JP6763421B2 - Cover tape and packaging for electronic component packaging - Google Patents

Description

The present disclosure relates to a cover tape for packaging electronic components and a package using the same.

In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric element registers have been taped and packaged for surface mounting. In taping packaging, after storing electronic parts in a carrier tape having a plurality of storage portions for storing electronic parts, the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic parts. Further, when mounting the electronic component, the cover tape is peeled off from the carrier tape, and the electronic component is automatically taken out and surface-mounted on the substrate. With regard to surface mounting of electronic components, the number of components tends to increase with the recent increase in high-speed communication and high-speed arithmetic processing of electronic devices, and further efficiency and speed of mounting are required. The cover tape is also called a top tape.

The cover tape is required to be easily peelable from the carrier tape. If the peeling strength of the cover tape is too strong, when the cover tape is peeled off from the carrier tape when mounting the electronic component, the carrier tape vibrates and the electronic component pops out from the storage part, or the cover tape breaks. There is a problem of chilling out. This is a particular problem when the cover tape is peeled off at high speed as the mounting speed increases.

Further, in taping packaging, in addition to the generation of static electricity due to friction or contact of electronic components with the carrier tape or cover tape, static electricity may be generated by peeling the cover tape from the carrier tape during mounting. The latter phenomenon is called exfoliation charging. The peeling charge increases as the peeling speed increases. Due to the peeling charge, the electronic component adheres to the cover tape at the time of mounting, and the electronic component cannot be taken out normally, or the electronic component pops out from the storage portion of the carrier tape. This leads to a decrease in mounting efficiency. Furthermore, static electricity may cause deterioration and destruction of electronic components.

Therefore, various cover tapes having antistatic properties have been proposed (see, for example, Patent Documents 1 to 3).

Patent No. 4162961 Japanese Unexamined Patent Publication No. 10-9548 Patent No. 4061136

However, the inventors of the present disclosure have found that even when an antistatic cover tape is used, electronic components may adhere to the cover tape.

The present disclosure has been made in view of the above problems, and an object of the present disclosure is to provide a cover tape for packaging electronic components, which can suppress adhesion of electronic components.

In one embodiment of the present disclosure, a heat-sealing layer arranged on one surface side of the base material layer and the base material layer and containing an ethylene-vinyl acetate copolymer, and the heat-sealing layer side of the base material layer. A cover tape for packaging electronic parts, which is arranged on the side opposite to the surface of the surface, has an antistatic layer containing a conductive polymer, and has a Vickers hardness of 2.0 or more of the heat seal layer. provide.

In one embodiment of the present disclosure, a carrier tape having a plurality of storage portions for storing electronic components, electronic components stored in the storage portions, and the electronic component packaging arranged so as to cover the storage portions. Provided is a packaging body comprising a cover tape for use.

In the present disclosure, it is possible to provide a cover tape for packaging electronic components, which can suppress the adhesion of electronic components.

It is the schematic sectional drawing which illustrates the cover tape for electronic component packaging of this disclosure. It is the schematic plan view and sectional drawing which illustrates the package body of this disclosure. It is the schematic sectional drawing which illustrates the cover tape for electronic component packaging of this disclosure.

An embodiment of the present disclosure will be described below with reference to the drawings and the like. However, the present disclosure can be implemented in many different embodiments and is not construed as limited to the description of the embodiments illustrated below. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual form, but this is just an example and the interpretation of the present disclosure is limited. It's not something to do. Further, in the present specification and each of the drawings, the same elements as those described above with respect to the above-described drawings may be designated by the same reference numerals, and detailed description thereof may be omitted as appropriate.

In the present specification, when expressing the mode of arranging another member on a certain member, when it is simply described as "above" or "below", it is in contact with a certain member unless otherwise specified. Including the case where another member is arranged directly above or directly below, and the case where another member is arranged above or below a certain member via another member. Further, in the present specification, when expressing the mode of arranging another member on the surface of a certain member, when simply expressing "on the surface side" or "on the surface", unless otherwise specified, the certain member is used. It includes both the case where another member is arranged directly above or directly below the member so as to be in contact with each other, and the case where another member is arranged above or below one member via another member.

Hereinafter, the cover tape for packaging electronic components and the packaging body of the present disclosure will be described in detail.

A. Cover tape for packaging electronic parts The cover tape for packaging electronic parts of the present disclosure includes a base material layer, a heat seal layer which is arranged on one surface side of the base material layer and contains an ethylene-vinyl acetate copolymer, and the above. The base material layer is arranged on the surface opposite to the surface on the heat-sealing layer side, has an antistatic layer containing a conductive polymer, and has a Vickers hardness of 2.0 or more. is there. In the present specification, the "cover tape for packaging electronic components" may be simply referred to as a "cover tape".

