JP2002109496A - Contactless data carrier - Google Patents
Contactless data carrierInfo
- Publication number
- JP2002109496A JP2002109496A JP2000304937A JP2000304937A JP2002109496A JP 2002109496 A JP2002109496 A JP 2002109496A JP 2000304937 A JP2000304937 A JP 2000304937A JP 2000304937 A JP2000304937 A JP 2000304937A JP 2002109496 A JP2002109496 A JP 2002109496A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- layer
- sealing layer
- data carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 83
- 239000011347 resin Substances 0.000 claims abstract description 83
- 239000010410 layer Substances 0.000 claims abstract description 65
- 238000007789 sealing Methods 0.000 claims abstract description 39
- 239000011241 protective layer Substances 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 14
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 12
- 230000003014 reinforcing effect Effects 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 235000013599 spices Nutrition 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は樹脂基材とアンテナ
とＩＣチップとを有する非接触式データキャリアに係
り、とりわけ表面の平滑性を得ることができる非接触式
データキャリアに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact data carrier having a resin base material, an antenna and an IC chip, and more particularly to a non-contact data carrier capable of obtaining a smooth surface.
【０００２】[0002]
【従来の技術】従来より非接触式データキャリアが、物
流システム等において用いられている。このような非接
触式データキャリアは、例えば製品の包装箱あるいは製
品自体に貼付されて使用される。2. Description of the Related Art Conventionally, non-contact data carriers have been used in distribution systems and the like. Such a non-contact data carrier is used, for example, by being attached to a product packaging box or the product itself.
【０００３】非接触式データキャリアは、一般に樹脂基
材と、樹脂基材上に設けられた導電性アンテナコイル
と、アンテナコイルに接続されるバンプを有するＩＣチ
ップとを備えている。A non-contact data carrier generally includes a resin base material, a conductive antenna coil provided on the resin base material, and an IC chip having bumps connected to the antenna coil.
【０００４】非接触式データキャリアに対して読取機側
から電磁波が発せられると、アンテナコイルに誘導電圧
が発生し、ＩＣチップを作動させるようになっている。When an electromagnetic wave is emitted from a reader to a non-contact type data carrier, an induced voltage is generated in an antenna coil to operate an IC chip.
【０００５】[0005]
【発明が解決しようとする課題】非接触式データキャリ
アは、上述のように樹脂基材上に設けられた導電性アン
テナコイルと、このアンテナコイルに接続されるバンプ
を有するＩＣチップとを備えている。またＩＣチップの
保護強化を図るため、ＩＣチップを覆って樹脂封止層を
設けられ、さらに樹脂封止層上に保護層が設けられてい
る。A non-contact type data carrier includes a conductive antenna coil provided on a resin substrate as described above, and an IC chip having a bump connected to the antenna coil. I have. In order to enhance the protection of the IC chip, a resin sealing layer is provided so as to cover the IC chip, and a protective layer is provided on the resin sealing layer.
【０００６】樹脂封止層は、最終的に保護層を形成する
に至るまでの過程で衝撃や外気によってＩＣチップが破
損・故障するのを防止するために設けられ、保護層はア
ンテナコイルまで含め回路全面を保護する目的で最終的
に形成されるものである。[0006] The resin sealing layer is provided to prevent the IC chip from being damaged or broken by an impact or the outside air in the process up to finally forming the protective layer. The protective layer includes the antenna coil. It is finally formed for the purpose of protecting the entire circuit.
【０００７】しかしながらＩＣチップ上に樹脂封止層お
よび保護層を設けると、この保護層のＩＣチップに対応
する部分が上方へ盛り上がり、保護層外面の平滑性を保
つことができない。However, when the resin sealing layer and the protective layer are provided on the IC chip, the portion of the protective layer corresponding to the IC chip rises upward, and the outer surface of the protective layer cannot be kept smooth.
