JP2009193226A - Sheet with ic chip, label with ic chip, method for manufacturing sheet with ic chip, and method for manufacturing label with ic chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To adequately prevent an IC chip from being damaged by protecting the IC chip attached to a sheet with an IC chip or a label with an IC chip by a simple structure, and easily produce the sheet with the IC chip and the label with the IC chip. <P>SOLUTION: The sheet 10 with the IC chip in which the IC chip 2 is attached to a sheet base material 1 and the label R using the sheet with the IC chip include at least a covering layer 4 containing thermoplastic resin to cover at least the IC chips. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet with an IC chip in which an IC chip is mounted on a sheet substrate, a label with an IC chip using such a sheet with an IC chip, a method for producing a sheet with an IC chip, and a method for producing a label with an IC chip. In particular, the IC chip mounted on a sheet with an IC chip or a label with an IC chip is protected by a simple configuration, and the IC chip is damaged when a load or the like is applied to the sheet with an IC chip or a label with an IC chip. This is characterized in that it is possible to appropriately prevent such a situation and to easily manufacture such a sheet with an IC chip and a label with an IC chip.

  In recent years, there are various kinds of sheets with IC chips such as inlays and the like using the IC chips attached to the sheet base material and imparting various functions such as display function, management function, security function and the like. Widely used in the field.

  Here, as such a sheet | seat with an IC chip, as shown to FIG. 1 (A), (B), various information is given to the single side | surface of the sheet | seat base material 1 comprised with resin films, such as a polyethylene terephthalate. An IC chip-attached sheet 10 provided with an IC chip 2 for accumulation and an antenna circuit 3 is used.

  Further, as the label R with an IC chip using such a sheet 10 with an IC chip, for example, as shown in FIGS. 2A and 2B, an IC chip provided with an IC chip 2 and an antenna circuit 3 is provided. The surface sheet 11 is provided so as to cover the surface of the attached sheet 10, and the above-described sheet 10 with IC chip and the surface sheet 11 are detachably attached to the release sheet 13 via the adhesive layer 12. It is used.

  In recent years, IC chip sheets and IC chip labels are attached to books, loading pallets, luggage, etc. to manage library collections, loading pallets, airports, warehouses, etc. , It came to be used for the management of luggage in the logistics process.

  Here, when a sheet with an IC chip or a label with an IC chip is used for the above-described purposes, there is a problem in that the IC chip is damaged due to various loads applied to the mounted IC chip.

  Conventionally, in order to prevent damage to an IC chip mounted on a sheet with an IC chip or a label with an IC chip, as shown in Patent Document 1, the sheet with an IC chip is accommodated in a case. As shown in Patent Document 2 and Patent Document 2, a thickness adjusting sheet having an opening surrounding the IC chip is attached to the label base material to which the IC chip-attached sheet is attached, and the IC chip is covered. In this way, an impact-resistant member is attached.

However, in the above-described Patent Documents 1 and 2, a case that accommodates a sheet with an IC chip, a thickness adjustment sheet that surrounds the IC chip, and an impact-resistant member that covers the IC chip are required. However, the production is cumbersome and costly, and the overall volume becomes large and bulky. It is difficult to use it by attaching it to a book or a baggage, and there is a problem that the application is limited.
JP-A-2005-141376 JP 2007-57858 A

  An object of the present invention is to solve the above-described problems in a sheet with an IC chip in which an IC chip is mounted on a sheet base material, and a label with an IC chip using such a sheet with an IC chip. .

  That is, the present invention protects an IC chip mounted on a sheet with an IC chip as described above or a label with an IC chip with a simple configuration, and when a load or the like is applied to the sheet with an IC chip or a label with an IC chip. It is an object of the present invention to make it possible to appropriately prevent damage to an IC chip and to easily manufacture such a sheet with an IC chip and a label with an IC chip.

