CN104340516A - Surface-mounted electronic device package structure and manufacturing and application methods thereof - Google Patents
Surface-mounted electronic device package structure and manufacturing and application methods thereof Download PDFInfo
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- CN104340516A CN104340516A CN201310330406.1A CN201310330406A CN104340516A CN 104340516 A CN104340516 A CN 104340516A CN 201310330406 A CN201310330406 A CN 201310330406A CN 104340516 A CN104340516 A CN 104340516A
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Abstract
The invention provides a surface-mounted electronic device package structure comprising a plurality of surface-mounted electronic devices and a base strip; the surface-mounted electronic devices are evenly arranged side by side along the length of the base strip and are all fixed on the upper surface of the base strip through adhesive; the base strip and the surface-mounted electronic devices are made into a woven strip. The surface-mounted electronic device package structure is simple in structure and needs less packaging material; weldable portions of part of electrodes of the surface-mounted electronic devices are exposed out of the packaging material, and the packaging material need not be peeled off accordingly during mounting of the surface-mounted electronic devices; the surface-mounted electronic devices are fixed on the base strip and can be accurately conveyed to specific positions of a surface-mounter, and mounting efficiency is improved; the base strip which is split can be mounted with the surface-mounted electronic devices onto a circuit board and softens at the welding temperature to form a protective layer for the surface-mounted electronic devices, and the surface-mounted electronic devices and the circuit board are better in reliability.
Description
Technical field
The present invention relates to the packaging of chip electronic component, transport field, particularly relate to a kind of chip electronic component packaging structure and manufacture method thereof and using method.
Background technology
Along with the development of science and technology and the raising of electronic technology level, and the micro-miniaturisation of electronic product volume, Performance And Reliability further raising, to little, light, thin future development, there is chip electronic component (SMD) thus in electronic devices and components.Compared with common components and parts, chip electronic component eliminates contact conductor, and it can directly weld in the circuit board, and all weld nuggets all in one plane, is specially adapted to the surface mounting technology (SMT) adopted in wiring board automatic Composition process.
Chip electronic component roughly has rectangle, circle, abnormity (wing, hook-type etc.) three kinds of shapes, wherein the chip electronic component 3 of rectangle as shown in Figure 1, it termination electrode 32 comprising Rectangular Element device body 31 and be located at component body 31 two ends, the cross section of described component body 31 is less than the cross section of termination electrode 32 usually, namely the upper surface of termination electrode 32 is higher than the upper surface of component body 31, and the lower surface of termination electrode 32 is lower than the lower surface of component body 31.Because chip electronic component volume is little, thus usually adopt one to be provided with multiple components and parts compartment bring packaging chip electronic component, the direction of an edge carrier band length of described carrier band is provided with multiple knock hole.US Patent specification US3608711 discloses a kind of blank for packing electronic devices and components carrier band, US Patent specification US4298120 discloses a kind of packaging structure be placed on by chip electronic component in the compartment of carrier band afterwards, again by the technical scheme of carrier tape wound on spool, as shown in Figure 2, and the manner of packing of this kind of chip electronic component has become the Normal practice of electronic industry.Under normal circumstances, the carrier band 11 of various sizes according to professional standard injection mo(u)lding or punch forming, then to transport to components and parts manufacturer by the manufacturer of carrier band.Components and parts are filled in the components and parts compartment 111 of carrier band 11 by components and parts manufacturer more one by one, the opening of components and parts compartment 111 is sealed with a coverlay 12 equal with carrier band 11 length, the both sides of coverlay 12 are equipped with adhesive layer, pressurization or heating on adhesive layer, coverlay 12 is made to be attached on carrier band 11, again carrier band 11 is wound on spool 1, thus is convenient to component transport to wiring board manufacturer.
Can use on the automatic assembling chip mounter of all parts of the world in order to ensure weaving into the components and parts after carrier band, electron trade cuncil is as EIA(EIA) and JEDEC(Joint Electronic Device Engineering Council) formulate the specific standards of carrier band.Such as, Electronic Industries Association USA standard EIA-481-B specifies the size of 8mm to 200mm injection mo(u)lding carrier band and 8mm to 12mm punch forming carrier band in detail, comprising size and the tolerance of components and parts compartment and knock hole, to ensure that components and parts are in packed and transported and use procedure, can not displacement and turning in compartment, can be covered in exactly on the position of specifying during paster.
