TWI738837B - Resin composition, covering tape and package for electronic component - Google Patents

Abstract

The present invention provides a resin composition that constitutes a sealant layer provided on one surface side of a covering tape, which seals a carrier tape having a recess capable of housing electronic components, and that comprises at least one of (A) polyolefin-based resin, (B) antistatic agent, (C) polystyrene-based resin and (D) (meth) acrylate polymer, wherein (A) polyolefin-based resin comprises a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, the ratio of the structural unit I derived from a carboxylic acid or a carboxylic acid derivative is 1-5% by mass to the total amount of (A) polyolefin-based resin, and the total content of (C) polystyrene-based resin and (D) (meth) acrylate polymer is 3-65 parts by mass to 100 parts by mass of the resin composition.

Description

Resin composition, cover tape and packaging for electronic parts

The invention relates to a resin composition, a covering tape and a packaging body for electronic parts.

As a method of transporting electronic components, there is known a taping reel method in which the electronic components are packaged in packaging materials and transported. In this reel method, a package is transported in a state wound on a reel, and the package is inserted by inserting electronic components into a continuous pocket for storing electronic components. In the carrier tape, the cover tape is heat-sealed and packaged from above.

As such a technique, for example, the technique described in Patent Document 1 can be cited. According to this document, a resin composition for a polyolefin tape base material is described. The examples of this document describe the use of an ethylene-ethyl acrylate copolymer (NUC-6520, ethyl acrylate content: 24% by weight) as the resin composition (paragraph 0026).

[Prior Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Application Publication No. 2002-309044

However, when the sealant layer of the cover tape is formed using the technique described in Patent Document 1, in terms of both adhesion resistance to electronic parts and adhesion (heat sealability) to the carrier tape, the resulting seal The agent layer has room for improvement.

According to the present invention, there is provided a resin composition which constitutes a sealant layer provided on one side of the cover tape in a cover tape for sealing a carrier tape having recesses capable of accommodating electronic parts, wherein the resin composition Contains: (A) polyolefin resin; (B) antistatic agent; and (C) at least one of polystyrene resin and (D) (meth)acrylate polymer, the aforementioned (A) poly The olefin resin contains the structural unit I derived from a carboxylic acid or a carboxylic acid derivative, and the ratio of the structural unit I derived from the carboxylic acid or a carboxylic acid derivative is 1% by mass relative to the total amount of the polyolefin resin (A) Above 5% by mass or less, the total amount of the content of the aforementioned (C) polystyrene resin and the aforementioned (D) (meth)acrylate polymer is 3 parts by mass to 65 parts by mass relative to 100 parts by mass of the resin composition the following.

In addition, according to the present invention, there is provided a resin composition which constitutes a sealant layer provided on one side of the cover tape in a cover tape for sealing a carrier tape having recesses capable of accommodating electronic components, wherein the resin The composition includes: (A) polyolefin resin; (B) antistatic agent; (C) at least any one of polystyrene resin and (D) (meth)acrylate polymer; and (E) Tackifier, the aforementioned (A) polyolefin-based resin contains structural unit II derived from α-olefin, the total amount of the aforementioned (C) polystyrene-based resin and the aforementioned (D) (meth)acrylate polymer content It is 3 parts by mass or more and 65 parts by mass or less with respect to 100 parts by mass of the resin composition.

Furthermore, according to the present invention, there is provided a cover tape comprising: a substrate layer; and a sealant layer provided on one side of the substrate layer. Sealing is performed, wherein the aforementioned sealant layer is composed of the aforementioned resin composition.

In addition, according to the present invention, there is provided a packaging body for electronic parts, which is composed of a parts storage tape, the parts storage tape including: a paper carrier tape, arranged at a predetermined interval to form part storage parts for accommodating electronic parts; and a cover tape It is provided so as to cover the parts storage portion formed on the paper carrier tape, the parts storage tape can be wound into a reel shape, and the cover tape is composed of the cover tape.

According to the present invention, it is possible to provide a cover tape with improved antistatic properties, good adhesion resistance to electronic parts, and good heat sealability to carrier tapes, a resin composition for forming the cover tape, and the use of The packaging body for electronic parts of the cover tape.

1: Substrate layer

2: Sealant layer

3: conductive layer

10: Cover tape

10a: surface

20: carrier tape

20a: bottom surface

21: Bag Department

100: package body

The above objectives and other objectives, features and advantages will be further clarified by the preferred embodiments described below and the following drawings attached hereto.

Fig. 1 is a diagram showing an example of a cover tape for packaging electronic parts according to the present embodiment.

Fig. 2 is a diagram showing an example of the cover tape for packaging electronic parts of the present embodiment.

Fig. 3 is a diagram showing an example of a state in which the cover tape for packaging electronic parts of the present embodiment is sealed to the carrier tape.

Hereinafter, the present invention will be described based on the embodiments and appropriately using drawings. In addition, in all the drawings, the same constituent elements are given the same reference numerals, and the description is appropriately omitted.

In addition, the configurations and requirements described in the embodiments can be appropriately combined as long as they do not impair the effects of the invention.

The outline of the cover tape of the present embodiment will be described.

Fig. 1 is a cross-sectional view showing an example of a cover tape 10 for packaging electronic parts according to the present embodiment. 3 is a diagram showing an example of the packaging body 100 in a state where the carrier tape 20 made of paper is sealed by the cover tape 10 for packaging electronic parts of the present embodiment.

As shown in FIG. 1, the cover tape 10 of this embodiment can include a base layer 1 and a sealant layer 2 provided on one side of the base layer 1.

As shown in FIG. 3, the cover tape 10 of this embodiment can be used for sealing the paper-made carrier tape (carrier tape 20) which has the recessed part (pocket part 21) which can accommodate electronic components. This kind of cover tape 10 can be used as a cover tape for packaging electronic parts capable of heat-sealing the carrier tape 20.

According to the cover tape 10 of this embodiment, it is possible to realize the cover tape 10 having excellent adhesion to a paper carrier tape and adhesion resistance to electronic parts.

Hereinafter, the configuration of the cover tape 10 of the present embodiment will be described in detail.

As an example of the cover tape 10 of this embodiment, as shown in FIG. 1, the base material layer 1 and the sealant layer 2 can be provided. The sealant layer 2 may be provided on one side of the base layer 1.

<Substrate layer>

The material constituting the above-mentioned base material layer 1 is capable of withstanding the use of the cover tape when the cover tape 10 is adhered to the carrier tape 20 when the sealant layer 2 or other layers are laminated on the base material layer 1 The mechanical strength of the degree of stress applied from the outside such as 10 o'clock, can withstand the application of the cover tape 10 when the carrier tape 20 is bonded The heat resistance of the degree of thermal history is better. In addition, the form of the material constituting the base layer is not particularly limited, but from the viewpoint of ease of processing, it is preferably processed into a film shape.

