JP2017013801A - Cover tape for packaging electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cover tape for packaging electronic parts having excellent balance in an attachment property and detachment property onto a carrier tape and an excellent antistatic property on an attachment surface with the carrier tape.SOLUTION: There is provided a cover tape for packaging electronic parts, comprising a substrate layer 1 and a sealant layer 2 arranged on one surface side of the substrate layer 1. Onto a side surface of the substrate layer 1 of one of the cover tape for packaging electronic parts opposite to the surface onto which the sealant layer 2 is arranged, a surface of the sealant layer 2 of another cover tape for packaging electronic parts is superposed. When the one of the cover tape for packaging electronic parts and another cover tape for packaging electronic parts are used and a friction test is carried out at a speed of 100 mm/min under condition where 200 g of load is applied according to JIS K7125, dynamic coefficient friction is 0.1 or more and 1.5 or less on the surface of the substrate layer 1 of the one of the cover tape for packaging electronic parts opposite to the surface onto which the sealant layer 2 is arranged.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cover tape for packaging electronic parts.

  Conventionally, electronic parts such as transistors, diodes, capacitors, piezoelectric element registers, etc. have been formed on a carrier tape in which pockets capable of accommodating the electronic parts are continuously formed at the manufacturing site of electronic equipment, and the carrier tape. After being sealed in a package consisting of a cover tape to be sealed and heat-sealed, it is transported to a work area for surface mounting on an electronic circuit board or the like in a state of being wound on a paper or plastic reel. Yes. And after peeling the cover tape of the said package in the working area mentioned above, this electronic component is taken out from the said pocket formed in the carrier tape, and is surface-mounted on an electronic circuit board etc. The electronic components are required to be further miniaturized and highly mounted with recent miniaturization of electronic devices. Therefore, recent electronic components tend to be more susceptible to static electricity than ever.

  In view of these circumstances, in recent years, it has been required to improve various characteristics described later for cover tapes used for transporting electronic components. First, the characteristic required for the cover tape is a balance between the adhesiveness to the carrier tape and the peelability that can prevent the generation of static electricity when peeling from the carrier tape. Secondly, the characteristic required for the cover tape is transparency necessary to inspect the electronic component housed in the package. Third, the characteristics required for the cover tape are generated by static electricity generated by friction between the cover tape and electronic components during transportation, static electricity generated when the cover tape is peeled off from the carrier tape, and dust and contents attached. The antistatic property is necessary to the extent that it is possible to suppress the failure (electrostatic breakdown) of an electronic component housed in the package due to static electricity. In particular, with regard to the technology that improves the antistatic property of the cover tape, the effects of static electricity generated by friction between the cover tape and the electronic parts during transportation and static electricity generated when the cover tape is peeled off from the carrier tape are suppressed. In view of this, various studies have been made so far.

  For example, Patent Document 1 discloses that a sealant layer is provided on a base material layer in order to suppress charge generated during peeling from a carrier tape, and the sealant layer includes a polyolefin resin and a polyether / polyolefin copolymer. A cover tape including is disclosed.

  Patent Document 2 discloses a cover tape in which the surface resistance value of the surface of the sealant layer is controlled so as to satisfy a specific condition in order to suppress charging generated by friction between the cover tape and the electronic component.

JP 2012-214252 A JP 2012-30897 A

As described above in the section of the background art, various studies have been made on improving the above-described three characteristics even in the conventional cover tape. However, in recent years, the technical level required for the viewpoint of countermeasures against static electricity of cover tapes is increasing. The present inventor has found the following problems regarding the conventional cover tape.
Specifically, the inventor removes the carrier tape and the cover tape when the cover tape to be sealed on the carrier tape is unwound, or when the package containing the electronic components is transported while being wound on the reel. The static electricity generated by the friction on the bonded surface, that is, the surface of the cover tape opposite to the surface of the sealant layer will cause the electronic components contained in the package to fail or cause problems such as sticking when mounting the board. I found out that it might cause. From this, the present inventor has found that there is room for improvement in terms of countermeasures against static electricity on the surface opposite to the surface of the sealant layer in the conventional cover tape.

  Therefore, the present invention provides a cover tape for packaging an electronic component that has an excellent antistatic property on an adhesive surface with a carrier tape, as well as a balance between adhesiveness and peelability to the carrier tape.

