JP2021138412A - Electronic component packaging cover tape and electronic component package - Google Patents

Abstract

To provide a cover tape which can be suitably heat-sealed to various kinds of carrier tapes.SOLUTION: An electronic component packaging cover tape 1 comprises a base material layer 14, and a sealant layer 11 provided on one surface side thereof. The base material layer contains polyester, and has a thickness of 5 to 30 μm. When an average value of peel strength under [condition 1] is represented by FLow, an average value of peel strength under [condition 2] is represented by FHigh, FHigh/FLow is 2 to 5. [Condition 1] seal condition: a long object, which is formed in such a manner that the cover tape is slitted to a width of 5.3 mm, is brought into contact with a surface of a sheet for a carrier tape on a surface thereof on the sealant layer side, and is heat-sealed under the condition of 160°C, 4 kg/cm2, 0.1 second to obtain a complex. Peel condition: the composite is peeled under the condition of a peel rate of 300 mm/min, a peel angle of 180°. [Condition 2] this condition is same as the condition 1 except that a heat sealing temperature is set to 200°C.SELECTED DRAWING: Figure 1

Description

The present invention relates to a cover tape for packaging electronic components and a packaging body for electronic components. More specifically, the present invention relates to a cover tape for packaging electronic components, and an electronic component package including the cover tape for packaging electronic components and a carrier tape.

Carrier tapes and cover tapes are often used when transporting, storing, etc. electronic components.
Specifically, first, an electronic component (semiconductor chip or the like) is placed in a recess formed in the carrier tape, and then the cover tape is heat-sealed on the upper surface of the carrier tape to enclose the electronic component. Then, it is wound up in a reel shape and transported / stored.

Typically, the cover tape comprises two layers, a substrate layer and a sealant layer (heat seal layer). The sealant layer is a layer for heat sealing with the carrier tape.

As an example, Patent Document 1 describes that a sealant layer is formed by using a coating liquid containing a specific thermoplastic resin, a carbon nanomaterial, and a solvent.
As another example, Patent Document 2 describes a block copolymer of a styrene-based hydrocarbon and a conjugated diene-based hydrocarbon, an ethylene-α-olefin random copolymer, and a block of a styrene-based hydrocarbon and a conjugated diene-based hydrocarbon. It is described that the sealant layer was formed by using a resin composition containing a copolymer and impact-resistant polystyrene.

JP-A-2007-45513 Special Table 2003-508253 Gazette

Conventional cover tapes are often designed to have optimum heat sealability and peel strength according to the type of carrier tape to be heat sealed. Therefore, a cover tape optimized for heat-sealing with a certain carrier tape may not be properly heat-sealed with another carrier tape.

Cover tapes that are "optimized" for the type of carrier tape lack versatility and cannot accommodate a wide variety of carrier tapes. This leads to disadvantages such as an increase in the manufacturing cost of the cover tape (it is necessary to manufacture a small amount and a wide variety of cover tapes).

The present invention has been made in view of such circumstances. One object of the present invention is to provide a cover tape that can be appropriately heat-sealed to various types of carrier tapes.

The present inventors have completed the inventions provided below and solved the above problems.

According to the present invention, the following cover tapes are provided.

A cover tape for packaging electronic components including a base material layer and a sealant layer provided on one surface side of the base material layer.
The base material layer contains polyester and has a thickness of 5 to 30 μm.
When the average value of the peel strength obtained by the following [Condition 1] is F _Low and the average value of the peel strength obtained by the following [Condition 2] is F _High , the _{value of F High} / F _Low is 2 to 5. A cover tape.
[Condition 1]
Sealing condition: The cover tape is slit to a width of 5.3 mm to form a long shape, which is brought into contact with the surface of the carrier tape sheet "Clearlen CST2401" manufactured by Denka Co., Ltd. on the surface on the sealant layer side. Heat seal at 160 ° C., 4 kg / cm ² , 0.1 seconds to obtain a composite.
Peeling conditions: The composite is peeled under the conditions of a peeling speed of 300 mm / min and a peeling angle of 180 °, and the peeling strength is measured.
[Condition 2]
The conditions are the same as in [Condition 1] except that the temperature of the heat seal is set to 200 ° C.

Further, according to the present invention, the following electronic component packaging bodies are provided.

A carrier tape in which electronic components are housed in a recess and the above-mentioned cover tape are provided.
An electronic component package in which the sealant layer is adhered to the carrier tape so as to seal the electronic component.

The cover tape of the present invention can be appropriately heat-sealed to various types of carrier tapes.

It is a figure for demonstrating an example of the layer structure of a cover tape.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The drawings are for illustration purposes only. The shape and dimensional ratio of each member in the drawing do not necessarily correspond to the actual article.