As specific examples of the material constituting the base layer 1, for example, polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, and polyamide resins can be cited. Amine resin, polycarbonate resin, ABS resin, etc. These can be used individually or in combination of 2 or more types. Among them, from the viewpoint of improving the mechanical strength of the cover tape 10, a polyester-based resin can be used. In addition, from the viewpoint of improving the mechanical strength and flexibility of the cover tape 10, nylon 6 may also be used as the material constituting the base layer 1. In addition, the material constituting the base material layer 1 may contain a lubricating material.

The base material layer 1 may be formed of a single-layer film containing the above-mentioned material, or may be formed using a multilayer film containing the above-mentioned material in each layer. In addition, the form of the film used to form the base layer 1 may be an unstretched film, or a film stretched in a uniaxial or biaxial direction, but from the viewpoint of improving the mechanical strength of the cover tape 10 A film stretched in a uniaxial direction or a biaxial direction is preferred.

The lower limit of the thickness of the base material layer 1 is, for example, 5 μm or more, and preferably can be 10 μm or more. Thereby, the mechanical strength of the cover tape 10 can be improved, and therefore even when the cover tape 10 is peeled off from the carrier tape 20 at a high speed, the cover tape 10 can be suppressed from breaking. On the other hand, the upper limit of the thickness of the base material layer 1 is, for example, 50 μm or less, preferably 40 μm or less, and more preferably 30 μm or less. Thereby, the rigidity of the cover tape 10 does not become too high, and even when a torsional stress is applied to the sealed carrier tape 20, the cover tape 10 can follow the deformation of the carrier tape 20 and suppress peeling.

The total light transmittance of the substrate layer 1 is, for example, 80% or more, preferably 85% or more. By setting it in this way, it is possible to provide the base material layer 1 in the package 100, and it is possible to check whether the electronic components are accurately contained in the package 100. The degree of transparency required in the pocket 21 of the carrier tape 20. Therefore, the electronic components contained in the package 100 can be seen and confirmed from the outside of the package 100. In addition, the total light transmittance of the base material layer 1 can be measured in accordance with JIS K7105 (1981).

<Sealant layer>

In the present embodiment, in the cover tape 10 that seals the carrier tape 20 having recesses capable of accommodating electronic components, the resin composition constituting the sealant layer 2 provided on one side of the cover tape 10 (hereinafter, sometimes Also referred to as a resin composition for forming a sealant layer) can contain (A) polyolefin resin, (B) antistatic agent, (C) polystyrene resin, and (D) (meth)acrylate polymer At least any one of them.

The sealant layer 2 of the present embodiment is composed of a resin composition for forming a sealant layer, and is obtained, for example, by extrusion molding the resin composition for forming a sealant layer into a film shape. When the sealant layer 2 is laminated on the base layer 1, for example, a method of extrusion-laminating the resin composition for forming a sealant layer on the base layer 1 can be used.

The inventors of the present invention conducted research on the sealant layer, and as a result, it was found that generally, if the adhesiveness of the sealant layer to the paper carrier tape is increased, the adhesiveness with the electronic components will also increase, and the electronic components will adhere to them during transportation. Sealant layer.

In response to this, it is known that by adjusting the polarity of the resin contained in the sealant layer, it is possible to reduce the affinity with electronic parts and improve the adhesion to the paper carrier tape.

In this embodiment, for example, by appropriately selecting the type and amount of the resin composition for forming the sealant layer forming the sealant layer 2 in the cover tape 10, the preparation method of the resin composition for forming the sealant layer, and the cover tape 10 The layered structure, etc., can control the above-mentioned peeling strength and the adhesion ratio of electronic parts. At that Among others, as the requirements for adjusting the peel strength and the adhesion ratio of electronic parts, for example, the use of (i) using the appropriate control of the type and content ratio of the polar group and the content ratio of the specific polar group to a predetermined Ethylene copolymer below the value; or (ii) At the same time, use a polyolefin resin that does not contain a polar group or a reduced polar group content, and a tackifier that improves the adhesion with the carrier tape to adjust the polarity and paper carrier tape Polyolefin resin with excellent balance of adhesion with resin or metal, etc.

((A) Polyolefin resin)

The resin composition for forming a sealant layer of this embodiment can contain (A) a polyolefin resin.

The above-mentioned (A) polyolefin resin can contain at least any one of structural unit I derived from carboxylic acid or a carboxylic acid derivative and structural unit II derived from α-olefin. These may be used alone or in combination of two or more kinds.

From the viewpoint of improving the adhesive strength with the paper carrier tape, the above-mentioned (A) polyolefin resin can include, for example, a copolymer having structural unit I derived from a carboxylic acid or a carboxylic acid derivative. The copolymer may be either a binary copolymer or a ternary copolymer.

At this time, in the above-mentioned (A) polyolefin resin, the ratio of the repeating structural unit I derived from carboxylic acid or a derivative of carboxylic acid (for example, the structural unit derived from maleic anhydride in (A) polyolefin resin The ratio of) relative to the total amount of the (A) polyolefin resin is preferably 1% by mass or more and 5% by mass or less, and more preferably 2% by mass or more and 4% by mass or less. Thereby, it is possible to improve the balance between the adhesion to the paper carrier tape and the adhesion resistance to electronic parts.

Examples of the carboxylic acid or carboxylic acid derivative include maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, monomethyl maleate, monoethyl maleate, and maleic acid. Diethyl, fumaric acid mono Methyl ester and so on. These may be used alone or in combination of two or more kinds. Among them, maleic anhydride can be used. That is, the above-mentioned structural unit I can include a structural unit derived from maleic anhydride. Although the detailed mechanism is not clear, it is thought that by selecting and adjusting the polarity of the resin such as the content rate of the maleic anhydride-derived structure, the adhesion to paper (cellulose) is good, and the metal electrode and thermistor, etc. (A) Polyolefin resin, which has low adhesion between the epoxy resins of the outer layer of the inductor, etc., and excellent adhesion balance, can improve the adhesion to the carrier tape while reducing the Adhesion of electronic parts.

The above-mentioned copolymer can contain structural units derived from other monomers in addition to structural units derived from carboxylic acids or carboxylic acid derivatives. As other monomers, for example, olefin-based monomers such as ethylene and propylene; acrylic esters such as methyl acrylate, ethyl acrylate, and butyl acrylate; (meth)acrylic monomers such as acrylic acid and methacrylic acid can be used. These may be used alone or in combination of two or more kinds.

As a specific example of the said (A) polyolefin resin, for example, ethylene-maleic anhydride copolymer or ethylene-(meth)acrylate-maleic anhydride copolymer can be contained. As an example of this ethylene-(meth)acrylate-maleic anhydride copolymer, an ethylene-ethyl acrylate-maleic anhydride copolymer can be mentioned, for example. Thereby, it is possible to better balance the adhesion with the paper carrier tape and the adhesion resistance to electronic parts.

In addition, from the viewpoint of reducing the affinity for potential parts, the above-mentioned (A) polyolefin-based resin can contain a homopolymer or copolymer having structural unit II derived from α-olefins such as ethylene, propylene, and butene. This type of (A) polyolefin resin can contain polyethylene or an ethylene copolymer.

