JP4573442B2 - Bottom cover tape for electronic component carriers - Google Patents

Description

【００６０】
表１より、実施例に係るボトムカバーテープは、キャリアテープに対する接着性が良好である。また、摩擦帯電圧が低く、さらに接着剤層の表面抵抗率も低い。従って、帯電防止性が優れており、チップの付着を抑制又は防止することができる。しかも、チップ部品と接触する接着剤層には、塩素イオンや硫酸イオンが含まれておらず、Ｎｉを腐食しない。従って、腐食防止性も優れている。
【図面の簡単な説明】
【図１】本発明のボトムカバーテープの一例を示す概略断面図である。
【図２】図１にかかるボトムカバーテープを用いたチップ型電子部品用キャリア材の使用状態を示す長さ方向の概略断面図である。
【符号の説明】
１ ボトムカバーテープ
２ 支持基材層
３ 接着剤層
４ チップ型電子部品用キャリア材
５ キャリアテープ
６ トップカバーテープ
７ チップ型電子部品収納用打ち抜き角穴
８ チップ型電子部品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a bottom cover tape for an electronic component carrier used for conveying chip-type electronic components. More specifically, the present invention has excellent adhesion to the carrier tape and good antistatic properties. The present invention relates to a bottom cover tape for an electronic component carrier that is excellent in preventing adhesion of components and preventing corrosion.
[0002]
[Prior art]
Chip-type electronic parts such as chip-fixed resistors and multilayer ceramic capacitors (chip parts) can be transported in the form of punched square holes for storing chip-type electronic parts at regular intervals along the length of the tape-like cardboard. The bottom surface of the formed paper carrier (carrier tape) is heat-sealed (taped) with a bottom cover tape to produce a storage pocket. Immediately thereafter, a chip-type electronic component is inserted into the storage pocket, and the top surface of the paper carrier. A series of taping reel systems are widely used in which a chip-type electronic component is encapsulated by heat sealing with a top cover tape, and then wound and transported in a reel shape. In the manufacturing process of the circuit board or the like of the transfer destination, an automatic assembly system that automatically picks up the housed chip-type electronic components with an air nozzle after the top cover tape is peeled off and supplies it onto the substrate becomes the mainstream. ing.
[0003]
In such an automatic incorporation system, a bottom cover tape is bonded to a carrier tape, and it is important that the bottom cover tape has good adhesion to the carrier tape.
[0004]
In particular, in recent years, a phenomenon has occurred in which chip components cannot be adsorbed by an air nozzle, and a decrease in adsorption rate has become a problem. This is because the chip component is further reduced in size and weight, the bottom cover tape is attached to the adhesive layer surface of the chip component due to static electricity generation, and the chip component is pressed by the air nozzle. Adhesion of the chip part to the adhesive layer due to insufficient cooling of the adhesive layer for shortening the time from taping of the bottom cover tape to insertion of the chip part into the storage pocket can be considered.
[0005]
In addition, in such a concern, the chip part is corroded by the bottom cover tape as an important problem, and the corrosion of the chip part can be suppressed or prevented. There is a need for a bottom cover tape with excellent reliability.
[0006]
[Problems to be solved by the invention]
Accordingly, an object of the present invention is to provide a bottom cover tape for an electronic component carrier that has excellent adhesion to a carrier tape, exhibits high antistatic properties, and is excellent in adhesion prevention and corrosion prevention of chip components. It is in.
[0007]
[Means for Solving the Problems]
As a result of intensive studies to achieve the above object, the inventors of the present invention have found that when the adhesive layer provided on the support substrate layer is composed of a specific resin composition in the bottom cover tape for electronic component carriers, the adhesiveness to the carrier tape. The inventors have found that all of antistatic properties, chip component adhesion preventive properties, and chip component corrosion preventive properties can be satisfied, and the present invention has been completed.
[0008]
  That is, the present invention is an amphoteric system containing 1 to 50 parts by weight of an alicyclic saturated hydrocarbon-based resin and no halogen atom and / or sulfur atom with respect to 100 parts by weight of the supporting base layer and the base polymer. And an adhesive layer containing 0.1 to 20 parts by weight of a surfactant and / or a nonionic surfactantThe surface roughness of the adhesive layer is 0.1 to 20 μmA bottom cover tape for an electronic component carrier is provided.
