JP7308807B2 - Electronic component packaging cover tape, electronic component package and manufacturing method thereof - Google Patents

Description

TECHNICAL FIELD The present invention relates to an electronic component packaging cover tape, an electronic component package including the electronic component packaging cover tape, and a manufacturing method thereof.

Conventionally, electronic components such as transistors, diodes, capacitors, piezoelectric element resistors, etc., have been manufactured in the field of manufacturing electronic equipment by using a carrier tape in which pockets are continuously formed in which the electronic components can be stored, and the carrier tape. After being housed in a package consisting of a cover tape to be sealed and heat-sealed, it is transported to a work area where it is surface-mounted on an electronic circuit board or the like while being wound on a reel made of paper or plastic. there is After peeling off the cover tape of the package in the working area, the electronic component is taken out from the pocket formed in the carrier tape and surface-mounted on an electronic circuit board or the like.

In Patent Document 1, by forming an adhesive layer mainly composed of an aqueous dispersion in which a polyolefin resin is dispersed with an anionic surfactant, on a cover tape, a stable peel strength can be obtained when the cover tape is peeled off from the carrier tape. It is stated that

JP 2007-276799 A

However, in the conventional technique described in Patent Document 1, the anionic surfactant exudes to the adhesive interface, which may reduce the peel strength, and the adhesive layer is created using a specific component. and the cost was high. Furthermore, there is room for improvement in the surface resistance value.

According to the invention,
A cover tape for packaging electronic parts comprising a sealant layer, an intermediate layer, and a base layer in this order, the intermediate layer being in contact with the sealant layer, and used for sealing the electronic parts with the sealant layer. hand,
The intermediate layer contains polyethylene, has a thickness of 30 to 60 μm, and has a hardness (durometer D) of 35 to 52 according to JIS7215,
Electronic component packaging, wherein the thickness of the sealant layer is 0.20 to 0.5 μm, and the ratio b/a of the thickness b (μm) of the intermediate layer to the thickness a (μm) of the sealant layer is 60 to 300 For cover tape, can be provided.
According to the invention,
a carrier tape containing electronic components;
Equipped with the electronic component packaging cover tape,
It is possible to provide an electronic component package in which the sealant layer is adhered to the carrier tape so as to seal the electronic component.
Moreover, according to the present invention,
The sealant layer of the electronic component packaging cover tape is heat-sealed by the following method while facing the surface of the polystyrene carrier tape containing the electronic components, and formed in the longitudinal direction so as to sandwich the electronic components. A step of adhering the electronic component packaging cover tape to the carrier tape via two strip-shaped heat-sealing surfaces,
It is possible to provide a method for manufacturing an electronic component package, wherein the total width of the two strip-shaped heat-sealed surfaces is 1.0 mm to 1.6 mm.
(Heat sealing method)
・Equipment: VS-120 (taping machine)
・Iron shape when sealing: blade width 0.4 mm / blade length 32 mm
・Seal temperature: 180°C
・Sealing time: 0.1s
・Seal pressure: 1 kg

According to the present invention, by adopting a specific intermediate layer, it is possible to exhibit stable peel strength when peeling from the carrier tape, and furthermore, the surface resistance value is low and the generation of static electricity accompanying peeling etc. is suppressed. It is possible to provide an electronic component packaging cover tape, an electronic component package including the electronic component packaging cover tape, and a method of manufacturing the same.

It is a schematic sectional drawing of the cover tape for electronic component packaging which concerns on this embodiment. 1 is a schematic perspective view of an electronic component package in which an electronic component packaging cover tape according to the present embodiment is sealed to a carrier tape; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In addition, in all the drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. In addition, "~" represents "more than" to "less than" unless otherwise specified.

<Cover tape for packaging electronic components>
The electronic component packaging cover tape 10 (hereinafter also referred to as "cover tape 10") according to the present embodiment comprises a sealant layer 2, an intermediate layer 4, and a base layer 6, as shown in FIG. Prepare in order. As shown in FIG. 2 , the electronic component packaging cover tape 10 seals the electronic component via the sealant layer 2 .

