KR20240052785A - Cover tape and electronic component packaging - Google Patents

Abstract

A cover tape (10) for packaging electronic components comprising a base material layer (3) and a sealant layer (2) laminated on one side of the base layer (3), wherein the sealant layer (2) includes (A) A cover tape (10) containing a (meth)acrylate copolymer and (B) a petroleum resin.

Description

Cover tape and electronic component packaging

The present invention relates to cover tapes and electronic component packaging. More specifically, it relates to a cover tape and an electronic component package manufactured using the cover tape.

Electronic components such as semiconductor IC chips are packed with packaging materials to prevent contamination after their manufacture and before being provided to the mounting process, and are stored and transported while wound on paper or plastic reels. . To package these electronic components, a tape-like packaging material is used to accommodate the mounting process onto a board using an automatic mounting device. This packaging material consists of a plurality of concave shapes spaced at predetermined intervals on a long sheet. It consists of a carrier tape on which a storage pocket is formed, and a cover tape heat-sealed to the carrier tape. After the electronic component is accommodated in the storage pocket of the carrier tape, a cover tape as a cover material is overlapped on the upper surface of the carrier tape, and immediately after heating, both ends of the cover tape are continuously heat-sealed in the longitudinal direction, creating an electronic component package. .

This electronic component package is transferred to a mounting process on a semiconductor substrate, and then the cover tape is peeled from the carrier tape, the stored electronic component is taken out, and this electronic component is mounted on the semiconductor substrate. In the mounting process of electronic components, it becomes important that the cover tape is peeled off smoothly. In addition, with recent high-speed mounting, the peeling speed of the cover tape is increasing, and thus the peeling strength of the cover tape is required to be improved. For example, in Patent Document 1, from the viewpoint of obtaining a cover tape whose peel strength is not affected by the peel speed and whose peel strength does not increase abnormally during high-speed mounting even in the conventional peel strength management method, a predetermined thickness is used. , a cover tape comprising a base material layer having a tensile modulus of elasticity, a heat seal layer containing polystyrene-based resin, polyethylene-based resin, and fatty acid amide, and having a predetermined thickness and tensile modulus of elasticity is disclosed.

Japanese Patent Publication No. 2005-263257

However, in the technology described in Patent Document 1 mentioned above, when the cover tape is peeled, the sealant layer of the cover tape remains on the carrier tape side, and peeling occurs between the sealant layer and the intermediate layer. As a result, there were cases where appropriate peel strength of the cover tape could not be obtained.

As a result of extensive research, the present inventors have found that by adjusting the composition of the resin composition constituting the heat seal layer, when peeling the cover tape, the heat seal layer of the cover tape is cohesively fractured, and the peeling strength from the carrier tape is reduced. It was found that a cover tape was obtained that was stable and had an excellent appearance after peeling, thereby completing the present invention.

According to the present invention, a cover tape and an electronic component package shown below are provided.

[1] A base layer,

A cover tape for packaging electronic components comprising a sealant layer laminated on one side of the base layer,

The sealant layer is a cover tape containing (A) a (meth)acrylate copolymer and (B) a petroleum-derived resin.

[2] The cover tape according to item [1], wherein the (meth)acrylate content of the (meth)acrylate copolymer (A) is 10 mol% or more and 25 mol% or less.

[3] The melt flow rate (MFR) of the (meth)acrylate copolymer (A) at 190°C and 21.2N is 3 g/10min or more and 15 g/10min or less, according to item [1] or [2]. cover tape.

[4] The (meth)acrylate copolymer (A) is selected from ethylene-methyl (meth)acrylate copolymer, ethylene-ethyl (meth)acrylate copolymer, and ethylene-butyl (meth)acrylate copolymer. The cover tape according to any one of items [1] to [3], comprising at least one selected.

[5] The petroleum-derived resin (B) contains at least one petroleum-derived resin selected from aliphatic-based, aromatic-based, dicyclopentadiene (DCPD)-based, and copolymers thereof, item [1] The cover tape according to any one of ] to [4].

[6] The cover tape according to any one of items [1] to [5], wherein the content of the petroleum-derived resin (B) is 1% by mass or more and 20% by mass or less with respect to the entire sealant layer.

[7] The cover tape according to any one of items [1] to [6], wherein the sealant layer further contains an antistatic agent.

[8] The cover tape according to any one of items [1] to [7], wherein the sealant layer further contains a polystyrene-based resin.

[9] The cover tape according to any one of items [1] to [8], wherein the base layer is a polyester film.

[10] Further provided with an intermediate layer,

The cover tape according to any one of items [1] to [9], wherein the base layer, the intermediate layer, and the sealant layer are laminated in this order.

[11] The cover tape according to item [10], wherein the intermediate layer contains a biomass-derived resin.

[12] The cover tape according to item [11], wherein the biomass-derived resin includes a biomass-derived polyethylene-based resin.

[13] The cover tape according to any one of items [10] to [12], wherein the intermediate layer further contains a petroleum-derived resin.

[14] A carrier tape containing electronic components,

An electronic component package comprising the cover tape according to any one of items [1] to [13], wherein the sealant layer is adhered to the carrier tape to encapsulate the electronic component.

According to the present invention, a cover tape is provided that has stable peeling strength from the carrier tape and has an excellent appearance after peeling.