In the present specification, the notation "XY" in the description of the numerical range means X or more and Y or less unless otherwise specified. For example, "1 to 5% by mass" means "1% by mass or more and 5% by mass or less".

In the notation of a group (atomic group) in the present specification, the notation that does not indicate whether it is substituted or unsubstituted includes both those having no substituent and those having a substituent. For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
The notation "(meth) acrylic" herein represents a concept that includes both acrylic and methacryl. The same applies to similar notations such as "(meth) acrylate".

In the present specification, the notation "gf" represents the unit of force "gram weight". The notation "kgf" represents the unit of force "kilogram-force". It can be converted to other unit systems by multiplying the numerical values expressed in these units by the gravitational acceleration.

<Cover tape>
FIG. 1 is a diagram schematically showing a layer structure of a cover tape (cover tape 1) for packaging electronic components according to the present embodiment.

The cover tape 1 includes at least a base material layer 14 and a sealant layer 11 on one surface side of the base material layer 14.
The cover tape 1 may include an intermediate layer 12, an adhesive layer 13, and the like between the base material layer 14 and the sealant layer 11. These are arbitrary layers.

In the cover tape 1, when the average value of the peel strength obtained by the following [Condition 1] is F _Low and the average value of the peel strength obtained by the following [Condition 2] is F _High , the _{value of F High} / F _Low . Is 2-5.
[Condition 1]
Sealing condition: A long piece of cover tape 1 slit to a width of 5.3 mm is brought into contact with the surface of the carrier tape sheet "Clearlen CST2401" manufactured by Denka Co., Ltd. on the surface on the sealant layer 11 side. Then, heat-seal is performed under the conditions of 160 ° C., 4 kg / cm ^{2, 0.1 seconds to obtain a composite.}
Peeling conditions: The composite is peeled under the conditions of a peeling speed of 300 mm / min and a peeling angle of 180 °, and the peeling strength is measured.
[Condition 2]
The conditions are the same as in [Condition 1] except that the temperature of the heat seal is set to 200 ° C.

The cover tape of the present embodiment is designed so that the average value of the peel strength differs by more than twice at the heat sealing temperatures of 160 ° C. and 200 ° C. With this design, various carrier tapes can be appropriately heat-sealed by changing the heat-sealing temperature (“appropriate heat-sealing” means, for example, peeling strength that is neither too strong nor too weak. It means that it can be heat-sealed with various carrier tapes).
Further, when _{the value of F High} / F _Low is 5 or less, it is possible to prevent the peel strength from becoming too large or too small due to a slight change in the heat sealing condition.

Incidentally, as far as the findings of the present inventors are concerned, the conventional cover tape is designed so that the peel strength does not change as much as possible due to fluctuations in heat sealing conditions (temperature and time). Therefore, _{the value of F High} / F _Low is less than 2.

In _{order to manufacture a cover tape having an F High} / F _Low value of 2 to 5, it is important to appropriately select the material and manufacturing method constituting the cover tape 1. These selections will be described in detail below.
Briefly, (1) an appropriate polyester resin is used as the material constituting the base material layer 14, the base material layer 14 is designed to be appropriately thin, and (2) the sealant layer 11 is provided. It is preferable to use an appropriate material.

Heat sealing of the cover tape to the carrier tape is usually performed by pressing the side of the sealant layer 11 of the cover tape 1 against the carrier tape and heating from the side of the base material layer 14 with a heat sealing device.
According to the design of (1), it is presumed that the heat from the heat source at the time of heat sealing is quickly and sufficiently transferred to the sealant layer 11. Further, according to the design of (2), the amount of heat transferred to the sealant layer 11 / the temperature at which the sealant layer 11 is actually heated corresponds to a large amount of the sealant layer 11 being softened / melted or a small amount of softening / melting. It is estimated that it will happen. For these reasons, it is presumed that the cover tape 1 can be appropriately heat-sealed to various types of carrier tapes by changing the heat-sealing temperature.

Hereinafter, the specific configuration and manufacturing method of the cover tape 1 will be described.

(Sealant layer 11)
The sealant layer 11 can contain any resin as long as the value of _{F High} / F _{Low is 2 to 5. Further, the values of F High} and F _Low can be adjusted by appropriately selecting the material and thickness of the sealant layer 11.

The sealant layer 11 usually contains a thermoplastic resin. Examples of the thermoplastic resin include ionomer resins, polyester resins, vinyl chloride-vinyl acetate copolymers, (meth) acrylic resins, polyurethane resins, ethylene-vinyl acetate copolymers, and ethylene- (meth) acrylic acids. Examples thereof include copolymers, ethylene- (meth) acrylic acid ester copolymers, maleic acid-based resins, polystyrene-based resins, and styrene-based block copolymers.

