JP3769324B2 - Non-contact IC card manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC module package built in an IC card.
[0002]
[Prior art]
In recent years, IC cards equipped with semiconductor elements for recording and processing data are becoming widespread from the viewpoint of efficiency of information processing and security. Such an IC card includes a contact type that connects an external terminal of the card and a terminal of an external processing device to transmit and receive data, an antenna coil that transmits and receives data by electromagnetic waves, and a semiconductor for data processing. There is a non-contact type that incorporates an element and can read and write data with an external processing device by a so-called wireless method. Recently, the driving power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card that does not incorporate a battery is increasing.
[0003]
These non-contact type IC cards are manufactured by mounting external components such as semiconductor elements, coils, capacitors, and batteries on a substrate, and processing the module into a package using an epoxy resin or the like by a casting method. Is generally laminated, bonded or embedded with PVC, ABS, or UV resin to form a card.
[0004]
Among them, the hot press laminating method includes a method called a punching method in which a hole for a module is punched in a core sheet, a non-contact IC module subjected to package processing is inserted, and an oversheet is placed on the top and bottom. Two types of methods called a countersink method in which a countersink is formed in accordance with the shape of the contact IC module to form a recess, an IC module is inserted into the recess, and the oversheet is thermally fused to the core sheet. Is representative.
[0005]
[Problems to be solved by the invention]
However, with these methods, there is a poor appearance strength due to insufficient bonding strength, physical strength, or peeling of the module and oversheet bonding between the non-contact IC module packaged with epoxy resin or the like and the oversheet. It often happens.
[0006]
The present invention has been made in view of the above circumstances, and provides an IC module package capable of manufacturing an IC card with improved bonding strength and physical strength at a bonding portion between a packaged IC module and an oversheet or the like. For the purpose.
[0007]
[Means for Solving the Problems]
According to the non-contact IC card manufacturing method of the present invention , the first resin member and the second resin member made of a cured resin are formed, and the IC and the coil of the IC module are stored in the recess of the first resin member. Then, the second resin member is covered with the recess, and the first resin member and the second resin member are joined to form an IC module package, and the IC module package is made of a core sheet made of resin. It inserts into a recessed part or a hole part, covers the oversheet which consists of resin in the said recessed part or hole part, heats and pressurizes, and the said oversheet is heat-sealed to the said IC module package and the said core sheet.
[0008]
IC modules are vulnerable to heat. For example, if heated to about 260 ° C, the coil coating may melt and short circuit, the coil may be deformed, and data may be damaged. The same vinyl chloride as the resin that constitutes the core sheet and oversheet It is difficult to directly encapsulate with resin or the like by injection molding or casting.
[0009]
However, the IC module package of the present invention has a structure in which the IC module is sealed in the resin member by a combination of resin members formed in advance. Therefore, the IC module can be sealed with a resin having a melting point higher than the heat resistance temperature of the IC module without applying heat to the IC module. Therefore, it is possible to encapsulate the IC module by selecting the same resin as that constituting the IC card, such as a core sheet and an oversheet, and as a result, the thermal fusion between the IC module package and the oversheet becomes strong, Bonding strength, physical strength, and poor appearance due to peeling are less likely to occur.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, although embodiment of this invention is described, this invention is not limited to the following embodiment.
The IC module package of the present invention will be described with reference to FIGS. 1 and 2 show an IC module package according to a first embodiment. FIG. 1 is a perspective view of each component, and FIG. 2 is a cross-sectional view of the assembled IC module package.
[0011]
The IC module package 1a is obtained by enclosing, for example, a non-contact IC module 4 having an IC 2 and a coil 3 in a container in which resin-made package blocks 11 and 12 are combined. The package block is composed of, for example, a package block 11 in which a recess 11a is countersunk in accordance with the shape of the non-contact IC module 4 on a sheet made of vinyl chloride resin, and a cover sheet 12 made of vinyl chloride resin.
[0012]
As shown in FIG. 1, the IC module package 1a is produced by storing the IC module 4 in the recess 11a of the package block 11, placing the cover sheet 12 thereon, and performing hot press lamination, and then bonding the package block 11 and the cover sheet 12 together. After heat fusion and integration, punching is performed to make the package size. In this case, various types of bonding methods such as bonding using an adhesive, bonding using a solvent, and ultrasonic welding can be employed in addition to thermal fusion. Further, the material of the package block 11 and the cover sheet 12 can be made different. The package block 11 can be formed by injection molding or the like.
[0013]
For example, the thickness t ₁ of the package block 11 is about 460 μm, the thickness t ₂ of the IC module 4 is about 400 μm, and the thickness t ₃ of the cover sheet 11 is about 100 μm. The total thickness of the block 11 and the cover sheet 12 is approximately the same as the thickness 560 μm of the core sheet on which the IC module is mounted. If necessary, the cover sheet 12 can also be formed with a recess corresponding to the recess 11a of the package block 11 by countersinking or the like.