  As a result of intensive studies to achieve the above-mentioned problems, the present inventor has obtained a cover tape having a base material layer and a sealant layer provided on one surface side of the base material layer. The sealant layer in the base material layer measured when the surface of the sealant layer of the other cover tape was superimposed on the surface opposite to the surface on which the sealant layer was provided and the friction test was performed was provided. The present invention was completed by obtaining the knowledge that the scale of the dynamic friction coefficient of the surface opposite to the surface is effective as a design guideline for improving the antistatic property on the adhesive surface to the carrier tape.

According to the present invention, a base material layer;
A sealant layer provided on one surface side of the base material layer, and an electronic component packaging cover tape comprising:
The surface of the sealant layer of another electronic component packaging cover tape is overlaid on the surface of the base layer of the electronic component packaging cover tape opposite to the surface on which the sealant layer is provided. In addition, according to JIS K7125, a friction test is performed at a speed of 100 mm / min in accordance with JIS K7125 using the one electronic component packaging cover tape and the other electronic component packaging cover tape. When carried out, the dynamic friction coefficient of the surface opposite to the surface provided with the sealant layer in the base material layer of the one electronic component packaging cover tape is 0.1 or more and 1.5 or less, A cover tape for packaging electronic components is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the cover tape for electronic component packaging excellent in the antistatic property in the adhesive surface with a carrier tape can be provided with the balance of the adhesiveness with respect to a carrier tape, and peelability.

It is a schematic sectional drawing which shows an example of the cover tape for electronic component packaging which concerns on this embodiment. It is a figure which shows an example of the state which sealed the cover tape for electronic component packaging which concerns on this embodiment to the carrier tape.

FIG. 1 is a schematic cross-sectional view showing an example of a cover tape for packaging electronic components according to the present embodiment.
As shown in FIG. 1, an electronic component packaging cover tape 10 (hereinafter also referred to as “cover tape”) according to the present embodiment is provided on the base layer 1 and one surface side of the base layer 1. And a sealant layer 2. And this cover tape 10 is the surface of the sealant layer 2 of the other said cover tape 10 with respect to the surface on the opposite side to the surface in which the base material layer 1 of the said one cover tape 10 was provided with the sealant layer 2. And a friction test (hereinafter referred to as this embodiment) at a speed of 100 mm / min with a load of 200 g in accordance with JIS K7125 using one cover tape 10 and another cover tape 10. The friction coefficient of the surface opposite to the surface on which the sealant layer 2 is provided in the base material layer 1 of the cover tape 10 is 0.1 to 1.5. It is as follows. By carrying out like this, the cover tape excellent in the antistatic property accompanying peeling of a carrier tape is realizable with the balance of the adhesiveness with respect to a carrier tape, and peelability.

First, the usage method of a cover tape is demonstrated with reference to FIG.
As shown in FIG. 2, the cover tape 10 is used as a cover material for a carrier tape 20 in which concave pockets 21 are continuously provided in accordance with the shape of the electronic component. Specifically, the cover tape 10 is used by adhering (for example, heat sealing) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. In the following description, a structure obtained by bonding the cover tape 10 and the carrier tape 20 will be referred to as a package 100 for an electronic component.

  Actually, at the manufacturing site of electronic equipment, the package 100 for electronic parts is produced by the following procedure. First, an electronic component is accommodated in the pocket 21 of the carrier tape 20. Next, the cover tape 10 is adhered to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20, thereby obtaining a structure in which the electronic component is hermetically housed in the package 100. Can do. As described in the background section above, the structure including such electronic components is surface-mounted on an electronic circuit board or the like in a state where the package 100 is wound around a paper or plastic reel. It is transported to the area. When the electronic component is conveyed with the package 100 wound around the reel described above, the bottom surface 20 a of the carrier tape 20 is in contact (friction) with the surface 10 a of the cover tape 10.

  The present inventor, when producing a structure containing an electronic component produced using a conventional cover tape, when the surface of the sealant layer of the cover tape is separated from the opposite surface, or the conventional cover tape When transporting a structure that contains electronic parts manufactured using a roll wound around a reel, the surface where the carrier tape and the cover tape are bonded by vibration during transport, that is, the sealant in the cover tape It has been found that the static electricity generated by the friction on the surface opposite to the surface of the layer may cause the electronic components contained in the package to fail or cause problems such as sticking when the substrate is mounted. For this reason, the conventional cover tape has room for improvement in terms of countermeasures against static electricity on the surface opposite to the surface of the sealant layer.