In the electronic component packaging cover tape 10 according to the present embodiment, the intermediate layer 4 contains polyethylene and has a hardness (durometer D) of 35 to 52 according to JIS7215 at a thickness of 30 to 60 μm,
The thickness of the sealant layer 2 is 0.15-0.5 μm, and the ratio b/a of the thickness b (μm) of the intermediate layer 4 to the thickness a (μm) of the sealant layer 2 is 60-300.

By satisfying this configuration, it is possible to exhibit stable peel strength when peeled from the carrier tape, and the cover tape for electronic component packaging, which has a low surface resistance value and suppresses the generation of static electricity accompanying peeling, etc. and the electronic An electronic component package provided with a component packaging cover tape can be provided. In other words, it is possible to provide a cover tape for electronic component packaging that has an excellent balance between peel strength and surface resistance.

The sealant layer 2, the intermediate layer 4, and the base layer 6, which constitute the cover tape 10, will be described below.

[Sealant layer 2]
As shown in FIG. 1 , in the cover tape 10 according to this embodiment, the sealant layer 2 is provided on one surface of the intermediate layer 4 .

As a material constituting the sealant layer 2, a material containing a thermoplastic resin such as an acrylic resin or a polyester resin and an antistatic agent can be used. Acrylic resin is preferable as the thermoplastic resin.

Specific examples of such antistatic agents include metal fillers such as tin oxide, zinc oxide, titanium oxide and smectite, antistatic resins such as polyether/polyolefin copolymers and polyetheresteramide block copolymers, and polyoxyethylene. selected from the group consisting of surfactants such as alkylamines, quaternary ammonium, methacrylate copolymers containing quaternary ammonium bases, maleimide copolymers containing quaternary ammonium bases, sodium polystyrene sulfonate, alkylsulfonates, and carbon; or a mixture thereof. As the carbon, fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube can be used.

From the viewpoint of preventing blocking during transportation, the material constituting the sealant layer 2 includes oxide particles containing silicon, magnesium or calcium as a main component, inorganic particles such as silica and talc, polyethylene particles, polyacrylate particles, and One selected from the group consisting of organic particles such as polystyrene particles or alloys thereof may be included.

The thickness of the sealant layer 2 can be between 0.15 μm and 0.5 μm, preferably between 0.20 μm and 0.5 μm. When the thickness of the sealant layer 2 is within the above range, the balance between the surface resistance value and the peel strength is further excellent.

The surface resistance value of the sealant layer 2 is less than 10 ¹⁰ Ω and 10 ⁴ Ω or more and 10 ⁹ Ω or less under conditions of 23° C. and 50 RH% from the viewpoint of efficiently discharging static electricity generated by various factors to the outside. is more preferable.

[Intermediate layer 4]
The material forming the intermediate layer 4 can improve the cushioning properties of the cover tape 10 as a whole and improve the adhesion to the carrier tape to be adhered.

Specific examples of the material forming the intermediate layer 4 include olefin-based resins, styrene-based resins, cyclic olefin-based resins, and the like. Among them, from the viewpoint of improving adhesion to the carrier tape to be adhered, it preferably contains an olefin resin, and more preferably contains polyethylene.

From the viewpoint of the effects of the present invention, the intermediate layer 4 contains polyethylene and has a thickness of 30 to 60 μm, preferably 35 to 55 μm, and a hardness (durometer D) conforming to JIS 7215 of 35 to 52, preferably 35 to 45. is preferably
Incidentally, the thickness of the intermediate layer in the conventional cover tape is about 20 μm.

Although the relationship between hardness (durometer D) and peel strength at a predetermined thickness of the intermediate layer 4 is not clear, if the thickness of the intermediate layer 4 exceeds the upper limit, heat is less likely to be conducted during heat sealing, and the sealant layer 2 and the Although the adhesive strength of the carrier tape is reduced, if the thickness of the intermediate layer 4 is within a predetermined range and the hardness (durometer D) is within a predetermined range, the adhesive strength due to heat during heat sealing is improved and the intermediate layer 4 It is presumed that this is because the contact area with the sealant layer 2 increases when the seat is heeled due to the improved flexibility of the seat.
The hardness (durometer D) of the intermediate layer 4 can be changed by the resin forming the intermediate layer 4 .

