JP2021176758A - Cover tape for packaging electronic component and package - Google Patents

Abstract

To provide a cover tape prevented in sticking of an electronic component to the cover tape when peeling the cover tape from a carrier tape, when a package is exposed to an environment of high temperature and high humidity in storing or transporting the package.SOLUTION: A cover tape 1 for packaging an electronic component has a substrate layer 2, a heat seal layer 3 arranged on one face side of the substrate layer, and an anti-static layer 4 arranged on a face side opposite to the face side of the heat seal layer side of the substrate layer. A surface resistivity of the cover tape measured from the anti-static layer side after wet heat load of storing a package using a paper carrier tape for 24 hours at 60°C, 95%RH is 1×1010 Ω/sq. or less, and surface tack force of the cover tape measured from the heat seal layer side after the wet heat load of storing the package using the paper carrier tape for 24 hours at 60°C, 95%RH is 5 gf or less.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a cover tape for packaging electronic components and a packaging body using the same.

In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric element registers are taped and packaged and used for surface mounting. In taping packaging, after storing electronic parts in a carrier tape having a plurality of storage portions for storing electronic parts, the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic parts. Further, when mounting the electronic component, the cover tape is peeled off from the carrier tape, and the electronic component is automatically taken out and surface-mounted on the substrate. The cover tape is also called a top tape.

It has been pointed out that electronic components adhere to the cover tape during surface mounting (see, for example, Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 10-9548 Japanese Unexamined Patent Publication No. 2004-25570

The inventors of the present disclosure, etc., when the package is stored or transported, even if there is no problem when the package is stored or transported in a sufficiently controlled normal temperature and humidity environment. It was found that when exposed to a high temperature and high humidity environment, there is a problem that electronic components adhere to the cover tape when the cover tape is peeled from the carrier tape.

The present disclosure may be referred to as a phenomenon in which electronic components adhere to the cover tape when the package is stored or transported in a high temperature and high humidity environment (hereinafter, referred to as "adhesion phenomenon due to high temperature and high humidity"). It is an object of the present invention to provide a cover tape for packaging electronic parts which can suppress the above.

In one embodiment of the present disclosure, the base material layer, the heat seal layer arranged on one surface side of the base material layer, and the surface side of the base material layer opposite to the surface of the base material layer on the heat seal layer side. A cover tape for packaging electronic parts having an arranged antistatic layer, which is stored for 24 hours in an environment of 60 ° C. and 95% RH in the state of a package using a paper carrier tape. The surface resistance of the tape measured from the antistatic layer side is 1 × 10 ¹⁰ Ω / □ or less, and the package is stored in a package using paper carrier tape in an environment of 60 ° C. and 95% RH for 24 hours. This is a cover tape for packaging electronic parts, which has a surface tack force of 5 gf or less measured from the heat seal layer side of the cover tape after a moist heat load.

In one embodiment of the present disclosure, the surface tack force measured from the heat seal layer side of the cover tape after the moist heat load is measured from the heat seal layer side of the cover tape before the moist heat load. The above-mentioned cover tape for packaging electronic components, which has a tack force of 80% or less.

In one embodiment of the present disclosure, the carrier tape having a plurality of storage portions for storing electronic components, the electronic components stored in the storage portions, and the electronic component packaging arranged so as to cover the storage portions. It is a packaging body provided with a cover tape for use.

According to the cover tape for packaging electronic components of the present disclosure, the adhesion phenomenon due to high temperature and high humidity can be suppressed. Therefore, by using the cover tape for packaging electronic components and the packaging body of the present disclosure, it is possible to improve the mounting of electronic components.

It is the schematic cross-sectional view which illustrates the cover tape for electronic component packaging of this disclosure. It is a schematic plan view and a cross-sectional view which exemplify the package body of this disclosure. It is the schematic cross-sectional view which illustrates the cover tape for electronic component packaging of this disclosure.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings and the like. However, the present disclosure can be implemented in many different embodiments and is not construed as limited to the description of the embodiments illustrated below. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual form, but this is just an example and the interpretation of the present disclosure is limited. It's not something to do. Further, in the present specification and each figure, the same elements as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and detailed description thereof may be omitted as appropriate.

In the present specification, when expressing the mode of arranging another member on one member, when it is simply described as "above" or "below", it is in contact with a certain member unless otherwise specified. Including the case where another member is arranged directly above or directly below, and the case where another member is arranged above or below a certain member via another member. Further, in the present specification, when expressing the mode of arranging another member on the surface of a certain member, when simply expressing "on the surface side" or "on the surface", unless otherwise specified, the certain member is used. It includes both the case where another member is arranged directly above or directly below the member so as to be in contact with each other, and the case where another member is arranged above or below one member via another member. Further, in the present specification, unless otherwise specified, the numerical value is an average value after excluding specific values.