  In particular, most conventional cover tapes have a large coefficient of dynamic friction between the surface of the base material layer opposite to the surface on which the sealant layer is provided and the surface of the sealant layer. Specifically, in the conventional cover tape, the dynamic friction coefficient of the surface of the base material layer opposite to the surface on which the sealant layer is provided has a value greater than 1.5. Therefore, the present inventor has found that in the conventional cover tape, the surface of the base material layer opposite to the surface on which the sealant layer is provided and the surface of the sealant layer are brought into contact and rubbed to generate static electricity. The design guideline for reducing the electric charges derived from the above has been intensively studied, and the design guideline for the cover tape 10 has been found.

  The cover tape 10 according to the present embodiment is opposite to the surface of the base material layer 1 that is in contact with the sealant layer 2 when the friction test according to the present embodiment is performed as described above. The dynamic friction coefficient of the side surface is not less than 0.1 and not more than 1.5. When the value of the dynamic friction coefficient is within the above numerical range, static electricity generated when the bottom surface of the carrier tape and the surface of the cover tape 10 come into contact with each other due to vibration when the electronic component is conveyed is generated between the carrier tape and the cover tape 10. It becomes possible to reduce the influence which it has on the electronic component accommodated in the package body which consists of. For this reason, the electronic component is electrostatically damaged due to the vibration generated when the electronic component is conveyed and the bottom surface of the carrier tape and the surface of the cover tape 10 come into contact with each other, or troubles such as sticking when mounting the substrate. It is possible to suppress the inconvenience of causing

  In the cover tape 10 according to the present embodiment, the value of the dynamic friction coefficient of the surface of the base material layer 1 opposite to the surface provided with the sealant layer 2 is 0.1 or more and 1.5 or less, preferably Is from 0.15 to 1.45, more preferably from 0.2 to 1.4. When the value of the dynamic friction coefficient is within the above numerical range, the antistatic property accompanying peeling of the carrier tape can be further improved. In addition, most of the conventional typical cover tapes have a value of a dynamic friction coefficient of about 2.0 on the surface opposite to the surface on which the sealant layer 2 of the base material layer is provided. In particular, in the cover tape 10 according to this embodiment, when the value of the dynamic friction coefficient on the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is equal to or less than the upper limit value, static electricity is generated due to friction. Even when this occurs, the cover tape 10 having excellent discharge characteristics can be realized. Further, when the value of the dynamic friction coefficient of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is equal to or more than the lower limit value, the cover tape 10 and the electronic component are rubbed during conveyance. Thus, it is possible to realize the cover tape 10 having excellent discharge characteristics such as static electricity generated by the above, static electricity generated when the cover tape 10 is peeled off from the carrier tape, and dust generated from the attached dust and contents.

  The total light transmittance of the cover tape 10 according to the present embodiment is preferably 80% or more, and more preferably 85% or more. When the value of the total light transmittance of the cover tape 10 is within the above numerical range, whether or not the electronic component is correctly accommodated in the pocket of the carrier tape in the package composed of the cover tape 10 and the carrier tape is determined. Necessary transparency can be imparted to such an extent that it can be inspected. In other words, by setting the total light transmittance of the base material layer 1 to be equal to or higher than the above lower limit value, the electronic component accommodated in the package body composed of the cover tape 10 and the carrier tape is visually recognized from the outside of the package body. Can be confirmed. The total light transmittance of the cover tape 10 can be measured according to JIS K7105 (1981).

  The width of the cover tape 10 according to the present embodiment is preferably 2 mm or more and 100 mm or less, more preferably 2 mm or more and 80 mm or less, and most preferably 2 mm or more and 50 mm or less.

