WO2021070935A1 - Cover tape for packaging electronic component and package - Google Patents

Abstract

This disclosure provides a cover tape for packaging an electronic component, the cover tape comprising: a base layer; a heat seal layer disposed on one surface of the base layer; and a charge prevention layer that is disposed on the surface of the base layer opposite the surface on which the heat seal layer is disposed. When an anti-abrasion test is performed on the charge prevention layer using steel wool, the change rate R1 of the surface specific resistance of the charge prevention layer before and after the anti-abrasion test satisfies 10 ≤ R1 ≤ 100.

Description

Cover tape and packaging for electronic component packaging

This disclosure relates to a cover tape for packaging electronic components and a packaging body using the same.

In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric element registers have been taped and packaged for surface mounting. In taping packaging, after storing electronic parts in a carrier tape having a plurality of storage portions for storing electronic parts, the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic parts. Further, when mounting the electronic component, the cover tape is peeled off from the carrier tape, and the electronic component is automatically taken out and surface-mounted on the substrate. The cover tape is also called a top tape.

In taping packaging, in addition to static electricity generated by friction and contact of electronic components with carrier tape and cover tape, static electricity may be generated by peeling the cover tape from the carrier tape during mounting.

Therefore, various cover tapes having antistatic properties have been proposed in order to suppress the generation of static electricity (see, for example, Patent Documents 1 to 3).

Patent No. 4162961 Patent No. 4061136 Japanese Unexamined Patent Publication No. 2001-270999

However, it was found that even when an antistatic cover tape is used, abnormal behavior such as electronic components adhering to the cover tape or popping out from the carrier tape may occur.

The present disclosure has been made in view of the above problems, and an object of the present disclosure is to provide a cover tape for packaging electronic components, which can suppress abnormal behavior of electronic components when peeled from the carrier tape.

In one embodiment of the present disclosure, the base material layer, the heat seal layer arranged on one surface side of the base material layer, and the surface side of the base material layer opposite to the surface of the base material layer on the heat seal layer side. It has an antistatic layer to be arranged, and when the antistatic layer is subjected to an antistatic test with steel wool, the change ratio R1 of the surface intrinsic resistance of the antistatic layer before and after the antistatic test is Provided is a cover tape for packaging electronic components that satisfies 10 ≦ R1 ≦ 100.

In one embodiment of the present disclosure, the carrier tape having a plurality of storage portions for storing electronic components, the electronic components stored in the storage portions, and the electronic component packaging arranged so as to cover the storage portions. Provided with a cover tape and a packaging.

According to the cover tape for packaging electronic parts of the present disclosure, it is possible to suppress abnormal behavior such as electronic parts adhering to the cover tape or popping out from the carrier tape. Therefore, by using the cover tape or the packaging body for packaging the electronic components of the present disclosure, the electronic components can be reliably mounted.

It is the schematic cross-sectional view which illustrates the cover tape for electronic component packaging of this disclosure. It is the schematic plan view and sectional drawing which illustrates the package body of this disclosure. It is the schematic cross-sectional view which illustrates the cover tape for electronic component packaging of this disclosure. It is a schematic enlarged view of the peeling mechanism of the feeder peeling device which peels a cover tape from a carrier tape. It is a graph which shows the relationship between the amount of friction residue generated and the thickness of an antistatic layer.

An embodiment of the present disclosure will be described below with reference to drawings and the like. However, the present disclosure can be implemented in many different embodiments and is not construed as limited to the description of the embodiments illustrated below. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual form, but this is just an example and the interpretation of the present disclosure is limited. It's not something to do. Further, in the present specification and each figure, the same elements as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and detailed description thereof may be omitted as appropriate.

In the present specification, when expressing the mode of arranging another member on a certain member, when simply expressing "above" or "below", unless otherwise specified, the member is in contact with the certain member. Including the case where another member is arranged directly above or directly below, and the case where another member is arranged above or below a certain member via another member. Further, in the present specification, when expressing the mode of arranging another member on the surface of a certain member, when simply expressing "on the surface side" or "on the surface", unless otherwise specified, the certain member is used. It includes both the case where another member is arranged directly above or directly below the member so as to be in contact with each other, and the case where another member is arranged above or below one member via another member.
Hereinafter, the cover tape for packaging electronic components and the packaging body of the present disclosure will be described in detail.