When the above-mentioned (A) polyolefin resin has structural unit II derived from α-olefin, the resin composition for forming a sealant layer of this embodiment can further contain (E) a tackifier. At this time, in the above (A) polyolefin resin, the upper limit of the ratio of the repeating structural unit I derived from carboxylic acid or carboxylic acid derivative is relative to the (A) polyolefin resin The total amount of the hydrocarbon resin is, for example, 5 mass% or less, preferably 4 mass% or less, and more preferably 3 mass% or less. On the other hand, the lower limit of the ratio of the repeating structural unit I derived from the carboxylic acid or its derivative is, for example, 0% by mass or more with respect to the total amount of the (A) polyolefin resin. Thereby, it is possible to improve the balance between the adhesion to the paper carrier tape and the adhesion resistance to electronic parts.

As the above-mentioned polyethylene, for example, low-density polyethylene can be used.

Examples of the ethylene copolymers include resins such as ethylene-vinyl acetate copolymers, ethylene-aliphatic unsaturated carboxylic acid copolymers, ethylene-aliphatic unsaturated carboxylic acid ester copolymers, and ionomers. By using this kind of resin, the peel strength to the carrier tape 20 can be improved.

As said ethylene-aliphatic unsaturated carboxylic acid copolymer, an ethylene-acrylic acid copolymer, an ethylene-methacrylic acid copolymer, etc. are mentioned, for example.

As said ethylene-aliphatic unsaturated carboxylate copolymer, an ethylene-acrylate copolymer, an ethylene-methacrylate copolymer, etc. are mentioned, for example. As acrylates and methacrylates, esters with alcohols having 1 to 8 carbon atoms, such as methanol and ethanol, can be preferably used. Among the above-mentioned ethylene-aliphatic unsaturated carboxylate copolymers, from the viewpoint of versatility, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, or ethylene-methyl methacrylate copolymer is Better.

Among the above resins, the ethylene copolymer is preferably an ethylene-vinyl acetate copolymer or an ethylene-aliphatic unsaturated carboxylic acid ester copolymer from the viewpoint of adhesion to the carrier substrate and cost.

In this embodiment, the ethylene-vinyl acetate copolymer is a copolymer obtained by copolymerizing at least ethylene and vinyl acetate, and the ethylene-aliphatic unsaturated carboxylic acid ester copolymer is at least a copolymer of ethylene and aliphatic unsaturated carboxylic acid. The copolymer obtained by copolymerization of ester may be further copolymerized with other monomers according to the situation.

When the (A) polyolefin resin contains a vinyl acetate copolymer, the ratio of vinyl acetate in all monomers constituting the copolymer is preferably 12% by mass or less, and more preferably 10% by mass or less. Thereby, the adhesion resistance of electronic components can be improved.

In addition, when the (A) polyolefin resin contains an aliphatic unsaturated carboxylic acid ester copolymer such as ethyl acrylate, the upper limit of the ratio of the aliphatic unsaturated carboxylic acid ester in all monomers constituting the copolymer With respect to the total amount of (A) polyolefin-based resin, for example, it is preferably 12% by mass or less, and more preferably 10% by mass or less. On the other hand, the lower limit of the ratio of the aliphatic unsaturated carboxylic acid ester is, for example, 0% by mass or more with respect to the total amount of (A) polyolefin resin. Thereby, the adhesion resistance of electronic components can be improved. As an example of the ethylene methyl acrylate copolymer, for example, an ethylene methyl acrylate copolymer (Mitsui DuPont Polyche: manufactured by Mical Co., Ltd.: trade name "Elvaloy AC1609"," derived from a structural unit of methyl acrylate The content ratio of ethylene methyl acrylate is 9% by mass), ethylene methyl acrylate copolymer (manufactured by Japan Polyethylene Corporation: trade name "REXPERL EB330H", the content ratio of structural units derived from methyl acrylate is 12% by mass), and ethylene ethyl acrylate copolymer ( Manufactured by NUC Corporation: Trade name "NUC-6220", derived from ethyl acrylate with a content of 7% by mass), ethylene ethyl acrylate copolymer (manufactured by Japan Polyethylene Corporation: Trade name "REXPERL A3100", derived from acrylic acid) The content ratio of the structural unit of ethyl ester is 10% by mass), ethylene methyl methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd.: trade name "WD301-F", derived from the structural unit of methyl methacrylate) The content ratio is 10% by mass) and so on. Thereby, the adhesion resistance of the electronic component can be improved, and the peel strength to the carrier tape 20 can be improved.

From the standpoint of peel strength, the value of the melt flow rate of the polyolefin resin (A) measured in accordance with JIS-K-7210 (hereinafter, sometimes referred to as "MFR") (190°C, 2.16kg) is 0.1g~ 100g is preferable, and 1g-50g is more preferable. Thereby, the peel strength with the carrier tape 20 can be made better.

In this embodiment, the content of (A) polyolefin resin relative to 100 parts by mass of the resin composition constituting the sealant layer 2 is 20 parts by mass or more, preferably 30 parts by mass or more, and more preferably 45 parts by mass or more .

By setting the content of (A) polyolefin-based resin in this way, it is possible to achieve appropriate peel strength as the sealant layer 2.

In addition, in this embodiment, the content of (A) polyolefin resin relative to 100 parts by mass of the resin composition constituting the sealant layer 2 is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and still more preferably It is 78 parts by mass or less.

By setting the content of (A) polyolefin resin in this way, it is possible to achieve a higher level of antistatic performance.

((B) Antistatic agent)

The resin composition for forming a sealant layer of this embodiment can contain (B) an antistatic agent. As said (B) antistatic agent, lithium ion can be contained. In this embodiment, by using the above-mentioned lithium ion-containing agent as the (B) antistatic agent, as the sealant layer 2, it is possible to achieve better antistatic ability. More specifically, a polymer type antistatic agent in which lithium ions are present in the resin can be used. In this way, the excellent antistatic performance can be continuously and stably exerted.

The above-mentioned lithium ion can be contained in the antistatic agent in the form of, for example, a lithium salt. Examples of the lithium salt include lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and pentafluoroethane. Lithium sulfonate, etc. These may be used alone or in combination of two or more kinds.

In addition, the lithium ion contained in the (B) antistatic agent can be confirmed by measuring the amount of metal elements. In this embodiment, the amount of lithium ions contained in the antistatic agent is preferably set to 50 μg/g or more (50 ppm or more), for example.

Furthermore, in this embodiment, (B) the antistatic agent can use a well-known antistatic agent in addition to the aforementioned lithium ion.

Examples of such antistatic agents include polyether amide and other polyamide-based copolymers, block polymers of polyolefin and polyether, including polyvinyl ether (polyethylene ether) and glycol (glycol) Polymers, potassium ionomers and other polymers containing carboxylate groups, copolymers containing quaternary ammonium salt groups, tin oxide, zinc oxide, titanium oxide and other metal fillers (fill), polyethylene dioxythiophene /Polystyrene sulfonic acid (PEDOT/PSS) and other thiophene-based conductive polymers. These may be used alone or in combination of two or more kinds.

