CN109790345B - Resin composition, outer sealing tape, and package for electronic component - Google Patents
Resin composition, outer sealing tape, and package for electronic component Download PDFInfo
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- CN109790345B CN109790345B CN201780059505.7A CN201780059505A CN109790345B CN 109790345 B CN109790345 B CN 109790345B CN 201780059505 A CN201780059505 A CN 201780059505A CN 109790345 B CN109790345 B CN 109790345B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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Abstract
The resin composition of the present invention is a resin composition for forming a sealant layer provided on one surface side of an outer tape for sealing a carrier tape having a recess capable of housing an electronic component, the resin composition comprises (A) a polyolefin resin, (B) an antistatic agent, and (C) at least one of a polystyrene resin and a (D) (meth) acrylate polymer, wherein the polyolefin resin contains a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, the proportion of the structural unit I derived from a carboxylic acid or a carboxylic acid derivative is 1 to 5 mass% relative to the total amount of the polyolefin resin (A), and the total content of the polystyrene resin (C) and the (D) (meth) acrylate polymer is 3 to 65 parts by mass relative to 100 parts by mass of the resin composition.
Description
Technical Field
The present invention relates to a resin composition, a cover tape, and a package for electronic components.
Background
As a method of transporting electronic components, a taping reel (taping reel) method is known in which electronic components are packaged in a packaging material and transported. In this tape-wound reel system, a package obtained by inserting electronic components into a carrier tape (carrier tape) in which electronic component storage pockets (pockets) are continuously formed and sealing the package tape by heat-sealing from above is transported in a state wound around a reel (reel).
As such a technique, for example, the technique described in patent document 1 can be cited. According to this document, a resin composition for a base material for polyolefin tapes is described. In the examples of this document, it is described that an ethylene-ethyl acrylate copolymer (NUC-6520, ethyl acrylate content: 24% by weight) is used as such a resin composition (paragraph 0026).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2002-309044.
Disclosure of Invention
Problems to be solved by the invention
However, when the sealant layer of the external sealing tape is formed by using the technique described in patent document 1, the obtained sealant layer has room for improvement in terms of compatibility between the adhesion prevention property to the electronic component and the adhesion (heat sealability) to the carrier tape.
Means for solving the problems
According to the present invention, there is provided a resin composition for constituting a sealant layer provided on one surface side of an outer tape for sealing a carrier tape having a recess capable of accommodating an electronic component, wherein,
the resin composition comprises:
(A) a polyolefin-based resin;
(B) an antistatic agent; and
(C) at least one of a polystyrene resin and a (D) (meth) acrylate polymer,
the polyolefin resin (A) contains a structural unit I derived from a carboxylic acid or a carboxylic acid derivative,
the proportion of the structural unit I derived from a carboxylic acid or a carboxylic acid derivative is 1 to 5 mass% based on the total amount of the polyolefin resin (A),
the total content of the (C) polystyrene resin and the (D) (meth) acrylate polymer is 3 to 65 parts by mass per 100 parts by mass of the resin composition.
Further, according to the present invention, there is provided a resin composition which constitutes a sealant layer provided on one surface side of an outer tape for sealing a carrier tape having a recess capable of accommodating an electronic component, wherein,
the resin composition comprises:
(A) a polyolefin-based resin;
(B) an antistatic agent;
(C) at least one of a polystyrene resin and a (D) (meth) acrylate polymer; and
(E) a tackifier, a water-soluble polymer,
the polyolefin resin (A) contains a structural unit II derived from an alpha-olefin,
the total content of the (C) polystyrene resin and the (D) (meth) acrylate polymer is 3 to 65 parts by mass per 100 parts by mass of the resin composition.
Further, according to the present invention, there is provided an outer tape comprising:
a substrate layer; and
a sealant layer provided on one surface side of the base material layer,
the outer tape is used for sealing a carrier tape having a recess capable of receiving an electronic component, wherein,
the sealant layer is composed of the resin composition.
Further, according to the present invention, there is provided an electronic component package comprising a component storage tape including: a paper carrier tape in which component storage sections for storing electronic components are formed at predetermined intervals; and an outer seal tape provided so as to cover the component storage section formed in the paper carrier tape,
the component receiving tape can be wound into a roll shape,
the outer seal belt is composed of the outer seal belt.
Effects of the invention
According to the present invention, it is possible to provide an outer seal tape excellent in antistatic property, excellent in adhesion resistance to an electronic component and excellent in heat sealability to a carrier tape, a resin composition for forming the outer seal tape, and a package for an electronic component using the outer seal tape.
Drawings
The above objects, other objects, features and advantages will become further apparent from the following description of preferred embodiments and the following drawings attached hereto.
Fig. 1 is a diagram showing an example of an electronic component packaging exterior tape according to the present embodiment.
Fig. 2 is a diagram showing an example of the electronic component packaging exterior tape according to the present embodiment.
Fig. 3 is a diagram showing an example of a state in which the electronic component package exterior tape according to the present embodiment is sealed to the carrier tape.
Detailed Description
The present invention will be described below with reference to embodiments and with reference to the accompanying drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate.
The configurations and elements described in the embodiments can be appropriately combined as long as the effects of the invention are not impaired.
The outline of the outer tape of the present embodiment will be described.
Fig. 1 is a cross-sectional view showing an example of an outer seal tape 10 for electronic component packaging according to the present embodiment. Fig. 3 is a diagram showing an example of a package 100 in which a paper carrier tape 20 is sealed with an outer tape 10 for electronic component packaging according to the present embodiment.
As shown in fig. 1, the outer tape 10 of the present embodiment may include a base material layer 1 and a sealant layer 2 provided on one surface side of the base material layer 1.
As shown in fig. 3, the exterior tape 10 of the present embodiment can be used to seal a paper carrier tape (carrier tape 20) having a recess (groove 21) capable of housing electronic components. This exterior tape 10 can be used as an electronic component package exterior tape that can heat-seal the carrier tape 20.
According to the exterior tape 10 of the present embodiment, the exterior tape 10 having excellent adhesion to a paper carrier tape and excellent adhesion prevention to an electronic component can be realized.
The structure of the outer tape 10 of the present embodiment will be described in detail below.
As an example of the outer tape 10 of the present embodiment, as shown in fig. 1, a base layer 1 and a sealant layer 2 may be provided. The sealant layer 2 may be provided on one surface side of the base material layer 1.
< substrate layer >
The material constituting the substrate layer 1 is preferably: when the sealant layer 2 and other layers are laminated on the base layer 1 to produce an outer tape, and when the outer tape 10 is joined to the carrier tape 20, the outer tape has mechanical strength to such an extent that it can withstand stress applied from the outside when the outer tape 10 is used, and heat resistance to such an extent that it can withstand a thermal history applied when the outer tape 10 is joined to the carrier tape 20. The form of the material constituting the base layer is not particularly limited, and is preferably processed into a film form from the viewpoint of ease of processing.
Specific examples of the material constituting the base layer 1 include polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, polycarbonate resins, and ABS resins. These may be used alone, or 2 or more of them may be used in combination. Among them, a polyester resin can be used from the viewpoint of improving the mechanical strength of the outer seal tape 10. In addition, from the viewpoint of improving the mechanical strength and flexibility of the outer tape 10, nylon 6 may be used as the material constituting the base material layer 1. The material constituting the base layer 1 may contain a lubricant.