In particular, in the present embodiment, the sealant layer 11 preferably contains at least one selected from the group consisting of (meth) acrylic resin, ethylene-alkyl (meth) acrylate copolymer and polystyrene resin, and these Of these, polystyrene-based resins are particularly preferable. It is presumed that the softening / melting behavior of these resins at 160 ° C. and the softening / melting behavior at 200 ° C. are sufficiently different. Therefore, it is presumed that it is easy to design the _{F High} / F _Low value to 2 to 5 by using any of these resins. And the cover tape so designed can be appropriately heat-sealed to various types of carrier tapes.

As the (meth) acrylic resin, those known for applications such as sealants, adhesives, and adhesives can be used without particular limitation.
Examples of the ethylene-alkyl (meth) acrylate copolymer include an ethylene- (meth) methyl acrylate copolymer and an ethylene- (meth) ethyl acrylate copolymer.
Examples of the polystyrene-based resin include polystyrene, styrene-butadiene-styrene block copolymer (SBS), and styrene-isoprene-styrene block copolymer (SIS). Further, as the hydrogenated additive, SEBS (hydrogenated additive to SBS), SBBS (hydrogenated partial additive to SBS), SEPS (hydrogenated additive to SIS) and the like can also be mentioned.

Further, the sealant layer 11 preferably contains inorganic particles together with an appropriate resin. As a result, it is easier to set the value of _{F High} / F _{Low to 2 to 5, and / or to easily adjust the value of F High} or F _Low itself to an appropriate size under normal peeling conditions.
Examples of the inorganic particles include sulfide particles such as zinc sulfide, copper sulfide, cadmium sulfide, nickel sulfide and palladium sulfide, metal oxides such as aluminum oxide, tin oxide, zinc oxide, indium oxide and titanium oxide, and carbon fine particles. be able to. Metal oxides are preferable as the inorganic particles because they are easily available and the peel strength can be easily adjusted.
The average particle size of the inorganic particles is preferably 10 to 1000 nm, preferably 50 to 500 nm. By selecting inorganic particles having an appropriate average particle size, it is easy to sufficiently obtain the effects of using the inorganic particles while maintaining various performances.
When the sealant layer 11 contains inorganic particles, the amount thereof is, for example, 1 to 20 parts by mass, preferably 1 to 10 parts by mass with respect to 100 parts by mass of the resin (thermoplastic resin).

In order to impart an antistatic effect to the sealant layer 11, the sealant layer 11 is provided with a conductive filler such as a metal oxide (different from the above-mentioned inorganic particles) or an antistatic agent (for example, a polymer type copolymer type). ) Etc. may be included.
The sealant layer 11 may further contain additives such as a dispersant, a filler, and a plasticizer, if necessary.

The thickness of the sealant layer 11 is preferably 0.1 to 50 μm, more preferably 0.5 to 40 μm, from the viewpoint of obtaining sufficient heat sealability without excessively impairing other performance.

(Middle layer 12)
When the cover tape 1 includes the intermediate layer 12, the intermediate layer 12 is usually present between the sealant layer 11 and the base material layer 14.
The intermediate layer 12 does not necessarily have to be in direct contact with the sealant layer 11 or the base material layer 14. That is, there may be an additional layer between the base material layer 14 and the intermediate layer 12, and there may be an additional layer between the sealant layer 11 and the intermediate layer 12. Of course, the intermediate layer 12 may be in contact with the base material layer 14 and the sealant layer 11.
When the cover tape 1 includes the intermediate layer 12, the cushioning property, impact resistance, and the like of the cover tape 1 can be improved. Further, when the cover tape 1 includes the intermediate layer 12, the pressing force at the time of heat sealing is appropriately leveled, and it may be easy to design the _{F High} / F _{Low value to 2 to 5.}

Examples of the material of the intermediate layer 12 include an olefin resin, a styrene resin, and a cyclic olefin resin. Above all, an olefin resin is preferable from the viewpoint of improving the cushioning property of the entire cover tape 1.
Examples of the olefin resin include polyethylene and polypropylene. Of these, polyethylene is preferable. In particular, from the viewpoint of cushioning property, low density polyethylene (LDPE) or linear low density polyethylene (L-LDPE) is more preferable. High-density polyethylene (HDPE) is also preferable from the viewpoint of achieving both cushioning and strength.
The intermediate layer 12 may contain various additives. Examples of the additive include those mentioned in the sealant layer and the base material layer.

When the intermediate layer is provided, its thickness is preferably 10 to 50 μm, more preferably 15 to 45 μm, from the viewpoint of improving the cushioning property of the entire cover tape without excessively impairing other performance. Incidentally, it is preferable that the thickness of the intermediate layer is not too thick so that the heat from the heat source at the time of heat sealing is quickly and sufficiently transferred to the sealant layer 11.

