CN113707424A - Planar winding unit and manufacturing method thereof, planar winding and planar electronic device - Google Patents

Planar winding unit and manufacturing method thereof, planar winding and planar electronic device Download PDF

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Publication number
CN113707424A
CN113707424A CN202110757417.2A CN202110757417A CN113707424A CN 113707424 A CN113707424 A CN 113707424A CN 202110757417 A CN202110757417 A CN 202110757417A CN 113707424 A CN113707424 A CN 113707424A
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CN
China
Prior art keywords
planar
layer
electronic device
insulating substrate
insulating
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202110757417.2A
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Chinese (zh)
Inventor
娄建勇
张旭东
袁凯
姚炜
尹玮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Shenwanghe Electronic Technology Co ltd
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Wuxi Shenwanghe Electronic Technology Co ltd
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Priority to CN202110757417.2A priority Critical patent/CN113707424A/en
Publication of CN113707424A publication Critical patent/CN113707424A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/125—Other insulating structures; Insulating between coil and core, between different winding sections, around the coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The invention discloses a planar winding unit, comprising: an insulating substrate comprising a conductive region and a non-conductive region; the patterned conducting layer is positioned on the conducting region of the insulating substrate; and the insulating filling layer is positioned in the non-conductive area of the insulating substrate. The invention also discloses a manufacturing method of the planar winding unit, a planar winding and a planar electronic device. By applying the planar winding unit and the manufacturing method thereof, the planar winding and the planar electronic device in the technical scheme of the invention, the insulating filling layer is positioned in the non-conductive area of the insulating substrate, so that the offset in the patterned conductive layer can be compensated, the smoothness of the layer structure in the planar winding is improved, the bubbles in the planar electronic device are reduced, the influence of the bubbles on the yield of the planar electronic device is avoided, the yield of the planar electronic device is further improved, and the application is facilitated.

Description

Planar winding unit and manufacturing method thereof, planar winding and planar electronic device
Technical Field
The invention relates to the technical field of planar electronic devices, in particular to a planar winding unit and a manufacturing method thereof, a planar winding and a planar electronic device.
Background
In the field of planar electronic devices, taking a planar transformer as an example, a planar winding of one of elements forming the planar transformer is mainly manufactured by adopting copper foils and plastic films/plates, and the manufacturing process comprises the following steps: firstly, forming a whole copper foil on a plastic film/plate, then patterning the copper foil through the processes of yellow light, etching, laser and the like to obtain the required transformer coil, and then bonding a plurality of layers of patterned copper foils and plastic films/plates through epoxy glue materials to meet the number of turns of the coil required by design.
Because the transformer plays a role in converting voltage, the current passing through the corresponding transformer coil is generally larger, especially for a high-power transformer, and in order to enable the copper foil to meet the current requirement, and simultaneously in order to reduce the volume of the product as much as possible, the thicker copper foil is generally used as much as possible. Correspondingly, in order to make up for the offset left after the copper foil patterning, the epoxy glue materials with the appropriate thickness are needed for bonding, otherwise, the layer structures in the planar transformer winding with the multilayer structure are difficult to be closely bonded together. However, due to the existence of the offset, the layer structure in the winding of the planar transformer with the multilayer structure is not flat, so that air bubbles are very likely to exist in the planar transformer, which affects the yield of the planar transformer and is not beneficial to wide application.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is how to improve the yield of a planar electronic device, and a planar winding unit, a manufacturing method thereof, a planar winding and a planar electronic device are provided.
In order to solve the above technical problem, the present invention provides a planar winding unit, including:
an insulating substrate comprising a conductive region and a non-conductive region;
the patterned conducting layer is positioned on the conducting region of the insulating substrate; and
and the insulating filling layer is positioned in the non-conductive area of the insulating substrate.
In one possible implementation, the thickness of the insulating fill layer is the same as the thickness of the patterned conductive layer.
In one possible implementation, the sum of the projected area of the insulating filling layer on the surface of the insulating substrate and the projected area of the patterned conductive layer on the surface of the insulating substrate is equal to the surface area of the insulating substrate.
In one possible implementation, the insulating filling layer is a glue layer; or the insulation filling layer comprises a laminated glue layer and a support film.
In one possible implementation, the glue layer is an epoxy glue layer.