In order to meet the requirement of the High-Speed Automatic installation of high density printed circuit board, the size meeting the carrier band of professional standard must match with the size of components and parts.If components and parts compartment is too loose, then the components and parts of internal storage can be shifted; Otherwise if components and parts compartment is too tight, then inner components and parts can be stuck, and cannot be taken out smoothly by chip mounter.Equally, also have strict requirement for the coverlay covering, close components and parts compartment, namely the adhesive ability of coverlay can not be crossed strong or excessively weak.Adhesive ability can extend its splitting time too by force, thus affects paster speed; The too weak meeting of adhesive ability causes in long storage periods or transportation, and coverlay is opened voluntarily.Therefore, consider from each side such as raw MAT'L, manufacture craft and equipment investment and reduction cost of product, carrier band and coverlay manufacture by the manufacturer of specialty usually, instead of are produced voluntarily by components and parts manufacturer.In addition, the components and parts due to each size all need the components and parts compartment of corresponding size, and components and parts manufacturer must store the carrier band of different size and kind.Carrier band itself has that volume is large, deal is light, can only the feature such as single use, the burden of bringing inevitable transport, storage and a large amount of packing thus to components and parts manufacturer to reclaim.
For the problems referred to above, US Patent specification US4846345 disclose a kind of can the hard plastic magazine with utility outlets of Reusability and packing method thereof.Use this plastic casing can save packing, packaging time and storage and traffic cost significantly.But, hundreds of chip electronic component is not added and is contained in separatedly in the same space, can inevitably cause between components and parts and components and parts with the mutual collision between packing box and friction, particularly for the components and parts such as chip ceramic condenser, chip inductor be made up of hard ceramic body and soft metal electrode, phase mutual friction inevitably can cause the metallic pollution on components and parts ceramic body surface, reduce the surface insulation performance of components and parts, cause components and parts to leak electricity or wiring board integrity problem.In addition, the chip electronic component be stored in plastic casing is likely not exclusively discharged, and causes chip mounter feed to interrupt.For fear of above problem, the method adopting this plastic casing to pack components and parts fails to popularize so far.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of chip electronic component packaging structure greatly reduced costs.
For achieving the above object, the invention provides a kind of chip electronic component packaging structure, comprise multiple chip electronic component, also comprise a base band, described multiple chip electronic component is evenly distributed side by side along the length direction of base band and is all fixed on the upper surface of base band by adhesives, and described base band and chip electronic component form a braid.
Further; described chip electronic component is laterally placed in base band; described chip electronic component comprises component body and is located at the termination electrode at component body two ends; the upper surface of described component body is coated with a boundary belt, and the weldability face of weld of termination electrode upper end exposes from the both sides of boundary belt.
Preferably, described termination electrode lower surface exposes from the both sides of base band, and described base band lower surface flushes lower than termination electrode lower surface or with termination electrode lower surface, and described boundary belt upper surface flushes with the face of weld of termination electrode.
Further, in the interval between adjacent two component body, described boundary belt contacts with base band.
Preferably, described braid is wrapped on a spool, and these spool two ends are all outward extended with back-up ring, and two back-up rings and spool form a circular groove, and described braid is positioned at circular groove.
The chip electronic component packaging structure that the present invention relates to, its integral structure is simple, and packing are saved, and the raw manufacturer of components and parts can produce voluntarily, thus eliminate the expense produced because third party manufactures, and then significantly reduce encapsulation, the packing cost of chip electronic component.And the partial electrode of components and parts can be exposed to outside packing in weld, therefore components and parts are when mounted, and packing do not need to be stripped; And the position of components and parts in base band is fixed, thus can by the assigned address be delivered to exactly on chip mounter, to improve paster efficiency; Base band after segmentation can be installed in the circuit board together in company with components and parts, and under welding heat, the softening protective cover forming components and parts, improves the reliability of components and parts and wiring board.
Another object of the present invention is to the manufacture method of the chip electronic component packaging structure that a kind of low cost of manufacture is provided.
For achieving the above object, the invention provides a kind of manufacture method of chip electronic component packaging structure, comprise the following steps:
A, multiple chip electronic component is put into feed appliance;
B, a spool is fixed on the rolling end of a packaging facilities, described base band is wrapped on a rotating base band volume, and by the end winding support of base band on spool, base band at the uniform velocity pull out and drives spool rotation to carry out rolling by described packaging facilities from base band volume;
The upper surface of C, past base band equally spaced places adhesives, and chip electronic component is at the uniform velocity placed on the adhesive by feed appliance;
D, chip electronic component are fixed on the upper surface of base band by adhesives, and chip electronic component and base band form a braid, and this braid is wrapped on spool.
