JP4444814B2 - Cover tape and electronic component packaging - Google Patents

Description

  The present invention relates to a cover tape that is used by adhering to a container for storing an electronic component such as an IC chip or a capacitor, and an electronic component package including the cover tape.

Currently, when mounting electronic components, the electronic components are stored in an electronic component storage portion of a container having a concave electronic component storage portion formed on the surface thereof, and sealed with a cover tape to be mounted as an electronic component package. A technique is widely used in which an electronic component is automatically taken out from the electronic component package by a mounting apparatus and used for mounting.
Containers include carrier tapes and trays. As the carrier tape, a punched carrier tape, an embossed carrier tape, a press carrier tape, etc. are generally used.
As the material for the container, polystyrene (PS) resin, polycarbonate (PC) resin, polyphenylene ether (PPE) resin, acrylonitrile / butadiene / styrene copolymer (ABS) resin, and the like are used.

Electronic parts housed in containers, especially active parts such as IC chips, are easily charged by static electricity generated when they come into contact with the container or when the cover tape is peeled off from the container. May cause electrostatic breakdown.
For this reason, various antistatic measures have been proposed in the past, and for example, a method of containing a conductive filler such as carbon black on the surface of the container has been performed.

  Commonly used containers include a mirror surface with a smooth surface and a rough surface with fine irregularities formed on the surface (see, for example, Patent Document 1). In particular, in the case of a container in which a conductive filler is contained on the container surface described above, a rough surface is often used. This is to increase the reliability of the inspection after storing the electronic component. Normally, when the electronic component is stored in the container, an inspection for checking whether the electronic component is accurately stored in the electronic component storing portion is performed. Has been done. In the inspection, usually, the electronic component storage unit is irradiated with light, and the electronic component is confirmed using a CCD camera. However, if the container surface is a mirror surface, the light is reflected, and as a result, the reliability of the inspection is lowered. Therefore, a rough surface is used to prevent the reflection.

On the other hand, as a cover tape, what is provided with the base material sheet and the sealing layer provided on this base material sheet is generally used. By adhering such a cover tape to the container by heat sealing or the like, the electronic component storage unit is sealed to obtain an electronic component package.
In the electronic component package, for example, if the sealing strength (peeling strength) between the container and the cover tape is small, there is a problem that the cover tape is peeled off during transportation. The cover tape cannot be peeled off smoothly, and problems such as tearing of the cover tape and popping up of electronic parts due to impact at the time of peeling occur, so the peel strength must be adjusted within a specified range with high accuracy. Is required.
The peel strength is adjusted by selecting the material of the sealing layer of the cover tape in consideration of the material and surface state of the container.
JP 2002-173194 A

  However, immediately after sealing, while showing a predetermined appropriate peel strength, the peel strength decreases with time, and the peel strength becomes insufficient, or conversely the peel strength increases, There was a problem that it exceeded the peel strength.

  This invention is made | formed in view of the said situation, Comprising: It aims at providing the cover tape and electronic component package which can maintain the peeling strength in a predetermined range for a long time.

As a result of intensive studies, the inventor has an influence of the surface state of the container as one of the causes of the decrease or increase of the peel strength. For example, when the container surface is rough, the peel strength is high due to the anchoring effect due to the unevenness. However, since the throwing effect changes depending on environmental conditions such as temperature and humidity, the peel strength decreases and the cover tape peels off naturally, or the peel strength increases significantly. The present invention has found that the above-mentioned problems can be solved by a cover tape having peel strengths within a specific range when sealed to two types of sealing surfaces of the same material and different surface roughness. Was completed.
That is, the cover tape of the present invention is a cover tape that is bonded to a container having an electronic component storage section by heat sealing, and satisfies the following formulas (1) to (3).
0.05 ≦ f1 ≦ 0.50 N / mm (1)
0.10 ≦ f2 ≦ 1.00 N / mm (2)
f1 <f2 (3)
[Wherein f1 is a peel strength (JIS C 0806-3) measured at a peeling speed of 300 mm / min when heat-sealed to a surface having a surface roughness Ra (JIS B-0601) of less than 0.1 μm. ), And f2 is a peel strength measured at a peeling speed of 300 mm / min when the Ra is heat-sealed to a surface of 0.1 μm or more and less than 0.5 μm (JIS C 0806-3). Represents the initial value of. ]
A first aspect of the electronic component package of the present invention includes the cover tape of the present invention and a container to which the cover tape is bonded, and the surface roughness Ra (JIS B-0601) of the sealing surface of the container is It is 0.1 μm or more and less than 0.5 μm.
A second aspect of the electronic component package of the present invention includes the cover tape of the present invention and a container to which the cover tape is bonded , and the container is obtained by molding a sheet . The surface roughness Ra (JIS B-0601) of the sealing surface is 0.1 μm or more and less than 0.5 μm, and Ra on the back surface of the sealing surface is less than 0.1 μm.