In addition, in order to prevent deterioration caused by high temperature during extrusion lamination or heat sealing, the thermal decomposition temperature of these (B) antistatic agents is preferably 120°C or higher.

In this embodiment, the content of (B) antistatic agent relative to 100 parts by mass of the resin composition for forming a sealant layer is, for example, 5 parts by mass or more, preferably 8 parts by mass or more, and more preferably 10 parts by mass or more .

By setting the content of the (B) antistatic agent in this way, it is possible to exhibit an appropriate antistatic ability as the sealant layer 2.

Furthermore, in this embodiment, the content of the (B) antistatic agent relative to 100 parts by mass of the resin composition for forming a sealant layer is preferably 25 parts by mass or less, more preferably 20 parts by mass or less, and still more preferably 18 parts by mass or less, particularly preferably 16 parts by mass or less.

Generally speaking, the (B) antistatic agent is expensive, so by setting the content of the antistatic agent in this way, it helps to reduce the cost when making the cover tape.

In addition, in this embodiment, the ratio of the antistatic agent containing lithium ions to 100 parts by mass of the entire antistatic agent (B) is, for example, 50 parts by mass or more, preferably 60 parts by mass or more, more preferably 75 parts by mass Copies or more.

By setting the ratio of the antistatic agent containing lithium ions in this way, it is possible to effectively exert an appropriate antistatic ability as the sealant layer 2.

The upper limit of the ratio of the antistatic agent containing lithium ions relative to 100 parts by mass of the entire antistatic agent (B) is not particularly limited, and the overall antistatic agent (B) may be an antistatic agent containing lithium ions.

((C) Polystyrene resin)

The resin composition for forming a sealant layer of this embodiment can contain (C) a polystyrene resin. Thereby, it is possible to achieve a moderate adjustment of the balance between the antistatic ability and the peel strength.

The above-mentioned (C) polystyrene resin is not particularly limited, and includes, for example, polystyrene, styrene-butadiene-styrene block copolymer (SBS), and styrene-ethylene-butadiene-styrene block Copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-(meth)acrylic acid methyl Ester copolymer, hydrogenated styrene block copolymer, high impact polystyrene (HIPS; High Impact Polystyrene), general purpose polystyrene resin (GPPS; General Purpose Polystyrene), etc. You can combine two or more of these use.

Among them, a styrene-methyl (meth)acrylate copolymer can be used from the viewpoint of high transparency and a well-balanced improvement in antistatic ability and peel strength.

((D)(meth)acrylate polymer)

The resin composition for forming a sealant layer of this embodiment can contain (D) a (meth)acrylate polymer. Thereby, as in the case where the (C) polystyrene resin is included, it is possible to achieve a moderate adjustment of the balance between the antistatic ability and the peel strength.

As said (D) (meth)acrylate polymer, for example, it can be selected from methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate (Meth)acrylate polymer among esters, isobutyl (meth)acrylate, hexyl (meth)acrylate, and ethylhexyl (meth)acrylate. These may be used alone or in combination of two or more kinds.

In addition, as long as these polymers do not belong to the aforementioned components (A) and (C), they can also be copolymers with other monomers.

In addition, in the present embodiment, among these, a methyl (meth)acrylate polymer can be used from the viewpoint of high availability and a well-balanced improvement in antistatic ability and peel strength.

In this specification, (meth)acrylic acid refers to acrylic acid, methacrylic acid, or a mixture of these, and a copolymer with (meth)acrylic acid refers to having one or more acrylic groups or one or more methacrylic groups的copolymer.

In addition, the (D) (meth)acrylate polymer contains, for example, 60 mol% or more of structural units derived from (meth)acrylate, preferably 70 mol% or more, more preferably Those who are more than 80 mol%.

In this embodiment, the lower limit of the total amount of (C) polystyrene resin and (D) (meth)acrylate polymer content relative to 100 parts by mass of the resin composition for forming a sealant layer is, for example, It is 3 parts by mass or more, preferably 5 parts by mass or more, and more preferably 7 parts by mass or more. Thereby, the appropriate antistatic property as the sealant layer 2 can be achieved.

In addition, in this embodiment, the upper limit of the total amount of the content of (C) polystyrene resin and (D) (meth)acrylate polymer relative to 100 parts by mass of the resin composition for forming a sealant layer For example, it is 65 parts by mass or less, preferably 40 parts by mass or less, more preferably 30 parts by mass or less, and still more preferably 20 parts by mass or less. Thereby, higher peel strength can be achieved.

((E) Tackifier)

The resin composition for forming a sealant layer of this embodiment can contain (E) a thickener.

Examples of the (E) tackifier include petroleum resins, rosin resins, terpene resins, styrene resins, kumaron-indene resins, etc., and these may be used alone. It can also be used in combination of two or more types. Among them, petroleum resins can be used from the viewpoint of improving the heat sealability to paper carrier tapes. As said petroleum resin, aliphatic petroleum resin, aromatic petroleum resin, aliphatic aromatic copolymerization petroleum resin, etc. are mentioned, for example. These may be used individually by 1 type, and may use 2 or more types together.

In addition, from the viewpoint of improving the stability to oxidation when the sealant layer 2 is extruded and laminated, an aliphatic petroleum resin can be used as the petroleum resin to be melted and oxidized at a high temperature, and preferably an alicyclic resin can be used. Group saturated hydrocarbon resin petroleum resin.

In addition, as the petroleum resin in this embodiment, from the viewpoint of further improving the heat sealability to the paper carrier tape, hydrogenated petroleum resin can be used as the petroleum resin.

When the (A) polyolefin resin contains a copolymer having a structural unit I derived from a carboxylic acid or a carboxylic acid derivative, the sealant layer 2 of this embodiment may not contain the (E) tackifier.

Also, when the (A) polyolefin resin in the sealant layer 2 contains a copolymer having a structural unit II derived from α-olefin, the sealant layer 2 of this embodiment preferably contains (E) a tackifier . Although the detailed mechanism is not clear, it is believed that by using a low-molecular-weight tackifier, the anchor effect based on its fluidity can be used to improve the adhesion to the paper carrier tape.

In addition, in this embodiment, from the viewpoint of improving the peel strength with the carrier tape 20, the content of the (E) tackifier is lower than 100 parts by mass of the resin composition constituting the sealant layer 2 The limit is preferably more than 7 parts by mass, more preferably 7.5 parts by mass or more.

On the other hand, from the viewpoint of achieving a cover tape that has an excellent balance between adhesion resistance to electronic parts and heat sealability to carrier tape, (E) is increased relative to 100 parts by mass of the resin composition constituting the sealant layer 2 The upper limit of the content of the adhesive may be, for example, 20 parts by mass or less, or 15 parts by mass or less.

