TWI835670B - Small parts carrier and manufacturing method therefor - Google Patents

Abstract

Provided are a small parts carrier and a manufacturing method thereof. An adhesive layer is formed on the lower surface of the carrier tape, and the carrier tape and the adhesive layer are perforated at the same time to form a space for small parts, and the lower cover tape is attached to the lower surface of the adhesive layer to seal the space for small parts, so as to prepare for the shipment of small parts device.

Description

Micro parts transport device and preparation method thereof

The present invention relates to a micro-component transport device and a manufacturing method thereof, and in particular to a micro-component transport device for transporting micro components of several mm to tens of mm or smaller and a manufacturing method thereof.

In order to transport tiny components such as integrated circuit (IC) wafers, modules or other precision electronic components, a transport device is required in which a space for mounting these tiny components is formed. For existing conveying devices, in order to form the space, a forming process is usually used. For example, as shown in Figure 5, a rod 510 of a certain size is used to apply heat and pressure to the plastic 500 to form a space 520 that can accommodate tiny components. However, as technology develops, the size of micro components is increasingly reduced, and there are limitations in producing a transport device with a smaller accommodation space that matches the size of such micro components through a molding process.

The technical problem to be solved by embodiments of the present invention is to provide a micro-component transport device and a preparation method thereof. The micro-component transport device accommodates micro components of various sizes by drilling holes and can solve the problem of micro components sticking due to adhesive.

The present invention provides a method for preparing a micro-component transport device, which includes forming an adhesive layer on the lower surface of a transport belt, simultaneously drilling the transport belt and the adhesive layer to form a micro-component accommodation space, and attaching a lower cover tape on the lower surface of the adhesive layer to seal the tiny component accommodating space.

The invention provides a micro-component transport device including a transport belt, an adhesive layer, a lower cover belt and a micro-component storage space. The adhesive layer is located at the lower part of the transport belt, the lower cover belt is located at the lower part of the adhesive layer, and the micro-component storage space. It is formed by punching the conveyor belt and the adhesive layer simultaneously.

Based on the above, according to embodiments of the present invention, a conveyor belt capable of accommodating tiny components can be formed by drilling holes. Furthermore, since the conveyor belt and the adhesive layer are drilled at the same time, when microcomponents are placed in the accommodation space formed by drilling, the microcomponents will not stick to the adhesive layer.

Hereinafter, the micro-component transport device and its manufacturing method according to embodiments of the present invention will be observed in detail with reference to the drawings.

FIG. 1 is a schematic diagram of a micro-component transport device according to an embodiment of the present invention.

Referring to FIG. 1 , the micro-component transport device 100 has a belt form that accommodates micro-components having a size of several mm in accommodation spaces 102 formed at regular intervals along the length direction. In the micro-component transport device 100, the size of the accommodation space 102 depends on the size of the micro-component. The micro parts transport device 100 is made of a bendable material and can be transported around a reel 110 .

FIG. 2 is a detailed structural diagram of the micro-component transport device according to the embodiment of the present invention.

Referring to FIG. 2 , the microcomponent transport device 100 includes a transport belt 200 , an adhesive layer 210 , and a lower cover tape 220 . The micro parts transport device 100 may further include an upper cover tape 230 . Although this embodiment shows an example in which the microcomponent transport device 100 includes the upper cover tape 230 , the upper cover tape 230 is a tape attached to close the accommodating space 202 containing the microcomponents. Therefore, the microcomponent transport device 100 may also be Upper cover strip 230 not included. Alternatively, the minute parts transport device 100 may not include the lower cover tape 220 . However, hereafter, for convenience of explanation, an example including all of the lower cover tape 220 and the upper cover tape 230 will be described.

The conveyor belt 200 is formed by a punching method. The size of the perforated area in the conveyor belt 200 depends on the size of the tiny parts to be conveyed. In the case where a space for accommodating minute parts is formed by a molding process as shown in FIG. 5 , it is difficult to form a smaller space of several mm or less, and in order to form accommodating spaces of various sizes, it is necessary to perform a process suitable for each accommodating The molding process requires a large space, so there are disadvantages that the preparation process time is increased and the preparation cost is increased.

Therefore, in this embodiment, a punching method is used to form the accommodation space 202 for tiny components on the conveyor belt 200 instead of using a molding process. The accommodating space 202 of the conveyor belt 200 is formed by a process of simply punching the conveyor belt 200 using a punch, so the accommodating space 202 having a desired size or shape can be freely formed, and the accommodating space 202 can be formed as With smaller dimensions of several mm or less. The shape of the accommodation space 202 may be various shapes such as a quadrilateral or a circle.