  According to the present invention, a cover tape and an electronic component package capable of maintaining a peel strength within a predetermined range for a long time are provided.

[Cover tape]
The cover tape of the present invention satisfies the above formulas (1) to (3). Thereby, when the said cover tape is sealed to a container and it is set as an electronic component package, the peeling strength between a cover tape and a container becomes in a predetermined range over a long period of time.
Here, the “within a predetermined range” peel strength is a range suitable for an electronic component package, for example, the cover tape does not peel off during transportation or storage, and at the same time, the cover tape can be smoothly removed from the container during mounting. It is the peel strength that can be peeled. The range of the peel strength varies depending on the material of the sheet. For example, the range from the time when the cover tape is sealed in a container to form an electronic component package until the electronic component package is used for mounting, for example, JIS C In accordance with 0806-3, it is preferable that the peel strength measured at a peeling speed of 300 mm / min is always in the range of 0.15 to 1.00 N / mm, preferably 0.30 to 0.80 N / mm More preferably, it is in the range of mm.

In the formulas (1) to (3), f1 is a peel strength (measured at a peeling speed of 300 mm / min when the surface roughness Ra (JIS B-0601) is sealed on a surface of less than 0.1 μm ( This represents an initial value of JIS C 0806-3), and f2 is a peel strength (JIS C) measured at a peeling speed of 300 mm / min when Ra is sealed on a surface of 0.1 μm or more and less than 0.5 μm. Represents the initial value of 0806-3).
“Surface roughness Ra” can be measured by using a surface roughness measuring device such as “Surfcom 480A” manufactured by Tokyo Seimitsu in accordance with JIS B-0601.
“Peel strength” can be measured at a peeling speed of 300 mm / min in accordance with JIS C 0806-3, for example, using a peel measuring device such as “VG-20” manufactured by Vanguard.
In the present invention, the “initial value of peel strength” is the peel strength measured after the cover tape is sealed and left for 24 hours at 23 ° C. and 40% RH.

The peel strength f1 is the peel strength with respect to the seal surface having a surface roughness Ra of less than 0.1 μm, and this is the adhesion between the material constituting the seal surface of the container and the material constituting the seal layer of the cover tape. Indicates. On the other hand, the peel strength f2 is the peel strength with respect to the sealing surface of the same material as described above and having a surface roughness Ra of 0.1 μm or more and less than 0.5 μm, and this is a state where it is actually used as an electronic component package. The adhesion between the container and the cover tape, that is, the adhesion between the material constituting the sealing surface of the container and the material constituting the sealing layer of the cover tape, and the anchoring effect due to the irregularities on the surface of the container are shown.
When the peel strength f1 is within the predetermined range, and at the same time, the peel strength f2 is within the predetermined range, and f1 <f2, the peel strength within the predetermined range, which is the effect of the present invention, can be maintained for a long time. If f1 exceeds the upper limit of the predetermined range, the peel strength becomes too high. Conversely, if f1 is lower than the lower limit of the predetermined range, the peel strength decreases with time.
In the present invention, in particular, in the measurement of f1 and f2, when a container having Ra of the sealing surface of 0.1 μm or more and less than 0.5 μm and Ra of the back surface of less than 0.1 μm is used, the f1 is It is preferable because it can be measured on the sealing surface of the container and the f2 can be measured on the back surface of the container.

The peel strength can be adjusted by adjusting the adhesive strength of the seal layer described later.
The adhesive strength of the seal layer includes the type of thermoplastic resin contained in the seal layer and the composition of other components, the thickness of the seal layer, and the thermocompression bonding conditions when sealing the cover tape (sealing temperature, sealing pressure, and sealing time). It can be adjusted by etc. For example, methods for increasing the adhesive strength include methods such as selecting a thermoplastic resin having high adhesive strength, adding a tackifier, and increasing the thickness of the seal layer.