The cover tape of the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of the cover tape of the present disclosure. As shown in FIG. 1, the cover tape 1 of the present disclosure is arranged on one surface side of the base material layer 2 and the base material layer 2, and contains a heat seal layer 3 containing an ethylene-vinyl acetate copolymer and a base. The material layer 2 has an antistatic layer 4 which is arranged on the surface opposite to the surface on the heat seal layer 3 side and contains a conductive polymer. The heat seal layer 3 has a Vickers hardness within a predetermined range.

2 (a) and 2 (b) are schematic plan views and cross-sectional views showing an example of a package using the cover tape for packaging electronic components of the present disclosure, and FIG. 2 (b) is A of FIG. 2 (a). -A line sectional view. As shown in FIGS. 2A and 2B, the package 10 stores the carrier tape 11 having a plurality of storage portions 12 for storing the electronic parts 13, the electronic parts 13 stored in the storage parts 12, and the electronic parts 13. A cover tape 1 arranged so as to cover the portion 12 is provided. The cover tape 1 is heat-sealed on the carrier tape 11, and heat-sealing portions 3h are provided on both ends of the heat-sealing layer 3 of the cover tape 1 in a line shape with a predetermined width. Further, in the package 10, the carrier tape 11 can have a feed hole 14.

The inventors of the present disclosure first describe that a cover tape having an antistatic layer containing a conductive polymer and a heat-sealing layer containing an ethylene-vinyl acetate copolymer has good antistatic properties and heat-sealing properties. It was found that it also has peelability. However, it has been found that even when a cover tape having good antistatic properties is used, electronic components may adhere to the cover tape. As a result of diligent studies to solve the above problems, the inventors of the present disclosure have found that not only static electricity but also the hardness of the heat seal layer of the cover tape is used to adhere the electronic components to the cover tape. It was found to have an effect. Further studies have been carried out, and it has been found that the adhesion of electronic components to the cover tape can be suppressed by setting the hardness of the heat seal layer containing the ethylene-vinyl acetate copolymer within a predetermined range.

The reason why the adhesion of electronic components to the cover tape can be suppressed by setting the hardness of the heat seal layer of the cover tape within a predetermined range is not clear, but it is presumed as follows. Vickers hardness is a type of indentation hardness. In the present disclosure, the heat seal layer of the cover tape has a Vickers hardness of a predetermined value or more, and is a relatively hard layer. Therefore, in the package using the cover tape of the present disclosure, when the electronic component comes into contact with the heat seal layer of the cover tape during the production of the package or the storage or transportation of the package, the heat seal layer of the cover tape is used. Is presumed to be difficult to follow the contact surface of the electronic component, that is, it is difficult for the electronic component to sink into the heat seal layer of the cover tape. Therefore, in the package using the cover tape of the present disclosure, it is presumed that when the cover tape is peeled off from the carrier tape, the electronic components can be prevented from sticking to the heat seal layer of the cover tape.

On the other hand, if the heat-sealing layer of the cover tape is a relatively soft layer, when the electronic component comes into contact with the heat-sealing layer of the cover tape, the heat-sealing layer of the cover tape easily follows the contact surface of the electronic component. That is, the electronic component easily sinks into the heat seal layer of the cover tape. Therefore, even when the cover tape has antistatic properties, it is considered that the cover tape is attached to the electronic component to the heat seal layer.

If it is not necessary to consider the heat sealability and peelability of the cover tape, it is conceivable to select the material of the heat seal layer with priority given to the viewpoint of making it difficult for electronic components to adhere. However, in the cover tape of the present disclosure, the Vickers hardness of the heat seal layer is set to a predetermined value or more while using a heat seal layer containing an ethylene-vinyl acetate copolymer in order to improve the heat seal property and the peelability. It is important to. In general, ethylene-vinyl acetate copolymers tend to make the layers relatively soft, so electronic components tend to stick to layers containing ethylene-vinyl acetate copolymers, but heat seals. By setting the Vickers hardness of the layer to a predetermined value or more, it is possible to prevent the electronic components from sticking to each other.