【０００８】本発明はこのような点を考慮してなされた
ものであり、ＩＣチップを効果的に保護することがで
き、かつ外面の平滑性を保つことができる非接触式デー
タキャリアを提供することを目的とする。The present invention has been made in view of the above points, and provides a non-contact data carrier capable of effectively protecting an IC chip and maintaining smoothness of an outer surface. The purpose is to:
【０００９】[0009]
【課題を解決するための手段】本発明は、樹脂基材と、
樹脂基材上の一側に設けられたアンテナと、アンテナに
接続されたＩＣチップと、を備え、ＩＣチップを覆って
樹脂封止層を設けるとともに、樹脂封止層上に樹脂中間
層を介して保護層を設け、樹脂中間層は樹脂封止層より
低い溶融点をもつことを特徴とする非接触式データキャ
リアである。The present invention provides a resin substrate,
An antenna provided on one side of the resin base material and an IC chip connected to the antenna are provided. A resin sealing layer is provided to cover the IC chip, and a resin intermediate layer is provided on the resin sealing layer via a resin intermediate layer. A non-contact type data carrier characterized in that a protective layer is provided and the resin intermediate layer has a lower melting point than the resin sealing layer.
【００１０】本発明によれば、ＩＣチップを覆って樹脂
封止層が設けられ、さらに樹脂封止層上に樹脂中間層を
介して保護層が設けられているので、樹脂封止層、樹脂
中間層および保護層によりＩＣチップの機械的保護強化
を図ることができる。また樹脂中間層は樹脂封止層より
低い溶融点をもつので、樹脂封止層上に樹脂中間層を介
して保護層を載置し、保護層上から熱プレス作業を施し
た場合、樹脂中間層が変形してＩＣチップおよび樹脂封
止層の厚みを吸収する。このため、保護層外面を平滑に
保つことができる。According to the present invention, the resin sealing layer is provided so as to cover the IC chip, and the protective layer is provided on the resin sealing layer via the resin intermediate layer. The intermediate layer and the protective layer can enhance the mechanical protection of the IC chip. Also, since the resin intermediate layer has a lower melting point than the resin sealing layer, if a protective layer is placed on the resin sealing layer via the resin intermediate layer and hot pressing is performed from above the protective layer, The layer is deformed to absorb the thickness of the IC chip and the resin sealing layer. For this reason, the outer surface of the protective layer can be kept smooth.
【００１１】[0011]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態について説明する。図１（ａ）（ｂ）（ｃ）乃
至図３は本発明による非接触式データキャリアの一実施
の形態を示す図である。Embodiments of the present invention will be described below with reference to the drawings. 1 (a), 1 (b), 3 (c) to 3 show a non-contact type data carrier according to an embodiment of the present invention.
【００１２】図１（ａ）（ｂ）（ｃ）に示すように、例
えばＩＣカードまたはＩＣタグ等の非接触式データキャ
リア１０は、ＰＥＴ製の樹脂基材１１と、樹脂基材１１
上面（樹脂基材１１の一側）の略全域にフォトレジスト
層（図示せず）を用いてアルミのエッチング又は導電性
フィラーを含有した導電性インクを用いた印刷により形
成された導電性アンテナコイル１３と、アンテナコイル
１３上に接続されたＩＣチップ２０とを備えている。As shown in FIGS. 1 (a), 1 (b) and 1 (c), a non-contact data carrier 10 such as an IC card or an IC tag comprises a resin base 11 made of PET and a resin base 11
A conductive antenna coil formed by etching a aluminum layer using a photoresist layer (not shown) or printing using a conductive ink containing a conductive filler over substantially the entire area of the upper surface (one side of the resin base material 11). 13 and an IC chip 20 connected on the antenna coil 13.