Further, in described step C, described adhesives is coated with in advance and is located in base band, forms an adhesive phase, and described adhesive phase and base band form an adhesive tape, and described chip electronic component is equally spaced fixed on this adhesive tape.
Preferably, described chip electronic component is laterally placed in base band, described chip electronic component comprises component body and is located at the termination electrode at component body two ends, described step D also comprises: on the upper surface of component body, paste an adhesive tape, and the face of weld that the part of described termination electrode comprises upper end exposes from the both sides of adhesive tape.
Preferably, described chip electronic component is laterally placed in base band, described chip electronic component comprises component body and is located at the termination electrode at component body two ends, described step D also comprises: by the successively covering resin of a sizing equipment in component body, and by solidification equipment by resin solidification, make resin be fixed on the surface of component body, the face of weld of described termination electrode upper end exposes from the both sides of resin.
This manufacture method step is simple and easy to grasp, and low cost of manufacture, thus greatly reduce the productive costs of chip electronic component.
Another object of the present invention is to provide a kind of using method being simple and easy to the chip electronic component packaging structure implemented.
For achieving the above object, the invention provides a kind of using method of chip electronic component packaging structure, comprise the following steps:
1), described braid is wrapped on a spool, and be arranged on by this spool on the pay-off of a chip mounter, described chip mounter comprises transmission gear, is positioned at the cutter of transmission gear side and is positioned at the components and parts extractor above transmission gear;
2), the end of described braid engages with described transmission gear, and between adjacent two teeth of transmission gear, card has a chip electronic component;
3), the braid that is meshed with transmission gear of described cutter cuts, make this braid cut into the single and outside face chip electronic component with base band;
4), single chip electronic component is delivered to the same position place of pay-off by transmission gear, and described components and parts extractor picks up this chip electronic component and this chip electronic component is placed on the pre-position of wiring board;
5), this chip electronic component is welded with wiring board.
Further, after described chip electronic component welding in the circuit board, described base band covers the outside face of chip electronic component, forms a components and parts protective film in the circuit board.
Preferably, after described chip electronic component welding in the circuit board, described base band departs from from the surface of chip electronic component, or described base band is volatilized under the effect of welding heat.
Further, the present invention also provides a kind of using method of chip electronic component packaging structure, comprises the following steps:
1), described braid is wrapped on a spool, and be arranged on by this spool on the pay-off of a chip mounter, described chip mounter comprises transmission gear, is positioned at the cutter of transmission gear side and is positioned at the components and parts extractor above transmission gear;
2), the end of described braid engages with described transmission gear, and between adjacent two teeth of transmission gear, card has a chip electronic component;
3), the braid that is meshed with transmission gear of described cutter cuts, make this braid cut into the single and outside face chip electronic component with base band and boundary belt;
4), single chip electronic component is delivered to the same position place of pay-off by transmission gear, and described components and parts extractor picks up this chip electronic component and this chip electronic component is placed on the pre-position of wiring board;
5), this chip electronic component is welded with wiring board.
Further, after described chip electronic component welding in the circuit board, described base band and boundary belt cover the outside face of chip electronic component simultaneously, form a components and parts protective film in the circuit board.
Preferably, after the welding in the circuit board of described chip electronic component, described base band and boundary belt all depart from from the surface of chip electronic component, or described base band and boundary belt all volatilize under the effect of welding heat.
This using method can by chip electronic component automatic welding in the circuit board, and step simply and easily implement, and the whole process of this using method can be full-automatic, meets the requirement of modern production.
Accompanying drawing explanation
Fig. 1 is the structural representation of chip electronic component.
Fig. 2 is the schematic diagram of chip electronic component packaging structure in prior art.
Fig. 3 to Fig. 8 is the front view of different embodiment in the present invention.
Fig. 9 is the connection diagram of base band and component body.
Figure 10 to Figure 12 is the connection diagram of base band, component body and boundary belt.
Figure 13 is that the A-A of Fig. 6 is to cutaway view.
Figure 14, Figure 15 are that the B-B of Fig. 8 is to cutaway view.
Figure 16 is that the C-C of Fig. 5 is to cutaway view.
Figure 17 is the schematic diagram of the packaging structure of chip electronic component in the present invention.
Figure 18 is the lateral plan of spool in Figure 17.
Figure 19 is the constitution diagram of the packing method of chip electronic component in the present invention.
Figure 20 is the constitution diagram of the using method of chip electronic component in the present invention.