When the antistatic property of the cover tape is insufficient, the contribution of adhesion due to static electricity is large, so that the effect of setting the Vickers hardness of the heat seal layer to a predetermined value or more is limited. Therefore, in addition to setting the Vickers hardness of the heat-sealed layer containing the ethylene-vinyl acetate copolymer to a predetermined value or more, a conductive polymer is contained on the surface side of the base material layer opposite to the heat-sealed layer. It is important to have an antistatic layer. Since the antistatic layer containing the conductive polymer is not easily affected by temperature and humidity and stable antistatic performance can be obtained, the effect of setting the Vickers hardness of the heat seal layer to a predetermined value or more is effective. Easy to enjoy. Further, since the antistatic layer containing the conductive polymer can generally have a thinner layer than the antistatic layer containing other antistatic agents, the effect on the heat sealing performance is small. Since the paper carrier tape has poor heat sealability and peelability as compared with the plastic carrier tape, it is particularly important to suppress the influence on the heat seal performance when the paper carrier tape is used. Further, the conductive polymer is unlikely to cause a so-called bleed-out phenomenon in which it is precipitated from the inside of the layer to the surface side of the layer over time. Therefore, by using an antistatic layer containing a conductive polymer in a cover tape having a heat-sealing layer containing an ethylene-vinyl acetate copolymer, the surface of the paper carrier tape and the surface of the antistatic layer of the cover tape are used in the package. It is possible to prevent the antistatic agent from being set off when it comes into contact with the sheet, and the peeling performance from being lowered.

Further, in order to improve the antistatic property of the cover tape, it is conceivable to add an antistatic agent to the heat seal layer. When an ethylene-vinyl acetate copolymer is used for the heat-seal layer, a nonionic surfactant or a relatively polar agent is used in order to suppress the influence on the heat-seal performance and the bleed-out phenomenon. Low ionic activators can be used. Since the paper carrier tape has poor heat sealability and peelability as compared with the plastic carrier tape, it is particularly important to suppress the influence on the heat seal performance when the paper carrier tape is used. However, a nonionic surfactant or an ionic surfactant having a relatively low polarity tends to stay inside the layer and the bleed-out phenomenon is unlikely to occur, but the antistatic performance may be difficult to be exhibited. Therefore, by having an antistatic layer containing a conductive polymer on the surface side of the base material layer opposite to the heat seal layer, the antistatic property of the cover tape can be improved. In addition to using an antistatic layer containing a conductive polymer on the surface side of the base material layer opposite to the heat seal layer, an antistatic agent is added to the heat seal layer to prevent the cover tape from being charged. The sex can be further improved.

As described above, in the present disclosure, in the cover tape having the antistatic layer containing the conductive polymer and the heat seal layer containing the ethylene-vinyl acetate copolymer, the Vickers hardness of the heat seal layer is equal to or higher than a predetermined value. Therefore, in the package using the cover tape of the present disclosure, it is possible to suppress sticking of electronic parts to the cover tape when the cover tape is peeled from the carrier tape. Therefore, it is possible to prevent the electronic components from popping out, floating, standing, etc. from the carrier tape storage portion due to the attachment of the electronic components to the cover tape, and the electronic components can be taken out normally. Therefore, it is possible to improve the mounting efficiency.

Hereinafter, each configuration of the cover tape of the present disclosure will be described.

1. 1. Heat-seal layer The heat-seal layer in the present disclosure is a layer arranged on one surface side of the base material layer and containing an ethylene-vinyl acetate copolymer. When the package is manufactured by using the cover tape of the present disclosure, the heat seal layer is heat-sealed against the carrier tape, so that the cover tape and the carrier tape are adhered to each other.

The Vickers hardness of the heat seal layer is 2.0 or more. When the Vickers hardness is in the above range, it is possible to prevent the electronic components from sticking to the cover tape. The Vickers hardness of the heat seal layer may be 2.3 or more, or 2.6 or more. The upper limit of the Vickers hardness of the heat seal layer is not particularly limited, but may be, for example, 6.0 or less, and may be 5.5 or less. If the Vickers hardness is too high, the heat-sealing property may be deteriorated, and when the cover tape is rolled, it may not be wound neatly or the heat-sealing layer may be cracked.