  The configuration of the cover tape is not particularly limited as long as it can seal an electronic component storage portion of a container such as a carrier tape, and may be the same configuration as a generally used cover tape. As such a cover tape, what is roughly comprised from the base material and the sealing layer provided on this base material can be illustrated.

As a base material, what is normally used as a base material of a cover tape is employable. Although not particularly limited, an insulating polymer film that has sufficient strength not to be cut when peeled from the carrier tape and excellent in dimensional stability against the environment and heat is preferably used.
Examples of such a polymer film include polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyethylene, polyamide, polycarbonate, polyimide, polyetherimide, polyamideimide, polyethersulfone, polysulfone, polyphenylene sulfide, polyarylate, and modified products thereof. Examples thereof include a film and a composite film in which these are combined.
Examples of the polymer modified product include a polymer alloy obtained by combining two or more kinds of polymers. The polymer alloy is obtained by blending different polymers, and examples of the compatibilizer used for blending include block copolymers and graft copolymers in which the different polymers are chemically bonded.
Examples of the composite film include a film obtained by laminating two or more kinds of the above exemplified films, and a film obtained by laminating any one of the above films and a known film other than the above. When the film is combined, known processes such as a roughening process, a corona discharge process, a plasma discharge process, a primer process, and an anchor coat process can be performed on the bonded surface in advance.
Among these, polyethylene terephthalate is preferable from the viewpoints of strength, heat resistance, and transparency.
Moreover, as a base material, a biaxially stretched film is preferable from the point of the intensity | strength of a cover tape, and a biaxially stretched polyethylene terephthalate film is especially preferable from the point of intensity | strength, heat resistance, and transparency.

  Although the thickness of a base material is not specifically limited, About 12-150 micrometers is preferable. If the substrate thickness is less than 12 μm, sufficient peel strength cannot be obtained, and if it is intermittently peeled off at a speed of 20 to 50 m / sec, there is a risk of being cut. In addition, it takes time for heat conduction during sealing, which is disadvantageous for high-speed sealing.

  The structure on the outer surface (surface opposite to the seal layer forming surface) side of the substrate is not particularly limited, and an antistatic layer made of a surfactant, a moisture permeation preventing layer made of a silicon dioxide thin film, etc. are necessary. It may be provided accordingly.

The seal layer is a layer containing a thermoplastic resin necessary when the cover tape is thermocompression bonded to a container such as a carrier tape described later, and is activated by adhesion under sealing conditions during thermocompression bonding.
As this sealing condition, for example, using a trowel having a width of 0.3 to 1.0 mm and a length of 10 to 50 mm, a surface temperature of 120 to 200 ° C., a pressure of 1 to 5 g / mm ² , and 50 to 100 times per minute. An example in which the pressing is repeated 1 to 5 times in this cycle can be given.
In addition, the sealing layer preferably has a bonding strength that does not vary depending on the conditions of thermocompression bonding and has a low dependency on the sealing temperature. When the temperature difference between the bonding conditions during low-temperature bonding and high-temperature bonding is 60 ° C. or more Even so, it is preferable that the variation in the adhesive strength is not more than 4 times, preferably not more than 3 times the strength at the time of high-temperature adhesion and low-temperature adhesion.

Specific examples of the thermoplastic resin that forms the sealing layer include polyamide resins, polyurethane resins, polyester resins, styrene resins, styrene thermoplastic elastomers, ethylene / vinyl acetate copolymers, and ethylene / vinyl alcohol systems. Examples thereof include ethylene resins such as resins, ethylene / vinyl acetate / acrylate copolymers, ethylene / methyl (meth) acrylate copolymers, ethylene / ethyl acrylate copolymers, and ethylene / ethyl acrylate copolymers. .
Of the thermoplastic resins, in view of the relationship with the material of the container described above, styrene resins, ethylene resins, copolymer resins thereof, and mixtures thereof are preferable.
Examples of styrene resins include polystyrene, styrene-butadiene block copolymer (SBS) and hydrogenated product (SEBS), styrene-butadiene graft copolymer, styrene-ethylene graft copolymer, styrene-acrylic copolymer, and the like. Is mentioned.

  The seal layer may contain a tackifier, an antistatic agent, an antiblocking agent and the like in addition to the thermoplastic resin.

  Although the film thickness of a sealing layer is not specifically limited, 1-50 micrometers is preferable and 5-30 micrometers is more preferable. If the film thickness is less than 1 μm, sufficient adhesive strength may not be maintained, and if it exceeds 50 μm, the peel strength becomes too high, and the peel strength within the predetermined range in the present invention may not be obtained.