  In the present specification, in addition to the above-described invention, 1 to 50 parts by weight of an alicyclic saturated hydrocarbon resin and a halogen atom and / or a sulfur atom with respect to 100 parts by weight of the support base layer and the base polymer. An adhesive layer containing 0.1 to 20 parts by weight of an amphoteric surfactant and / or a nonionic surfactant that does not contain a bottom cover tape for an electronic component carrier, Is also explained.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings as necessary. FIG. 1 is a schematic sectional view showing an example of a bottom cover tape for an electronic component carrier according to the present invention. In FIG. 1, 1 is a bottom cover tape, 2 is a support base material layer, and 3 is an adhesive layer. The bottom cover tape 1 includes a support base layer 2 and an adhesive layer 3 provided on the support base layer 2.
[0010]
(Supporting substrate layer 2)
The supporting substrate constituting the supporting substrate layer 2 may be any material having self-supporting properties, for example, paper such as Japanese paper, thin paper, crepe paper, synthetic paper, mixed paper, composite paper; non-woven fabric, cloth; Thermoplastic resins such as polyethylene, polypropylene, olefin resins such as ethylene-acid copolymer resins, polypropylene modified resins, thermoplastic elastomers such as styrene thermoplastic elastomers, polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples include a plastic film or sheet that is configured; a metal foil or thin plate that is formed of a metal such as copper or aluminum; and a laminate of these.
[0011]
The support substrate 2 preferably has a melting point of 90 ° C. or higher. When the melting point is less than 90 ° C., for example, when taping is performed by thermocompression bonding using a metal iron or the like, the support base material may melt and adhere to the iron or the like, and the original cover may not be achieved. There is.
[0012]
The surface of the support base material layer 2 (surface opposite to the adhesive layer 3) may be subjected to conventional surface treatment, easy slip treatment, antistatic treatment, and the like. In addition, the surface of the support base layer 2 on the side of the adhesive layer 3 may be subjected to a treatment for improving anchoring properties such as ozone treatment and corona treatment. In particular, the support base material is a plastic film. In this case, anchoring property improving means by applying an anchor coating agent may be employed.
[0013]
Although the thickness of the support base material layer 2 can be selected in a wide range according to the application as long as the mechanical strength, handling property and the like are not impaired, it is generally about 5 to 100 μm, preferably about 10 to 50 μm.
[0014]
(Adhesive layer 3)
The adhesive layer 3 is composed of a thermoplastic adhesive. The thermoplastic adhesive contains at least a base polymer, an alicyclic saturated hydrocarbon resin, and an amphoteric surfactant and / or a nonionic surfactant not containing a halogen atom and / or a sulfur atom. is doing. More specifically, the thermoplastic adhesive is 1 to 50 parts by weight of an alicyclic saturated hydrocarbon resin and 100% by weight of the base polymer, and an amphoteric system containing no halogen atom and / or sulfur atom. It contains at least 0.1 to 20 parts by weight of a surfactant and / or a nonionic surfactant.
[0015]
(Base polymer)
As the base polymer, for example, thermoplastic resins such as olefin resins, vinyl acetate resins, polyester resins, styrene resins, and thermoplastic elastomers can be used. These base polymers can be used alone or in combination of two or more.
[0016]
Examples of the olefin resin include polyolefins such as polyethylene (low density polyethylene, linear low density polyethylene, metallocene catalyzed polyethylene, high density polyethylene, etc.), polypropylene, ethylene-α-olefin copolymer resin; (For example, ethylene-unsaturated carboxylic acid copolymer such as ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA); ionomer; ethylene-methyl acrylate copolymer, ethylene-acrylic Ethylene- (meth) acrylic acid ester copolymers such as ethyl acetate copolymer (EEA) and ethylene-methyl methacrylate copolymer; ethylene-vinyl acetate copolymer (EVA); ethylene-vinyl alcohol copolymer, etc. ); Polypropylene modified resin, etc. And the like.
[0017]
Examples of the vinyl acetate resin include polyvinyl acetate, vinyl acetate- (meth) acrylic acid ester copolymer, vinyl acetate-vinyl ester copolymer, vinyl acetate-maleic acid ester copolymer, and the like.