【００１３】このうちＩＣチップ２０はＩＣチップ本体
２０ａと、ＩＣチップ本体２０ａの底面に設けられたバ
ンプ２２とを有し、ＩＣチップ２０のバンプ２２側の面
（底面）は回路面２３となっている。ＩＣチップ２０
は、バンプ２２側の回路面２３をアンテナコイル１３側
に向けて配置され、バンプ２２をアンテナコイル１３に
当接させた状態で、絶縁性接着剤１４によりアンテナコ
イル１３上に固着されている。この場合、ＩＣチップ２
０の回路面２３は絶縁性接着剤１４により覆われて保護
される。The IC chip 20 has an IC chip main body 20a and a bump 22 provided on the bottom surface of the IC chip main body 20a, and the surface (bottom surface) of the IC chip 20 on the bump 22 side is a circuit surface 23. ing. IC chip 20
Is mounted on the antenna coil 13 with the insulating adhesive 14 in a state where the circuit surface 23 on the side of the bump 22 faces the antenna coil 13 and the bump 22 is in contact with the antenna coil 13. In this case, the IC chip 2
The circuit surface 23 is covered and protected by the insulating adhesive 14.
【００１４】なおアンテナコイル１３の代わりに、ＩＣ
チップ２０のバンプ２２に接触するとともに、パターン
で構成された面積受送信型のアンテナ３３を用いてもよ
い（図４）。In place of the antenna coil 13, an IC
An area receiving / transmitting antenna 33 configured to be in contact with the bumps 22 of the chip 20 and configured by a pattern may be used (FIG. 4).
【００１５】また、樹脂基材１１上面には、ＩＣチップ
２０をアンテナコイル１３に加熱圧着させる際の強度補
強を図るため、金属板からなる金属補強部材２６が設け
られている。この金属補強部材２６は、樹脂基材１１上
にアンテナコイル１３を形成する際同時に形成されるこ
とが好ましく、このため金属補強部材２６はアルミ製又
は導電性印刷層となっている。A metal reinforcing member 26 made of a metal plate is provided on the upper surface of the resin substrate 11 in order to reinforce the strength when the IC chip 20 is heated and pressed on the antenna coil 13. The metal reinforcing member 26 is preferably formed at the same time when the antenna coil 13 is formed on the resin base material 11, so that the metal reinforcing member 26 is made of aluminum or a conductive printing layer.
【００１６】なお図２および図３に示すように、アンテ
ナコイル１３の一対の端部は、アンテナコイル１３の内
側と外側に各々配置されている。As shown in FIGS. 2 and 3, a pair of ends of the antenna coil 13 are disposed inside and outside the antenna coil 13, respectively.
【００１７】また図１（ｃ）に示すように、ＩＣチップ
２０を覆って樹脂封止層１５が設けられており、この樹
脂封止層１５は絶縁性接着剤１４の外周全域およびＩＣ
チップの側面および上面を覆って設けられている。さら
に樹脂封止層１５上には、樹脂中間層１７を介して保護
層１８が設けられている。As shown in FIG. 1C, a resin sealing layer 15 is provided so as to cover the IC chip 20. The resin sealing layer 15 covers the entire outer periphery of the insulating adhesive 14 and the IC chip.
It is provided to cover the side and top surfaces of the chip. Further, a protective layer 18 is provided on the resin sealing layer 15 via a resin intermediate layer 17.
【００１８】次に各部の材料および形状について説明す
る。Next, the material and shape of each part will be described.
【００１９】樹脂基材１１としては、例えばポリエステ
ル、ポリエチレン、ポリプロピレン、ポリイミド等のプ
ラスチックフィルムの他、紙または不織布等が使用でき
るが、耐薬品性、耐熱性等からポリエステル、ポリイミ
ドが主に用いられる。ポリエステルとしては、予め熱処
理された２軸延伸ポリエステルが用いられる。As the resin substrate 11, for example, paper or nonwoven fabric can be used in addition to a plastic film such as polyester, polyethylene, polypropylene, and polyimide, but polyester and polyimide are mainly used because of their chemical resistance and heat resistance. . As the polyester, a biaxially stretched polyester which has been heat-treated in advance is used.