Correspondingly, the invention also provides a manufacturing method of the planar winding unit, which comprises the following steps:
providing an insulating substrate;
forming a patterned conductive layer on the insulating substrate; the area of the patterned conducting layer covering the insulating substrate is a conducting area, and the area of the patterned conducting layer not covering the insulating substrate is a non-conducting area; and
and forming an insulating filling layer on the non-conductive area of the insulating base material to obtain the planar winding unit.
The invention also provides a planar winding, which comprises the planar winding unit.
In one possible implementation, the planar winding further includes an adhesive layer on one side of the planar winding unit, and the thickness of the adhesive layer is smaller than that of the patterned conductive layer.
In one possible implementation, the thickness of the adhesive layer is less than 0.5 mm.
The invention also provides a planar electronic device comprising a planar winding according to any of the above.
In one possible implementation, the planar electronic device is a planar inductor or a planar transformer.
The implementation of the invention has the following beneficial effects:
by applying the planar winding unit and the manufacturing method thereof, the planar winding and the planar electronic device in the technical scheme of the invention, the insulating filling layer is positioned in the non-conductive area of the insulating substrate, so that the offset in the patterned conductive layer can be compensated, the smoothness of the layer structure in the planar winding is improved, the bubbles in the planar electronic device are reduced, the influence of the bubbles on the yield of the planar electronic device is avoided, the yield of the planar electronic device is further improved, and the application is facilitated.
Drawings
FIG. 1 is a schematic plan view of a planar winding unit according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along A-A' of FIG. 1;
fig. 3 is a schematic view of a planar electronic device according to an embodiment of the present invention.
Reference numerals in the drawings: 100-planar winding unit, 110-insulating substrate, 120-patterned conductive layer, 130-insulating filling layer, 200-planar winding, 210-adhesive layer, 300-planar electronic device, 310-insulating substrate.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the invention, the planar winding unit is used for forming a planar winding. Referring to fig. 1 and fig. 2 together, a planar winding unit 100 according to an embodiment of the present invention includes an insulating substrate 110, a patterned conductive layer 120, and an insulating filling layer 130.
The insulating substrate 110 is used to support the patterned conductive layer 120 and the insulating filling layer 130 thereon, and the insulating substrate 110 may be a substrate such as a plastic film or a plastic plate capable of supporting. The insulating substrate 110 includes conductive and non-conductive regions. Specifically, the area of the patterned conductive layer 120 covering the insulating substrate 110 is a conductive area, and the area of the patterned conductive layer 120 not covering the insulating substrate 110 is a non-conductive area.
The patterned conductive layer 120 is located on the conductive region of the insulating substrate 110. The pattern of the patterned conductive layer 120 is not limited, and may be set according to actual requirements.
Wherein the insulating filling layer 130 is located in the non-conductive region of the insulating substrate 110. The insulating filling layer 130 plays a role of insulation and filling.
The insulating filling layer 130 in the planar winding unit 100 can compensate for the offset in the patterned conductive layer 120, so that the flatness of the layer structure in the planar winding is improved, bubbles in the planar electronic device are reduced, the influence of the bubbles on the yield of the planar electronic device is avoided, and the yield of the planar electronic device is further improved.
On the basis of the foregoing embodiment, the thickness of the insulating filling layer 130 is the same as that of the patterned conductive layer 120. At this time, the surface of the insulating filling layer 130 away from the insulating base material 110 and the surface of the patterned conductive layer 120 away from the insulating base material 110 are located on the same plane, so that the offset in the patterned conductive layer 120 can be sufficiently compensated, and when the subsequent two adjacent layers of planar winding units 100 are stacked, the flatness of the two adjacent layers of planar winding units 100 can be sufficiently ensured.
It is understood that the thickness of the insulating filling layer 130 and the thickness of the patterned conductive layer 120 may be different in other embodiments of the present invention. The thickness of the insulating filling layer 130 may be greater than or less than the thickness of the patterned conductive layer 120, and at this time, the insulating filling layer 130 can also play a role of compensating for the offset in the patterned conductive layer 120, thereby also improving the yield of the planar electronic device.
On the basis of the foregoing embodiment, the sum of the projected area of the insulating filling layer 130 on the surface of the insulating substrate 110 and the projected area of the patterned conductive layer 120 on the surface of the insulating substrate 110 is equal to the surface area of the insulating substrate 110. That is, the insulating filling layer 130 is located in the empty region where the patterned conductive layer 120 does not cover the insulating substrate 110, and is complementary to the patterned conductive layer 120. At this time, the insulating filling layer 130 can completely compensate for the break in the patterned conductive layer 120 on the plane, thereby improving the yield of the planar electronic device.