Fig. 1 is a cross-sectional view showing the structure of a cover tape according to this embodiment.
Fig. 2 is a diagram showing an example of a state in which the cover tape for packaging electronic components according to the present embodiment is sealed to a carrier tape.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention will be described using drawings. In addition, in all drawings, like reference numerals are given to like components, and description thereof is omitted as appropriate. Additionally, the drawings are schematic diagrams and do not necessarily correspond to actual dimensional ratios. In addition, in this specification, the description "a to b" means "a or more and b or less."

As shown in FIG. 1 , the cover tape 10 according to the present embodiment includes a base material layer 3 and a sealant layer 2 provided on one side of the base material layer 3. Here, the cover tape 10 may have a two-layer structure of base material layer 3/sealant layer 2, for example, an intermediate layer (another layer) between the base layer 3 and the sealant layer 2. It may be a multilayer structure such as base layer (3)/intermediate layer (1)/sealant layer (2) with 1) interposed therebetween. The sealant layer 2 is the outermost surface of the cover tape 10 and constitutes one side of the cover tape 10, and can thereby be brought into close contact with the carrier tape 20, which will be described later. In addition, in this embodiment, the base material layer 1, the intermediate layer 1, and the sealant layer 2 have approximately the same width and length, and exist without gaps or breaks.

A method of using the cover tape will be described with reference to FIG. 2. As shown in FIG. 2, the cover tape 10 is used as a covering material for the carrier tape 20 in which concave pockets 21 are continuously provided to match the shape of the electronic component. Specifically, the cover tape 10 is used by adhering (heat sealing) to the surface of the carrier tape 20 so as to cover the entire surface of the opening of the pocket 21 of the carrier tape 20. That is, the sealant layer 2 in the cover tape 10 is heat sealed so as to contact the carrier tape 20. In addition, in this specification, the structure obtained by adhering the cover tape 10 and the carrier tape 20 is referred to as the electronic component package 100.

As described above, the package 100 is wound on a paper or plastic reel and transported to a work area where surface mounting is performed on an electronic circuit board or the like. In the surface mounting process of the electronic component, the cover tape 10 is peeled from the carrier tape 20, and the electronic component is automatically taken out from the package and mounted on the electronic circuit board.

Hereinafter, the aspects and materials of each layer of the cover tape 10 will be described.

[Sealant layer]

The sealant layer 2 provided in the cover tape 10 of this embodiment is a layer present on the outermost surface of the cover tape 10 and is a layer in close contact with the carrier tape 20.

The sealant layer 2 is cohesively fractured when the cover tape 10 is removed from the carrier tape 20. That is, peeling of the cover tape 10 from the carrier tape 20 occurs not by peeling of the adhesive surface of the cover tape 10 and the carrier tape 20, but by cohesive failure of the sealant layer 2. In this way, the adhesive surface and the peeling surface of the cover tape 10 and the carrier tape 20 are different, thereby stabilizing the peeling strength of the cover tape. Additionally, peeling of the cover tape 10 from the carrier tape 20 occurs due to cohesive failure of the sealant layer 2, thereby improving the appearance after peeling.

The peeling strength of the sealant layer 2 included in the cover tape 10 of the present embodiment can be adjusted by selecting the material used for this, its mixing amount, and the manufacturing method.

The sealant layer 2 included in the cover tape 10 of the present embodiment is made of a resin composition containing (A) a (meth)acrylate copolymer and (B) a petroleum-derived resin. By using the sealant layer 2 made of such a resin composition, when the cover tape 10 is peeled from the carrier tape 20, cohesive failure of the sealant layer 2 occurs, thereby stabilizing the peeling strength.

·(Meth)acrylate copolymer (A)

The (meth)acrylate copolymer (A) used in the sealant layer 2 in this embodiment has a (meth)acrylate content of, for example, 10 mol% or more and 25 mol% or less, preferably. is 12 mol% or more and 22% or less, and more preferably, is 15 mol% or more and 20 mol% or less. By using a (meth)acrylate copolymer with a (meth)acrylate content in the above range, the obtained sealant layer 2 has appropriate cohesive force, and as a result, the peeling strength of the cover tape 10 and the carrier tape 20 is increased. It can be controlled to a more appropriate range. Here, the (meth)acrylate content rate of the (meth)acrylate copolymer refers to the ratio (mol%) of structural units derived from (meth)acrylate contained in the (meth)acrylate copolymer.

In this embodiment, the melt flow rate (MFR) of the (meth)acrylate copolymer (A) used in the sealant layer 2 at 190°C and 21.2N is the difference between the cover tape 10 and the carrier tape 20. ), from the viewpoint of keeping the peeling strength within an appropriate range, it is preferably 3 g/10 min or more, and more preferably 5 g/10 min or more. Moreover, from the same viewpoint, the (meth)acrylate copolymer (A) MFR is preferably 15 g/10 min or less, more preferably 12 g/10 min or less, and still more preferably 10 g/10 min or less. Here, the MFR of the (meth)acrylate copolymer (A) is measured according to JIS-K-7210 under conditions of 190°C and 21.2N.

Examples of the (meth)acrylate copolymer (A) used in the sealant layer 2 in this embodiment include ethylene-methyl (meth)acrylate copolymer and ethylene-ethyl (meth)acrylate copolymer. , and ethylene-butyl (meth)acrylate copolymer. The (meth)acrylate copolymer (A) may be used individually, or may be used in mixture of two or more types.

