TWI805842B - Covering tape for packing elecronic component and package - Google Patents

Abstract

The present disclosure provides a covering tape for packing electronic component, the covering tape comprising: a base material layer, a heat seal layer that is disposed at one surface side of the base material layer and includes an ethylene-vinyl acetate copolymer, and an antistatic layer that is disposed at the opposite surface side to the heat seal layer side of the base material layer and includes a conductive polymer; wherein the Vickers hardness of the heat seal layer is a specific value or more.

Description

Cover tape and package body for packaging electronic parts

The invention relates to a cover tape for packaging electronic parts and a package using the same.

In recent years, electronic components such as IC (Integrated Circuit), resistors, transistors, diodes, capacitors, and piezoelectric element registers have been taped and packaged for surface mounting. In the tape packaging, after storing the electronic components in a carrier tape having a plurality of storage portions for storing electronic components, the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic components. In addition, when mounting electronic components, the cover tape is peeled off from the carrier tape, and the electronic components are automatically taken out and surface-mounted on the substrate. With regard to the surface mounting of electronic components, with the high-speed communication and high-speed computing processing of electronic equipment in recent years, there is a tendency for the number of parts to increase, and further efficiency and speed of mounting are required. Furthermore, the cover tape is also called the top tape.

For the cover tape, it is required to be easily peelable from the carrier tape. If the peeling strength of the cover tape is too strong, there is a problem that when the cover tape is peeled from the carrier tape during mounting of electronic parts, the carrier tape vibrates and the electronic parts jump out of the storage portion or the cover tape breaks. This becomes a problem particularly when the cover tape is peeled off at high speed along with the speed-up of mounting.

Also, in tape packaging, static electricity may be generated by friction or contact between electronic parts and the carrier tape or cover tape, and static electricity may be generated by peeling the cover tape from the carrier tape during mounting. The latter phenomenon is called stripping electrification. The faster the stripping speed, the greater the stripping charge. Due to the stripped electrification, the electronic parts are attached to the cover tape during installation, and the electronic parts cannot be taken out normally, or the electronic parts jump out of the storage part of the carrier tape. This leads to a decrease in installation efficiency. Furthermore, there is also a possibility of deterioration and destruction of electronic components due to static electricity.

Therefore, various cover tapes having antistatic properties have been proposed (for example, refer to Patent Documents 1 to 3). [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent No. 4162961 [Patent Document 2] Japanese Patent Laid-Open No. 10-95448 [Patent Document 3] Japanese Patent No. 4061136

[Problem to be solved by the invention]

However, the inventors of the present invention have found that even when an antistatic cover tape is used, electronic parts may adhere to the cover tape.

This invention was made in view of the above-mentioned problem, and it aims at providing the cover tape for packaging electronic components which can suppress the adhesion of electronic components. [Technical means to solve the problem]

One embodiment of the present invention provides a cover tape for packaging electronic components, which has: a base material layer; a heat seal layer, which is arranged on one side of the base material layer, and includes an ethylene-vinyl acetate copolymer; and an antistatic layer. , which is disposed on the side of the substrate layer opposite to the side of the heat-sealing layer, and includes a conductive polymer; and the heat-sealing layer has a Vickers hardness of 2.0 or more.

One embodiment of the present invention provides a package including: a carrier tape having a plurality of storage sections for storing electronic components; electronic components stored in the storage sections; The storage part is configured in the manner mentioned above. [Effect of Invention]

In the present invention, a cover tape for packaging electronic components capable of suppressing adhesion of electronic components can be provided.

Embodiments of the present invention will be described below with reference to the drawings and the like. However, the present invention can be implemented in various forms, and should not be limited to the descriptions of the embodiments exemplified below and interpreted. In addition, in order to clarify the description, the drawings may schematically show the width, thickness, shape, etc. of each part compared with the actual form, but these are just examples and do not limit the interpretation of the present invention. In addition, in this specification and each drawing, the same reference numerals may be attached to the same elements as those described in the already proposed drawings, and detailed description may be appropriately omitted.

In this specification, when expressing the aspect of arranging other components on a certain component, when it is only described as "on top" or "under", unless otherwise specified in advance, it is assumed that it is included to be in contact with a certain component. Both the case of disposing other components directly above or directly below, and the situation of disposing other components above or below a certain component through another component. Also, in this specification, when expressing an aspect of arranging another member on the surface of a member, when it is only described as "on the side of the face" or "on the face", unless otherwise specified, it is assumed to include the same as Both the case of arranging other members directly above or directly below a certain member in a connected manner, and the case of arranging other members above or below a certain member with another member interposed therebetween.

Hereinafter, the cover tape and package body for electronic component packaging of this invention are demonstrated in detail.