The base layer 1 may be formed of a single-layer film including the above-described material, or may be formed using a multilayer film including the above-described material in each layer. The film used to form the base layer 1 may be an unstretched film or a uniaxially or biaxially stretched film, but a uniaxially or biaxially stretched film is preferable from the viewpoint of improving the mechanical strength of the outer tape 10.
The lower limit of the thickness of the substrate layer 1 is, for example, 5 μm or more, and preferably 10 μm or more. This makes it possible to improve the mechanical strength of the cover tape 10, and therefore, even when the cover tape 10 is peeled from the carrier tape 20 at a high speed, the cover tape 10 can be prevented from breaking. On the other hand, the upper limit of the thickness of the base material layer 1 is, for example, 50 μm or less, preferably 40 μm or less, and more preferably 30 μm or less. This prevents the rigidity of the exterior tape 10 from becoming too high, and even when a torsional stress is applied to the sealed carrier tape 20, the exterior tape 10 can follow the deformation of the carrier tape 20 and suppress peeling.
The total light transmittance of the base layer 1 is, for example, 80% or more, preferably 85% or more. By setting in this manner, the substrate layer 1 can be provided with transparency required to the extent that it is possible to check whether or not the electronic component is accurately housed in the recess 21 of the carrier tape 20 in the package 100. Therefore, the electronic components housed inside the package 100 can be confirmed by visual recognition from the outside of the package 100. The total light transmittance of the base material layer 1 can be measured according to JIS K7105 (1981).
< sealant layer >
In the present embodiment, in the exterior tape 10 that seals the carrier tape 20 having the recess portion capable of accommodating the electronic component, the resin composition constituting the sealant layer 2 provided on one surface side of the exterior tape 10 (hereinafter, also referred to as a sealant layer-forming resin composition in some cases) may include at least one of (a) a polyolefin-based resin, (B) an antistatic agent, and (C) a polystyrene-based resin and (D) a (meth) acrylate polymer.
The sealant layer 2 of the present embodiment is composed of a sealant layer-forming resin composition, and is obtained by, for example, extrusion-molding the sealant layer-forming resin composition into a film shape. When the sealant layer 2 is laminated on the base material layer 1, for example, a method of extrusion-laminating the sealant layer-forming resin composition on the base material layer 1 can be used.
The present inventors have studied on the sealant layer, and as a result, have found that, in general, when the adhesiveness of the sealant layer to a paper carrier tape is improved, the adhesiveness to an electronic component is also improved, and the electronic component adheres to the sealant layer during transportation.
In view of the above, it has been found that by adjusting the polarity of the resin contained in the sealant layer, the affinity with the electronic component can be reduced and the adhesion to the paper carrier tape can be improved.
In the present embodiment, the peel strength and the adhesion ratio of the electronic component can be controlled by appropriately selecting, for example, the type and the blending amount of the resin composition for sealant layer formation constituting the sealant layer 2 in the outer tape 10, the preparation method of the resin composition for sealant layer formation, the laminated structure of the outer tape 10, and the like. Among these, examples of the requirements for adjusting the peel strength and the adhesion ratio of the electronic component include polyolefin resins having excellent balance of adhesion between the paper carrier tape and a resin or a metal by adjusting the polarity as follows: for example, (i) an ethylene copolymer in which the content ratio in a specific polar group is a predetermined value or less by appropriately controlling the kind and content ratio of the polar group; or (ii) a polyolefin resin containing no polar group or having a reduced polar group content, and a tackifier for improving adhesion to a carrier tape.
((A) polyolefin resin)
The resin composition for forming a sealant layer according to the present embodiment may contain (a) a polyolefin resin.
The polyolefin-based resin (a) may contain at least one of a structural unit I derived from a carboxylic acid or a carboxylic acid derivative and a structural unit II derived from an α -olefin. These may be used alone, or 2 or more may be used in combination.
The polyolefin-based resin (a) may contain a copolymer having a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, for example, from the viewpoint of improving the adhesion strength to a paper carrier tape. The copolymer may be any of a 2-membered copolymer or a 3-membered copolymer.
In this case, the proportion of the repeating structural unit I derived from a carboxylic acid or a derivative of a carboxylic acid (for example, the proportion of the structural unit derived from maleic anhydride in the polyolefin resin (a)) in the polyolefin resin (a) is preferably 1% by mass or more and 5% by mass or less, and more preferably 2% by mass or more and 4% by mass or less, relative to the total amount of the polyolefin resin (a). This improves the balance between the adhesion to the paper carrier tape and the adhesion prevention to the electronic component.
Examples of the carboxylic acid or carboxylic acid derivative include maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, monomethyl maleate, monoethyl maleate, diethyl maleate, monomethyl fumarate, and the like. These may be used alone, or 2 or more may be used in combination. Among them, maleic anhydride may be used. That is, the structural unit I may contain a structural unit derived from maleic anhydride. Although the detailed mechanism is not clear, it is considered that the adhesion to a paper carrier tape can be improved and the adhesion to an electronic component can be reduced by appropriately selecting (a) a polyolefin-based resin having an excellent balance of adhesion, which is a polyolefin-based resin having good adhesion to paper (cellulose) and low adhesion to an epoxy resin of an outer layer of a metal electrode such as a thermistor (thermistor) and/or an inductor (inductor) by adjusting the polarity of the resin such as the content of a structure derived from maleic anhydride.
The above copolymer can contain a structural unit derived from another monomer in addition to a structural unit derived from a carboxylic acid or a carboxylic acid derivative. Examples of the other monomer include olefin monomers such as ethylene and propylene; acrylic esters such as methyl acrylate, ethyl acrylate, and butyl acrylate; and (meth) acrylic monomers such as acrylic acid and methacrylic acid. These may be used alone, or 2 or more may be used in combination.
Specific examples of the polyolefin-based resin (a) include an ethylene-maleic anhydride copolymer and an ethylene- (meth) acrylate-maleic anhydride copolymer. Examples of the ethylene- (meth) acrylate-maleic anhydride copolymer include an ethylene-ethyl acrylate-maleic anhydride copolymer. This makes it possible to appropriately balance adhesion to the paper carrier tape and adhesion prevention to the electronic component.
The polyolefin-based resin (a) may contain a homopolymer or a copolymer having a structural unit II derived from an α -olefin such as ethylene, propylene, or butene, from the viewpoint of reducing the affinity for electronic components. The polyolefin-based resin (a) may contain polyethylene or an ethylene copolymer.
When the polyolefin resin (a) has a structural unit II derived from an α -olefin, the resin composition for forming a sealant layer of the present embodiment may further include (E) a tackifier. In this case, the upper limit of the proportion of the repeating structural unit I derived from a carboxylic acid or a carboxylic acid derivative in the polyolefin-based resin (a) is, for example, 5% by mass or less, preferably 4% by mass or less, and more preferably 3% by mass or less, relative to the total amount of the polyolefin-based resin (a). On the other hand, the lower limit of the proportion of the repeating structural unit I derived from a carboxylic acid or a derivative thereof with respect to the total amount of the polyolefin-based resin (a) is, for example, 0 mass% or more. This improves the balance between the adhesion to the paper carrier tape and the adhesion prevention to the electronic component.