The thickness of the conveyor belt 200 may vary depending on the embodiment, and may be formed to a very small thickness equal to or less than 1 mm. The conveyor belt 200 may be formed from a flexible solid film. Examples of solid films include polyethylene (PE, polyethylene), polycarbonate (PC, polycarbonate), polystyrene (PS, polystyrene), paper, polyethylene terephthalate (PET, polyethylene terephthalate) etc. In addition, the conveyor belt 200 may be embodied by various materials other than those mentioned in this embodiment.

The conveyor belt 200 may include a transfer hole 204 so that the conveyor belt 200 can be automatically supplied to a Surface Mounter Technology (SMT) machine or the like. For example, when the transfer hole 204 is coupled to a gear located on the SMT machine and rotates, the conveyor belt 200 may be automatically supplied to the machine.

There is an adhesive layer 210 on the lower surface of the conveyor belt 200 . The adhesive layer 210 may be formed of adhesive or thermoplastic resin. For example, the adhesive layer 210 may be formed of a thermoplastic resin such as polyethylene (PE, polyethylene), polypropylene, ethylene vinyl acetate, or polyolefin copolymer. The adhesive layer 210 may be formed on the lower surface of the conveyor belt 200 by a laminating (ie, coating) method. In the case where the adhesive layer 210 is formed of thermoplastic resin, the adhesive layer 210 can be attached to the lower surface of the conveyor belt 200 by applying a certain temperature and pressure to the adhesive layer 210 . The width W ₁ of the conveyor belt 200 may vary according to the size of the minute components, for example, less than 1 cm (eg, 8 mm).

As will be described again with reference to FIGS. 3A to 3D , the receiving space 202 of the conveyor belt 200 is formed after the adhesive layer 210 is attached to the conveyor belt 200 . In other words, once the adhesive layer 210 is formed on the lower surface of the conveyor belt 200, the accommodation space 202 is formed by simultaneously punching the conveyor belt 200 and the adhesive layer 210 using a punch. Since the transport belt 200 and the adhesive layer 210 are drilled simultaneously, there is no accommodation space 202 formed by drilling in the adhesive layer 210 , thereby solving the problem of tiny components sticking to the adhesive layer 210 .

The width of the adhesive layer 210 may be the same as the width W ₁ of the conveyor belt 200 , or, as in this embodiment, may be formed to have a width W ₂ that is smaller than the width W ₁ of the conveyor belt 200 . According to another embodiment, the adhesive layer 210 may be formed by a plurality of separators formed along the length direction of the conveyor belt 200, an example of which is illustrated in FIG. 4 .

There are a bottom cover tape 220 and a top cover tape 230 that cover the lower and upper parts of the accommodation space 202 respectively, so that the accommodation space 202 of the conveyor belt 200 can accommodate tiny components. The lower cover tape 220 and the upper cover tape 230 may be formed of various materials such as polyester, nylon, polyethylene terephthalate, and the like.

Since the adhesive layer 210 is formed on the lower surface of the conveyor belt 200 in advance, the lower cover belt 220 does not require an adhesive. If the adhesive layer 210 exists on the lower cover belt 220 but not on the lower surface of the conveyor belt 200 , the adhesive layer 210 of the lower cover belt 220 should be disposed not to overlap with the accommodation space 202 of the conveyor belt 200 . However, if an error occurs in the attachment position of the lower cover tape 220 when it is attached to the conveyor belt 200, a part of the adhesive layer formed on the lower cover tape 220 may be exposed in the accommodation space 202, in which case, it may occur that The problem of tiny parts sticking to the adhesive layer. Furthermore, in order to form an adhesive layer on the lower cover tape 220 , the adhesive layer needs to be accurately formed on one side of the lower cover tape 220 to prevent the accommodating space 202 from being blocked. Therefore, there are many difficulties in forming the adhesive layer. Furthermore, if the adhesive layer has a smaller width so as not to overlap with the accommodation space, problems with adhesion may occur.

However, according to this embodiment, the adhesive layer 210 is formed on the lower surface of the conveyor belt 200 in advance, and the adhesive layer 210 and the conveyor belt 200 are drilled simultaneously to form the accommodation space 202 . Therefore, the adhesive layer does not exist in the accommodation space 202 , and a wider adhesive layer 210 can be formed around the accommodation space 202, thereby solving the problem of adhesion of small components and improving the adhesion of the lower cover tape 220 to the conveyor belt 200.

According to another embodiment, lower cover strip 220 may be composed of multiple layers. For example, the lower cover tape 220 may be composed of a support layer and an antistatic layer. The antistatic layer can be composed of surfactants, conductive polymers, tin oxide, zinc oxide, titanium oxide and other antistatic agents. According to another embodiment, the lower cover strip 220 may be composed of an electrically conductive material.