Hereinafter, the cover tape for packaging electronic components and the packaging body of the present disclosure will be described in detail. In this specification, the "cover tape for packaging electronic components" may be simply referred to as a "cover tape".

A. Cover tape for packaging electronic components The cover tape of the present disclosure is opposite to the surface of the base material layer, the heat seal layer arranged on one surface side of the base material layer, and the surface of the base material layer on the heat seal layer side. It has an antistatic layer arranged on the surface side. The cover tape is stored in a package using a paper carrier tape in an environment of 60 ° C. and 95% RH for 24 hours. The surface resistivity of the cover tape measured from the antistatic layer side of the cover tape after a wet heat load is determined. It is 1 × 10 ¹⁰ Ω / □ or less. The cover tape is stored in a package using a paper carrier tape in an environment of 60 ° C. and 95% RH for 24 hours. The surface tack force measured from the heat seal layer side of the cover tape after a moist heat load is 5 gf. It is as follows.

The cover tape of the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of the cover tape of the present disclosure. As shown in FIG. 1, the cover tape 1 of the present disclosure is arranged on one surface side of the base material layer 2 and the base material layer 2, and the heat seal layer 3 and the heat seal layer 3 side of the base material layer 2 are arranged. It has an antistatic layer 4 arranged on the surface side opposite to the surface of the surface.

In the present disclosure, for example, as shown in FIG. 2, an intermediate layer 5 may be arranged between the base material layer 2 and the heat seal layer 3, if necessary. Although not shown, an adhesive layer may be arranged between the base material layer 2 and the intermediate layer 5. Further, although not shown, even if a second antistatic layer different from the antistatic layer 4 or an antistatic layer is arranged on the surface side of the heat seal layer 3 opposite to the surface on the base material layer 2 side. good.

The cover tape 1 of the present disclosure has a surface resistivity of 1 × 10 ¹⁰ Ω / □ or less measured from the antistatic layer 4 side after a predetermined moist heat load, and is measured from the heat seal layer 3 side after a predetermined moist heat load. The surface tack force applied is 5 gf or less.

The surface resistivity is the electrical resistivity per unit area of the surface, and is also called the sheet resistivity or the surface resistivity. The surface resistivity is measured by the method described in [Measurement of surface resistivity] of the embodiment described later. The surface resistivity measured from the antistatic layer side after the moist heat load is the surface of the antistatic layer side of the cover tape where the cover tape is not heat-sealed after the cover tape is peeled off from the package after the moist heat load, which will be described later. It is a value measured in.

The surface tack force is the adhesive force per unit area of the surface. The surface tack force is measured by the method described in [Measurement of surface tack force] of the embodiment described later. The surface tack force measured from the heat-sealed layer side after the moist heat load is the surface of the cover tape on the heat-sealed layer side where the cover tape is not heat-sealed after the cover tape is peeled off from the package after the moist heat load, which will be described later. It is a value measured in.

In the present disclosure, the moist heat load is a load given by storing the cover tape in the state of a package obtained by heat-sealing the cover tape on a paper carrier tape in an environment of 60 ° C. and 95% RH for 24 hours. The conditions for the moist heat load will be described in [Method for producing a package] and [Method for moist heat load] in Examples described later.

Electronic components are packed as packaging at the electronic component manufacturing plant. Ideally, the packaging should be stored and transported in a well-controlled environment of normal temperature and humidity so as not to be in a high temperature and high humidity environment. However, in reality, it is difficult to adequately control all environments such as warehouses, the inside of transportation facilities and containers, and factories that use electronic components, and they are stored and transported in hot and humid areas and seasons. In some cases, the packaging may be exposed to a hot and humid environment. Carrier tapes are roughly classified into plastic carrier tapes made of plastic and paper carrier tapes made of paper. Paper carrier tapes generally absorb moisture more easily than plastic carrier tapes, and are affected by high temperature and high humidity environments. Easy to receive. Therefore, dealing with the adhesion phenomenon due to high temperature and high humidity is an important issue.

The inventors of the present disclosure faced a problem that it is difficult to further reduce the adhesion phenomenon due to high temperature and high humidity to some extent by imparting antistatic performance to the cover tape. Therefore, as a result of diligent studies, the inventors of the present disclosure have found that it is important that the surface tack force measured from the heat seal layer side after a predetermined moist heat load is 5 gf or less. Even if only the surface tacking force is reduced in a state where the antistatic performance is insufficient, the contribution of static electricity is large, so that the adhesion phenomenon due to high temperature and high humidity cannot be reduced.

