JP2001106994A - Cover tape for electronic component carrier and electronic component carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a cover tape for an electronic component carrier capable of preventing the component from adhering at a temperature within the wide range of low to high temperatures and exhibiting moderate adhesive properties to an embossed carrier tape even when the material thereof is either of a plastic and a paper. SOLUTION: This cover tape for the electronic component carrier is equipped with an adhesive layer on a substrate and the adhesive layer comprises an epoxydated styrene-based thermoplastic elastomer as a base polymer. The content of the epoxydated styrene-based thermoplastic elastomer is about 1-99.5 wt.% based on the total base polymer composing the adhesive layer. The adhesive layer may contain a resin imparting adhesiveness in an amount of 2-100 pts.wt. based on 100 pts.wt. of the base polymer. A surface resistivity of the surface of the substrate and the surface of the adhesive layer is, e.g. <=1013 Ω.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component carrier used for transporting chip-type electronic components and the like until they are mounted on a substrate, and a cover tape used for the electronic component carrier.

[0002]

2. Description of the Related Art As a method for transporting chip-type electronic components such as chip fixed resistors and multilayer ceramic capacitors, a taping reel system using an electronic component transport tape (electronic component transport body) is known. In this taping reel system, for example, after embedding a chip-type electronic component in a concave portion of an embossed carrier tape having a concave portion for accommodating an electronic component, a top cover tape is attached to an upper surface of the concave portion, and the electronic component is sealed. , And are wound and transported in a reel shape.
These steps are generally performed using a taping machine. Then, in the manufacturing process (mounting process) of the circuit board or the like at the transfer destination, after the top cover tape is peeled off, the stored chip-type electronic components are automatically sucked by the air nozzle and supplied onto the board. Is the mainstream.

Conventionally, as a cover tape used for such an electronic component carrier, a tape provided with an adhesive layer made of an ethylene-acid copolymer or SBS (styrene-butadiene-styrene block copolymer) on a support has been known. It is used. However, in the conventional cover tape, the electronic components packaged by taping may be used under various environments (temperature -10 to -10).
At a temperature of 60 ° C. and a humidity of 20 to 95% RH), a mounting failure occurs in which the toner adheres or fuses to the tape surface and cannot be picked up by the suction nozzle. Also, in recent years, the embossed carrier tape has partially shifted from a plastic carrier to a paper carrier, and when a conventional cover tape is attached to such a paper carrier, the adhesive strength to the paper carrier is too strong. Therefore, at the time of peeling, fibers (burrs) are generated, interlayer destruction of the backing paper is caused, and a tape break occurs. Furthermore, the miniaturization of electronic components has progressed, and 1 mm × 0.
Since taping is performed on components having a size of 5 mm or less, there is also a problem that electronic components pop out due to static electricity during mounting and running.

[0004]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to prevent parts from adhering in a wide temperature range from a low temperature to a high temperature, and to obtain an embossed carrier tape made of either plastic or paper. An object of the present invention is to provide a cover tape for an electronic component carrier that has a suitable adhesiveness to a carry tape, and an electronic component carrier using the cover tape.

Another object of the present invention is to provide, in addition to the above characteristics,
It is still another object of the present invention to provide a cover tape for an electronic component carrier that can prevent components from adhering to the tape surface due to electrification during peeling, and an electronic component carrier using the cover tape.

[0006]

Means for Solving the Problems The inventors of the present invention have made intensive studies to achieve the above object, and as a result, when a specific thermoplastic elastomer is used as a base polymer of an adhesive layer of a cover tape, electronic components can be used in a wide temperature range. The present invention has been found to be able to prevent the adhesion of the carrier tape and to show an appropriate adhesiveness to the carrier tape regardless of the material of the embossed carrier tape.

That is, the present invention provides a cover tape for an electronic component carrier having an adhesive layer provided on a support, wherein the adhesive layer contains an epoxidized styrene-based thermoplastic elastomer as a base polymer. Provided is a cover tape for a carrier.

In this cover tape, the content of the epoxidized styrene-based thermoplastic elastomer is, for example, 1 to 99.5% by weight of the whole base polymer constituting the adhesive layer. The adhesive layer may contain, for example, about 2 to 100 parts by weight of an adhesion-imparting resin based on 100 parts by weight of the base polymer.

