CN210093663U - Circuit board - Google Patents
Circuit board Download PDFInfo
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- CN210093663U CN210093663U CN201920736628.6U CN201920736628U CN210093663U CN 210093663 U CN210093663 U CN 210093663U CN 201920736628 U CN201920736628 U CN 201920736628U CN 210093663 U CN210093663 U CN 210093663U
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- resin layer
- signal
- circuit board
- microstrip line
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Abstract
The present application relates to a circuit board. The circuit board comprises a resin layer, a signal layer, a ground layer, a first solder mask layer and a second solder mask layer, wherein the signal layer is arranged on one side of the resin layer; the grounding layer is arranged on the other side of the resin layer; the first solder mask layer is arranged on the resin layer and covers the signal layer; the second solder mask layer is arranged on one side of the grounding layer, which is far away from the resin layer, and the second solder mask layer covers the grounding layer. Because only a resin layer is used between the signal layer and the grounding layer of the circuit board, no additional material layer such as a glass fiber layer is used, and no filling material layer such as a silicon dioxide layer is used, the circuit board has better dielectric property, thereby ensuring that the signal transmission performance of the circuit board is more stable, and solving the problems of poor signal transmission stability and easy occurrence of offset frequency.
Description
Technical Field
The application relates to the technical field of antennas, in particular to a circuit board.
Background
The current society has entered the highly information society, the IT industry has become the strong driving force of the social informatization, and the related industries all require the electronic materials and electronic components and the like to have the functions of high-frequency, high-speed and large-capacity signal storage and transmission, which has higher and higher requirements for the signal transmission of the circuit board.
The traditional circuit board comprises a glass fiber layer, a silicon dioxide filling layer and the like, and analysis shows that the glass fiber layer and the silicon dioxide filling layer have large influence on signal transmission, so that the signal transmission stability of the circuit board is poor, and the circuit board is easy to have a frequency offset phenomenon.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a circuit board for solving the problems of poor stability of signal transmission and easy occurrence of offset frequency of the circuit board.
A circuit board, comprising:
a resin layer;
a signal layer provided on one side of the resin layer;
the grounding layer is arranged on the other side of the resin layer;
the first solder mask layer is arranged on the resin layer and covers the signal layer;
and the second solder mask layer is arranged on one side of the ground layer, which is deviated from the resin layer, and covers the ground layer.
The circuit board can be used for signal transmission of an antenna, the signal layer and the ground layer are respectively arranged on two sides of the resin layer, the first solder mask layer is arranged on the resin layer and covers the signal layer to play an insulating role, and the second solder mask layer is arranged on one side of the ground layer, which is far away from the resin layer, to play an insulating role; because only a resin layer is used between the signal layer and the grounding layer of the circuit board, no additional material layer such as a glass fiber layer is used, and no filling material layer such as a silicon dioxide layer is used, the circuit board has better dielectric property, thereby ensuring that the signal transmission performance of the circuit board is more stable, and solving the problems of poor signal transmission stability and easy occurrence of offset frequency.
In one embodiment, the signal layer and the ground layer are both copper layers, so that the signal layer and the ground layer have better conductivity.
In one embodiment, the copper layer is an inverted copper foil layer or a rolled copper foil layer, so that the roughness of the copper layer is lower, and the circuit board has better signal transmission performance.
In one embodiment, the roughness of the copper layer is less than or equal to 3.5 μm, resulting in a lower roughness of the copper layer.
In one embodiment, the resin layer comprises at least one of an epoxy resin layer, a BT resin layer, a polyphenylene ether resin layer, or polytetrafluoroethylene.
In one embodiment, the signal layer, the resin layer and the ground layer are bonded together such that the signal layer, the resin layer and the ground layer are securely connected together.
In one embodiment, the signal layer is formed with a microstrip line, so that the signal layer has better signal transmission performance.
In one embodiment, the number of the microstrip lines is multiple, and the plurality of microstrip lines are distributed at intervals, so that the signal transmission performance of the signal layer is more stable.
In one embodiment, the extension track of the microstrip line is bent, so that the microstrip line can better cover all positions of the resin layer, and the signal transmission performance of the signal layer is more reliable.
In one embodiment, the line width precision of the microstrip line is ± 0.02mm, so that the line width of the microstrip line is relatively uniform.
In one embodiment, the cross section of the microstrip line is rectangular, so that the microstrip line has a simpler structure and more stable signal transmission performance.
Drawings
FIG. 1 is a schematic diagram of a circuit board according to an embodiment;
FIG. 2 is a cross-sectional view of the wiring board of FIG. 1;
FIG. 3 is an enlarged view of the circuit board of FIG. 2 at location A;
fig. 4 is a partial schematic view of the wiring board shown in fig. 1.