The cover tape of the present invention may have an intermediate layer between the base material and the seal layer.
For example, an intermediate layer made of an elastic body (specifically, polyethylene, ethylene / vinyl alcohol copolymer, styrene-based, amide-based, or ester-based thermoplastic elastomer) having a shear modulus smaller than that of the base material ( By providing the cushion layer), it is possible to improve the contact of the thermocompression bonding iron at the time of sealing and to obtain a stable adhesion. In this case, the thickness of the intermediate layer is preferably 1 to 80 μm, and more preferably 10 to 60 μm.
Moreover, you may mix | blend an antistatic agent with an intermediate | middle layer. As a result, an antistatic function is imparted, and the peeling charge generated when the cover tape is peeled from the container can be reduced.

The method for forming the seal layer on the substrate is not particularly limited, and for example, a known extrusion method or coating method can be used.
Examples of the extrusion molding method include the following methods.
1) The resin constituting the seal layer is formed into a desired thickness by the T-die method or the inflation method, and the obtained seal layer is previously coextruded with a polyethylene terephthalate (PET) film and an intermediate layer as a cushion layer. A method for obtaining a cover tape by laminating and laminating laminated films.
Here, the sealing layer and the laminated film are laminated by using a dry laminate or a modified olefin, an ethylene-vinyl acetate copolymer (EVA), SBS, polyethylene (PE) or the like as an adhesive layer as the intermediate layer and the sealing layer. Can be performed by sandwich lamination.
2) A method in which an intermediate layer and a seal layer are coextruded with a multilayer extruder using a PET film as a base material and laminated and integrated. At this time, it is possible to use a PET film that has been subjected to an easy adhesion treatment. From the viewpoint of adhesiveness between the intermediate layer and the intermediate layer.

  In addition, a cover tape becomes a final product by cut | disconnecting the original fabric obtained after sealing layer formation to the desired width | variety of several to several dozen mm, and winding up on a reel.

"Electronic parts packaging"
The electronic component package of the present invention includes the above-described cover tape of the present invention and a container to which the cover tape is adhered, and the surface roughness Ra (JIS B-0601) of the sealing surface of the container is 0.1 μm or more. It is less than 0.5 μm, and Ra on the back surface thereof is less than 0.1 μm.
By using a container having a surface roughness Ra (JIS B-0601) of 0.1 μm or more and less than 0.5 μm and a Ra of the back surface of less than 0.1 μm as the container, The feeding operation is stable when being stored in the container, and it is possible to prevent erroneous detection due to the projection of the electronic component on the inner wall surface of the container when inspecting whether the electronic component is accurately stored in the electronic component storage part. it can. Further, such a container can be used as it is for the measurement of f1 and f2 in the cover tape of the present invention.

A commercially available container may be used or manufactured as the container having the surface roughness Ra. As a method for producing such a container, a known method can be used. For example, when a container is made from a sheet, it can be obtained by molding the sheet by a general molding method such as an extrusion molding method or a calendar molding method.
For example, as an example of the extrusion molding method, when the resin melted and discharged from the T-die is sandwiched between two cooling rolls and solidified by cooling, the surface roughness of each cooling roll is set appropriately. Thereby, the sheet | seat used for the container which has the said surface roughness Ra is obtained. This sheet can be imparted with antistatic property or conductivity by kneading an antistatic agent, a conductive filler, a conductive polymer or the like, or coating the surface. Further, this sheet can be selected from either a single layer configuration or a multilayer configuration.
The material of the container is not particularly limited, and polystyrene, polycarbonate, polyester, polypropylene, polyacrylonitrile, styrene block copolymer, acrylonitrile-butadiene-styrene copolymer (ABS resin), polyphenylene ether, a mixture or alloy thereof, or the like. Is mentioned.
There is no restriction | limiting in particular as a shape of a container, For example, a carrier tape, a tray, etc. are mentioned. As the carrier tape, generally, an electronic component housing portion is formed. (1) A punched carrier tape in which a part of a sheet is removed by punching and a bottom tape is attached to the back surface of the sheet to form a recess. There is an embossed carrier tape in which a concave portion is formed by embossing a part of a plastic sheet into a concave shape, and (3) a press carrier tape in which a concave portion is formed by compressing a part of the sheet. As a method for forming the embossed carrier tape, there are press forming, vacuum forming, pressure forming, and the like. By these forming methods, an electronic component storage portion (emboss) having a desired concave shape can be formed. At this time, the sheet surface roughness Ra may change due to preheating or the like during molding. In that case, it is necessary to appropriately adjust the surface roughness Ra of the container at the time of forming the container.

