CN207966943U - A kind of chip SMT location trays - Google Patents
A kind of chip SMT location trays Download PDFInfo
- Publication number
- CN207966943U CN207966943U CN201820054217.4U CN201820054217U CN207966943U CN 207966943 U CN207966943 U CN 207966943U CN 201820054217 U CN201820054217 U CN 201820054217U CN 207966943 U CN207966943 U CN 207966943U
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- big plate
- chip
- positioning region
- pallet
- big
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Abstract
The utility model discloses a kind of chip SMT location trays, the pallet includes the big plate with several chips, cut that the big plate makes single or multiple chips can be detached with big plate, it is characterized in that, several described chip arranged in sequence are on big plate, it is provided with the first positioning region on the big plate, the second positioning region and several grooves are provided on the pallet, first positioning region carries out location fit with the second positioning region, one layer of not residue glue PE film is attached in the one side of the big plate after dicing, second positioning region of first positioning region of the big plate and the pallet is coordinated；Said chip surface mount prelocalization load mode can conveniently load integrated chip, improve production efficiency, one contraposition of chip for relatively large deviation occur is swung in pallet without Manufacturing Worker.
Description
Technical field
The utility model is related to a kind of chip SMT location trays.
Background technology
Currently, the pallet of the existing board surface sticked integrated chip of integrated circuit is by anti-static material injection molding, root
According to chip mounter accuracy, determines that tray loading region extends out size with respect to integrated chip, during surface mount, pass through patch
Machine CCD camera systems are accurately positioned integrated chip bottom land, then by transmission system on chip mounter to integrated chip
Deviation problem carries out the adjustment of part when reprinting pallet, realizes accurate attachment.But due in technology and cost,
Transmission system on many chip mounters still cannot achieve adjusts integrated chip for 360 ° at any angle, this results in chip mounter
The big chip None- identified of tray position deviation is packed into for integrated chip and continues operation, needs Manufacturing Worker that will occur larger
One contraposition of chip of deviation swings in pallet, and above-mentioned behavior causes great difficulty to production process, leads to low production efficiency,
And there is surface mount and be easy the problems such as patch is inclined.
Utility model content
To overcome drawbacks described above, the utility model discloses a kind of chip SMT location trays, which includes with several
The big plate of a chip, cuts that the big plate makes single or multiple chips can be detached with big plate, which is characterized in that several
The chip arranged in sequence is provided with the first positioning region, the second positioning is provided on the pallet on big plate on the big plate
Portion and several grooves, first positioning region carry out location fit with the second positioning region, and the one of the big plate after dicing
One layer of not residue glue PE film is attached on face, by first positioning region of the big plate and second positioning region of the pallet into
Row cooperation so that the chip on the big plate is corresponding with the groove on the pallet, tears the PE films off so that
The chip each cut is detached with big plate and is fallen into corresponding groove, is all fallen in single cut or multiple chips
After entering groove.
Further the PE films are low viscosity.
Further first positioning region is location hole, and the second positioning region is positioning column.
A kind of chip SMT location trays and its application method of the utility model, have following advantageous effect：
By attaching not residue glue PE films in big plate one side after dicing so that the big plate keeps integrality, passes through
First positioning region is set on big plate and the second positioning region is set on pallet so that location fit may be implemented in the two, with true
It is corresponding with the groove of pallet to protect chip, so that it is guaranteed that it is corresponding with the chip that big plate detaches can to fall into pallet when tearing PE films off
Groove in, said chip surface mount prelocalization load mode can conveniently load integrated chip, improve production effect
One contraposition of chip for relatively large deviation occur is swung in pallet by rate without Manufacturing Worker.
Description of the drawings
Fig. 1 is the pad face front view of the big plate of the utility model.
Fig. 2 is another view of Fig. 1
Fig. 3 is the pallet schematic diagram of the utility model.
Reference numeral in figure, 1（4）First positioning region；2（5）Big plate；3 chips；6 not residue glue PE films；7 be the second positioning region；
8 be pallet；9 grooves.
Specific implementation mode
In order to make those skilled in the art more fully understand the technical solution of the utility model, with reference to embodiment and
Attached drawing is described in further detail the utility model product.
A kind of chip SMT location trays, SMT（The abbreviation of Surface Mount Technology）It is surface installation technique
（Surface mounting technology）, referred to as surface mount or surface mounting technique.It is most popular a kind of skill in current electronic assembly industry
Art and technique.
The pallet includes the big plate with several chips, several described chip arranged in sequence on big plate, such as
Identical spacing is installed to be arranged on big plate, cutting the big plate in a manner of being cut by laser using laser cutting device makes single
Or multiple chips can be detached with big board chip parent, after obtaining the required chip shape of consumer, not have to remove list at this time
Or multiple chips, that is, cut that the big plate makes single or multiple chips can be detached with big plate.
It is provided with the first positioning region on the big plate, the second positioning region and several grooves, institute are provided on the pallet
Big plate and pallet location fit, the tool of the first positioning region and the second positioning region can be made by stating the first positioning region and the second positioning region
Shape can be configured according to actual conditions, be set to location hole and positioning column, but above-mentioned setting in figs 1-3
The only preferred embodiment of the utility model, does not impose any limitation on the present invention.
In the one side of big plate（Non- pad face）Attach one layer of not residue glue PE film, it is ensured that the entire big plate one side of PE films covering with
The integrality for keeping big plate can be effectively prevented chip by grey dustiness in process of production as a result of not residue glue PE films
Dye and scuffing, and original bright and clean glossy surface is protected, to improve the quality of chip, and will when tearing the PE films off
Do not stay residue glue, preferably low viscosity not residue glue PE films.