In the electronic component packaging cover tape 10 of the present embodiment, when the thickness of the intermediate layer 4 is in the above range, the peel strength of the sealant layer 2 to the carrier tape after heat sealing (180° peeling in accordance with JIS C0806-3 strength) can be 20 gf or more, preferably 40 gf or more. Although the upper limit is not particularly limited, it is about 100 gf or less from the viewpoint of ease of peeling during production.

[Base material layer 6]
The material constituting the base layer 6 is applied from the outside when the intermediate layer 4 and the sealant layer 2 are laminated to produce a cover tape, when the cover tape is adhered to the carrier tape, and when the cover tape is used. Any material may be used as long as it has the mechanical strength to withstand stress and the heat resistance to withstand the heat history applied when the cover tape 10 is adhered to the carrier tape. The form of the material constituting the base material layer is not particularly limited, but from the viewpoint of easy processing, it is preferably processed into a film shape.

Materials for forming the base material layer 6 include polyester-based resins, polyamide-based resins, polyolefin-based resins, polyacrylate-based resins, polymethacrylate-based resins, polyimide-based resins, polycarbonate-based resins, ABS resins, and the like. Among them, polyester-based resins are preferable from the viewpoint of the effect of the present invention. Moreover, from the viewpoint of improving the mechanical strength and flexibility of the cover tape, nylon 6 may be used as a material constituting the base layer. In addition, the material constituting the base layer may contain an antistatic agent and a lubricant.

The substrate layer 6 may be formed of a single-layer film containing the materials described above, or may be formed using a multi-layer film containing the materials described above in each layer. The form of the film used to form the base material layer 6 may be an unstretched film or a uniaxially or biaxially stretched film. From the viewpoint of improving the mechanical strength, the film is preferably uniaxially or biaxially stretched.

The total light transmittance of the substrate layer 6 is preferably 85% or more, more preferably 90% or more. By doing so, the package consisting of the cover tape and the carrier tape can be provided with transparency to the extent that it is possible to inspect whether or not the electronic components are correctly accommodated in the pockets of the carrier tape. . In other words, by setting the total light transmittance of the base material layer to the above lower limit or more, the electronic component housed inside the package consisting of the cover tape and the carrier tape can be visually confirmed from the outside of the package. It becomes possible to The total light transmittance of the substrate layer can be measured according to JIS K7105 (1981).

The thickness of the base material layer 6 is preferably 10 μm to 25 μm, more preferably 12 μm to 25 μm, from the viewpoint of improving adhesion to the carrier tape to be adhered.

[Antistatic layer]
In the cover tape 10 according to the present embodiment, an antistatic layer may be provided on the surface of the base material layer 6 opposite to the surface on which the intermediate layer 4 and the sealant layer 2 are provided. As described above, the surface of the antistatic layer may come into contact with the bottom surface of the carrier tape when the electronic component is housed in the package consisting of the carrier tape and the cover tape and transported.

Examples of materials for forming the antistatic layer include materials containing ester compounds. Materials for forming the antistatic layer are described below.

The material that forms the antistatic layer has a higher static charge than the material that forms the object that comes into contact with the surface of the antistatic layer when the electronic component is accommodated and transported, such as the material that forms the bottom surface of the carrier tape. It preferably includes a "positive compound" located on the positive side in the row and a "negative compound" located on the negative side in the charging row compared to the material forming the object. By doing so, it is possible to suppress the generation of static electricity due to friction when the surface of the antistatic layer comes into contact with an object. The reason for this is that when the surface of the antistatic layer contacts an object, the positive compound contained in the material forming the antistatic layer is positively charged, while the negative compound is negatively charged. This is because it can be electrically neutralized in the antistatic layer.