[0018]
Examples of the thermoplastic elastomer include SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), and SEBS (styrene-ethylene-butylene-styrene block copolymer). , SEPS (styrene-ethylene-propylene-styrene block copolymer), SEP (styrene-ethylene-propylene block copolymer), and other styrenic thermoplastic elastomers (styrenic block copolymers; for example, having a styrene content of 5% by weight or more Polystyrene thermoplastic elastomers; Polyester thermoplastic elastomers; Blended thermoplastic elastomers such as polymer blends of polypropylene and EPT (ternary ethylene-propylene rubber) Such as Ma and the like.
[0019]
(Alicyclic saturated hydrocarbon resin)
Examples of the alicyclic saturated hydrocarbon resin include aromatic petroleum resins (for example, C₉(For example, “alicyclic saturated petroleum resin”) that is completely hydrogenated. Specifically, a brand name “ESCOREZ5300”, a brand name “ESCOREZ5380” (above, manufactured by Toenex Corporation), and the like can be given.
[0020]
The alicyclic saturated hydrocarbon resins can be used alone or in combination of two or more. When the adhesive layer 3 is formed by extrusion lamination, the alicyclic saturated petroleum resin is particularly preferable from the viewpoint of stability against oxidation because it is melted at a high temperature.
[0021]
By including the alicyclic saturated hydrocarbon resin as a tackifying resin in the adhesive layer 3, the taping workability can be improved and a stable and good adhesive force can be exerted on the carrier tape.
[0022]
The blending amount of the alicyclic saturated hydrocarbon resin is, for example, about 1 to 50 parts by weight, preferably about 5 to 30 parts by weight with respect to 100 parts by weight of the base polymer. When the blending amount of the alicyclic saturated hydrocarbon resin is less than 1 part by weight with respect to 100 parts by weight of the base polymer, for example, when paper is used as the support substrate 2, the molten adhesive composition is There is a need to provide an intermediate layer by co-extrusion or tandem extrusion laminating instead of simple extrusion laminating without adhering to the paper base material 2 (throwability cannot be obtained). Moreover, it becomes difficult to obtain adhesiveness with a carrier tape (paper carrier).
[0023]
On the other hand, when the blending amount of the alicyclic saturated hydrocarbon resin exceeds 50 parts by weight with respect to 100 parts by weight of the base polymer, the adhesive layer 3 and the adhesive layer 3 immediately after extrusion are formed during film formation. Blocking may occur between the metal rolls in contact with the metal rolls and stable production may not be possible. Further, the chip component adheres to the adhesive layer 23, and air nozzle suction failure is likely to occur in the circuit board manufacturing process.
[0024]
(Amphoteric surfactants, nonionic surfactants)
As the amphoteric surfactant and / or the nonionic surfactant contained in the pressure-sensitive adhesive layer 3, those containing no halogen atom and / or sulfur atom are used. As described above, by using an amphoteric surfactant and / or a nonionic surfactant that does not contain a halogen atom and / or a sulfur atom, corrosion of the electrode of the chip component is prevented. be able to.
[0025]
In the surfactant containing a halogen atom, the halogen atom is often contained in the form of a halogen ion (such as a chlorine ion). Moreover, in the surfactant containing a sulfur atom, a sulfur atom is often contained in the form of a sulfate ion. These halogen ions (such as chlorine ions) and sulfate ions corrode the metal that is the electrode of the chip component. However, in the bottom cover tape of the present invention, since the surfactant as an antistatic agent does not have a halogen atom or a sulfur atom, in particular, the halogen atom or the sulfur atom is an ion such as a halogen ion or a sulfate ion, respectively. Since it does not have a form, the electrode of the chip component is not corroded.
[0026]
The amphoteric surfactant is not particularly limited, and examples thereof include N, N-dimethyl-N-alkylaminoacetic acid betaine and 2-alkyl-1-hydroxyethyl-1-carboxymethylimidazolinium betaine.
[0027]
Nonionic surfactants include glycerin fatty acid ester, sorbitan fatty acid ester, sucrose fatty acid ester, polyoxyethylene alkylphenyl ether, polyoxyethylene alkyl ether, polyoxyethylene polyoxypropylene block copolymer, polyethylene glycol fatty acid ester. (Polyoxyethylene fatty acid ester), polyoxyethylene sorbitan fatty acid ester, fatty acid alkanolamide and the like.