A. Cover Tape for Packaging Electronic Components The cover tape for packaging electronic components of the present disclosure includes a base material layer, a heat seal layer arranged on one surface side of the base material layer, and the heat seal layer side of the base material layer. The antistatic layer has an antistatic layer arranged on the surface opposite to the surface of the surface, and the antistatic layer before and after the antistatic test when the antistatic layer is subjected to the rubbing resistance test with steel wool. This is a cover tape for packaging electronic components, wherein the rate of change R1 of the surface specific resistance of the above satisfies 10 ≦ R1 ≦ 100. In this specification, the "cover tape for packaging electronic components" may be simply referred to as a "cover tape".

The cover tape of the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of the cover tape of the present disclosure. As shown in FIG. 1, the cover tape 1 of the present disclosure includes a base material layer 2, a heat seal layer 3 arranged on one surface side of the base material layer 2, and a heat seal layer 3 side of the base material layer 2. It has an antistatic layer 4 arranged on the surface side opposite to the surface of the surface.

2 (a) and 2 (b) are schematic plan views and cross-sectional views showing an example of a package using the cover tape for packaging electronic components of the present disclosure, and FIG. 2 (b) is A of FIG. 2 (a). -A line sectional view. As shown in FIGS. 2A and 2B, the package 10 stores the carrier tape 11 having a plurality of storage portions 12 for storing the electronic components 13, the electronic components 13 stored in the storage portions 12, and the electronic components 13. A cover tape 1 arranged so as to cover the portion 12 is provided. The cover tape 1 is heat-sealed on the carrier tape 11, and heat-sealing portions 3h are provided on both ends of the heat-sealing layer 3 of the cover tape 1 in a line shape with a predetermined width. Further, in the package 10, the carrier tape 11 can have a feed hole 14.

As mentioned above, various antistatic cover tapes have been proposed. For example, Patent Document 3 describes a crosslinkable conductive composition containing a water-soluble conductive polymer having a carboxyl group, a silane coupling agent, and colloidal silica. Although the antistatic layer formed from this crosslinkable conductive composition has a three-dimensional crosslinked structure and is a hard coating film, the antistatic layer is cracked or peeled off from the base material layer when the cover tape is actually peeled off. As a result, it was not possible to suppress the abnormal behavior of electronic components.

As a result of detailed examination of the causes of abnormal behavior of electronic components, the inventors of the present disclosure have found that the following events have a strong influence.
A feeder peeling device is used to peel the cover tape from the carrier tape and pick up the electronic components for mounting. The feeder peeling device is a device that sequentially supplies electronic components to the pickup position of the component mounting machine by intermittently transferring the carrier tape. Then, the component mounting machine picks up the electronic components supplied by the feeder by the transfer head provided with a plurality of nozzles capable of holding the electronic components by vacuum suction or the like. The feeder peeling device has a peeling mechanism on the upstream side of the pickup position, which peels the cover tape from the carrier tape to expose the accommodating portion in which the electronic component is housed.

FIG. 4 shows a schematic enlarged view of the peeling mechanism. The peeling mechanism includes a peeling jig 31, and the cover tape storage reel (not shown) for storing the peeled cover tape 1 is rotated, so that the cover tape 1 is in contact with the peeling jig 31 and is attached to the carrier tape 11. It is pulled in the direction D2 substantially opposite to the feed direction D1. At this time, the surface of the cover tape comes into contact with the peeling jig, the surface of the antistatic layer is scraped by friction, the thickness of the antistatic layer becomes thin, and the antistatic performance for suppressing the generation of static electricity deteriorates. As shown in FIG. 4, since the peeling jig and the carrier tape are close to each other, the deterioration of the antistatic performance due to friction affects the behavior of the electronic component.

It was possible to maintain a low surface resistivity by increasing the thickness of the antistatic layer, but even if the surface of the antistatic layer after friction has high antistatic performance, the abnormal behavior of electronic components Was found to occur. As a result of further studies, the present inventors have made an abnormality in electronic components by accumulating dust (hereinafter referred to as friction residue) generated by scraping the surface of the antistatic layer in the vicinity 31a of the peeling jig 31. It was found that it affects the behavior. Then, as a result of investigating the abrasion resistance of the antistatic layer, the present inventors have found that the amount of friction residue generated increases regardless of whether the antistatic layer is too thick or too thin. Further, it was found that the antistatic layer deteriorates in performance, is easily scraped, and the amount of friction debris generated increases as the cover tape absorbs moisture due to dew condensation over time or in a moist heat environment. FIG. 5 shows a graph showing the relationship between the amount of friction residue generated and the thickness of the antistatic layer after storage at room temperature and storage at 60 ° C. and 95% RH for 24 hours.

