JP3965431B2 - Manufacturing method of taping package - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a tape-packaged product packaged electronic parts tape-like packaging material, in particular manufacturing method of taping packaging which displays the product name and identification mark in the laser beam irradiation printing on a tape-like packaging material About.
[0002]
[Prior art]
Conventionally, printed circuit boards for electrical and electronic equipment have been using surface-mounted electronic components such as resistors, capacitors, coils, varistors, thermistors, and diodes. Electronic components are mounted on the printed circuit board surface. In this case, from the viewpoint of manufacturing automation, the form of a taping package 10 (also referred to as an electronic component series) in which the electronic component 1 is wrapped with a tape-shaped packaging material as shown in FIG. The product name and identification symbol of the part 1 are displayed only on the outer surface of the reel around which the taping package 10 is wound.
[0003]
When surface mount electronic components first appeared, their dimensions were sometimes large, and it was possible to print the product name and identification symbol on the surface of each electronic component. As you can see, the miniaturization of equipment has been promoted, and the surface-mounted electronic components used have also been miniaturized to less than 1 mm in width, length, and thickness. The background is that it has become difficult to print the name and identification symbol of an electronic component on the surface of the electronic component.
[0004]
As shown in FIG. 5, the specific configuration of the taping packaged product is roughly divided into the upper and lower surfaces of the storage tape 11 in which the recesses (open holes) 12 for storing the electronic components 1 and the feed holes 15 are formed. There are three-layer configurations each covered with cover tapes 13 and 14, or a two-layer configuration in which the upper surface of a storage tape (an embossed tape) in which a bottomed recess for storing electronic components is formed is covered with a cover tape.
[0005]
Known examples of taping packages include Patent Document 1 and Patent Document 2 below.
[0006]
[Patent Document 1]
JP-A-7-76364 [Patent Document 2]
Japanese Patent Laid-Open No. 2001-278334
In Patent Document 1, a barcode is attached to the bottom surface of the carrier tape for each electronic component. However, when the electronic component becomes small, it is impossible to attach the barcode to each electronic component.
[0008]
[Problems to be solved by the invention]
By the way, in a production line, there is often a case where a taping package containing electronic parts is pulled away from a winding reel or a part of the taping packaging pulled out from the reel is cut off and used. . If the taping package is pulled away from the reel or a part of it is cut off, such as when manufacturing printed circuit boards in a small number of units, the name of the electronic component and the identification symbol of the reel Since only the use of labels is used on the outer surface, there are many problems in the production line that cannot be prevented from being confused with different parts and different kinds of electronic parts and cause serious malfunctions.
[0009]
The present invention has been made in view of the above points, and by tape-type packaging material for storing electronic components printed and displayed by laser light irradiation , the taping package product can be pulled away from the reel in the production line. The purpose of the present invention is to provide a method for manufacturing a taping package product that can prevent confusion between different parts and different types of electronic parts even when part of them are cut out and used. The object is to provide an inexpensive and reliable manufacturing method for packaged products.
[0010]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the taping package manufacturing method according to the invention of claim 1 of the present invention, when packaging electronic components with a tape-like packaging material having a structure in which a cover tape is bonded to a storage tape,
The cover tape is a thin paper with a resin laminate,
After the electronic component is packaged with the tape-shaped packaging material, the thin paper is burned and printed through the resin laminate by laser light irradiation .
[0014]
The method for manufacturing a taping package according to the invention of claim 2 of the present invention is to wrap electronic components with a tape-shaped packaging material having a structure in which a cover tape is bonded to a storage tape.
The storage tape is a mount tape, and the cover tape is a resin tape,
After the electronic component is packaged with the tape-shaped packaging material, the mount tape is scorched through the resin tape by laser light irradiation and printed.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a method for manufacturing a taping package according to the present invention will be described below with reference to the drawings.
[0016]
1 and 2 show a first embodiment of the present invention, in which FIG. 1 is a perspective view with the bottom side of the taping package facing upward, FIG. 2A is a front sectional view, and FIG. Each figure is shown. In these drawings, the taping package 20 includes a storage tape 21 provided with a plurality of storage recesses 22 for storing the chip-like electronic components 1 one by one and distributed in the length direction, and an upper tape. The cover tape 23 and the lower cover tape 24 are used as a tape-shaped packaging material. The storage tape 21 is provided with a plurality of feed holes 25 having an arrangement pitch correlated with the storage recess 22. Such a storage tape 21 is generally made of a material such as paper, polystyrene, or polyester, but the storage recess 22 described above is provided as a hole penetrating in the thickness direction of the storage tape 21, so The lower cover tape 24 is bonded (crimped) to the bottom surface side of the storage tape 21 so as to close the lower surface opening. Further, after the electronic components 1 are stored one by one in the storage recess 22, the upper cover tape 23 is bonded (crimped) to the storage tape 21 so as to close the top opening of the storage recess 22.