  In the sheet with an IC chip of the present invention, in order to solve the above-described problems, a thermoplastic resin is used so as to cover at least the IC chip in the sheet with the IC chip mounted on the sheet base material. A coating layer was provided.

  Here, as the thermoplastic resin used for the coating layer, for example, a polyolefin-based or polyamide-based hot melt resin can be used. In order to protect the IC chip more firmly, a polyamide-based hot melt resin is used. Is preferably used.

  Further, in providing a coating layer so as to cover the IC chip in this way, in order to prevent the coating layer from being easily detached from the sheet with the IC chip, various kinds of plasticizers and the like are added to the thermoplastic resin as described above. Additives can be added.

  In addition, when providing a coating layer using a thermoplastic resin so as to cover the IC chip as described above, in order to ensure that the IC chip is sufficiently protected by this coating layer, the coating on the portion coated with the IC chip is performed. The thickness of the layer is preferably 50 μm or more, more preferably 200 μm or more, and even more preferably 300 μm or more. In addition, if the thickness of the coating layer is too thick, it is bulky when used by being attached to books, luggage, etc., and the strength is greatly improved even if the thickness of the coating layer is increased beyond a certain thickness. Therefore, the thickness of the coating layer is preferably 2000 μm or less, more preferably 1000 μm or less, and even more preferably 500 μm or less.

  In addition, in the label with an IC chip of the present invention, in order to solve the above-described problems, the above-described sheet with an IC chip is used.

  Further, in the method for producing a sheet with an IC chip according to the present invention, a step of supplying a coating liquid using a thermoplastic resin having heat and fluidity so as to cover the IC chip mounted on the sheet substrate; A step of adjusting the thickness of the coating layer in the portion coated with the IC chip by pressing before the coating liquid is cured is performed.

  Further, in the method for producing a label with an IC chip according to the present invention, a step of releasably attaching a sheet base material on which the IC chip is mounted to the surface of the release sheet, and a thermoplastic resin that is heated and has fluidity are used. Supplying the applied coating solution so as to cover the IC chip mounted on the sheet substrate, and adjusting the thickness of the coating layer in the portion coated with the IC chip by pressing before the coating solution is cured And a step of removably attaching the surface sheet to the surface of the release sheet so as to cover the sheet substrate on which the IC chip is mounted.

  In the sheet with an IC chip and the label with an IC chip according to the present invention, since the coating layer using the thermoplastic resin is provided so as to cover at least the IC chip as described above, the IC chip is protected by the coating layer. Various loads are added when used for library management, loading pallet management, luggage management in airports, warehouses, logistics processes, etc. However, the IC chip is appropriately prevented from being damaged.

  Further, in the sheet with IC chip and the label with IC chip in the present invention, it is only necessary to provide a coating layer using a thermoplastic resin so as to cover at least the IC chip. There is no need to provide a housing case, a thickness adjustment sheet surrounding the IC chip, and an impact-resistant member that covers the IC chip, and a sheet with an IC chip and a label with an IC chip can be easily manufactured as described above. Thus, the manufacturing cost is greatly reduced, and continuous manufacturing is also possible.

  Furthermore, the overall volume does not increase as in the case of housing a sheet with an IC chip, a thickness adjusting sheet that surrounds the IC chip, and an impact-resistant member that covers the IC chip. It can also be used by sticking it to books or luggage, and can be used for various purposes.

  Hereinafter, a sheet with an IC chip, a label with an IC chip, and a manufacturing method thereof according to embodiments of the present invention will be specifically described with reference to the accompanying drawings. Note that the present invention is not particularly limited to those shown in the following embodiments, and can be implemented with appropriate modifications within a range not changing the gist thereof.

  In the sheet 10 with an IC chip in this embodiment, as shown in FIGS. 3A and 3B, various kinds of information are accumulated on one side of a sheet substrate 1 made of a resin film such as polyethylene terephthalate. The IC chip 2 and the antenna circuit 3 are provided, and the coating layer 4 using a thermoplastic resin is provided on the sheet base 1 so as to cover the IC chip 2.