[0028]
Amphoteric surfactants and / or nonionic surfactants can be used alone or in admixture of two or more.
[0029]
The compounding amount of the surfactant (amphoteric surfactant and / or nonionic surfactant) is 0.1 to 20 parts by weight with respect to 100 parts by weight of the base polymer in terms of active ingredients or solids. Yes, preferably 0.5 to 10 parts by weight. When the amount of the surfactant is less than 0.1 parts by weight with respect to 100 parts by weight of the base polymer, the antistatic property is lowered, and the chip component adheres to the surface of the adhesive layer due to static electricity. The effect may not be obtained. Specifically, when the blending amount of the surfactant is less than 0.1 parts by weight with respect to 100 parts by weight of the base polymer, the surface resistivity of the adhesive layer is 1 × 10.¹³In some cases, it exceeds Ω / □, and the triboelectric chargeability of the adhesive layer exceeds 3000V. On the other hand, when the compounding amount of the surfactant exceeds 20 parts by weight with respect to 100 parts by weight of the base polymer, the surfactant bleeds out on the surface or interface of the adhesive layer, and the adherend (carrier) Adhesive strength to the tape) may not be sufficiently obtained, and the adhesive strength to the support base material layer 2 may be insufficient, and interface fracture between the adhesive layer 3 and the support base material layer 2 may occur.
[0030]
In the present invention, additives such as a filler, an antioxidant, a softener, an ultraviolet absorber, a rust inhibitor, a coupling agent, an antistatic agent other than the above, and a crosslinking agent are added to the pressure-sensitive adhesive layer 3. May be.
[0031]
The thickness of the adhesive layer 3 can be appropriately selected as long as the adhesiveness and handling properties are not impaired, but is generally about 5 to 50 μm. When the thickness of the adhesive layer 3 is less than 5 μm, the adhesive strength with the carrier tape (adhered body) decreases, and the processability becomes difficult. On the other hand, when the thickness exceeds 50 μm, the total thickness of the bottom cover tape becomes large. In particular, in the case of long winding, problems such as a decrease in handling property due to an increase in weight and a decrease in production efficiency occur.
[0032]
In this invention, it is preferable that the softening point of the adhesive bond layer 3 is about 60-170 degreeC (preferably 70-150 degreeC). When the softening point is less than 60 ° C., the chip component is adhered or adhered to the adhesive layer 3 when the electronic component carrier encapsulating the chip component is exposed to a high temperature and high humidity environment for a long period of time. There is. On the other hand, when the softening point of the adhesive layer 3 exceeds 170 ° C., the temperature during the film forming process becomes high, the heat sealing (taping) workability is lowered, and the surfactant contained in the adhesive layer 3 (Amphoteric surfactant and / or nonionic surfactant) is vaporized, and the antistatic effect is reduced.
[0033]
The softening point of the adhesive layer 3 can be adjusted by appropriately selecting the type of base polymer (such as a thermoplastic resin or a thermoplastic elastomer) that constitutes the adhesive layer 3.
[0034]
The surface resistivity of the adhesive layer 3 is 10⁸-10¹³Ω / □ (preferably 10⁸-10¹²Ω / □). The surface resistivity of the adhesive layer 3 can be adjusted by appropriately selecting the type of the resin constituting the adhesive layer 3, additives such as a surfactant (antistatic agent), the blending ratio thereof, and the like. .
[0035]
The triboelectric charge rate of the adhesive layer 3 is preferably 3000 V or less (particularly 1000 V or less). The frictional voltage can be adjusted by appropriately selecting the type of the thermoplastic adhesive of the adhesive layer 3 and the thickness of the layer.
[0036]
In the present invention, the surface roughness (average roughness Ra) of the adhesive layer 3 is preferably 0.1 to 20 μm (preferably 1 to 18 μm). When the surface roughness is less than 0.1 μm, the contact area with the chip component increases, the adhesion of the chip component increases, and the chip component easily adheres to the adhesive layer 3. On the other hand, if the surface roughness of the adhesive layer 3 exceeds 20 μm, problems such as film cracking during film formation and a decrease in adhesive strength to the carrier tape (adhered body) may occur.