It is understood that, in other embodiments of the present invention, the sum of the projected area of the insulating filling layer 130 on the surface of the insulating substrate 110 and the projected area of the patterned conductive layer 120 on the surface of the insulating substrate 110 may also be smaller than the surface area of the insulating substrate 110. In a preferred embodiment, the gap between the insulating fill layer 130 and the patterned conductive layer 120 is less than or equal to 0.5 mm. In addition, the insulating filling layer 130 may be designed in any pattern. At this time, the insulating filling layer 130 can compensate for the partial difference in the patterned conductive layer 120 on the plane, that is, the portion of the surface of the insulating substrate 110 covered by the insulating filling layer 130, thereby also playing a role in increasing the yield of the planar electronic device.
On the basis of the foregoing embodiment, the insulating filling layer 130 is a glue layer; or the insulating filling layer 130 includes a stacked glue layer and a support film. When the insulating filling layer 130 includes a glue layer and a support film stacked, it is preferable that the glue layer is positioned between the insulating substrate 110 and the support film. In the above embodiment, the glue layer in the insulating filling layer 130 can play an insulating role, and can be firmly fixed on the insulating base material 110, so as to prevent the yield of the planar electronic device from being affected by bubbles generated due to the existence of a gap between the insulating filling layer 130 and the insulating base material 110. Of course, the insulating filling layer 130 is not limited thereto, and may be other substances capable of performing the insulating and filling functions.
On the basis of the foregoing embodiment, the adhesive layer is an epoxy adhesive layer. The epoxy glue layer has the advantages of water resistance, chemical corrosion resistance, glittering and translucent property and the like, and is favorable for being applied to the planar winding unit 100 of the technical scheme of the invention. Of course, the material of the adhesive layer is not limited thereto, and may be other materials.
By applying the planar winding unit 100 of the technical scheme of the invention, the insulating filling layer 130 is positioned in the non-conductive area of the insulating substrate 110, so that the offset in the patterned conductive layer 120 can be compensated, the smoothness of the layer structure in the planar winding is improved, the bubbles in the planar electronic device are reduced, the influence of the bubbles on the yield of the planar electronic device is avoided, the yield of the planar electronic device is further improved, and the application is facilitated.
The method for manufacturing the planar winding unit 100 according to an embodiment of the present invention includes the following steps:
s10, providing an insulating substrate.
The insulating substrate 110 may be a substrate such as a plastic film or a plastic plate that can function as a support.
S20, forming a patterned conductive layer on the insulating base material; the area of the patterned conductive layer covering the insulating substrate is a conductive area, and the area of the patterned conductive layer not covering the insulating substrate is a non-conductive area.
In one possible implementation, the step of forming the patterned conductive layer 120 on the insulating substrate 110 is: first, a whole conductive layer is formed on the insulating substrate 110, and then the conductive layer is patterned to obtain a patterned conductive layer 120. Wherein the conductive layer may be patterned by a process such as yellow light, etching, or laser.
In another possible implementation, the patterned conductive layer 120 is formed directly on the insulating substrate 110.
And S30, forming an insulating filling layer on the non-conductive area of the insulating base material to obtain the planar winding unit.
Different manufacturing methods can be selected according to the initial state of the insulating filling layer.
In one possible implementation, the insulating filling layer 130 is a glue layer, and the initial state of the insulating filling layer 130 (defined as the precursor of the insulating filling layer 130) is a liquid state, in which case the liquid precursor of the insulating filling layer 130 may be formed on the non-conductive area of the insulating substrate 110 by printing or coating, and the liquid precursor of the insulating filling layer 130 is cured to obtain the insulating filling layer 130.
In another possible implementation manner, the insulating filling layer 130 includes a stacked glue layer and a support film, and in this case, the entire glue layer and the support film may be patterned together by using a laser or a die-cutting process, and the patterned glue layer and the support film may be bonded to the patterned conductive layer 120 by using a rapid pressing process, so as to form the insulating filling layer 130 on the insulating substrate 110.