  Here, in manufacturing the sheet 10 with an IC chip of this embodiment, as shown in FIG. 4, the IC chip 2 and the antenna circuit 3 are sequentially attached to the long continuous sheet substrate 1, The coating liquid 4a using a thermoplastic resin having fluidity is supplied from the coating liquid supply device 21 so as to cover the IC chip 2 mounted on the continuous sheet substrate 1.

  Then, before the coating liquid 4a supplied in this way is cured, the coating liquid 4a supplied by the pressing roller 22 is pressed to adjust the thickness of the coating layer 4 covering the IC chip 2, and the above IC A continuous sheet 10 with chips is manufactured.

  Then, the sheet 10 with the IC chip can be obtained by separating the continuous sheet 10 with the IC chip by cutting or the like at a position between the individual sheets 10 with the IC chip.

  Further, in the label R with an IC chip in this embodiment, as shown in FIGS. 5A and 5B, the IC chip 2 and the antenna circuit 3 are provided as described above and the IC chip 2 is covered. The surface sheet 11 is provided so as to cover the surface of the IC chip-attached sheet 10 provided with the coating layer 4 using the thermoplastic resin, and the above-mentioned IC chip-attached sheet 10 and the surface sheet 11 are bonded to the adhesive layer 12. It is attached to the release sheet 13 so as to be peeled off via. In addition, various displays such as characters and figures can be printed on the surface sheet 11 provided so as to cover the surface of the sheet 10 with IC chip.

  Here, in manufacturing the label R with an IC chip of this embodiment, as shown in FIG. 6, the sheet substrate 1 on which the IC chip 2 and the antenna circuit 3 are mounted is formed into a continuous continuous release sheet 13. It is made to stick to the surface of this so that it can peel in order through a required space | interval.

  Then, the thermoplastic resin having fluidity is heated from the coating liquid supply device 21 so as to cover the IC chip 2 mounted on each sheet base material 1 stuck on the surface of the continuous release sheet 13 in this way. Resin is supplied, and before the coating liquid 4a supplied in this way is cured, the coating liquid 4a supplied by the pressing roller 22 is pressed to adjust the thickness of the coating layer 4 that covers the IC chip 2.

  Next, the continuous surface sheet 11 is supplied onto the release sheet 13 so as to cover the IC chip-attached sheet 10 on which the coating layer 4 having a predetermined thickness is formed so as to cover the IC chip 2 in this way, After this surface sheet 11 is pressed by the elastic roller 24 so that it can be peeled off on the surface of the release sheet 13, the surface sheet 11 is cut into a predetermined size by a cutter device 23 such as a die roll, and each cut surface The sheet 11 covers the surface of the IC chip-attached sheet 10 and the periphery of the surface sheet 11 remains on the release sheet 13, and the unnecessary portion 11 a of the cut surface sheet is removed by the separation roller 25. 13 is peeled off from above 13, and the above-mentioned label R with IC chip is continuously manufactured.

  In the manufacturing process of the label R with the IC chip in the embodiment shown in FIG. 6, in forming the covering layer 4 that covers the IC chip 2, the sheet substrate 1 on which the IC chip 2 and the antenna circuit 3 are mounted is used. An IC mounted on each sheet substrate 1 attached to the surface of the continuous release sheet 13 in such a manner that it is attached to the surface of the continuous release sheet 13 in a releasable manner in order through a required interval. Although the coating liquid 4a is supplied to the chip 2 to form the coating layer 4 in-line, the method of forming the coating layer 4 that covers the IC chip 2 is not particularly limited to this.

  For example, as shown in FIG. 4 described above, the IC chip 2 with the IC chip 2 coated with the coating layer 4 having a predetermined thickness is separately manufactured in advance off-line in advance, and thus separated. It is also possible to attach the IC chip-attached sheet 10 to the surface of the long continuous release sheet 13 in a detachable manner in order through a required interval.