A. Cover tape for electronic parts packaging The cover tape for packaging electronic parts of the present invention has: a base material layer; a heat-sealing layer disposed on one side of the base material layer and comprising an ethylene-vinyl acetate copolymer; and an antistatic layer disposed on the base material The side of the layer opposite to the side of the heat-sealing layer includes a conductive polymer; and the Vickers hardness of the heat-sealing layer is 2.0 or more. In addition, in this specification, a "cover tape for packaging electronic components" may be simply referred to as a "cover tape".

The cover tape of the present invention will be described with reference to the drawings. Fig. 1 is a schematic sectional view showing an example of the cover tape of the present invention. As shown in FIG. 1 , the cover tape 1 of the present invention has: a base material layer 2; a heat-sealing layer 3, which is disposed on one side of the base material layer 2, comprising ethylene-vinyl acetate copolymer; and an antistatic layer 4, It is disposed on the side of the substrate layer 2 opposite to the side of the heat-sealing layer 3 and includes a conductive polymer. The Vickers hardness of the heat-sealing layer 3 is within a specific range.

Fig. 2 (a), (b) are the schematic top view and sectional view of an example of the packaging body showing the use of the cover tape for packaging electronic parts of the present invention, and Fig. 2 (b) is the A-A sectional view of Fig. 2 (a). As shown in Figure 2 (a), (b), the package 10 is equipped with: a carrier tape 11, which has a plurality of storage parts 12 for storing electronic parts 13; electronic parts 13, which are stored in the storage parts 12; and a cover tape 1 , which is arranged to cover the housing portion 12 . The cover tape 1 is heat-sealed to the carrier tape 11 , and heat-sealed portions 3 h are provided in a linear shape with a predetermined width at both ends of the heat-seal layer 3 of the cover tape 1 . Moreover, in the package 10, the carrier tape 11 may have the conveyance hole 14. As shown in FIG.

The inventors of the present invention first realized that a cover tape having an antistatic layer comprising a conductive polymer and a heat-sealing layer comprising an ethylene-vinyl acetate copolymer has good antistatic properties, heat-sealing properties, and peelability . However, it has been found that even when a cover tape having good antistatic properties is used, electronic parts may adhere to the cover tape. Then, as a result of diligent research to solve the above problems, the inventors of the present invention found that not only static electricity but also the hardness of the heat-sealing layer of the cover tape affects the adhesion of electronic components to the cover tape. Furthermore, after repeated studies, it was found that the adhesion of electronic parts to the cover tape can be suppressed by setting the hardness of the heat-sealing layer made of an ethylene-vinyl acetate copolymer into a specific range.

The reason why the adhesion of electronic components to the cover tape can be suppressed by setting the hardness of the heat-sealing layer of the cover tape into a specific range is not certain, but it is estimated as follows. Vickers hardness is one of indentation hardness. In the present invention, the Vickers hardness of the heat-sealing layer of the cover tape is a specific value or more, and thus becomes a relatively hard layer. Therefore, it is speculated that in the package using the cover tape of the present invention, when the electronic component is in contact with the heat-sealing layer of the cover tape during the production of the package or during the storage or transportation of the package, the heat-sealing layer of the cover tape is difficult to Following the contact surface of electronic parts, it is difficult for electronic parts to sink into the heat-sealing layer of the cover tape. Therefore, it is presumed that in the package using the cover tape of the present invention, when the cover tape is peeled off from the carrier tape, it is possible to make it difficult for electronic components to adhere to the heat-sealing layer of the cover tape.

On the other hand, if the heat-sealing layer of the cover tape is a relatively soft layer, when the electronic parts are in contact with the heat-sealing layer of the cover tape, the heat-sealing layer of the cover tape is easy to follow the contact surface of the electronic parts, that is, the electronic parts are easy to Trapped in the heat seal layer of the cover tape. Therefore, it is considered that even when the cover tape has antistatic properties, the adhesion of electronic components to the heat-sealing layer of the cover tape occurs.

It is also considered that if it is assumed that there is no need to consider the heat-sealability and peelability of the cover tape, the material of the heat-sealing layer will be selected based on the viewpoint that electronic parts are difficult to attach. However, in the cover tape of the present invention, it is important to use a heat-sealing layer containing an ethylene-vinyl acetate copolymer for good heat-sealing properties and peelability, and to set the Vickers hardness of the heat-sealing layer to a specific value or more. . In general, ethylene-vinyl acetate copolymers have a tendency to make layers relatively soft, and thus have a tendency for electronic parts to be easily attached to layers comprising ethylene-vinyl acetate copolymers, but by making the heat-sealing layer dimensionally When the hardness is set above a certain value, it is difficult to attach electronic parts.

