CN207269277U - Electronic part packaging, which is cut, peels off heat-sealing cover band - Google Patents
Electronic part packaging, which is cut, peels off heat-sealing cover band Download PDFInfo
- Publication number
- CN207269277U CN207269277U CN201721264543.XU CN201721264543U CN207269277U CN 207269277 U CN207269277 U CN 207269277U CN 201721264543 U CN201721264543 U CN 201721264543U CN 207269277 U CN207269277 U CN 207269277U
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- China
- Prior art keywords
- heat
- sealing cover
- cut
- electronic part
- layer
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Abstract
Cut the utility model discloses a kind of electronic part packaging and peel off heat-sealing cover band, including basic unit, portion is being glued to paste the patch being sticked to when prolonging on carrier band two by the basic unit two, the basic unit includes antistatic process material layer, hot melt adhesive layer and the superficial layer being laminated from bottom to top, and also respectively perforation is provided with a slight crack with pasting viscous portion interval on two sides on an at least surface for the hot melt adhesive layer.The utility model has the advantages that carrier tape/cover tape stablizes the component being avoided that in carrier band in stripping process and follows stripping and shake.
Description
Technical field
Automation patch processing is the utility model is related to, carrier tape/cover tape is stablized in stripping process more particularly, to one kind
The component being avoided that in carrier band follows the electronic part packaging peeled off and shaken to cut and peels off heat-sealing cover band.
Background technology
When circuit board chip mounter is with (loader) offer component is flown up to, it usually needs preserve and convey component.Example
Such as, electronic component need to usually be transported to the specific location on circuit board, and to be connected thereto, these components are normal in production
It is often different polytypes, including surface mounting assembly, such as storage chip, IC chip, resistor, connector, place
Manage device, capacitor, gate array etc..Requirement can be finer and accurately from carrier band/lid again when just encapsulating component with carrier tape/cover tape
Band transfers component in place.Most known covering band will using heat-activatable adhesive (HAA) or contact adhesive (PSA)
Cover strip is adhered on carrier band.In feed, the component in carrier band is exposed in peel-off covers band first, and uses vacuum slot
Or other handling articles are carried.But can there are problems that in operation；Such as the plastics of packaging carrier band are common at present
Material includes following：Polyolefin (HDPE, PP), Polystyrenes (PS, IMPS, ABS), Polyvinyl chorides
(PVC), Polyesters (PET, APET, PETG), Polycarbonates (PC), these materials have not relatively because material is different
Same physical characteristic, including toughness, impact resistance, intensity, light transmittance and dimensional stability etc..With made of any type material
Strap necessarily respectively with the presence of its advantage and disadvantage, the carrier band of unlike material under uniform machinery during peel-off covers band because of peeling force the problem of
There may be the problem of uneven and inconsistent stripping, this can cause moving left and right for carrier tape/cover tape, and make first device in carrier band
Part follows vibrations, and impact movement can be such that component is ejected from carrier band when serious, so as to cause mechanical disorder and final plant closure
Equipment.
Utility model content
The shortcomings that to overcome the prior art, the utility model aim is in offer one kind carrier tape/cover tape in stripping process
Stablizing the component being avoided that in carrier band follows the electronic part packaging peeled off and shaken to cut stripping heat-sealing cover band.
The utility model realizes that a kind of electronic part packaging cuts stripping heat-sealing cover by following technical measures
Portion is being glued to paste the patch being sticked to when prolonging on carrier band two by band, including basic unit, the basic unit two, and the basic unit includes being laminated from bottom to top
Antistatic process material layer, hot melt adhesive layer and superficial layer, also respectively perforation is set for two sides on an at least surface for the hot melt adhesive layer
It is equipped with a slight crack with pasting viscous portion interval.
As a kind of preferred embodiment, respectively perforation is provided with one and patch respectively on two sides of the upper and lower surface of the hot melt adhesive layer
The slight crack at viscous portion interval.
As a kind of preferred embodiment, the residual thickness of the hot melt adhesive layer at the slight crack is 10-15uf.
As a kind of preferred embodiment, basic unit's peel force at the slight crack is not more than 10 grams.
As a kind of preferred embodiment, the superficial layer is PC layers, PS layers, pet layer, abs layer or layer of PVC.
As a kind of preferred embodiment, the slight crack is continuous lines or dashed line.
On two side of an at least surface of hot melt adhesive layer, respectively perforation is provided with one with pasting splitting for viscous portion interval to the utility model
Trace, when in use, basic unit two while the viscous portion's patch of patch be sticked to prolong on the two of carrier band while on, the heat-sensitive glue viscosity in the viscous portion of both sides patch is up to
More than 80 grams, it is mutually melted into securely on the carrier band that each material of PC, PS, PET, ABS or PVC are processed, working
When mechanism for stripping separation is torn into by two slight cracks by the basic unit at middle part, so as to without consider carry material in the case of carry
For stable peeling force, the deep processing of slight crack is makes its peeling force maintain within 10 grams, so as to apply in any material
The lower energy postpartum uniform peeling force of carrier band so that carrier tape/cover tape is stablized in stripping process, and the member being avoided that in carrier band
Device follows stripping and shakes.
Brief description of the drawings
Fig. 1 is the cross section view of the utility model embodiment.