Further, in the cover tape, the surface specific resistance on the support side and the adhesive layer side is, for example, 10 ¹³ Ω or less. Furthermore, the half value (time until the voltage decreases to half of the initial voltage) when the surface on the support side and the surface on the adhesive layer side are charged may be 600 seconds or less. An antistatic layer may be provided outside the support or between the support and the adhesive layer. Further, the support may be composed of a polymer composition containing an epoxidized styrene-based thermoplastic elastomer.

[0010] The present invention is also an electronic component carrier comprising an electronic component accommodating portion for accommodating an electronic component, and a cover tape covering the electronic component accommodating portion. Provided is an electronic component carrier using a component carrier cover tape.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings as necessary. FIG. 1 is a schematic view showing an example of the electronic component carrier of the present invention. In the electronic component carrier shown in FIG. 1, an electronic component housing recess 2 for housing an electronic component 5 is formed at a predetermined interval in a length direction at a substantially central portion in a width direction, and an automatic machine feed hole 3 is formed in a width direction side portion. The embossed carrier tape 1 is formed at a predetermined interval in the length direction of the first embodiment, and an electronic component carrier cover tape 4 for covering the upper surface of the electronic component housing recess 2.

As the material of the embossed carrier tape 1, any material having self-supporting properties may be used. For example, paper such as Japanese paper, crepe paper, synthetic paper, mixed paper, composite paper; polyethylene, polypropylene, polyethylene terephthalate, Plastic films or sheets such as vinyl chloride and cellophane; metal foil and the like can be used. In the present invention, even if the embossed carrier tape 1 is made of paper, the adhesive strength with the cover tape 4 is not too large, and when the cover tape 4 is peeled off, fluffing or interlayer destruction does not occur. The electronic component receiving recess 2 and the automatic machine feed hole 3 can be formed by a known or commonly used method.

FIG. 2 is a sectional view showing an example of the cover tape 4 for an electronic component carrier of FIG. 1 (the cover tape for an electronic component carrier of the present invention). The cover tape 4 includes a support 6 and an adhesive layer 7.

An important feature of the present invention is that the adhesive layer 7 contains an epoxidized styrene-based thermoplastic elastomer as a base polymer. The epoxidized styrene-based thermoplastic elastomer means a polymer in which the double bond of the main chain of the styrene-based thermoplastic elastomer is epoxidized, and a typical example thereof is epoxidized SBS (epoxidized styrene-butadiene-styrene). Block copolymer; ESBS). Epoxidized SBS is commercially available under the trade name “Epofriend” (manufactured by Daicel Chemical Industries, Ltd.).

The content of the epoxidized styrene-based thermoplastic elastomer in the adhesive layer 7 is not particularly limited.
1 to 9 with respect to the entire base polymer constituting the adhesive layer 7
It is about 9.5% by weight, preferably about 8 to 90% by weight, and more preferably about 15 to 50% by weight.

As the base polymer constituting the adhesive layer 7, in addition to the epoxidized styrene-based thermoplastic elastomer, a thermoplastic resin such as an olefin-based resin and a vinyl acetate-based resin, a thermoplastic elastomer, a synthetic rubber, a natural rubber, etc. Elastomers can be used. These polymers can be used in combination of two or more kinds.

As the olefin resin, for example,
Polyolefins such as polyethylene (low-density polyethylene, linear low-density polyethylene, high-density polyethylene, etc.) and polypropylene; ethylene copolymers (eg, ethylene-non-ethylene such as ethylene-acrylic acid copolymer and ethylene-methacrylic acid copolymer) Saturated carboxylic acid copolymer; ionomer; ethylene- (meth) acrylate copolymer such as ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl methacrylate copolymer; ethylene -Vinyl acetate copolymer; ethylene-vinyl alcohol copolymer, etc.); and polypropylene-modified resin.

Examples of the vinyl acetate resin include polyvinyl acetate, vinyl acetate- (meth) acrylate copolymer, vinyl acetate-vinyl ester copolymer, vinyl acetate-maleate copolymer and the like. Can be

As the thermoplastic elastomer, for example,
SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butylene-styrene block copolymer), SEPS (styrene-ethylene-propylene-styrene) Styrene-based thermoplastic elastomers such as block copolymers) and SEP (styrene-ethylene-propylene block copolymers) (styrene-based block copolymers; for example, styrene-based block copolymers having a styrene content of 5% by weight or more); polyurethane-based thermoplastics Elastomers; polyester-based thermoplastic elastomers; and blend-based thermoplastic elastomers such as a polymer blend of polypropylene and EPT (ternary ethylene-propylene rubber).