Further, in order to suppress the generation of static electricity when the cover tape and the carrier tape are peeled off, it is considered that it is most effective to add an antistatic agent to the heat seal layer to be the peeling surface. However, since the performance of antistatic agents generally deteriorates in a high temperature and high humidity environment, if an attempt is made to sufficiently suppress the generation of static electricity during peeling in a high temperature and high humidity environment, a normal antistatic agent is used as a heat seal layer. It is necessary to add a large amount of antistatic agent such as a conductive polymer or conductive inorganic particles to the heat seal layer.

Therefore, when the inventors of the present disclosure try to obtain a desired antistatic performance by adding an antistatic agent only to the heat seal layer, a predetermined moist heat load is ensured while ensuring the desired heat seal performance. We faced the problem that it was difficult to adjust the surface tack force measured from the heat seal layer side later. At that time, since the surface of the paper carrier tape is generally larger than that of the plastic carrier tape, it is difficult to secure the heat seal strength, and since it easily absorbs moisture, the heat seal strength tends to decrease due to humidity. As a result, it was found that the above-mentioned problem is more prominent.

Therefore, as a result of further diligent studies, the inventors of the present disclosure have arranged an antistatic layer on the surface opposite to the surface of the base material layer on the heat seal layer side, and the cover tape after a predetermined moist heat load. It was found that it is important that the surface resistivity measured from the antistatic layer side of the above is 1 × 10 ¹⁰ Ω / □ or less. Even when the antistatic layer is provided on the surface opposite to the surface of the base material layer on the heat seal layer side, the surface resistivity is usually measured from the surface of the cover tape on the heat seal layer side. Although it is considered to be focused, the inventors of the present disclosure have measured the surface of the cover tape from the surface on the antistatic layer side in order to reduce the adhesion phenomenon due to high temperature and high humidity while ensuring the desired heat sealing performance. It was found that the resistivity should be focused on.

In the cover tape 1 of the present disclosure, the antistatic layer 4 is arranged on the surface opposite to the surface of the base material layer 2 on the heat seal layer 3 side, and the surface is measured from the antistatic layer 4 side after a predetermined moist heat load. The resistivity is 1 × 10 ¹⁰ Ω / □ or less. Generally, it is said that good antistatic performance can be obtained when the surface resistivity is 1 × 10 ^{10 Ω / □ or less.} If the antistatic performance on the antistatic layer 4 side is set to that level, even if the antistatic performance on the heat seal layer 3 side does not reach that level, the adhesion phenomenon due to high temperature and high humidity can be suppressed, and the adhesion phenomenon can be suppressed. Since the restriction on the use of the antistatic agent added to the heat seal layer 3 is eliminated or reduced, the surface tack force can be easily adjusted. Surface resistivity measured from the antistatic layer 4 side after a predetermined wet heat load may be a 1 × 10 ⁹ Ω / □ under.

In order to reduce the surface resistivity measured from the antistatic layer 4 side after a predetermined moist heat load to 1 × 10 ¹⁰ Ω / □ or less, an antistatic agent that is not easily decomposed or deteriorated by heat or humidity is added to the antistatic layer. It can be adjusted by doing. Examples of such an antistatic agent include a conductive polymer, a polymer-type surfactant, and conductive inorganic particles. The antistatic layer may be formed only with an antistatic agent. Further, an antistatic agent may be added to a layer other than the main antistatic layer, for example, a base material layer, a heat seal layer, an intermediate layer or an adhesive layer described later, to assist the antistatic layer.

In the cover tape 1 of the present disclosure, the heat seal layer 3 is arranged on the surface opposite to the surface of the base material layer 2 on the antistatic layer 4 side, and the cover tape 1 is measured from the heat seal layer 3 side after a predetermined moist heat load. The surface tack force is 5 gf or less. By reducing the surface tacking force under sufficient antistatic performance, the adhesion phenomenon of high temperature and high humidity is suppressed.

In order to reduce the surface tack force measured from the heat seal layer 3 side after a predetermined moist heat load to 5 gf or less, for example, use a low-viscosity material or a hard material for the heat seal layer, cure the heat seal layer, and heat seal. It can be adjusted by a method such as a constant roughening of the surface of the layer or a thinning of the heat seal layer.

Generally, when the above method is performed, the heat sealing performance tends to decrease even if the surface tacking force decreases. Therefore, in order to secure the desired heat-sealing performance and reduce the surface tacking force to 5 gf or less, a material having better heat-sealing property but high viscosity and hardness and a material having relatively low heat-sealing property but having viscosity and hardness are high. It can be used in combination with low materials. Such material combinations include, for example, a combination of a material having a relatively low melting point and glass transition temperature and a material having a relatively high melting point and glass transition temperature, a combination of a low molecular weight or medium molecular weight material and a high molecular weight material, and a resin. Examples include combinations of materials and inorganic materials.

