JPH04173584A - Package for chip-shaped electronic component - Google Patents

Abstract

PURPOSE:To reduce the dimension or the outer width or a case by a method wherein a chip shaped electronic component series, which has a tape shape, is pulled out, a winding core which is rotatably held by a case is rotated. CONSTITUTION:A chip-shaped electronic component series 2 is equipped with a tape storage body 4 on which a plurality of cavities 3 are distributed on the length direction. In each cavity 3, a chip-shaped electronic component 5 is stored. The tape shaped storage body 4 has a bonded structure with 3 layers which consist of, e.g. a bottom tape 6, storage tape 7 and top tape 8. The chip- shaped electronic component series 2 is wound around a winding core 10, and this winding core 10 is rotatably held by a case 11. The winding core 10 has a through hole 12 at the center. The through hole 12 preferably has a cross-sectional shape which accepts a shaft for which a knurling tool is formed, and prohibits rotation between the through hole 12 and the shaft. At each end of the winding core 10, small circular stages 13 and 14 with comparatively small diameters are formed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a package for a chip-shaped electronic component, and in particular, a package containing a chip-shaped electronic component for automatic mounting. The present invention relates to a packaging form for removably storing a series of tape-shaped chip-shaped electronic components in which a plurality of cavities are distributed in the length direction.

[Prior Art] When automatically mounting a chip-shaped electronic component onto a printed circuit board, etc., a tape-shaped chip-shaped component in which a plurality of cavities storing the chip-shaped electronic components are distributed in the length direction is used. An electronic component chain is advantageously used.

Such a series of tape-shaped chip-shaped electronic components is usually wound on a reel and shipped from the chip-shaped electronic component manufacturer, and the consumer of the chip-shaped electronic components The reel is directly attached to the automatic mounting machine. In an automatic mounting machine, a tape-shaped series of chip-shaped electronic components is pulled out from a reel, and the chip-shaped electronic components stored in the cavity are taken out one after another.
It is automatically mounted on a printed circuit board, etc.

[Problems to be Solved by the Invention] However, in the package for a chip-shaped electronic component as described above, the following problems were involved in using a reel to be solved.

First, the outer width of the reel is relatively large compared to the width of the tape-like chip-like electronic component series. Currently, due to the thickness of the flange provided on the reel, the outer width of the reel is approximately twice as large as the width of the tape-shaped chip-shaped electronic component series. Therefore, in automatic mounting machines for chip-shaped electronic components,
A space for mounting such a reel is required to be at least twice as wide as the width of the series of chip-shaped electronic components in the width direction of the reel.

With a typical automatic mounting machine,
However, as mentioned above, if space is taken up for mounting the reel, the floor space occupied by the automatic mounting machine increases, reducing productivity per unit area. It becomes an obstacle to improvement.

In addition, as mentioned above, since the reel has a relatively large outer width, the packaging volume per unit quantity of chip-shaped electronic components becomes thick during transportation, resulting in an increase in transportation costs. invite.

Therefore, it is an object of the present invention to provide a package for chip-shaped electronic components that does not use reels as described above and that can solve the problems posed by reels.

[Means for Solving the Problems] Chip-shaped electronic components packaged by the package according to the present invention are in the form of a series of tape-shaped chip-shaped electronic components. That is, a tape-like series of chip-like electronic components is used in which a plurality of cavities containing chip-like electronic components are distributed in the length direction. Such a series of chip-shaped electronic components is wound around a winding core.

On the other hand, a case is provided having first and second wall members connected via a bendable connection. First and second bearing holes are formed in the first and second wall members of the case, respectively, for rotatably receiving each end of the winding core. Therefore, the series of chip-shaped electronic components wound around the core is positioned between the first and second wall members. The first and second wall members are maintained parallel to each other by the parallel state maintaining means.