In the case where the antistatic property of the cover tape is insufficient, the effect of setting the Vickers hardness of the heat-sealing layer to a certain value or more is limited because static electricity greatly contributes to the adhesion. Therefore, it is important to set the Vickers hardness of the heat-sealing layer made of ethylene-vinyl acetate copolymer to a certain value or more, and to have a resistance layer made of a conductive polymer on the side of the substrate layer opposite to the heat-sealing layer. Static layer. The antistatic performance of the antistatic layer containing conductive polymers is difficult to be affected by temperature or humidity to obtain stable antistatic performance, so it is easy to enjoy the effect produced by setting the Vickers hardness of the heat sealing layer above a specific value . In addition, the antistatic layer containing conductive polymer can generally make the thickness of the layer thinner than the antistatic layer containing other antistatic agents, so it has less influence on the heat sealing performance. Compared with plastic carrier tapes, paper carrier tapes are inferior in heat sealability and peelability, so when using paper carrier tapes, it is especially important to suppress the influence on heat sealability. Also, the so-called exudation phenomenon in which the conductive polymer is precipitated from the inside of the layer to the surface of the layer over time is less likely to occur. Therefore, by using an antistatic layer containing a conductive polymer in a cover tape having a heat seal layer containing an ethylene-vinyl acetate copolymer, the antistatic properties of the surface of the paper carrier tape and the cover tape in the package can be suppressed. When the surface of the layer is in contact, the antistatic agent will print through and the peeling performance will decrease.

Also, in order to improve the antistatic property of the cover tape, it is considered to add an antistatic agent to the heat seal layer. When ethylene-vinyl acetate copolymer is used in the heat-sealing layer, a non-ionic surfactant or a relatively low-polarity ionic active agent can be used to suppress the effect on the heat-sealing performance or to suppress bleeding. Since paper carrier tapes are inferior in heat sealability and peelability compared to plastic carrier tapes, it is especially important to suppress the influence on heat sealability when paper carrier tapes are used. However, non-ionic surfactants or ionic active agents with relatively low polarity tend to remain inside the layer and are difficult to bleed out, but on the contrary, it may be difficult to exert antistatic performance. Therefore, the antistatic property of the cover tape can be improved by having an antistatic layer containing a conductive polymer on the side of the substrate layer opposite to the heat-sealing layer. Furthermore, the antistatic property of the cover tape can be further improved by using an antistatic layer containing a conductive polymer on the side of the substrate layer opposite to the heat-sealing layer, and adding an antistatic agent to the heat-sealing layer.

Thus, in the present invention, in the cover tape having an antistatic layer comprising a conductive polymer and a heat-sealing layer comprising an ethylene-vinyl acetate copolymer, the heat-sealing layer has a Vickers hardness of a specified value or more, whereby In the package using the cover tape of the present invention, when the cover tape is peeled off from the carrier tape, adhesion of electronic components to the cover tape can be suppressed. Therefore, it is possible to suppress jumping, lifting, and standing up of the electronic parts from the storage portion of the carrier tape due to the attachment of the electronic parts to the cover tape, and it is possible to take out the electronic parts normally. Therefore, mounting efficiency can be improved.

Hereinafter, each structure of the cover tape of this invention is demonstrated.

1. Heat sealing layer The heat-sealing layer in the present invention is disposed on one side of the substrate layer and includes a layer of ethylene-vinyl acetate copolymer. The heat-sealing layer adheres the cover tape to the carrier tape by heat-sealing the carrier tape when the package is manufactured using the cover tape of the present invention.

The Vickers hardness of the heat-sealing layer is above 2.0. When the said Vickers hardness is the said range, the sticking of an electronic component to a cover tape can be suppressed. The Vickers hardness of the heat-sealing layer may be not less than 2.3, or not less than 2.6. Moreover, the upper limit of the Vickers hardness of a heat-sealing layer is not specifically limited, For example, it may be 6.0 or less, and may be 5.5 or less. When the said Vickers hardness is too high, heat-sealing property may fall, and when a cover tape is made into a roll shape, it may not be fully wound, or a heat-sealing layer may crack.

The Vickers hardness of the heat-sealing layer can be adjusted by the type or content of the material used in the heat-sealing layer. The heat-sealing layer in the present invention can also only use ethylene-vinyl acetate copolymer to obtain the desired Vickers hardness. For example, ethylene-vinyl acetate copolymers that give the desired Vickers hardness can be used. However, it is generally known that ethylene-vinyl acetate copolymer has better flexibility among resins. Therefore, by using the modified ethylene-vinyl acetate copolymer or the cross-linked ethylene-vinyl acetate copolymer, the Vickers hardness of the heat-sealing layer can be increased to obtain a desired Vickers hardness. Alternatively, by using an ethylene-vinyl acetate copolymer and an organic or inorganic substance harder than the ethylene-vinyl acetate copolymer, the Vickers hardness of the heat-sealing layer can be increased to obtain a desired Vickers hardness. As organic substances harder than ethylene-vinyl acetate copolymers, generally, resins with higher heat resistance than ethylene-vinyl acetate copolymers, resins with higher storage elastic modulus than ethylene-vinyl acetate copolymers, and resins with higher densities than ethylene-vinyl acetate copolymers can be listed. - Resin with high vinyl acetate copolymer, cross-linked resin, etc. These organic or inorganic substances may exist in the form of particles in the heat-sealing layer, and may also exist in a state compatible or incompatible with the ethylene-vinyl acetate copolymer.