Specifically, a combination of an ethylene-vinyl acetate-based copolymer having a relatively high vinyl acetate content ratio and an ethylene-vinyl acetate-based copolymer having a relatively low vinyl acetate content ratio, an ethylene-vinyl acetate-based copolymer. Combination of polyethylene (including a copolymer of ethylene and α-olefin), combination of polyethylene (including a copolymer of ethylene and α-olefin) and an olefin-based resin other than polyethylene, olefin-based resin and olefin-based Examples thereof include a combination with a thermoplastic resin other than the resin.

Alternatively, the surface tacking force of the heat-sealing layer can be adjusted by giving priority to ensuring the heat-sealing performance and using a layer other than the heat-sealing layer, for example, an intermediate layer, an adhesive layer, a base material layer, etc., which will be described later. For example, the surface tacking force can be reduced by using a hard material for the layer other than the heat seal layer or reducing the thickness of the layer other than the heat seal layer.

The surface tack force measured from the heat seal layer side of the cover tape after the moist heat load may be lower than the surface tack force before the moist heat load. In general, the layer or material constituting the cover tape is softened or deteriorated by a moist heat load, so that a high-temperature and high-humidity adhesion phenomenon is likely to occur. On the other hand, the tacking force is reduced by the moist heat load, so that the adhesion phenomenon of high temperature and high humidity can be suppressed. The surface tack force after the moist heat load may be 80% of the surface tack force before the moist heat load. As a method of lowering the surface tack force after the moist heat load to be lower than the surface tack force before the moist heat load, for example, a material whose viscosity is lowered or hardened by the moist heat load can be used. For example, an ethylene-vinyl acetate copolymer may become hard due to high crystallinity and orientation due to a moist heat load. Alternatively, the composition containing the heat-crosslinking agent may undergo a heat-crosslinking reaction and become hard due to a moist heat load.

When the cover tape for packaging electronic components of the present disclosure completed by the inventors of the present disclosure and the like in this manner is exposed to a high temperature and high humidity environment when the package is stored and / or transported. Even so, the phenomenon of electronic components adhering to the cover tape (hereinafter, may be referred to as "adhesion phenomenon due to high temperature and high humidity") can be suppressed.

The carrier tape used in combination with the cover tape of the present disclosure is not limited to the paper carrier tape, and may be a plastic carrier tape. The reason why the moist heat load is applied with the paper carrier tape is that the carrier tape, which is more susceptible to the influence of humidity, is used to make the conditions more severe. Further, in an actual environment, although the temperature may reach 60 ° C. or the humidity may reach 95% RH, it is considered that it rarely reaches 60 ° C. 95% RH, but 60 ° C. 95 By storing for 24 hours in an environment of% RH, it is considered that the influence of humidity can be confirmed experimentally in an accelerated manner.

Hereinafter, each configuration of the cover tape of the present disclosure will be described.
The heat seal layer is a layer arranged on one surface side of the base material layer. When the package is manufactured using the cover tape of the present disclosure, the heat seal layer is heat-sealed against the carrier tape, so that the cover tape and the carrier tape are adhered to each other.

The heat seal layer may contain a thermoplastic resin. One kind of thermoplastic resin may be used, or a plurality of kinds of thermoplastic resins may be used. Thermoplastic resins include ethylene-vinyl acetate copolymers, olefin resins such as polyethylene (including copolymers of ethylene and α-olefin) and polypropylene (polymers of polypropylene and α-olefin), and acrylic resins. Examples thereof include resins, polyester resins, polyurethane resins, vinyl chloride-vinyl acetate copolymers, and the like. If necessary, the heat seal layer may contain additives such as a tackifier, an antistatic agent, and an antiblocking agent.

As one specific example of the heat seal layer, a case where a combination of an ethylene-vinyl acetate copolymer and polyethylene is used will be described. If necessary, it may contain an ethylene-vinyl acetate copolymer or a resin other than polyethylene.

The ethylene-vinyl acetate-based copolymer is a copolymer containing at least an ethylene monomer unit and a vinyl acetate monomer unit. The content of ethylene in the ethylene-vinyl acetate copolymer is not particularly limited, but can be 60% by mass or more and 97% by mass or less, and 80% by mass or more and 95% by mass or less. The content of vinyl acetate in the ethylene-vinyl acetate-based copolymer is not particularly limited, but can be 3% by mass or more and 40% by mass or less, and 5% by mass or more and 20% by mass or less. The ethylene-vinyl acetate copolymer may contain a third monomer unit in addition to the ethylene monomer unit and the vinyl acetate monomer unit. The third monomer unit may contain a functional group having an antistatic property. The content of the ethylene-vinyl acetate copolymer in the heat-sealed layer is not particularly limited, but can be 50% by mass or more and 90% by mass or less, and 60% by mass or more and 80% by mass or less. Increasing the content of the ethylene-vinyl acetate copolymer improves the heat sealing performance, but tends to increase the surface tacking force.