  Next, in the example in which the coating layer using the thermoplastic resin is provided so as to cover the IC chip provided on the sheet base as described above, the IC chip is not affected even when a load is applied. It will be clarified by giving a comparative example that damage is suppressed.

  In Example A, an IC chip was mounted on a sheet substrate made of a polyethylene terephthalate resin film having a thickness of 45 μm, and this IC chip was used with a polyolefin-based hot melt resin (Q5365 manufactured by Henkel Japan). The coating layer was coated, and the thickness of the coating layer in the portion coated with the IC chip was changed.

  In Example B, an IC chip was mounted on a sheet substrate made of a polyethylene terephthalate resin film having a thickness of 45 μm, and this IC chip was used with a polyamide-based hot melt resin (OM652 manufactured by Henkel Japan). The coating layer was coated, and the thickness of the coating layer in the portion coated with the IC chip was changed.

  In Comparative Example 1, only the IC chip was mounted on the sheet substrate made of a polyethylene terephthalate resin film having a thickness of 45 μm, and the coating layer was not provided.

  In Comparative Example 2, an IC chip is mounted on a sheet substrate made of a polyethylene terephthalate resin film having a thickness of 45 μm, and a synthetic paper made of foamed polypropylene having a thickness of 80 μm is stuck on the IC chip. did.

  A coating layer made of a polyolefin-based hot melt resin in Example A above has a thickness of 100 μm, 200 μm, and 300 μm on the IC chip, and a coating made of a polyamide-based hot melt resin in Example B above The thickness of the layer on the IC chip is 100 μm, 200 μm, and 300 μm, and those of Comparative Examples 1 and 2 above, and pressure is applied from above the IC chip using a press machine to damage the IC chip. Then, the load at the time when communication was disabled was obtained, and the result is shown in Table 1 below.

As a result, in Examples A and B in which the IC chip was coated with a coating layer using a polyolefin-based or polyamide-based hot melt resin, Comparative Example 1 in which the IC chip was not coated, or the IC chip Compared with the thing of the comparative example 2 which coat | covered with synthetic paper, the load from which an IC chip was damaged and communication became impossible became very high, and the intensity | strength with respect to a static load was improved significantly. In particular, in the case of Example B in which the IC chip is coated with a coating layer using a polyamide-based hot melt resin, even when the thickness of the coating layer in the portion coated with the IC chip is 100 μm, the load at which communication is impossible Is a high value exceeding 200 kg / cm ² , and the strength against static load was greatly improved even when the coating layer was thin.

  Next, the thickness of the coating layer made of the polyolefin-based hot melt resin in Example A above on the IC chip was set to 50 μm, 100 μm, 200 μm, and 300 μm, and the polyamide-based hot melt resin in Example B above A coating layer made of a material having a thickness of 50 μm, 100 μm, 200 μm, and 300 μm on the IC chip and those of Comparative Examples 1 and 2 were set on a polypropylene plate and each IC chip. A SUS board was set on top.

  Then, whether a cardboard having a weight of 2.4 kg, 6.5 kg, and 9.8 kg is dropped 50 times on the SUS plate from a position of 50 cm in height, respectively, and communication using an IC chip can be performed. The results are shown in Table 2 below, where ◯ indicates that communication is possible, and X indicates that communication is disabled.

  As a result, in the comparative example 1 in which the IC chip is not coated and in the comparative example 2 in which the IC chip is coated with synthetic paper, the corrugated board having a weight of 2.4 kg is dropped 50 times from the position of 50 cm in height. At that time, the IC chip was damaged and communication was not possible.