[0017]
In the present embodiment, as the lower cover tape 24, a thin paper used as a base material and subjected to resin lamination and antistatic processing is used. Then, after packaging the electronic component 1 with the tape-shaped packaging material (the storage tape 21, the upper cover tape 23, and the lower cover tape 24), the electronic component is stored by irradiating the lower cover tape 24 with a laser beam. Either or both of the product name and the identification symbol are printed at a position P indicated by a one-dot chain line in the drawing, for example. In this case, good visibility can be ensured by scoring the thin paper that is the base material of the lower cover tape 24 through the laminated resin (forming a branding mark). The resin laminating process using thin paper as a base material may be performed on one side or both sides of the thin paper, but in the case of single sided, the resin laminating process is performed on the outer surface of the thin paper.
[0018]
An experimental example of laser light irradiation printing is shown below.
(1) Lower cover tape conditions:
A thin paper with a weight of 14 gf / m ² per unit area is used as a base material, and a 20 μm thick translucent satin polyethylene film is laminated and antistatic processed. The lower cover tape is pressed against the storage tape.
(2) Laser irradiation printing conditions:
Printing speed: 200 mm / sec Laser output: 18% (when the rated output of the laser printer is 100%)
Processing surface output: 2 W (irradiation intensity on the lower cover tape surface)
Focus: Focusing on the lower cover tape Printing time: 0.28 seconds
FIG. 3 shows the state of printing in the above experimental example of laser light irradiation printing on the lower cover tape of the taping package. The lower cover tape is burnt (a part of the thin paper is burnt) by laser light irradiation, and clear printing is obtained.
[0020]
When the laser printing apparatus is combined with a taping machine, the taping packaging process for packaging electronic components with a tape-shaped packaging material and the printing process by laser light irradiation can be performed almost simultaneously (interlocked). For example, in the order of electronic component characteristic measurement process → editing process → taping packaging process → laser printing process → reel winding process, or characteristic measurement process → taping packaging process → laser printing process → reel winding process Each process can be linked and executed in order.
[0021]
According to the first embodiment, the following effects can be obtained.
[0022]
(1) When manufacturing printed circuit boards in a small number of units, when using tapes that have been separated from reels or partially cut off on the production line, different parts or different types of electronic parts This makes it possible to prevent confusion and eliminates rework work, leading to a reduction in manufacturing costs.
[0023]
(2) Printing by laser light irradiation has the advantage that it can be controlled and managed with a simple computer system. Further, the surface of the tape-like packaging material is carbonized with laser light to express characters and symbols, the laser light focus is sharp, even small characters can be printed, and more complicated control is possible. Therefore, it is possible to print even small characters on the flat surface of the tape-like packaging material with laser light irradiation, so it is possible to prevent confusion between different parts and different kinds of electronic parts, and the mounting process of electronic parts The certainty can be maintained, and as a result, the manufacturing cost can be reduced.
[0024]
(3) Since printing is performed by laser light irradiation, the printing speed is high, and the electronic component characteristic measurement process → taping packaging process → printing process → reel winding process can be linked to contribute to productivity improvement.
[0025]
(4) Because of printing by laser light irradiation, unlike the printing method using ink, there is also a secondary advantage that no industrial waste is involved.
[0026]
(5) By making the cover tape of the tape-like packaging material a thin paper with a resin laminate, the thin paper can be scorched by laser irradiation and printed, and the visibility is improved. Can do.
[0027]
FIG. 4 shows a second embodiment of the present invention. The taping package 20A includes a storage tape 21, a lower cover tape 24A, and an upper cover tape provided so that a plurality of storage recesses 22 for storing the electronic components 1 one by one are distributed in the length direction. 23 is used as a tape-shaped packaging material. Here, unlike the first embodiment, the lower cover tape 24 </ b> A does not use a thin paper base material but has a structure of only a resin tape, and a paper mount tape is used as the storage tape 21.
[0028]
Then, after packaging the electronic component 1 with a tape-shaped packaging material (the storage tape 21, the upper cover tape 23, and the lower cover tape 24A), the lower cover tape 24A is irradiated with a laser beam, so that either the product name or the identification symbol is displayed. Or both are printed at a position P indicated by a one-dot chain line in the figure, for example. In this case, good visibility can be secured by scoring the surface of the mount tape forming the storage tape 21 through the lower cover tape 24A.