Examples of polyethylene include polyethylenes such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. From the viewpoint of ease of mixing with ethylene-vinyl acetate copolymer, low density polyethylene (LDPE, density less than 0.910 to 0.930) and linear low density polyethylene (LLDPE, density 0.910 to 0. 925) can be used. The content of the polyethylene resin in the heat seal layer is not particularly limited, but can be 10% by mass or more and less than 50% by mass, and 20% by mass or more and 40% by mass or less. Increasing the polyethylene content reduces the heat seal performance, but tends to reduce the surface tacking force.

The thickness of the heat seal layer can be, for example, 1 μm or more and 60 μm or less. In the case of paper carrier tape, the thickness of the heat seal layer may be, for example, 10 μm or more and 60 μm or less.
Examples of the method for forming the heat seal layer include a coating method, an inflation method, and a T-die extrusion method.

The antistatic layer is arranged on the surface side of the base material layer opposite to the surface of the base material layer on the heat seal layer side, and is a layer for preventing the cover tape from being charged. The antistatic layer may contain an antistatic agent. Examples of the antistatic agent include conductive polymers, polymer-type surfactants, low-molecular-weight surfactants, and conductive inorganic particles. Examples of the conductive polymer include polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, polyvinylcarbazole and the like. Examples of the polymer-type surfactant include a polymer-type quaternary ammonium salt and the like. The antistatic layer may contain, for example, a binder such as a resin or an additive such as an anti-blocking agent. A crosslinked resin can be used as the binder of the antistatic layer. The thickness of the antistatic layer can be, for example, 0.02 μm or more and 3 μm or less. Examples of the method for forming the antistatic layer include a coating method.

The base material layer is a layer that supports the heat seal layer and the antistatic layer. Examples of the base material layer include polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, nylon 6, nylon 66, and the like. Examples thereof include polyamides such as nylon 610, and polyolefins such as polyethylene, polypropylene and polymethylpentene. If necessary, the base material layer may contain additives such as a filler, a plasticizer, a colorant, and an antistatic agent.

The base material layer may be a single layer, or may be a laminate of a plurality of layers of the same type or different types. Further, the base material layer may be a stretched film or an unstretched film. The base material layer may be subjected to easy-adhesion treatment such as corona discharge treatment, plasma treatment, ozone treatment, frame treatment, preheat treatment, dust removal treatment, thin film deposition treatment, alkali treatment, and sandblast treatment. The thickness of the base material layer can be, for example, 2.5 μm or more and 300 μm or less, 6 μm or more and 100 μm or less, and 12 μm or more and 50 μm or less.

An intermediate layer may be provided between the base material layer and the heat seal layer. The intermediate layer can improve the adhesion between the base material layer and the heat seal layer. Further, the intermediate layer improves the cushioning property, and heat is applied to the heat-sealing layer more uniformly when the cover tape is heat-sealed to the carrier tape. Examples of the material of the intermediate layer include polyolefins such as polyethylene and polypropylene, polyurethane, polyester and the like. The thickness of the intermediate layer can be, for example, 5 μm or more and 50 μm or less.

An adhesive layer may be provided between the base material layer and the intermediate layer. By forming the adhesive layer on the base material layer, the adhesion between the base material layer and the intermediate layer is improved even when the base material layer has poor adhesive strength. Examples of the material of the adhesive layer include acrylic, isocyanate-based, urethane-based, and ester-based adhesives. The thickness of the adhesive layer can be, for example, 0.1 μm or more and 1 μm or less.

The surface resistivity measured from the antistatic layer side of the cover tape before the moist heat load ^{can be 1 × 10 10} Ω / □ or less, and can be less than ^{1 × 10 9 Ω / □.} Further, the surface tack force measured from the heat seal layer side of the cover tape before the moist heat load can be 30 gf or less and 20 gf or less.

The heat seal strength of the cover tape before the wet heat load can be 5 gf or more and 50 fg or less, and 15 gf or more and 40 gf or less. Further, the heat seal strength of the cover tape after a moist heat load can be 5 gf or more and 50 fg or less, and 15 gf or more and 40 gf or less. It is possible to suppress the risk of problems such as peeling when packaging electronic components and the risk of the cover tape being unintentionally peeled during storage or transportation. The heat seal strength is measured by the method described in [Measurement of heat seal strength] of Examples described later.