Examples of the above-described positive compound include polystyrene and the like, for example, materials that form objects that come into contact with the surface of the antistatic layer when storing and transporting electronic components, such as materials that form the bottom surface of the carrier tape. Since there are many cases, it is preferable to contain an aziridinyl compound and its ring-opening compound. Such aziridinyl compounds generally refer to compounds having an aziridinyl group, and specific examples include N,N'-hexamethylene-1,6-bis(1-aziridicarboxamide), N,N'- diphenylmethane-4,4'-bis(1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate), N,N'-toluene-2,4-bis(1-aziridinecarboxamide) ), triethylene melamine, trimethylolpropane-tri-β(2-methylaziridine) propionate, bisisophthaloyl-1-2-methylaziridine, tri-1-aziridinylphosphine oxide, tris-1-2-methyl aziridine phosphine oxide and the like. As the aziridinyl compound, commercially available products such as Chemitite PZ-33 and DZ-22E manufactured by Nippon Shokubai Co., Ltd. can also be used. The ring-opened compound of the aziridinyl compound refers to a compound in which the aziridinyl group in the aziridinyl compound is ring-opened.

The content of the positive compound described above is preferably 0.2% by mass or more and 98% by mass or less, and 0.5% by mass or more and 90% by mass or less, relative to the total amount of the material forming the antistatic layer. and more preferred. By doing so, the physical strength of the coating film is increased and the antistatic agent is resistant to slipping off due to contact.

Examples of the above-described negative compounds include polystyrene and the like, for example, the material forming the bottom surface of the carrier tape, and the like. Since there are many cases, it is preferable to contain an ester compound. Such an ester compound refers to a compound formed by a dehydration reaction of an organic acid or an inorganic acid and an alcohol, and specific examples thereof include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and derivatives thereof. etc.

The content of the negative compound described above is preferably 0.2% by mass or more and 98% by mass or more, and 0.5% by mass or more and 90% by mass or less, relative to the total amount of the material forming the antistatic layer. and more preferred. By doing so, the physical strength of the coating film is increased and the antistatic agent is resistant to slipping off due to contact.

The material forming the antistatic layer preferably contains a conductive polymer from the viewpoint of reducing the surface resistance value of the antistatic layer and suppressing the generation of static electricity due to friction. Specific examples of such conductive polymers include polyaniline, polypyrrole, etc. Among them, polyethylenedioxythiophene/polystyrenesulfonic acid (PEDOT/PSS) compounds can be preferably used.

The material for forming the antistatic layer preferably contains a surfactant from the viewpoint of improving wettability and leveling properties when forming the antistatic layer. Such a surfactant may be a low-molecular-weight surfactant or a high-molecular-weight surfactant, but a surfactant containing a fluorine alkyl structure can be preferably used.

The triboelectric voltage of the antistatic layer is preferably −2200 V or more and 2200 V or less, more preferably −800 V or more and 800 V or less, and most preferably −500 V or more under conditions of 23° C. and 50% RH. 500 V or less. In other words, the absolute value of the frictional electrification voltage of the antistatic layer is preferably 2200 V or less, more preferably 800 V or less, and most preferably 500 V or less under conditions of 23° C. and 50% RH. be. By doing so, it is possible to avoid electrostatic damage to the electronic parts or troubles during board mounting due to static electricity generated by the contact between the bottom surface of the carrier tape and the surface of the cover tape due to vibrations when the electronic parts are conveyed. It is possible to suppress the occurrence of the inconvenience of causing

[Other layers]
The cover tape 10 according to this embodiment may be provided with arbitrary layers other than the sealant layer 2, the intermediate layer 4, and the base layer 6. FIG.
The cover tape 10 according to this embodiment may have an adhesive layer between the base layer 4 and the intermediate layer 4 or between the intermediate layer and the sealant layer 2 . By doing so, the mechanical strength of the cover tape can be improved.