From the above findings, it was found that in order to suppress the abnormal behavior of electronic components, not only the material composition should be optimized, but also the thickness of the antistatic layer should be within the optimum range. The optimum range of thickness differs depending on the type. Therefore, the present inventors suppress abnormal behavior of electronic components by suppressing both the fluctuation of the surface intrinsic resistance when the surface of the antistatic layer is scraped by the friction by the peeling jig of the feeder peeling device and the amount of friction residue generated. The parameter is the rate of change in the surface intrinsic resistance before and after the abrasion resistance test when a steel wool test is performed to reproduce the phenomenon that the surface of the antistatic layer is scraped by friction with the feeder peeling jig. It was found that if the rate of change is within a specific range, a cover tape that can maintain a low surface intrinsic resistance and has good abrasion resistance can be obtained, and abnormal behavior of electronic components can be suppressed. It was.

As described above, in the present disclosure, in the package using the cover tape of the present disclosure, when the cover tape is peeled off from the carrier tape, the electronic components are attached to the cover tape, so that the electrons from the carrier tape storage portion are received. It is possible to obtain a package that can suppress abnormal behavior of electronic parts such as popping out, floating, and standing of parts.
As described above, according to the cover tape for packaging electronic components of the present disclosure, the electronic components can be taken out normally, and the mounting efficiency can be improved.

Hereinafter, each configuration of the cover tape of the present disclosure will be described.
I. Antistatic layer The antistatic layer in the present disclosure is a layer arranged on the surface opposite to the surface of the base material layer on the heat seal layer side to prevent the cover tape from being charged. By having the antistatic layer, it is possible to prevent the generation of static electricity due to contact with other surfaces, and to prevent the static electricity from being charged and adhering dust, dust, etc. to the surface of the cover tape.

In the cover tape of the present disclosure, the change ratio R1 of the surface intrinsic resistance before and after the scratch resistance test when the antistatic layer is subjected to the scratch resistance test with steel wool satisfies 10 ≦ R1 ≦ 100.
In the present disclosure, in the "rubbing resistance test with steel wool", a cover tape is fixed to the table of the reciprocating wear tester so that the antistatic layer side faces the surface, and the reciprocating wear test is performed in accordance with the following test conditions. Do it by.

(Abrasion resistance test conditions using steel wool)
Equipment: Reciprocating wear tester TYPE30S (Shinto Kagaku Co., Ltd.)
Steel wool count: # 0000 (made by Bonster)
Load: 80g
Number of reciprocating wear: 5 times Movement speed: 600 to 650 mm / min
Travel distance: 50mm
Test environment: 25 ° C, 50% RH environment

The change ratio R1 of the surface resistivity before and after the abrasion resistance test when the abrasion resistance test with steel wool is measured on the surface measured at 25 ° C. and 50% RH environment at an applied voltage of 1000 V before the abrasion resistance test. After the resistivity (Ω / □) (R11) and the abrasion resistance test with the above steel wool, the abrasion debris on the tape surface was wiped off, and the surface resistivity measured at 25 ° C. and 50% RH environment at an applied voltage of 1000 V (). It is a ratio (R21 / R11) with Ω / □) (R21). The surface resistivity of the antistatic layer is measured, for example, by using a high resistance / resistivity meter manufactured by Mitsubishi Chemical Analytech Co., Ltd. High Restor-UX MCP-HT800.

In the present disclosure, the change ratio R1 of the surface intrinsic resistance of the antistatic layer satisfies 10 ≦ R1 ≦ 100, so that the abnormal behavior of the electronic component is suppressed. The rate of change R1 of the surface intrinsic resistance of the antistatic layer is preferably 10 ≦ R1 ≦ 50, more preferably 10 ≦ R1 ≦ 25.

When R1 is smaller than 10, it means that the thickness of the antistatic layer is thicker than the optimum range.
When the antistatic layer is thick, the fluctuation of the surface resistance due to friction is small and the surface resistance after friction can be kept low. Is considered to be promoted. Therefore, even if the fluctuation of the surface resistance of the antistatic layer after friction is small, abnormal behavior of the electronic component frequently occurs due to the generation of friction residue. It is presumed that this is because the charge of the friction residue itself accumulated in the peeling jig of the tape feeder has an adverse effect.