The manufacturing method of the planar winding unit 100 in the technical scheme of the invention has simple process, and in the manufactured planar winding unit 100, because the insulating filling layer 130 is positioned in the non-conductive area of the insulating base material 110, the offset in the patterned conductive layer 120 can be compensated, the smoothness of each layer structure in the planar winding is improved, the bubbles in the planar electronic device are reduced, and the influence of the bubbles on the yield of the planar electronic device is avoided, so that the yield of the planar electronic device is further improved, and the application is facilitated.
Referring to fig. 3, a planar winding 200 according to an embodiment of the present invention includes any of the planar winding units 100 described above.
On the basis of the foregoing embodiment, the planar winding 200 further includes an adhesive layer 210 located on one side of the planar winding unit 100, and the thickness of the adhesive layer 210 is smaller than that of the patterned conductive layer 120. The adhesive layer 210 is used to adhere two adjacent planar winding units 100 or to adhere the planar winding unit 100 and the capping layer 310 on one side of the planar winding unit 100, and the adhesive layer 210 may be an epoxy adhesive layer or other adhesive layer capable of performing an adhesive function. Compared with the conventional planar winding in which the thickness of the adhesive layer is greater than that of the patterned conductive layer, the thickness of the adhesive layer 210 in the present embodiment is less than that of the patterned conductive layer 120, so that the purpose of reducing the thickness of the planar winding 200 can be achieved, thereby reducing the overall thickness of the planar electronic device and meeting the requirement of lightening and thinning the planar electronic device.
Of course, in other embodiments of the present invention, the thickness of the adhesive layer 210 may be equal to or slightly greater than the thickness of the patterned conductive layer 120.
In addition to the foregoing embodiments, the thickness of the adhesive layer 210 is less than 0.5 mm. More preferably, the thickness of the adhesive layer 210 is 0.1 mm. Compared with the conventional adhesive layer 210, the adhesive layer 210 according to the embodiment of the invention has a smaller thickness, so that the overall thickness of the planar electronic device can be reduced, and the requirement of thinning the planar electronic device can be met.
By applying the planar winding 200 of the technical scheme of the invention, because the insulating filling layer 130 is positioned in the non-conductive area of the insulating substrate 110, the offset in the patterned conductive layer 120 can be compensated, the smoothness of the layer structure in the planar winding 200 is improved, bubbles in a planar electronic device are reduced, and the influence of the bubbles on the yield of the planar electronic device is avoided, so that the yield of the planar electronic device is further improved, and the application is facilitated.
Referring to fig. 3, a planar electronic device 300 according to an embodiment of the present invention includes any of the above-mentioned planar windings 200.
On the basis of the foregoing embodiments, the planar electronic device 300 is a planar inductor or a planar transformer. When any of the planar windings 200 is used in a planar inductor or a planar transformer, air bubbles in the planar inductor or the planar transformer can be reduced, so that the yield of the planar inductor or the planar transformer is improved. In addition, the whole thickness of the planar inductor or the planar transformer can be reduced, and the requirement of lightness and thinness of the planar inductor or the planar transformer is met.
On the basis of the foregoing embodiment, the planar electronic device 300 further includes a capping layer 310 located on one side of the planar winding 200. Capping layer 310 serves to protect planar winding 200. It is understood that the planar electronic device 300 of the present invention may also include other elements.
By applying the planar electronic device 300 of the technical scheme of the invention, because the insulating filling layer 130 is positioned in the non-conductive area of the insulating substrate 110, the offset in the patterned conductive layer 120 can be compensated, the smoothness of the layer structure in the planar winding 200 is improved, the bubbles in the planar electronic device 300 are reduced, and the influence of the bubbles on the yield of the planar electronic device 300 is avoided, so that the yield of the planar electronic device 300 is further improved, and the application is facilitated.
Referring to fig. 2 and 3 together, in an embodiment of the present invention, a planar electronic device 300 includes a planar winding 200 and a capping layer 310 on one side of the planar winding 200, wherein the planar winding 200 includes 12 layers of planar winding units 100, and each layer of planar winding unit 100 includes an insulating substrate 110, a patterned conductive layer 120 and an insulating filling layer 130; an epoxy glue layer is adopted as the bonding layer 210 to bond between two adjacent layers of planar winding units 100 or between the planar winding 200 and the capping layer 310.