The Vickers hardness of the heat-sealing layer in the present invention is the Vickers hardness obtained by nanoindentation method. As a specific measurement method for the Vickers hardness (dimensionless) obtained by the nanoindentation method of the heat-sealing layer, for the surface of the heat-sealing layer that is opposite to the base layer, indent from the vertical direction at an opposite angle of 136° The Vickers indenter in the shape of a diamond square pyramid, calculates the indentation hardness (indentation hardness) H _IT according to the obtained load-displacement curve, and then converts the indentation hardness (indentation hardness) H _IT into Vickers hardness HV. The average value was calculated|required about 30 places, and this average value was made into the Vickers hardness of a heat-sealing layer. Furthermore, the indentation hardness (indentation hardness) H _IT is more specifically obtained as shown in the following formula (1) by calculating the maximum indentation depth h _max of the Vickers indenter. The contact projected area A _p (mm ² ) of the formed pyramid-shaped concave indenter is divided by the contact projected area A _p (mm ² ) of the maximum test load F(N). H _IT =F/A _p (1) The conversion from the indentation hardness (indentation hardness) H _IT to the Vickers hardness HV follows the following formula (2). HV=H _IT ×0.0945 (2) The details of the method for measuring the Vickers hardness of the heat-sealing layer are as follows. Based on the nano-indentation method, the indenter can be pressed into the heat-sealing layer under the following specific conditions to measure the Vickers hardness of the heat-sealing layer. In addition, the measurement of the Vickers hardness by the nanoindentation method can be measured using Picodentor HM-500 by Fischer Instruments company. <Measurement conditions> ・Load load 0～0.27 mN (increase the load continuously, measure the hardness according to the indentation depth) ・Load application speed 0.27 mN/10 seconds ・Hold time 10 seconds ・Load unloading speed 0.27 mN/10 seconds ・Indenter Vickers (the opposite angle of the front end of the quadrangular pyramid is 136°) ・Measurement temperature 25℃±3℃ ・Change the measurement location, the average value of the part where N=30 and the maximum indentation depth h _max is 0.8 μm～1.0 μm

The heat seal layer comprises ethylene-vinyl acetate copolymer. When the heat-sealing layer contains the ethylene-vinyl acetate copolymer, the heat-sealing property and peelability to the carrier tape become favorable. Usually, the unevenness of the surface of the paper carrier tape is larger than that of the plastic carrier tape, it is difficult to heat seal the paired cover tape without unplanned peeling, and it is easy to peel off from the cover tape during installation. A cover tape having a heat-sealing layer comprising an ethylene-vinyl acetate copolymer can obtain good heat-sealing properties and good peelability even for paper carrier tapes. Ethylene-vinyl acetate copolymers can be modified and crosslinked.

The content of the ethylene-vinyl acetate copolymer in the heat-sealing layer may be, for example, 5% by mass or more, 10% by mass or more, or 15% by mass or more. Moreover, content of the said ethylene-vinyl acetate copolymer may be 100 mass % or less, 50 mass % or less, 40 mass % or less, or 30 mass % or less, for example.

The heat-sealing layer may contain other resins as long as it contains an ethylene-vinyl acetate copolymer. Examples of other resins include polyolefins such as polyethylene and polypropylene, polyesters, acrylic resins such as polyacrylates and polymethacrylates, and the like. These resins may also be modified. These resins can be used to adjust the Vickers hardness of the heat-sealing layer.

In the heat-sealing layer, for example, additives such as tackifiers, antistatic agents, antiblocking agents, dispersants, fillers, plasticizers, and coloring agents may be contained as necessary. These additives can be used to adjust the Vickers hardness of the heat-sealing layer. When adding an antistatic agent to a heat-sealing layer, the addition amount can be made into the value required for the surface resistance of the cover tape of this invention to fall in the numerical value range mentioned later.