[0029]
Other configurations are the same as those of the first embodiment described above, and the same operational effects can be obtained.
[0030]
In each of the above embodiments, laser light is irradiated on the lower cover tape side of the tape-shaped packaging material composed of the storage tape, the upper cover tape, and the lower cover tape, and printing is performed on the bottom surface side of the tape-shaped packaging material. However, a similar effect can be obtained even in a configuration in which the upper cover tape side is irradiated with laser light and printed on the upper surface side of the tape-shaped packaging material. Furthermore, you may give the printing by laser beam irradiation on both the upper surface and the lower surface of the said tape-shaped packaging material.
[0031]
In each of the above-described embodiments, the case of a three-layer tape-shaped packaging material composed of a storage tape, an upper cover tape, and a lower cover tape has been illustrated. The present invention can also be applied to the case of using a two-layer tape-shaped packaging material in which the upper surface of the formed storage tape (embossed tape) is covered with a cover tape.
[0032]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.
[0033]
【The invention's effect】
As described above, the taping package obtained by the method for manufacturing a taping package according to the present invention is printed on one or both sides of a tape-shaped packaging material by laser light irradiation, and has the following effects. Can do.
[0034]
(1) Even in the case of manufacturing a printed circuit board of a small number of units, even if the taped package is pulled away from the reel or partially cut off in the production line, the tape-like Since the names and identification symbols of the electronic parts stored in the packaging material are displayed, it is possible to prevent confusion between different parts and different kinds of electronic parts, eliminating the need for rework and reducing manufacturing costs. It leads to reduction.
[0035]
(2) Printing is performed by laser light irradiation, and even a small character can be printed on the flat surface of a tape-shaped packaging material in an easy-to-read manner.
[0036]
Further, in the method for manufacturing a taping package according to the present invention, after packaging electronic parts with a tape-shaped packaging material (substantially simultaneously with the packaging operation), printing is performed on the tape-shaped packaging material by laser light irradiation. The following effects can be obtained.
[0037]
(1) Printing by laser beam irradiation has the advantage that it can be controlled and managed with a simple computer system, and is a method in which the surface of a tape-like packaging material is carbonized with laser light to express characters, symbols, etc. Therefore, the laser beam focus is sharp, even small characters can be printed, and more complicated control is possible. Therefore, it is possible to print even small characters on the flat surface of the tape-like packaging material with laser light irradiation, so it is possible to prevent confusion between different parts and different kinds of electronic parts, and the mounting process of electronic parts The certainty can be maintained, and as a result, the manufacturing cost can be reduced.
[0038]
(2) Since printing is performed by laser light irradiation, the printing speed is high, and the electronic component characteristic measurement process → taping packaging process → printing process → rewinding process on the reel can be linked to contribute to productivity improvement.
[0039]
(3) Because of printing by laser light irradiation, unlike the printing method using ink, there is also a secondary advantage that no industrial waste is involved.
[Brief description of the drawings]
FIG. 1 shows a taping package according to a first embodiment of the present invention, in which a product name and an identification symbol of an electronic component are printed and displayed on a tape-shaped packaging material surface containing the electronic component by laser light irradiation. It is a perspective view.
2A is a cross-sectional view of the taping package, and FIG. 2B is a bottom view of the first embodiment.
FIG. 3 is an enlarged photograph showing an experimental result of laser light irradiation printing on a tape-shaped packaging material surface.
4A and 4B are a second embodiment of the present invention, in which FIG. 4A is a cross-sectional view of a taping package, and FIG. 4B is a bottom view.
FIG. 5 is a perspective view showing an example of a taping packaged product.
[Explanation of symbols]
1 Electronic component 10, 20, 20A Taping package 11, 21 Storage tape 12, 22 Recess 13, 14, 23, 23A, 24 Cover tape 25 Feed hole

Claims (2)

In a method for manufacturing a taping packaged product in which an electronic component is packaged with a tape-shaped packaging material having a structure in which a cover tape is bonded to a storage tape ,
The cover tape is a thin paper with a resin laminate,
A method of manufacturing a taping package, wherein after packaging an electronic component with the tape-shaped packaging material, the thin paper is burned and printed through the resin laminate by laser light irradiation . In a method for manufacturing a taping packaged product in which an electronic component is packaged with a tape-shaped packaging material having a structure in which a cover tape is bonded to a storage tape ,
The storage tape is a mount tape, and the cover tape is a resin tape,
A method for manufacturing a taping packaged product, wherein after packaging an electronic component with the tape-shaped packaging material, the mount tape is burned and printed through the resin tape by laser light irradiation .

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