As the polyethylene, for example, low density polyethylene can be used.
Examples of the ethylene copolymer include resins such as an ethylene-vinyl acetate copolymer, an ethylene-aliphatic unsaturated carboxylic acid ester copolymer, and an ionomer. By using such a resin, the peel strength to carrier tape 20 can be made appropriate.
Examples of the ethylene-aliphatic unsaturated carboxylic acid copolymer include an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid copolymer.
Examples of the ethylene-aliphatic unsaturated carboxylic acid ester copolymer include an ethylene-acrylic acid ester copolymer and an ethylene-methacrylic acid ester copolymer. As the acrylic acid ester and the methacrylic acid ester, esters with alcohols having 1 to 8 carbon atoms such as methanol and ethanol can be preferably used. Among the above ethylene-aliphatic unsaturated carboxylic acid ester copolymers, an ethylene-methyl acrylate copolymer, an ethylene-ethyl acrylate copolymer or an ethylene-methyl methacrylate copolymer is preferable from the viewpoint of general applicability.
Among the above resins, the ethylene copolymer is preferably an ethylene-vinyl acetate copolymer or an ethylene-aliphatic unsaturated carboxylic acid ester copolymer from the viewpoint of adhesiveness to a carrier base material and cost.
In the present embodiment, the ethylene-vinyl acetate copolymer is a copolymer obtained by copolymerizing at least ethylene and vinyl acetate, the ethylene-aliphatic unsaturated carboxylic acid ester copolymer is a copolymer obtained by copolymerizing at least ethylene and aliphatic unsaturated carboxylic acid ester, and other monomers may be further copolymerized as appropriate.
When the polyolefin-based resin (a) contains a vinyl acetate copolymer, the proportion of vinyl acetate in all the monomers constituting the copolymer is preferably 12% by mass or less, and more preferably 10% by mass or less. This can improve the adhesion prevention of the electronic component.
When the polyolefin-based resin (a) contains an aliphatic unsaturated carboxylic acid ester copolymer such as ethyl acrylate, the upper limit of the proportion of the aliphatic unsaturated carboxylic acid ester in all the monomers constituting the copolymer is, for example, preferably 12% by mass or less, and more preferably 10% by mass or less, relative to the total amount of the polyolefin-based resin (a). On the other hand, the lower limit of the proportion of the aliphatic unsaturated carboxylic acid ester relative to the total amount of the polyolefin-based resin (a) is, for example, 0 mass% or more. This can improve the adhesion prevention of the electronic component. Examples of such an ethylene methyl acrylate copolymer include an ethylene methyl acrylate copolymer (manufactured by Tridak-DuPont Polymer chemical Co., Ltd. (DU PONT-MITSUI POLYCHEMICALS CO., LTD.): 9% by weight of a content ratio of a structural unit derived from methyl acrylate: 9%, 9% by weight of a structural unit derived from methyl acrylate), an ethylene methyl acrylate copolymer (manufactured by Japan Polyethylene Corporation: 12% by weight of a structural unit derived from methyl acrylate: 9% by weight of a structural unit derived from methyl acrylate: 7% by weight of a structural unit derived from ethyl acrylate: 12% by weight of a structural unit derived from methyl acrylate), an ethylene ethyl acrylate copolymer (manufactured by NUC Corporation: 10% by weight of a structural unit derived from ethyl acrylate: 7% by weight of a structural unit derived from ethyl acrylate) ], and a copolymer prepared by Nippon Polyethylene Corporation: 10% by weight of a structural unit derived from ethyl acrylate, and the like, An ethylene methyl methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd.; trade name "WD 301-F.; content ratio of structural units derived from methyl methacrylate: 10% by mass), and the like. This can improve the adhesion prevention of the electronic component and can make the peel strength to the carrier tape 20 appropriate.
The value of the melt flow rate (hereinafter, sometimes referred to as "MFR") of the polyolefin resin (A) (190 ℃ C., 2.16kg) measured according to JIS-K-7210 is preferably 0.1g to 100g, more preferably 1g to 50g, from the viewpoint of peel strength. This makes it possible to optimize the peel strength with the carrier tape 20.
In the present embodiment, the content of the polyolefin resin (a) is 20 parts by mass or more, preferably 30 parts by mass or more, and more preferably 45 parts by mass or more, per 100 parts by mass of the resin composition constituting the sealant layer 2.
By setting the content of the polyolefin resin (a) in this manner, an appropriate peel strength as the sealant layer 2 can be achieved.
In the present embodiment, the content of the polyolefin resin (a) is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and still more preferably 78 parts by mass or less, per 100 parts by mass of the resin composition constituting the sealant layer 2.
By setting the content of the polyolefin resin (a) in this manner, higher antistatic performance can be achieved.
((B) antistatic agent)
The resin composition for forming a sealant layer according to the present embodiment may contain (B) an antistatic agent. As the antistatic agent (B), lithium ions can be contained. In the present embodiment, by using the antistatic agent containing lithium ions as (B) the antistatic agent, as the sealant layer 2, a more excellent antistatic ability can be achieved. More specifically, a polymer type antistatic agent in which lithium ions are present in the resin can be used. This can continuously and stably exhibit excellent antistatic performance.
The lithium ion may be contained in the antistatic agent in the form of a lithium salt, for example. Examples of the lithium salt include lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and lithium pentafluoroethanesulfonate. These may be used alone, or 2 or more may be used in combination.
In addition, the lithium ions contained in the antistatic agent (B) can be confirmed by measuring the amount of the metal element. In the present embodiment, the amount of lithium ions contained in the antistatic agent is preferably set to, for example, 50 μ g/g or more (50ppm or more).
In the present embodiment, the antistatic agent (B) may be used in combination with a known antistatic agent in addition to the antistatic agent containing lithium ions.
Examples of such antistatic agents include polyamide copolymers such as polyetheresteramide, block polymers of polyolefin and polyether, polymers including polyethylene ether and glycol, polymers containing carboxylate groups such as potassium ionomer, copolymers containing quaternary ammonium groups, metal fillers (fill) such as tin oxide, zinc oxide, and titanium oxide, and thiophene conductive polymers such as polyethylenedioxythiophene/polystyrenesulfonic acid (PEDOT/PSS). These may be used alone, or 2 or more may be used in combination.
In addition, the (B) antistatic agent is preferably one having a thermal decomposition temperature of 120 ℃ or higher in order to prevent deterioration due to high temperature at the time of extrusion lamination or heat sealing.
In the present embodiment, the content of the antistatic agent (B) is, for example, 5 parts by mass or more, preferably 8 parts by mass or more, and more preferably 10 parts by mass or more, relative to 100 parts by mass of the sealant layer-forming resin composition.
By setting the content of the antistatic agent (B) in this manner, an appropriate antistatic ability can be exhibited as the sealant layer 2.
In the present embodiment, the content of the (B) antistatic agent is preferably 25 parts by mass or less, more preferably 20 parts by mass or less, still more preferably 18 parts by mass or less, and particularly preferably 16 parts by mass or less, relative to 100 parts by mass of the sealant layer-forming resin composition.
In general, the antistatic agent (B) is an expensive antistatic agent, and thus setting the content of the antistatic agent as described above contributes to cost reduction in the production of the outer tape.