In the planar electronic device 300 of the above embodiment, the thickness of the insulating substrate 110 is 0.1mm, the thicknesses of the patterned conductive layer 120 and the insulating filling layer 130 are both 0.1mm, the thickness of the epoxy glue layer is 0.05mm, and the thickness of the capping layer 310 is 0.1 mm. The total thickness of the planar electronic device 300 of the above embodiment is the sum of the thickness of the 12-layer planar winding unit 100, the thickness of the epoxy glue layer and the thickness of the capping layer 310, i.e., 12 × 0.1mm +12 × 0.05mm +0.1mm — 3.1 mm.
In a comparative example of the present invention directed to the above embodiments, a planar electronic device includes a planar winding and a capping layer on one side of the planar winding, wherein the planar winding includes 12 layers of planar winding units, each layer of the planar winding units including an insulating base material and a patterned conductive layer; and an epoxy glue layer is adopted as a bonding layer to bond between two adjacent layers of planar winding units or between the planar winding and the sealing cover layer.
In the planar electronic device of the above comparative example, the thickness of the insulating base material was 0.1mm, the thickness of the patterned conductive layer was 0.1mm, the thickness of the epoxy glue layer was 0.2mm, and the thickness of the capping layer was 0.1 mm. The total thickness of the planar electronic device is the sum of the thickness of the 12 planar winding units, the thickness of the epoxy glue layer and the thickness of the capping layer, namely 12 x (0.1mm +0.1mm) +12 x 0.2mm +0.1 mm-4.9 mm.
Comparing the above examples with the comparative examples, it can be seen that the thickness of the epoxy layer in the planar electronic device of the above example of the present invention is 0.15mm less than that of the epoxy layer in the comparative planar electronic device, and the overall thickness of the planar electronic device of the example is reduced by 37% relative to that of the planar electronic device of the comparative example. This shows that in the planar electronic device according to the embodiment of the present invention, the insulating filling layer can compensate for the offset in the patterned conductive layer, so that the overall thickness of the planar electronic device can be reduced, and the requirement for thinning the planar electronic device can be satisfied.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (11)

1. A planar winding unit, characterized in that it comprises:
an insulating substrate comprising a conductive region and a non-conductive region;
the patterned conducting layer is positioned on the conducting region of the insulating substrate; and
and the insulating filling layer is positioned in the non-conductive area of the insulating substrate.
2. The planar winding unit of claim 1, wherein the insulating fill layer has a thickness that is the same as a thickness of the patterned conductive layer.
3. The planar winding unit of claim 1, wherein the sum of the projected area of the insulating filler layer on the surface of the insulating substrate and the projected area of the patterned conductive layer on the surface of the insulating substrate is equal to the surface area of the insulating substrate.
4. The planar winding unit of claim 1, wherein the insulating filler layer is a glue layer; or the insulation filling layer comprises a laminated glue layer and a support film.
5. The planar winding unit of claim 4, wherein the glue layer is an epoxy glue layer.
6. A manufacturing method of a planar winding unit is characterized by comprising the following steps:
providing an insulating substrate;
forming a patterned conductive layer on the insulating substrate; the area of the patterned conducting layer covering the insulating substrate is a conducting area, and the area of the patterned conducting layer not covering the insulating substrate is a non-conducting area; and
and forming an insulating filling layer on the non-conductive area of the insulating base material to obtain the planar winding unit.
7. A planar winding, comprising the planar winding unit according to any one of claims 1 to 5.
8. The planar winding of claim 7, further comprising an adhesive layer on one side of the planar winding unit, the adhesive layer having a thickness less than a thickness of the patterned conductive layer.
9. The planar winding of claim 8, wherein the adhesive layer has a thickness of less than 0.5 mm.
10. A planar electronic device comprising a planar winding according to any one of claims 7 to 9.
11. The planar electronic device as claimed in claim 10, wherein the planar electronic device is a planar inductor or a planar transformer.
CN202110757417.2A 2021-07-05 2021-07-05 Planar winding unit and manufacturing method thereof, planar winding and planar electronic device Withdrawn CN113707424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110757417.2A CN113707424A (en) 2021-07-05 2021-07-05 Planar winding unit and manufacturing method thereof, planar winding and planar electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110757417.2A CN113707424A (en) 2021-07-05 2021-07-05 Planar winding unit and manufacturing method thereof, planar winding and planar electronic device

Publications (1)

Publication Number Publication Date
CN113707424A true CN113707424A (en) 2021-11-26

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