B. Packaging Body The packaging body of the present disclosure includes a carrier tape having a plurality of storage portions for storing electronic parts, electronic parts stored in the storage parts, and the above-mentioned cover tape arranged so as to cover the storage parts. And. According to the package of the present disclosure, the adhesion phenomenon due to high temperature and high humidity can be suppressed.

3 (a) and 3 (b) are schematic plan views and cross-sectional views showing an example of a package using the cover tape for packaging electronic components of the present disclosure, and FIG. 3 (b) is A of FIG. 3 (a). It is a cross-sectional view taken along the line A. As shown in FIGS. 3A and 3B, the package 10 stores the carrier tape 11 having a plurality of storage portions 12 for storing the electronic components 13, the electronic components 13 stored in the storage portions 12, and the electronic components 13. A cover tape 1 arranged so as to cover the portion 12 is provided. The cover tape 1 is heat-sealed on the carrier tape 11, and heat-sealing portions 3h are provided on both ends of the heat-sealing layer 3 of the cover tape 1 in a line shape with a predetermined width. Further, in the package 10, the carrier tape 11 can have feed holes 14 arranged at a pitch a in one direction.

Hereinafter, each configuration of the package will be described.
Since the cover tape has been described in the above section "A. Cover tape for packaging electronic components", the description thereof is omitted here.

In the package, the heat-sealing layer of the cover tape and the carrier tape are adhered at the heat-sealing portion. The heat-sealing portion can be arranged, for example, in a part of the portion where the heat-sealing layer of the cover tape comes into contact with the carrier tape. That is, the heat seal layer may have a heat seal portion and a non-heat seal portion. Thereby, the peelability of the cover tape with respect to the carrier tape can be improved.

The carrier tape is a member having a plurality of storage portions for storing electronic components. The carrier tape may be any one having a plurality of storage portions, and for example, any of an embossed carrier tape, a punch carrier tape, and a press carrier tape can be used. Examples of the material of the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and paper. In the present disclosure, the term "paper" refers to a paper containing cellulose as a main component, and may further contain a resin component and a small molecule component such as glue or filler.

The electronic components are not particularly limited, and for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element registers, filters, crystal oscillators, crystal oscillators, connectors, switches, etc. Volumes, relays, etc. can be mentioned.

The present disclosure is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same structure as the technical idea described in the claims of the present disclosure and exhibiting the same effect and effect is the present invention. Included in the technical scope of the disclosure.

Examples and comparative examples are shown below, and the present disclosure will be described in more detail.

[Example 1]
As a base material layer, a 25 μm-thick biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having corona treatment on both sides was prepared. Antistatic coating agent (containing PEDOT as a conductive polymer and containing aziridine as a curing agent, Alacoat AS601D / CL910 (mass ratio) = 10/1, manufactured by Arakawa Chemical Co., Ltd., solid content concentration 3 on one surface side of PET film An antistatic layer was formed by applying (0.0%) (Wet application amount 3.5 g / m ^2). Urethane-based anchor coating agent (Takenate A-3075 / Takelac A-3210 (mass ratio) = 3/1 diluted 5% with ethyl acetate Wet application) on the side of the PET film opposite to the side on which the antistatic layer was formed. An amount of 1.0 g / m ² ) was applied to form an adhesive layer. Next, polyethylene (CE4009 manufactured by Sumitomo Chemical Co., Ltd.) and polyethylene (Sumicasen L705 manufactured by Sumitomo Chemical Co., Ltd.) and an ethylene-vinyl acetate copolymer having antistatic performance (Melsen (registered trademark) M (MX53C) Tosoh) are melt-extruded. A material obtained by mixing 40/60 (mass ratio) with (manufactured by the company) was laminated to a thickness of 20 μm each to form an intermediate layer and a heat seal layer, respectively. As a result, the cover tape of Example 1 was produced.

[Example 2]
The heat-sealing layer material in Example 1 is polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) and an ethylene-vinyl acetate composite having antistatic performance (Melsen (registered trademark) M (MX53C) manufactured by Tosoh Co., Ltd.) 20/80. The cover tape of Example 2 was produced in the same manner as in Example 1 except that the mixed material was changed to (mass ratio).

[Example 3]
The heat-sealing layer material in Example 1 is polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) and an ethylene-vinyl acetate composite having antistatic performance (Melsen (registered trademark) M (MX53C) manufactured by Tosoh Co., Ltd.) 60/40. The cover tape of Example 3 was produced in the same manner as in Example 1 except that the mixed material was changed to (mass ratio).