Resin is included in the material forming the adhesive layer described above. Specific examples of such resins include urethane-based dry laminate adhesive resins and anchor coat adhesive resins. can be used.

In the cover tape 10 of the present embodiment having the layer structure as described above, the thickness of the sealant layer 2 is 0.15 μm to 0.5 μm, preferably 0.20 μm, from the viewpoint of the balance between the surface resistance value and the peel strength. 0.5 μm, and the ratio b/a of the thickness b (μm) of the intermediate layer 4 to the thickness a (μm) of the sealant layer 2 can be 60-300, preferably 60-250.

The thickness of the base material layer 6 is 10 μm to 25 μm, more preferably 12 μm to 25 μm, and the ratio of the thickness b (μm) of the intermediate layer 4 to the thickness a (μm) of the sealant layer 2 is b/a is x, the ratio x/c of the thickness c (μm) of the base layer 6 to x can be 3-30, preferably 4-20. Thereby, the balance between the surface resistance value and the peel strength is excellent.

<Electronic component package>
As shown in FIG. 2, the electronic component package 100 of this embodiment includes:
a carrier tape 20 containing electronic components;
Equipped with the electronic component packaging cover tape 10 of the present embodiment,
A sealant layer 2 is adhered to the carrier tape 20 so as to seal the electronic component.

A method of using the cover tape 10 will be specifically described with reference to FIG.
As shown in FIG. 2, the cover tape 10 is used as a cover material for a carrier tape 20 in which concave pockets 21 are continuously provided to match the shape of electronic components. Specifically, the cover tape 10 is adhered (for example, heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20 .

Specifically, the electronic component packaging cover tape 10 of the present embodiment can be heat-sealed to the surface of the polystyrene carrier tape 20 containing the electronic components by the following method.
(Heat sealing method)
・Equipment: VS-120 (taping machine)
・Iron shape when sealing: blade width 0.4 mm / blade length 32 mm
・Seal temperature: 180°C
・Sealing time: 0.1s
・Seal pressure: 1 kg

Then, as shown in FIG. 2, the electronic component packaging cover tape 10 is adhered to the carrier tape 20 via two strip-shaped heat-sealing surfaces 31 and 32 formed in the longitudinal direction so as to sandwich the electronic component. . The total value of the width A and the width B of the two strip-shaped heat-sealing surfaces 31 and 32 can be 1.0 mm to 1.6 mm, preferably 1.2 to 1.5 mm.
Since the cover tape 10 for packaging electronic components of the present embodiment can ensure a bonding area with the carrier tape 20 , it can exhibit more stable peel strength when peeled from the carrier tape 20 .

In practice, electronic component package 100 is produced in the following procedure at the manufacturing site of electronic devices. First, electronic components are accommodated in the pocket 21 of the carrier tape 20 . Next, the cover tape 10 is adhered to the surface of the carrier tape 20 via the sealant layer 2 so as to cover the entire opening of the pocket 21 of the carrier tape 20, so that the electronic component is hermetically housed in the package 100. You can get a structure that As described in the background art section above, a structure containing such electronic components is surface-mounted on an electronic circuit board or the like while the package 100 is wound around a reel made of paper or plastic. transported to the area. When the electronic component is transported with the package 100 wound on the reel described above, the bottom surface 20a of the carrier tape 20 is in contact (friction) with the surface 10a of the cover tape 10 .

The width of the cover tape 10 according to this embodiment is preferably 1 mm or more and 100 mm or less, more preferably 2 mm or more and 80 mm or less, and most preferably 2 mm or more and 50 mm or less.

Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can be employed within the scope that does not impair the effects of the present invention.

EXAMPLES The present invention will be described in more detail below with reference to Examples, but the present invention is not limited to these.