  Moreover, the cover tape 10 according to the present embodiment has a surface opposite to the surface on which the sealant layer 2 is provided in the base material layer 1 of the cover tape 10 when the friction test according to the present embodiment is performed. The static friction coefficient is preferably 0.5 or more and 1.7 or less, more preferably 0.55 or more and 1.65 or less, and still more preferably 0.6 or more and 1.6 or less. When the value of the static friction coefficient is within the above numerical range, the antistatic property associated with the peeling of the carrier tape can be further improved. In particular, when the value of the coefficient of static friction of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is equal to or less than the upper limit, the discharge characteristics are excellent even when static electricity is generated due to friction. The cover tape 10 can be realized. Moreover, when the value of the static friction coefficient of the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided is equal to or more than the lower limit value, the cover tape 10 and the electronic component are rubbed during transportation. Thus, it is possible to realize the cover tape 10 having excellent discharge characteristics such as static electricity generated by the above, static electricity generated when the cover tape 10 is peeled off from the carrier tape, and static electricity generated from attached dust and contents.

  Hereinafter, the configuration of each layer forming the cover tape 10 according to the present embodiment will be described in detail.

<Base material layer>
When the cover tape 10 is produced by laminating the sealant layer 2 or the like on the base material layer 1 when the material constituting the base material layer 1 is bonded, the cover tape 10 Mechanical strength enough to withstand the stress applied from the outside during use, and heat resistance enough to withstand the thermal history applied when the cover tape 10 is bonded to the carrier tape. Anything is acceptable. Moreover, the form of the material which comprises the base material layer 1 is although it does not specifically limit, From a viewpoint with which a process is easy, it is preferable that it was processed into the film form.

  Specific examples of the material constituting the base material layer 1 include polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, polycarbonate resins, ABS resins, and the like. It is done. Among these, from the viewpoint of improving the mechanical strength of the cover tape 10, a polyester resin is preferable, and polyethylene terephthalate is more preferable. Further, nylon 6 may be used as a material constituting the base material layer 1 from the viewpoint of improving the mechanical strength and flexibility of the cover tape 10. In addition, the material constituting the base material layer 1 may contain a lubricant.

  The base material layer 1 may be formed by a single layer film including the above-described material, or may be formed using a multilayer film including the above-described material in each layer. Moreover, as a form of the film used in order to form the base material layer 1, an unstretched film may be sufficient, and the film extended | stretched to the uniaxial direction or the biaxial direction may be sufficient. From the viewpoint of improving mechanical strength, a film stretched in a uniaxial direction or a biaxial direction is preferable.

  The thickness of the base material layer 1 is preferably 9 μm or more and 25 μm or less, and more preferably 9 μm or more and 16 μm or less. When the thickness of the base material layer 1 is less than or equal to the above upper limit value, the cover tape 10 is not too rigid, and even if a torsional stress is applied to the carrier tape after sealing, Following the deformation of the carrier tape, it can be prevented from peeling. In addition, when the thickness of the base material layer 1 is equal to or more than the above upper limit value, the mechanical strength of the cover tape 10 can be improved, and thus the cover tape 10 is peeled off from the carrier tape at a high speed. However, it is possible to prevent the cover tape 10 from being broken.

  The total light transmittance of the base material layer 1 is preferably 80% or more, and more preferably 85% or more. When the value of the total light transmittance of the base material layer 1 is within the above numerical range, whether or not the electronic component is correctly accommodated in the pocket of the carrier tape in the package including the cover tape 10 and the carrier tape. The necessary transparency can be imparted to such an extent that can be inspected. In other words, by setting the total light transmittance of the base material layer 1 to be equal to or higher than the above lower limit value, the electronic component accommodated in the package body composed of the cover tape 10 and the carrier tape is visually recognized from the outside of the package body. Can be confirmed. In addition, the total light transmittance of the base material layer 1 can be measured according to JIS K7105 (1981).

The surface resistance value on the surface opposite to the surface on which the sealant layer 2 is provided in the base material layer 1 is a condition of 23 ° C. and 30% RH from the viewpoint of efficiently discharging the static electricity generated by various factors to the outside. And preferably 1 × 10 ⁷ Ω / □ or more and 5 × 10 ¹³ Ω / □ or less, and more preferably 1 × 10 ⁷ Ω / □ or more from the viewpoint of improving the antistatic property of the cover tape 10. 1 × 10 ¹⁰ Ω / □ or less, and most preferably 2 × 10 ⁷ Ω / □ or more and 5 × 10 ⁹ Ω / □ or less.

<Sealant layer>
When the cover tape 10 is used by the above-described method, the surface of the sealant layer 2 in the cover tape 10 according to the present embodiment comes into contact with the carrier tape.