[Operation] The package for a chip-shaped electronic component according to the present invention is transported in its original form and is mounted on an automatic mounting machine. In an automatic mounting machine, when a tape-shaped series of chip-shaped electronic components is pulled out, a winding core rotatably held in a case rotates to allow such pulling out.

[Effect of the invention] .

Thus, according to the present invention, the case and the winding core are
Plays the role of a traditional reel. The case can be made of, for example, a relatively thin plate of plastic or paper, and if necessary, the first and second wall materials of the case can be made of a series of chip-shaped electronic components wound around a core. can be brought into contact with. Therefore, the outer width of the case can be made smaller than that of a conventional reel.

Therefore, the space required to load a predetermined number of packages onto an automatic mounting machine can be reduced compared to when reels are used, and the floor space occupied by the automatic mounting machine can be reduced (
As a result, productivity per unit area can be improved. In addition, given the same amount of space on an automatic mounting machine, more packages can be mounted than when using a reel. It is possible to increase the number of types of electronic components.

In addition, since the distance between each of the packages arranged in the automatic mounting machine can be reduced, in the automatic mounting machine, the gap between the packages and the chuck mechanism for taking out the chip-shaped electronic components from the individual chip-shaped electronic component series can be reduced. Since the relative movement distance can be reduced, the automatic mounting process can be made faster.

Furthermore, the package according to the present invention can reduce the packaging volume per unit quantity of chip-shaped electronic components compared to the case where a conventional reel is used, so that transportation costs can be reduced.

Further, as described above, the case used in the package according to the present invention can be made of a plastic board or paper, so the manufacturing cost of the case itself can be reduced compared to a conventional reel. Further, since the first and second wall materials included in the case are connected via a bendable connecting portion, the work for assembling such a case is simple.

In addition, since the winding core around which the series of chip-shaped electronic components is wound is already rotatably held by the case, when such a package is mounted on an automatic mounting machine, the case itself will not rotate like a reel. There is no need to hold it rotatably. Therefore, the mechanism for mounting the package in the automatic mounting machine can be simplified.

[Embodiment] FIG. 1 is a perspective view showing a package 1 according to an embodiment of the present invention. FIG. 2 is a top view of the package 1 shown in FIG.

1 and 2, a series of tape-shaped chip-shaped electronic components 2 is schematically shown.

The detailed structure of this chip-shaped electronic component series 2 is shown in FIG.

Referring to FIG. 3, the chip-shaped electronic component series 2 includes a tape-shaped storage body 4 in which a plurality of cavities 3 are distributed in the length direction. A chip-shaped electronic component 5 is housed within each cavity 3.

In this embodiment, the tape-shaped storage body 4 is a bottom tape 6.
, has a three-layer laminated structure consisting of a storage tape 7 and a top tape 8. The cavity 3 described above is provided as a hole passing through the storage tape 7, and the bottom tape 6 and the top tape 8 are attached to the storage tape 7 so as to close the openings on the lower and upper surfaces of the cavity 3, respectively. . Further, the storage tape 7 is provided with a plurality of feed holes 9 in a fixed positional relationship with the cavity 3.

Note that the chip-shaped electronic component series 2 may be replaced with a structure other than that shown in FIG. 3.

The chip-shaped electronic component chain 2 is wound around the winding core 10,
This winding core 10 is rotatably held by a case 11. The details of the structure of the winding core 10 and the case 11 will be explained with reference to FIG. 4 in addition to FIGS. 1 and 2.

The winding core 10 has a through hole 12 at its center.

The through-hole 12 preferably has a cross-sectional shape such that it receives a knurled shaft and is prevented from rotating thereabout. At each end of the winding core 10, circular stepped portions 13 and 14 having a relatively small diameter are formed.

The case 11 is made of, for example, a plastic plate or cardboard with a thickness Q of about 5 mm.

The case 11 has a first wall material 15 and a wall material 16 of the chest 2. These first and second wall materials 15 and 16 are connected to each other via bendable connecting portions 19 via bending lines 17 and 18. The connecting part 19 has a window 2
0 may be formed.

