MY174235A - Resin composition, cover tape, and electronic component package - Google Patents

Resin composition, cover tape, and electronic component package

Info

Publication number
MY174235A
MY174235A MYPI2019001366A MYPI2019001366A MY174235A MY 174235 A MY174235 A MY 174235A MY PI2019001366 A MYPI2019001366 A MY PI2019001366A MY PI2019001366 A MYPI2019001366 A MY PI2019001366A MY 174235 A MY174235 A MY 174235A
Authority
MY
Malaysia
Prior art keywords
mass
resin composition
based resin
equal
carboxylic acid
Prior art date
Application number
MYPI2019001366A
Inventor
Hiroki Abe
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY174235A publication Critical patent/MY174235A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Sealing Material Composition (AREA)
  • Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The resin composition of the present invention is a resin composition which constitutes a sealant layer (2) provided on one surface of a cover tape {10) sealing a carrier tape {20) having recesses capable of accommodating electronic parts and contains (A) polyolefin-based resin, (B) antistatic agent, and at least one of (C) polystyrene-based resin and (D) (meth)acrylic acid ester polymer, in which (A) polyolefin-based resin contains a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, a proportion of the structural unit I derived from a carboxylic acid or a carboxylic acid derivative in a total amount of (A) polyolefin-based resin is equal to or higher than 1% by mass and equal to or lower than 5% by mass, and a total content of (C) polystyrene-based resin and (D) (meth)acrylic acid ester polymer with respect to 100 parts by mass of the resin composition is equal to or greater than 3 parts by mass and equal to or smaller than 65 parts by mass.
MYPI2019001366A 2016-09-28 2017-07-27 Resin composition, cover tape, and electronic component package MY174235A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016189581 2016-09-28
JP2016191839 2016-09-29
PCT/JP2017/027195 WO2018061442A1 (en) 2016-09-28 2017-07-27 Resin composition, cover tape, and electronic component package

Publications (1)

Publication Number Publication Date
MY174235A true MY174235A (en) 2020-04-01

Family

ID=61762725

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019001366A MY174235A (en) 2016-09-28 2017-07-27 Resin composition, cover tape, and electronic component package

Country Status (5)

Country Link
JP (1) JP6358403B1 (en)
CN (1) CN109790345B (en)
MY (1) MY174235A (en)
TW (1) TWI738837B (en)
WO (1) WO2018061442A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7218505B2 (en) * 2018-05-14 2023-02-07 凸版印刷株式会社 Sealant film for ultraviolet shielding packaging material, packaging material and packaging body
JP6763421B2 (en) * 2018-09-18 2020-09-30 大日本印刷株式会社 Cover tape and packaging for electronic component packaging
JP7206747B2 (en) * 2018-09-26 2023-01-18 東ソー株式会社 Adhesive resin composition and easily peelable film
JP6795569B2 (en) * 2018-09-28 2020-12-02 住友ベークライト株式会社 Cover tape and packaging for electronic components
JP6806753B2 (en) * 2018-09-28 2021-01-06 住友ベークライト株式会社 Cover tape and packaging for electronic components
CN113646242B (en) * 2019-04-03 2023-04-21 大日本印刷株式会社 Cover tape for packaging electronic components and package
WO2021095638A1 (en) * 2019-11-15 2021-05-20 住友ベークライト株式会社 Cover tape and electronic part package
CN114746480B (en) * 2019-11-28 2024-06-04 三井-陶氏聚合化学株式会社 Resin pellet, method for producing resin pellet, gravure ink, and wire coating material
CN111117032A (en) * 2019-12-25 2020-05-08 武汉江成东顺新材料科技有限公司 Low-static winding film and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815545A (en) * 1981-07-20 1983-01-28 Du Pont Mitsui Polychem Co Ltd Heat-sealable resin composition
JP4400800B2 (en) * 1999-07-06 2010-01-20 三井・デュポンポリケミカル株式会社 Resin composition and laminate thereof
JP2002309044A (en) * 2001-04-10 2002-10-23 Nippon Unicar Co Ltd Resin composition for polyolefin-based tape base material, and tape base material produced therefrom
DE60213914T2 (en) * 2001-06-26 2007-02-22 Sumitomo Bakelite Co. Ltd. Masking tape for packaging electronic components
JP5419607B2 (en) * 2009-09-15 2014-02-19 三井・デュポンポリケミカル株式会社 Sealant material, cover tape, and packaging for transporting electronic components
JP5602067B2 (en) * 2011-03-09 2014-10-08 三井・デュポンポリケミカル株式会社 Sealant material, cover tape, and packaging for transporting electronic components
TWI564151B (en) * 2011-03-30 2017-01-01 住友電木股份有限公司 Film and packaged product
WO2015033958A1 (en) * 2013-09-03 2015-03-12 大日本印刷株式会社 Resin composition for sealant layer of battery packaging material

Also Published As

Publication number Publication date
WO2018061442A1 (en) 2018-04-05
CN109790345B (en) 2021-02-12
TW201829594A (en) 2018-08-16
CN109790345A (en) 2019-05-21
TWI738837B (en) 2021-09-11
JPWO2018061442A1 (en) 2018-09-27
JP6358403B1 (en) 2018-07-18

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