  As a material constituting the sealant layer 2, a material including a thermoplastic resin such as an acrylic resin or a polyester resin and an antistatic agent can be used. Specific examples of such antistatic agents are selected from the group consisting of metal fillers such as tin oxide, zinc oxide, titanium oxide, and smectite, surfactants such as polyoxyethylene alkylamine, quaternary ammonium, and alkyl sulfonate, and carbon. Or a mixture thereof. In addition, as said carbon, the filler of various shapes consisting of carbon, such as carbon black, white carbon, carbon fiber, a carbon tube, can be used.

  The material constituting the sealant layer 2 includes oxide particles mainly composed of silicon, magnesium or calcium, inorganic particles such as silica and talc, polyethylene particles, and polyacrylate particles from the viewpoint of preventing blocking that occurs during transportation. In addition, one kind selected from the group consisting of organic particles such as polystyrene particles or an alloy thereof may be contained.

  The thickness of the sealant layer 2 is preferably 1 μm or more and 15 μm or less, more preferably 1 μm or more and 10 μm or less, and most preferably, from the viewpoint of improving the balance between adhesion to the carrier tape and peelability. 1 μm or more and 5 μm or less.

The surface resistance value of the sealant layer 2 should be 10 ⁴ Ω / □ or more and 10 ¹² Ω / □ or less under the conditions of 23 ° C. and 50% RH from the viewpoint of efficiently discharging static electricity generated by various factors to the outside. Is preferred.

<Antistatic layer>
The cover tape 10 according to the present embodiment is provided with the sealant layer 2 in the base material layer 1 from the viewpoint of reducing the amount of charge generated when the carrier tape is peeled off when the cover tape 10 is used by the method described above. It is preferable to have the antistatic layer 3 on the surface opposite to the formed surface (see FIG. 1). The surface of the antistatic layer 3 has a possibility of coming into contact with the bottom surface of the carrier tape when the electronic component is accommodated and transported in a package made of the carrier tape and the cover tape 10.
Hereinafter, the cover tape 10 according to the present embodiment will be described with an example in which the antistatic layer 3 is provided on the surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided.

  The material for forming the antistatic layer 3 is preferably a material that can be dispersed or dissolved in a diluent solvent, and examples thereof include acrylic compounds, ester compounds, vinyl alcohol compounds, and polyether compounds. Among them, it is preferable to blend a material containing an ester compound as a binder resin from the viewpoint of friction resistance and transparency. Such an ester compound refers to a compound formed by combining an organic acid or inorganic acid and an alcohol by a dehydration reaction. Specific examples thereof include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and derivatives thereof. Etc.

  The content of the above-described material containing the ester compound (binder resin) is preferably 0.2% by mass or more and 98% by mass or less, and 0.5% by mass with respect to the total amount of the material forming the antistatic layer 3. More preferably, it is 90 mass% or less. By doing so, the physical strength of the coating film is increased and the antistatic agent slips off due to contact.

  The material for forming the antistatic layer 3 includes a low molecular surfactant type, a high molecular surfactant type, a conductive polymer type, a metal filler, and the like, and the surface resistance value of the antistatic layer 3 is lowered to cause friction. From the viewpoint of suppressing the generation of static electricity, the conductive polymer type is particularly preferable. In particular, among the conductive polymer types, a polyethylenedioxythiophene / polyanion poly (styrenesulfonate) -based (PEDOT / PSS) conductive polymer is preferable in order to improve the antistatic performance.

  The material for forming the antistatic layer 3 preferably contains a surfactant from the viewpoint of improving the wettability and leveling properties when the antistatic layer 3 is formed. Such a surfactant may be a low molecular surfactant or a high molecular surfactant, but a surfactant having a fluorine alkyl structure can be suitably used.

  Further, the material for forming the antistatic layer 3 is highly polar from the viewpoint of more effectively reducing the amount of charge generated along with the peeling of the carrier tape when the cover tape 10 is used by the above-described method. It is preferable that an organic solvent having a high boiling point is included as a conductive additive. By doing so, the crystal structure of the antistatic agent is adjusted, and as a result, the surface resistance value of the antistatic layer 3 can be reduced. Examples of the organic solvent having a high polarity and a high boiling point include dimethyl sulfoxide, N-methylpyrrolidone, and ethylene glycol.