Figure 21, Figure 22 are the structural representation of chip electronic component and wiring board in the present invention.
Element numbers explanation
1 spool
101 back-up rings
102 circular grooves
2 braids
3 chip electronic components
31 component body
32 termination electrodes
321 termination electrode lower surfaces
322 face of weld
4 base band
41 base band lower surfaces
42 adhesive phases
5 boundary belts
51 boundary belt upper surfaces
6 base band volumes
7 sizing equipment
8 transmission gears
9 cutters
10 components and parts extractors
11 carrier bands
111 components and parts compartments
12 coverlays
13 wiring boards
14 forming gears
15 pulleys
16 soldering-tin layers
17 solidification equipments
18 baffle plates
Detailed description of the invention
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this specification sheets can understand other advantages of the present invention and effect easily.
Notice, structure, ratio, size etc. that this specification sheets institute accompanying drawings illustrates, content all only in order to coordinate specification sheets to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification sheets as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
The invention provides a kind of chip electronic component packaging structure, see shown in Fig. 3 to Fig. 6, comprise multiple chip electronic component 3, also comprise a base band 4, described multiple chip electronic component 3 is evenly distributed side by side along the length direction of base band 4 and is all pasted and fixed on the upper surface of base band 4 by adhesives, and described base band 4 and chip electronic component 3 form a braid 2.The material of described base band 4 can be plastics, as selected PET, PP etc., also can be other flexible planar material such as paper; In addition, described base band 4 also can select the adhesive tape having applied adhesive phase 42 in advance, and as shown in figure 13, now, multiple chip electronic component 3 is just pasted onto on the glue face of adhesive tape, and the glue face of adhesive tape is described adhesives.
This braid 2 structure is simple, and be convenient to manufacture, and components and parts manufacturer can produce this braid 2 voluntarily, the carrier band produced without the need to using third party, thus eliminate the working expenses, warehousing charge etc. that pilot process produces, significantly reduce the productive costs of chip electronic component 3.In addition, this braid 2 also eliminates the burden that in prior art, wrapping plastic carrier reclaims, environmental protection more.And the weld of components and parts is exposed to outside packing, therefore components and parts when mounted, and packing do not need to be stripped; And the position of components and parts in base band is fixed, thus can by the assigned address be delivered to exactly on chip mounter, to improve paster efficiency; Base band after segmentation can be installed in the circuit board with boundary belt together with components and parts, and under welding heat, the softening protective cover forming components and parts, improves the reliability of components and parts and wiring board.If use the material that low temperature decomposes or melts, adhesives and base band 4 can be separated with chip electronic component 3 when welding, and do not change or affect existing welding process and welding quality.
Further, described chip electronic component 3 comprises component body 31 and is located at the weldability termination electrode 32 at component body 31 two ends, and the termination electrode 32 being located at component body 31 two ends can be one, and also can be multiple, such as IC chip, be shown in Fig. 4.When the termination electrode 32 being located at component body 31 two ends is respectively one, the cross-sectional plane of described termination electrode 32 is greater than the cross-sectional plane of component body 31 usually, namely between the face of weld 322 of the upper end of termination electrode 32 and the upper surface of component body 31, all there is a height difference H between termination electrode lower surface 321 and the lower surface of component body 31, as shown in figure 13.Described chip electronic component 3 can vertically be placed in base band 4, and namely the length direction of component body 31 parallels with the length direction of base band 4, as shown in Figure 3; Described chip electronic component 3 also can laterally be placed in base band 4, namely the length direction of component body 31 and the length direction of base band 4 perpendicular, as shown in Figure 5, Figure 6.Described base band 4 can the bottom surface of comprehensive coated chip electronic component 3, and see Fig. 3 to Fig. 5, described base band 4 also can only bond with the lower surface of component body 31, thus allows termination electrode 32 expose, as shown in Fig. 6 and Fig. 9 from the both sides of base band 4.