The content of the (meth)acrylate copolymer (A) in the sealant layer 2 is, for example, 40% by mass or more and 95% by mass or less, preferably 45% by mass, relative to the entire sealant layer 2. It is 90 mass% or less, and more preferably, is 50 mass% or more and 85 mass% or less. When the content of the (meth)acrylate copolymer (A) in the sealant layer 2 is within the above range, the resulting sealant layer 2 has excellent heat sealing properties with respect to the cover tape 20 and can be appropriately peeled. It has strength.

・Resin derived from petroleum (B)

Examples of the petroleum-derived resin (B) used in the sealant layer 2 in this embodiment include petroleum-derived resins of aliphatic-based, aromatic-based, dicyclopentadiene (DCPD)-based, and copolymers thereof. You can. Commercially available products include hydrogenated petroleum resin manufactured by Arakawa Chemical Industries, Ltd. under the brand name "Alcon" series. These may be used individually, or two or more types may be mixed and used. The sealant layer 2 contains a petroleum-derived resin (B) and thus has adhesiveness. As a result, the sealant layer 2 has excellent heat sealing properties to the cover tape 20 and an appropriate peel strength. have

The petroleum-derived resin (B) is, for example, 1% by mass or more and 20% by mass or less with respect to the entire sealant layer 2. The lower limit of the compounding amount of the petroleum-derived resin (B) in the sealant layer 2 is preferably 2% by mass or more, more preferably 3% by mass or more, with respect to the entire sealant layer 2, and especially Preferably, it is 5% by mass or more. The upper limit of the compounding amount of the petroleum-derived resin (B) in the sealant layer 2 is 14% by mass or less, more preferably 12% by mass or less, with respect to the entire sealant layer 2, and especially preferably, It is 10% by mass or less.

The sealant layer 2 may further contain the following components.

·Antistatic agent (C)

The sealant layer 2 may contain an antistatic agent (C). Thereby, the antistatic ability can be improved.

Examples of the antistatic agent (C) include those containing lithium ions. A polymer type antistatic agent in which lithium ions are present in the resin can be used. As a result, excellent anti-static performance is continuously and stably demonstrated.

Lithium ions can be contained in the antistatic agent in the form of, for example, a lithium salt. Examples of this lithium salt include lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and pentafluoroethane sulfonate. Lithium ponic acid, etc. can be mentioned.

The lithium ion contained in the antistatic agent (C) can be confirmed by measuring the amount of metal element. The amount of lithium ions contained in the antistatic agent is preferably, for example, 50 μg/g or more (50 ppm or more).

As the antistatic agent (C), known antistatic agents other than those containing lithium ions can be used. Moreover, those containing lithium ions and those not containing lithium ions can be used together.

Examples of antistatic agents that do not contain lithium ions include the following.

-Polymers containing a polyether structure (e.g., polyamide-based copolymers such as polyetheresteramide, block polymers of polyolefin and polyether, polymers made of polyethylene ether and glycol, etc.), potassium esters Polymers containing carboxylic acid bases such as ionomers, copolymers containing quaternary ammonium bases, etc.

-Metal fillers such as tin oxide, zinc oxide, titanium oxide, etc.

-Conductive polymers such as polyethylene dioxythiophene/polystyrene sulfonic acid (PEDOT/PSS), polyacetylene, and polyaniline.

-Challenge carbon

When the sealant layer 2 contains an antistatic agent (C), the amount (total amount if it contains two or more types) is, for example, 1% by mass or more, preferably, based on the entire sealant layer 2. is 5% by mass or more, more preferably 8% by mass or more, and even more preferably 10% by mass or more. Thereby, an appropriate antistatic ability can be obtained.

Moreover, the content of the antistatic agent is preferably 95% by mass or less, more preferably 90% by mass or less, further preferably 80% by mass or less, especially preferably 70% by mass, with respect to the entire sealant layer 2. It is as follows. Antistatic agents are often expensive. Therefore, maintaining the antistatic agent content in this way leads to a reduction in the cost of manufacturing the cover tape 10.

·Polystyrene-based resin (D)

The sealant layer 2 may contain polystyrene-based resin (D). When the sealant layer 2 contains polystyrene-based resin (D), the cohesive force of the sealant layer 2 can be adjusted, making it easy to cause cohesive peeling of the sealant layer 2 when peeling the cover tape from the carrier tape. can do. Cohesive peeling refers to a form in which the sealant layer itself is broken and peeled off.

This polystyrene-based resin (D) is not particularly limited, but examples include polystyrene, styrene/butadiene/styrene block copolymer (SBS), styrene/ethylene/butadiene/styrene block copolymer ( SEBS), styrene/isoprene/styrene block copolymer (SIS), styrene/ethylene/propylene/styrene block copolymer (SEPS), styrene-(meth)acrylate copolymer, hydrogenated styrene block These include copolymers, high impact polystyrene (HIPS), general purpose polystyrene (GPPS), etc., and two or more of these may be used in combination.

Among them, it is preferable to use a styrene-(meth)acrylate copolymer from the viewpoint of high transparency and improving antistatic performance and peel strength with a good balance.

When the sealant layer 2 contains a styrene-(meth)acrylate copolymer, the amount is 10% by mass or more and 30% by mass or less with respect to the entire sealant layer 2, and is preferably 15% by mass. It is an amount of more than 25% by mass and less than 25% by mass. By using the styrene-(meth)acrylate copolymer in the above-mentioned range, the peeling strength when peeling the cover tape 10 obtained from the carrier tape 20 can be reduced by rupture of the cover tape 10 or the cover tape 10. (10) This can be done to the extent that the resin residue does not occur and can be easily peeled off. This styrene-(meth)acrylate copolymer is a copolymer of styrene and (meth)acrylate, and the (meth)acrylate content in the styrene-(meth)acrylate copolymer is styrene-(meth)acrylate. ) It is 45 mol% or more and 80 mol% or less based on the entire acrylate copolymer.