[0037]
In the present invention, an intermediate layer may be provided between the support base material layer 2 and the adhesive layer 3 in order to improve the adhesion between both layers. This intermediate layer can be made of, for example, a thermoplastic resin such as a polyolefin resin, a thermoplastic elastomer, rubber, or the like. Examples of the olefin resin include low density polyethylene, linear low density polyethylene, ethylene-α-olefin copolymer, and ethylene-vinyl acetate copolymer. These components constituting the intermediate layer can be used alone or in admixture of two or more. The thickness of the intermediate layer can be appropriately selected as long as the handleability of the bottom cover tape is not impaired, and is, for example, about 0 to 40 μm. Note that the intermediate layer is not necessarily provided.
[0038]
The bottom cover tape 1 of the present invention is, for example, a conventional single or tandem one obtained by melt blending the components of the adhesive layer 3 into a predetermined blending ratio by a biaxial kneader and pelletizing, or dry blending. It can manufacture by laminating | stacking on the support base material layer 2 with or without an intermediate | middle layer by the extrusion lamination method. Alternatively, the adhesive layer 3 and the intermediate layer can be produced by co-extrusion on the supporting base material layer 2 by lamination.
[0039]
FIG. 2 is a schematic cross-sectional view in the length direction showing a usage state of the carrier material for chip-type electronic component using the bottom cover tape 1 shown in FIG. A carrier material (carrier material) 4 for chip-type electronic components includes a carrier tape 5 in which punched square holes 7 for storing chip-type electronic components are formed at regular intervals in the length direction, and a bottom provided on the lower surface of the carrier tape 5. The cover tape 1 and the top cover tape 6 provided on the upper surface of the carrier tape 5 are configured. In this carrier material 4, a chip-type electronic component 8 is inserted into a storage pocket formed by heat-sealing the lower surface of the carrier tape 5 with the bottom cover tape 1, and the upper surface of the carrier tape 5 is heated with the top cover tape 6. After sealing, it is wound into a reel and transported.
[0040]
At this time, the adhesive layer 3 of the bottom cover tape 1 is composed of a resin composition containing a base polymer, a specific tackifier, and a specific antistatic agent (surfactant) in a specific ratio. Therefore, the bottom cover tape 1 and the carrier tape 5 are firmly bonded to each other, and the bottom cover tape 1 is not peeled off during the transportation and the chip component 8 is not dropped.
[0041]
Further, the bottom cover tape 1 is excellent in antistatic property and excellent in anti-sticking property of chip parts. Specifically, the chip component 8 can be suppressed or prevented from adhering to the surface of the adhesive layer 3 of the bottom cover tape 1 due to static electricity, and the chip component can be stored even after storing or enclosing the chip component. It is possible to suppress or prevent 8 from adhering to or fusing to the surface of the adhesive layer 3.
[0042]
For this reason, the chip component adsorption rate of the air nozzle in the automatic assembly system is remarkably improved, and the chip component can be reliably taken out and supplied onto the substrate.
[0043]
In addition, the adhesive layer 3 does not contain a component that corrodes the chip component (such as a halogen ion such as chlorine ion or a sulfur compound such as sulfate ion), so that the corrosion of the chip component 8 can be suppressed or prevented. It is possible to prevent corrosion of chip parts. Therefore, the reliability at the time of mounting and storage as an electronic component carrier can be enhanced.
[0044]
The bottom cover tape thus obtained can be suitably used as a bottom cover tape used for transporting a chip-type electronic component such as a resistor such as a chip-fixed resistor or a multilayer ceramic capacitor.
[0045]
【The invention's effect】
The bottom cover tape of the present invention is excellent in thermal adhesiveness to the carrier tape because the adhesive layer is composed of a specific component. In addition, it can exhibit high antistatic properties, and the frictional voltage is extremely low during transport, etc., so that adhesion of the chip component to the adhesive layer surface due to static electricity is suppressed or prevented, and adhesion of the chip component Excellent prevention. Further, since the antistatic agent having no halogen atom or sulfur atom is used, there is no corrosion of the electrode of the chip component.
Therefore, problems such as adhesion of chip parts due to charging during transportation or peeling, chip parts popping out, adhesion due to pressing of the chip parts with the air nozzle are eliminated, and air nozzle adsorption mistakes in the automatic assembly system are eliminated. Smooth chip component supply to the substrate becomes possible.