In the present embodiment, the proportion of the antistatic agent containing lithium ions is, for example, 50 parts by mass or more, preferably 60 parts by mass or more, and more preferably 75 parts by mass or more, relative to 100 parts by mass of the entire antistatic agent (B).
By thus setting the proportion of the antistatic agent containing lithium ions, an appropriate antistatic ability as the sealant layer 2 can be effectively exerted.
The upper limit value of the proportion of the lithium ion-containing antistatic agent is not particularly limited with respect to 100 parts by mass of the entire (B) antistatic agent, which may be a lithium ion-containing antistatic agent.
((C) polystyrene-based resin)
The resin composition for forming a sealant layer according to the present embodiment may contain (C) a polystyrene-based resin. This makes it possible to adjust the balance between the appropriate antistatic ability and peel strength.
The Polystyrene-based resin (C) is not particularly limited, and includes, for example, Polystyrene, styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-methyl (meth) acrylate copolymer, hydrogenated styrene block copolymer, High Impact Polystyrene (HIPS; High Impact Polystyrene), General Purpose Polystyrene resin (GPPS; General Purpose Polystyrene), and the like, and 2 or more of these may be used in combination.
Among them, a styrene-methyl (meth) acrylate copolymer can be used from the viewpoint of high transparency and a well-balanced improvement in antistatic ability and peel strength.
((D) (meth) acrylate Polymer)
The sealant layer-forming resin composition according to the present embodiment may contain (D) (meth) acrylate polymer. This makes it possible to adjust the balance between the appropriate antistatic ability and peel strength, as in the case of containing (C) a polystyrene resin.
Examples of the (meth) acrylate polymer (D) include polymers of (meth) acrylates selected from methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, ethylhexyl (meth) acrylate, and the like. These may be used alone, or 2 or more may be used in combination.
These polymers may be copolymers with other monomers as long as they do not conform to the components (a) and (C).
In addition, in the present embodiment, among these, a methyl (meth) acrylate polymer can be used from the viewpoint of high availability and a good balance between antistatic ability and peel strength.
In the present specification, the term (meth) acrylic acid means acrylic acid, methacrylic acid or a mixture thereof, and the copolymer having (meth) acrylic acid means a copolymer having 1 or more acrylic groups or having 1 or more methacrylic groups.
The (D) (meth) acrylate polymer is a polymer containing, for example, 60 mol% or more of a structural unit derived from a (meth) acrylate, preferably 70 mol% or more of a structural unit derived from a (meth) acrylate, and more preferably 80 mol% or more of a structural unit derived from a (meth) acrylate.
In the present embodiment, the lower limit of the total amount of the contents of the (C) polystyrene resin and the (D) meth (acrylate) polymer is, for example, 3 parts by mass or more, preferably 5 parts by mass or more, and more preferably 7 parts by mass or more, per 100 parts by mass of the sealant layer-forming resin composition. This can achieve appropriate antistatic properties as the sealant layer 2.
In the present embodiment, the upper limit of the total amount of the contents of the (C) polystyrene-based resin and the (D) (meth) acrylate polymer is, for example, 65 parts by mass or less, preferably 40 parts by mass or less, more preferably 30 parts by mass or less, and still more preferably 20 parts by mass or less, relative to 100 parts by mass of the sealant layer-forming resin composition. This can achieve higher peel strength.
((E) tackifier)
The sealant layer-forming resin composition according to the present embodiment may contain (E) a tackifier.
Examples of the tackifier (E) include petroleum resin, rosin resin, terpene resin, styrene resin, coumarone-indene resin, and the like, and these may be used alone or in combination of 2 or more. Among them, petroleum resin can be used from the viewpoint of improving heat sealability to a paper carrier tape. Examples of the petroleum resin include aliphatic petroleum resins, aromatic petroleum resins, and aliphatic-aromatic copolymer petroleum resins. These may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
In addition, from the viewpoint of improving stability against oxidation when the sealant layer 2 is extrusion-laminated, an aliphatic petroleum resin, preferably an alicyclic saturated hydrocarbon resin, can be used as the petroleum resin that is melt-oxidized under high temperature conditions.
In the present embodiment, the petroleum resin may be a hydrogenated petroleum resin, from the viewpoint of further improving the heat sealability to the paper carrier tape.
When the polyolefin-based resin (a) contains a copolymer having a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, the sealant layer 2 of the present embodiment may not contain (E) a tackifier.
When the polyolefin-based resin (a) in the sealant layer 2 contains a copolymer having a structural unit II derived from an α -olefin, the sealant layer 2 of the present embodiment preferably contains (E) a tackifier. Although the detailed mechanism is not clear, it is considered that the use of a thickener having a low molecular weight can improve the adhesion to a paper carrier tape by utilizing the anchoring effect based on the fluidity thereof.
In the present embodiment, the lower limit of the content of the tackifier (E) is preferably more than 7 parts by mass, and more preferably 7.5 parts by mass or more, per 100 parts by mass of the resin composition constituting the sealant layer 2, from the viewpoint of optimizing the peel strength with respect to the carrier tape 20.
On the other hand, from the viewpoint of achieving an outer seal tape having an excellent balance between the anti-adhesion property to an electronic component and the heat-sealing property to a carrier tape, the upper limit of the content of the (E) tackifier may be 20 parts by mass or less, or 15 parts by mass or less, for example, with respect to 100 parts by mass of the resin composition constituting the sealant layer 2.
In the resin composition constituting the sealant layer 2 according to the present embodiment, the total content of the antistatic agent (B) and the tackifier (E) is preferably 34 parts by mass or more and 80 parts by mass or less, and more preferably 34 parts by mass or more and 75 parts by mass or less, based on 100 parts by mass of the polyolefin resin (a), from the viewpoint of achieving an outer seal tape having an excellent balance between the adhesion prevention property to an electronic component and the heat sealability to a carrier tape.
In the resin composition constituting the sealant layer 2 according to the present embodiment, when the content of the tackifier (E) is X with respect to 100 parts by mass of the resin composition and the total content of the polystyrene-based resin (C) and the (meth) acrylate polymer (D) with respect to 100 parts by mass of the resin composition is Y, the value of X/Y is preferably 0.2 or more and 15 or less, and more preferably 0.3 or more and 12 or less, from the viewpoint of achieving an outer seal tape excellent in balance between the adhesion prevention property to an electronic component and the heat sealability to a carrier tape.
In the present embodiment, the resin composition constituting the sealant layer 2 may contain, for example, an anti-blocking agent, a slip agent, and the like as described below, depending on the application.
Examples of the anti-blocking agent include silica, aluminosilicate (zeolite, etc.), and the like. By containing the antiblocking agent, blocking of the sealant layer 2 can be alleviated.
Examples of the above-mentioned slip agent include various amides such as palmitamide, stearamide, behenamide, oleamide, erucamide, oleylpalmitamide, stearylpalmitamide, methylenebisstearamide, methylenebisoleamide, ethylenebisoleamide and ethylenebiserucamide, polyalkylene glycol (polyalkylene glycol) such as polyethylene glycol and polypropylene glycol, hydrogenated castor oil and the like. By containing the slip agent in the sealant layer 2, processability such as extrusion processing, roll release property, film sliding property, and the like can be improved.