Here, the (meth)acrylate content rate refers to the ratio (mol%) of structural units derived from (meth)acrylate contained in the styrene-(meth)acrylate copolymer. When the (meth)acrylate content is within the above-mentioned range, the sealant layer 2 containing it has good peelability.

In this embodiment, the styrene-(meth)acrylate copolymer has a melt flow rate (MFR) of 5 g/10 min or more and 30 g/10 min or less at 230°C and 3.8 kg. By using a styrene-(meth)acrylate copolymer having a melt flow rate in the above range, the peelability of the sealant layer 2 containing it becomes suitable.

Other added ingredients

The sealant layer 2 contains, in addition to the above components, an anti-blocking agent, a slip agent, a lubricant, a plasticizer, an antioxidant, an ultraviolet absorber, a colorant, a surfactant, an inorganic filler, etc., to the extent that its properties are not impaired. It may contain arbitrary additives. And/or, these coating treatments may be applied to the surface of the sealant layer 3.

Examples of anti-blocking agents include silica, aluminosilicate (zeolite, etc.). When the sealant layer 2 contains an anti-blocking agent, blocking of the sealant layer 3 is alleviated.

Examples of slip agents include palmitic acid amide, stearic acid amide, behenic acid amide, oleic acid amide, erucic acid amide, oleyl palmitamide, stearyl palmitamide, methylenebisstearylamide, methylenebisoleylamide, and ethylene. Various amides such as bisoleylamide and ethylenebiserucic acid amide, polyalkylene glycols such as polyethylene glycol and polypropylene glycol, and hydrogenated castor oil are included. When the sealant layer 2 contains a slip agent, processing properties such as extrusion processing, easy roll properties, film sliding properties, etc. are improved.

The amount of other additive components in the sealant layer 2 may be adjusted appropriately depending on the purpose of addition. Typically, it may be adjusted within a range of about 0.01 to 10 mass% with respect to the entire sealant layer 2.

The thickness of the sealant layer 2 produced from the resin composition of this embodiment is preferably 2 μm or more and 10 μm or less, and more preferably 3 μm or more and 8 μm or less. If the thickness of the sealant layer 2 is below the above upper limit, it becomes easy to control spreading during heat sealing, and if the thickness of the sealant layer 2 is above the above lower limit, the carrier tape 20 of the cover tape 10 ) is suitable for peeling strength.

In one embodiment, fine irregularities may be provided on the surface side of the sealant layer 2 (the surface of the sealant layer 2 on the side opposite to the base material layer 3). Thereby, sticking of electronic components can be prevented. When the sealant layer 2 has an uneven surface, its surface roughness is, for example, 3 to 20 μm, preferably 5 to 25 μm. A method of providing unevenness to the sealant layer 2 can use a technique known in the field.

[Base layer]

The base layer 3 is exposed from the outside when laminating the sealant layer 2 to produce a cover tape, when adhering the cover tape 10 to the carrier tape 20, and when using the cover tape 10. It is desirable to have mechanical strength sufficient to withstand the applied stress, and heat resistance sufficient to withstand the thermal history applied when adhering the cover tape 10 to the carrier tape 20. In addition, the material constituting the base layer 3 is preferably processed into a film form from the viewpoint of ease of processing.

The above characteristics of the base material layer 3 can be adjusted by appropriately selecting the materials constituting it. Specific examples of the material constituting the base layer 3 include polyester-based resin, polyamide-based resin, polyolefin-based resin, polyacrylate-based resin, polymethacrylate-based resin, polyimide-based resin, polycarbonate-based resin, ABS resin, etc. can be mentioned. Among them, from the viewpoint of improving the mechanical strength and flexibility of the cover tape 10, it is preferable to use polyester resin, nylon 6. The base material layer 3 may further contain additives such as a lubricant.

The base material layer 3 may be in the form of a single-layer film containing the above-described materials, or may be in the form of a multilayer film containing each layer of the above-mentioned materials. Moreover, the film used to form the base material layer 3 may be an unstretched film, or may be a film stretched in the uniaxial direction or the biaxial direction. From the viewpoint of improving the mechanical strength of the cover tape 10, it is preferable that the film is stretched in uniaxial or biaxial directions.

The thickness of the base material layer 3 is preferably 5 μm or more, and more preferably 10 μm or more. Moreover, the thickness of the base material layer 3 is preferably 50 μm or less, and more preferably 40 μm or less. When the thickness of the base material layer 3 is below the above upper limit, the rigidity of the cover tape 10 does not become excessively high, and even when torsional stress is applied to the carrier tape 20 after sealing, the cover tape 10 remains on the carrier. Peeling along with deformation of the tape 20 can be suppressed. In addition, when the thickness of the base layer 3 is equal to or greater than the above lower limit, the mechanical strength of the cover tape 10 can be improved, so that when the cover tape 10 is peeled from the carrier tape 20 at high speed, the cover tape 10 can be peeled off from the carrier tape 20 at high speed. Breakage of the tape 10 can be prevented.