The Vickers hardness of the heat seal layer can be adjusted by the type and content of the material used for the heat seal layer. The heat-sealed layer in the present disclosure may obtain a desired Vickers hardness only with an ethylene-vinyl acetate copolymer. For example, an ethylene-vinyl acetate copolymer that gives the desired Vickers hardness can be used. However, it is generally known that the ethylene-vinyl acetate copolymer has good flexibility among resins. Therefore, by using a modified ethylene-vinyl acetate copolymer or a crosslinked ethylene-vinyl acetate copolymer, the Vickers hardness of the heat-sealed layer can be increased to obtain a desired Vickers hardness. .. Alternatively, by using an ethylene-vinyl acetate copolymer and an organic substance or an inorganic substance harder than the ethylene-vinyl acetate copolymer, the Vickers hardness of the heat seal layer is increased to obtain a desired Vickers hardness. Can be done. As organic substances harder than ethylene-vinyl acetate copolymer, generally, a resin having higher heat resistance than ethylene-vinyl acetate copolymer, a resin having higher storage elasticity than ethylene-vinyl acetate copolymer, and ethylene-acetic acid Examples thereof include resins having a higher density than vinyl copolymers and crosslinked resins. These organic substances and inorganic substances may exist in the form of particles in the heat-sealed layer, or may exist in a compatible or incompatible state with the ethylene-vinyl acetate copolymer.

The Vickers hardness of the heat seal layer in the present disclosure is the Vickers hardness by the nanoindentation method. As a specific method for measuring Vickers hardness (non-dimensional) by the nanoindentation method of the heat seal layer, a diamond having a facing angle of 136 ° from the direction perpendicular to the surface of the heat seal layer opposite to the base material layer. push the Vickers indenter regular quadrangular pyramid shape, resulting load - indentation hardness from the displacement curve (indentation hardness) calculates H _IT, further indentation hardness (the indentation hardness) H _IT to Vickers hardness HV The average obtained by converting and calculating this for 30 places is taken as the Vickers hardness of the heat seal layer. More specifically, the indentation hardness (indentation hardness) _HIT is a pyramid-shaped indentation indenter formed by indentation at the maximum indentation depth h _max of the Vickers indenter, as shown in the following equation (1). It is obtained by calculating the contact projected area _Ap (mm ² ) of and dividing the test maximum load F (N).
H _IT = F / _Ap (1)
Also, in terms of indentation hardness (indentation _hardness) from _{H IT} to Vickers hardness HV is in accordance with the following equation (2).
HV = H _IT x 0.0945 (2)
The details of the method for measuring the Vickers hardness of the heat seal layer are as follows. Based on the nanoindentation method, the Vickers hardness of the heat seal layer can be measured by pressing an indenter into the heat seal layer under the following specific conditions. The Vickers hardness by the nanoindentation method can be measured by using a picodenter HM-500 manufactured by Fisher Instruments.
<Measurement conditions>
・ Load load 0 to 0.27 mN (Continuously increase the load and measure the hardness from the pushing depth)
・ Load application speed 0.27mN / 10 seconds ・ Holding time 10 seconds ・ Load unloading speed 0.27mN / 10 seconds ・ Indenter Vickers (face-to-face angle 136 ° at the tip of a quadrangular pyramid)
・ Measurement temperature 25 ℃ ± 3 ℃
・ The average value of the points where the measurement point is changed and N = 30 and the maximum pushing depth h _max is 0.8 μm to 1.0 μm.

The heat seal layer contains an ethylene-vinyl acetate copolymer. When the heat-sealing layer contains an ethylene-vinyl acetate copolymer, the heat-sealing property and the peelability with respect to the carrier tape are improved. In general, the paper carrier tape has a larger surface unevenness than the plastic carrier tape, and it is difficult to easily peel off the cover tape at the time of mounting while heat-sealing the cover tape so as not to cause unintended peeling. A cover tape having a heat-sealing layer containing an ethylene-vinyl acetate copolymer can obtain good heat-sealing properties and good peeling properties even for paper carrier tapes. The ethylene-vinyl acetate copolymer may be modified or crosslinked.

The content of the ethylene-vinyl acetate copolymer in the heat-sealed layer can be, for example, 5% by mass or more, 10% by mass or more, or 15% by mass or more. The content of the ethylene-vinyl acetate copolymer can be, for example, 100% by mass or less, 50% by mass or less, 40% by mass or less, or 30% by mass or less.

The heat-sealed layer may contain other resins as long as it contains an ethylene-vinyl acetate copolymer. Examples of other resins include polyolefins such as polyethylene and polypropylene, and acrylics such as polyester, polyacrylic acid ester and polymethacrylic acid ester. These resins may be modified. These resins can be used to adjust the Vickers hardness of the heat seal layer.

If necessary, the heat seal layer may contain additives such as a tackifier, an antistatic agent, an antiblocking agent, a dispersant, a filler, a plasticizer, and a colorant. These additives can be used to adjust the Vickers hardness of the heat seal layer. When an antistatic agent is added to the heat seal layer, the amount of the antistatic agent added can be a value necessary for the surface resistance of the cover tape of the present disclosure to fall within the numerical range described later.