The upper cover tape 230 is attached to the upper surface of the conveyor belt 200 to cover the upper part of the accommodation space 202 when the small components are loaded in the accommodation space 202 of the conveyor belt 200 . According to an embodiment, the upper cover belt 230 is embodied in a transparent material, so that the SMT machine can identify the position of the accommodation space 202 in which the tiny components are installed in the conveyor belt 200 through a camera or the like. In order to take out the minute components from the accommodation space 202 , it is not necessary to remove the lower cover tape 220 from the conveyor belt 200 , and it is sufficient to peel off only the upper cover tape 230 from the conveyor belt 200 . Therefore, the adhesive force of the upper cover tape 230 may be the same as that of the adhesive layer 210 attached to the lower cover tape 220 , or the adhesive force of the upper cover tape 230 may be smaller than the adhesive force of the adhesive layer 210 .

The manufacturer of the micro-component conveying device may supply the conveyor belt 200 in a state in which the lower cover tape 220 is attached but the upper cover tape 230 is not attached to the conveyor belt 200 to a component manufacturer or packager. Therefore, the microcomponent transport device 100 of this embodiment may not include the upper cover tape 230 , and the upper cover tape 230 attached to the upper surface of the transport belt 200 may be embodied by various existing methods.

3A to 3D are schematic diagrams of a method of manufacturing a micro-component transport device according to an embodiment of the present invention.

Referring to FIG. 3A , an adhesive layer 210 is formed on the lower surface of the conveyor belt disc 300 having a certain area. According to an embodiment, the adhesive layer 210 can be attached to the lower surface of the conveyor belt disc 300 by lamination. According to another embodiment, in the case where the adhesive layer 210 is composed of an adhesive material, the adhesive layer 210 may be attached to the conveyor belt disc 300 . According to another example, in the case where the adhesive layer 210 is composed of a thermoplastic resin, the adhesive layer 210 may be attached to the lower surface of the conveyor belt disc 300 by applying heat or pressure. In addition, various methods of attaching the adhesive layer 210 to the lower surface of the conveyor belt disc 300 are applicable to this embodiment depending on the type of adhesive material constituting the adhesive layer 210 , and the attachment method is not limited to a specific method. .

The dimensions of the conveyor belt disc 300 may vary depending on the embodiment. The conveyor belt 200 with a certain width can be formed by cutting the conveyor belt disk 300 with the adhesive layer 210 on the lower surface at certain intervals (A-A'). According to another embodiment, as shown in FIG. 2 , the adhesive layer 210 may be formed on the lower surface of the conveyor belt 200 with a certain width instead of the conveyor belt disc 300 . However, for convenience of explanation, an example in which the conveyor belt disc 300 on which the adhesive layer 210 is formed is cut into a certain width to form the conveyor belt 200 is assumed and described below.

Referring to FIG. 3B , the tiny component accommodating space 202 is formed by punching the conveyor belt 200 cut into a certain width. Since the adhesive layer 210 exists on the lower surface of the conveyor belt 200, when drilling holes, not only the conveyor belt 200 is perforated, but the adhesive layer 210 is also perforated at the same time. In the case where the conveyor belt 200 includes the transfer hole 204, the transfer hole 204 may be formed by various existing methods. For example, after the adhesive layer 210 is formed on the entire lower surface of the conveyor belt 200, the transfer holes 204 and the transfer space 202 are formed by drilling.

Referring to FIG. 3C , the lower cover tape 220 is attached to the lower surface of the perforated conveyor belt 200 . The width of the lower cover strip 220 is larger than the width of the transportation space 202 and therefore can cover the transportation space 202 . The lower cover tape 220 is attached to the lower surface of the conveyor belt 200 through the adhesive layer 210 present on the lower surface of the conveyor belt 200 . For example, in the case where the adhesive layer 210 is formed of a thermoplastic resin, the lower cover tape 220 may be attached to the adhesive layer 210 by applying heat or pressure. In addition, various methods of attaching the lower cover tape 220 to the adhesive layer 210 may be applicable to this embodiment according to the material of the adhesive layer 210 . In the case where the transfer hole 204 exists, the width of the lower cover tape 220 may be formed to a width that does not block the transfer hole.

According to another embodiment, after the transport belt 200 and the adhesive layer 210 are drilled to form the transport space 202, the lower cover tape 220 is attached to the lower surface of the adhesive layer 210, and then the transport holes 204 are formed by drilling. In this case, when the transfer hole 204 is punched, the lower cover tape 220 is also perforated. Therefore, the width of the lower cover tape 220 may be the same as the width of the transfer tape 200 or a width sufficient to cover the transfer hole area. Width.

