SG96676A1 - Bottom cover tape for electronic part carrier - Google Patents

Bottom cover tape for electronic part carrier

Info

Publication number
SG96676A1
SG96676A1 SG200200223A SG200200223A SG96676A1 SG 96676 A1 SG96676 A1 SG 96676A1 SG 200200223 A SG200200223 A SG 200200223A SG 200200223 A SG200200223 A SG 200200223A SG 96676 A1 SG96676 A1 SG 96676A1
Authority
SG
Singapore
Prior art keywords
bottom cover
electronic part
cover tape
part carrier
carrier
Prior art date
Application number
SG200200223A
Inventor
Ichikawa Hiroki
Nakano Ichirou
Araki Kyouichi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG96676A1 publication Critical patent/SG96676A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG200200223A 2001-01-11 2002-01-10 Bottom cover tape for electronic part carrier SG96676A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001003710A JP4573442B2 (en) 2001-01-11 2001-01-11 Bottom cover tape for electronic component carriers

Publications (1)

Publication Number Publication Date
SG96676A1 true SG96676A1 (en) 2003-06-16

Family

ID=18872007

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200223A SG96676A1 (en) 2001-01-11 2002-01-10 Bottom cover tape for electronic part carrier

Country Status (6)

Country Link
JP (1) JP4573442B2 (en)
KR (1) KR20020060618A (en)
CN (1) CN1200062C (en)
MY (1) MY139319A (en)
SG (1) SG96676A1 (en)
TW (1) TW555829B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
JP2004189314A (en) * 2002-12-13 2004-07-08 Nitta Ind Corp Electronic component support
JP3808852B2 (en) * 2003-09-12 2006-08-16 大王製紙株式会社 Carrier tape mount base material
JP2005306460A (en) * 2004-04-26 2005-11-04 Denki Kagaku Kogyo Kk Cover tape and electronic part packaging carrier tape system
JP4766863B2 (en) * 2004-10-22 2011-09-07 電気化学工業株式会社 Cover tape and carrier tape system for packaging electronic components
JP4710072B2 (en) * 2004-06-23 2011-06-29 電気化学工業株式会社 Cover tape
US7704591B2 (en) 2004-04-26 2010-04-27 Denki Kagaku Kogyo Kabushiki Kaisha Cover tape and carrier tape system
JP4444814B2 (en) * 2004-12-28 2010-03-31 信越ポリマー株式会社 Cover tape and electronic component packaging
JP6758801B2 (en) * 2015-03-20 2020-09-23 株式会社サンエー化研 Surface protective film
JP2018193121A (en) * 2017-05-22 2018-12-06 Koa株式会社 Bottom cover tape
JP7211239B2 (en) * 2018-06-25 2023-01-24 Tdk株式会社 How to store electronic components
JP7324049B2 (en) * 2019-05-24 2023-08-09 株式会社ダイセル semiconductor equipment
FR3097869B1 (en) 2019-06-27 2021-11-26 Bostik Sa Polyurethane- (meth) acrylic pressure sensitive hot melt adhesive composition
CN114787052A (en) * 2019-12-10 2022-07-22 住友电木株式会社 Cover tape and electronic component package
JP2021127134A (en) * 2020-02-12 2021-09-02 Koa株式会社 Component storage tape and reel for component packaging

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4645711A (en) * 1985-08-26 1987-02-24 Minnesota Mining And Manufacturing Company Removable pressure-sensitive adhesive tape
EP0150882B1 (en) * 1984-01-30 1989-09-20 National Starch and Chemical Corporation Conductive die attach tape
EP0345492B1 (en) * 1988-06-09 1993-10-06 Minnesota Mining And Manufacturing Company Unrolling low-noise self-adhesive tape and process for the preparation thereof
EP0220885B1 (en) * 1985-10-17 1994-05-04 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive having broad useful temperature range
EP0814140A2 (en) * 1996-06-18 1997-12-29 Hercules Incorporated Pressure sensitive adhesives
JP2000191991A (en) * 1998-12-24 2000-07-11 Nitto Denko Corp Top cover tape for chip type electronic part carrier

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104547A (en) * 1976-02-29 1977-09-02 Tokyo Silicone Kk Antistatic paint
JP2001003014A (en) * 1999-06-16 2001-01-09 Nitto Denko Corp Bottom cover tape for chip type electronic part carrier

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0150882B1 (en) * 1984-01-30 1989-09-20 National Starch and Chemical Corporation Conductive die attach tape
US4645711A (en) * 1985-08-26 1987-02-24 Minnesota Mining And Manufacturing Company Removable pressure-sensitive adhesive tape
EP0220885B1 (en) * 1985-10-17 1994-05-04 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive having broad useful temperature range
EP0345492B1 (en) * 1988-06-09 1993-10-06 Minnesota Mining And Manufacturing Company Unrolling low-noise self-adhesive tape and process for the preparation thereof
EP0814140A2 (en) * 1996-06-18 1997-12-29 Hercules Incorporated Pressure sensitive adhesives
JP2000191991A (en) * 1998-12-24 2000-07-11 Nitto Denko Corp Top cover tape for chip type electronic part carrier

Also Published As

Publication number Publication date
CN1200062C (en) 2005-05-04
TW555829B (en) 2003-10-01
CN1364842A (en) 2002-08-21
KR20020060618A (en) 2002-07-18
MY139319A (en) 2009-09-30
JP2002211677A (en) 2002-07-31
JP4573442B2 (en) 2010-11-04

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