The sealant layer 2 may contain any additives such as various conductive materials, lubricants, plasticizers, antioxidants, ultraviolet absorbers, colorants, various surfactants, and inorganic fillers, as long as the properties thereof are not impaired. Further, a coating treatment may be performed.
In the present embodiment, the thickness of the sealant layer 2 is, for example, preferably 1 μm or more and 30 μm or less, and more preferably 2 μm or more and 20 μm or less. If the thickness of the sealant layer 2 is equal to or less than the upper limit, bleeding during heat sealing can be easily controlled, and if the thickness of the sealant layer 2 is equal to or more than the lower limit, the peel strength of the exterior tape 10 to the carrier tape 20 can be easily adjusted.
In the present embodiment, the upper limit of the surface resistivity of the sealant layer 2 at 23 ℃ and 50% RH is preferably, for example, 1.0 × 1011Ω/cm2Hereinafter, more preferably 7.0 × 1010Ω/cm2Hereinafter, more preferably 5.0 × 1010Ω/cm2The following. Such surface resistivity can be easily achieved by appropriately setting the kind and amount of the antistatic agent.
The lower limit of the surface resistivity of the sealant layer 2 is not particularly limited, but is exemplified byFor example, it can be set to 1.0 × 105Ω/cm2The above.
The surface resistivity can be measured in an environment of 23 ℃ and 50% relative humidity according to JIS K6911 using a surface resistance measuring instrument (manufactured by SIMCO).
As a modification of the outer tape 10 of the present embodiment, as shown in fig. 2, another layer may be formed on the surface of the base material layer 1 on the side opposite to the sealant layer 2. As another layer, for example, the conductive layer 3 can be used. By using such an outer seal tape 10 for the package 100, accumulation of static electricity can be more effectively suppressed.
In the present embodiment, in the step of transporting the package 100 containing the electronic component, when the method of transporting the package 100 after the bottom surface 20a of the carrier tape and the surface 10a of the outer tape are brought into close contact with each other is employed, the surface of the conductive layer 3 may come into contact with the bottom surface of the carrier tape 20 and be rubbed. In this case, the accumulation of static electricity can be more effectively suppressed.
< conductive layer >
The outer tape 10 for electronic module packaging according to the present embodiment may be provided with a conductive layer 3 (antistatic layer) as shown in fig. 2, in addition to the base layer 1 and the sealant layer 2.
Fig. 2 shows an example in which the conductive layer 3 is provided on the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided.
By laminating such conductive layers 3, accumulation of static electricity can be more effectively suppressed when a package in which an electronic component is packaged is obtained. In particular, in actual processes, conditions for conveying the package 100 after the bottom surface 20a (see fig. 3) of the carrier tape and the surface 10a (see fig. 3) of the cover tape are brought into close contact with each other are often used, and therefore, such a conductive layer 3 is preferably provided as the cover tape 10.
The conductive layer 3 may contain, for example, a binder resin such as an aziridine (aziridyl) compound or a ring-opening compound thereof.
The aziridinyl compound generally refers to a compound having an aziridinyl group, and as a specific example thereof, examples thereof include N, N '-hexamethylene-1, 6-bis (1-aziridinecarboxamide), N' -diphenylmethane-4, 4 '-bis (1-aziridinecarboxamide), trimethylolpropane-tris- β -aziridinylpropionate, N' -toluene-2, 4-bis (1-aziridinecarboxamide), trimethylenemelamine, trimethylolpropane-tris- β (2-methylaziridine) propionate, bis-isophthaloyl (isophtaloyl) -1-2-methylaziridine, tris-1-aziridinyloxyphosphine oxide, tris-1-2-methylaziridine phosphine oxide and the like. As the aziridinyl compound, commercially available compounds such as Chemite PZ-33 and DZ-22E manufactured by Nippon Shokubai Co., Ltd., can also be used. The ring-opening compound of the aziridinyl compound refers to a compound in which the aziridinyl group in the aziridinyl compound is in a ring-opened state.
The conductive layer 3 may further contain an ester compound. The ester compound is a compound in which an organic acid or an inorganic acid and an alcohol are bonded through a dehydration reaction, and specific examples thereof include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and derivatives thereof. These may be used alone, or 2 or more may be used in combination.
In order to reduce the surface resistance of the conductive layer 3 and suppress the generation of static electricity due to friction, the conductive layer 3 may contain a conductive polymer. Specific examples of the conductive polymer include polyaniline and polypyrrole, and among them, a polyethylenedioxythiophene/polystyrenesulfonic acid (PEDOT/PSS) type compound can be preferably used.
The conductive layer 3 may contain other materials according to purposes, and may contain a surfactant type antistatic agent, for example.
As a modification of the outer tape 10 of the present embodiment, for example, an intermediate layer may be provided between the base material layer 1 and the sealant layer 2. As the intermediate layer, for example, a cushion layer capable of absorbing impact or relaxing stress relating to the outer tape 10 can be used. This can improve the impact resistance and stress relaxation property of the entire cover tape 10.
The intermediate layer can be made of, for example, a thermoplastic resin such as an olefin resin or a styrene resin. The thermoplastic resin may have a linear or branched chain structure or a cyclic structure. These may be used alone, or 2 or more may be used in combination. Among these, from the viewpoint of improving the cushioning property of the entire outer tape, an olefin resin, a styrene resin, or a cyclic olefin resin may be contained, and an olefin resin may be more preferably contained.
The thickness of the intermediate layer may be, for example, 10 μm or more and 30 μm or less, and preferably 15 μm or more and 25 μm or less, from the viewpoint of improving the stress relaxation property of the entire outer tape.
As a modification of the outer tape 10 according to the present embodiment, for example, a bonding layer may be provided between the base material layer 1 and the sealant layer 2 or between the base material layer 1 and the conductive layer 3. By doing so, the mechanical strength of the outer seal tape 10 can be improved.
As a material for forming the bonding layer, for example, various publicly known solvent-based or aqueous anchor coat agents (anchor coat agents) such as isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based materials can be used. These may be used alone, or 2 or more may be used in combination.
The surface of the base material layer 1 may be subjected to one or more surface treatments selected from corona treatment, plasma treatment, flame treatment, and primer (primer) treatment. Among them, for example, corona treatment can be used. This can improve the adhesion between the base material layer 1 and the sealant layer 2.
The lower limit of the total light transmittance of the outer seal tape 10 of the present embodiment is preferably 80% or more, and more preferably 85% or more. By setting as described above, in the package 100 including the outer seal tape 10 and the carrier tape 20, transparency required to be able to check whether or not the electronic components are accurately housed in the recesses of the carrier tape 20 can be provided. In other words, by setting the total light transmittance of the cover tape 10 to be equal to or higher than the lower limit value, it is possible to visually confirm the electronic components housed inside the package including the cover tape and the carrier tape from the outside of the package. The upper limit of the total light transmittance of the outer tape 10 is not particularly limited, and may be, for example, 100% or less. In addition, the total light transmittance of the outer seal tape can be measured according to JIS K7105 (1981).
The upper limit of the haze of the outer tape 10 of the present embodiment measured by measurement method a according to JIS K7105(1998) is, for example, 85% or less, preferably 80% or less, and more preferably 75% or less. This can maintain the transparency of the cover tape 10 to a degree sufficient for recognizing and inspecting electronic components with a sensor or the like. The lower limit of the haze is not particularly limited, and may be, for example, 0% or more.