(Adhesive layer 13)
The adhesive layer 13 may be provided for bonding the intermediate layer 12 and the base material layer 14, for example, when the cover tape 1 includes the intermediate layer 12.
As the material for forming the adhesive layer 13, generally, a combination of a polyol such as a polyester polyol or a polyether polyol and an isocyanate compound can be used.
Further, as a material for forming the adhesive layer 13, a known solvent-based or water-based anchor coating agent can be used. More specifically, anchor coating agents such as isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based can be mentioned.
Further, as a material for forming the adhesive layer 13, urethane-based adhesive resin for dry lamination and the like can be mentioned.

Incidentally, by applying a corona treatment to the adhesive surface of the intermediate layer 12 and / or the base material layer 14, the adhesiveness can be further improved. The conditions for this corona treatment may be adjusted as appropriate.

The thickness of the adhesive layer 13 is preferably 0.001 to 10 μm, more preferably 0.01 to 5 μm. By setting the thickness to an appropriate level, it is possible to suppress deterioration of visibility while obtaining sufficient adhesiveness.
(Base material layer 14)
The base material layer 14 contains a polyester resin and has a thickness of 5 to 30 μm. As described above, this _{facilitates the design of the F High} / F _Low value to 2-5.
Further, the polyester resin is preferable from the viewpoint of mechanical strength. That is, by forming the base material layer 14 with a material containing a polyester resin, it is easy to obtain mechanical strength that can withstand more than enough when the cover tape is peeled off from the carrier tape. Further, the polyester resin has an advantage that it is resistant to heat when the cover tape 1 is heat-sealed on the carrier tape.

Specific examples of the polyester resin include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and derivatives thereof. From the viewpoint of balance of mechanical strength, heat resistance, cost and the like, the base material layer 14 preferably contains polyethylene terephthalate (PET).
When forming the base material layer 14, a commercially available polyester resin film may be used.

The base material layer 14 may be stretched or unstretched.
By selecting an appropriate polyester-based resin film on the market, it becomes easy to design the value of _{F High} / F _{Low to 2 to 5.}

The base material layer 14 preferably contains an antistatic agent. As a result, it is possible to suppress the charge of static electricity when accommodating and transporting the electronic component and when the cover tape 1 is peeled off from the carrier tape, and it is possible to suppress damage to the electronic component.

Examples of the antistatic agent include a conductive filler such as a metal oxide, a polymer copolymer type antistatic agent, and a surfactant type antistatic agent.
When the base material layer 14 contains an antistatic agent, it may be contained in the base material layer 14 or may be laminated on the base material layer 14 by coating.

The thickness of the base material layer 14 is 5 to 30 μm, preferably 10 to 27.5 μm, and more preferably 10 to 25 μm. By appropriately adjusting the thickness of the base material layer 14, it is easy to improve the heat sealability to various types of carrier tapes.
Further, when the thickness of the base material layer 14 is 30 μm or less, the rigidity of the cover tape 1 does not become too large. As a result, the cover tape 1 can easily follow the deformation of the carrier tape even when a torsional stress is applied to the carrier tape after sealing. Therefore, it is possible to prevent the cover tape from being unintentionally peeled off from the carrier tape.
Further, when the thickness of the base material layer 14 is 10 μm or more, the mechanical strength of the cover tape 1 can be sufficiently improved. Therefore, for example, even when the cover tape 1 is peeled off from the carrier tape at high speed, it is possible to prevent the cover tape from breaking.

(Other layers)
The cover tape 1 may or may not have a layer other than the above.
In one aspect, _{from the viewpoint of setting the F High} / F _Low value to 2 to 5, the cover tape 1 is placed between the above layers (sealant layer 11, intermediate layer 12, adhesive layer 13 and base material layer 14). It may have a functional layer having some function.

(Additional explanation about _{F High} / F _{Low, etc.)}
In the cover tape 1, _{the value of F High} / F _Low may be 2 to 5, but _{the value of F High} / F _Low is preferably 2.2 to 4.5, more preferably 2.5 to 4.0. Is.
The value of F _Low itself is preferably 5 to 80 gf, more preferably 10 to 70 gf, and even more preferably 20 to 60 gf. And _{the value of F High} itself is 2 to 5 times these numerical values. When _{the values of F Low} and F _High themselves are within an appropriate range, it is easy to peel off under normal cover tape peeling conditions while appropriately protecting the housed electronic components.