Preferably, cuts 21 and 22 are provided on the above-mentioned bending lines 17 and 18 in order to facilitate the bending here.

A first bearing hole 23 is formed in the first wall material 15 to rotatably receive the circular stepped portion 13 provided at one end of the winding core 10 . On the other hand, a second bearing hole 24 is formed in the second wall material 16 to rotatably receive the circular stepped portion 14 provided at the other end of the winding core 10 .

The first wall material 15 also has, for example, four protrusions 25. located at positions surrounding the bearing hole 23. 26. 27°28 is provided.

Moreover, two overhang pieces 29 and 30 are formed at the end of the first wall material 15, for example.

The second wall material 16 includes, for example, two windows 31 and 32.
is provided.

To obtain the package 1 shown in FIGS. 1 and 2,
First, one end of the chip-shaped electronic component chain 2 is fixed to the outer circumferential surface of the winding core 10, and one circular stepped portion 13 of the winding core 10 is connected to the first bearing hole 23 of the first wall material 15. Further, in this state, the winding core 10 is attached to a winding shaft of a winding machine (not shown). A knurling is formed on the winding shaft, and mutual rotation is prohibited between the winding shaft and the winding core 10, so that the rotation of the winding shaft is reliably transmitted to the winding core 10. has been done.

Next, the second wall material 16 is bent via the connecting portion 19 so as to face the first wall material 15. At this time,
Preferably, the first wall material 15 and the jI2 wall material 16 do not face each other in parallel, but are slightly open at the free ends of each wall material 15 and 16. For example, the distance between the first wall material 15 and the second wall material 16 at this free end is approximately 1.1 to 1.5 times the width of the series of chip-shaped electronic components 2.

In the above-mentioned state, the winding shaft of the winder is rotated, and the winding core 10 is rotated, so that the series of chip-shaped electronic components 2 is wound around the winding core 10.

When winding of the chip-shaped electronic component series 2 of a predetermined length is finished,
The winding core 10 is removed from the winder together with the case 11.

Next, the second wall material 16 is arranged in parallel with the first wall material 15. As a result, the circular stepped portion 14 of the winding core 10
is completely fitted into the second bearing hole 24.

In order to maintain the first and second wall materials 15 and 16 parallel to each other in this manner, connecting tapes 33 and 34 are provided. The connecting tapes 33 and 34 are
For example, it is composed of a film having a 22-layer structure of polyester and polyethylene, and is fixed to the first and second wall materials 15 and 16 by heat welding. That is, each end of the connecting tapes 33 and 34 is attached to the overhanging pieces 29 and 30 of the first wall material 15, and each other end is attached to the inner surface of the free end of the second wall material 16.

In this way, a package 1 as shown in FIGS. 1 and 2 is obtained.

The chip-shaped electronic component 5 is shipped in the form of such a package 1. Furthermore, on the consumer side, the package 1 is mounted on an automatic mounting machine in its original form.

5 and 6 show the state in which the package 1 is mounted on an automatic mounting machine in a top view and a front view, respectively.

In FIGS. 5 and 6, a cassette 35 for mounting the package 1 is shown, which forms part of an automatic mounting machine. The cassette 35 can be attached to and detached from the automatic mounting machine body while holding the package 1.

The cassette 35 includes a vertical wall 36, and on one side thereof,
A positioning shaft 37 and a positioning lever 38 are provided. The positioning lever 38 is rotatable in the direction shown by an arrow 39. To attach the package 1 to such a cassette 35, the positioning shaft 37 is inserted into the through hole 12 of the winding core 10, and the positioning lever 38 is rotated so that the positioning lever 38 is inserted into the window 20 of the case 11. It is brought into a state where it is engaged with the wall material 15 on the east side 1 through the hole. In this state, since the positioning shaft 37 has a circular cross section, the winding core 10 can freely rotate around the positioning shaft 37.

