WO2012173885A3 - Structural member for polishing - Google Patents

Structural member for polishing Download PDF

Info

Publication number
WO2012173885A3
WO2012173885A3 PCT/US2012/041535 US2012041535W WO2012173885A3 WO 2012173885 A3 WO2012173885 A3 WO 2012173885A3 US 2012041535 W US2012041535 W US 2012041535W WO 2012173885 A3 WO2012173885 A3 WO 2012173885A3
Authority
WO
WIPO (PCT)
Prior art keywords
monomer
homopolymer
polishing
transition temperature
glass transition
Prior art date
Application number
PCT/US2012/041535
Other languages
French (fr)
Other versions
WO2012173885A2 (en
Inventor
Jun Fujita
Yusuke Saito
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Priority to KR1020147000358A priority Critical patent/KR20140051212A/en
Priority to CN201280028637.0A priority patent/CN103596729B/en
Publication of WO2012173885A2 publication Critical patent/WO2012173885A2/en
Publication of WO2012173885A3 publication Critical patent/WO2012173885A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Abstract

A structural member for polishing including a supporting member, a polishing material, and an adhesive agent layer bonding these together. The adhesive agent layer includes a polymer of monomers including from 58 to 85 wt% of a first monomer, from 2 to 7 wt% of a second monomer, and from 10 to 40 wt% of a third monomer. The first monomer is an alkyl (meth)acrylate having an alkyl group with carbon counts from 8 to 18 carbon atoms and provides a homopolymer with a glass transition temperature of 0°C or less. The second monomer is a polar monomer that provides a homopolymer with a glass transition temperature of 50°C or greater. The third monomer is an alkyl (meth)acrylate having an alkyl group with carbon counts from 4 to 18 carbon atoms or an aralkyl group having carbon counts from 7 to 18 carbon atoms and provides a homopolymer with a glass transition temperature of 10°C or greater.
PCT/US2012/041535 2011-06-13 2012-06-08 Structural member for polishing WO2012173885A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020147000358A KR20140051212A (en) 2011-06-13 2012-06-08 Structural member for polishing
CN201280028637.0A CN103596729B (en) 2011-06-13 2012-06-08 Structural member for polishing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-131587 2011-06-13
JP2011131587A JP5851124B2 (en) 2011-06-13 2011-06-13 Polishing structure

Publications (2)

Publication Number Publication Date
WO2012173885A2 WO2012173885A2 (en) 2012-12-20
WO2012173885A3 true WO2012173885A3 (en) 2013-05-02

Family

ID=47357676

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/041535 WO2012173885A2 (en) 2011-06-13 2012-06-08 Structural member for polishing

Country Status (5)

Country Link
JP (1) JP5851124B2 (en)
KR (1) KR20140051212A (en)
CN (1) CN103596729B (en)
TW (1) TW201307504A (en)
WO (1) WO2012173885A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11964359B2 (en) 2015-10-30 2024-04-23 Applied Materials, Inc. Apparatus and method of forming a polishing article that has a desired zeta potential

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6838811B2 (en) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー Method of polishing intermittent structured polished articles and workpieces
US10543582B2 (en) * 2014-07-07 2020-01-28 Bando Chemical Industries, Ltd. Abrasive film
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN113579992A (en) 2014-10-17 2021-11-02 应用材料公司 CMP pad construction with composite material properties using additive manufacturing process
JP6976048B2 (en) * 2015-11-30 2021-12-01 日東電工株式会社 Adhesive sheet for fixing polishing pads
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
KR102345784B1 (en) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 High-hardness polishing pad for polishing the backside of wafer
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112171532A (en) * 2020-08-26 2021-01-05 南京航空航天大学 Elastic milling and polishing tool for free-form surface machining and manufacturing method thereof

Citations (5)

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Publication number Priority date Publication date Assignee Title
US6190746B1 (en) * 1995-04-25 2001-02-20 Nitta Corp Polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine
WO2001045900A1 (en) * 1999-12-23 2001-06-28 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US6616520B1 (en) * 1998-08-28 2003-09-09 Nitta Corporation Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate
US6666752B1 (en) * 1998-08-28 2003-12-23 Nitta Corporation Wafer retainer and method for attaching/detaching the wafer retainer to/from polishing machine base plate
US7169199B2 (en) * 2002-11-25 2007-01-30 3M Innovative Properties Company Curable emulsions and abrasive articles therefrom

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JPH02220838A (en) * 1989-02-22 1990-09-04 Rodeele Nitta Kk Laminate and support material of member to be polished and polishing cloth used therewith
US5441549A (en) * 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
CN1188252C (en) * 1997-03-07 2005-02-09 美国3M公司 Abrasive article for providing clear surface finish on glass
US6077601A (en) * 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
US6706383B1 (en) * 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
JP4351007B2 (en) * 2003-09-08 2009-10-28 東洋ゴム工業株式会社 Polishing pad
JP4898172B2 (en) * 2005-09-08 2012-03-14 日本ミクロコーティング株式会社 Polishing pad, method for producing the same, and polishing method
JP2007138015A (en) * 2005-11-18 2007-06-07 Toyo Ink Mfg Co Ltd Adhesive and adhesive sheet using the same
JP5702912B2 (en) * 2008-11-21 2015-04-15 積水化学工業株式会社 Double-sided adhesive tape for fixing adhesive and abrasive cloth
JP5656379B2 (en) * 2009-03-03 2015-01-21 日立マクセル株式会社 Dicing adhesive film and method for manufacturing semiconductor element
JP2011044461A (en) * 2009-08-19 2011-03-03 Nitta Corp Adhesive tape for laser dicing
JP2011074308A (en) * 2009-10-01 2011-04-14 Three M Innovative Properties Co Transparent adhesive sheet and image display device including the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190746B1 (en) * 1995-04-25 2001-02-20 Nitta Corp Polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine
US6616520B1 (en) * 1998-08-28 2003-09-09 Nitta Corporation Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate
US6666752B1 (en) * 1998-08-28 2003-12-23 Nitta Corporation Wafer retainer and method for attaching/detaching the wafer retainer to/from polishing machine base plate
WO2001045900A1 (en) * 1999-12-23 2001-06-28 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US7169199B2 (en) * 2002-11-25 2007-01-30 3M Innovative Properties Company Curable emulsions and abrasive articles therefrom

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11964359B2 (en) 2015-10-30 2024-04-23 Applied Materials, Inc. Apparatus and method of forming a polishing article that has a desired zeta potential

Also Published As

Publication number Publication date
TW201307504A (en) 2013-02-16
WO2012173885A2 (en) 2012-12-20
JP2013000809A (en) 2013-01-07
CN103596729A (en) 2014-02-19
KR20140051212A (en) 2014-04-30
JP5851124B2 (en) 2016-02-03
CN103596729B (en) 2017-01-18

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