The thickness of the heat-sealing layer can be set to, for example, not less than 0.05 μm and not more than 50 μm. In the case of a paper carrier tape, the thickness of the heat-sealing layer may be, for example, not less than 5 μm and not more than 50 μm, or may be not less than 10 μm and not more than 25 μm. In the case of a plastic carrier tape, the thickness of the heat-sealing layer may be, for example, not less than 0.05 μm and not more than 10 μm, or may be not less than 0.1 μm and not more than 5 μm. When the thickness of the heat-sealing layer is too thin, a uniform film may not be obtained. Moreover, when the thickness of a heat-sealing layer is too thick, the transparency of a cover tape may fall, or the heat-sealing property to a carrier tape may fall.

As a method of forming the heat-sealing layer, for example, the method of using a composition for a heat-sealing layer obtained by dispersing or dissolving an ethylene-vinyl acetate copolymer and, if necessary, the above-mentioned other resins or additives, etc. in a solvent, on a base One side of the material layer was coated with the above-mentioned composition for a heat seal layer and dried. Examples of coating methods for the composition for the heat seal layer include roll coating, reverse roll coating, gravure coating, gravure reverse coating, chipped wheel coating, and bar coating. , wire bar coating method, rod coating method, contact coating method, knife coating method, die coating method, flow coating method, dip coating method, spray coating method and other known coating methods.

Also, a film may be used as the heat-sealing layer. In this case, the lamination method of the base material layer and the heat-sealing layer is not particularly limited, and a known method can be used. For example, a method of laminating a pre-manufactured film to a base layer with an adhesive, or a method of extruding a thermally fused film raw material onto a base layer using a T-die or the like to obtain a laminate. As an adhesive agent, a polyester adhesive agent, a polyurethane adhesive agent, an acrylic adhesive agent etc. can be used, for example.

2. Antistatic layer The antistatic layer in the present invention is disposed on the side of the substrate layer opposite to the side of the heat-sealing layer, and contains conductive polymers to prevent the charged layer from being covered. By having an antistatic layer, it is possible to prevent dirt or dust from adhering to the surface of the cover tape due to static electricity, or to prevent static electricity from being in contact with other surfaces.

Examples of conductive polymers include polythiophene, polyaniline, polypyrrole, polyacetylene, poly(paraphenylene), polyphenylene vinylene, polyvinylcarbazole, and the like. Among them, the conductive polymer is preferably one or more selected from the group consisting of polythiophene, polyaniline, and polypyrrole. This is because sufficient antistatic properties and transparency independent of humidity can be obtained. As polythiophene, for example, PEDOT/PSS (poly(3,4-ethylenedioxythiophene/polystyrenesulfonic acid) is preferably used. As polyaniline, for example, sulfonated polyaniline is preferably used.

The content of the conductive polymer in the antistatic layer can be set to a value required to make the surface resistance of the cover tape of the present invention fall within the numerical range described later.

The antistatic layer contains a conductive polymer as an essential component, but may contain an antistatic agent other than the conductive polymer.

In addition, the antistatic layer may contain resin.

The thickness of the antistatic layer can be set to a value required to make the surface resistance of the cover tape of the present invention fall within the numerical range described later.

As a method for forming the antistatic layer, for example, the method of coating the antistatic layer on the other side of the substrate layer using a composition for an antistatic layer obtained by dispersing or dissolving a conductive polymer etc. in a solvent Apply composition and allow to dry. Examples of coating methods for the antistatic layer composition include air knife coating, blade coating, knife coating, rod coating, and rod coating. Known coating methods such as coating method, direct roll coating method, reverse roll coating method, gravure coating method, inclined plate coating method, etc.

The thickness of the antistatic layer can be set to, for example, not less than 0.03 μm and not more than 5 μm.

3. Substrate layer The substrate layer in the present invention is a layer supporting the above-mentioned heat-sealing layer or antistatic layer.

As the base layer, various materials can be used as long as they have mechanical strength to withstand external forces during storage and transportation, or heat resistance to withstand manufacturing and tape packaging. For example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalate Diformic acid-cyclohexanedimethanol-ethylene glycol copolymer and other polyesters; nylon 6, nylon 66, nylon 610 and other polyamides; polyethylene, polypropylene, polymethylpentene and other polyolefins, etc. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are better in terms of cost and mechanical strength, and therefore are preferably used.

Moreover, additives, such as a filler, a plasticizer, a coloring agent, and an antistatic agent, can also be contained in a base material layer as needed.

The substrate layer may be a single layer or a laminate of multiple layers of the same type or different types. In addition, the base material layer may be a stretched film or an unstretched film. Here, for the purpose of improving the strength, the base material layer may be a film stretched in a uniaxial direction or a biaxial direction.

The thickness of the substrate layer may be, for example, from 2.5 μm to 300 μm, from 6 μm to 100 μm, or from 12 μm to 50 μm. If the thickness of the base layer is too thick, the heat-sealing temperature at the time of tape packaging may become high, which is also disadvantageous in terms of cost. Moreover, when the thickness of a base material layer is too thin, mechanical strength may become insufficient.