Next, the package 100 of the present embodiment will be described.
The package 100 (package for electronic components) according to the present embodiment may be configured by a component storage tape including: a paper carrier tape (carrier tape 20) in which component storage sections (recesses 21) for storing electronic components are formed at predetermined intervals; and the outer seal tape 10 provided so as to cover a component storage section (a recessed groove 21) formed in the paper carrier tape. The pack storage tape constituting the package 100 of the present embodiment can be wound in a roll shape.
As shown in fig. 3, the exterior tape 10 of the present embodiment is a cover member of a tape carrier tape 20 in which concave recesses 21 are continuously provided in accordance with the shape of electronic components. Specifically, the cover tape 10 is configured to be able to be bonded (e.g., heat-sealed) to the surface of the carrier tape 20 so as to cover the entire surface of the opening of the notch 21 of the carrier tape 20.
The package 100 of the present embodiment can be used as follows.
First, electronic components are accommodated in the recesses 21 of the carrier tape 20. Next, the outer seal tape 10 is bonded to the surface of the carrier tape 20 by heat sealing so as to cover the entire surface of the opening of the concave groove 21 of the carrier tape 20, thereby obtaining a structure in which the electronic component is hermetically housed in the package 100.
The structure housing the electronic components is transported to a working area where surface mounting of an electronic circuit board or the like is performed, with the package 100 wound around a reel made of paper or plastic.
After the structure is transported to the working area, the cover tape 10 is peeled off from the carrier tape 20, and the housed electronic components are taken out.
The outer seal tape 10 of the present embodiment has excellent adhesion to a paper carrier tape (carrier tape 20). Therefore, the sealed state can be maintained during the transportation of the package 100, and thus the transportation stability can be improved. The outer tape 10 of the present embodiment is excellent in adhesion prevention to electronic components. Therefore, after the conveyed package 100 is opened, the state in which the electronic component is easily taken out can be maintained, and therefore, the efficiency of mounting the taken-out electronic component on the substrate can be improved, and the productivity can be improved.
While the embodiments of the present invention have been described above, these are merely illustrative of the present invention, and various configurations other than the above-described configurations can be adopted.
Hereinafter, reference examples are attached.
1. A resin composition constituting a sealant layer of an exterior tape for sealing a carrier tape having a recess capable of housing an electronic component, wherein,
the resin composition comprises:
(A) a polyolefin-based resin;
(B) an antistatic agent; and
(C) at least one of a polystyrene resin and a (D) (meth) acrylate polymer,
the polyolefin resin (A) is a 2-or 3-membered copolymer containing a repeating structural unit derived from a carboxylic acid or a derivative thereof,
the content of the polyolefin resin (A) is 20 parts by mass or more per 100 parts by mass of the resin composition.
2. The resin composition according to claim 1, wherein the polyolefin resin (A) is an ethylene-maleic anhydride copolymer or an ethylene- (meth) acrylate-maleic anhydride copolymer.
3. The resin composition according to 1 or 2, wherein the (B) antistatic agent contains lithium ions.
4. The resin composition according to any one of claims 1 to 3, wherein a content of the repeating structural unit derived from the carboxylic acid or the derivative thereof is 1 mass% or more and 5 mass% or less with respect to the total amount of the polyolefin-based resin (A).
5. The resin composition according to any one of claims 1 to 4, wherein the content of the (B) antistatic agent is 25 parts by mass or less with respect to 100 parts by mass of the resin composition.
6. The resin composition according to any one of claims 1 to 5, wherein the (C) polystyrene-based resin comprises a styrene-methyl (meth) acrylate copolymer.
7. The resin composition according to any one of claims 1 to 6, wherein the (D) (meth) acrylate polymer comprises a methyl (meth) acrylate polymer.
8. The resin composition according to any one of claims 1 to 7, wherein the surface resistivity of the sealant layer is 1.0X 10 at 23 ℃ and 50% RH11Ω/cm2The following.
9. An exterior tape for sealing a carrier tape having a recess capable of housing an electronic component, comprising a sealant layer made of the resin composition described in any one of 1 to 8.
In the following, reference examples are attached.
1. A resin composition constituting a sealant layer of an exterior tape for sealing a carrier tape having a recess capable of housing an electronic component, wherein,
the resin composition comprises:
(A) a polyolefin-based resin;
(B) an antistatic agent; and
(C) at least one of a polystyrene resin and a (D) (meth) acrylate polymer,
the content of the polyolefin resin (A) is 20 parts by mass or more per 100 parts by mass of the resin composition,
the resin composition further comprises (E) a tackifier.
2. The resin composition according to claim 1, wherein a total content of the antistatic agent (B) and the tackifier (E) is 34 to 80 parts by mass with respect to 100 parts by mass of the polyolefin resin (A).
3. The resin composition according to 1 or 2, wherein when the content of the tackifier (E) is X and the total content of the polystyrene-based resin (C) and the (meth) acrylate polymer (D) is Y with respect to 100 parts by mass of the resin composition, X/Y is 0.2 or more and 15 or less.
4. The resin composition according to any one of claims 1 to 3, wherein the (E) tackifier is a hydrogenated petroleum resin.
5. The resin composition according to any one of claims 1 to 4, wherein the tackifier (E) is an alicyclic saturated hydrocarbon resin-based petroleum resin.
6. The resin composition according to any one of claims 1 to 5, wherein the (B) antistatic agent contains lithium ions.
7. The resin composition according to any one of claims 1 to 6, wherein the content of the antistatic agent (B) is 5 parts by mass or more and 25 parts by mass or less with respect to 100 parts by mass of the resin composition.
8. The resin composition according to any one of claims 1 to 7, wherein the surface resistivity of the sealant layer is 1.0X 10 at 23 ℃ and 50% RH11Ω/cm2The following.
9. An exterior tape for sealing a carrier tape having a recess capable of housing an electronic component, comprising a sealant layer made of the resin composition described in any one of 1 to 8.
Examples
The present invention will be described below with reference to examples and comparative examples, but the present invention is not limited to these examples.
< preparation of resin composition >
In each example and each comparative example, resin compositions were obtained by blending the respective components in the formulation shown in table 1. The components in table 1 are the following components.