  On the other hand, in Examples A and B in which the IC chip was coated with a coating layer using a polyolefin-based or polyamide-based hot melt resin, the thickness of the coating layer on the IC chip was 50 μm. However, when a cardboard with a weight of 9.8 kg is dropped 50 times from a position with a height of 50 cm, the IC chip is not damaged and communication cannot be performed, and the strength against dynamic load is greatly improved. It was.

  In addition, the thickness of the coating layer made of the polyolefin-based hot melt resin in Example A above on the IC chip is 200 μm, 300 μm, 400 μm, and 500 μm, and the polyamide-based hot melt resin in Example B above. The thickness of the coating layer to be formed on the IC chip is 200 μm, 300 μm, 400 μm, and 500 μm, and an iron bar having a weight of 85.3 g is dropped twice on the IC chip. The impact energy (mJ) at which the IC chip was damaged and communication was disabled was determined for each change, and the results are shown in Table 3 below.

  As a result, in Example A in which the IC chip was coated with a coating layer using a polyolefin-based hot melt resin, the IC chip was damaged when the thickness of the coating layer on the IC chip was 400 μm. Whereas the impact energy at which communication is impossible has been greatly increased, in the case of Example B in which the IC chip is coated with a coating layer using a polyamide-based hot melt resin, the coating layer on the IC chip The impact energy at which the IC chip was damaged and communication became impossible was greatly increased at the time when the thickness of the substrate was 300 μm.

The sheet | seat with the conventional IC chip is shown, (A) is a schematic plan view, (B) is a schematic sectional drawing. The conventional label with an IC chip is shown, (A) is a schematic plan view, and (B) is a schematic sectional view. The sheet | seat with an IC chip in one Embodiment of this invention is shown, (A) is a schematic plan view, (B) is a schematic sectional drawing. It is the schematic explanatory drawing which showed the process of manufacturing the sheet | seat with an IC chip which concerns on said embodiment. The label with an IC chip in one embodiment of this invention is shown, (A) is a schematic plan view, and (B) is a schematic sectional view. It is the schematic explanatory drawing which showed the process of manufacturing the label with an IC chip which concerns on said embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet | seat base material 2 IC chip 3 Antenna circuit 4 Covering layer 4a Coating liquid 10 Sheet | seat with IC chip 11 Surface sheet 11a Unnecessary part of surface sheet 12 Adhesive layer 13 Release sheet 21 Coating liquid supply apparatus 22 Press roller 23 Cutter apparatus 24 Elasticity Roller 25 Separation roller R Label with IC chip

Claims (8)

  An IC chip-attached sheet in which an IC chip is mounted on a sheet base material, and a coating layer using a thermoplastic resin is provided so as to cover at least the IC chip.   2. The sheet with an IC chip according to claim 1, wherein the thermoplastic resin is a polyolefin-based or polyamide-based hot melt resin.   The sheet with an IC chip according to claim 1 or 2, wherein the thermoplastic resin is a polyamide-based hot-melt resin.   The sheet with an IC chip according to any one of claims 1 to 3, wherein the coating layer has a thickness of 50 µm or more in a portion coated with the IC chip.   5. The sheet with an IC chip according to claim 1, wherein the coating layer has a thickness of 200 μm or more and 1000 μm or less in a portion coated with the IC chip.   A label with an IC chip using the sheet with an IC chip according to any one of claims 1 to 5.   A step of supplying a coating liquid using a heated thermoplastic resin so as to cover the IC chip mounted on the sheet substrate, and pressing the IC chip before the coating liquid is cured. And a step of adjusting the thickness of the coating layer in the coated portion.   A step of pasting a sheet base material with an IC chip attached to the surface of the release sheet so as to be peelable, and a coating liquid using a thermoplastic resin that is heated and has fluidity to coat the IC chip attached to the sheet base material And the step of adjusting the thickness of the coating layer in the portion where the IC chip is coated by pressing before the coating liquid is cured, and the sheet substrate on which the IC chip is mounted is covered. And a step of removably attaching the surface sheet to the surface of the release sheet.

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