[Example 4]
The heat-sealed layer material in Example 1 was an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 63.2% by mass, low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 26.4. Weight%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 8% by mass, antistatic masterbatch (Rikemaster ELB-347, manufactured by RIKEN Vitamin Co., Ltd. (containing 25% antistatic agent) 2.4% by mass) The cover tape of Example 4 was prepared in the same manner as in Example 1 except that the intermediate layer material in Example 1 was changed to polyethylene resin (Novatec LC600A, manufactured by Nippon Polyethylene Co., Ltd.). bottom.

[Example 5]
The heat-sealed layer material in Example 1 was an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 44.8% by mass, and low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 44.8. Mass%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 8 mass%, antistatic masterbatch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)) 2.4 mass The cover tape of Example 5 was applied in the same manner as in Example 1 except that the mixed material was changed to% and the intermediate layer material in Example 1 was changed to polyethylene resin (Novatec LC600A, manufactured by Nippon Polyethylene Co., Ltd.). Made.

[Example 6]
The heat-sealed layer material in Example 1 was an ethylene-vinyl acetate copolymer (Evaflex EV2350, manufactured by Mitsui Dow Polychemical Co., Ltd.) 78.8% by mass, and low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 8.8. Mass%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 10 mass%, antistatic masterbatch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)) 2.4 mass The cover tape of Example 6 was prepared in the same manner as in Example 1 except that the mixed material was changed to%.

[Comparative Example 1]
The same method as in Example 1 except that the heat seal layer material in Example 1 was changed to an ethylene-vinyl acetate copolymer having antistatic performance (Melsen (registered trademark) M (MX53C) manufactured by Tosoh Corporation). , The cover tape of Comparative Example 1 was prepared.

[Comparative Example 2]
The cover tape of Comparative Example 2 was produced in the same manner as in Example 4 except that the antistatic layer was not provided in the cover tape of Example 4.

[How to make a package]
By using the taping machine below, while continuously arranging 500 of the following electronic components in the cavity of the paper carrier tape below, the paper carrier tape and cover tape are wound up while being heat-sealed under the following conditions. A sample of a roll-shaped package was obtained.

(Production conditions)
Taping machine: NST-35 (manufactured by Nitto Kogyo Co., Ltd.)
Paper carrier tape: Hokuetsu Corporation 0.31mmt 8mm width (virgin paper)
Paper carrier tape feed hole pitch: 2 mm
Cover tape width: 5.25 mm width Taping temperature: 180 ° C
Taping speed: 3500 tact taping trowel size: 0.6 mm x 2 wires Taping trowel length (seal length at 1 tact) 8 ± 1 mm
Electronic components: 0402 size capacitors

[Method of moist heat load]
The roll-shaped package obtained by the above production method was placed horizontally in a constant temperature and humidity test room set at 60 ° C. and 95% RH, and stored for 24 hours. Then, the roll was placed horizontally in a constant temperature and humidity test room set at 25 ° C. and 40% RH, stored for 24 hours, and then measured and evaluated.

[Measurement of surface resistivity]
The surface resistivity was measured using a surface resistivity meter (Mitsubishi Chemical Analytec Hiresta UP MCP-HT450) under the following test conditions.

(Measurement condition)
Probe: UA probe Applicable voltage: 10 ^{Less than 10} Ω / □ 10 V
10 ¹⁰ 10 ¹² Ω / □ 500V
10 ¹³ Ω / □ or more 1000 V
Measurement points: Central part of the sample Measured value: Measure 5 points so that the measurement points do not overlap, and use the average value. One measurement time: Use the display after 10 seconds. Pre-measurement sample storage: 25 ° C, 40% RH environment Storage for 24 hours or more Measurement environment: 25 ± 2 ° C, 40 ± 5% RH environment

[Measurement of surface tack force]
The surface tacking force was measured using a tacking tester (TAC-2, manufactured by RHESCA) under the following measurement conditions and measurement procedure.

(Measurement condition)
Pressurization (compression) speed: 30 mm / min
Pressurized load: 200 gf
Pressurization time: 10s
Measurement (disengagement) speed: 30 mm / min
Measurement contact part (probe): cylinder diameter 5 mm, SUS304
Temperature conditions: Probe temperature 60 ° C, sample table temperature 60 ° C (sample temperature 60 ° C)
Pre-measurement sample storage: Stored for 24 hours or more in a 25 ° C, 40% RH environment Measurement environment: 25 ± 2 ° C, 40 ± 5% RH environment

(Measurement procedure)
A sample was obtained by cutting the cover tape to 50 mm × 20 mm. Using 3MTM heat-resistant polyimide tape 7414 so that the surface of the sample on the heat-sealing layer side faces up and is flat on a slide glass (76 x 26 mm, 0.8 to 1.0 mmt), the four corners or four sides of the sample are used. The polyimide tape was attached to the slide glass so that it would not protrude from the slide glass. The sample is placed on the stage of the measuring device with the clasp attached to the device, the probe is brought into contact with the sample from above under the above measurement conditions, the probe is separated from the sample under the above measurement conditions, and the load value received by the probe at this time is used. Obtained.