The thickness of the heat seal layer can be, for example, 0.05 μm or more and 50 μm or less. In the case of paper carrier tape, the thickness of the heat seal layer can be, for example, 5 μm or more and 50 μm or less, and may be 10 μm or more and 25 μm or less. In the case of the plastic carrier tape, the thickness of the heat seal layer can be, for example, 0.05 μm or more and 10 μm or less, and may be 0.1 μm or more and 5 μm or less. If the thickness of the heat seal layer is too thin, a uniform film may not be obtained. Further, if the thickness of the heat seal layer is too thick, the transparency of the cover tape may be lowered, or the heat seal property to the carrier tape may be lowered.

As a method for forming the heat-seal layer, for example, a composition for a heat-seal layer in which an ethylene-vinyl acetate copolymer and, if necessary, other resins and additives described above are dispersed or dissolved in a solvent is used as a base material. Examples thereof include a method in which the composition for a heat seal layer is applied to one surface side of the layer and dried. Examples of the method for applying the heat seal layer composition include roll coat, reverse roll coat, gravure coat, gravure reverse coat, comma coat, bar coat, wire bar coat, rod coat, kiss coat, knife coat, die coat, and the like. Known coating methods such as flow coat, dip coat, and spray coat can be mentioned.

Further, a film can be used as the heat seal layer. In this case, the method of laminating the base material layer and the heat seal layer is not particularly limited, and a known method can be used. For example, a method of laminating a film produced in advance to a base material layer with an adhesive, a method of extruding a raw material of a heat-melted film onto a base material layer with a T-die or the like, and the like to obtain a laminate. As the adhesive, for example, a polyester-based adhesive, a polyurethane-based adhesive, an acrylic-based adhesive, or the like can be used.

2. 2. Antistatic layer The antistatic layer in the present disclosure is arranged on the surface opposite to the surface of the base material layer on the heat seal layer side, contains a conductive polymer, and prevents the cover tape from being charged. Layer. By having the antistatic layer, it is possible to prevent static electricity from adhering to the surface of the cover tape due to static electricity, and to prevent the generation of static electricity due to contact with other surfaces.

Examples of the conductive polymer include polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, polyvinylcarbazole and the like. Among them, the conductive polymer is preferably one or more selected from the group consisting of polythiophene, polyaniline and polypyrrole. This is because sufficient antistatic properties and transparency that do not depend on humidity can be obtained. As the polythiophene, for example, PEDOT / PSS (poly (3,4-ethylenedioxythiophene / polystyrene sulfonic acid)) is preferably used. As the polyaniline, for example, sulfonated polyaniline is preferably used.

The content of the conductive polymer in the antistatic layer can be a value necessary for the surface resistance of the cover tape of the present disclosure to fall within the numerical range described later.

The antistatic layer contains a conductive polymer as an essential component, but may contain an antistatic agent other than the conductive polymer.

Further, the antistatic layer may contain a resin.

The thickness of the antistatic layer can be a value required for the surface resistance of the cover tape of the present disclosure to fall within the numerical range described later.

As a method for forming the antistatic layer, for example, a composition for an antistatic layer in which a conductive polymer or the like is dispersed or dissolved in a solvent is used, and the composition for an antistatic layer is applied to the other surface side of the base material layer. Then, there is a method of drying. As a method for applying the composition for the antistatic layer, for example, known application methods such as air doctor, blade coat, knife coat, rod coat, bar coat, direct roll coat, reverse roll coat, gravure coat, slide coat and the like are used. Can be mentioned.

The thickness of the antistatic layer can be, for example, 0.03 μm or more and 5 μm or less.

3. 3. Base material layer The base material layer in the present disclosure is a layer that supports the above-mentioned heat seal layer and antistatic layer.

As the base material layer, various materials can be applied as long as it has mechanical strength to withstand external forces during storage and transportation, heat resistance to withstand manufacturing and taping packaging, and the like. For example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymers, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymers, and polyamides such as nylon 6, nylon 66 and nylon 610. Examples thereof include polyolefins such as polyethylene, polypropylene, and polymethylpentene. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are preferably used because of their good cost and mechanical strength.

Further, the base material layer may contain additives such as a filler, a plasticizer, a colorant, and an antistatic agent, if necessary.

The base material layer may be a single layer, or may be a laminate of a plurality of layers of the same type or different types. Further, the base material layer may be a stretched film or an unstretched film. Above all, the base material layer may be a film stretched in the uniaxial direction or the biaxial direction for the purpose of improving the strength.