As synthetic rubbers, IR (isoprene rubber), SBR (styrene-butadiene rubber), BR (butadiene rubber), CR (chloroprene rubber), NBR
(Nitrile rubber), EPR (binary ethylene-propylene rubber), EPT (ternary ethylene-propylene rubber), IIR (butyl rubber), acrylic rubber, urethane rubber, acid-modified elastomer (carboxyl-modified elastomer, etc.), epoxy Group-modified elastomers and the like.

Among the above polymers, polyolefins such as polyethylene and polypropylene; ethylene-unsaturated carboxylic acid copolymers such as ethylene-acrylic acid copolymer and ethylene-methacrylic acid copolymer; ionomers;
Preferred are ethylene-vinyl acetate copolymer; ethylene-vinyl alcohol copolymer; polypropylene-modified resin; vinyl acetate-based resin; styrene-based thermoplastic elastomer (styrene-based block copolymer); EPT; BR; .

The adhesive layer 7 includes, in addition to the base polymer,
It may contain an adhesion-imparting resin and inorganic particles. The tackifier resin, for example, petroleum resin [aliphatic petroleum resin (C ₅ petroleum resins), aromatic petroleum resin (C ₉ petroleum resins), alicyclic petroleum resin (aromatic petroleum resin Hydrogenated products)], rosin resins (such as rosin esters), phenol resins, alkylphenol resins, styrene resins,
Terpene resin (dipentene resin, α-pinene resin, β
-Pinene resin, etc.), terpene phenolic resin, PE-
WAX and the like. These adhesion-imparting resins can be used alone or in combination of two or more. The amount of the adhesion-imparting resin is, for example, 2 to 100 parts by weight, preferably about 10 to 60 parts by weight, based on 100 parts by weight of the base polymer. When the amount of the adhesion-imparting resin is less than 2 parts by weight, the adhesive strength is apt to be reduced, and the resin carrier is liable to peel off and float on a plastic carrier tape. Further, when the amount of the adhesion-imparting resin exceeds 100 parts by weight, the adhesive layer becomes hard, a slip stick phenomenon (running) occurs at the time of peeling, and the component easily pops out, and the adhesive force increases with time,
In some cases, peeling does not occur.

Examples of the inorganic particles include oxides (including composite oxides) such as zinc oxide, silica, alumina, magnesia, and tin oxide; carbonates such as calcium carbonate and magnesium carbonate; clay, talc, and silicate. Silicates such as calcium; hydroxides such as magnesium hydroxide and aluminum hydroxide; sulfates such as calcium sulfate; and inorganic compounds having conductivity such as spherical silicon. These inorganic particles can be used alone or in combination of two or more. The amount of the inorganic particles is, for example, about 0.5 to 100 parts by weight, preferably about 20 to 60 parts by weight, based on 100 parts by weight of the base polymer. When the amount of the inorganic particles is less than 0.5 part by weight, especially when the electronic component is a chip-type capacitor or the like, the electronic component easily adheres to the adhesive layer. In some cases, cracking of the coating, generation of pinholes, reduction in adhesive strength, and the like are likely to occur.

The adhesive layer 7 further includes an antioxidant (a phenolic antioxidant, a phosphorus-based antioxidant, etc.), a softening agent, an ultraviolet absorber, a rust inhibitor, a coupling agent (a silane coupling agent, etc.). ), An antistatic agent, a crosslinking agent (such as an isocyanate crosslinking agent), a conductive metal powder, and a conventional additive such as an organic conductive polymer agent. The amount of each of these additives was set at 100
The amount is, for example, about 0.1 to 100 parts by weight, preferably about 0.5 to 60 parts by weight with respect to parts by weight. When the added amount of the antistatic agent or the organic conductive polymer is less than 0.1 part by weight, the surface specific resistance of the adhesive layer 7 exceeds, for example, 10 ¹³ Ω. This makes it easy for components to jump out and mounting defects. If the amount of the antistatic agent or the organic conductive polymer exceeds 100 parts by weight, the adhesiveness may be significantly reduced.

The adhesive layer 7 is formed by mixing the base polymer and, if necessary, an adhesion-imparting resin, inorganic particles, and other additives with a biaxial kneader, a kneader, or the like.
The obtained mixture can be formed by, for example, melt-extruding the surface of the support 6 with an extrusion laminating machine or the like. The adhesive layer 7 can be formed by co-extrusion with the support 6. Depending on the type of the adhesive, the constituents of the adhesive layer 7 such as a base polymer may be formed on the support 6 in the form of a solution or an emulsion by coating and drying. May be applied to the support 6 using a hot melt coater or the like.