(polyolefin resin)
Polyolefin-based resin 1: ethylene-ethyl acrylate-maleic anhydride copolymer (manufactured by ARKEMA corporation, trade name "LOTADER 6200", content of structural unit derived from ethyl acrylate: 6.5 mass%, content of structural unit derived from maleic anhydride: 2.8 mass%)
Polyolefin-based resin 2: ethylene-ethyl acrylate copolymer (manufactured by NUC Corporation, NUC 6220; trade name; containing ratio of structural units derived from ethyl acrylate: 7% by mass)
Polyolefin-based resin 3: low-density polyethylene (manufactured by Sumitomo Chemical Co., Ltd., Ltd.): trade name "SUMIKACENE L705")
Polyolefin-based resin 4: ethylene-ethyl acrylate copolymer (available from NUC under the trade name NUC-6170; content of structural units derived from ethyl acrylate: 18% by mass)
Polyolefin-based resin 5: ethylene-ethyl acrylate copolymer (manufactured by NUC, trade name "NUC-6570", content ratio of structural units derived from ethyl acrylate: 25% by mass)
(antistatic agent)
Antistatic agent 1: antistatic agent containing lithium ion (manufactured by Sanyo chemical Co., Ltd. (SANYO KASEI CO., LTD.), trade name "Pelctron PVL")
(polystyrene series resin)
Polystyrene resin 1: styrene-methyl (meth) acrylate copolymer (manufactured by Nippon chemical Co., Ltd. (NIPPON STEEL CHEMICAL CO., LTD.), trade name "Estyrene MS-600")
Polystyrene resin 2: general-purpose polystyrene resin (manufactured by Toyo STYRENE Co., Ltd.) and having a trade name of "Toyo Styrol G100C")
((meth) acrylate Polymer)
(meth) acrylate polymer 1: methyl methacrylate homopolymer (product name "SUMIPEX MGSV" manufactured by Sumitomo chemical Co., Ltd.)
(tackifier)
Tackifier 1: hydrogenated Petroleum resin of alicyclic saturated Hydrocarbon resin series (manufactured by Mitsukawa chemical INDUSTRIES, Ltd. (ARAKAWA CHEMICAL INDUSTRIES, LTD.) under the trade name "ARKON P-100")
TABLE 1
TABLE 2
< manufacture of outer seal tape >
A biaxially stretched polyester film having a film thickness of 12 μm (trade name E7415, manufactured by Toyo Boseki Kabushiki Kaisha, Ltd.) was formed into a film having a thickness of 20 μm by an extrusion lamination method at an extrusion temperature of 300 ℃ using a low-density polyethylene (trade name SUMIKACENE L705, manufactured by Sumitomo chemical Co., Ltd.) as an intermediate layer.
On the intermediate layer thus formed, a resin composition having a formulation shown in tables 1 and 2 was further formed into a film having a thickness of 10 μm at an extrusion temperature of 280 ℃ as a sealant layer, thereby obtaining an outer tape.
The following evaluations were performed using the outer tape obtained by the above method.
< evaluation method >
(surface resistivity)
The surface resistivity of the surface of the sealant was measured with a surface resistivity measuring instrument (manufactured by SIMCO) in an environment of 23 ℃ and 50% humidity according to JIS K6911 for each of the outer tapes obtained in the examples and comparative examples. In addition, the unit is omega/cm2。
(Peel Strength)
Each of the outer tapes obtained in examples and comparative examples was cut into 5.3mm wide pieces, and applied to the surface of a PAPER carrier tape (manufactured by TOKYO PAPER corporation, TOKYO PAPER mfg. co., LTD.),TWA-6621 was manufactured at 170 ℃ and 4kg/cm using a taping machine (taping machine) (Tokyo Weld Co., Ltd.; TWA-6621)2And heat-sealed under the conditions of 0.005 second, and the peel strength immediately after the heat-sealing was measured. The peel strength was measured using a peel tester under conditions of a peel speed of 300mm/min and a peel angle of about 180 °. And, the unit is gf.
(anti-adhesion to electronic Components)
Each of the outer tapes obtained in examples and comparative examples was attached to a slide glass so that the sealant of the outer tape faced upward, and a test piece on which 20 wound-type inductors (1608 size) were mounted was produced. The test piece was left to stand at 55 ℃ and 60% RH for 24 hours, and further left to stand at normal temperature and humidity for 24 hours. Then, the test piece was vibrated at 1500rpm for 20 seconds while the slide glass was inverted, and then the number of the wire wound inductors attached to the sealant surface of the outer tape was measured.
The evaluation results of the evaluation items are shown in table 1.
It was confirmed that the exterior tapes of examples 1 to 3 were all the exterior tapes having excellent antistatic properties and having both excellent anti-adhesion properties to electronic components and excellent heat-sealing properties to carrier tapes. On the other hand, the outer seal tapes of comparative examples 1 and 4 have low peel strength and do not satisfy the required level from the viewpoint of excellent heat sealability to the carrier tape. The outer tapes of comparative examples 2 and 3 had a large number of electronic components attached, and did not satisfy the required level in terms of the adhesion prevention of the electronic components. The outer tape of comparative example 5 has a high surface resistivity and does not satisfy the conventional level required in view of antistatic property of the surface of the sealant.
Further, it was confirmed that the exterior tapes of examples 4 to 7 were all the exterior tapes having excellent antistatic properties and having both excellent anti-adhesion properties to electronic components and excellent heat-sealing properties to carrier tapes. On the other hand, the outer seal tapes of comparative examples 6 and 7 and comparative example 10 have low peel strength and do not satisfy the required level from the viewpoint of excellent heat sealability to the carrier tape. The outer tape of comparative examples 8 and 9 had a large number of electronic components attached, and did not satisfy the required level in terms of the adhesion prevention of the electronic components. The outer tape of comparative example 11 has a high surface resistivity and does not satisfy the conventional level required in view of antistatic property of the sealant surface.
This application claims priority based on Japanese patent application No. 2016-.
Claims (19)
1. A resin composition which constitutes a sealant layer provided on one surface side of an outer tape for sealing a carrier tape having a recess capable of housing an electronic component, wherein,
the resin composition comprises:
(A) a polyolefin-based resin;
(B) an antistatic agent; and
(C) at least one of a polystyrene resin and a (D) (meth) acrylate polymer,
the polyolefin resin (A) contains a structural unit I derived from a carboxylic acid or a carboxylic acid derivative,
the carboxylic acid or carboxylic acid derivative is selected from the group consisting of maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, monomethyl maleate, monoethyl maleate, diethyl maleate and monomethyl fumarate,
the proportion of the structural unit I derived from a carboxylic acid or a carboxylic acid derivative is 1 to 5 mass% based on the total amount of the polyolefin resin (A),
the total content of the (C) polystyrene resin and the (D) (meth) acrylate polymer is 3 to 65 parts by mass per 100 parts by mass of the resin composition.
2. The resin composition according to claim 1, wherein,
the structural unit I is a structural unit derived from maleic anhydride.
3. The resin composition according to claim 1 or 2, wherein,
the polyolefin resin (A) is an ethylene-maleic anhydride copolymer or an ethylene- (meth) acrylate-maleic anhydride copolymer.
4. A resin composition which constitutes a sealant layer provided on one surface side of an outer tape for sealing a carrier tape having a recess capable of housing an electronic component, wherein,
the resin composition comprises:
(A) a polyolefin-based resin;
(B) an antistatic agent;
(C) at least one of a polystyrene resin and a (D) (meth) acrylate polymer; and
(E) a tackifier, a water-soluble polymer,
the polyolefin resin (A) comprises a structural unit II derived from an alpha-olefin and a repeating structural unit I derived from a carboxylic acid or a carboxylic acid derivative,
the ratio of the repeating structural unit I derived from a carboxylic acid or a carboxylic acid derivative is 0 to 5 mass% based on the total amount of the polyolefin resin (A),
when the polyolefin resin (A) contains a vinyl acetate copolymer, the proportion of the vinyl acetate in all the monomers constituting the copolymer is 12% by mass or less relative to the total amount of the polyolefin resin (A),
when the polyolefin-based resin (A) contains an aliphatic unsaturated carboxylic acid ester copolymer, the proportion of the aliphatic unsaturated carboxylic acid ester in all the monomers constituting the copolymer is 12% by mass or less relative to the total amount of the polyolefin-based resin (A),
the total content of the (C) polystyrene resin and the (D) (meth) acrylate polymer is 3 to 65 parts by mass per 100 parts by mass of the resin composition.