The total light transmittance of the base material layer 3 is preferably 80% or more, and more preferably 85% or more. By doing this, in the package 100 made of the cover tape 10 and the carrier tape 20, which will be described later, it can be inspected whether or not the electronic component is correctly accommodated in the pocket 21 of the carrier tape 20. This can provide the necessary transparency. In other words, by setting the total light transmittance of the base material layer 3 to the above lower limit or more, the electronic components accommodated inside the package 100 made of the cover tape 10 and the carrier tape 20 can be stored in the package ( 100) It becomes possible to recognize and confirm from the outside. In addition, the total light transmittance of the base material layer 3 can be measured according to JIS K7361-1 (1999).

[Middle layer]

In one embodiment, an intermediate layer (1) may be provided between the base material layer (3) and the sealant layer (2). By providing the intermediate layer 1, the cushioning properties of the entire cover tape 10 can be improved.

In one embodiment, materials forming the intermediate layer 1 include ethylene-(meth)acrylic acid ester copolymer, ethylene-vinyl acetate copolymer, polystyrene-based resin, and polyethylene, which are petroleum-derived resins. These may be used individually, or two or more types may be used in combination. Among them, from the viewpoint of improving the cushioning properties of the entire cover tape 10, it is preferable to include ethylene-(meth)acrylic acid ester copolymer, ethylene-vinyl acetate copolymer, polyethylene, and polystyrene-based resin. As polyethylene, low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is more preferable. Additionally, the intermediate layer 1 may contain additives generally used in the field.

In one embodiment, the intermediate layer 1 contains a biomass-derived resin, preferably a biomass-derived polyolefin resin, more preferably a biomass-derived polyethylene-based resin. By configuring at least part of the resin constituting the intermediate layer 1 from biomass-derived resin, the load on the global environment can be reduced. Additionally, a cover tape provided with a resin layer containing biomass-derived resin as an intermediate layer has performance equivalent to that provided with a polyolefin resin layer made of polyolefin derived from fossil fuels.

The intermediate layer 1 may be composed only of petroleum-derived resin, may be composed only of biomass-derived resin, or may be composed of a mixture of petroleum-derived resin and biomass-derived resin.

When the middle layer 1 is composed of a mixture of a petroleum-derived resin and a biomass-derived resin, the amount of biomass-derived resin contained in the middle layer 1 is, for example, with respect to the entire middle layer 1. It is 20% by mass or more and 100 or less. The lower limit of the amount of biomass-derived resin is preferably 30% by mass or more, more preferably 40% by mass or more, with respect to the entire middle layer 1 from the viewpoint of reducing environmental load. Preferably, it is 45% by mass or more. The upper limit of the amount of biomass-derived resin is preferably 95% by mass or more, more preferably 90% by mass or more, relative to the entire intermediate layer 1, from the viewpoint of maintaining the performance of the resulting cover tape. .

When providing the intermediate layer 1, its thickness is preferably 10 μm or more and 30 μm or less, and more preferably 15 μm or more and 25 μm or less from the viewpoint of improving the cushioning properties of the entire cover tape.

[Other floors]

The cover tape 10 may include other layers in addition to each of the above layers.

Other layers include, for example, a reinforcing layer for increasing the mechanical strength of the cover tape 10, between the base layer 1 and the middle layer 2, and/or between the middle layer 2 and the sealant layer 3. An adhesive layer provided in between can be mentioned.

(reinforcement layer)

The cover tape 10 may further include a reinforcing layer at an arbitrary position on the surface of the sealant layer 2 on the side of the intermediate layer 1. By providing a reinforcing layer, the mechanical strength of the cover tape 10 can be further increased.

Specific examples of materials constituting the reinforcement layer include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, and ABS resin. can be mentioned. Among them, polyester resin is preferable from the viewpoint of improving the mechanical strength of the cover tape 10. Additionally, from the viewpoint of improving the mechanical strength and/or flexibility of the cover tape 10, it is preferable to use polyamide-based resin, especially nylon 6. Additionally, the reinforcement layer may contain additives such as lubricant.

The reinforcement layer may be provided at any position as long as it is on the surface of the sealant layer 2 on the intermediate layer 1 side. Alternatively, the reinforcing layer may be provided on the surface of the base layer 3 opposite to the surface on the intermediate layer 1 side.

The reinforcement layer may be one layer or two or more layers. For example, the reinforcement layer may be formed of a multilayer film in which the above-mentioned materials are laminated. The film used to form the reinforcement layer may be an unstretched film, or may be a film stretched in a uniaxial direction or a biaxial direction. From the viewpoint of further improving the mechanical strength of the cover tape 10, it is preferable that the film is stretched in uniaxial or biaxial directions.

The thickness of the reinforcing layer is not particularly limited. The thickness of the reinforcement layer is preferably 5 μm or more, and more preferably 10 μm or more. Moreover, the thickness of the reinforcement layer is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 30 μm or less.

Since the thickness of the reinforcing layer is 50 μm or less, the rigidity of the cover tape 10 does not increase excessively. Accordingly, even when torsional stress is applied to the carrier tape 20 after sealing, the cover tape 10 is likely to follow the deformation of the carrier tape 20. Therefore, unintentional peeling of the cover tape 10 from the carrier tape 20 can be prevented.

When the thickness of the reinforcing layer is 5 μm or more, the mechanical strength of the cover tape 10 can be sufficiently good. Therefore, for example, even when the cover tape 10 is peeled from the carrier tape 20 at high speed, breakage of the cover tape 10 can be prevented.