When chip electronic component 3 is laterally placed in base band 4; the upper surface of described component body 31 can be coated with a boundary belt 5; see Fig. 7 and Fig. 8; and the face of weld 322 of termination electrode 32 upper end and the lateral surface of termination electrode 32 all expose from the both sides of boundary belt 5; to ensure when producing wiring board 13; the face of weld 322 of termination electrode 32 upper end contacts with wiring board 13, and during welding, soldering paste is attached on the lateral surface of face of weld 322 and termination electrode 32.Preferably, this boundary belt 5 can be an adhesive tape, also can for be formed by after resin solidification.Now, described base band 4 can the bottom surface of comprehensive coated chip electronic component 3, sees Fig. 7; Also can only fit with the lower surface of component body 31, see Fig. 8, in this kind of embodiment, described base band 4, component body 31 and boundary belt 5 have three kinds of connection modes, be respectively: embodiment 1, as shown in Figure 10, base band 4 is bonding with the lower surface of component body 31, boundary belt 5 fixes with the upper surface of component body 31, and base band 4 parallels with boundary belt 5, is not in contact with each other; Embodiment 2, as shown in figure 11, base band 4 is bonding with the lower surface of component body 31, the upper surface of the coated component body 31 of boundary belt 5 and two sides, in interval between adjacent two component body 31, described boundary belt 5 contacts with base band 4 and is fixed together; Embodiment 3; as shown in figure 12; base band 4 is bonding with the lower surface of component body 31; boundary belt 5 fixes with the upper surface of component body 31; and the two sides of component body 31 by base band 4 and boundary belt 5 institute coated; in interval between adjacent two component body 31, described boundary belt 5 contacts with base band 4 and is fixed together.
Further, for the ease of storage and the transport of braid 2, also comprise a spool 1, see Figure 17 and Figure 18, braid 2 be wrapped on this spool 1, these spool 1 two ends are all outward extended with back-up ring 101, two back-up rings 101 and spool 1 form a circular groove 102, and described braid 2 is positioned at circular groove 102.But, after termination electrode 32 exposes from the both sides of base band 4, then after braid 2 is wrapped on spool 1, in adjacent inside and outside two-layer braid 2, the surface of the termination electrode 32 of two chip electronic components 3 can contact with each other, or contact with back-up ring 101, thus cause the face of weld 322 of termination electrode 32 likely to produce wearing and tearing, finally can cause the rack of fusion of chip electronic component 3.Therefore in order to eliminate described wear problem, can by the lower surface of comprehensive for base band 4 coated chip electronic component 3, the width of base band 4 is made to be greater than the width of chip electronic component 3, namely base band 4 is stretched out from the both sides of termination electrode, as shown in figure 16, also the thickness of base band 4 can be increased, the thickness of base band 4 is made to be more than or equal to described height difference H, namely described base band lower surface 41 flushes lower than termination electrode lower surface 321 or with termination electrode lower surface 321, see Figure 13 to Figure 15, described boundary belt upper surface 51 flushes with the face of weld 322 of termination electrode 32, or, described boundary belt upper surface 51 also can lower than the face of weld 322 of termination electrode 32, in addition, before being placed on by chip electronic component 3 on wiring board 13, wiring board 13 is provided with soldering paste, therefore described boundary belt upper surface 51 also can a little more than the face of weld 322 of termination electrode 32, preferably, boundary belt upper surface 51 exceeds the thickness of the face of weld 322 of termination electrode 32 is 0 ~ 2mm.By increasing thickness and the width of base band 4, to make braid 2 be wrapped in after on spool 1, the termination electrode 32 of inside and outside two chip electronic components 3 is not in contact with each other, thus eliminates wearing and tearing possibility, ensure the quality of chip electronic component 3, the final welding quality ensureing wiring board 13.
The invention still further relates to a kind of manufacture method of chip electronic component packaging structure, see Figure 19, this manufacture method comprises the following steps:
A, multiple chip electronic component 3 is put into feed appliance;
B, a spool 1 is fixed on the rolling end of a packaging facilities, described base band 4 is wrapped on a rotating base band volume 6, and by the end winding support of base band 4 on spool 1, base band 4 at the uniform velocity pulls out and drives spool 1 to rotate and carries out rolling by described packaging facilities from base band volume 6;
The upper surface of C, past base band 4 equally spaced places adhesives, and chip electronic component 3 is at the uniform velocity placed on the adhesive by feed appliance, such as toward the upper surface drop adhesives at equal intervals of base band 4, while place chip electronic component 3; Preferably, described adhesives is coated with in advance and is located in base band 4, forms an adhesive phase 42, and described adhesive phase 42 and base band 4 form an adhesive tape, and described chip electronic component 3 is equally spaced fixed on this adhesive tape.
D, chip electronic component 3 are fixed on the upper surface of base band 4 by adhesives, and chip electronic component 3 and base band 4 form a braid 2, and this braid 2 is wrapped on spool 1.