Structure diagram when Fig. 2 is the application that the utility model plays embodiment.
Embodiment
With reference to embodiment and compare attached drawing the utility model is described in further detail.
A kind of electronic part packaging, which is cut, peels off heat-sealing cover band, referring to figs. 1 to Fig. 2, including basic unit 100, the base
Layer 100 2 while be sticked to for patch prolong on carrier band 200 2 while 201 patch glue portion 101, the basic unit 100 including being laminated from bottom to top
10 layers of antistatic process material layer 30, hot melt adhesive layer 20 and surface, two sides on an at least surface for the hot melt adhesive layer 20 are also each
Perforation is provided with a slight crack 21 being spaced with pasting viscous portion 101.
On two side of an at least surface of hot melt adhesive layer, respectively perforation is provided with one with pasting splitting for viscous portion interval to this heat-sealing cover band
Trace, when in use, basic unit 100 2 while the viscous portion 101 of patch paste prolong on be sticked to carrier band 200 two while 201 on, the viscous portion 101 of both sides patch
Heat-sensitive glue viscosity be up to more than 80 grams, it is mutually melted into each material of PC, PS, PET, ABS or PVC securely and processed
Carrier band on, without reproduction to coordinate more money heat-sealing cover bands of different materials, mechanism for stripping is by the basic unit at middle part at work
Separation is torn by two slight cracks 21, so as to provide stable peeling force in the case of without considering to carry 200 materials, is split
The deep processing of trace 21 is makes its peeling force maintain within 10 grams, so as to apply the energy postpartum under the carrier band of any material uniform
Consistent peeling force so that carrier tape/cover tape is stablized in stripping process, and the component being avoided that in carrier band follows stripping and shakes
It is dynamic.
The embodiment for peeling off heat-sealing cover band is cut in an electronic part packaging, attached drawing 1 and Fig. 2 are refer to, above
On the basis of technical solution specifically it is also possible that hot melt adhesive layer 20 upper and lower surface two sides respectively respectively perforation be provided with one with
The slight crack at the viscous portion interval of patch.
The embodiment for peeling off heat-sealing cover band is cut in an electronic part packaging, attached drawing 1 and Fig. 2 are refer to, above
Specifically it is also possible that the residual thickness of the hot melt adhesive layer 20 at slight crack 21 is 10-15uf on the basis of technical solution.
The embodiment for peeling off heat-sealing cover band is cut in an electronic part packaging, attached drawing 1 and Fig. 2 are refer to, above
Specifically it is also possible that superficial layer 10 for PC layers, PS layers, pet layer, abs layer or layer of PVC on the basis of technical solution.
The embodiment for peeling off heat-sealing cover band is cut in an electronic part packaging, attached drawing 1 and Fig. 2 are refer to, above
Specifically it is also possible that slight crack 21 is continuous lines or dashed line on the basis of technical solution.
It is set forth, is used to help above is being cut to the utility model electronic part packaging and peeling off heat-sealing cover band
Understand the utility model, but the embodiment of the utility model and be not restricted to the described embodiments, it is any without departing from this practicality
Change, modification, replacement, combination, the simplification made under new principle, should be equivalent substitute mode, are included in this practicality
Within new protection domain.
Claims (6)
1. a kind of electronic part packaging, which is cut, peels off heat-sealing cover band, it is characterised in that：Including basic unit, two side of basic unit is
Patch, which is sticked to, prolongs the patch on side and glues portion on carrier band two, the basic unit includes antistatic process material layer, the hot melt adhesive being laminated from bottom to top
Layer and superficial layer, also respectively perforation is provided with one with pasting splitting for viscous portion interval on two sides on an at least surface for the hot melt adhesive layer
Trace.
2. electronic part packaging according to claim 1, which is cut, peels off heat-sealing cover band, it is characterised in that：The hot melt
Respectively perforation is provided with a slight crack with pasting viscous portion interval respectively on two sides of the upper and lower surface of glue-line.
3. electronic part packaging according to claim 1, which is cut, peels off heat-sealing cover band, it is characterised in that：The slight crack
The residual thickness of the hot melt adhesive layer at place is 10-15uf.
4. electronic part packaging according to claim 1, which is cut, peels off heat-sealing cover band, it is characterised in that：The slight crack
Basic unit's peel force at place is not more than 10 grams.
5. electronic part packaging according to claim 1, which is cut, peels off heat-sealing cover band, it is characterised in that：The surface
Layer is PC layers, PS layers, pet layer, abs layer or layer of PVC.
6. electronic part packaging according to claim 1, which is cut, peels off heat-sealing cover band, it is characterised in that：The slight crack
For continuous lines or dashed line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721264543.XU CN207269277U (en) | 2017-09-27 | 2017-09-27 | Electronic part packaging, which is cut, peels off heat-sealing cover band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721264543.XU CN207269277U (en) | 2017-09-27 | 2017-09-27 | Electronic part packaging, which is cut, peels off heat-sealing cover band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207269277U true CN207269277U (en) | 2018-04-24 |
Family
ID=61955072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721264543.XU Active CN207269277U (en) | 2017-09-27 | 2017-09-27 | Electronic part packaging, which is cut, peels off heat-sealing cover band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207269277U (en) |
-
2017
- 2017-09-27 CN CN201721264543.XU patent/CN207269277U/en active Active
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