As a precaution, _{it will be explained that F Low} and F _High are "average values".
F _Low is the "average value" of the peel strength obtained by [Condition 1], which means the magnitude of the force measured during peeling with the measurement time t as the horizontal axis in the test of [Condition 1]. It means that the average of the graphs in which F is plotted on the vertical axis (the value obtained by dividing the total peel strength measured at regular intervals by the number of measurement points) is adopted as _{F Low.} However, in calculating this average, the "rising portion" near t = 0 and the "falling portion" near the end of t = measurement time in the graph are excluded.
Similarly, F _High is the "average value" of the peel strength obtained by [Condition 2], which means that the force measured during peeling with the measurement time t as the horizontal axis in the test of [Condition 2]. It means that the average of the graphs in which the magnitude F of the above is plotted on the vertical axis (the value obtained by dividing the total peel strength measured at regular intervals by the number of measurement points) is adopted as _{F High.} In calculating this average, the “rising portion” near t = 0 and the “falling portion” near the end of the measurement time in the graph are excluded.

(Production method)
The manufacturing method of the cover tape 1 is not particularly limited. For example, it can be produced by applying a known extrusion method, laminating method, coating method or the like.
More specifically, the cover tape 1 can be manufactured by the following procedure.
(1) A film corresponding to the base material layer 14 is prepared. This film may be subjected to surface treatment such as corona treatment.
(2) The film prepared in (1) and the film corresponding to the intermediate layer 12 are laminated. For laminating, for example, a dry laminating method can be applied. When laminated by the dry laminating method, an adhesive layer 13 is formed between the base material layer 14 and the intermediate layer 12.
(3) The sealant layer 11 is formed on the surface of the laminated film obtained in (2) where the intermediate layer 12 is exposed by a coating method. For example, a coating liquid obtained by dissolving or dispersing (meth) acrylic resin or inorganic particles in an organic solvent such as toluene is applied to the exposed surface of the intermediate layer 12 using a bar coater, a roll coater, a gravure coater, or the like. Although it depends on the coating method and the desired film thickness, the non-volatile content concentration of the coating liquid may be adjusted between, for example, 10 to 50% by mass.
After coating, the sealant layer 11 can be formed by performing a drying treatment at about 65 to 75 ° C. By using an appropriate coating liquid and drying at an appropriate temperature, the surface condition after drying becomes appropriate, and it is easy to manufacture a cover tape having _{an F High} / F _{Low value of 1.0 to 2.0.} A commercially available product may be used as the coating liquid. Commercially available coating liquids can be obtained from, for example, DIC Corporation.
(4) If necessary, the obtained film is cut to an appropriate length and width.

<Electronic component packaging>
An electronic component package can be manufactured by heat-sealing the carrier tape in which the electronic component is housed in the recess and the cover tape 1 described above. For example, an electronic component package in which the sealant layer 11 of the cover tape 1 is adhered to the carrier tape can be obtained by the following procedure.
(1) Prepare a carrier tape in which electronic components are housed in a recess.
(2) The cover tape 1 is used to cover the entire opening of the carrier tape described above. At this time, the sealant layer 11 is brought into contact with the carrier tape.
(3) Heat seal treatment is performed.

With regard to the carrier tape, the tendency of the peel strength from the cover tape tends to depend on the glass transition temperature of the main raw material contained in the carrier tape.
For example, when a carrier tape in which the main raw material is polystyrene is used, the glass transition temperature Tg of polystyrene is about 80 ° C., so that the peel strength between the cover tape and the cover tape tends to be high even if the cover tape is sealed at a low temperature.
On the other hand, when a carrier tape whose main raw material is polycarbonate is used, the glass transition temperature Tg of polycarbonate is about 150 ° C., so that the peel strength between the cover tape and the cover tape tends to be low unless the cover tape is sealed at a high temperature.
The cover tape of the present embodiment has _{a value of F High} / F _Low of 2 to 5. Therefore, the peel strength can be not too strong even when combined with a cover tape having a low Tg, and can be a strong peel strength which can withstand practical use even when combined with a cover tape having a high Tg. That is, it can be appropriately heat-sealed to various types of carrier tapes.

The specific method and conditions of the heat seal are not particularly limited as long as the cover tape 1 adheres sufficiently strongly to the carrier tape. Typically, it can be carried out using a known taping machine at a temperature of 100 to 240 ° C., a load of 0.1 to 10 kgf (0.98 to 98 N), and a time of 0.0001 to 1 second. By changing this condition, the cover tape 1 can be appropriately heat-sealed with various carrier tapes.

The obtained electronic component package is wound on a reel, for example, and then transported to a work area where the electronic component is mounted on an electronic circuit board or the like. The material of the reel can be metal, paper, plastic, or the like.
After the electronic component package is transported to the work area, the cover tape 1 is peeled off from the carrier tape, and the contained electronic component is taken out.