[0014]
3 and 4 show a second example of the IC module package. FIG. 3 is a perspective view of each member, and FIG. 4 is a cross-sectional view of the IC module package 1b. The package block (resin member) is formed by molding the two package blocks 21 and 22 by, for example, injection molding of vinyl chloride resin so that a gap is formed in accordance with the IC module to be stored. The package blocks 21 and 22 have, for example, the same shape in contrast to each other, and each has a groove 21a in which the IC 2 is mounted and a ring-shaped groove 21b in which the coil 3 surrounding it is mounted.
[0015]
As shown in FIG. 3, the IC module package 1b is prepared by mounting the IC module in a gap formed when the package blocks 21 and 22 are combined, and then bonding the two package blocks together by hot press lamination or solvent bonding. The IC module package 1b is completed by temporarily fixing with an agent or the like. Also in this case, the materials of the two package blocks 21 and 22 can be made different.
[0016]
According to the IC module package of these first and second forms, a package member is formed in advance by countersinking, injection molding, etc. using the same quality resin as the core sheet and oversheet. Enclose the IC module. If the IC module is heated to about 260 ° C, for example, the coil coating may melt and short circuit, the coil may be deformed, or the data may be damaged. It is difficult to encapsulate directly with vinyl chloride resin, etc. by injection molding or casting. It is. However, according to this method, the IC module can be encapsulated with a resin having a melting point equal to or higher than the heat resistance temperature of the IC module, and the resin encapsulating the IC module can be selected in a wide range. IC module can be encapsulated with the same quality resin.
[0017]
In addition, the resin is not limited to the same material as the core sheet or oversheet. For example, if packaging is performed using a resin having particularly good adhesion, the core sheet and the oversheet may be made of different resins. The range is wide.
The resin constituting the module package is not particularly limited for the reasons described above. For example, polyvinyl chloride resin, polyethylene, polypropylene, polystyrene, ABS resin, acrylic resin, polyester resin, polyamide, polyimide, natural rubber, SBR, etc. Examples thereof include thermosetting resins such as synthetic rubber, unsaturated polyester, and phenol resin, and ultraviolet curable resins.
[0018]
In the above figure, the IC module is exposed, but it is needless to say that it may be sealed in advance with, for example, an epoxy resin.
Such an IC module package is incorporated in a card to constitute an IC card. For example, as shown in FIG. 5, the IC module package 1 of the present invention is mounted in the embedding recess 31a of the core sheet 31 in which the embedding recess 31a is formed by countersinking or the like, and the IC card is completed. In this case, the resins of the upper and lower packages of the IC module package 1 are different, for example, the lower package is made of a resin having good adhesion to the core sheet, and the package exposed on the surface has good printability. It is also effective to use a resin.
[0019]
Further, as shown in FIG. 6, the IC module package 1 is mounted in the punching hole 32a of the core sheet 32 provided with the punching hole, and the oversheets 33 and 34 are laminated from both sides by heat fusion or the like, and the IC module package By enclosing 1, an IC card can be manufactured. In this case, it is effective that the resin constituting the IC module package 1 is made of the same material as the oversheets 33 and 34 to improve the bonding strength by heat fusion.
[0020]
In the above description, two resin members are used as a package constituting the IC module. However, one or more resin members may be used as long as three or more or a cover and a container can be integrally formed. Further, although the IC module includes a coil, only an IC excluding the coil may be encapsulated with a resin member, and various modifications can be made without departing from the scope of the present invention.
[0021]
【The invention's effect】
The IC module package of the present invention can use a wider variety of resins than conventional sealing by casting.
[Brief description of the drawings]
FIG. 1 is a perspective view of each member showing a first form of an IC module package of the present invention.
2 is a cross-sectional view of the IC module package of FIG. 1. FIG.
FIG. 3 is a perspective view of each member showing a second form of the IC module package of the present invention.
4 is a cross-sectional view of the IC module package of FIG. 3;
FIG. 5 is a perspective view showing a state in which an IC module package is incorporated into an IC card.
FIG. 6 is a cross-sectional view showing a state where an IC module package is mounted on a core sheet having a punching hole.
[Explanation of symbols]
1, 1a, 1b ... IC module package, 2 ... IC, 3 ... coil, 4 ... IC module, 11, 12, 21, 22 ... package block, 31, 32 ... core sheet, 33, 34 ... oversheet

Claims (1)

A method of manufacturing a non-contact IC card ,
A first resin member and a second resin member made of cured resin are formed, and an IC and a coil of the IC module are housed in the recess of the first resin member, and the second resin member is placed in the recess. Cover the first resin member and the second resin member to form an IC module package, and insert the IC module package into a recess or hole of a core sheet made of resin. Cover the part with an oversheet made of resin and heat and pressurize the oversheet to heat-seal the IC module package and the core sheet.
A method for manufacturing a non-contact IC card.

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