Preferably; described chip electronic component 3 is laterally placed in base band 4; described chip electronic component 3 comprises component body 31 and is located at the termination electrode 32 at component body 31 two ends; described step D also comprises: on the upper surface of component body 31, paste an adhesive tape; the face of weld 322 of described termination electrode 32 upper end exposes from the both sides of adhesive tape, and this adhesive tape forms described boundary belt 5.In described step D, adhesives can select pressure sensitive adhesive, after adopting pressure sensitive adhesive, can be cured process, also can not be cured process to it; And all can be cured process at the upper surface of base band 4 and lower surface.
Preferably; described chip electronic component 3 is laterally placed in base band 4; described chip electronic component 3 comprises component body 31 and is located at the termination electrode 32 at component body 31 two ends; described step D also comprises: by the successively covering resin of a sizing equipment 7 in component body 31; and by solidification equipment 17 by resin solidification; resin is made to be fixed on the surface of component body 31; the face of weld 322 of described termination electrode 32 upper end exposes from the both sides of resin, forms described boundary belt 5 after resin solidification.Described resin can select UV resin, then the mode adopting UV to solidify is by UV resin solidification.Described sizing equipment 7 can realize glue spraying and print, and namely 3D prints, thus enhances productivity and working accuracy.
Further, also comprise a forming gear 14, described forming gear 14 is meshed with the upper surface of braid 2, namely as described in Figure 19, when after the upper surface resin by injection of chip electronic component 3, by forming gear 14, resin is rolled sizing, and make resin be coated in the surface of component body 31 equably, afterwards again by resin solidification.
The invention still further relates to the using method of a kind of chip electronic component packaging structure on chip mounter, see Figure 20, this using method comprises the following steps:
1), described braid 2 is wrapped on a spool 1, this spool 1 is arranged on the pay-off of a chip mounter, the components and parts extractor 10 that described chip mounter comprises transmission gear 8, is positioned at the cutter 9 of transmission gear 8 side and is positioned at above transmission gear 8;
2), the end of described braid 2 engages with described transmission gear 8, and between adjacent two teeth of transmission gear 8, card has a chip electronic component 3;
3), the braid 2 that is meshed with transmission gear 8 of described cutter 9 cutting, make this braid 2 cut into the single and outside face chip electronic component 3 with base band 4;
4), single chip electronic component 3 is delivered to the same position place that pay-off is specified in advance by transmission gear 8, in the present embodiment, this position is the top of transmission gear 8, described components and parts extractor 10 picks up this chip electronic component 3 and this chip electronic component 3 is placed on the pre-position of wiring board 13, in the present embodiment, components and parts extractor 10 adopts the mode of vacuum suction to draw chip electronic component 3;
5), by the wiring board 13 posting multiple chip electronic component 3 carry, by a high-temperature soldering region, this chip electronic component 3 is welded with wiring board 13.
In the present embodiment, described cutter 9 can adopt laser cutter, and cutting is quick and precision is high.In addition, described chip mounter and provide the technology of chip electronic component to be prior art to chip mounter, as disclosed a kind of components and parts feeding device of chip mounter at US Patent specification US2011/0243695A1.
Further, when being coated with boundary belt 5 on the upper surface of component body 31, described step 3) in, braid 2 is cut into single and outside face simultaneously with the chip electronic component 3 of base band 4 and boundary belt 5.Before on desired location chip electronic component 3 being placed on wiring board 13, the upper soldering paste of printing in advance on the components and parts relevant position of described wiring board 13, when the components and parts on wiring board 13 all place complete after, wiring board 13 is transported to high-temperature soldering district.Under the effect of welding heat, soldering paste melts, thus is weldingly fixed on wiring board 13 by components and parts, and between termination electrode 32 and wiring board 13, forms soldering-tin layer 16, the lateral surface of the coated termination electrode 32 of described soldering-tin layer 16 and face of weld 322.In addition; in welding process; the base band 4 and the boundary belt 5 that cover chip electronic component 3 outside face are softening under the effect of welding heat; even a components and parts protective film is formed on the surface of chip electronic component 3 weld nugget on the surface of chip electronic component 3; and the surface of base band 4 and the comprehensive coated chip electronic component 3 of boundary belt 5; see Figure 21 and Figure 22, to promote the reliability of wiring board and available protecting chip electronic component 3, extend its service life.Especially for needing high potential or the high reliability wiring board of implementing surface resin coating after welding, the surface of all components and parts all forms protective film, just can save the trouble of PCB surface coating.If the base band 4 selecting low melting point material to make and boundary belt 5; at chip electronic component 3 with the process of wiring board 13 high-temperature soldering; described base band 4 and boundary belt 5 also can melt or volatilize under high temperature action; base band 4 and boundary belt 5 are departed from from the surface of chip electronic component 3; eliminate step base band 4, boundary belt 5 removed, very easy to use.