【００２０】通常アンテナコイル１３の形状は４０ｍｍ
×４０ｍｍ程度となっているが、使用用途、必要性能に
よりアンテナコイル１３をカード状等に形成してもよ
い。また樹脂基材１１の厚さは３０〜２００μｍとなっ
ている。Normally, the shape of the antenna coil 13 is 40 mm
Although it is about × 40 mm, the antenna coil 13 may be formed in a card shape or the like depending on the intended use and required performance. The thickness of the resin substrate 11 is 30 to 200 μm.
【００２１】またアンテナコイル１３は、エッチングに
より形成され、アルミ製となっている。アンテナコイル
１３の厚さは５〜１００μ程度となっているが、コスト
・電気的特性から、１５〜３０μｍが好ましい。なお、
アンテナコイル１３を導電フィラーを用いた印刷により
形成し、その厚さを５〜５０ｎｍとしてもよい。この場
合、導電フィラーとしては、Ａｇ、カーボンまたはこれ
らの混合物が考えられ、導電フィラーからなるアンテナ
コイル１３の比抵抗は１×１０−１Ω・ｃｍ〜１×１０
−６Ω・ｃｍとなる。The antenna coil 13 is formed by etching and is made of aluminum. The thickness of the antenna coil 13 is about 5 to 100 μm, but is preferably 15 to 30 μm in view of cost and electrical characteristics. In addition,
The antenna coil 13 may be formed by printing using a conductive filler, and may have a thickness of 5 to 50 nm. In this case, the conductive filler may be Ag, carbon, or a mixture thereof, and the specific resistance of the antenna coil 13 made of the conductive filler is 1 × 10 −1 Ω · cm to 1 × 10
−6 Ω · cm.
【００２２】さらにＩＣチップ２０のＩＣチップ本体２
０ａは、大きさ１．５ｍｍ×１．５ｍｍ角、厚さ約１８
０μｍのものが用いられる。Further, the IC chip body 2 of the IC chip 20
0a has a size of 1.5 mm × 1.5 mm square and a thickness of about 18
One having a thickness of 0 μm is used.
【００２３】金属補強部材２６はアルミ製となっている
が、他の金属製のものを用いても良い。The metal reinforcing member 26 is made of aluminum, but may be made of another metal.
【００２４】また絶縁性接着剤１４はエポキシ、アクリ
ル、ウレタン等の熱硬化性樹脂をベースポリマーとして
用いたものの他、種々の熱可塑性樹脂から選定しても良
い。又、着色剤を用いて隠ペイしておくと更に保護効果
が高まる。The insulating adhesive 14 may be selected from various thermoplastic resins in addition to those using a thermosetting resin such as epoxy, acrylic, urethane or the like as a base polymer. In addition, if the hidden pay is made using a coloring agent, the protective effect is further enhanced.
【００２５】次に樹脂封止層１５について説明する。樹
脂封止層１５としては、ウレタン、ポリエステル、ＥＶ
Ａ、ＰＢＴ等の熱可塑性樹脂が用いられる。とりわけ熱
プレス適性の点から、融点が８０〜１５０℃程度のホッ
トメルトタイプが望ましいが、実用耐久性、仕上がり
（表面平滑性）を確保するには１００〜１２０℃の融点
を持つものが更に良い。Next, the resin sealing layer 15 will be described. As the resin sealing layer 15, urethane, polyester, EV
A, a thermoplastic resin such as PBT is used. In particular, a hot melt type having a melting point of about 80 to 150 ° C. is desirable from the viewpoint of suitability for hot pressing, but a substance having a melting point of 100 to 120 ° C. is more preferable in order to ensure practical durability and finish (surface smoothness). .
【００２６】また、樹脂封止層１５を印刷により形成し
てもよく、またティスペンスによる塗布により形成して
もよい。Further, the resin sealing layer 15 may be formed by printing, or may be formed by applying with a spice.