Also, when the above R1 is larger than 100, the abnormal behavior of the electronic component cannot be suppressed. When R1 is larger than 100, it means that the thickness of the antistatic layer is thinner than the optimum range. Even when the antistatic layer is thin, the amount of friction residue generated is large. It is presumed that this is because the coating film state is non-uniform and the antistatic layer is formed in an island shape, so that the abrasion resistance as a film is not sufficiently exhibited. Further, the fluctuation of the surface resistance due to friction becomes remarkable, and the abnormal behavior of the electronic component cannot be suppressed.

As the cover tape absorbs moisture due to dew condensation over time or in a high humidity environment, the abrasion resistance of the antistatic layer deteriorates, and the fluctuation of surface resistance with respect to the thickness of the antistatic layer and the behavior of the amount of friction residue generated change before and after moisture absorption. In some cases. Therefore, in order to suppress abnormal behavior of electronic components when the cover tape is peeled off after being stored in a high humidity environment, the cover tape of the present disclosure is antistatic after being stored for 24 hours in a 60 ° C. 95% RH environment. It is preferable that the change ratio R2 of the surface intrinsic resistance of the antistatic layer before and after the rubbing resistance test when the rubbing resistance test with steel wool is performed on the layer satisfies 20 ≦ R2 ≦ 85. The rate of change R2 of the surface intrinsic resistance is more preferably 20 ≦ R2 ≦ 35.

The antistatic layer in the present disclosure is not particularly limited, and examples thereof include the following two aspects, a first antistatic layer and a second antistatic layer. With these antistatic layers, the rate of change of the surface intrinsic resistance R1 or R2 can be within the above range.

1. 1. First Antistatic Layer (a) Structure The first antistatic layer has an acrylic main chain, a side chain containing a quaternary ammonium base, and a crosslinked resin containing a crosslinked structure, and the crosslinked structure is −NHC (=). It has O) O-, -NHC (= O)-or-C (= O) OC ₂ H ₄ NH-. The first antistatic layer is made of an antistatic material having a first crosslinkable acrylic polymer containing a crosslinkable functional group and a quaternary ammonium base and a first polyfunctional curing agent, as will be described later. It is formed.

(A1) Crosslinked Resin The first antistatic layer in the present disclosure has a crosslinked resin which is a crosslinked resin, and the crosslinked resin contains an acrylic main chain, a side chain containing a quaternary ammonium base, and a crosslinked structure.
The quaternary ammonium base has a function as a hydrophilic part of the surfactant, and the quaternary ammonium base oriented toward the surface side of the antistatic layer reacts with water vapor in the air to form a film of moisture on the surface of the antistatic layer. By doing so, the surface resistance is reduced.

Examples of the quaternary ammonium base contained in the crosslinked resin include those represented by the following formula (1).
-N ⁺ R ₃ (1)
(In the formula, R is an organic group that is the same or different from each other independently.)
R is preferably an alkyl group having 1 to 6 carbon atoms, and more preferably an alkyl group having 1 to 2 carbon atoms from the viewpoint of surface orientation of the quaternary ammonium base.
The quaternary ammonium base represented by the above formula (1) is bonded to the acrylic chain which is the main chain via a divalent hydrocarbon group which may contain oxygen and nitrogen.

Examples of such a divalent hydrocarbon group include -X (CH ₂ ) _n- (in the formula, n is an integer of 1 to 6 and X is an amide group (-C (= O) NH-) or an ester. A group (-C (= O) O-), wherein the carbon atom of the amide group or the ester group is bonded to the acrylic chain which is the main chain) is preferable.
The content of the quaternary ammonium base contained in the antistatic layer can be a value necessary for the surface resistivity of the antistatic layer in the present disclosure to fall within the numerical range described later.

When the antistatic layer contains a crosslinked resin having a quaternary ammonium base and a crosslinked structure in the molecule, so that an antistatic agent such as a low molecular weight surfactant is dispersed in the crosslinked binder resin and used. In comparison, it is possible to prevent the surfactant from bleeding out to the surface of the antistatic layer or the interface between the antistatic layer and the base material layer due to moisture absorption. Therefore, it is possible to suppress a decrease in antistatic performance and a decrease in adhesion to the base material layer.