The total light transmittance of the reinforcement layer is preferably 80% or more, and more preferably 85% or more. As a result, in the electronic component package 100 consisting of the cover tape 10 and the carrier tape 20, necessary transparency can be secured to the extent that it can be inspected whether the electronic component is properly accommodated. In other words, by setting the total light transmittance of the reinforcing layer to 80% or more, it becomes easy to visually check the electronic components housed inside the package made of the cover tape 10 and the carrier tape 20 from the outside. The total light transmittance can be measured according to JIS-K-7361.

(Adhesive layer)

The cover tape 10 may further include an adhesive layer at an arbitrary position on the surface of the base material layer 3 on the intermediate layer 1 side. By providing an adhesive layer, the adhesion between the base layer 3 and other layers laminated thereon (such as the sealant layer 2 or the intermediate layer 1) can be improved, and as a result, the mechanical properties of the cover tape 10 can be improved. In addition to being able to increase the strength, stabilization of the peeling strength can be achieved. More specifically, the base layer 3 is laminated with the intermediate layer 1 or the sealant layer 2 through an adhesive layer, thereby improving the adhesion between these layers. Accordingly, when peeling the cover tape 10 from the carrier tape 20, peeling due to destruction between the sealant layer 2 and the base layer 3 or the intermediate layer 1 can be prevented.

As a material for forming the adhesive layer, for example, various known solvent-based or water-based anchor coating agents can be used. More specifically, the anchor coat agent includes isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based agents.

Additionally, by subjecting the base layer 3 to corona treatment or plasma treatment, the adhesion between the base layer 3 and other layers can be improved. This corona treatment or plasma treatment may be performed by appropriately selecting known conditions.

In addition, the cover tape 10 for electronic component packaging of this embodiment may be provided with an antistatic layer separately from the base material layer 3, the intermediate layer 2, and the sealant layer 3.

[Cover Tape]

The width and length of the cover tape 10 can be appropriately set mainly depending on the width and length of the carrier tape. The thickness of the cover tape 10 is, for example, 20 to 80 μm, and is preferably 25 to 70 μm. Typically, the width of the cover tape 10 is about 1 to 100 mm and the length is about 100 to 30,000 m.

[Manufacturing method of cover tape]

The manufacturing method of the cover tape 10 of this embodiment is not particularly limited. For example, it can be manufactured by applying a known extrusion method, laminating method, coating method, etc. As an example, the cover tape 10 of this embodiment can be manufactured by an extrusion laminating method.

More specifically, the cover tape 10 of this embodiment can be manufactured by the following procedures (1) to (4).

(1) Prepare a film corresponding to the base layer 3.

(2) A laminating agent is applied to one side of the film prepared in (1), and a layer corresponding to the middle layer (1) is formed thereon by the extrusion laminating method. As a result, a film with a two-layer structure of base layer (3)/intermediate layer (1) is obtained.

(3) A layer corresponding to the sealant layer 2 is formed on the surface of the two-layer film of (2) where the middle layer 1 is exposed by the extrusion laminating method. This obtains a film with a three-layer structure.

(4) If necessary, the obtained three-layer film is cut to an appropriate length and width.

In the extrusion laminate of steps (2) and (3), a molten resin material is formed on one side of the film corresponding to the base layer (3). Resin materials include the resins and various additives mentioned in the [middle layer] and [sealant layer] columns above. When the resin material contains two or more types of materials, it is preferable that they are appropriately mixed before forming the film (in a molten state). The extrusion temperature in step (2) may be adjusted appropriately. For example, it can be adjusted between 150 and 350°C.

[Electronic component packaging]

An electronic component package 100 can be obtained from the cover tape 10 described above and the carrier tape 20 in which the electronic component is accommodated in the pocket 21 (recessed portion). This will be explained with reference to FIG. 2 .

In Fig. 2, the cover tape 10 is used as a covering material for a strip-shaped carrier tape 20 in which concave pockets 21 are continuously provided to match the shape of the electronic component. Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire surface of the opening of the pocket 21 of the carrier tape 20. Hereinafter, the structure obtained by adhering the cover tape 10 and the carrier tape 20 is referred to as the electronic component package 100.

The electronic component package 100 can be manufactured, for example, using the following procedures.

First, the electronic component is accommodated in the pocket 21 of the carrier tape 20.

Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by a heat seal method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 2 of the cover tape 10 is brought into contact with the carrier tape 20 (that is, the “back side” of the cover tape 10 in FIG. 2 is the sealant layer 2). to perform a heat seal). By doing this, a structure in which electronic components are sealed and housed (electronic component package 100) is obtained.

The specific method or conditions of heat sealing are not particularly limited as long as the cover tape 10 adheres sufficiently strongly to the carrier tape 20. Typically, it can be performed using a known taping machine at a temperature of 100 to 240°C, a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

The material of the carrier tape 20 is not particularly limited as long as it can adhere the cover tape 10 by heat sealing, but may include a material containing polystyrene resin, a material containing polycarbonate resin, and a material containing polyethylene terephthalate resin. Resin-made, or paper-made, etc. are mentioned. Among them, it is preferable that it is made of resin from the viewpoint of effectively improving peel strength.

By heat-sealing the above-described cover tape 10 to a carrier tape made of these materials to form an electronic component package, it is easy to further reduce the remaining sealant layer on the carrier tape side.

The electronic component package 100 is wound on a reel, for example, and is then transported to a work area where the electronic component is mounted on an electronic circuit board or the like. The material of the reel is, for example, metal, paper, plastic, etc.