In the electronic component package of the present invention, for example, after electronic components and the like are stored in the electronic component storage portion of the container, this is aligned with the cover tape, and both edges in the longitudinal direction of the cover tape are 0.3 to 1 respectively. It can be manufactured by continuously sealing and packaging with a width of 0.0 mm and winding it on a reel. Electronic parts and the like are stored or transported in the form of this package.
The electronic parts and the like stored in the carrier tape are peeled off the cover tape intermittently while the package is being transported through the feed holes provided along both edges in the longitudinal direction of the carrier tape. It can be taken out while checking the presence, orientation, and position of electronic components.

As described above, the cover tape of the present invention can maintain the peel strength within a predetermined range for a long time. For example, the surface roughness Ra of the sealing surface of the container to which the cover tape is bonded is 0.1 μm or more. In the case of a rough surface of less than 5 μm, it is possible to effectively prevent a problem due to a decrease in peel strength which has been conventionally observed.
Therefore, if the cover tape of the present invention and the electronic component package of the present invention obtained using the cover tape of the present invention are used, transportation and storage due to the peel strength of the cover tape changing outside the predetermined range. Troubles during installation and mounting can be suppressed.

EXAMPLES Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to this.
Production Example 1 (Preparation of sheet)
A multilayer (three-layer structure) sheet was formed using the following materials.
Material 1: HIPS (475D; manufactured by PS Japan)
Material 2: Conductive compound (Rioconduct S-1365; manufactured by Toyo Ink Co., Ltd.)
A three-layer sheet having Material 1 as an intermediate layer and Material 2 as a surface layer, using a multilayer extrusion molding machine, the layer ratio is 0.3 mm thick with the ratio of surface layer: intermediate layer: surface layer = 1: 8: 1 Molded.
At that time, a plurality of cooling rolls having a mirror surface and a rough surface were prepared, and the three-layer sheet was formed using these cooling rolls.
Thereby, a sheet (S1) having a thickness of 0.3 mm was obtained.

Production Example 2 (Preparation of sheet)
A single layer sheet was formed using the following materials.
SBS (Asaflex 825; manufactured by Asahi Kasei Chemicals Corporation): 60 wt%
GPPS (HF77; manufactured by PS Japan): 30 wt%
HIPS (475D; manufactured by PS Japan): 10 wt%
A sheet (S2) was obtained by molding to a thickness of 0.3 mm using a single layer extrusion molding apparatus.

Production Example 3 (Preparation of container)
Using the slit sheet obtained by slitting the sheet (S1) obtained in Production Example 1 to a width of 24 mm, the pocket size is 10.5 mm × 10.5 mm, the depth is 2.5 mm, and the pocket arrangement pitch is A 20 mm container (embossed carrier tape) (T1) was obtained.

Production Example 4 (Preparation of container)
Using the slit sheet obtained by slitting the sheet (S2) obtained in Production Example 2 to a width of 24 mm, the pocket size is 10.5 mm × 10.5 mm, the depth is 2.5 mm, and the pocket arrangement pitch is A 20 mm container (embossed carrier tape) (T2) was obtained.

Production Example 5 (Preparation of cover tape)
Seal layer constituent resin consisting of 85 wt% of hydrogenated styrene elastomer (L610; manufactured by Asahi Kasei Chemicals Co., Ltd.) and 15 wt% of polyethylene (KC570; manufactured by Nippon Polyethylene Co., Ltd.) and LDPE resin in a two-layer configuration Extrusion was performed to form a seal layer base film [the thickness of the seal layer base film: 25 μm (the thickness of the seal layer is 15 μm + the thickness of the LDPE layer is 10 μm)].
A base film in which an LDPE resin layer (thickness 15 μm) is provided on a biaxially stretched PET film (thickness 16 μm) and the above-mentioned sealing layer base film are extrusion sandwich laminated (film thickness 10 μm) with the LDPE resin layer, and the total A cover tape A having a thickness of 66 μm was obtained.

