TW201612277A - Adhesive composition, adhesive obtained by crosslinking same, adhesive for masking films, adhesive for heat-resistant adhesive films, heat-resistant adhesive film for masking, and method for using heat-resistant adhesive film for masking - Google Patents

Adhesive composition, adhesive obtained by crosslinking same, adhesive for masking films, adhesive for heat-resistant adhesive films, heat-resistant adhesive film for masking, and method for using heat-resistant adhesive film for masking

Info

Publication number
TW201612277A
TW201612277A TW104126779A TW104126779A TW201612277A TW 201612277 A TW201612277 A TW 201612277A TW 104126779 A TW104126779 A TW 104126779A TW 104126779 A TW104126779 A TW 104126779A TW 201612277 A TW201612277 A TW 201612277A
Authority
TW
Taiwan
Prior art keywords
adhesive
masking
heat
resistant
films
Prior art date
Application number
TW104126779A
Other languages
Chinese (zh)
Other versions
TWI668284B (en
Inventor
Toshiyuki Takeda
Original Assignee
Nippon Synthetic Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Synthetic Chem Ind filed Critical Nippon Synthetic Chem Ind
Publication of TW201612277A publication Critical patent/TW201612277A/en
Application granted granted Critical
Publication of TWI668284B publication Critical patent/TWI668284B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24—Homopolymers or copolymers of amides or imides
    • C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/31—Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

Provided is an adhesive composition which is capable of maintaining an adequate adhesive force even under high temperature conditions, and which is not susceptible to the occurrence of contamination if separated from an object to be bonded after use under high temperature conditions. This adhesive composition is able to be used for a heat-resistant adhesive film for masking, which can be separated with a small force, and the like. An adhesive composition which contains an acrylic resin (A) that has a structural unit derived from a polyoxyethylene structure-containing monomer (a1) and a structural unit derived from a (meth)acrylic acid alkyl ester monomer (a2), and which is characterized in that: the content of the structural unit derived from a polyoxyethylene structure-containing monomer (a1) is 10-45% by weight; and an antistatic agent is not contained.
TW104126779A 2014-08-18 2015-08-18 Adhesive, adhesive for masking film, adhesive for heat-resistant adhesive film, heat-resistant adhesive film for masking, and method of using the same TWI668284B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-165780 2014-08-18
JP2014165780 2014-08-18

Publications (2)

Publication Number Publication Date
TW201612277A true TW201612277A (en) 2016-04-01
TWI668284B TWI668284B (en) 2019-08-11

Family

ID=55350731

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104126779A TWI668284B (en) 2014-08-18 2015-08-18 Adhesive, adhesive for masking film, adhesive for heat-resistant adhesive film, heat-resistant adhesive film for masking, and method of using the same

Country Status (5)

Country Link
JP (1) JP6996834B2 (en)
KR (1) KR20170043619A (en)
CN (1) CN106574161B (en)
TW (1) TWI668284B (en)
WO (1) WO2016027787A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI820178B (en) * 2018-08-08 2023-11-01 日商琳得科股份有限公司 Terminal protection tape and method for manufacturing semiconductor device with electromagnetic wave shielding film

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017145545A1 (en) * 2016-02-25 2017-08-31 株式会社寺岡製作所 Adhesive agent composition and adhesive tape
JP6827670B2 (en) * 2016-09-30 2021-02-10 日本カーバイド工業株式会社 Adhesive composition for optical member protective film and optical member protective film
JP6915291B2 (en) * 2017-02-14 2021-08-04 東洋インキＳｃホールディングス株式会社 Surface protection adhesive and surface protection sheet
WO2018181550A1 (en) * 2017-03-29 2018-10-04 住化積水フィルム株式会社 Plating process conveyance tape base material, and plating process conveyance tape
JP7091610B2 (en) * 2017-05-31 2022-06-28 昭和電工マテリアルズ株式会社 Surface protective film and surface protective film
WO2019180647A1 (en) 2018-03-21 2019-09-26 3M Innovative Properties Company High temperature resistant masking adhesive composition
JP7077091B2 (en) * 2018-03-23 2022-05-30 リンテック株式会社 Adhesive film
JP7132004B2 (en) * 2018-07-17 2022-09-06 リンテック株式会社 masking sheet
WO2021075188A1 (en) * 2019-10-15 2021-04-22 綜研化学株式会社 Adhesive agent composition and adhesive sheet
JP7375451B2 (en) * 2019-10-17 2023-11-08 Dic株式会社 adhesive composition
CN111117512A (en) * 2019-12-31 2020-05-08 浙江福莱新材料股份有限公司 Easy-to-peel base-paper-free cold mounting protective film
CN111117513A (en) * 2019-12-31 2020-05-08 浙江福莱新材料股份有限公司 Preparation method of efficient environment-friendly base-paper-free protective adhesive tape

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059449A (en) * 1991-06-28 1993-01-19 Toyo Ink Mfg Co Ltd Rereleasable self-adhesive composition
JP5061898B2 (en) * 2005-06-24 2012-10-31 東洋インキＳｃホールディングス株式会社 Antistatic acrylic adhesive
JP4942171B2 (en) * 2006-09-14 2012-05-30 綜研化学株式会社 Adhesive composition and adhesive sheet
JP5083805B2 (en) * 2007-05-08 2012-11-28 綜研化学株式会社 Adhesive composition for surface protective film
JP2010132891A (en) * 2008-10-31 2010-06-17 Nippon Synthetic Chem Ind Co Ltd:The Adhesive for optical member, optical member having adhesive layer attached thereto and obtained by using the same, and adhesive composition for active energy beam-setting and/or thermosetting optical member
JP2011127052A (en) * 2009-12-21 2011-06-30 Ipposha Oil Industries Co Ltd Pressure-sensitive adhesive composition for surface protecting sheet and surface protecting sheet
WO2011115224A1 (en) 2010-03-18 2011-09-22 積水化学工業株式会社 Pressure-sensitive adhesive composition for optical members and pressure-sensitive adhesive tape for optical members
KR20120076817A (en) * 2010-12-30 2012-07-10 주식회사 엘지화학 Pressure sensitive adhesive for protective film having anti-static property
JP5934158B2 (en) * 2013-08-28 2016-06-15 藤森工業株式会社 Electrical insulating pressure-sensitive adhesive layer, electrical insulating pressure-sensitive adhesive film, and optical member on which it is bonded

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI820178B (en) * 2018-08-08 2023-11-01 日商琳得科股份有限公司 Terminal protection tape and method for manufacturing semiconductor device with electromagnetic wave shielding film

Also Published As

Publication number Publication date
KR20170043619A (en) 2017-04-21
CN106574161B (en) 2019-06-14
JP6996834B2 (en) 2022-01-17
CN106574161A (en) 2017-04-19
WO2016027787A1 (en) 2016-02-25
TWI668284B (en) 2019-08-11
JPWO2016027787A1 (en) 2017-06-01

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