In addition, from the viewpoint of realizing a cover tape with an excellent balance between adhesion resistance to electronic parts and heat sealability to carrier tape, in the resin composition constituting the sealant layer 2 of this embodiment, (B) antistatic The total content of the agent and the (E) tackifier is preferably 34 parts by mass or more and 80 parts by mass or less, and more preferably 34 parts by mass or more and 75 parts by mass or less with respect to 100 parts by mass of the polyolefin resin (A).

In addition, in the resin composition constituting the sealant layer 2 of the present embodiment, the content of the (E) tackifier relative to 100 parts by mass of the resin composition is set to X, and is relative to 100 parts by mass of the resin composition. When the total content of (C) polystyrene resin and (D) (meth)acrylate polymer in parts by mass is set to Y, the adhesion resistance to electronic parts and heat sealability to carrier tape can be realized From the viewpoint of a coverage belt with an excellent balance of X/Y, the value of X/Y is preferably 0.2 or more and 15 or less, and more preferably 0.3 or more and 12 or less.

In addition, in this embodiment, the resin composition constituting the sealant layer 2 may contain, for example, an antiblocking agent, a slipping agent, and the like shown below, depending on the application.

As an example of the said antiblocking agent, silica, aluminosilicate (zeolite etc.) etc. are mentioned, for example. By containing the anti-blocking agent, the adhesion of the sealant layer 2 can be alleviated.

As examples of the above-mentioned slip agent, for example, amide palmitate, amide stearate, amide behenate, amide oleate, erucamide, oleyl palmitamide, stearyl palmitate Various amides, such as amide, methylene bisstearyl amide, methylene bis oleamide, ethylene bis oleamide, ethylene bis erucamide, etc., polyethylene glycol, polypropylene glycol, etc. Polyalkylene glycol, hydrogenated castor, etc. When the sealant layer 2 contains a slip agent, processability such as extrusion processing, roll release properties, film sliding properties, etc. can be improved.

In addition, the above-mentioned sealant layer 2 may contain any additives such as various conductive materials, lubricants, plasticizers, antioxidants, ultraviolet absorbers, colorants, various surfactants, and inorganic fillers, within the range of not impairing its characteristics. In addition, coating treatment can be performed.

In this embodiment, the thickness of the sealant layer 2 is preferably 1 μm or more and 30 μm or less, and more preferably 2 μm or more and 20 μm or less. If the thickness of the sealant layer 2 is less than the above upper limit, it is easy to control exudation during heat sealing, and if the thickness of the sealant layer 2 is more than the above lower limit, it is easy to make the cover tape 10 to the carrier tape. The peel strength of 20 becomes better.

In this embodiment, the upper limit of the surface resistivity of the sealant layer 2 at 23°C and 50%RH ^{is preferably 1.0×10 11} Ω/cm ² or less, and 7.0×10 ¹⁰ Ω/cm ² or less. It is more preferable, and 5.0×10 ¹⁰ Ω/cm ² or less is still more preferable. This kind of surface resistivity can be easily achieved by appropriately setting the type and amount of the aforementioned antistatic agent.

In addition, the lower limit of the surface resistivity of the above-mentioned sealant layer 2 is not particularly limited. For example, it can be 1.0×10 ⁵ Ω/cm ² or more.

In addition, the surface resistivity can be measured in an environment with a temperature of 23° C. and a relative humidity of 50% based on JIS K6911 using a surface resistivity measuring device (manufactured by SIMCO).

In addition, as a modified example of the cover tape 10 of this embodiment, as shown in FIG. 2, another layer may be formed on the surface of the base layer 1 on the side opposite to the sealant layer 2. As the other layer, for example, the conductive layer 3 can be used. By using this kind of cover tape 10 for the packaging body 100, the accumulation of static electricity can be more effectively suppressed.

In this embodiment, in the step of transporting the package 100 containing electronic parts, when the bottom surface 20a of the carrier tape and the surface 10a of the cover tape are brought into close contact and then the package 100 is transported, the surface of the conductive layer 3 may be It comes into contact with the bottom surface of the carrier tape 20 and rubs. In this case, the accumulation of static electricity can be more effectively suppressed.

<Conductive layer>

The cover tape 10 for packaging electronic parts of this embodiment may be provided with a conductive layer 3 (antistatic layer) as shown in FIG. 2 in addition to the base layer 1 and the sealant layer 2 described above.

FIG. 2 shows an example in which the conductive layer 3 is provided on the surface of the base layer 1 opposite to the surface on which the sealant layer 2 is provided.

By laminating the conductive layer 3 of this kind, when obtaining a packaging body in which electronic parts are packaged, the accumulation of static electricity can be more effectively suppressed. In particular, in actual processing, the bottom surface 20a of the carrier tape (see FIG. 3) and the cover There are many conditions for transporting the package 100 after the tape surface 10a (refer to FIG. 3) is tightly bonded. Therefore, as the covering tape 10, it is better to provide the conductive layer 3 of this kind.

As the conductive layer 3, for example, a binder resin such as an aziridin-based compound or a ring-opening compound thereof can be contained.

The above-mentioned aziridinyl compound generally refers to a compound having an aziridinyl group. As a specific example thereof, for example, N,N'-hexamethylene-1,6-bis(1-aziridinylcarboxamide ), N,N'-diphenylmethane-4,4'-bis(1-aziridine carboxyamide), trimethylolpropane-tris-β-aziridinyl propionate, N,N '-Toluene-2,4-bis(1-aziridine carboxyamide), trimethylene melamine, trimethylolpropane-tris-β(2-methylaziridine) propionate, double Phthaloyl (isophthaloyl)-1-2-methylaziridine, tri-1-aziridinyl phosphine oxide, tri-1-2-methylaziridine phosphine oxide, etc. In addition, as the above-mentioned aziridinyl compound, commercially available products such as Chemitite PZ-33 and DZ-22E manufactured by Nippon Shokubai Co., Ltd. can also be used. In addition, the ring-opening compound of the aziridinyl compound refers to a compound in which the aziridinyl group in the aziridinyl compound is in a ring-opened state.

The conductive layer 3 described above can further contain an ester compound. The above-mentioned ester compound refers to a compound formed by bonding an organic acid or an inorganic acid and an alcohol through a dehydration reaction. Specific examples thereof include polyethylene terephthalate and polybutylene terephthalate. , Polyethylene naphthalate or their derivatives. These may be used alone or in combination of two or more kinds.

In addition, from the viewpoint of reducing the surface resistance value of the conductive layer 3 and suppressing the generation of static electricity due to friction, the conductive layer 3 may include a conductive polymer. Specific examples of the above-mentioned conductive polymer include polyaniline, polypyrrole, and the like. Among them, polyethylenedioxythiophene/polystyrene sulfonic acid (PEDOT/PSS)-based compounds can be preferably used.

The conductive layer 3 may contain other materials depending on the purpose, and may contain, for example, a surfactant-type antistatic agent.