The thickness of the adhesive layer 7 is, for example, about 2 to 90 μm. When the thickness of the adhesive layer 7 is less than 2 μm, the adhesive strength is not sufficiently exhibited, and when the thickness is more than 90 μm, the adhesive strength is too strong and the components may pop out during peeling.

The surface resistivity of the adhesive layer 7 is preferably 10 ¹³ Ω or less (for example, about 10 ² to 10 ¹³ Ω). Further, the half value (the time until the voltage decreases to half the initial voltage) when the surface on the side of the adhesive layer 7 is charged is preferably 600 seconds or less, particularly preferably 60 seconds or less. If the surface specific resistance of the adhesive layer 7 exceeds 10 ¹³ Ω, when picking up the electronic component 5, the component is likely to jump out due to static electricity and to cause defective mounting. The surface resistivity and the half value of the adhesive layer 7 can be adjusted by the amount of the conductive inorganic compound, antistatic agent or organic conductive polymer added to the adhesive layer 7.

The support 6 may have any self-supporting properties, for example, polyolefins such as polyethylene and polypropylene (for example, high molecular weight polypropylene); ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer. Ethylene-unsaturated carboxylic acid copolymer such as coalesce; Polypropylene-modified resin; Polystyrene; Polyimide; Or it can be constituted by a sheet. The thermoplastic resins can be used alone or in combination of two or more.

The support 6 includes, in addition to the thermoplastic resin,
A thermoplastic elastomer such as a styrene-based thermoplastic elastomer (styrene-based block copolymer) and an epoxidized styrene-based thermoplastic elastomer may be included.
In particular, when an epoxidized styrene-based thermoplastic elastomer is used as the constituent polymer of the support 6, the anchoring property between the adhesive layer 7 and the support 6 is significantly improved. In this case, the amount of the epoxidized styrene-based thermoplastic elastomer is about 0.1 to 99.5% by weight, preferably about 0.5 to 50% by weight of the whole polymer constituting the support 6.

The support 6 has an antioxidant for preventing thermal deterioration during kneading of the resin constituting the support 6, a UV absorber for appearance inspection, and a softening agent for improving melt extrudability. Additives such as rust preventives to prevent corrosion of component electrodes, inorganic particles, conductive metal powders, organic conductive polymer agents, and coupling agents such as titanium-based and silane-based agents may be added. . As the inorganic particles, the same inorganic particles that may be added to the adhesive layer can be used. The coupling agent is used to improve the dispersibility of the inorganic particles, the conductive metal powder, and the like. The inorganic particles, the conductive metal powder, the amount of the organic conductive polymer agent added,
Each amount is, for example, about 0.1 to 100 parts by weight based on 100 parts by weight of the polymer constituting the support 6. 10
When 0 parts by weight or more is added, the adhesiveness between the adhesive layer 7 and the support 6 tends to decrease.

The melting point of the support 6 is preferably 90 ° C. or higher. When the melting point of the support 6 is less than 90 ° C., the taping of the electronic component 5 causes the support to shrink or melt, the taping state becomes unstable, and the electronic component 5 may spill or pop out. There is.

The support 6 may be a single layer or multiple layers. The thickness of the support 6 is about 2 to 250 μm, preferably about 20 to 200 μm. If the thickness of the support 6 is less than 2 μm, the mechanical strength is too low, and the conveyance of the electronic component 5 tends to be hindered. If the thickness exceeds 250 μm, the ability to follow the electronic component 5 is reduced, and repulsion is likely to occur. The support 6 can be formed by a conventional film forming method, for example, extrusion molding, coextrusion, injection molding, casting method and the like.

The surface of the support 6 on the side of the adhesive layer 7 is subjected to a conventional surface treatment such as a corona discharge treatment or a plasma treatment, if necessary, and then an isocyanate-based, urethane-based or epoxy-based adhesive is applied. An antistatic layer such as an agent or an electrostatic induction layer made of an antistatic primer may be provided.
Examples of the antistatic primer include BONDEIP (a compound composed of choline chloride methacrylate and methyl methacrylate, 2-methylimidazole, and the like) manufactured by Altec Corporation.