The crosslinked structure is a structure in which the crosslinkable functional group of the first crosslinkable acrylic polymer described later and the first polyfunctional curing agent are bonded, and -NHC (= O) O-, -NHC (=). It has O)-or -C (= O) OC ₂ H ₄ NH-.

The first antistatic layer has an acrylic chain as a main chain. As used herein, the term acrylic chain comprehensively refers to an acrylic chain and a methacrylic chain.

The antistatic layer preferably does not contain a compound having a cyclic structure such as an aromatic ring, an aliphatic ring, and a heterocycle. In particular, it is preferable that the crosslinked resin does not have the above-mentioned cyclic structure. This is because when the antistatic layer contains an annular structure, the antistatic layer becomes hard and brittle, and peeling from the base material layer and frictional debris are likely to occur.

(A2) Moisture-absorbing and desorbing fine particles Further, ^{in order to impart high antistatic performance (for example, less than 1.0 × 10 10} Ω / □) to the first antistatic layer, a second antistatic layer described later is used. In comparison, there is no choice but to increase the thickness. As the thickness increases, the antistatic performance deteriorates due to friction and the adhesion to the base material deteriorates. Therefore, it is preferable to add an easy-to-slip agent for the purpose of reducing friction. Above all, if moisture absorbing / releasing fine particles are used as an easy lubricant, good slipperiness and antistatic property can be obtained. Since moisture is adsorbed on the surface of the moisture-absorbing and desorbing fine particles, the slipperiness can be improved without impairing the antistatic performance of the quaternary ammonium base. As the moisture absorbing / releasing fine particles, acrylic resin fine particles are preferable from the viewpoint of surely obtaining the above effects, and specific examples thereof include the moisture absorbing / releasing fine particles Tuftic HU series (manufactured by Japan Exlan Co., Ltd.).

(B) Surface resistance The surface resistivity of the first antistatic layer is 1.0 × 10 ⁹ Ω / □ or more, 1.0 × 10 ¹¹ Ω / □ or less, preferably 5.0 × 10 ⁹ Ω / □. As mentioned above, ^{it can be 5.0 × 10 10} Ω / □ or less.

(C) Thickness The thickness of the first antistatic layer is determined by the rate of change R1 of the surface intrinsic resistance of the antistatic layer before and after the antistatic test when the antistatic layer is subjected to the rubbing resistance test with steel wool. It can be a value required to satisfy 10 ≦ R1 ≦ 100. For example, it can be 0.1 μm or more and 1.5 μm or less, preferably 0.2 μm or more and 1.0 μm or less.

(D) First Antistatic Layer Material The first antistatic layer material for forming the first antistatic layer is a first crosslinkable acrylic system containing a crosslinkable functional group and a quaternary ammonium base. It has a polymer and a polyfunctional curing agent. The polyfunctional curing agent contained in the first antistatic layer material is referred to as a first polyfunctional curing agent.

(D1) First Crosslinkable Acrylic Polymer The first crosslinkable acrylic polymer contains a crosslinkable functional group and a quaternary ammonium base and reacts with a polyfunctional curing agent to form a crosslinked structure. The crosslinkable functional group contained in the first crosslinkable acrylic polymer is not particularly limited as long as it can form a crosslinked structure with the polyfunctional curing agent, and examples thereof include a hydroxyl group and a carboxyl group. .. Examples of the quaternary ammonium base contained in the first crosslinkable acrylic polymer include those represented by the above formula (1).

In the present disclosure, the first crosslinkable acrylic polymer preferably has a crosslinkable functional group and a quaternary ammonium base, and 50% by mass or more of the total amount of the monomer components constituting the polymer is an acrylic monomer. ..
Further, in the present specification, the acrylic monomer means a monomer having at least one (meth) acryloyl group in one molecule. Further, the (meth) acryloyl group has a meaning comprehensively referring to an acryloyl group and a methacryloyl group.

The first crosslinkable acrylic polymer is an acrylic monomer (m1) having a quaternary ammonium base (hereinafter referred to as (m1) component), an acrylic monomer having a crosslinkable functional group such as a hydroxyl group and a carboxyl group (m2). ) (Hereinafter referred to as (m2) component), and if necessary, a copolymer formed by reacting an acrylic monomer or an unsaturated monomer (m3) (hereinafter referred to as (m3) component)). Can be mentioned.