Referring to FIG. 3D , when the small components are loaded in the accommodation space 202 of the conveyor belt 200 , the upper cover tape 230 is attached to the upper surface of the conveyor belt 200 to seal the accommodation space 202 . Since the upper cover tape 230 is produced in a process performed after mounting the micro parts, the process of attaching the upper cover tape 230 can be eliminated from the manufacturing process of the micro parts transport device. That is, the microcomponent transport device 100 of this embodiment is composed of the transport belt 200, the adhesive layer 210, and the lower cover tape 220, and the upper cover tape 230 may not be included.

FIG. 4 is a schematic diagram of another method of forming an adhesive layer according to an embodiment of the present invention.

Referring to FIG. 4 , the adhesive layer 210 may be formed by at least two separators on the lower surface of the conveyor belt 200 along the length direction of the conveyor belt 200 . The example shown in FIG. 3 is an example in which the adhesive layer 210 is formed on the entire lower surface of the conveyor belt disc 300 . However, the adhesive layer 210 may be present on the lower surface of the conveyor belt disc 300 in the form of a plurality of separators separated by certain intervals.

The conveyor belt disc 300 with the adhesive layer 210 formed on the lower surface is cut into a certain width to form the conveyor belt 200, and the conveyor belt 200 is punched to form the accommodation space 202. Therefore, even if the adhesive layer 210 exists in the lower part of the conveyor belt 200 where the accommodation space 202 is to be formed, when the accommodation space 202 is formed by punching, the adhesive layer 210 located in the lower part of the accommodation space 202 is also perforated at the same time. Therefore, by the separator number The spacing between the formed adhesive layers 210 can be determined arbitrarily, regardless of the position of the accommodation space 202 . Furthermore, when the adhesive layer 210 is formed by a plurality of separators on the conveyor belt 200 instead of the conveyor belt disc 300, the adhesive layer 210 under the accommodation space 202 is removed by drilling, so that the arrangement of the adhesive layer 210 can be freely selected. spacing or location etc.

Above, the preferred embodiments of the present invention have been described. Those of ordinary skill in the technical field to which the present invention belongs should understand that the present invention can be embodied in various modifications within the scope that does not deviate from its essence. Accordingly, the disclosed embodiments should be considered from a descriptive perspective rather than a restrictive perspective. The scope of the present invention is described in the patent application scope of the invention rather than the above-mentioned specific embodiments, and all differences within the equivalent scope thereof should be construed as being included in the scope of the present invention.

100: Small parts transport device 102: Accommodation space 110: Reel 200: Conveyor belt 202: Accommodation space/transport space 204: Transfer hole 210: Adhesive layer 220: Lower cover tape 230: Upper cover tape 300: Conveyor belt circular plate 500: Plastic 510: Rod 520: Space W ₁ , W ₂ : Width

FIG. 1 is a schematic diagram of a micro-component transport device according to an embodiment of the present invention. FIG. 2 is a detailed structural diagram of the micro-component transport device according to the embodiment of the present invention. 3A to 3D are schematic diagrams of a method of manufacturing a micro-component transport device according to an embodiment of the present invention. FIG. 4 is a schematic diagram of another method of forming an adhesive layer according to an embodiment of the present invention. Figure 5 is a schematic diagram of a method of producing a conveyor belt through a conventional forming method.

200: Conveyor belt 202: Accommodation space/transport space 204: Transfer hole 210: Adhesive layer 220: Lower cover tape 230: Upper cover tape W ₁ , W ₂ : Width

Claims (8)

A method of preparing a tiny parts transport device, which is characterized by including: The step of forming an adhesive layer on the lower surface of the conveyor belt; and The step of simultaneously drilling holes into the conveyor belt and the adhesive layer to form tiny component accommodation spaces. The preparation method of claim 1, further comprising: The step of attaching a lower cover tape to the lower surface of the adhesive layer to seal the micro-component accommodating space. The preparation method of claim 1, wherein the step of forming the adhesive layer includes: The step of forming an adhesive layer on the lower surface of a conveyor belt disk having a certain area; and The conveyor belt disk with the adhesive layer attached is cut into a certain width to form a conveyor belt with an adhesive layer on its lower surface. The preparation method of claim 1, wherein the step of forming the adhesive layer includes: The step of forming the adhesive layer with at least two separators on the lower surface of the conveyor belt along the length direction of the conveyor belt. A tiny parts transport device, characterized by including: conveyor belt; An adhesive layer located at the lower part of the conveyor belt; and A micro-component accommodation space is formed by simultaneously drilling holes in the conveyor belt and the adhesive layer. The tiny parts transport device of claim 5, further comprising: The lower covering tape is located at the lower part of the adhesive layer. The tiny parts transport device according to claim 5, further comprising: An upper cover belt is located on the upper part of the conveyor belt. The microparts transport device according to claim 6, characterized in that: The adhesive layer includes an adhesive or a thermoplastic resin, and the lower cover tape is composed of at least one layer.