【００２７】さらに樹脂中間層１７および保護層１８と
しては、樹脂封止層１５よりも低い溶融点をもつ材料、
例えばウレタン、ポリエステル、ＥＶＡ、ＰＢＴ等の熱
可塑性樹脂の他、エポキシ、アクリル、ウレタン等の熱
硬化性樹脂や反応硬化型樹脂を未硬化・半硬化状態で使
用しても良い。The resin intermediate layer 17 and the protective layer 18 are made of a material having a lower melting point than that of the resin sealing layer 15.
For example, in addition to thermoplastic resins such as urethane, polyester, EVA, and PBT, thermosetting resins such as epoxy, acrylic, and urethane and reaction-curable resins may be used in an uncured / semi-cured state.
【００２８】融点または軟化温度として上記封止樹脂と
の組み合わせで１００℃〜１５０℃程度のものが選ばれ
る。仕上がり（表面平滑性）の点から、上記封止樹脂の
融点以上のものが最も良い。A material having a melting point or softening temperature of about 100 ° C. to 150 ° C. in combination with the above sealing resin is selected. From the viewpoint of finish (surface smoothness), those having a melting point of the sealing resin or more are the best.
【００２９】次にこのような構成からなる非接触式デー
タキャリアの製造方法について説明する。まず図１
（ａ）に示すように、樹脂基材１１が準備され、樹脂基
材１１の上面にフォトレジスト層を用いたエッチング法
または印刷法によりアンテナコイル１３が形成される。Next, a method of manufacturing a non-contact data carrier having such a configuration will be described. First, Figure 1
As shown in (a), a resin substrate 11 is prepared, and an antenna coil 13 is formed on the upper surface of the resin substrate 11 by an etching method or a printing method using a photoresist layer.
【００３０】同時に樹脂基材１１の上面に、エッチング
法または印刷法により金属補強部材２６が設けられる。At the same time, a metal reinforcing member 26 is provided on the upper surface of the resin substrate 11 by an etching method or a printing method.
【００３１】次にアンテナコイル１３上に、絶縁性接着
剤１４を介してＩＣチップ２０が搭載されるとともに、
ＩＣチップ２０が加熱ヘッド（図示せず）により加熱圧
着されてアンテナコイル１３に固定される。この場合、
樹脂基材１１上に金属補強部材２６が設けられているの
で、ＩＣチップ２０を加熱ヘッドにより加熱圧着しても
樹脂基材１１がたるんだり収縮したりすることはない。
すなわち金属補強部材２６がない場合、ＩＣチップ２０
の加熱圧着時にＩＣチップ２０に加わる力と熱により樹
脂基材１１がたるんだり収縮したりすることも考えられ
る。しかしながら本発明によれば、金属補強部材２６を
設けたので、ＩＣチップ２０に加わる力と熱をこの金属
補強部材２６により受けることができ、樹脂基材１１の
たるみおよび収縮が防止される。Next, the IC chip 20 is mounted on the antenna coil 13 with the insulating adhesive 14 interposed therebetween.
The IC chip 20 is heated and pressed by a heating head (not shown) and fixed to the antenna coil 13. in this case,
Since the metal reinforcing member 26 is provided on the resin substrate 11, the resin substrate 11 does not sag or shrink even when the IC chip 20 is heated and pressed by the heating head.
That is, when there is no metal reinforcing member 26, the IC chip 20
It is also conceivable that the resin base material 11 sags or shrinks due to the force and heat applied to the IC chip 20 at the time of heat compression. However, according to the present invention, since the metal reinforcing member 26 is provided, the force and heat applied to the IC chip 20 can be received by the metal reinforcing member 26, and the sagging and shrinkage of the resin base material 11 can be prevented.
【００３２】その後、図１（ｂ）に示すように、ＩＣチ
ップ２０を覆って樹脂封止層１５が設けられる。Thereafter, as shown in FIG. 1B, a resin sealing layer 15 is provided so as to cover the IC chip 20.