Examples of the (m1) component include acryloyloxyethyltrimethylammonium chloride, acryloyloxyethyltrimethylammonium bromide, acryloyloxyethylmethylammonium chloride, acryloyloxyethyldiethylmethylammonium chloride, acryloyloxyethyldimethylethylammonium chloride, and the like. These monomers may be used alone or in combination of two or more.

Specific examples of the (meth) acrylic monomer having a carboxyl group of the (m2) component include acrylic acid, methacrylic acid, itaconic acid, maleic acid, and crotonic acid. These monomers may be used alone or in combination of two or more. Specific examples of the (meth) acrylic monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl ( Examples thereof include hydroxyalkyl (meth) acrylates such as meta) acrylates. These monomers may be used alone or in combination of two or more.

Examples of the (m3) component include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and t. Examples thereof include (meth) acrylic acid esters such as -butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, and stearyl (meth) acrylate. These monomers may be used alone or in combination of two or more.

As the first crosslinkable acrylic polymer, a commercially available one can also be used. For example, as an acrylic polymer having a carboxyl group, a quaternary ammonium base, and a (meth) acrylic acid ester group, Acryt 1SX-1123 (Manufactured by Taisei Fine Chemical Co., Ltd.) can be used.

(D2) First Polyfunctional Curing Agent The first polyfunctional curing agent has two or more crosslinkable functional groups of the first crosslinkable acrylic polymer and functional groups capable of forming a crosslinked structure. If there is no particular limitation, it is preferable that the structural portion other than the functional group does not have a cyclic structure such as an aromatic ring, an aliphatic ring, or a heterocyclic ring. That is, a curing agent in which the structural portion other than the functional group is linear or branched is preferable. This is because if the antistatic layer contains an annular structure derived from a curing agent, the antistatic layer becomes hard and brittle, and frictional debris is likely to be generated.

Specific examples of the polyfunctional curing agent having no cyclic structure other than such a functional group include an aliphatic polyisocyanate and an aziridine-based curing agent.
Examples of the aliphatic polyisocyanate include hexamethylene diisocyanate (HDI), polymerized (excluding those obtained by nucleating) these, a mixture thereof, and a copolymer with another polymer.

Examples of the aziridine-based cross-linking agent having no cyclic structure other than the functional group include a cross-linking agent having 2 or more, preferably 3 or more aziridine-based groups. Specifically, tris (1-aziridine propionic acid) 1, 1,1-Propanetriyltrismethylene, tris (2-methyl-1-aziridinepropionic acid) 1,1,1-propanetriyltrismethylene, tris (1-aziridinepropionic acid) 2-hydroxyethylidinetrismethylene, Tris (2-methyl-1-aziridine propionic acid) 2-hydroxyethylidine trismethylene and the like can be mentioned.

Examples of the curing agent having a cyclic structure such as an aromatic ring, an aliphatic ring, and a heterocycle in the structural portion other than the functional group include TDI-based polyisocyanate and aromatic-based aziridine.

The blending ratio of the first crosslinkable acrylic polymer and the first polyfunctional curing agent in the first antistatic layer material is not particularly limited, but the mole of the crosslinkable functional group in the crosslinkable acrylic polymer is not particularly limited. When the number (mol) is x and the number of moles (mol) of the functional groups of the polyfunctional curing agent is y, x / y is usually about 0.5 to 2.0, preferably 0.75 to 1. It is a range of about .2.

(D3) Moisture Absorbing and Desorbing Fine Particles The first antistatic layer material preferably contains moisture absorbing and releasing fine particles. Examples of the moisture-absorbing and desorbing fine particles include those similar to those described in "1. First antistatic layer (a) configuration (a2) Moisture-absorbing and desorbing fine particles".

The content of the moisture absorbing / releasing fine particles in the first antistatic layer material is not particularly limited, but is based on 100 parts by mass of the total amount of the first crosslinkable acrylic polymer and the first polyfunctional curing agent. It can be 1 part by mass or more and 5 parts by mass or less.

(E) Forming method As a method for forming the antistatic layer, for example, an antistatic layer material containing the first crosslinkable acrylic polymer, a polyfunctional curing agent, moisture absorbing / releasing fine particles and the like is dispersed or dissolved in a solvent. Examples thereof include a method in which the antistatic layer composition is used and the antistatic layer composition is applied to the other surface side of the base material layer and cured. Examples of the coating method of the antistatic layer composition include known coating methods such as air doctor, blade coating, knife coating, rod coating, bar coating, direct roll coating, reverse roll coating, gravure coating, and slide coating. Be done.