After the electronic component package 100 is transported to the work area, the cover tape 10 is peeled from the carrier tape 20 and the contained electronic component is taken out.

Electronic components housed in the electronic component package 100 are not particularly limited, but may be used in the manufacture of electrical/electronic devices, such as semiconductor chips, transistors, diodes, condensers, piezoelectric elements, optical elements, LED-related members, connectors, electrodes, etc. This includes all parts used.

Although embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than those described above may be adopted.

Example

Hereinafter, the present invention will be explained by examples and comparative examples, but the present invention is not limited to these.

(Examples 1 to 10, Comparative Example 1)

The components listed in Table 1 were mixed in the mass parts listed in Table 1 and kneaded using a twin-screw extruder to obtain a resin composition for forming a sealant layer. A PET film (E7455, manufactured by Toyobo Corporation) with a film thickness of 19 μm was used as a base layer, and low-density polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen L705, LDPE), a petroleum-derived resin, was used as an intermediate layer on top of this using an extrusion laminating method. A film is formed to a thickness of 20 μm at an extrusion temperature of 300°C, corona treatment is performed on the surface of the formed intermediate layer, the wettability index is set to 40 Dyn or more, and then the above resin composition is added as a sealant layer on the surface of the intermediate layer by the extrusion laminating method. A cover tape for each example was obtained by forming a film with a thickness of 5 μm at an extrusion temperature of 200°C.

(Examples 11 to 13)

The components listed in Table 1 were mixed in the mass parts listed in Table 1 and kneaded using a twin-screw extruder to obtain a resin composition for forming a sealant layer. PET film (manufactured by Toyobo, E7455) with a film thickness of 19 μm was used as a base layer, and on top of this, plant-derived low-density polyethylene (manufactured by Braschem, SBC818) was used as an intermediate layer to a thickness of 20 μm at an extrusion temperature of 300°C by the extrusion laminating method. After forming a film, corona treatment is performed on the surface of the formed intermediate layer, and the wettability index is set to 40Dyn or more, the above resin composition is added to the surface of the intermediate layer as a sealant layer to a thickness of 5 μm at an extrusion temperature of 200°C by the extrusion laminating method. By forming a film, cover tapes for each example were obtained.

(Example 14)

The components listed in Table 1 were mixed in the mass parts listed in Table 1 and kneaded using a twin-screw extruder to obtain a resin composition for forming a sealant layer. A PET film with a film thickness of 19 μm (E7455, manufactured by Toyobo Corporation) was used as a base layer, and as an intermediate layer, petroleum-derived low-density polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen L705, LDPE-2) and plant-derived low-density polyethylene ( SBC818 (manufactured by Braschem Co., Ltd.) was dry blended using an automatic mass weighing mixer at the weight ratio shown in Table 1, the mixture was formed into a film with a thickness of 20 μm at an extrusion temperature of 300°C by the extrusion laminating method, and the film was applied to the surface of the formed intermediate layer. After corona treatment was performed to increase the wettability index to 40 Dyn or more, the above resin composition was further formed as a sealant layer on the surface of the middle layer by an extrusion laminating method at an extrusion temperature of 200°C to a thickness of 5 μm, and the cover tapes of each example were made. got it

Details of the components listed in Table 1 are shown below.

[Middle layer]

・LDPE (α-1): Petroleum-derived low-density polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen L705, LDPE)

··LDPE (α-2): Plant-derived low-density polyethylene (manufactured by Braschem, SBC818)

[Sealant layer]

((meth)acrylate copolymer (A))

·(Meth)acrylate copolymer (A-1): Ethylene-ethyl acrylate copolymer (“NUC6170” manufactured by NUC, ethyl acrylate content: 18 mol%, MFR (190°C, 21.2N): 6g/10min )

· (Meth)acrylate copolymer (A-2): Ethylene-methylacrylate copolymer (“Rexpal EB240H” manufactured by Nippon Polyethylene Co., Ltd., methyl acrylate content: 20 mol%, MFR (190°C, 21.2N): 6g/10min)

(meth)acrylate copolymer (A-3): ethylene-methyl methacrylate copolymer (“Acryft WH303-F” manufactured by Sumitomo Chemical Co., Ltd., methyl methacrylate content: 18 mol%, MFR (190°C) , 21.2N): 7g/10min)

·(Meth)acrylate copolymer (A-4): Ethylene-butylacrylate copolymer (“Lotril 17BA07N” manufactured by Arkema, methyl methacrylate content: 17 mol%, MFR (190°C, 21.2N) : 7g/10min)

(Petroleum derived resin (B))

· Petroleum-derived resin (B-1): “Alcon P-140” manufactured by Arakawa Chemical Co., Ltd.

· Petroleum-derived resin (B-2): Idemitsu Kosan Co., Ltd., “Imerve P-140”

・Petroleum-derived resin (B-3): “T-REZ OP501” manufactured by Donen General Sekiyu Co., Ltd.

(Antistatic agent (C))

・Antistatic agent (C-1): Antistatic agent containing lithium ions (“Perectron PVH” manufactured by Sanyo Kasei Industries, Ltd.)

(polystyrene-based resin (D))

・Polystyrene-based resin (D-1): Styrene-(meth)acrylate copolymer (Stirene Sumikin Chemical Co., Ltd., “Estyrene MS-750”, (meth)acrylate content: 75 mol%)

・Polystyrene-based resin (D-2): Styrene-(meth)acrylate copolymer (Stirene Sumikin Chemical Co., Ltd., “Estyrene MS-600”, (meth)acrylate content: 60 mol%)

The peeling strength and appearance after peeling of the obtained cover tape were evaluated using the following methods. The evaluation results are shown together in Table 1.