The substrate layer can also be implemented such as corona discharge treatment, plasma treatment, ozone treatment, flame treatment, primer (also known as adhesion-promoting coating agent, adhesion promoter, easy-adhesive agent) coating treatment, preheating treatment , Dust removal treatment, evaporation treatment, alkali treatment, sand blasting treatment, etc. are easy to follow.

4. Base coat In the present invention, for example, as shown in FIG. 3 , an undercoat layer 5 may be arranged between the base material layer 2 and the heat-sealing layer 3 as needed. The adhesion between the base material layer and the heat-sealing layer can be improved by the undercoat layer. In addition, when the cover tape of the present invention is heat-sealed to the carrier tape by the undercoat layer, cushioning properties can be improved.

The material of the undercoat layer is appropriately selected according to the materials of the base material layer and the heat-sealing layer, and examples thereof include polyolefins such as polyethylene and polypropylene, polyurethane, and polyester.

The thickness of the undercoat layer can be set to, for example, not less than 5 μm and not more than 25 μm.

As an undercoat, films can be used. In this case, the lamination method of the base layer and the primer layer is not particularly limited, and a known method can be used. For example, a method of laminating a pre-manufactured film to a base layer with an adhesive, or a method of extruding a thermally fused film raw material onto a base layer using a T-die or the like to obtain a laminate. In addition, about an adhesive agent, it is the same as what was described in the said heat-sealing layer.

5. Cover tape As the surface resistance of the cover tape of the present invention, the surface resistance of the surface of the cover tape of the present invention on the side where the antistatic layer is disposed can be, for example, 1×10 ⁷ Ω/□ or more than 1×10 ¹³ Ω/□ □ Below. In addition, the surface resistance of the surface of the cover tape of the present invention on which the heat-sealing layer is arranged can be, for example, not less than 1×10 ⁷ Ω/□ and not more than 1×10 ¹³ Ω/□. In addition, the surface resistance of the surface of the cover tape of the present invention on which the antistatic layer is disposed and the surface resistance of the surface of the cover tape of the present invention on which the heat-sealing layer is disposed can be, for example, 1×10 ⁷ Ω/□ More than 1×10 ¹³ Ω/□ and less. If the surface resistance is too high, the diffusion effect of static electricity will be extremely reduced, and it will be difficult to protect electronic components from static electricity damage. Moreover, if the surface resistance is too low, the electronic component may be electrically broken by being energized from the outside through the cover tape for electronic component packaging.

The surface resistance was measured in accordance with IEC (International Electrotechnical Commission, International Electrotechnical Commission) 61340. Specifically, the measurement is performed in an environment of about 23° C. and about 40% RH. As a measuring device, for example, a digital ultra-high resistance/microcurrent meter 5450 (manufactured by ADC Corporation) can be used.

B. Package body The package of the present invention includes: a carrier tape having a plurality of storage sections for storing electronic components; an electronic component stored in the storage sections; and the cover tape arranged to cover the storage sections.

In this invention, by providing the said cover tape, when peeling a cover tape from a carrier tape, sticking of an electronic component to a cover tape can be suppressed. Therefore, it is possible to suppress jumping, lifting, and standing up of the electronic parts from the storage portion of the carrier tape due to the attachment of the electronic parts to the cover tape, and it is possible to take out the electronic parts normally. Therefore, mounting efficiency can be improved.

Fig. 2(a), (b) is a schematic plan view and cross-sectional view showing an example of the package of the present invention. 2(a) and (b) have already been described in the item "A. Electronic component packaging cover tape" above, so the description here is omitted.

Hereinafter, each structure of the package body of this invention is demonstrated.

1. Covering tape The cover tape in the present invention has already been described in the item "A. Cover tape for packaging electronic components" above, so the description here is omitted.

In the package of the present invention, the heat-seal layer of the cover tape and the carrier tape are bonded at the heat-sealed portion. The heat-sealed portion can be arranged, for example, at a part of the portion where the heat-sealed layer of the cover tape is in contact with the carrier tape. That is, the heat-sealing layer may have a heat-sealing portion and a non-heat-sealing portion. Thereby, the releasability of a cover tape with respect to a carrier tape can be made favorable.

2. Carrier tape The carrier tape in the present invention is a member having a plurality of storage portions for storing electronic components.

As the carrier tape, as long as it has a plurality of storage parts, for example, embossed carrier tape (also called embossed tape), perforated carrier tape (also called perforated tape), pressed carrier tape (also called is any one of the pressed belt). Among them, an embossed carrier tape is preferably used from the standpoint of cost, formability, dimensional accuracy, and the like.