5. The resin composition according to claim 4, wherein,
the carboxylic acid or carboxylic acid derivative is selected from the group consisting of maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, monomethyl maleate, monoethyl maleate, diethyl maleate and monomethyl fumarate.
6. The resin composition according to claim 4 or 5, wherein,
the total content of the antistatic agent (B) and the tackifier (E) is 34 to 80 parts by mass with respect to 100 parts by mass of the polyolefin resin (A).
7. The resin composition according to claim 4 or 5, wherein,
when the content of the thickener (E) is X with respect to 100 parts by mass of the resin composition and the total content of the polystyrene-based resin (C) and the (meth) acrylate polymer (D) is Y with respect to 100 parts by mass of the resin composition, X/Y is 0.2 to 15 inclusive.
8. The resin composition according to claim 4 or 5, wherein,
the tackifier (E) is a hydrogenated petroleum resin or an alicyclic saturated hydrocarbon resin-based petroleum resin.
9. The resin composition according to claim 1 or 4, wherein,
the (B) antistatic agent contains lithium ions.
10. The resin composition according to claim 1 or 4, wherein,
the content of the antistatic agent (B) is 5 to 25 parts by mass per 100 parts by mass of the resin composition.
11. The resin composition according to claim 1 or 4, wherein,
the polystyrene resin (C) is styrene-methyl (meth) acrylate copolymer.
12. The resin composition according to claim 1 or 4, wherein,
the (meth) acrylate polymer (D) is a methyl (meth) acrylate polymer.
13. The resin composition according to claim 1 or 4, wherein,
the surface resistivity of the sealant layer composed of the resin composition was 1.0X 10 under the conditions of 23 ℃ and 50% RH11Ω/cm2The following.
14. An outer tape, wherein,
the disclosed device is provided with: a substrate layer; and
a sealant layer provided on one surface side of the base material layer,
the outer tape is used for sealing a carrier tape having a recess capable of receiving an electronic component,
the sealant layer is composed of the resin composition described in any one of claims 1 to 13.
15. The outer cover tape of claim 14,
the carrier tape is a paper carrier tape.
16. The outer cover tape of claim 14,
an intermediate layer is further provided between the base material layer and the sealant layer.
17. The outer cover tape of claim 16,
the intermediate layer contains one or more thermoplastic resins selected from the group consisting of olefin resins, cyclic olefin resins, and styrene resins.
18. The outer tape according to any one of claims 14 to 17, wherein an antistatic layer is further provided on the other surface side of the base material layer opposite to the sealant layer.
19. A package for electronic components, which is constituted by a component housing tape, comprising: a paper carrier tape in which component storage sections for storing electronic components are formed at predetermined intervals; and an outer seal tape provided so as to cover the component storage section formed in the paper carrier tape,
the component receiving tape can be wound into a roll shape,
the outer tape is constituted by the outer tape of any one of claims 14 to 18.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-189581 | 2016-09-28 | ||
| JP2016189581 | 2016-09-28 | ||
| JP2016-191839 | 2016-09-29 | ||
| JP2016191839 | 2016-09-29 | ||
| PCT/JP2017/027195 WO2018061442A1 (en) | 2016-09-28 | 2017-07-27 | Resin composition, cover tape, and electronic component package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109790345A CN109790345A (en) | 2019-05-21 |
| CN109790345B true CN109790345B (en) | 2021-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780059505.7A Active CN109790345B (en) | 2016-09-28 | 2017-07-27 | Resin composition, outer sealing tape, and package for electronic component |
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| Country | Link |
|---|---|
| JP (1) | JP6358403B1 (en) |
| CN (1) | CN109790345B (en) |
| MY (1) | MY174235A (en) |
| TW (1) | TWI738837B (en) |
| WO (1) | WO2018061442A1 (en) |
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|---|---|---|---|---|
| JP7218505B2 (en) * | 2018-05-14 | 2023-02-07 | 凸版印刷株式会社 | Sealant film for ultraviolet shielding packaging material, packaging material and packaging body |
| JP6763421B2 (en) * | 2018-09-18 | 2020-09-30 | 大日本印刷株式会社 | Cover tape and packaging for electronic component packaging |
| JP7206747B2 (en) * | 2018-09-26 | 2023-01-18 | 東ソー株式会社 | Adhesive resin composition and easily peelable film |
| JP6806753B2 (en) * | 2018-09-28 | 2021-01-06 | 住友ベークライト株式会社 | Cover tape and packaging for electronic components |
| JP6795569B2 (en) * | 2018-09-28 | 2020-12-02 | 住友ベークライト株式会社 | Cover tape and packaging for electronic components |
| CN113646242B (en) * | 2019-04-03 | 2023-04-21 | 大日本印刷株式会社 | Cover tape for packaging electronic components and package |
| CN114728741A (en) * | 2019-11-15 | 2022-07-08 | 住友电木株式会社 | Cover tape and electronic component package |
| CA3159691A1 (en) * | 2019-11-28 | 2021-06-03 | Dow-Mitsui Polychemicals Co., Ltd. | Resin pellet, method of manufacturing resin pellet, gravure ink and wirecoating material |
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| CN1394797A (en) * | 2001-06-26 | 2003-02-05 | 住友电木株式会社 | Sealing belt for electronic parts |
| CN105518897A (en) * | 2013-09-03 | 2016-04-20 | 大日本印刷株式会社 | Resin composition for sealant layer of battery packaging material |
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| JP5419607B2 (en) * | 2009-09-15 | 2014-02-19 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
| JP5602067B2 (en) * | 2011-03-09 | 2014-10-08 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
| TWI564151B (en) * | 2011-03-30 | 2017-01-01 | 住友電木股份有限公司 | Film and packaged product |
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2017
- 2017-07-27 CN CN201780059505.7A patent/CN109790345B/en active Active
- 2017-07-27 JP JP2017549530A patent/JP6358403B1/en active Active
- 2017-07-27 WO PCT/JP2017/027195 patent/WO2018061442A1/en active Application Filing
- 2017-07-27 MY MYPI2019001366A patent/MY174235A/en unknown
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| JP2002309044A (en) * | 2001-04-10 | 2002-10-23 | Nippon Unicar Co Ltd | Resin composition for polyolefin-based tape base material, and tape base material produced therefrom |
| CN1394797A (en) * | 2001-06-26 | 2003-02-05 | 住友电木株式会社 | Sealing belt for electronic parts |
| CN105518897A (en) * | 2013-09-03 | 2016-04-20 | 大日本印刷株式会社 | Resin composition for sealant layer of battery packaging material |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI738837B (en) | 2021-09-11 |
| CN109790345A (en) | 2019-05-21 |
| TW201829594A (en) | 2018-08-16 |
| MY174235A (en) | 2020-04-01 |
| JPWO2018061442A1 (en) | 2018-09-27 |
| JP6358403B1 (en) | 2018-07-18 |
| WO2018061442A1 (en) | 2018-04-05 |
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