In addition, as shown in figure 20, described braid 2 is pulled out by level from spool 1, by a pulley 15, braid 2 is transferred to vertically by horizontal motion and moves, and then be meshed with transmission gear 8, improve the stationarity of transmission.Also comprise the baffle plate 18 of a circular arc, this baffle plate 18 is positioned at the periphery of transmission gear 8, is particularly positioned at the periphery of the chip electronic component 3 after cutting, comes off from transmission gear 8 to prevent the chip electronic component 3 after cutting.
In sum, the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (15)
1. a chip electronic component packaging structure, comprise multiple chip electronic component (3), it is characterized in that: also comprise a base band (4), described multiple chip electronic component (3) is evenly distributed side by side along the length direction of base band (4) and is all fixed on the upper surface of base band (4) by adhesives, and described base band (4) and chip electronic component (3) form a braid (2).
2. chip electronic component packaging structure according to claim 1; it is characterized in that: described chip electronic component (3) is laterally placed in base band (4); described chip electronic component (3) comprises component body (31) and is arranged on the weldability termination electrode (32) at component body (31) two ends; the upper surface of described component body (31) is coated with a boundary belt (5), and the face of weld (322) of termination electrode (32) upper end exposes from the both sides of boundary belt (5).
3. chip electronic component packaging structure according to claim 2; it is characterized in that: described termination electrode lower surface (321) is exposed from the both sides of base band (4); described base band lower surface (41) flushes lower than termination electrode lower surface (321) or with termination electrode lower surface (321), and described boundary belt upper surface (51) flushes with the face of weld (322) of termination electrode (32).
4. chip electronic component packaging structure according to claim 2, is characterized in that: in the interval between adjacent two component body (31), described boundary belt (5) contacts with base band (4).
5. chip electronic component packaging structure according to claim 1 and 2, it is characterized in that: described braid (2) is wrapped on a spool (1), this spool (1) two ends are all outward extended with back-up ring (101), two back-up rings (101) and spool (1) form a circular groove (102), and described braid (2) is positioned at circular groove (102).
6. a manufacture method for chip electronic component packaging structure according to claim 1, is characterized in that: comprise the following steps:
A, multiple chip electronic component (3) is put into feed appliance;
B, a spool (1) is fixed on the rolling end of a packaging facilities, described base band (4) is wrapped on rotating base band volume (6), and by the end winding support of base band (4) on spool (1), base band (4) at the uniform velocity pulls out and drives spool (1) to rotate and carries out rolling by described packaging facilities base band volume (6);
The upper surface of C, past base band (4) equally spaced places adhesives, and chip electronic component (3) is at the uniform velocity placed on the adhesive by feed appliance;
D, chip electronic component (3) are fixed on the upper surface of base band (4) by adhesives, and chip electronic component (3) and base band (4) form a braid (2), and this braid (2) is wrapped on spool (1).
7. manufacture method according to claim 6, it is characterized in that: in described step C, described adhesives is coated with in advance and is located in base band (4), form an adhesive phase (42), described adhesive phase (42) and base band (4) form an adhesive tape, and described chip electronic component (3) is equally spaced fixed on this adhesive tape.
8. the manufacture method according to claim 6 or 7, it is characterized in that: described chip electronic component (3) is laterally placed in base band (4), described chip electronic component (3) comprises component body (31) and is located at the termination electrode (32) at component body (31) two ends, described step D also comprises: on the upper surface of component body (31), paste an adhesive tape, and the face of weld (322) of described termination electrode (32) upper end exposes from the both sides of adhesive tape.
9. the manufacture method according to claim 6 or 7, it is characterized in that: described chip electronic component (3) is laterally placed in base band (4), described chip electronic component (3) comprises component body (31) and is located at the termination electrode (32) at component body (31) two ends, described step D also comprises: by the successively covering resin of a sizing equipment (7) in component body (31), and by solidification equipment (17) by resin solidification, resin is made to be fixed on the surface of component body (31), the face of weld (322) of described termination electrode (32) upper end exposes from the both sides of resin.