The thickness of the base material layer can be, for example, 2.5 μm or more and 300 μm or less, 6 μm or more and 100 μm or less, or 12 μm or more and 50 μm or less. If the thickness of the base material layer is too thick, the heat sealing temperature at the time of taping packaging may become high, which is disadvantageous in terms of cost. Further, if the thickness of the base material layer is too thin, the mechanical strength may be insufficient.

The base material layer is, for example, corona discharge treatment, plasma treatment, ozone treatment, frame treatment, primer (also called anchor coat, adhesion accelerator, easy-adhesive) coating treatment, preheat treatment, dust removal treatment, vapor deposition treatment, alkali treatment, etc. Easy-adhesion treatment such as sandblasting may be performed.

4. Primer layer In the present disclosure, for example, as shown in FIG. 3, a primer layer 5 may be arranged between the base material layer 2 and the heat seal layer 3, if necessary. The primer layer can improve the adhesion between the base material layer and the heat seal layer. Further, the primer layer can improve the cushioning property when the cover tape of the present disclosure is heat-sealed to the carrier tape.

The material of the primer layer is appropriately selected depending on the material of the base material layer and the heat seal layer, and examples thereof include polyolefins such as polyethylene and polypropylene, polyurethane, polyester and the like.

The thickness of the primer layer can be, for example, 5 μm or more and 25 μm or less.

A film can be used as the primer layer. In this case, the method of laminating the base material layer and the primer layer is not particularly limited, and a known method can be used. For example, a method of laminating a film produced in advance to a base material layer with an adhesive, a method of extruding a raw material of a heat-melted film onto a base material layer with a T-die or the like, and the like to obtain a laminate. The adhesive is the same as that described in the section of the heat seal layer.

5. Cover tape As the surface resistance of the cover tape of the present disclosure, the surface resistance of the surface of the cover tape of the present disclosure on the side where the antistatic layer is arranged is, for example, 1 × 10 ⁷ Ω / □ or more and 1 × 10 ¹³ Ω /. □ It can be as follows. Further, the surface resistance of the surface of the cover tape of the present disclosure on the side on which the heat seal layer is arranged can be, for example, 1 × 10 ⁷ Ω / □ or more and 1 × 10 ¹³ Ω / □ or less. Further, the surface resistance of the surface of the cover tape of the present disclosure on the side where the antistatic layer is arranged and the surface resistance of the surface of the cover tape of the present disclosure on the side where the heat seal layer is arranged are, for example, 1 × 10 ^7. It can be Ω / □ or more and 1 × 10 ¹³ Ω / □ or less. If the surface resistance is too high, the effect of diffusing static electricity will be extremely reduced, and it may be difficult to protect electronic components from static electricity destruction. Further, if the surface resistance is too low, the electronic component is energized from the outside via the cover tape for packaging the electronic component, which may be electrically destroyed.

Surface resistance is measured according to IEC61340. Specifically, the measurement is performed in an environment of about 23 ° C. and about 40% RH. As the measuring instrument, for example, a digital ultra-high resistance / micro ammeter 5450 (manufactured by ADC) can be used.

B. Packaging Body The packaging body of the present disclosure includes a carrier tape having a plurality of storage portions for storing electronic parts, electronic parts stored in the storage parts, and the above-mentioned cover tape arranged so as to cover the storage parts. And.

In the present disclosure, by providing the above-mentioned cover tape, it is possible to suppress sticking of electronic components to the cover tape when the cover tape is peeled from the carrier tape. Therefore, it is possible to prevent the electronic components from popping out, floating, standing, etc. from the carrier tape storage portion due to the attachment of the electronic components to the cover tape, and the electronic components can be taken out normally. Therefore, it is possible to improve the mounting efficiency.

2 (a) and 2 (b) are schematic plan views and cross-sectional views showing an example of the package of the present disclosure. Note that FIGS. 2 (a) and 2 (b) have been described in the above section "A. Cover tape for packaging electronic components", and thus the description thereof will be omitted here.

Hereinafter, each configuration of the package of the present disclosure will be described.

1. 1. Cover tape The cover tape in the present disclosure has been described in the above section "A. Cover tape for packaging electronic components", and thus the description thereof is omitted here.

In the package of the present disclosure, the heat seal layer of the cover tape and the carrier tape are adhered to each other at the heat seal portion. The heat-sealing portion can be arranged, for example, in a part of the portion where the heat-sealing layer of the cover tape comes into contact with the carrier tape. That is, the heat seal layer may have a heat seal portion and a non-heat seal portion. Thereby, the peelability of the cover tape with respect to the carrier tape can be improved.

2. 2. Carrier Tape The carrier tape in the present disclosure is a member having a plurality of storage portions for storing electronic components.