Production Example 6 (Preparation of cover tape)
As in Example 1, except that a resin composed of 70% by weight of VMX (Z120F; manufactured by Mitsubishi Chemical Corporation) and 30% by weight of polyethylene (KC370F; manufactured by Nippon Polyethylene Co., Ltd.) was used as the sealing layer constituting resin. Cover tape B was obtained.

  Reference Examples 1 and 2 and Examples 1 to 4 were performed using the sheets S1 and S2, the containers T1 and T2, and the cover tapes A and B obtained in the above-described production 1 to 6.

Reference examples 1 and 2
<Evaluation method>
[Surface roughness]
About the sheet | seat obtained by manufacture example 1,2, the surface roughness Ra1 of the mirror surface side and the surface roughness Ra2 of the rough surface side were measured based on JIS B-0601 using "Surfcom480A" made by Tokyo Seimitsu. did. The same measurement was performed three more times.
[Peel strength]
Sealing conditions Using a sealing machine “VS-120” manufactured by Vanguard Co., Ltd., sealing was performed on the mirror surface side and the rough surface side of the sheet obtained in each production example under the sealing conditions shown in Table 1.
-Initial value After being sealed and left for 24 hours under conditions of 23 ° C. and 40% RH, JIS C 0806 was peeled off at a peeling rate of 300 mm / min using a vanguard peel measuring device “VG-20”. The peel strength measured according to 3 (the peel strength on the mirror surface side is f1 and the peel strength on the rough surface side is f2) was measured.
-Measured value after environmental test The cover tape was sealed to a sheet in the same manner as in the above "sealing conditions", stored in a gear oven at 50 ° C for 168 hours, and then peel strength was measured in the same manner as in the above "initial value".
The results are shown in Table 2.

Examples 1-4
The cover tapes A and B obtained in Production Examples 5 and 6 were each subjected to the container T1 obtained in Production Examples 3 and 4 under the sealing conditions shown in Table 3 using a sealing machine “VS-120” manufactured by Vanguard. , T2 was sealed on the mirror surface side and the rough surface side to produce an electronic component package.

The electronic component package obtained in Examples 1 to 4 was evaluated based on the following evaluation method.
<Evaluation method>
[Roughness of container surface]
For the containers obtained in Production Examples 3 and 4, the surface roughness Ra1 on the mirror surface side and the surface roughness Ra2 on the rough surface side are measured according to JIS B-0601 using “Surfcom 480A” manufactured by Tokyo Seimitsu. did. The same measurement was performed three more times. The surface roughness of the container was measured on the sealing surface to which the cover tape was adhered.
[Peel strength]
-Initial value After sealing, the sample was allowed to stand for 24 hours under conditions of 23 ° C and 40% RH, and then measured in the same manner as in Test Example 1 above.
-Measured value after environmental test After being stored in a gear oven at 50 ° C for 168 hours, it was evaluated in the same manner as the initial value.
The results are shown in Table 4.

As is apparent from the results, the cover tapes A and B satisfying the initial peel strength values of 0.05 ≦ f1 ≦ 0.50 N / mm, 0.10 ≦ f2 ≦ 1.00 N / mm, and f1 <f2. The peel strength of the electronic component package obtained using the cover tapes A and B was suitable as an electronic component package before and after the environmental test.

Claims (3)

A cover tape that is bonded to a container having an electronic component storage portion by heat sealing, and satisfies the following formulas (1) to (3).
0.05 ≦ f1 ≦ 0.50 N / mm (1)
0.10 ≦ f2 ≦ 1.00 N / mm (2)
f1 <f2 (3)
[Wherein f1 is a peel strength (JIS C 0806-3) measured at a peeling speed of 300 mm / min when heat-sealed to a surface having a surface roughness Ra (JIS B-0601) of less than 0.1 μm. ), And f2 is a peel strength measured at a peeling speed of 300 mm / min when the Ra is heat-sealed to a surface of 0.1 μm or more and less than 0.5 μm (JIS C 0806-3). Represents the initial value of. ]   A cover tape according to claim 1 and a container to which the cover tape is adhered, wherein the surface roughness Ra (JIS B-0601) of the sealing surface of the container is 0.1 μm or more and less than 0.5 μm. Electronic component packaging as a feature. A cover tape according to claim 1 and a container to which the cover tape is adhered, the container being obtained by molding a sheet, and a surface roughness Ra (JIS B- 0601) is 0.1 μm or more and less than 0.5 μm, and Ra on the back surface of the sealing surface is less than 0.1 μm.