As a modified example of the cover tape 10 of this embodiment, for example, an intermediate layer may be provided between the base layer 1 and the sealant layer 2. As the intermediate layer, for example, a buffer layer capable of absorbing an impact related to the cover tape 10 or relaxing stress can be used. Thereby, the impact resistance and stress relaxation properties of the entire cover tape 10 can be improved.

The above-mentioned intermediate layer can contain a thermoplastic resin such as an olefin resin or a styrene resin, for example. The above-mentioned thermoplastic resin may have a linear or branched chain structure or a cyclic structure. These may be used alone or in combination of two or more kinds. Among them, from the viewpoint of improving the cushioning properties of the entire cover tape, an olefin-based resin, a styrene-based resin, and a cyclic olefin-based resin may be contained, and it is more preferable that the olefin-based resin may be contained.

From the viewpoint of improving the stress relaxation properties of the entire cover tape, the thickness of the intermediate layer may be, for example, 10 μm or more and 30 μm or less, preferably 15 μm or more and 25 μm or less.

In addition, as a modification of the cover tape 10 of the present embodiment, for example, an adhesive layer can be provided between the base layer 1 and the sealant layer 2 or between the base layer 1 and the conductive layer 3. With this arrangement, the mechanical strength of the cover tape 10 can be improved.

As the material for forming the above-mentioned adhesive layer, for example, well-known isocyanate-based, polyurethane-based, polyester-based, polyethylene imine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based materials can be used. A variety of anchor coat agents (anchor coat agent) in the solvent or water system. These may be used alone or in combination of two or more kinds.

In addition, one or more surface treatments selected from the group consisting of corona treatment, plasma treatment, flame treatment, and primer treatment may be performed on the surface of the base material layer 1. Among them, for example, corona treatment can be used. Thereby, the adhesiveness between the base material layer 1 and the sealant layer 2 can be improved.

The lower limit of the total light transmittance of the cover tape 10 of the present embodiment is preferably 80% or more, and more preferably 85% or more. With this setting, the package 100 including the cover tape 10 and the carrier tape 20 can be provided with transparency required to the extent that it is possible to check whether the electronic components are accurately contained in the pocket of the carrier tape 20. In other words, by setting the total light transmittance of the cover tape 10 to be higher than the above-mentioned lower limit value, it is possible to view and confirm the electronic components contained in the package including the cover tape and the carrier tape from the outside of the package. In addition, the upper limit of the total light transmittance of the cover tape 10 is not particularly limited, and it can be set to 100% or less, for example. In addition, the total light transmittance of the cover tape can be measured in accordance with JIS K7105 (1981).

The upper limit of the haze measured in accordance with JIS K7105 (1998) measurement method A of the cover tape 10 of this embodiment is, for example, 85% or less, preferably 80% or less, and more preferably 75% or less. Thereby, the transparency of the cover tape 10 can be maintained to a level sufficient for the identification and inspection of electronic components using sensors or the like. The lower limit of the above-mentioned haze is not particularly limited, and for example, it can be set to 0% or more.

Next, the package 100 of this embodiment will be described.

The packaging body 100 (electronic component packaging body) of the present embodiment can be constituted by a parts storage tape including: a paper carrier tape (carrier tape 20), and parts storage for storing electronic parts are arranged at predetermined intervals. Section (pocket section 21); and the above-mentioned covering tape 10 is provided in such a way as to cover the parts storage section (bag section 21) formed on the paper carrier tape. The parts storage tape constituting the packaging body 100 of the present embodiment can be wound into a reel shape.

As shown in FIG. 3, the cover tape 10 of this embodiment becomes the cover material of the tape-shaped carrier tape 20 in which the concave-shaped pocket part 21 was continuously provided according to the shape of an electronic component. Specifically, the cover tape 10 is configured to be able to be adhered (for example, heat-sealed) to the surface of the carrier tape 20 so as to cover the entire surface of the opening of the pocket 21 of the carrier tape 20.

The package 100 of this embodiment can be used as follows.

First, electronic components are contained in the pocket 21 of the carrier tape 20. Next, to cover the entire surface of the opening of the bag portion 21 of the carrier tape 20, the cover tape 10 is adhered to the surface of the carrier tape 20 by heat sealing, thereby obtaining the electronic components sealed and contained in the packaging body 100. Into the structure.

The structure containing electronic components is transported to a work area where the packaging body 100 is wound on a reel made of paper or plastic to a work area for surface mounting on an electronic circuit board or the like.

After the structure is transported to the work area, the cover tape 10 is peeled off from the carrier tape 20, and the contained electronic components are taken out.

The adhesiveness between the cover tape 10 of this embodiment and the paper carrier tape (carrier tape 20) is excellent. Therefore, the sealed state can be maintained during the conveyance of the package 100, and thus the conveyance stability can be improved. In addition, the cover tape 10 of the present embodiment has excellent adhesion resistance to electronic components. Therefore, after unsealing the transported package 100, it is possible to maintain a state in which the electronic components can be easily taken out. Therefore, the efficiency of mounting the taken-out electronic components on the substrate can be improved, and the productivity can be improved.

The embodiments of the present invention have been described above, but these are examples of the present invention, and various configurations other than those described above can also be adopted.

Below, an example of a reference form is attached.

1. A resin composition constituting a sealant layer of a cover tape that seals a carrier tape having recesses capable of accommodating electronic parts, wherein the resin composition includes: (A) a polyolefin resin; (B) ) Antistatic agent; and (C) at least one of polystyrene resin and (D) (meth)acrylate polymer, the aforementioned (A) polyolefin resin containing carboxylic acid or its derivative The content of the aforementioned (A) polyolefin-based resin with respect to 100 parts by mass of the resin composition of the binary copolymer or the ternary copolymer of the repeating structural unit of the substance is 20 parts by mass or more.

2. The resin composition according to 1., wherein the (A) polyolefin resin is an ethylene-maleic anhydride copolymer or an ethylene-(meth)acrylate-maleic anhydride copolymer.

3. The resin composition according to 1. or 2., wherein the aforementioned (B) antistatic agent contains lithium ions.

4. The resin composition according to any one of 1. to 3., wherein the content of the repeating structural unit derived from the carboxylic acid or its derivative is 1 mass relative to the total amount of the (A) polyolefin resin % Above 5% by mass.

5. The resin composition according to any one of 1. to 4., wherein the content of the aforementioned (B) antistatic agent relative to 100 parts by mass of the resin composition is 25 parts by mass or less.

6. The resin composition according to any one of 1. to 5., wherein the (C) polystyrene resin comprises a styrene-methyl (meth)acrylate copolymer.

7. The resin composition according to any one of 1. to 6., wherein the (D) (meth)acrylate polymer includes a methyl (meth)acrylate polymer.

8. The resin composition according to any one of 1. to 7., wherein the surface resistivity of the sealant layer at 23° C. and 50% RH is 1.0×10 ¹¹ Ω/cm ² or less.

9. A cover tape that seals a carrier tape having a recess capable of accommodating electronic components, and the cover tape includes a sealant layer composed of the resin composition described in any one of 1. to 8.