[0046]
【Example】
EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, this invention is not limited at all by these Examples.
[0047]
Example 1
Low density polyethylene (LDPE) (base polymer, trade name “LJ800”, manufactured by Mitsubishi Chemical Corporation, density 0.918 g / cm^Three, 100 parts by weight of melt flow rate (MFR) 20 g / 10 minutes, softening point 82 ° C., 20 parts by weight of alicyclic hydrocarbon-based resin (tackifying resin, trade name “ESCOREZ5300”, manufactured by Toenex Co., Ltd.) And 1.5 parts by weight of a nonionic surfactant (antistatic agent, trade name “Nonion S-10”, manufactured by NOF Corporation, polyoxyethylene fatty acid ester) at a temperature of 130 ° C. in a twin-screw kneader. And kneaded for 30 minutes to form pellets. Next, using this pellet, a film was formed by an extrusion laminator at a temperature of 250 ° C., and washi paper (thickness 40 μm, basis weight 19 g / m) as a supporting substrate.²And an adhesive layer having a film thickness of 25 μm was laminated on Japanese paper to obtain a laminated tape (bottom cover tape). The resulting laminated tape had a total thickness of 55 μm and a surface roughness Ra of the adhesive layer of 4 μm.
[0048]
Example 2
Ethylene-vinyl acetate copolymer (EVA resin) (base polymer, trade name “LV140”, manufactured by Mitsubishi Chemical Corporation, vinyl acetate content 2% by weight, MFR 1.5 g / 10 min, softening point 87 ° C.) 100 weight Parts, 10 parts by weight of an alicyclic hydrocarbon resin (tackifier resin, trade name “ESCOREZ5380”, manufactured by Toenex Co., Ltd.), nonionic surfactant (trade name “IMEX 300-LD”, Sanyo Chemical Co., Ltd.) Made in the same manner as in Example 1 using 5 parts by weight of pellets. Next, the pellets were used to form a film at a temperature of 220 ° C. with an extrusion laminator to form a supporting paper Japanese paper (thickness 40 μm, basis weight 18 g / m²And an adhesive layer having a film thickness of 20 μm was laminated on Japanese paper to obtain a laminated tape (bottom cover tape) having a total thickness of 50 μm. Thereafter, the laminated tape was subjected to sand blasting so that the surface roughness Ra of the adhesive layer was 15 μm.
[0049]
Example 3
Low density polyethylene (LDPE) (base polymer, trade name “LJ800”, manufactured by Mitsubishi Chemical Corporation, density 0.918 g / cm^Three, 100 parts by weight of melt flow rate (MFR) 20 g / 10 minutes, softening point 82 ° C., 20 parts by weight of alicyclic hydrocarbon-based resin (tackifying resin, trade name “ESCOREZ5300”, manufactured by Toenex Co., Ltd.) And 2 parts by weight of polyethylene glycol (antistatic agent, nonionic surfactant) were kneaded with a Banbury mixer and pelletized. Next, using this pellet, a film was formed at a temperature of 250 ° C. by an extrusion laminator to form a Japanese paper (thickness 25 μm, basis weight 14 g / m) as a supporting substrate.²And an adhesive layer having a film thickness of 25 μm was laminated on Japanese paper to obtain a laminated tape (bottom cover tape). The resulting laminated tape had a total thickness of 50 μm and a surface roughness Ra of the adhesive layer of 3 μm.
[0050]
Comparative Example 1
Japanese paper (thickness 40 μm, basis weight 18 g / m) as a support base material layer²), As an adhesive layer, low density polyethylene (trade name “LJ800”, manufactured by Mitsubishi Chemical Corporation, density 0.918 g / cm^ThreeMFR 20 g / 10 min, softening point 82 ° C.) was laminated by an extrusion laminator to obtain a laminated tape having a total thickness of 55 μm and an adhesive layer surface roughness Ra of 0.05 μm.