10. a using method for chip electronic component packaging structure according to claim 1, is characterized in that: comprise the following steps:
1), described braid (2) is wrapped on a spool (1), be arranged on the pay-off of a chip mounter by this spool (1), described chip mounter comprises transmission gear (8), is positioned at the cutter (9) of transmission gear (8) side and is positioned at the components and parts extractor (10) of transmission gear (8) top;
2), the end of described braid (2) engages with described transmission gear (8), and between adjacent two teeth of transmission gear (8), card has a chip electronic component (3);
3), the braid (2) that is meshed with transmission gear (8) of described cutter (9) cutting, make this braid (2) cut into the single and outside face chip electronic component (3) with base band (4);
4), single chip electronic component (3) is delivered to the same position place of pay-off by transmission gear (8), and described components and parts extractor (10) is picked up this chip electronic component (3) and this chip electronic component (3) is placed on the pre-position of wiring board (13);
5), this chip electronic component (3) is welded with wiring board (13).
11. using method according to claim 10; it is characterized in that: described chip electronic component (3) is welded on after on wiring board (13); described base band (4) covers the outside face of chip electronic component (3), at the upper formation one components and parts protective film of wiring board (13).
12. using method according to claim 10, it is characterized in that: described chip electronic component (3) is welded on after on wiring board (13), described base band (4) departs from from the surface of chip electronic component (3), or described base band (4) is volatilized under the effect of welding heat.
The using method of 13. 1 kinds of chip electronic component packaging structures according to claim 2, is characterized in that: comprise the following steps:
1), described braid (2) is wrapped on a spool (1), be arranged on the pay-off of a chip mounter by this spool (1), described chip mounter comprises transmission gear (8), is positioned at the cutter (9) of transmission gear (8) side and is positioned at the components and parts extractor (10) of transmission gear (8) top;
2), the end of described braid (2) engages with described transmission gear (8), and between adjacent two teeth of transmission gear (8), card has a chip electronic component (3);
3), the braid (2) that is meshed with transmission gear (8) of described cutter (9) cutting, make this braid (2) cut into the single and outside face chip electronic component (3) with base band (4) and boundary belt (5);
4), single chip electronic component (3) is delivered to the same position place of pay-off by transmission gear (8), and described components and parts extractor (10) is picked up this chip electronic component (3) and this chip electronic component (3) is placed on the pre-position of wiring board (13);
5), this chip electronic component (3) is welded with wiring board (13).
14. using method according to claim 13; it is characterized in that: described chip electronic component (3) is welded on after on wiring board (13); described base band (4) and boundary belt (5) cover the outside face of chip electronic component (3) simultaneously, at the upper formation one components and parts protective film of wiring board (13).
15. using method according to claim 13; it is characterized in that: described chip electronic component (3) is welded on after on wiring board (13); described base band (4) and boundary belt (5) all depart from from the surface of chip electronic component (3), or described base band (4) and boundary belt (5) all volatilize under the effect of welding heat.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310330406.1A CN104340516A (en) | 2013-07-31 | 2013-07-31 | Surface-mounted electronic device package structure and manufacturing and application methods thereof |
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| CN201310330406.1A CN104340516A (en) | 2013-07-31 | 2013-07-31 | Surface-mounted electronic device package structure and manufacturing and application methods thereof |
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| CN105470749A (en) * | 2015-12-18 | 2016-04-06 | 深圳创维－Rgb电子有限公司 | Connector combination strip and welding method for welding equipment |
| WO2017193424A1 (en) * | 2016-05-09 | 2017-11-16 | 宋延伟 | Spool package for double spiral binding |
| CN108882666A (en) * | 2018-07-17 | 2018-11-23 | 珠海格力电器股份有限公司 | The fixed structure and its method of electromagnetic induction component |
| CN109841430A (en) * | 2019-03-22 | 2019-06-04 | 杭州灵通电子有限公司 | A kind of termination device and closed-end technology for large scale multilayer ceramic capacitor |
| CN110436048A (en) * | 2018-08-21 | 2019-11-12 | 青岛海威物联科技有限公司 | Electronic tag assembly, electronic tag packing device and its application method |
| CN110577098A (en) * | 2018-06-11 | 2019-12-17 | 株式会社村田制作所 | Braiding reel, method for manufacturing coil component, and electronic component |
| CN114030669A (en) * | 2021-12-08 | 2022-02-11 | 盐城海和电子有限公司 | Efficient and reliable electronic component bulk packaging method |
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| CN114030669A (en) * | 2021-12-08 | 2022-02-11 | 盐城海和电子有限公司 | Efficient and reliable electronic component bulk packaging method |
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Application publication date: 20150211 |