MY174235A - Resin composition, cover tape, and electronic component package - Google Patents
Resin composition, cover tape, and electronic component packageInfo
- Publication number
- MY174235A MY174235A MYPI2019001366A MYPI2019001366A MY174235A MY 174235 A MY174235 A MY 174235A MY PI2019001366 A MYPI2019001366 A MY PI2019001366A MY PI2019001366 A MYPI2019001366 A MY PI2019001366A MY 174235 A MY174235 A MY 174235A
- Authority
- MY
- Malaysia
- Prior art keywords
- mass
- resin composition
- based resin
- equal
- carboxylic acid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Sealing Material Composition (AREA)
- Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The resin composition of the present invention is a resin composition which constitutes a sealant layer (2) provided on one surface of a cover tape {10) sealing a carrier tape {20) having recesses capable of accommodating electronic parts and contains (A) polyolefin-based resin, (B) antistatic agent, and at least one of (C) polystyrene-based resin and (D) (meth)acrylic acid ester polymer, in which (A) polyolefin-based resin contains a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, a proportion of the structural unit I derived from a carboxylic acid or a carboxylic acid derivative in a total amount of (A) polyolefin-based resin is equal to or higher than 1% by mass and equal to or lower than 5% by mass, and a total content of (C) polystyrene-based resin and (D) (meth)acrylic acid ester polymer with respect to 100 parts by mass of the resin composition is equal to or greater than 3 parts by mass and equal to or smaller than 65 parts by mass.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016189581 | 2016-09-28 | ||
JP2016191839 | 2016-09-29 | ||
PCT/JP2017/027195 WO2018061442A1 (en) | 2016-09-28 | 2017-07-27 | Resin composition, cover tape, and electronic component package |
Publications (1)
Publication Number | Publication Date |
---|---|
MY174235A true MY174235A (en) | 2020-04-01 |
Family
ID=61762725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019001366A MY174235A (en) | 2016-09-28 | 2017-07-27 | Resin composition, cover tape, and electronic component package |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6358403B1 (en) |
CN (1) | CN109790345B (en) |
MY (1) | MY174235A (en) |
TW (1) | TWI738837B (en) |
WO (1) | WO2018061442A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7218505B2 (en) * | 2018-05-14 | 2023-02-07 | 凸版印刷株式会社 | Sealant film for ultraviolet shielding packaging material, packaging material and packaging body |
JP6763421B2 (en) * | 2018-09-18 | 2020-09-30 | 大日本印刷株式会社 | Cover tape and packaging for electronic component packaging |
JP7206747B2 (en) * | 2018-09-26 | 2023-01-18 | 東ソー株式会社 | Adhesive resin composition and easily peelable film |
JP6795569B2 (en) * | 2018-09-28 | 2020-12-02 | 住友ベークライト株式会社 | Cover tape and packaging for electronic components |
JP6806753B2 (en) * | 2018-09-28 | 2021-01-06 | 住友ベークライト株式会社 | Cover tape and packaging for electronic components |
CN113646242B (en) * | 2019-04-03 | 2023-04-21 | 大日本印刷株式会社 | Cover tape for packaging electronic components and package |
WO2021095638A1 (en) * | 2019-11-15 | 2021-05-20 | 住友ベークライト株式会社 | Cover tape and electronic part package |
CN114746480B (en) * | 2019-11-28 | 2024-06-04 | 三井-陶氏聚合化学株式会社 | Resin pellet, method for producing resin pellet, gravure ink, and wire coating material |
CN111117032A (en) * | 2019-12-25 | 2020-05-08 | 武汉江成东顺新材料科技有限公司 | Low-static winding film and preparation method thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5815545A (en) * | 1981-07-20 | 1983-01-28 | Du Pont Mitsui Polychem Co Ltd | Heat-sealable resin composition |
JP4400800B2 (en) * | 1999-07-06 | 2010-01-20 | 三井・デュポンポリケミカル株式会社 | Resin composition and laminate thereof |
JP2002309044A (en) * | 2001-04-10 | 2002-10-23 | Nippon Unicar Co Ltd | Resin composition for polyolefin-based tape base material, and tape base material produced therefrom |
DE60213914T2 (en) * | 2001-06-26 | 2007-02-22 | Sumitomo Bakelite Co. Ltd. | Masking tape for packaging electronic components |
JP5419607B2 (en) * | 2009-09-15 | 2014-02-19 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
JP5602067B2 (en) * | 2011-03-09 | 2014-10-08 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
TWI564151B (en) * | 2011-03-30 | 2017-01-01 | 住友電木股份有限公司 | Film and packaged product |
WO2015033958A1 (en) * | 2013-09-03 | 2015-03-12 | 大日本印刷株式会社 | Resin composition for sealant layer of battery packaging material |
-
2017
- 2017-07-27 CN CN201780059505.7A patent/CN109790345B/en active Active
- 2017-07-27 MY MYPI2019001366A patent/MY174235A/en unknown
- 2017-07-27 JP JP2017549530A patent/JP6358403B1/en active Active
- 2017-07-27 WO PCT/JP2017/027195 patent/WO2018061442A1/en active Application Filing
- 2017-08-03 TW TW106126162A patent/TWI738837B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2018061442A1 (en) | 2018-04-05 |
CN109790345B (en) | 2021-02-12 |
TW201829594A (en) | 2018-08-16 |
CN109790345A (en) | 2019-05-21 |
TWI738837B (en) | 2021-09-11 |
JPWO2018061442A1 (en) | 2018-09-27 |
JP6358403B1 (en) | 2018-07-18 |
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