As the material of the carrier tape, for example, polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, ABS (acrylonitrile-butadiene-styrene, acrylonitrile-butadiene-styrene) Plastic such as resin or paper, etc. Among them, the material of the carrier tape is preferably paper. That is, it is preferably a paper carrier tape made of paper. This is because paper carrier tapes are excellent in terms of cost, environmental load, and the like.

The thickness of the carrier tape is appropriately selected according to the material of the carrier tape or the thickness of the electronic parts. For example, the thickness of the carrier tape can be set to not less than 30 μm and not more than 1000 μm. If the thickness of the carrier tape is too thick, the formability will be deteriorated, and if the thickness of the carrier tape is too thin, the strength may be insufficient.

The carrier tape has a plurality of storage parts. The accommodating parts are usually arranged at predetermined intervals in the longitudinal direction of the carrier tape. The size, depth, pitch, and the like of the housing portion are appropriately adjusted according to the size, thickness, and the like of electronic components.

As a method of forming the carrier tape having the storage portion, a general carrier tape forming method can be applied, and it can be appropriately selected according to the type and material of the carrier tape. For example, press forming, vacuum forming, pressure forming, press processing, compression processing, etc. are mentioned.

3. Electronic parts The electronic components used in the package of the present invention are not particularly limited, and examples thereof include ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light-emitting diodes), liquid crystals, and piezoelectric elements. Registers, filters, crystal oscillators, crystal oscillators, connectors, switches, capacitors (volume), relays, etc. The form of IC is also not particularly limited.

4. Package body The packaging system of the present invention is used for storage and transportation of electronic parts. Electronic parts are stored and transported in a packaged state, and are provided for installation. When mounting, the cover tape is peeled off, and the electronic components stored in the storage portion of the carrier tape are taken out, and mounted on a substrate or the like.

In addition, this invention is not limited to the said embodiment. The above-mentioned embodiments are examples, and those having substantially the same configuration as the technical idea described in the claims of the present invention and exerting the same effects are included in the technical scope of the present invention. [Example]

Examples and comparative examples are shown below to describe the present invention in more detail.

[Example 1] As the substrate layer, a biaxially stretched polyethylene terephthalate film (manufactured by Futamura Chemical Co., FE2002, hereinafter referred to as "PET film") having a thickness of 25 μm subjected to corona treatment on both sides was prepared. An antistatic layer having a thickness of 0.05 μm was formed by coating the following composition A for an antistatic layer containing a conductive polymer on one side of the PET film. An undercoat layer having a thickness of 1 μm was formed by applying the following undercoat composition A on the side of the PET film opposite to the surface on which the antistatic layer was formed. A heat-sealing layer having a thickness of 25 μm was formed by melt-extruding the following composition A for a heat-sealing layer containing an ethylene-vinyl acetate copolymer on the side of the primer layer opposite to the PET film. Thereby, the cover tape of Example 1 was obtained. The obtained cover tape has a structure in which an antistatic layer including a conductive polymer, a substrate layer of a PET film, a primer layer, and a heat-sealing layer including an ethylene-vinyl acetate copolymer are laminated in this order.

(Composition A for antistatic layer) 100 parts by mass of a two-component curable antistatic coating agent (Aracoat AS601D (manufactured by Arakawa Chemical Industry Co., Ltd.)) having PEDOT/PSS as a conductive polymer, an acrylic monomer as a curing component, and an aziridine compound as a curing agent. 10 parts by mass of Aracoat CL910 (manufactured by Arakawa Chemical Industry Co., Ltd.).

(Composition A for Undercoating) Urethane-based thickening coating agent (a mixture of 30 parts by mass of Takenate A-3075 (manufactured by Mitsui Chemicals) and 100 parts by mass of Takelac A-3210 (manufactured by Mitsui Chemicals)).

(Composition A for heat seal layer) Polyolefin-based adhesive resin containing an ethylene-vinyl acetate copolymer (mixture of 90 parts by mass of Melthene M MX53C (manufactured by Tosoh) and 10 parts by mass of antiblocking agent BL15MB (manufactured by Tosoh)).

[Example 2] Except having used the following composition B for heat seal layers, it carried out similarly to Example 1, and produced the cover tape.

(Composition B for heat seal layer) Polyolefin-based adhesive resin containing an ethylene-vinyl acetate copolymer (mixture of 97 parts by mass of Melthene M MX53C (manufactured by Tosoh) and 3 parts by mass of antiblocking agent BL15MB (manufactured by Tosoh)).

[Comparative example 1] Except having used the following composition C for heat seal layers, it carried out similarly to Example 1, and produced the cover tape.

(Composition C for heat seal layer) Polyolefin-based adhesive resin containing ethylene-vinyl acetate copolymer (Melthene M MX53C, manufactured by Tosoh Corporation).

