MX2016011997A - Temperature sensitive adhesive. - Google Patents

Temperature sensitive adhesive.

Info

Publication number
MX2016011997A
MX2016011997A MX2016011997A MX2016011997A MX2016011997A MX 2016011997 A MX2016011997 A MX 2016011997A MX 2016011997 A MX2016011997 A MX 2016011997A MX 2016011997 A MX2016011997 A MX 2016011997A MX 2016011997 A MX2016011997 A MX 2016011997A
Authority
MX
Mexico
Prior art keywords
sensitive adhesive
temperature sensitive
meth
acrylate
carbon atoms
Prior art date
Application number
MX2016011997A
Other languages
Spanish (es)
Inventor
Sako Keisuke
Kawahara Shinichiro
Original Assignee
Nitta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Corp filed Critical Nitta Corp
Publication of MX2016011997A publication Critical patent/MX2016011997A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
    • C09J143/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1818—C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

Abstract

This temperature sensitive adhesive includes a side chain crystalline polymer obtained by polymerizing (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms, and adhesion of the temperature sensitive adhesive decreases at a temperature less than the melting point of the side chain crystalline polymer. The side chain crystalline polymer is composed of a copolymer obtained by further polymerizing a reactive polysiloxane compound, and the ratio of the (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms to the reactive polysiloxane compound is (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms:reactive polysiloxane compound=91:9 to 99:1, by weight.
MX2016011997A 2014-03-18 2015-01-30 Temperature sensitive adhesive. MX2016011997A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014055328A JP6734010B2 (en) 2014-03-18 2014-03-18 Temperature-sensitive adhesive sheet and temperature-sensitive adhesive tape
PCT/JP2015/052629 WO2015141294A1 (en) 2014-03-18 2015-01-30 Temperature sensitive adhesive

Publications (1)

Publication Number Publication Date
MX2016011997A true MX2016011997A (en) 2016-12-07

Family

ID=54144274

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016011997A MX2016011997A (en) 2014-03-18 2015-01-30 Temperature sensitive adhesive.

Country Status (6)

Country Link
JP (1) JP6734010B2 (en)
KR (1) KR102289184B1 (en)
CN (1) CN106103627B (en)
MX (1) MX2016011997A (en)
TW (1) TWI651385B (en)
WO (1) WO2015141294A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098077A (en) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 Anisotropic conductive film and connection method
JP2017179004A (en) * 2016-03-28 2017-10-05 ニッタ株式会社 Temperature-sensitive adhesive
JP6754609B2 (en) * 2016-05-17 2020-09-16 ニッタ株式会社 Temperature sensitive adhesive
JP6789001B2 (en) * 2016-05-17 2020-11-25 ニッタ株式会社 Temperature sensitive adhesive
JP7058405B2 (en) * 2016-06-23 2022-04-22 ニッタ株式会社 Temperature Sensitive Resin, Temperature Sensitive Adhesive and Thermosensitive Adhesive Composition
KR102235979B1 (en) * 2018-03-28 2021-04-02 주식회사 엘지화학 Adhesive film and manufacturing method of adhesive film
KR102256784B1 (en) * 2018-03-28 2021-05-26 주식회사 엘지화학 Adhesive film and manufacturing method of adhesive film
KR102290643B1 (en) * 2018-07-27 2021-08-17 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102290640B1 (en) * 2018-07-27 2021-08-17 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102293550B1 (en) * 2018-07-27 2021-08-24 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102293935B1 (en) * 2018-07-27 2021-08-24 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102293549B1 (en) * 2018-07-27 2021-08-24 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102290629B1 (en) * 2018-07-27 2021-08-17 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102293551B1 (en) * 2018-07-27 2021-08-24 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102290639B1 (en) * 2018-07-27 2021-08-17 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102542732B1 (en) * 2019-01-23 2023-06-12 주식회사 엘지화학 Polarizing film, manufacturing method of same and liquid crystal display device comprising same
KR102375401B1 (en) * 2019-01-25 2022-03-16 주식회사 엘지화학 Adhesive film and plastic organic light emitting display comprising same
KR102476489B1 (en) * 2019-04-25 2022-12-09 주식회사 엘지화학 Adhesive film and plastic organic light emitting display comprising same
KR102428187B1 (en) * 2019-07-03 2022-08-02 주식회사 엘지화학 Adhesive film, manufacturing method of same and plastic organic light emitting display comprising same
KR102428179B1 (en) * 2019-07-03 2022-08-02 주식회사 엘지화학 Adhesive film, manufacturing method of same and plastic organic light emitting display comprising same
KR102428192B1 (en) * 2019-07-03 2022-08-02 주식회사 엘지화학 Adhesive film, manufacturing method of same and plastic organic light emitting display comprising same
CN110655883B (en) * 2019-09-24 2021-07-13 南京清尚新材料科技有限公司 Cold-shut adhesive, preparation method thereof and preparation method of adhesive tape
KR102409532B1 (en) * 2019-10-22 2022-06-15 주식회사 엘지화학 Adhesive composition, adhesive film using same, backplate film comprising adhesive film and plastic organic light emitting display comprising adhesive film
KR102481004B1 (en) * 2021-02-22 2022-12-23 주식회사 켐코 Adhesive compostion having improved heat and cold resistance and adhesive tape using the same
CN117043297A (en) * 2021-03-26 2023-11-10 霓达株式会社 Temperature-sensitive adhesive and method for processing object to be processed

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JP5118350B2 (en) * 2007-01-26 2013-01-16 ニッタ株式会社 Adhesive
JP5231775B2 (en) * 2007-09-10 2013-07-10 ニッタ株式会社 Temperature-sensitive resin, temperature-sensitive adhesive, and temperature-sensitive adhesive tape
JP5358086B2 (en) * 2007-11-15 2013-12-04 ニッタ株式会社 Temperature sensitive adhesive
WO2010110107A1 (en) * 2009-03-23 2010-09-30 セメダイン株式会社 Curable composition
JP5551959B2 (en) * 2010-04-09 2014-07-16 ニッタ株式会社 Easy peelable adhesive sheet and easy peelable adhesive tape
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Also Published As

Publication number Publication date
WO2015141294A1 (en) 2015-09-24
CN106103627B (en) 2019-01-01
CN106103627A (en) 2016-11-09
JP2015178539A (en) 2015-10-08
KR20160134677A (en) 2016-11-23
KR102289184B1 (en) 2021-08-13
TWI651385B (en) 2019-02-21
JP6734010B2 (en) 2020-08-05
TW201538668A (en) 2015-10-16

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