The surface resistance value of the antistatic layer 3 is preferably 1 × 10 ⁷ Ω / min under the conditions of 23 ° C. and 30% RH from the viewpoint of more effectively reducing the amount of charge generated when the carrier tape is peeled off. □ or more and 1 × 10 ¹⁰ Ω / □ or less, more preferably 2 × 10 ⁷ Ω / □ or more and 5 × 10 ⁹ Ω / □ or less.

  Further, the material forming the antistatic layer 3 may contain components such as a lubricant and a neutralizing agent as necessary.

<Other layers>
In the cover tape 10 according to this embodiment, an intermediate layer (not shown) may be provided between the base material layer 1 and the sealant layer 2. By doing so, the cushioning property of the entire cover tape 10 can be improved, and the adhesion with the carrier tape to be bonded can be improved.

  Examples of the material forming the intermediate layer include olefin resins, styrene resins, and cyclic olefin resins. Especially, it is preferable that an olefin resin is included from a viewpoint of improving adhesiveness with the carrier tape which is adhesion object.

  The thickness of the intermediate layer is preferably 10 μm or more and 30 μm or less, and more preferably 15 μm or more and 25 μm or less, from the viewpoint of improving the adhesion to the carrier tape to be bonded.

  The cover tape 10 according to this embodiment may be provided with an adhesive layer (not shown) between the base material layer 1 and the sealant layer 2 or between the base material layer 1 and the antistatic layer 3. By doing so, the mechanical strength of the cover tape 10 can be improved.

  Resin is contained in the material which forms the contact bonding layer mentioned above. Specific examples of such resins include urethane-based dry laminate adhesive resins, anchor coat adhesive resins, etc., and generally a combination of a polyester composition such as polyester polyol or polyether polyol and an isocyanate compound. Can be used.

  Next, a material for forming an object that comes into contact with the surface of the antistatic layer 3 when the electronic component is accommodated and transported will be described. As described above, examples of the object include the bottom surface of the carrier tape, etc., but there is a possibility of contact with the surface of the antistatic layer 3 when the electronic component is accommodated and transported or when the electronic component is mounted. It will not be limited if it is. Specific examples of the material forming the object include materials for forming carrier tapes such as polystyrene, polyethylene terephthalate, and polycarbonate, polyethylene, rubber (material processed from natural rubber, synthetic rubber, etc.), and the like. .

Next, a method for manufacturing the cover tape 10 according to this embodiment will be described.
The manufacturing method of the cover tape 10 in this embodiment is different from the conventional manufacturing method, and it is necessary to control the manufacturing conditions mentioned later highly. That is, the sealant layer 2 in the base material layer 1 that has been in contact with the sealant layer 2 when the friction test according to the present embodiment is performed for the first time by a manufacturing method that highly controls various factors related to the following two conditions. It is possible to obtain the cover tape 10 in which the value of the dynamic friction coefficient on the surface opposite to the provided surface satisfies the specific condition described above.
(1) Combination of a resin material forming the base material layer 1 and a material forming the sealant layer 2 (2) Surface state (surface of the base material layer 1 opposite to the surface on which the sealant layer 2 is provided) (Resistance value and composition of the material that forms the surface)

However, the cover tape 10 according to the present embodiment employs various specific manufacturing conditions such as temperature setting of the manufacturing apparatus on the assumption that various factors related to the above two conditions are highly controlled. be able to. In other words, the cover tape 10 in the present embodiment can be manufactured by adopting a known method except for highly controlling the various factors related to the above two conditions. Hereinafter, an example of a method for manufacturing the cover tape 10 will be described on the assumption that various factors related to the above two conditions are highly controlled.
First, the antistatic layer 3 is formed by applying a predetermined material to one surface of the base material layer 1 and drying it. Next, the sealant layer 2 is laminated by extrusion lamination on the surface of the base material layer 1 opposite to the surface on which the antistatic layer 3 is formed. Thus, the cover tape 10 according to the present embodiment can be manufactured. In addition, after forming the sheet | seat of the sealant layer 2 by the extrusion method, you may laminate | stack the sheet | seat obtained on the surface on the opposite side to the surface in which the antistatic layer 3 of the base material layer 1 was formed.