<Base material>
・Polyethylene terephthalate: “FE2001 12 μm, 25 μm, 50 μm” manufactured by Futamura Chemical Co., Ltd.
<Middle layer>
・ Intermediate layer 1: Low-density polyethylene (LDPE): Sumitomo Chemical Co., Ltd., "Sumikasen L705", JIS 7215-compliant hardness (durometer D) at the film thickness shown in Table 1: 52
· Intermediate layer 2: Linear low-density polyethylene: manufactured by Tosoh Corporation, "Lumitac 43-1", JIS 7215-compliant hardness (durometer D) at the film thickness shown in Table 1: 45
・ Intermediate layer 3: Ethylene-α-olefin copolymer: "Excellen VL700" manufactured by Sumitomo Chemical Co., Ltd. Hardness (durometer D) according to JIS 7215 at the film thickness shown in Table 1: 43
・ Intermediate layer 4: Ethylene-α-olefin copolymer: "Excellen VL731" manufactured by Sumitomo Chemical Co., Ltd. Hardness (durometer D) according to JIS 7215 at the film thickness shown in Table 1: 37
· Intermediate layer 5: Ethylene-propylene-hexene copolymer: "KC452T" manufactured by Japan Polyethylene Co., Ltd. Hardness (durometer D) according to JIS 7215 at the film thickness shown in Table 1: 35
· Intermediate layer 6: low density polyethylene: manufactured by Tosoh Corporation, "Petrothene 205", hardness (durometer D) in accordance with JIS 7215 at the film thickness shown in Table 1: 59
· Intermediate layer 7: ethylene / α-olefin random copolymer: "KS340T" manufactured by Japan Polyethylene Co., Ltd. Hardness (durometer D) according to JIS 7215 at the film thickness shown in Table 1: 30
<Sealant layer>
・ Poly (meth) acrylic acid derivative: “A450A” manufactured by Dainippon Ink Co., Ltd.
・Antistatic agent (tin oxide): "T-1" manufactured by Mitsubishi Materials Corporation

(Example 1: Production of cover tape)
It was manufactured according to the following procedure.
(1) As a substrate layer, a 25 μm thick biaxially stretched polyethylene terephthalate film shown in the table was prepared.
(2) The intermediate layer (thickness: 40 μm).
(3) After subjecting the exposed surface of the intermediate layer to corona treatment, 60% by weight of an antistatic agent and 40% by weight of an acrylic sealant resin (A450A, manufactured by DIC) were applied by gravure coating, dried, and dried to 0.00%. A 5 μm layer of sealant was applied.

(Examples 2 to 12, Comparative Examples 1 to 7)
A cover tape was produced in the same manner as in Example 1, except that the thicknesses of the resin constituting the intermediate layer, the substrate layer, the intermediate layer, and the sealant layer were changed as shown in Table-1.

The obtained cover tape was evaluated by the following methods.
(Measurement of surface resistance)
The surface resistance value on the sealant layer side was measured at 23° C. and 50 RH % according to JIS K6911 (1995). The unit is Ω.
The surface resistance value was evaluated according to the following criteria. The evaluation results are shown in Table-1.
(standard)
◎: Less than 10 ⁹ Ω level ○: 10 ⁹ Ω level or more, 10 ¹⁰ Ω level or less ×: More than 10 ¹⁰ Ω level

(Measurement of peel strength)
Each of the cover tapes obtained in Examples and Comparative Examples was cut to a width of 5.5 mm.
The cut cover tape was heat-sealed to an 8 mm wide sheet of "CEL-E980A" manufactured by Sumitomo Bakelite Co., Ltd. under the following conditions. This gave a composite for testing.
・Equipment: TWA-6621 (taping machine)
・Iron shape when sealing: blade width 0.3 mm / blade length 54 mm
・Seal temperature: 160°C
・Sealing time: 0.05s
・Seal pressure: 5 kg
Using the obtained composite, the peel strength between the cover tape and the carrier tape was measured under the following conditions.
・ Peeling device: 856VS (manufactured by General Production Devices)
・Peeling speed: 300mm/min
・ Peeling angle: 180°
・Standard: JIS K 0806-3
The peel strength was evaluated according to the following criteria. The evaluation results are shown in Table-1.
(standard)
◎: more than 50 gf
○: 40 gf or more, 50 gf or less ×: less than 40 gf

