CN108198775A - A kind of chip SMT location trays and its application method - Google Patents
A kind of chip SMT location trays and its application method Download PDFInfo
- Publication number
- CN108198775A CN108198775A CN201810032770.2A CN201810032770A CN108198775A CN 108198775 A CN108198775 A CN 108198775A CN 201810032770 A CN201810032770 A CN 201810032770A CN 108198775 A CN108198775 A CN 108198775A
- Authority
- CN
- China
- Prior art keywords
- big plate
- positioning region
- chip
- pallet
- big
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 17
- 239000003292 glue Substances 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Abstract
The invention discloses a kind of chip SMT location trays, the pallet includes the big plate with several chips, the big plate is cut so that single or multiple chips can be detached with big plate, it is characterized in that, several described chip arranged in sequence are on big plate, the first positioning region is provided on the big plate, the second positioning region and several grooves are provided on the pallet, first positioning region carries out location fit with the second positioning region, one layer of not residue glue PE film is attached in the one side of the big plate after dicing, second positioning region of first positioning region of the big plate and the pallet is coordinated；Said chip surface mount prelocalization load mode can conveniently load integrated chip, improve production efficiency, one contraposition of chip for relatively large deviation occur is swung in pallet without Manufacturing Worker.
Description
Technical field
The present invention relates to a kind of chip SMT location trays and its application methods.
Background technology
At present, the pallet of the board surface sticked integrated chip of existing integrated circuit is by anti-static material injection molding, root
According to chip mounter accuracy, determine that tray loading region extends out size with respect to integrated chip, during surface mount, pass through patch
Machine CCD camera systems are accurately positioned integrated chip bottom land, then by transmission system on chip mounter to integrated chip
Deviation problem carries out the adjustment of part when reprinting pallet, realizes accurate attachment.But due in technology and cost,
Transmission system on many chip mounters still can not be realized adjusts integrated chip for 360 ° at any angle, this results in chip mounter
The big chip None- identified of tray position deviation is packed into for integrated chip and continues operation, needs Manufacturing Worker that will occur larger
One contraposition of chip of deviation swings in pallet, and above-mentioned behavior causes great difficulty to production process, leads to low production efficiency,
And there is surface mount and easily paste the problems such as inclined.
Invention content
To overcome drawbacks described above, the invention discloses a kind of chip SMT location trays, which includes having several cores
The big plate of piece, cuts that the big plate causes single or multiple chips can be detached with big plate, which is characterized in that described in several
Chip arranged in sequence is provided with the first positioning region on big plate on the big plate, be provided on the pallet the second positioning region and
Several grooves, first positioning region and the second positioning region carry out location fit, in the one side of the big plate after dicing
One layer of not residue glue PE film is attached, second positioning region of first positioning region of the big plate and the pallet is matched
It closes so that the chip on the big plate is corresponding with the groove on the pallet, tears the PE films off so that each
Cut chip is all detached with big plate and is fallen into corresponding groove, is entirely fallen in single be cut or multiple chips recessed
After slot.
Further the PE films are low viscosity.
Further first positioning region is location hole, and the second positioning region is positioning column.
A kind of application method of chip SMT location trays, which is characterized in that the pallet includes big with several chips
Plate, several described chip arranged in sequence are provided with the first positioning region, are provided on the pallet on big plate on the big plate
Second positioning region and several grooves, first positioning region carry out location fit with the second positioning region；
The method is further comprising the steps of：
Step 1, the big plate is cut, so that single or multiple chips can be detached with the big plate；
Step 2, one layer of not residue glue PE film is attached in the one side of the big plate；
Step 3, the first positioning region of the big plate and the second positioning region of the pallet are subjected to location fit；
Step 4, the PE films are torn off so that each cut single or multiple chips entirely fall in the pallet correspondence it is recessed
In slot.
Further the PE films are low viscosity.
Further first positioning region is location hole, and the second positioning region is positioning column.
A kind of chip SMT location trays and its application method of the present invention has following advantageous effect：
By attaching not residue glue PE films in big plate one side after dicing so that the big plate keeps integrality, by big
First positioning region on plate is set and the second positioning region is set on pallet so that the two can realize location fit, to ensure core
Piece is corresponding with the groove of pallet, so that it is guaranteed that it is corresponding recessed with the chip that big plate detaches can to fall into pallet when tearing PE films off
In slot, said chip surface mount prelocalization load mode can conveniently load integrated chip, improve production efficiency, nothing
Need Manufacturing Worker that one contraposition of chip for relatively large deviation occur is swung in pallet.