The series of chip-shaped electronic components 2 pulled out from the package 1 mounted on the cassette 35 is guided onto a table 40 formed by extending from one side of the vertical wall 36, and is guided under a holding plate 41. . A sprocket wheel is attached to the end of the table 40, and when the sprocket wheel is rotated while the sprocket 42 formed on the sprocket wheel is engaged with the feed hole 9 of the chip-shaped electronic component series 2, the chip is rotated. A series of electronic components 2 are sent. A window 43 is formed in the holding plate 41, and this window 4
3, the top tape 8 of the series of chip-shaped electronic components 2 is peeled off, and this top tape 8 is passed through the winding roll 44.
It is wound up. When the top tape 8 is peeled off,
The top opening of the cavity 3 (Fig. 3) is opened, and the chip-shaped electronic component 5 housed therein is moved to the chuck mechanism (
(not shown) and subjected to an automatic mounting process.

The case 11 provided for the package 1 described above is the second
As clearly shown in the figure, the first wall material 15 and the second wall material 16 provide the connecting portion 19 with dimensions that allow it to come into contact with the series of chip-shaped electronic components 2.

However, as shown in FIG. 7, even if this case 11 is applied to a relatively narrow chip-shaped electronic component series 2a, the first and second wall materials 15 and 16 are can be brought into contact with.

That is, by making the angles formed between the connecting portion 19 and the first and second wall materials 15 and 16 different from 90 degrees, the first and second wall materials 15 and 16
The distance between them can be narrowed while keeping them parallel to each other. Therefore, while using the case 11 of the same size, it is possible to accommodate a series of chip-shaped electronic components having various widthwise dimensions.

In addition, as shown in FIG. 7, when using the case 11, the second It is necessary to change the position of the second bearing hole 24 provided in the wall material 16. In order to make such a change unnecessary, another bending line may be formed at the center of the connecting portion 19 in the width direction.

In the embodiment described above, the first and second wall materials 15 and 16 were placed on both sides of the chip-shaped electronic component series 2 without any gaps, but as shown in FIG. A gap may be formed between at least one of the first and second wall materials 15 and 16.

In this case, the protrusions 25, 26, 27 and 28 shown in FIG.
The widthwise dimension of the protrusions 45 and 46 corresponding to is made larger than the widthwise dimension of the series of chip-shaped electronic components 2.

Therefore, the distance between the first and second wall members 15 and 16 is defined by the protrusions 45 and 46, and the first wall member 15 and the second wall member 16 are positioned, and the connecting tape 33 allows the first and second wall members 15 and 16 to be parallel to each other. condition is maintained.

As shown in FIG. 8, when the protrusions 45 and 46 have a width dimension that is equal to or larger than the width of the series of chip-shaped electronic components 2, the protrusions 45 and 46 are bonded with adhesive. Alternatively, by joining it to the second wall material 16 by thermal welding or the like, it is possible to maintain the mutually parallel state of the first and second wall materials 15 and 16 without using the connecting tape 33. In this case, the overhang piece 29
and 30 are unnecessary.

Further, as shown in FIG. 9, the first wall material 15 is provided with protrusions 47 and 48, and the second wall material 16 is provided with a protrusion 49.
and 50, and by joining the protrusions 47 and 49, and the protrusions 48 and 50, respectively,
The first and second wall members 15 and 16 may be kept parallel to each other.

In addition, the four protrusions 25 shown in FIG. 26°27.
Still another example of how to provide such a protrusion will be described with reference to 28.

For example, only the protrusions 25 and 27 may be provided on the first wall material 15, while the remaining protrusions 26 and 28 may be provided on the second wall material 16.

Also, for example two of these protrusions may be removed from either wall material 15 and 16.

Furthermore, at least two of these protrusions may be formed integrally.

FIG. 10 is an exploded perspective view of a case 51 included in still another embodiment of the present invention.