Second positioning region of first positioning region of the big plate and the pallet is coordinated so that described
The chip on big plate is corresponding with the groove on the pallet, tears the PE films off so that the core each cut
Piece is all detached with big plate and is fallen into corresponding groove, after single cut or multiple chips entirely fall in groove, is taken away
After the big plate, pallet can be packed into chip mounter to carry out the surface mount operation of circuit board.
A kind of application method of chip SMT location trays, which is characterized in that the pallet includes big with several chips
Plate, several described chip arranged in sequence are provided with the first positioning region, are provided on the pallet on big plate on the big plate
Second positioning region and several grooves, first positioning region carry out location fit with the second positioning region；
The method is further comprising the steps of：
Step 1, the big plate is cut, so that single or multiple chips can be detached with the big plate, is not removed at this time
State separable chip；
Step 2, one layer of not residue glue PE film is attached in the one side of the big plate, it is ensured that the entire big plate one side of PE films covering with
Keep the integrality of big plate；
Step 3, the first positioning region of the big plate and the second positioning region of the pallet are subjected to location fit, coordinated
Cheng Hou, the chip on big plate will be corresponded with the groove on pallet；
Step 4, the PE films are torn off so that single each cut or multiple chips entirely fall in pair of the pallet
It answers in groove.
After through the above steps so that the neat designated position for falling into pallet of single chip（Groove）On, take away big plate
Remaining defective material in addition to cut portion, you can to load onto the surface mount operation that patch board carries out circuit board.
A kind of chip SMT location trays and its application method of the utility model, have following advantageous effect：
By attaching not residue glue PE films in big plate one side after dicing so that the big plate keeps integrality, passes through
First positioning region is set on big plate and the second positioning region is set on pallet so that location fit may be implemented in the two, with true
It is corresponding with the groove of pallet to protect chip, so that it is guaranteed that it is corresponding with the chip that big plate detaches can to fall into pallet when tearing PE films off
Groove in, said chip surface mount prelocalization load mode can conveniently load integrated chip, improve production effect
One contraposition of chip for relatively large deviation occur is swung in pallet by rate without Manufacturing Worker.
The above, the only preferred embodiment of the utility model not make in any form the utility model
Limitation；The those of ordinary skill of all industry can be shown in by specification attached drawing and described above and swimmingly implement this practicality
It is novel；But all those skilled in the art are not departing within the scope of technical solutions of the utility model, using the above institute
The technology contents of announcement and the equivalent variations of a little variation, modification and evolution made, are the equivalence enforcement of the utility model
Example；Meanwhile all substantial technologicals according to the utility model to the changes of any equivalent variations made by above example, modification with
Develop etc., still fall within the protection domain of the technical solution of the utility model.
Claims (3)
1. a kind of chip SMT location trays, which includes the big plate with several chips, cuts the big plate and makes single
Or multiple chips can be detached with big plate, which is characterized in that several described chip arranged in sequence are set on big plate on the big plate
It is equipped with the first positioning region, the second positioning region and several grooves are provided on the pallet, first positioning region is fixed with second
Position portion carries out location fit, one layer of not residue glue PE film is attached in the one side of the big plate after dicing, by the institute of the big plate
Second positioning region for stating the first positioning region and the pallet is coordinated so that the chip on the big plate with it is described
The groove on pallet is corresponding, tears the PE films off so that the chip each cut detaches with big plate and falls into phase
In the groove answered, after single cut or multiple chips entirely fall in groove.
2. a kind of chip SMT location trays according to claim 1, it is characterised in that：The PE films are low viscosity.
3. a kind of chip SMT location trays according to claim 2, it is characterised in that：First positioning region is positioning
Hole, the second positioning region are positioning column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820054217.4U CN207966943U (en) | 2018-01-13 | 2018-01-13 | A kind of chip SMT location trays |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820054217.4U CN207966943U (en) | 2018-01-13 | 2018-01-13 | A kind of chip SMT location trays |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207966943U true CN207966943U (en) | 2018-10-12 |
Family
ID=63732891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820054217.4U Active CN207966943U (en) | 2018-01-13 | 2018-01-13 | A kind of chip SMT location trays |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207966943U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108198775A (en) * | 2018-01-13 | 2018-06-22 | 蚌埠华特科技有限公司 | A kind of chip SMT location trays and its application method |
| CN111331677A (en) * | 2020-03-30 | 2020-06-26 | 镇江锆源传感科技有限公司 | Blanking and filling method of cast membrane |
| CN112739003A (en) * | 2020-11-09 | 2021-04-30 | 昆山丘钛光电科技有限公司 | Method and device for dividing FPC (Flexible printed Circuit) connecting board |
-
2018
- 2018-01-13 CN CN201820054217.4U patent/CN207966943U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108198775A (en) * | 2018-01-13 | 2018-06-22 | 蚌埠华特科技有限公司 | A kind of chip SMT location trays and its application method |
| CN111331677A (en) * | 2020-03-30 | 2020-06-26 | 镇江锆源传感科技有限公司 | Blanking and filling method of cast membrane |
| CN112739003A (en) * | 2020-11-09 | 2021-04-30 | 昆山丘钛光电科技有限公司 | Method and device for dividing FPC (Flexible printed Circuit) connecting board |
| CN112739003B (en) * | 2020-11-09 | 2022-04-26 | 昆山丘钛光电科技有限公司 | Method and device for dividing FPC (Flexible printed Circuit) connecting board |
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