The carrier tape may have a plurality of storage portions, and may be, for example, an embossed carrier tape (also referred to as embossed tape), a punch carrier tape (also referred to as punch tape), or a press carrier tape (press). Any of the tapes) can be used. Above all, the embossed carrier tape is preferably used from the viewpoint of cost, moldability, dimensional accuracy and the like.

Examples of the material of the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and paper. Above all, the material of the carrier tape is preferably paper. That is, a paper carrier tape made of paper is preferable. This is because the paper carrier tape is excellent in terms of cost, environmental load, and the like.

The thickness of the carrier tape is appropriately selected according to the material of the carrier tape, the thickness of the electronic component, and the like. For example, the thickness of the carrier tape can be 30 μm or more and 1000 μm or less. If the thickness of the carrier tape is too thick, the moldability is deteriorated, and if the thickness of the carrier tape is too thin, the strength may be insufficient.

The carrier tape has a plurality of storage portions. The storage portions are usually arranged at predetermined intervals in the longitudinal direction of the carrier tape. The size, depth, pitch, etc. of the storage portion are appropriately adjusted according to the size, thickness, etc. of the electronic component.

As a method for forming the carrier tape having the accommodating portion, a general method for forming the carrier tape can be applied, and the carrier tape is appropriately selected according to the type and material of the carrier tape. For example, press molding, vacuum forming, pressure forming, punching, compression and the like can be mentioned.

3. 3. Electronic components The electronic components used in the packaging of the present disclosure are not particularly limited, and include, for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element registers, filters, and crystal oscillators. Examples include children, crystal oscillators, connectors, switches, volumes, relays, and the like. The format of the IC is also not particularly limited.

4. Packaging The packaging of this disclosure is used for the storage and transportation of electronic components. Electronic components are stored and transported in their packaging for mounting. At the time of mounting, the cover tape is peeled off, the electronic components stored in the carrier tape storage portion are taken out, and the electronic components are mounted on a substrate or the like.

The present disclosure is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same structure as the technical idea described in the claims of the present disclosure and exhibiting the same action and effect is described in this invention. Included in the technical scope of disclosure.

Examples and comparative examples are shown below, and the present disclosure will be described in more detail.

[Example 1]
As a base material layer, a 25 μm-thick biaxially stretched polyethylene terephthalate film (manufactured by Futamura Chemical Co., Ltd., FE2002, hereinafter referred to as “PET film”) having corona treatment on both sides was prepared. An antistatic layer having a thickness of 0.05 μm was formed by applying the composition A for an antistatic layer containing the following conductive polymer to one surface side of the PET film. A primer layer having a thickness of 1 μm was formed by applying the following composition A for a primer layer on the side of the PET film opposite to the surface on which the antistatic layer was formed. A heat seal layer having a thickness of 25 μm was formed by melt-extruding the composition A for a heat seal layer containing the following ethylene-vinyl acetate copolymer on the surface side of the primer layer opposite to the PET film. As a result, the cover tape of Example 1 was obtained. The obtained cover tape has a structure in which an antistatic layer containing a conductive polymer, a base material layer of a PET film, a primer layer, and a heat seal layer containing an ethylene-vinyl acetate copolymer are laminated in this order. Was there.

(Composition A for Antistatic Layer)
100 parts by mass of a two-component curable antistatic coating agent (Aracoat AS601D (manufactured by Arakawa Chemical Industry Co., Ltd.)) having PEDOT / PSS as a conductive polymer, acrylic monomer as a curing component, and an aziridine compound as a curing agent, and Aracoat CL910 (Arakawa) (Made by Chemical Industry Co., Ltd.) Mixture with 10 parts by mass).

(Composition A for primer layer)
Urethane-based anchor coating agent (mixture of 30 parts by mass of Takenate A-3075 (manufactured by Mitsui Chemicals) and 100 parts by mass of Takelac A-3210 (manufactured by Mitsui Chemicals)).

(Composition A for heat seal layer)
A polyolefin-based adhesive resin containing an ethylene-vinyl acetate copolymer (a mixture of 90 parts by mass of Melsen MX53C (manufactured by Tosoh Corporation) and 10 parts by mass of an antiblocking agent BL15MB (manufactured by Tosoh Corporation)).

[Example 2]
A cover tape was produced in the same manner as in Example 1 except that the composition B for the heat seal layer described below was used.

(Composition B for heat seal layer)
A polyolefin-based adhesive resin containing an ethylene-vinyl acetate copolymer (a mixture of 97 parts by mass of Mercen MX53C (manufactured by Tosoh Corporation) and 3 parts by mass of an antiblocking agent BL15MB (manufactured by Tosoh Corporation)).