The electronic components to be accommodated are not particularly limited. Examples of all parts used in the manufacture of electrical and electronic equipment such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes can be mentioned.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the range in which the object of the present invention can be achieved are included in the present invention.

Embodiments of the present invention will be described in detail based on Examples and Comparative Examples. As a reminder, the invention is not limited to examples.

<Manufacturing of cover tape>
(Example 1: Manufacture of cover tape)
Manufactured by the following procedure.
(1) As a base material layer, a biaxially stretched polyethylene terephthalate film having a film thickness of 12 μm (Espet (registered trademark) E5100 manufactured by Toyobo Co., Ltd.) was prepared.
(2) Polyethylene was laminated on the corona-treated surface side of the base material layer by dry laminating (using a urethane-based adhesive) so as to have a film thickness of 25 μm. As a result, an intermediate layer was provided.
(3) The exposed surface of the intermediate layer was corona-treated.
(4) 15% by mass of styrene sealant resin (LX2507H, manufactured by Zeon Corporation), 15% by mass of acrylic sealant resin (A450A, manufactured by DIC), 2% by mass of zinc oxide having an average particle size of 100 nm, and 68% by mass of toluene. A mixed coating solution was prepared. This coating liquid was applied to the exposed surface of the intermediate layer treated with corona in (3) and dried at 70 ° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Example 2: Manufacture of cover tape)
Manufactured by the following procedure.
(1) As a base material layer, a biaxially stretched polyethylene terephthalate film having a film thickness of 25 μm (Espet (registered trademark) E5100 manufactured by Toyobo Co., Ltd.) was prepared.
(2) Polyethylene was laminated as an intermediate layer on the corona-treated surface side of the base material layer so as to have a film thickness of 25 μm.
(3) The exposed surface of the intermediate layer was corona-treated.
(4) A coating solution in which 15% by mass of a styrene-based sealant resin (LX2507H manufactured by Zeon Corporation), 1% by mass of zinc oxide having an average particle size of 100 nm, 1% by mass of aluminum oxide having an average particle size of 100 nm, and 68% by mass of cyclohexane are mixed. Was prepared. This coating liquid was applied to the exposed surface of the intermediate layer treated with corona in (3) and dried at 70 ° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Example 3: Manufacture of cover tape)
Manufactured by the following procedure.
(1) As a base material layer, a biaxially stretched polyethylene terephthalate film having a film thickness of 12 μm (Espet (registered trademark) E5100 manufactured by Toyobo Co., Ltd.) was prepared.
(2) Polyethylene was laminated on the corona-treated surface side of the base material layer by dry laminating (using a urethane-based adhesive) so as to have a film thickness of 25 μm. As a result, an intermediate layer was provided.
(3) The exposed surface of the intermediate layer was corona-treated.
(4) Styrene-based sealant resin (Zeon Corporation, LX2507H) 15% by mass, acrylic sealant resin (Mitsubishi Chemical Corporation, Dianal BR-116) 15% by mass, aluminum oxide with an average particle size of 100 nm, 2% by mass, A coating liquid mixed with 68% by mass of toluene was prepared. This coating liquid was applied to the exposed surface of the intermediate layer treated with corona in (3) and dried at 70 ° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Example 4: Manufacture of cover tape)
Manufactured by the following procedure.
(1) As a base material layer, a biaxially stretched polyethylene terephthalate film having a film thickness of 12 μm (Espet (registered trademark) E5100 manufactured by Toyobo Co., Ltd.) was prepared.
(2) Polyethylene was laminated on the corona-treated surface side of the base material layer by dry laminating (using a urethane-based adhesive) so as to have a film thickness of 25 μm. As a result, an intermediate layer was provided.
(3) The exposed surface of the intermediate layer was corona-treated.
(4) A coating liquid was prepared by mixing 30% by mass of an acrylic sealant resin (Dianal BR-116 manufactured by Mitsubishi Chemical Corporation), 2% by mass of zinc oxide having an average particle size of 100 nm, and 68% by mass of toluene. This coating liquid was applied to the exposed surface of the intermediate layer treated with corona in (3) and dried at 70 ° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Comparative Example 1: Manufacture of cover tape)
Manufactured by the following procedure.
(1) As a base material layer, a biaxially stretched polyethylene terephthalate film having a film thickness of 12 μm (Espet (registered trademark) E5100 manufactured by Toyobo Co., Ltd.) was prepared.
(2) Polyethylene was laminated on the corona-treated surface side of the base material layer by dry laminating (using a urethane-based adhesive) so as to have a film thickness of 25 μm. As a result, an intermediate layer was provided.
(3) The exposed surface of the intermediate layer was corona-treated.
(4) A coating liquid was prepared by mixing 30% by mass of an acrylic sealant resin (A450A manufactured by DIC), 2% by mass of zinc oxide having an average particle size of 100 nm, and 68% by mass of toluene. This coating liquid was applied to the exposed surface of the intermediate layer treated with corona in (3) and dried at 70 ° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Comparative Example 2: Manufacture of cover tape)
Manufactured by the following procedure.
(1) As a base material layer, a biaxially stretched polyethylene terephthalate film having a film thickness of 25 μm (Espet (registered trademark) E5100 manufactured by Toyobo Co., Ltd.) was prepared.
(2) Polyethylene was laminated on the corona-treated surface side of the base material layer by dry laminating (using a urethane-based adhesive) so as to have a film thickness of 25 μm. As a result, an intermediate layer was provided.
(3) The exposed surface of the intermediate layer was corona-treated.
(4) A coating liquid was prepared by mixing 30% by mass of an acrylic sealant resin (A450A manufactured by DIC), 2% by mass of zinc oxide having an average particle size of 100 nm, and 68% by mass of toluene. This coating liquid was applied to the exposed surface of the intermediate layer treated with corona in (3) and dried at 70 ° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