  When forming the above-described intermediate layer, the intermediate layer may be laminated by extrusion lamination on the surface of the base material layer 1 opposite to the surface on which the antistatic layer 3 is formed, After the layer is formed into a sheet by an extrusion method, the obtained sheet may be laminated on the surface of the base material layer 1 opposite to the surface on which the antistatic layer 3 is formed.

  Moreover, what is necessary is just to apply | coat the material of an adhesive layer to the target surface by the conventionally well-known coating method, when forming the adhesive layer mentioned above.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and various structures other than the above are also employable.

  Hereinafter, although an example and a comparative example explain the present invention, the present invention is not limited to these.

  The raw material components used in the preparation of the antistatic layer, sealant layer, and base material layer in each example and each comparative example are shown below.

<Antistatic layer>
(Antistatic agent)
-Conductive polymer containing polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) -based compound (WED-SM, manufactured by Soken Chemical Co., Ltd.)
(Diluted solvent)
・ Diluting solvent: isopropyl alcohol: water = 1: 1
(Neutralizer)
・ Triethylamine (Wako Pure Chemical Industries, Ltd.)
(Surfactant)
-Surfactant: BYK-3440, manufactured by BYK Japan

(Binder resin)
・ Water-soluble polyester resin (manufactured by Kyodo Chemical Co., Ltd., plus coat Z565)
(Conductive aid)
·ethylene glycol

(Lubricant)
・ Lubricant 1: Paraffin wax (AQUACER 539, manufactured by BYK)
・ Lubricant 2: Polyethylene wax (byqua, AQUACER 531)
Lubricant 3: Polypropylene wax (AQUACER 593, manufactured by BYK)
Lubricant 4: Silica (manufactured by Nissan Chemical Industries, IPA-ST, average particle size: 10 μm)
Lubricant 5: silica (Nissan Chemical Co., Ltd., IPA-ST-L, average particle size: 40 μm)
Lubricant 6: Silica (manufactured by JGC Catalysts & Chemicals, Spherica slurry 140, average particle size: 140 μm)

<Sealant layer>
Styrene- (meth) methyl acrylate copolymer (manufactured by Nippon Steel Chemical Co., Ltd., Estyrene MS-600. Hereinafter also referred to as “St-MMA”)
-Ethylene-methyl acrylate copolymer (Mitsui-Dupont Polychemical Co., Ltd., Elvalloy AC 1820. Hereinafter, also referred to as "EMA".)
Polyether / polyolefin copolymer (manufactured by Sanyo Chemical Industries, Pelestat 212; hereinafter also referred to as “PEG-PP”)

<Base material layer>
-Base material layer 1: biaxially stretched polyester film having a thickness of 16 μm (Toyobo Co., Ltd .: E5102)
-Base material layer 2: Biaxially stretched polyester film having a thickness of 16 μm (Toyobo Co., Ltd .: T4100)

<Manufacture of cover tapes according to Examples 1 to 7>
First, a biaxially stretched polyester film (Toyobo Co., Ltd. product: E5102) having a thickness of 16 μm was prepared as a base material layer.

Next, a material for forming the antistatic layer was prepared by the following method. The composition of each reagent is as shown in Table 1.
After adding a diluting solvent to the dispersion containing the antistatic agent, the mixture was stirred for 30 seconds while neutralizing. Next, in order to improve substrate adhesion and dispersion stability, a binder resin, a surfactant and a lubricant were added, followed by stirring for 30 seconds. In this way, a material for forming a liquid antistatic layer was prepared.

Subsequently, the material (liquid form) which forms the obtained antistatic layer was applied to one surface of the base material layer using a gravure coater. Then, the antistatic layer was formed into a film by making it dry at 100 degreeC. The wet amount of the material for forming the antistatic layer was 2 g / m ² . Further, the wet film thickness of the material for forming the antistatic layer applied using a gravure coater was set to 4 μm.

  Next, the sealant layer was laminated | stacked by the extrusion lamination method with respect to the surface on the opposite side to the surface which formed the antistatic layer in the base material layer. As a material for forming such a sealant layer, a resin composition comprising 15 parts by weight of St-MMA, 65 parts by weight of EMA and 20 parts by weight of PEG-PP was used. The thickness of the sealant layer was 5 μm.

The cover tape which concerns on Examples 1-7 was produced by the above method. The width of the obtained cover tape was 8 mm.