Peel strength-1: Peel strength against polycarbonate (PC) carrier tape

The obtained cover tape was set to a width of 5.5 mm, and was heat-sealed to a carrier tape of a width of 8 mm using a heat sealer under the following conditions to obtain a test piece.

Using the obtained test piece, the peeling strength of the cover tape and the carrier tape was measured according to the following conditions.

(Heat seal conditions)

Equipment: TWA-6621

Iron size: 0.4mm×28mm

Temperature: 180℃

Load: 5kg

Seal time: 60ms

Carrier tape feeding pitch: 4mm

Carrier tape: Conductive polycarbonate (made by 3M: #3000)

(Peel strength measurement conditions)

Stripping machine: PTS-5000K

Peeling speed: 300mm/min

Peel angle: 175~180°

Standard: JIS C 0806-3

Peel strength-2: Peel strength against polystyrene (PS) carrier tape

The obtained cover tape was set to a width of 5.5 mm, and was heat-sealed to a carrier tape of a width of 8 mm using a heat sealer under the following conditions to obtain a test piece.

Using the obtained test piece, the peeling strength of the cover tape and the carrier tape was measured according to the following conditions.

(Heat seal conditions)

Equipment: TWA-6621

Iron size: 0.4mm×28mm

Temperature: 180℃

Load: 5kg

Seal Time: 60ms

Carrier tape feeding pitch: 4mm

Carrier tape: Conductive polystyrene (Sumitomo Bakelite: E980E)

(Peel strength measurement conditions)

Stripping machine: PTS-5000K

Peeling speed: 300mm/min

Peel angle: 175~180°

Standard: JIS C 0806-3

(Peeling appearance)

After measuring the peel strength of the polycarbonate (PC) carrier tape and the polystyrene (PS) carrier tape, the sealant layer transferred to the surface of the carrier tape by cohesive peel for each carrier tape was observed with a microscope at 20 to 50 times magnification, Evaluation was performed based on the following criteria.

(standard)

A: The transferred sealant layer is not broken, has a stable width, and has a uniform appearance without becoming uneven.

B: The transferred sealant layer is not broken, has a stable width, and no fluff is visible, but there are places where it becomes uneven.

C: The transferred sealant layer is not broken, but there are places where the width is unstable or fluff is generated.

D: There are places where the transferred sealant layer is partially broken.

[Table 1]

[Table 2]

The cover tapes of Examples 1 to 10 had excellent peeling strength and a good peeling appearance after peeling. The cover tapes of Examples 11 to 14, which have an intermediate layer containing a biomass-derived resin, have excellent peel strength and a good peeling appearance after peeling, and Example 1 includes an intermediate layer containing a petroleum-derived resin. It had performance equivalent to ~10 cover tape.

This application claims priority based on Japanese Patent Application No. 2021-157705, filed on September 28, 2021, and Japanese Patent Application No. 2022-133170, filed on August 24, 2022, all of the disclosures thereof. is used here.

1 middle layer
2 Sealant layer
3 Base layer
10 Cover tape for packaging electronic components (cover tape)
20 carrier tape
21 pockets
100 electronic components package

Claims (14)

A base layer,
A cover tape for packaging electronic components comprising a sealant layer laminated on one side of the base layer,
The sealant layer is a cover tape containing (A) a (meth)acrylate copolymer and (B) a petroleum-derived resin. In claim 1,
A cover tape wherein the (meth)acrylate content of the (meth)acrylate copolymer (A) is 10 mol% or more and 25 mol% or less. In claim 1 or claim 2,
A cover tape wherein the melt flow rate (MFR) of the (meth)acrylate copolymer (A) at 190°C and 21.2N is 3 g/10min or more and 15 g/10min or less. The method according to any one of claims 1 to 3,
The (meth)acrylate copolymer (A) is at least selected from ethylene-methyl (meth)acrylate copolymer, ethylene-ethyl (meth)acrylate copolymer, and ethylene-butyl (meth)acrylate copolymer. Includes one cover tape. The method according to any one of claims 1 to 4,
A cover tape wherein the petroleum-derived resin (B) contains at least one selected from petroleum-derived resins of aliphatic, aromatic, dicyclopentadiene (DCPD)-based, and copolymers thereof. The method according to any one of claims 1 to 5,
A cover tape wherein the content of the petroleum-derived resin (B) is 1% by mass or more and 20% by mass or less with respect to the entire sealant layer. The method according to any one of claims 1 to 6,
The cover tape wherein the sealant layer further includes an antistatic agent. The method according to any one of claims 1 to 7,
The cover tape further includes a polystyrene-based resin. The method according to any one of claims 1 to 8,
A cover tape wherein the base material layer is a polyester film. The method according to any one of claims 1 to 9,
Further provided with a middle layer,
A cover tape in which the base layer, the intermediate layer, and the sealant layer are laminated in this order. In claim 10,
A cover tape wherein the intermediate layer contains a biomass-derived resin. In claim 11,
A cover tape in which the biomass-derived resin includes a biomass-derived polyethylene-based resin. In claim 10,
The cover tape further contains a petroleum-derived resin. A carrier tape containing electronic components,
An electronic component package comprising the cover tape according to any one of claims 1 to 13, wherein the sealant layer is adhered to the carrier tape to encapsulate the electronic component.