Description of the drawings
Fig. 1 is the pad face front view of the big plate of the present invention.
Fig. 2 is another view of Fig. 1
Fig. 3 is the pallet schematic diagram of the present invention.
Reference numeral in figure, 1（4）First positioning region；2（5）Big plate；3 chips；6 not residue glue PE films；7 be the second positioning region；
8 be pallet；9 grooves.
Specific embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to embodiment and attached drawing
Product of the present invention is described in further detail.
A kind of chip SMT location trays, SMT（The abbreviation of Surface Mount Technology）It is surface installation technique
（Surface mounting technology）, referred to as surface mount or surface mounting technique.It is most popular a kind of skill in current electronic assembly industry
Art and technique.
The pallet include with several chips big plate, several described chip arranged in sequence on big plate, such as
Identical spacing is installed to be arranged on big plate, cutting the big plate in a manner of being cut by laser using laser cutting device causes single
Or multiple chips can be detached with big board chip parent, after obtaining the required chip shape of consumer, not have to remove list at this time
Or multiple chips, that is, cut the big plate so that single or multiple chips can be detached with big plate.
The first positioning region is provided on the big plate, the second positioning region and several grooves, institute are provided on the pallet
The tool of big plate and pallet location fit, the first positioning region and the second positioning region can be caused by stating the first positioning region and the second positioning region
Shape can be configured according to actual conditions, be set to location hole and positioning column, but above-mentioned setting in figs 1-3
Only presently preferred embodiments of the present invention not makees the present invention limitation in any form.
In the one side of big plate（Non- pad face）Attach one layer of not residue glue PE film, it is ensured that the entire big plate one side of PE films covering with
The integrality of big plate is kept, as a result of not residue glue PE films, chip can be effectively prevented in process of production by grey dustiness
Dye and scuffing, and original bright and clean glossy surface is protected, so as to improve the quality of chip, and will when the PE films are torn off
Do not stay residue glue, preferably low viscosity not residue glue PE films.
Second positioning region of first positioning region of the big plate and the pallet is coordinated so that described
The chip on big plate is corresponding with the groove on the pallet, tears the PE films off so that each cut core
Piece is all detached with big plate and is fallen into corresponding groove, after single be cut or multiple chips entirely fall in groove, is taken away
After the big plate, pallet can be packed into chip mounter to carry out the surface mount operation of circuit board.
A kind of application method of chip SMT location trays, which is characterized in that the pallet includes big with several chips
Plate, several described chip arranged in sequence are provided with the first positioning region, are provided on the pallet on big plate on the big plate
Second positioning region and several grooves, first positioning region carry out location fit with the second positioning region；
The method is further comprising the steps of：
Step 1, cut the big plate so that single or multiple chips can be detached with the big plate, do not remove at this time it is above-mentioned can
Separating chips；
Step 2, one layer of not residue glue PE film is attached in the one side of the big plate, it is ensured that PE films cover entire big plate one side to keep
The integrality of big plate；
Step 3, the first positioning region of the big plate and the second positioning region of the pallet are subjected to location fit, cooperation is completed
Afterwards, the chip on big plate will be corresponded with the groove on pallet；
Step 4, the PE films are torn off so that each cut single or multiple chips entirely fall in the pallet correspondence it is recessed
In slot.
After above-mentioned steps so that the neat designated position for falling into pallet of single chip（Groove）On, take away big plate
Remaining defective material in addition to cut portion, you can to load onto the surface mount operation that patch board carries out circuit board.
A kind of chip SMT location trays and its application method of the present invention has following advantageous effect：
By attaching not residue glue PE films in big plate one side after dicing so that the big plate keeps integrality, by big
First positioning region on plate is set and the second positioning region is set on pallet so that the two can realize location fit, to ensure core
Piece is corresponding with the groove of pallet, so that it is guaranteed that it is corresponding recessed with the chip that big plate detaches can to fall into pallet when tearing PE films off
In slot, said chip surface mount prelocalization load mode can conveniently load integrated chip, improve production efficiency, nothing
Need Manufacturing Worker that one contraposition of chip for relatively large deviation occur is swung in pallet.