Detailed Description
To facilitate an understanding of the present application, a wiring board will be described more fully below with reference to the associated drawings. Preferred embodiments of the wiring board are shown in the drawings. However, the wiring board may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the wiring boards herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
One embodiment is a circuit board including a resin layer, a signal layer, a ground layer, a first solder resist layer, and a second solder resist layer, the signal layer being provided on one side of the resin layer; the grounding layer is arranged on the other side of the resin layer; the first solder mask layer is arranged on the resin layer and covers the signal layer; the second solder mask layer is arranged on one side of the grounding layer, which is far away from the resin layer, and the second solder mask layer covers the grounding layer.
As shown in fig. 1 to 3, a circuit board 10 of an embodiment includes a resin layer 100, a signal layer 200, a ground layer 300, a first solder resist layer 400, and a second solder resist layer 500. The signal layer is arranged on one side of the resin layer, the grounding layer is arranged on the other side of the resin layer, namely the signal layer and the grounding layer are respectively arranged on two sides of the resin layer. The first solder mask layer is arranged on the resin layer, and the signal layer is coated by the first solder mask layer to play an insulating role. The second solder mask layer is arranged on one side, deviating from the resin layer, of the ground layer, and covers the ground layer to play an insulating role.
The circuit board can be used for signal transmission of an antenna, the signal layer and the ground layer are respectively arranged on two sides of the resin layer, the first solder mask layer is arranged on the resin layer and covers the signal layer to play an insulating role, and the second solder mask layer is arranged on one side, deviating from the resin layer, of the ground layer to play an insulating role. Because only a resin layer is used between the signal layer and the grounding layer of the circuit board, no additional material layer such as a glass fiber layer is used, and no filling material layer such as a silicon dioxide layer is used, the circuit board has better dielectric property, thereby ensuring that the signal transmission performance of the circuit board is more stable, and solving the problems of poor signal transmission stability and easy occurrence of offset frequency.
In order to provide better conductivity to the signal and ground layers, in one embodiment, the signal and ground layers are copper layers, providing better conductivity to the signal and ground layers. In this embodiment, the signal layer and the ground layer are both processed by copper foil.
In one embodiment, the copper layer is an inverted copper foil layer or a rolled copper foil layer, so that the roughness of the copper layer is lower, and the circuit board has better signal transmission performance. In this embodiment, the copper layer is an inverse copper foil. In one embodiment, the copper layer is a low roughness copper foil. In one embodiment, the roughness (Rz) of the copper layer is less than or equal to 3.5 μm, i.e. the roughness (Rz) of the copper layer is within 3.5 μm, so that the roughness of the copper layer is low, and the circuit board has good signal transmission performance.
In one embodiment, the resin layer includes at least one of an epoxy resin layer, a BT resin layer, a polyphenylene oxide (PPO) resin layer, or Polytetrafluoroethylene (PTFE). In this embodiment, the resin layer is an insulating resin layer, so that the resin layer has an insulating effect. In one embodiment, the resin layer is a pure resin layer, that is, the resin layer is a single type of resin material layer, so that the signal transmission of the circuit board is stable. In one embodiment, the resin layer comprises an epoxy resin layer or a BT resin layer or a polyphenylene ether resin layer or polytetrafluoroethylene. In this embodiment, the resin layer is an epoxy resin layer.
In one embodiment, the signal layer, the resin layer and the ground layer are bonded together to form a substrate, such that the signal layer, the resin layer and the ground layer are securely connected together. In this embodiment, the signal layer, the resin layer, and the ground layer are laminated together by a copper clad laminate press. Specifically, under the condition of heating and pressurizing, the signal layer, the resin layer and the grounding layer are laminated together through a copper-clad plate laminating machine.
In one embodiment, the thickness of the resin layer is 0.3mm to 0.5 mm. In the present embodiment, the thickness of the resin layer may be 0.4mm or 0.45 mm. In one embodiment, the signal and ground layers are each 17.5 microns thick. In one embodiment, the signal layer, the resin layer and the grounding layer are combined together to form a substrate, and the thickness of the substrate is 0.435mm, so that the thickness of the circuit board is thinner.
As shown in fig. 2 and 3, in one embodiment, the signal layer 200 is formed with a microstrip line 202, so that the signal layer has better signal transmission performance. In one embodiment, the number of the microstrip lines is multiple, that is, the signal layer includes multiple microstrip lines. In one embodiment, the microstrip lines are distributed at intervals, so that the signal transmission performance of the signal layer is more stable. As shown in fig. 4, in the present embodiment, the plurality of microstrip lines are a first microstrip line 210, a second microstrip line 220 and a third microstrip line 230, respectively, the first microstrip line is disposed opposite to the second microstrip line and the third microstrip line, respectively, and the second microstrip line is further disposed opposite to the third microstrip line. The first microstrip line and the third microstrip line are both L-shaped. The first microstrip line is positioned between the second microstrip line and the third microstrip line.