<Manufacture of cover tape according to Example 8>
The same method as in Examples 1 to 7 except that a biaxially stretched polyester film (Toyobo Co., Ltd .: T4100) having a thickness of 16 μm was prepared as the base material layer and the antistatic layer was not provided. A cover tape was produced.

<Manufacture of cover tape according to Comparative Example 1>
A cover tape was produced in the same manner as in Examples 1 to 7 except that the antistatic layer was not provided.

<Manufacture of cover tape according to Comparative Example 2>
A cover tape was produced in the same manner as in Examples 1 to 4 except that a mixed solution obtained without adding a lubricant was used as a material for forming the antistatic layer.

  The following evaluations were performed using the cover tapes of Examples and Comparative Examples.

<Evaluation method>
-Dynamic friction coefficient of the surface of the antistatic layer against the sealant layer: The surface of the antistatic layer of one cover tape is overlapped with the surface of the sealant layer of another cover tape, and one cover tape and another cover tape are In accordance with JIS K7125, a friction test was carried out at a speed of 100 mm / min under a load of 200 g, and the dynamic friction coefficient of the surface of the antistatic layer in the one cover tape was measured. The measurement environmental conditions were 23 ° C. and 50% RH.

-Static friction coefficient of the surface of the antistatic layer against the sealant layer: The surface of the antistatic layer of one cover tape is overlapped with the surface of the sealant layer of another cover tape, and one cover tape and another cover tape are In accordance with JIS K7125, a friction test was performed at a speed of 100 mm / min under a load of 200 g, and the static friction coefficient of the surface of the antistatic layer in the one cover tape was measured. The measurement environmental conditions were 23 ° C. and 50% RH.

-Surface resistance value on the surface of the base material layer: The surface resistance value on the surface of the base material layer under the conditions of 23 ° C and 30% RH was measured according to IEC 61340. The unit is Ω / □.

Total light transmittance: The total light transmittance of the cover tape was measured according to JIS K7105 (1981). The unit is%.

  The evaluation results regarding the above evaluation items are shown in Table 1 below together with the composition of the antistatic layer.

  All of the cover tapes of the examples were excellent in antistatic properties accompanying the peeling of the carrier tape, as well as the balance between the adhesiveness to the carrier tape and the peelability. On the other hand, the cover tape of the comparative example did not satisfy the required level particularly in terms of antistatic properties accompanying peeling of the carrier tape.

DESCRIPTION OF SYMBOLS 1 Base material layer 2 Sealant layer 3 Antistatic layer 10 Cover tape for electronic component packaging (cover tape)
10a Cover tape surface (antistatic layer surface)
20 Carrier tape 20a Bottom surface 21 of carrier tape Pocket 100 Package

Claims (6)

A base material layer;
A sealant layer provided on one surface side of the base material layer, and an electronic component packaging cover tape comprising:
The surface of the sealant layer of another electronic component packaging cover tape is overlaid on the surface of the base layer of the electronic component packaging cover tape opposite to the surface on which the sealant layer is provided. In addition, according to JIS K7125, a friction test is performed at a speed of 100 mm / min in accordance with JIS K7125 using the one electronic component packaging cover tape and the other electronic component packaging cover tape. When carried out, the dynamic friction coefficient of the surface opposite to the surface provided with the sealant layer in the base material layer of the one electronic component packaging cover tape is 0.1 or more and 1.5 or less, Cover tape for packaging electronic parts.   The electronic component packaging cover tape according to claim 1, wherein the total light transmittance of the electronic component packaging cover tape is 80% or more.   The cover tape for electronic component packaging of Claim 1 or 2 whose width | variety of the said cover tape for electronic component packaging is 2 mm or more and 100 mm or less. The surface resistance value on the surface opposite to the surface on which the sealant layer is provided in the base material layer measured at 23 ° C. and 30% RH is 1 × 10 ⁷ Ω / □ or more and 5 × 10 ¹³ Ω / □ or less. The cover tape for packaging electronic parts according to any one of claims 1 to 3, wherein   The electronic component packaging cover tape according to any one of claims 1 to 4, further comprising an antistatic layer on a surface opposite to the surface on which the sealant layer is provided in the base material layer.   The electronic component packaging cover tape according to claim 5, wherein the antistatic layer is formed of a material containing an ester compound.

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