The thickness of the antistatic layer is, for example, 0.1 to
It is about 10 μm. When the thickness is less than 0.1 μm, the support 6 and the adhesive layer 7 are apt to cause interlayer destruction, and when the thickness exceeds 10 μm, the rigidity is increased and repulsion is likely to occur.

A resin layer containing an antistatic agent (for example, a quaternary ammonium salt) (for example, an olefin-based resin layer such as polypropylene) is formed on the opposite side of the support 6 from the adhesive layer 7. ) Or an antistatic layer such as the aforementioned electrostatic induction layer.

In the present invention, the surface resistivity of the support 6 is preferably 10 ¹³ Ω or less (for example, 10 ² to 10 Ω).
¹³ Ω). Further, the half value (time required for the voltage to decrease to half the initial voltage) when the surface of the support 6 is charged is preferably 600 seconds or less, particularly preferably 60 seconds or less. If the surface specific resistance of the support 6 exceeds 10 ¹³ Ω, when picking up the electronic component 5, the component is likely to jump out due to static electricity and to cause a mounting failure. On the other hand, if the half value exceeds 600 seconds, the reliability of components tends to decrease due to electrostatic breakdown, especially in semiconductor products.

The surface resistivity on the support 7 side and the half value can be determined by appropriately selecting the amount of the conductive inorganic compound, antistatic agent or organic conductive polymer added to the support 6.
It can be adjusted by providing the antistatic layer on at least one surface of the above.

The electronic component carrier of the present invention only needs to have an electronic component housing portion for housing the electronic component 5 and a cover tape for covering the electronic component housing portion, as shown in FIG. The present invention is not limited to the embossed carrier type taping including the embossed carrier tape 1 and the cover tape 4. For example, a square hole punched carrier tape having a square punched hole for inserting a part, and a square holed punched carrier tape may be formed. It may be a square hole punch carrier type taping comprising a bottom cover tape for covering the lower surface and a top cover tape for covering the upper surface of the square hole of the square hole punch carrier tape. In the latter square hole punch carrier type taping, the cover tape for an electronic component carrier of the present invention can be used, for example, as the above-mentioned top cover tape.

The cover tape for an electronic component carrier and the electronic component carrier according to the present invention are provided with a resistor such as a chip fixed resistor,
It can be suitably used for transporting a wide range of chip-type electronic components such as capacitors such as multilayer ceramic capacitors.

[0040]

According to the present invention, since a specific thermoplastic elastomer is used as the base polymer of the adhesive layer of the cover tape, the adhesion of parts can be prevented in a wide temperature range from a low temperature to a high temperature. Regardless of whether the material is plastic or paper, it shows an appropriate adhesiveness to the carry tape. Also, stable adhesive strength can be obtained even under high temperature and high humidity. Further, according to the present invention, it is possible to prevent components from adhering to the tape surface due to charging when the cover tape is peeled off. Therefore, destruction due to static electricity can be prevented particularly for semiconductor electronic components, and the reliability of components and the reliability of mounting are greatly improved.

[0041]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

Example 1 Low-density polyethylene (LLD-PE; manufactured by Mitsui Dupont Co., Ltd., trade name "Mirason 11P") 70 parts by weight resin, epoxidized SBS (ESBS) resin (manufactured by Daicel Chemical Industries, Ltd.) 30 parts by weight of "Epo Friend") and 10 parts by weight of an antistatic agent (polymer type antistatic agent) were melted and extruded on a polyethylene terephthalate (PET) film by a T-die extrusion laminating machine to form an adhesive layer. Was provided. Next, on the other surface of the polyethylene terephthalate film, an antistatic layer made of a cationic polymer type antistatic agent was provided, and an adhesive layer (LLD-P
A cover tape for an electronic component carrier having a layer structure of E + ESBS; thickness: 20 μm) / support layer (PET; thickness: 25 μm) / antistatic layer (thickness: 0.5 μm) was produced.

Example 2 (i) 70 parts by weight of a styrene-butadiene-styrene block copolymer (SBS; styrene content 40%), ES
30 parts by weight of BS (manufactured by Daicel Chemical Industries, Ltd., trade name "Epo Friend"), petroleum resin (trade name: ALCON P-
90 ") 20 parts by weight and conductive metal oxide (tin oxide)
20 parts by weight of a resin composition, (ii) polyethylene (PE), and (iii) a resin mixture of 100 parts by weight of polypropylene (PP) and 10 parts by weight of an antistatic agent (quaternary ammonium salt and the like). , Extruded with a three-layer co-extruder to form an adhesive layer (SBS + ESBS; thickness 20μ)
m) / support layer (PE; thickness: 15 μm) / antistatic layer (PP + antistatic agent; thickness: 25 μm) A cover tape for an electronic component carrier was produced.