In addition, below, examples of reference forms are attached.

1. A resin composition constituting a sealant layer of a cover tape that seals a carrier tape having recesses capable of accommodating electronic parts, wherein the resin composition includes: (A) a polyolefin resin; (B) ) Antistatic agent; and (C) at least one of polystyrene resin and (D) (meth)acrylate polymer, relative to 100 parts by mass of the resin composition (A) polyolefin The content of the resin is 20 parts by mass or more, and the resin composition further contains (E) a tackifier.

2. The resin composition according to 1., wherein the total content of the aforementioned (B) antistatic agent and the aforementioned (E) tackifier is 34 parts by mass or more relative to 100 parts by mass of the aforementioned (A) polyolefin resin 80 Parts by mass or less.

3. The resin composition according to 1. or 2., wherein the content of the aforementioned (E) tackifier relative to 100 parts by mass of the resin composition is set to X, and relative to 100 parts by mass of the resin composition When the total content of the (C) polystyrene resin and the (D) (meth)acrylate polymer in parts is Y, X/Y is 0.2 or more and 15 or less.

4. The resin composition according to any one of 1. to 3., wherein the aforementioned (E) tackifier is a hydrogenated petroleum resin.

5. The resin composition according to any one of 1. to 4., wherein the aforementioned (E) tackifier is a petroleum resin of an alicyclic saturated hydrocarbon resin.

6. The resin composition according to any one of 1. to 5., wherein the aforementioned (B) antistatic agent contains lithium ions.

7. The resin composition according to any one of 1. to 6., wherein the content of the aforementioned (B) antistatic agent relative to 100 parts by mass of the resin composition is not less than 5 parts by mass and not more than 25 parts by mass.

8. The resin composition according to any one of 1. to 7., wherein the surface resistivity of the sealant layer at 23° C. and 50% RH is 1.0×10 ¹¹ Ω/cm ² or less.

9. A cover tape that seals a carrier tape having a recess capable of accommodating electronic components, and the cover tape includes a sealant layer composed of the resin composition described in any one of 1. to 8.

[Example]

Hereinafter, the present invention will be described using examples and comparative examples, but the present invention is not limited to these.

<Preparation of resin composition>

In each example and each comparative example, each component was blended at the blending ratio shown in Table 1 to obtain a resin composition. In addition, the components in Table 1 are those shown below.

(Polyolefin resin)

Polyolefin resin 1: ethylene-ethyl acrylate-maleic anhydride copolymer (manufactured by ARKEMA, trade name "LOTADER6200", the content ratio of the structural unit derived from ethyl acrylate is 6.5% by mass, derived from the structure of maleic anhydride The content ratio of the unit is 2.8% by mass)

Polyolefin resin 2: ethylene-ethyl acrylate copolymer (manufactured by NUC Corporation, trade name "NUC-6220", the content ratio of the structural unit derived from ethyl acrylate is 7 mass%)

Polyolefin resin 3: Low-density polyethylene (manufactured by Sumitomo Chemical Co., Ltd.: trade name "SUMIKATHENE L705")

Polyolefin resin 4: ethylene-ethyl acrylate copolymer (manufactured by NUC Corporation, trade name "NUC-6170", the content ratio of structural units derived from ethyl acrylate is 18% by mass)

Polyolefin resin 5: ethylene-ethyl acrylate copolymer (manufactured by NUC Corporation, trade name "NUC-6570", the content ratio of the structural unit derived from ethyl acrylate is 25% by mass)

(Antistatic agent)

Antistatic agent 1: Antistatic agent containing lithium ion (manufactured by SANYO KASEI CO.,LTD., trade name "Pelectron PVL")

(Polystyrene resin)

Polystyrene resin 1: Styrene-methyl (meth)acrylate copolymer (manufactured by NIPPON STEEL CHEMICAL CO., LTD., trade name "Estyrene MS-600")

‧Polystyrene resin 2: General-purpose polystyrene resin (manufactured by TOYO STYRENE Co., Ltd., trade name "Toyo Styrol G100C")

((Meth)acrylate polymer)

(Meth)acrylate polymer 1: methyl methacrylate homopolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name "SUMIPEX MGSV")

(Tackifier)

Tackifier 1: Hydrogenated petroleum resin of alicyclic saturated hydrocarbon resin (manufactured by ARAKAWA CHEMICAL INDUSTRIES, LTD., trade name "ARKON P-100")

<Manufacturing of Cover Tape>

On a biaxially stretched polyester film (manufactured by TOYOBO CO., LTD.: trade name E7415) with a film thickness of 12 μm, low-density polyethylene (manufactured by Sumitomo Chemical Co., Ltd.: trade name SUMIKATHENE L705) is used as an intermediate layer , The film is made into a thickness of 20μm at an extrusion temperature of 300°C by the extrusion lamination method.

On the intermediate layer formed by the film, the resin composition of the ratio shown in Tables 1 and 2 was further used as a sealant layer, and the film was formed to a thickness of 10 μm at an extrusion temperature of 280° C. to obtain a cover tape.

The following evaluations were performed using the cover tape obtained by the above method.

<Evaluation method>

(Surface resistivity)

With respect to each cover tape obtained in the Examples and Comparative Examples, the surface resistivity of the sealant surface was measured using a surface resistivity meter (manufactured by SIMCO) in an environment with a temperature of 23° C. and a humidity of 50% based on JIS K6911. In addition, the unit is Ω/cm ² .

(Peel strength)

The covering tapes obtained in the Examples and Comparative Examples were sliced into 5.3mm width, and on the surface of a paper carrier tape (manufactured by TOKYO PAPER MFG. CO. LTD.) using a taping machine (Tokyo (Manufactured by Weld Co., Ltd.: TWA-6621) ^{heat sealing was performed under the conditions of 170° C., 4 kg/cm 2} , and 0.005 seconds, and the peel strength immediately after heat sealing was measured. In addition, the measurement of the peeling strength was performed using a peeling tester under the conditions of a peeling speed of 300 mm/min and a peeling angle of about 180°. And, the unit is gf.

(Adhesion resistance to electronic parts)

The cover tapes obtained in the examples and comparative examples were attached to a glass slide with the sealant side of the cover tape facing up, and 20 winding sensors (1608 size) were placed thereon. Test piece. The test piece was allowed to stand for 24 hours under the conditions of 55°C and 60%RH, and further left to stand at room temperature and humidity. 24 hours. Then, the test piece was vibrated for 20 seconds at 1,500 rpm while the slide glass was inverted, and then the number of winding sensors attached to the sealant surface of the cover tape was measured.

Table 1 shows the evaluation results related to the above evaluation items.

It was confirmed that the cover tapes of Examples 1 to 3 were all excellent in antistatic properties and had both excellent adhesion resistance to electronic parts and excellent heat sealability to carrier tapes. On the other hand, the cover tapes of Comparative Example 1 and Comparative Example 4 had low peel strength and did not meet the required level from the viewpoint of excellent heat sealability to the carrier tape. The cover tapes of Comparative Example 2 and Comparative Example 3 had a large number of adhesion of electronic components, and did not meet the required level from the viewpoint of adhesion resistance of electronic components. In addition, the cover tape of Comparative Example 5 had a high surface resistivity and did not meet the conventionally required level from the viewpoint of antistatic properties of the sealant surface.