The foregoing is only a preferred embodiment of the present invention, not makees limitation in any form to the present invention；It is all
The those of ordinary skill of the industry can be shown in by specification attached drawing and described above and swimmingly implement the present invention；It is but all
Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents
The equivalent variations of a little variation, modification and evolution made are the equivalent embodiment of the present invention；Meanwhile it is all according to the present invention
The variation, modification and evolution of any equivalent variations made to above example of substantial technological etc., still fall within the present invention's
Within the protection domain of technical solution.
Claims (6)
1. a kind of chip SMT location trays, which includes the big plate with several chips, cuts the big plate and causes
Single or multiple chips can be detached with big plate, which is characterized in that several described chip arranged in sequence are on big plate, the big plate
On be provided with the first positioning region, be provided with the second positioning region and several grooves on the pallet, first positioning region and the
Two positioning regions carry out location fit, one layer of not residue glue PE film are attached in the one side of the big plate after dicing, by the big plate
First positioning region and second positioning region of the pallet coordinated so that the chip on the big plate with
The groove on the pallet is corresponding, tears the PE films off so that each cut chip is detached and fallen with big plate
Enter in corresponding groove, after single be cut or multiple chips entirely fall in groove.
2. a kind of chip SMT location trays according to claim 1, it is characterised in that：The PE films are low viscosity.
3. a kind of chip SMT location trays according to claim 2, it is characterised in that：First positioning region is positioning
Hole, the second positioning region are positioning column.
4. a kind of application method of chip SMT location trays, which is characterized in that the pallet includes big with several chips
Plate, several described chip arranged in sequence are provided with the first positioning region, are provided on the pallet on big plate on the big plate
Second positioning region and several grooves, first positioning region carry out location fit with the second positioning region；
The method is further comprising the steps of：
Step 1, the big plate is cut, so that single or multiple chips can be detached with the big plate；
Step 2, one layer of not residue glue PE film is attached in the one side of the big plate；
Step 3, the first positioning region of the big plate and the second positioning region of the pallet are subjected to location fit；
Step 4, the PE films are torn off so that cut single or multiple chips entirely fall in the respective slot of the pallet
It is interior.
5. according to the method described in claim 4, it is characterized in that：The PE films are low viscosity.
6. according to the method described in claim 5, it is characterized in that：First positioning region is location hole, and the second positioning region is
Positioning column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810032770.2A CN108198775A (en) | 2018-01-13 | 2018-01-13 | A kind of chip SMT location trays and its application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810032770.2A CN108198775A (en) | 2018-01-13 | 2018-01-13 | A kind of chip SMT location trays and its application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108198775A true CN108198775A (en) | 2018-06-22 |
Family
ID=62589048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810032770.2A Pending CN108198775A (en) | 2018-01-13 | 2018-01-13 | A kind of chip SMT location trays and its application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108198775A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400779A (en) * | 2013-07-09 | 2013-11-20 | 程君 | Manufacturing method of semiconductor display panel |
| CN203984791U (en) * | 2014-07-24 | 2014-12-03 | 上海埃富匹西电子有限公司 | A kind of instrument of locating fast in the time that SMT assembles for FPC |
| CN104378926A (en) * | 2013-08-12 | 2015-02-25 | 上海斐讯数据通信技术有限公司 | PoP chip integrating jig and application method thereof |
| JP2015076411A (en) * | 2013-10-04 | 2015-04-20 | 株式会社日立ハイテクインスツルメンツ | Die bonder |
| CN207966943U (en) * | 2018-01-13 | 2018-10-12 | 蚌埠华特科技有限公司 | A kind of chip SMT location trays |
-
2018
- 2018-01-13 CN CN201810032770.2A patent/CN108198775A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400779A (en) * | 2013-07-09 | 2013-11-20 | 程君 | Manufacturing method of semiconductor display panel |
| CN104378926A (en) * | 2013-08-12 | 2015-02-25 | 上海斐讯数据通信技术有限公司 | PoP chip integrating jig and application method thereof |
| JP2015076411A (en) * | 2013-10-04 | 2015-04-20 | 株式会社日立ハイテクインスツルメンツ | Die bonder |
| CN203984791U (en) * | 2014-07-24 | 2014-12-03 | 上海埃富匹西电子有限公司 | A kind of instrument of locating fast in the time that SMT assembles for FPC |
| CN207966943U (en) * | 2018-01-13 | 2018-10-12 | 蚌埠华特科技有限公司 | A kind of chip SMT location trays |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180622 |
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| WD01 | Invention patent application deemed withdrawn after publication |