[Comparative Example 1]
A cover tape was produced in the same manner as in Example 1 except that the composition C for the heat seal layer described below was used.

(Composition C for heat seal layer)
Polyolefin-based adhesive resin containing an ethylene-vinyl acetate copolymer (Mersen M MX53C, manufactured by Tosoh Corporation).

[Evaluation]
(Vickers hardness)
The Vickers hardness of the surface of the cover tape on the side opposite to the base material layer of the heat seal layer was measured by the method described in the above section "A. Cover tape for packaging electronic components 1. Heat seal layer".

(Surface resistance)
The surface resistance of the cover tape was measured by the method described in the above section "A. Cover tape for packaging electronic components 5. Cover tape".

(Number of abnormal behavior)
The number of electronic components that popped out when the cover tape was peeled off from the package was measured as the number of abnormal behavior. As electronic components, 500 capacitors (GRM0222C1H220JA02, 0.22pF 0402 size, manufactured by Murata Manufacturing Co., Ltd.) are continuously arranged in the cavity of a paper carrier tape (HP33M, manufactured by Hokuetsu Kishu Paper Co., Ltd.) with a width of 8 mm, and the paper carrier tape A roll-shaped package was obtained by heat-sealing a cover tape having a width of 5 mm. The roll of the package was stored in a constant temperature and humidity test room at 60 ° C. and 95% RH for 24 hours. The cover tape was peeled off from the rolled package after storage at a speed of 0.1 m / sec using a cover tape peeling device (intelligent feeder with a 7-inch reel holder, manufactured by FUJI). The peeling was performed in an environment of 25 ° C. and 30% RH, and was completed in 10 seconds. The behavior of the electronic component at the time of peeling was observed with a high-speed camera (1000 frames / sec, resolution 512 × 512, FASTCAM MC2.1, manufactured by Photron). Abnormal behavior when the electronic component is lifted from the cavity of the paper carrier tape above the upper surface of the paper carrier tape, when the electronic component is rotated 90 degrees and stands up, or when the electronic component pops out from the cavity of the paper carrier tape during peeling. As a result, the number of abnormal behaviors was counted visually while playing back the images taken by the high-speed camera in slow motion.

Table 1 shows the evaluation results of the cover tapes of Examples 1 to 3 and Comparative Example 1.

From Table 1, in the cover tapes of Examples 1 and 2 in which the Vickers hardness of the heat seal layer is 2.0 or more, the number of abnormal behaviors when the cover tape is peeled from the package is the Vickers hardness of the heat seal layer. It can be seen that the amount is less than 2.0 as compared with the cover tape of Comparative Example 1. The surface resistance of the cover tapes of Examples 1 and 2 and Comparative Example 1 on the heat seal layer side and the surface resistance on the antistatic layer side are the same values and can be said to be good.

1 ... Cover tape 2 ... Base material layer 3 ... Heat seal layer 4 ... Antistatic layer 5 ... Primer layer 10 ... Package 11 ... Carrier tape 12 ... Storage 13 ... Electronic components

Claims (6)

Base layer and
A heat-sealed layer arranged on one surface side of the base material layer and containing an ethylene-vinyl acetate copolymer,
An antistatic layer arranged on the surface side of the base material layer opposite to the surface on the heat seal layer side and containing a conductive polymer, and
Have,
A cover tape for packaging electronic components, wherein the Vickers hardness of the heat seal layer is 2.0 or more and 6.0 or less . The cover tape for packaging electronic parts according to claim 1, wherein the heat-sealing layer contains a modified ethylene-vinyl acetate copolymer or a crosslinked ethylene-vinyl acetate copolymer. The heat-sealed layer has a higher heat resistance than the ethylene-vinyl acetate copolymer, a resin having a higher storage elasticity than the ethylene-vinyl acetate copolymer, and a density higher than that of the ethylene-vinyl acetate copolymer. The cover tape for packaging electronic parts according to claim 1 or 2, which comprises a resin having a high content or a crosslinked resin. The cover tape for packaging electronic components according to any one of claims 1 to 3, wherein the heat seal layer contains a particulate organic substance or an inorganic substance. A carrier tape with multiple storage units for storing electronic components,
Electronic components stored in the storage unit and
The cover tape for packaging electronic components according to any one of claims 1 to 4, which is arranged so as to cover the storage portion.
A packaging body. The package according to claim 5, wherein the carrier tape is a paper carrier tape made of paper.

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