[evaluate] (Vickers hardness) Using the method described in the item "A. Cover tape for electronic component packaging 1. Heat seal layer", measure the Vickers hardness of the surface of the heat seal layer of the cover tape opposite to the base layer.

(surface resistance) The surface resistance of the cover tape was measured using the method described in the above item "A. Cover tape for electronic component packaging 5. Cover tape".

(number of abnormal behaviors) The number of electronic parts jumping out when the cover tape was peeled off from the package was measured as the number of behavioral abnormalities. On the one hand, 500 capacitors (GRM0222C1H220JA02, 0.22 pF, size 0402, manufactured by Murata Manufacturing Co., Ltd.) were continuously arranged as electronic parts in the cavity of a paper carrier tape (HP33M, manufactured by Hokuetsu Kishu Paper Co., Ltd.) with a width of 8 mm. The carrier tape was heat-sealed with a cover tape having a width of 5 mm, whereby a roll-shaped package was obtained. Store the package roll in a constant temperature and humidity laboratory at 60°C and 95%RH for 24 hours. Using a cover tape peeling device (intelligent feeder with a 7-inch reel holder, manufactured by FUJI Corporation), the cover tape was peeled off from the roll-shaped package after storage at a speed of 0.1 m/sec. The peeling is carried out in an environment of 25°C and 30%RH, and ends in 10 seconds. A high-speed camera (1000 frames/second, resolution 512×512, FASTCAM MC2.1, manufactured by Photron Corporation) was used to observe the behavior of the electronic parts during peeling. When peeling off, the situation where the electronic parts float from the cavity of the paper carrier tape, the situation where the electronic parts are rotated 90 degrees to stand up, and the situation where the electronic parts jump out of the cavity of the paper carrier tape are abnormal behaviors. , while playing the images captured by the high-speed camera in slow motion, while visually observing and counting the number of abnormal behaviors.

Table 1 shows the evaluation results of the cover tapes of Examples 1-3 and Comparative Example 1.

[Table 1]

As can be seen from Table 1, the number of abnormal behaviors of the cover tapes of Examples 1 and 2 in which the Vickers hardness of the heat-sealing layer is 2.0 or more when the cover tape is peeled from the package is compared with the Vickers hardness of the heat-sealing layer which is less than 2.0. The cover band of Example 1 is reduced. Furthermore, the surface resistance of the heat seal layer side and the surface resistance of the antistatic layer side of the cover tapes of Examples 1 and 2 and Comparative Example 1 were all the same value, which can be said to be good.

1: cover tape 2: Substrate layer 3: heat sealing layer 3h: heat sealing part 4: Antistatic layer 5: Base coat 10: Package body 11: Carrier tape 12: storage department 13:Electronic parts 14: Delivery hole

Fig. 1 is a schematic sectional view illustrating an example of a cover tape for packaging electronic components of the present invention. Fig. 2 (a), (b) is a schematic plan view and a cross-sectional view illustrating the packaging body of the present invention. Fig. 3 is a schematic sectional view illustrating an example of the cover tape for packaging electronic components of the present invention.

1: cover tape

2: Substrate layer

3: heat sealing layer

4: Antistatic layer

Claims (6)

A cover tape for packaging electronic parts, which has: substrate layer; A heat-sealing layer, which is disposed on one side of the above-mentioned substrate layer, comprises ethylene-vinyl acetate copolymer; and An antistatic layer, which is disposed on the side of the substrate layer opposite to the side of the heat-sealing layer, and includes a conductive polymer; and The Vickers hardness of the heat-sealing layer is 2.0 or more. The cover tape for electronic component packaging according to claim 1, wherein the heat-sealing layer comprises a modified ethylene-vinyl acetate copolymer or a cross-linked ethylene-vinyl acetate copolymer. The cover tape for packaging electronic parts as claimed in claim 1 or 2, wherein the heat-sealing layer contains a resin with higher heat resistance than the above-mentioned ethylene-vinyl acetate copolymer, and a resin with a higher storage elastic modulus than the above-mentioned ethylene-vinyl acetate copolymer. Resin, a resin having a density higher than the above-mentioned ethylene-vinyl acetate copolymer, or a cross-linked resin. The cover tape for packaging electronic components according to claim 1 or 2, wherein the heat-sealing layer contains particulate organic or inorganic substances. A kind of packaging body, it has: Carrier tape, which has a plurality of storage parts for storing electronic parts; Electronic parts, which are housed in the above-mentioned storage section; and The cover tape for packaging electronic components according to Claim 1 or 2, which is disposed so as to cover the above-mentioned accommodating portion. The package according to claim 5, wherein the above-mentioned carrier tape is a paper carrier tape.

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