Comparative Example 1 Polyethylene (P) was placed on a PET film via an adhesive.
E) and a styrene-butadiene-styrene block copolymer (SBS; styrene content 60%) are bonded in this order, and an adhesive layer (SBS; thickness 30 μm) / undercoat layer (PE; thickness 15 μm) / A tape having a layer structure of a support layer (PET; thickness: 16 μm).

Evaluation Test The following tests were performed on the tapes obtained in Examples and Comparative Examples. Table 1 shows the results. (Total thickness) The total thickness (μm) of the tape was measured with a 1/1000 mm dial gauge. (Tensile strength and elongation) The tensile strength and elongation were measured with a tensile speed of 300 mm / min. (Adhesive force) The adhesive force of polystyrene (PS), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), and paper board was measured as follows. That is, the surface of the adhesive layer of the tape obtained in each of the examples and the comparative examples was superimposed on the surface of a sheet made of each material, and a temperature of 140 ° C. and a pressure of 2.times.
After pressure bonding for 0.5 seconds under the condition of 5 kgf / cm ² (245 kPa), the peeling force was measured at room temperature. Regarding the adhesive strength to the backing paper, the adhesive strength (peeling strength) when the sheet was stored for 30 days under the conditions of 40 ° C. and 90% RH after the pressure bonding operation was also measured. The adhesive force (peeling force) of the top cover tape of the electronic component taping (surface mounting component) is standardized by EIAJ, and the pulling direction is set at an angle of 165 ° to 180 °.
And when the top cover tape is pulled at a speed of 300 mm / min, unless otherwise specified, 0.1 to 0.7 N
(10.2 to 71.4 gf).

(Surface Resistance Value) The surface resistance of the surface of the adhesive layer and the surface of the support layer was measured with a minute current potentiometer. (Half value) Measured with a static honest meter.
The half-value means that the surface of the support layer of the tape is charged,
It means the time until the voltage reaches half the value of the initial voltage.

[0047]

[Table 1]

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of an electronic component carrier of the present invention.

FIG. 2 is a sectional view showing an example of a cover tape for an electronic component carrier of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 embossed carrier tape 2 electronic component housing recess 3 automatic machine feed hole 4 cover tape for electronic component carrier 5 electronic component 6 support 7 adhesive layer

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3E067 AA11 AB41 BA26A BB01A BB11A BB14A BB15A BB16A BC07A CA21 CA24 EA35 EE46 4J004 AA05 AA07 AA13 CA02 CA04 CA05 CA06 CA08 CB02 CC02 CC04 CD01 FA05 5F03 MA20

Claims (8)

[Claims] 1. A cover tape for an electronic component carrier provided with an adhesive layer on a support, wherein the adhesive layer contains an epoxidized styrene-based thermoplastic elastomer as a base polymer. tape. 2. The cover tape for an electronic component carrier according to claim 1, wherein the content of the epoxidized styrene-based thermoplastic elastomer is 1 to 99.5% by weight of the whole base polymer constituting the adhesive layer. 3. The cover tape for an electronic component carrier according to claim 1, wherein the adhesive layer contains 2 to 100 parts by weight of an adhesion-imparting resin based on 100 parts by weight of the base polymer. 4. The cover tape for an electronic component carrier according to claim 1, wherein both the surface resistivity of the support and the surface of the adhesive layer are 10 ¹³ Ω or less. 5. The electronic component according to claim 1, wherein the half value (time required for the voltage to decrease to half of the initial voltage) when the surface on the support side and the surface on the adhesive layer side are charged is 600 seconds or less. Cover tape for carrier. 6. The cover tape for an electronic component carrier according to claim 1, wherein an antistatic layer is provided outside the support or between the support and the adhesive layer. 7. The cover tape according to claim 1, wherein the support is made of a plastic film containing an epoxidized styrene-based thermoplastic elastomer. 8. An electronic component storage unit for storing an electronic component,
An electronic component carrier provided with a cover tape that covers the electronic component housing portion, wherein the cover tape for an electronic component carrier according to any one of claims 1 to 7 is used as the cover tape. Electronic parts carrier.