(Measurement of seal width)
Each of the cover tapes obtained in Examples and Comparative Examples was cut to a width of 5.5 mm.
The cut cover tape was heat-sealed to an 8 mm wide sheet of "CEL-E980A" manufactured by Sumitomo Bakelite Co., Ltd. under the following conditions. This gave a composite for testing.
・Equipment: VS-120 (taping machine)
・Iron shape when sealing: blade width 0.4 mm / blade length 32 mm
・Seal temperature: 180°C
・Sealing time: 0.1s
・Seal pressure: 1 kg
Using the obtained composite, the total value of widths A and B where the cover tape and carrier tape are adhered was measured under the following conditions.
・Microscope: VHX-6000 (manufactured by Keyence Corporation)

From the results shown in Table 1, the thickness of the intermediate layer 4 is within a predetermined range, and the hardness (durometer D) according to JIS7215 and the ratio b/a of the thickness b of the intermediate layer to the thickness a of the sealant layer is within a predetermined range, the cover tapes for electronic component packaging of Examples exhibit stable peel strength and low surface resistance compared to Comparative Examples that do not satisfy even one of these, and both peel strength and surface resistance was found to be well-balanced.

2 Sealant layer 4 Intermediate layer 6 Base layer 10 Electronic component packaging cover tape 10a Surface 20 Carrier tape 20a Bottom surface 21 Pockets 31, 32 Strip-shaped heat-sealed surfaces A, B Width 100 Electronic component package

Claims (7)

A cover tape for packaging electronic parts comprising a sealant layer, an intermediate layer, and a base layer in this order, the intermediate layer being in contact with the sealant layer, and used for sealing the electronic parts with the sealant layer. hand,
The intermediate layer contains polyethylene, has a thickness of 30 to 60 μm, and has a hardness (durometer D) of 35 to 52 according to JIS7215,
Electronic component packaging, wherein the thickness of the sealant layer is 0.20 to 0.5 μm, and the ratio b/a of the thickness b (μm) of the intermediate layer to the thickness a (μm) of the sealant layer is 60 to 300 cover tape. When the thickness of the base layer is 10 to 25 μm, and the ratio b/a of the thickness b (μm) of the intermediate layer to the thickness a (μm) of the sealant layer is x, the thickness of the base layer 2. The cover tape for packaging electronic components according to claim 1, wherein the ratio x/c to c (μm) is 3-30. The cover tape for packaging electronic components according to claim 1 or 2, wherein the sealant layer contains an acrylic resin. 4. The cover tape for packaging electronic parts according to claim 1, wherein the sealant layer has a surface resistance of less than 10 ¹⁰ Ω at 23° C. and 50 RH%. a carrier tape containing electronic components;
Equipped with the electronic component packaging cover tape according to any one of claims 1 to 4,
An electronic component package, wherein the sealant layer is adhered to the carrier tape so as to seal the electronic component. The sealant layer of the electronic component packaging cover tape is adhered to the carrier tape via two strip-shaped heat-sealing surfaces formed in the longitudinal direction so as to sandwich the electronic component,
6. The electronic component package according to claim 5, wherein the total width of the two band-shaped heat-sealed surfaces is 1.0 mm to 1.6 mm. The sealant layer of the electronic component packaging cover tape according to any one of claims 1 to 4 is heat-sealed by the following method while facing the surface of the polystyrene carrier tape containing the electronic component, and the electronic component A step of adhering the electronic component packaging cover tape to the carrier tape via two strip-shaped heat-sealing surfaces formed in the longitudinal direction so as to sandwich the component,
A method for manufacturing an electronic component package, wherein the total width of the two band-shaped heat-sealed surfaces is 1.0 mm to 1.6 mm.
(Heat sealing method)
・Equipment: VS-120 (taping machine)
・Iron shape when sealing: blade width 0.4 mm / blade length 32 mm
・Seal temperature: 180°C
・Sealing time: 0.1s
・Seal pressure: 1 kg

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