FIG. 11 is a perspective view showing a package 52 that includes the case 51 shown in FIG. 10.

The case 51 includes a first wall material 55 and a second wall material 55 that are connected via a bendable connecting portion 54 along a bending line 53.
The wall material 56 is provided. These first and second wall materials 55
and 56 are formed with first and second bearing holes 58 and 59 for rotatably receiving each end of a winding core 57 around which a series of chip-shaped electronic components (not shown) is wound. There is.

Such a case 51 is obtained by molding plastic, and the connecting portion 54 is made thin to provide a bending line 53.

The first and second wall materials 55 and 56 include, respectively,
Rising walls 60 and 61 are formed along three sides. These rising walls 60 and 61 serve as the aforementioned protrusions.

Further, the rising wall 60 is provided with a plurality of fitting protrusions 62, while the rising wall 61 is provided with these fitting protrusions 6.
In this embodiment in which a fitting recess 63 corresponding to 2 is provided, as shown in FIG. is maintained by the fitting protrusion 62 fitting into the corresponding fitting recess 63. Note that, as shown in FIG. 11, an adhesive film 64 bonded by adhesive or thermocompression bonding is pasted across the first and second wall materials 55 and 56, and the first and second wall materials are bonded together. 55 and 56
It is also possible to reinforce the overlapping state of . In this case, the adhesive film 64 may be used as a display label indicating the type of chip-shaped electronic component contained in the package 52.

Note that the package 52 shown in FIGS. 10 and 11
In place of the fitting protrusion 62 and the fitting recess 63,
The opposing surfaces of the rising walls 60 and 61 may be joined by adhesive or heat welding. Also,
The mutually parallel state of the first and second wall members 55 and 56 may be maintained only by the adhesive film 64 described above.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a package 1 according to an embodiment of the present invention. FIG. 2 is a top view of the package 1 shown in FIG. FIG. 3 is a plan view showing details of the structure of the chip-shaped electronic component array 2 shown in FIG. 1. FIG. FIG. 4 is an exploded perspective view of the case 11 shown in FIG. 1, and also shows the winding core lO. Figure 5 shows the first
FIG. 3 is a top view showing a state in which the package 1 shown in the figure is mounted on a cassette 35 provided in an automatic mounting machine. FIG. 6 is a front view of the state shown in FIG. 5. FIG. 7 is a diagram corresponding to FIG. 2 and shows another method of using the case 11. FIG. 8 is a top view showing a package according to another embodiment of the invention. FIG. 9 is a top view showing a package according to still another embodiment of the invention. FIG. 10 is an exploded perspective view of a case 51 included in still another embodiment of the present invention. FIG. 11 is a perspective view showing a package 52 that includes the case 51 shown in FIG. 10. In the figure, 1.52 is a package, 2 and 2a are a series of chip-shaped electronic components, 3 is a cavity, 5 is a chip-shaped electronic component, 10.57 is a core, 11.51 is a case, and 15.55
is the first wall material, 16.56 is the second wall material, 17, 18.
53 is a bending line, 19.54 is a connecting portion, 23.58 is a first bearing hole, 24.59 is a second bearing hole, 33.34 is a connecting tape (parallel state maintaining means), 45. 46.47
゜48.49.50 is a protrusion (parallel state maintaining means), 60
．． 61 is a rising wall, 62 is a fitting protrusion, 63 is a fitting recess, and 64 is an adhesive film. Figure 6 μ Figure 8 54 Figure 11

Claims (1)

[Scope of Claims] A tape-shaped series of chip-shaped electronic components in which a plurality of cavities storing chip-shaped electronic components are distributed in the length direction; a winding core wound around the winding core; first and second bearing holes each forming a rotatable receiving hole for each end of the winding core and connected via a bendable connecting portion; such first and second
A package for a chip-shaped electronic component, comprising: a case having a wall material; and parallel state maintaining means for maintaining the first and second wall materials in a mutually parallel state.