In addition, it was confirmed that the cover tapes of Examples 4 to 7 were all excellent in antistatic properties, and had both excellent adhesion resistance to electronic parts and excellent heat sealability to carrier tapes. On the other hand, the cover tapes of Comparative Examples 6 and 7 and Comparative Example 10 had low peel strength and did not meet the required level from the viewpoint of excellent heat sealability to the carrier tape. The cover tapes of Comparative Example 8 and Comparative Example 9 had a large number of adhesion of electronic parts, and did not meet the required level from the viewpoint of adhesion resistance of electronic parts. In addition, the cover tape of Comparative Example 11 had a high surface resistivity and did not satisfy the conventionally required level from the viewpoint of antistatic properties of the sealant surface.

This application claims priority based on the Japanese application patent application No. 2016-189581 filed on September 28, 2016 and the Japanese application patent application No. 2016-191839 filed on September 29, 2016, and the disclosures thereof are incorporated herein. All content.

1‧‧‧Substrate layer

2‧‧‧Sealant layer

10‧‧‧covering tape

Claims (21)

A resin composition that forms a sealant layer provided on one side of the cover tape in a cover tape for sealing a carrier tape having recesses capable of accommodating electronic parts, the resin composition comprising: (A) poly Olefin-based resin; (B) antistatic agent; and (C) at least one of polystyrene-based resin and (D) (meth)acrylate polymer, the (A) polyolefin-based resin containing The structural unit I of carboxylic acid or carboxylic acid derivative, the carboxylic acid or carboxylic acid derivative is selected from maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, monomethyl maleate, A group consisting of monoethyl maleate, diethyl maleate and monomethyl fumarate, the ratio of the structural unit I derived from carboxylic acid or carboxylic acid derivative relative to the (A) polyolefin resin The total amount is 1% by mass to 5% by mass, and the total amount of the (C) polystyrene resin and the (D) (meth)acrylate polymer content relative to 100 parts by mass of the resin composition is 3 Parts by mass or more and 65 parts by mass or less. Such as the resin composition of item 1 in the scope of patent application, wherein the structural unit I contains a structural unit derived from maleic anhydride. Such as the resin composition of item 1 or 2 in the scope of the patent application, wherein the (A) polyolefin resin comprises an ethylene-maleic anhydride copolymer or an ethylene-(meth)acrylate-maleic anhydride copolymer. A resin composition that forms a sealant layer provided on one side of the cover tape in a cover tape for sealing a carrier tape having recesses capable of accommodating electronic parts, wherein the resin composition includes: (A) Polyolefin resin; (B) antistatic agent; (C) at least any one of polystyrene resin and (D) (meth)acrylate polymer; and (E) tackifier, the (A) ) The polyolefin resin contains the structural unit II derived from α-olefin, and the total content of the (C) polystyrene resin and the (D) (meth)acrylate polymer is relative to 100 parts by mass of the resin composition It is 3 parts by mass or more and 65 parts by mass or less. For example, the resin composition of item 4 in the scope of the patent application, wherein the (A) polyolefin resin comprises a repeating structure unit I derived from a carboxylic acid or a carboxylic acid derivative, and the repeating structure derived from a carboxylic acid or a carboxylic acid derivative The ratio of the unit I is 5% by mass or less with respect to the total amount of the (A) polyolefin resin. For example, the resin composition of item 4 or 5 of the scope of patent application, wherein the total content of the (B) antistatic agent and the (E) tackifier is 34 parts by mass relative to 100 parts by mass of the (A) polyolefin resin Above 80 parts by mass or less. For example, the resin composition of item 4 or 5 of the scope of patent application, wherein the content of the (E) tackifier relative to 100 parts by mass of the resin composition is set to X, and is relative to 100 parts by mass of the resin composition When the total content of the (C) polystyrene resin and the (D) (meth)acrylate polymer is Y, X/Y is 0.2 or more and 15 or less. For example, the resin composition of item 4 or 5 in the scope of the patent application, wherein the (E) tackifier comprises a petroleum resin of a hydrogenated petroleum resin or an alicyclic saturated hydrocarbon resin. For example, the resin composition of item 1 or 4 in the scope of the patent application, wherein the (A) polyolefin resin comprises an aliphatic unsaturated carboxylic acid ester copolymer, and the proportion of the aliphatic unsaturated carboxylic acid ester copolymer is relative to the ( A) The total amount of polyolefin resin is 12% by mass or less. For example, the resin composition of item 1 or 4 in the scope of patent application, wherein the content of the (A) polyolefin resin is 20 parts by mass or more and 85 parts by mass or less with respect to 100 parts by mass of the resin composition. For example, the resin composition of item 1 or 4 in the scope of patent application, wherein the (B) antistatic agent contains lithium ion. For example, the resin composition of item 1 or 4 in the scope of patent application, wherein the content of the (B) antistatic agent is 5 parts by mass or more and 25 parts by mass or less with respect to 100 parts by mass of the resin composition. For example, the resin composition of item 1 or 4 in the scope of patent application, wherein the (C) polystyrene resin comprises a styrene-methyl (meth)acrylate copolymer. Such as the resin composition of item 1 or 4 of the scope of patent application, which The (D) (meth)acrylate polymer contains a methyl (meth)acrylate polymer. For example, the resin composition of item 1 or 4 in the scope of patent application, wherein the surface resistivity of the sealant layer including the resin composition at 23° C. and 50% RH is 1.0×10 ¹¹ Ω/cm ² or less. A cover tape, comprising: a base material layer; and a sealant layer, arranged on one side of the base material layer, the cover tape being used to seal a carrier tape having recesses capable of accommodating electronic parts, wherein the sealant The layer is composed of the resin composition of any one of items 1 to 15 in the scope of patent application. For example, the covering tape of item 16 in the scope of patent application, wherein the carrier tape is a paper carrier tape. For example, the covering tape of item 16 or 17 of the scope of patent application, wherein an intermediate layer is also provided between the substrate layer and the sealant layer. Such as the covering tape of item 18 of the scope of patent application, wherein the intermediate layer contains one or more thermoplastic resins selected from the group consisting of olefin resins, cyclic olefin resins, and styrene resins. For example, the covering tape of the 16th or 17th item of the scope of patent application, wherein an antistatic layer is further provided on the other side of the base layer on the side opposite to the sealant layer. A packaging body for electronic parts, which is composed of a part storage tape, the parts storage tape includes: a paper carrier tape, arranged at a predetermined interval with a part storage portion for storing electronic parts; and a cover tape to cover the paper The part storage part on the carrier tape is set in a way that the parts storage tape can be wound into a reel shape, and the cover tape is composed of any one of the 16 to 20 patent applications.

Images