[0051]
Comparative Example 2
Linear low density polyethylene (trade name “UF240”, manufactured by Mitsubishi Chemical Corporation, density 0.923 g / cm^Three, MFR 2 g / 10 min, softening point 85 ° C.) 100 parts by weight, add 5 parts by weight of quaternary ammonium salt (cationic antistatic agent), knead with kneader, support with extrusion laminator Japanese paper as a base material layer (thickness 35 μm, basis weight 15 g / m²Extrusion lamination was performed to obtain a laminated tape having a total thickness of 50 μm and a surface roughness Ra of the adhesive layer of 0.5 μm.
[0052]
Evaluation test
The following tests were conducted for each laminated tape obtained in the examples and comparative examples. The results are shown in Table 1.
[0053]
(Tensile strength and elongation)
The tensile strength (N / 5.25 mm) and the elongation (N / 5.25 mm) were measured with Tensilon at a pulling speed of 300 mm / min.
[0054]
(Adhesive strength)
Each laminated tape was applied to the surface of a paper carrier (Hokuto Paper Co., Ltd., HOCTO-60) using a heat sealing machine (Taping Machine manufactured by Tokyo Wells Co., Ltd.) at 170 ° C. and an iron holding force of 1.5 kgf ( 14.7N) After heat-sealing under conditions of 1200 PCS / min, the adhesion strength (N / 5.25 mm) was measured using a peel tester under conditions of a peel speed of 300 mm / min and a peel angle of about 180 °.
[0055]
(Surface resistivity)
The surface resistivity (Ω) of each laminated tape was measured using a high resistivity meter Hiresta UP (manufactured by Mitsubishi Chemical Corporation) in an atmosphere of 23 ° C./65% RH under conditions of 500 V × 30 seconds.
[0056]
(Friction band voltage)
In accordance with JIS L 1094, the frictional voltage (V) on the adhesive layer side of each laminated tape was measured.
[0057]
(Corrosive)
The adhesive layer of each laminated tape is thermocompression bonded to nickel foil (Ni foil), stored for 100 hours in an atmosphere of 60 ° C./90% RH, then peeled off the laminated tape, and the degree of discoloration of the Ni foil is examined. Evaluation was made as “◯” for those having no color change, “Δ” for those partially discolored, and “×” for those completely discolored.
[0058]
(Ion extraction amount)
About the adhesive layer of each laminated tape, 0.5 g of pellets as the material of the adhesive layer was immersed in 50 ml of pure water and boiled at 100 ° C. for 45 minutes while refluxing to extract ionic components. After cooling the extract, chloride ions (Cl^-) And sulfate ions (SO_Four ^2-), The detected amount (extracted amount) (ppm) was determined. In Table 1, “ND” means “not detected”.
[0059]
[Table 1]

[0060]
From Table 1, the bottom cover tape which concerns on an Example has favorable adhesiveness with respect to a carrier tape. In addition, the frictional voltage is low, and the surface resistivity of the adhesive layer is also low. Therefore, the antistatic property is excellent and the adhesion of the chip can be suppressed or prevented. Moreover, the adhesive layer in contact with the chip component does not contain chlorine ions or sulfate ions, and does not corrode Ni. Therefore, corrosion prevention is also excellent.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an example of a bottom cover tape of the present invention.
2 is a schematic cross-sectional view in the length direction showing a usage state of a carrier material for a chip-type electronic component using the bottom cover tape according to FIG. 1;
[Explanation of symbols]
1 Bottom cover tape
2 Support base material layer
3 Adhesive layer
4 Carrier material for chip-type electronic components
5 Carrier tape
6 Top cover tape
7 punched square holes for storing chip-type electronic components
8 Chip-type electronic components

Claims (3)

1 to 50 parts by weight of an alicyclic saturated hydrocarbon resin, and an amphoteric surfactant that does not contain a halogen atom and / or a sulfur atom and / or 100 parts by weight of the base polymer and an adhesive layer containing 0.1 to 20 parts by weight nonionic surfactant, a bottom for electronic components carrier surface roughness of the adhesive layer, characterized in 0.1~20μm der Rukoto Cover tape. The electron according to claim 1, wherein the thickness of the adhesive layer is 5 to 50 µm, the softening point of the adhesive layer is 60 to 170 ° C, and the surface resistivity of the adhesive layer is 10 ⁸ to 10 ¹³ Ω / □. Bottom cover tape for component carriers. The bottom cover tape for electronic component carriers according to claim 1 or 2 , wherein the frictional voltage of the adhesive layer is 3000 V or less.

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