<Measurement of _{F High} and F _Low>
(Measurement according to [Condition 1])
The cover tapes obtained in Examples 1 and 2 and Comparative Example 1 were cut to a width of 5.5 mm, respectively.
The cut cover tape was heat-sealed on an 8 mm wide sheet (flat sheet used as a material for the carrier tape) of the carrier tape sheet "Clearlen CST2401" manufactured by Denka Corporation under the following conditions. As a result, a test complex was obtained.
・ Equipment: ISMECA MBM4000 (taping machine)
-Iron shape at the time of sealing: Blade width 0.3 mm / Blade length 54 mm / Blade spacing 1.95 mm (Two trowels of 0.3 mm x 54 mm are lined up at 1.95 mm intervals)
・ Seal temperature: 160 ℃
・ Sealing time: 0.1s
・ Seal pressure: 4kgf / cm ²

Using the obtained composite, the peel strength of the cover tape and the carrier tape was measured under the following conditions.
-Peeling device: 856VS (manufactured by General Production Devices)
-Peeling speed: 300 mm / min
・ Peeling angle: 180 °
-Standard: JIS K 0806-3

_{In the above measurement, F Low} , f _max and f _min were obtained from the relationship (graph) of the measurement time and the peel strength obtained from the peeling device. For F _Low , the peel strength measured 100 times (10 seconds in total) every 0.1 seconds, excluding the “rising part” near t = 0 and the “falling part” near the end of the measurement time in the graph. The value obtained by dividing the total of the above by 100 was adopted.

(Measurement according to [Condition 2])
The same measurement as the above [Condition 1] was performed except that the heat seal temperature was changed to 200 ° C. Then, F _High was obtained.

<Performance evaluation 1: Evaluation using polystyrene carrier tape sheet>
The cover tapes of each Example and Comparative Example were cut to a width of 5.5 mm, respectively. The left and right ends of the cut cover tape were cut in three places with a cutter of about 0.5 mm (these cuts are made to make it easier to cut the tape).
The notched cover tape was heat-sealed on an 8 mm wide sheet (flat sheet used as the material for the carrier tape) of the carrier tape sheet "Clearlen CST2401 (polystyrene type)" manufactured by Denka Co., Ltd. under the following conditions. .. As a result, a test complex was obtained.
・ Equipment: ISMECA MBM4000 (taping machine)
-Iron shape at the time of sealing: Blade width 0.3 mm / Blade length 54 mm / Blade spacing 1.95 mm (Two trowels of 0.3 mm x 54 mm are lined up at 1.95 mm intervals)
・ Seal temperature: 160 ℃
・ Sealing time: 0.1s
・ Seal pressure: 4kgf / cm ²

The test complex obtained as described above was peeled under the following high-speed peeling conditions. At this time, it was confirmed whether or not the tape was broken.
-Peeling device: 856VS (manufactured by General Production Devices)
・ Peeling speed: 15,000 mm / min
・ Peeling angle: 180 °
-Standard: JIS K 806-3

<Performance evaluation 2: Evaluation using a polycarbonate carrier tape sheet>
For the cover tape of each example or comparative example, an 8 mm wide sheet (flat sheet used as a material for the carrier tape) of the carrier tape sheet "No. 3000 (polycarbonate type)" manufactured by 3M Japan Ltd. is used under the following conditions. Heat-sealed with. As a result, a test complex was obtained.
・ Equipment: ISMECA MBM4000 (taping machine)
-Iron shape at the time of sealing: Blade width 0.3 mm / Blade length 54 mm / Blade spacing 1.95 mm (Two trowels of 0.3 mm x 54 mm are lined up at 1.95 mm intervals)
・ Seal temperature: 200 ℃
・ Sealing time: 0.1s
・ Seal pressure: 4kgf / cm ²

Holding both ends of the test complex obtained as described above with both hands, one side was rotated 180 ° clockwise, the other 180 ° counterclockwise, and then returned to the original state was repeated 10 times. After this operation, the presence or absence of peeling between the cover tape and the carrier tape was visually confirmed.