【００３３】次に図１（ｃ）に示すように、樹脂封止層
１５を覆って樹脂中間層１７および保護層１８が載置さ
れ、保護層１８上から図示しない熱板を用いて熱プレス
作業が行われる（加熱温度８０〜１６０℃、加圧力２〜
２０ｋｇｆ／ｃｍ２）。この場合、樹脂中間層１７は樹
脂封止層１５より低い溶融点をもつので、熱プレス作業
中に樹脂中間層１７が変形し、ＩＣチップ２０および樹
脂封止層１５の厚みを吸収する。このためＩＣチップ２
０および樹脂封止層１５によって保護層１８が外方へ突
出することはなく、保護層１８の表面を平滑に保つこと
ができる。Next, as shown in FIG. 1 (c), a resin intermediate layer 17 and a protective layer 18 are placed so as to cover the resin sealing layer 15, and a hot press is performed from above the protective layer 18 using a hot plate (not shown). Work is performed (heating temperature 80 to 160 ° C, pressure 2 to 2
20 kgf / cm 2 ). In this case, since the resin intermediate layer 17 has a lower melting point than the resin sealing layer 15, the resin intermediate layer 17 is deformed during the hot pressing operation, and absorbs the thickness of the IC chip 20 and the resin sealing layer 15. Therefore, IC chip 2
The protective layer 18 does not protrude outward by the 0 and the resin sealing layer 15, and the surface of the protective layer 18 can be kept smooth.
【００３４】以上のように本実施の形態によれば、ＩＣ
チップ２０を覆って樹脂封止層１５、樹脂中間層１７お
よび保護層１８が設けられているので、樹脂封止層１
５、樹脂中間層１７および保護層１８によりＩＣチップ
２０を機械的に保護し強化することができる。また、樹
脂中間層１７は樹脂封止層１５より低い溶融点をもつの
で、熱プレス作業中に樹脂中間層１７が変形しＩＣチッ
プ２０および樹脂封止層１５の厚みを吸収する。このた
め、保護層１８の外面を平滑に保つことができる。As described above, according to the present embodiment, the IC
Since the resin sealing layer 15, the resin intermediate layer 17, and the protective layer 18 are provided to cover the chip 20, the resin sealing layer 1
5. The IC chip 20 can be mechanically protected and strengthened by the resin intermediate layer 17 and the protective layer 18. In addition, since the resin intermediate layer 17 has a lower melting point than the resin sealing layer 15, the resin intermediate layer 17 is deformed during the hot pressing operation to absorb the thickness of the IC chip 20 and the resin sealing layer 15. Therefore, the outer surface of the protective layer 18 can be kept smooth.
【００３５】[0035]
【発明の効果】以上のように本発明によれば、非接触式
データキャリアのＩＣチップの保護強化を図ることがで
きるとともに、保護層外面を平滑に保つことができる。As described above, according to the present invention, the protection of the IC chip of the non-contact type data carrier can be enhanced and the outer surface of the protective layer can be kept smooth.
【図１】本発明による非接触式データキャリアの一実施
の形態を示す側面図。FIG. 1 is a side view showing one embodiment of a contactless data carrier according to the present invention.
【図２】本発明による非接触式データキャリアの平面
図。FIG. 2 is a plan view of a non-contact data carrier according to the present invention.
【図３】本発明による非接触式データキャリアの拡大
図。FIG. 3 is an enlarged view of a non-contact data carrier according to the present invention.
【図４】面積受送信型のアンテナを示す図。FIG. 4 is a diagram showing an area receiving / transmitting antenna.
１０ 非接触式データキャリア １１ 樹脂基材 １３ アンテナコイル １４ 絶縁性接着剤 １５ 樹脂封止層 １７ 樹脂中間層 １８ 保護層 ２０ ＩＣチップ ２２ バンプ DESCRIPTION OF SYMBOLS 10 Non-contact data carrier 11 Resin base material 13 Antenna coil 14 Insulating adhesive 15 Resin sealing layer 17 Resin intermediate layer 18 Protective layer 20 IC chip 22 Bump
Claims (3)
封止層上に樹脂中間層を介して保護層を設け、樹脂中間
層は樹脂封止層より低い溶融点をもつことを特徴とする
非接触式データキャリア。1. An electronic device comprising: a resin base; an antenna provided on one side of the resin base; and an IC chip connected to the antenna. A resin sealing layer is provided to cover the IC chip. A non-contact data carrier, wherein a protective layer is provided on a sealing layer via a resin intermediate layer, and the resin intermediate layer has a lower melting point than the resin sealing layer.