[Measurement of heat seal strength]
For the heat seal strength, the peel strength (unit: gf) was measured for the package obtained by the above manufacturing method using a seal strength measuring machine (Vanguard Systems peel back tester VG-20) under the following measurement conditions.
(Measurement condition)
Peeling speed: 300 mm / min
Peeling temperature: 25 ± 3 ° C, 40 ± 10% RH
Peeling angle: 165 to 175 °
Measured value: Average value when measuring 150 mm

[Evaluation of the number of abnormal behaviors]
The number of abnormal behaviors of electronic components when the cover tape was peeled off from the package obtained by the above manufacturing method was measured. Specifically, the cover tape was peeled off from the roll-shaped package at a speed of 100 mm / sec using a cover tape peeling device (W08f Intelligent Feeder, manufactured by FUJI). The peeling was performed in an environment of 25 ± 3 ° C. and 30 ± 5% RH, and was completed in 10 seconds. The behavior of electronic components during peeling was observed with a high-speed camera. When the chip protrudes more than half from the cavity of the carrier tape at the time of peeling (when the electronic component sticks to the cover tape, when the electronic component rotates 90 degrees and stands up, the electronic component pops out from the cavity of the paper carrier tape. The number of abnormal behaviors was calculated by visually observing the number of abnormal behaviors while playing back the images taken by the high-speed camera in slow motion.

For the cover tapes of Examples 1 to 6 and Comparative Examples 1 and 2, before the above-mentioned moist heat load (after placing the roll horizontally in a constant temperature and humidity test room set at 25 ° C. and 40% RH and storing for 24 hours) and above. The surface resistivity, surface tack force, and heat seal strength after moist heat loading were measured, and the number of abnormal behaviors was evaluated. The surface resistivity was measured from the antistatic layer side of the cover tape, and the surface tack force was measured from the heat seal layer side of the cover tape. In addition, the rate of change of the surface tack force before and after the heat load (surface tack force after the moist heat load / surface tack force before the moist heat load) x 100) (%) was measured from the value of the surface tack force before and after the moist heat load. .. The results of measurement and evaluation are shown in Table 1.

However, since the surface resistivity of the cover tape of Comparative Example 2 was too high to be measured by the above method, a digital ultra-high resistance / micro ammeter 8340 and a resiliency chamber 12704A (applied voltage: 500V) were used. Was measured.

The cover tapes of Examples 1 to 6 had fewer abnormal behaviors after a moist heat load than the cover tapes of Comparative Examples 1 and 2. On the other hand, in the cover tape of Comparative Example 1, since the surface tack force measured from the heat seal layer side after the moist heat load exceeds 5 gf, the number of abnormal behaviors after the moist heat load is the cover tape of Examples 1 to 6. Was more than. Further, in the cover tape of Comparative Example 2, the surface tack force measured from the heat seal layer side after the moist heat load is 5 gf or less, but the surface resistivity measured from the antistatic layer side after the moist heat load is 1 ×. Since ^{it exceeds 10 10} Ω / □, the number of abnormal behaviors after moist heat loading was larger than that of the cover tapes of Examples 1 to 6.

1 ... Cover tape 2 ... Base material layer 3 ... Heat seal layer 4 ... Antistatic layer 5 ... Intermediate layer 10 ... Package 11 ... Carrier tape 12 ... Storage 13 ... Electronic components

Claims (3)

Base layer and
A heat seal layer arranged on one surface side of the base material layer and
An antistatic layer arranged on a surface side of the base material layer opposite to the surface on the heat seal layer side,
It is a cover tape for packaging electronic parts with
The surface resistivity measured from the antistatic layer side of the cover tape after a moist heat load, which is stored for 24 hours in an environment of 60 ° C. and 95% RH in the state of a package using a paper carrier tape, is 1 × 10 ^10. Ω / □ or less,
The surface tack force measured from the heat seal layer side of the cover tape after a moist heat load, which is stored for 24 hours in an environment of 60 ° C. and 95% RH in the state of a package using a paper carrier tape, is 5 gf or less.
Cover tape for packaging electronic components. The surface tack force measured from the heat seal layer side of the cover tape after the moist heat load is 80% or less of the surface tack force measured from the heat seal layer side of the cover tape before the moist heat load. , The cover tape for packaging electronic components according to claim 1. A carrier tape with multiple storage units for storing electronic components,
Electronic components stored in the storage unit and
The cover tape for packaging electronic components according to claim 1 or 2, which is arranged so as to cover the storage portion.
A packaging body.

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