As shown in fig. 4, in one embodiment, the second microstrip line 220 includes a first portion 222 and a second portion 224 connected to each other, and the first portion 222 includes a first straight portion 222a, a first bent portion 222b, and a second straight portion 222c connected in sequence. The second portion 224 includes a second bent portion 224a and a third straight portion 224b connected to each other. The second straight line part is parallel to the third straight line part, and the end part of the second straight line part far away from the first bending part is connected with the second bending part. The second bending part is arranged adjacent to the third microstrip line. The first bending part is arranged near one end of the first microstrip line. In one embodiment, the first microstrip line is parallel to the line segment of the second straight line part, the third straight line part, and the line segment of the third microstrip line parallel to the third straight line part are arranged in parallel and at intervals, so that the signal layer has better signal transmission performance.
In one embodiment, the extension track of the microstrip line is bent, so that the microstrip line can better cover all positions of the resin layer, and the signal transmission performance of the signal layer is more reliable. In the present embodiment, the number of the microstrip lines is plural, and each microstrip line is bent. Specifically, for the second microstrip line, the first bending portion and the second bending portion are both bent. The first microstrip line and the third microstrip line are both provided with only one bending part. It is understood that in other embodiments, the number of the bending portions of each microstrip line can be set according to the requirement. In one embodiment, the bending portion of each microstrip line is over-rounded, so that the signal layer has better signal transmission performance, and the problem that stress concentration easily occurs at the bending portion of each microstrip line is avoided.
In order to make the line width of the microstrip line more uniform, in one embodiment, the line width precision of the microstrip line is ± 0.02mm, that is, the line width precision of the microstrip line is within ± 0.02mm, that is, the line width variation value of the microstrip line is 0.02mm, so that the line width of the microstrip line is more uniform, and the signal transmission performance of the signal layer is more reliable. In the present embodiment, the line width precision of each microstrip line is ± 0.02 mm.
In one embodiment, the cross section of the microstrip line is rectangular, so that the microstrip line has a simpler structure and more stable signal transmission performance. In other embodiments, the cross section of the microstrip line may also be in a semicircular shape or a semi-elliptical shape.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (10)
1. A circuit board, comprising:
a resin layer;
a signal layer provided on one side of the resin layer;
the grounding layer is arranged on the other side of the resin layer;
the first solder mask layer is arranged on the resin layer and covers the signal layer;
and the second solder mask layer is arranged on one side of the ground layer, which is deviated from the resin layer, and covers the ground layer.
2. The wiring board of claim 1, wherein the signal layer and the ground layer are both copper layers.
3. The wiring board of claim 2, wherein the copper layer is an inverted copper foil layer or a calendered copper foil layer.
4. The wiring board of claim 2, wherein the roughness of the copper layer is less than or equal to 3.5 μm.
5. The wiring board of claim 1, wherein the resin layer comprises at least one of an epoxy resin layer, a BT resin layer, a polyphenylene ether resin layer, or polytetrafluoroethylene.
6. The wiring board of claim 1, wherein the signal layer, the resin layer, and the ground layer are bonded together.
7. The wiring board according to any one of claims 1 to 6, wherein the signal layer is formed with a microstrip line.
8. The circuit board of claim 7, wherein the number of the microstrip lines is plural, and the plurality of microstrip lines are distributed at intervals.
9. The circuit board according to claim 7, wherein the extension trace of the microstrip line is bent.
10. The wiring board of claim 7, wherein the microstrip line has a line width precision of ± 0.02 mm;
the cross section of the microstrip line is rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920736628.6U CN210093663U (en) | 2019-05-22 | 2019-05-22 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920736628.6U CN210093663U (en) | 2019-05-22 | 2019-05-22 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210093663U true CN210093663U (en) | 2020-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920736628.6U Active CN210093663U (en) | 2019-05-22 | 2019-05-22 | Circuit board |
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| Country | Link |
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| CN (1) | CN210093663U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115529719A (en) * | 2022-11-01 | 2022-12-27 | 深圳市丰达兴线路板制造有限公司 | Circuit board with surface metal wire protection structure |
-
2019
- 2019-05-22 CN CN201920736628.6U patent/CN210093663U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115529719A (en) * | 2022-11-01 | 2022-12-27 | 深圳市丰达兴线路板制造有限公司 | Circuit board with surface metal wire protection structure |
| CN115529719B (en) * | 2022-11-01 | 2023-08-29 | 深圳市丰达兴线路板制造有限公司 | Circuit board with surface metal wire protection structure |
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