熱可塑性樹脂材料からなり、樹脂中間層は融点が１２０
〜１５０℃の熱可塑性樹脂材料からなることを特徴とす
る請求項１記載の非接触式データキャリア。2. The resin sealing layer is made of a thermoplastic resin material having a melting point of 100.degree. C. to 120.degree.
2. The non-contact data carrier according to claim 1, wherein the non-contact data carrier is made of a thermoplastic resin material having a temperature of 150 to 150 [deg.] C.
剤が介在されていることを特徴とする請求項１記載の非
接触式データキャリア。3. The non-contact data carrier according to claim 1, wherein an insulating adhesive is interposed between the antenna and the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000304937A JP4614518B2 (en) | 2000-10-04 | 2000-10-04 | Non-contact data carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000304937A JP4614518B2 (en) | 2000-10-04 | 2000-10-04 | Non-contact data carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002109496A true JP2002109496A (en) | 2002-04-12 |
| JP4614518B2 JP4614518B2 (en) | 2011-01-19 |
Family
ID=18785895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000304937A Expired - Fee Related JP4614518B2 (en) | 2000-10-04 | 2000-10-04 | Non-contact data carrier |
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| Country | Link |
|---|---|
| JP (1) | JP4614518B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009193226A (en) * | 2008-02-13 | 2009-08-27 | Osaka Sealing Printing Co Ltd | Sheet with ic chip, label with ic chip, method for manufacturing sheet with ic chip, and method for manufacturing label with ic chip |
| JP2019093626A (en) * | 2017-11-22 | 2019-06-20 | 凸版印刷株式会社 | card |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH111083A (en) * | 1997-06-13 | 1999-01-06 | Dainippon Printing Co Ltd | Noncontact ic card and manufacture thereof |
| JPH11250209A (en) * | 1998-03-04 | 1999-09-17 | Dainippon Printing Co Ltd | Non-contact ic card |
| JPH11345302A (en) * | 1998-06-02 | 1999-12-14 | Toppan Printing Co Ltd | Mounting method for ic chip, ic module, inlet and ic card |
| JP2000172819A (en) * | 1998-10-02 | 2000-06-23 | Shinko Electric Ind Co Ltd | Manufacture of ic card |
| JP2000200335A (en) * | 1997-01-31 | 2000-07-18 | Denso Corp | Ic card and production thereof |
-
2000
- 2000-10-04 JP JP2000304937A patent/JP4614518B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000200335A (en) * | 1997-01-31 | 2000-07-18 | Denso Corp | Ic card and production thereof |
| JPH111083A (en) * | 1997-06-13 | 1999-01-06 | Dainippon Printing Co Ltd | Noncontact ic card and manufacture thereof |
| JPH11250209A (en) * | 1998-03-04 | 1999-09-17 | Dainippon Printing Co Ltd | Non-contact ic card |
| JPH11345302A (en) * | 1998-06-02 | 1999-12-14 | Toppan Printing Co Ltd | Mounting method for ic chip, ic module, inlet and ic card |
| JP2000172819A (en) * | 1998-10-02 | 2000-06-23 | Shinko Electric Ind Co Ltd | Manufacture of ic card |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009193226A (en) * | 2008-02-13 | 2009-08-27 | Osaka Sealing Printing Co Ltd | Sheet with ic chip, label with ic chip, method for manufacturing sheet with ic chip, and method for manufacturing label with ic chip |
| JP2019093626A (en) * | 2017-11-22 | 2019-06-20 | 凸版印刷株式会社 | card |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4614518B2 (en) | 2011-01-19 |
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