The results are shown in the table below. The numerical unit of F _High and F _Low is gf (gram weight).

In "Performance Evaluation 1" (adhesion with polystyrene sheet) of the cover tapes of Examples 1 to 4, even a cover tape having a scratch on the end where the tape is likely to break can be peeled off without causing the tape break. It could be confirmed. This is because the cover tapes of Examples 1 to 4 having a F _High / F _Low value of 2 to 5 are suitable for a polystyrene-based carrier tape that easily adheres at a relatively low temperature and at a relatively low temperature of 160 ° C. It is probable that it was possible to adhere with sufficient strength.
Further, in "Performance Evaluation 2" (adhesion with the polycarbonate sheet) of the cover tapes of Examples 1 to 4, good results were obtained in the torsion test, for example, strong vibration was generated during the transportation of the composite in which the electronic parts were packaged. It was confirmed that the outflow of electronic parts is unlikely to occur even if it is applied. This is because the cover tapes of Examples 1 to 4 having a F _High / F _Low value of 2 to 5 have a high temperature of 200 ° C., which makes it difficult to adhere to the polycarbonate-based carrier tape, which is difficult to adhere to unless the temperature is relatively high. It is thought that high strength can be ensured by adhering with.

On the other hand, in "Performance Evaluation 1" of the cover tapes of Comparative Examples 1 and 2, it was confirmed that the tape breakage is likely to occur especially in the case of the cover tape having a scratch on the end where the tape breakage is likely to occur. This is because the cover tapes of Comparative Examples 1 and 2 in which the F _High / F _Low value is less than 2 are a polystyrene-based carrier tape that easily adheres at a relatively low temperature and an appropriate strength (too strong) at 160 ° C. It is probable that it was not possible to make close contact with the product (not strong enough).
Further, in the "performance evaluation 2" of the cover tapes of Comparative Examples 1 and 2, good results were not obtained in the torsion test. It was confirmed that a spill could occur. This is because the cover tapes of Comparative Examples 1 and 2 in which the F _High / F _Low value is less than 2 are a polycarbonate-based carrier tape that is difficult to adhere to unless the temperature is relatively high, and sufficient strength even at a high temperature of about 200 ° C. It is probable that it was difficult to make them adhere to each other.

1 Cover tape 11 Sealant layer 12 Intermediate layer 13 Adhesive layer 14 Base material layer

Claims (6)

A cover tape for packaging electronic components including a base material layer and a sealant layer provided on one surface side of the base material layer.
The base material layer contains polyester and has a thickness of 5 to 30 μm.
When the average value of the peel strength obtained by the following [Condition 1] is F _Low and the average value of the peel strength obtained by the following [Condition 2] is F _High , the _{value of F High} / F _Low is 2 to 5. A cover tape.
[Condition 1]
Sealing condition: The cover tape is slit to a width of 5.3 mm to form a long shape, which is brought into contact with the surface of the carrier tape sheet "Clearlen CST2401" manufactured by Denka Co., Ltd. on the surface on the sealant layer side. Heat seal at 160 ° C., 4 kg / cm ² , 0.1 seconds to obtain a composite.
Peeling conditions: The composite is peeled under the conditions of a peeling speed of 300 mm / min and a peeling angle of 180 °, and the peeling strength is measured.
[Condition 2]
The conditions are the same as in [Condition 1] except that the temperature of the heat seal is set to 200 ° C. The cover tape for packaging electronic components according to claim 1.
The polyester contained in the base material layer is a cover tape containing polyethylene terephthalate. The cover tape for packaging electronic components according to claim 1 or 2.
A cover tape provided with an intermediate layer between the base material layer and the sealant layer. The cover tape for packaging electronic components according to claim 3.
The intermediate layer is a cover tape containing polyethylene. The cover tape for packaging electronic components according to any one of claims 1 to 4.
The sealant layer is a cover tape containing at least one selected from the group consisting of (meth) acrylic resin, ethylene-alkyl (meth) acrylate copolymer and polystyrene resin. A carrier tape in which an electronic component is housed in a recess and a cover tape according to any one of claims 1 to 5 are provided.
An electronic component package in which the sealant layer is adhered to the carrier tape so as to seal the electronic component.

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