2. Second Antistatic Layer (a) Structure The second antistatic layer in the present disclosure has a conductive polymer, a crosslinked resin containing an acrylic main chain and a crosslinked structure, and the crosslinked structure is −C (= O). ) OC ₂ H ₄ NH- or -C (OH) CH ₂ OC (= O)-. The second antistatic layer is made of an antistatic material having a conductive polymer, a second crosslinkable acrylic polymer having a carboxylate anionic group, and a second polyfunctional curing agent, as will be described later. It is formed.

(A1) Conductive Polymer The second antistatic layer has a conductive polymer to reduce the surface resistance of the antistatic layer. In the first antistatic layer, the quaternary ammonium base reacts with water vapor in the air to form a film of moisture on the surface of the antistatic layer, thereby reducing the surface resistance, while the conductivity in the second antistatic layer. The conductive polymer itself exhibits conductivity. Therefore, it has the effect of lowering the surface resistance without depending on the humidity. Furthermore, since the second antistatic layer has high water resistance, the abrasion resistance is unlikely to deteriorate even when stored in a high humidity environment. Therefore, it becomes easy to set the values of R1 and R2 within the specific range.

Examples of the conductive polymer include polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, polyvinylcarbazole and the like.
Among them, polythiophene is preferable as the conductive polymer. As the polythiophene, for example, PEDOT / PSS (poly (3,4-ethylenedioxythiophene / polystyrene sulfonic acid)) is preferably used.

(A2) Crosslinked resin The second antistatic layer has a crosslinked resin containing an acrylic main chain and a crosslinked structure in addition to the above conductive polymer.
Crosslinked structure in the crosslinked resin, crosslinkable functional groups of the second acrylic-based polymer to be described later - the (carboxylate anion ^(-COO) or other crosslinkable functional group), and a second polyfunctional curing agent It is a combined structure and has -C (= O) OC ₂ H ₄ NH- or -C (OH) CH ₂ OC (= O)-.

(B) Surface resistance The surface resistivity of the second antistatic layer is, for example, 1.0 × 10 ⁷ Ω / □ or more, 1.0 × 10 ¹⁰ Ω / □ or less, preferably 5.0 × 10 ⁷ Ω / □. □ or more, may be 1.0 × 10 ⁹ Ω / □ or less.

(C) Thickness The thickness of the second antistatic layer is the rate of change of the surface specific resistance of the antistatic layer before and after the antistatic test when the antistatic layer is subjected to the rubbing resistance test with steel wool R1. Can be a value required to satisfy 10 ≦ R1 ≦ 100. For example, it can be 0.1 μm or more and 1.5 μm or less, preferably 0.2 μm or more and 1.0 μm or less.

(D) Second Antistatic Layer Material The second antistatic layer material for forming the second antistatic layer is a second crosslinkable acrylic material containing a conductive polymer and a carboxylate anion. It has a polymer and a second polyfunctional curing agent. Hereinafter, the polyfunctional curing agent contained in the second antistatic layer material is also referred to as a second polyfunctional curing agent.

(D1) Conductive Polymer As the conductive polymer, the same one as described in "I. Antistatic layer 2. Second antistatic layer (a) configuration (a1) Conductive polymer" is used. Can be mentioned. The content of the conductive polymer in the second antistatic layer material is 5 parts by mass or more with respect to 100 parts by mass of the total amount of the second crosslinkable acrylic polymer and the second polyfunctional curing agent. It can be 25 parts by mass or less.

(D2) a second crosslinkable acrylic polymer second crosslinkable acrylic polymer, carboxylate anion group (-COO ^-) and other groups optionally acts as a crosslinking functional group. Further, carboxylate anion group (-COO ^-) by the presence of, and also has a function as a binder resin has high affinity with the conductive polymer. The second crosslinkable acrylic polymer, a carboxylate anion group in the molecule (-COO ^-) is not particularly limited as long as it is an acrylic resin having, it can be a known. For example, a copolymer obtained by reacting a monomer containing an acrylic monomer having a carboxyl group (neutralized salt) can be mentioned.

The carboxylate anion group is derived from the carboxyl group of the acrylic monomer. As the acrylic monomer having a carboxyl group, acrylic acid and methacrylic acid are preferable.

Examples of the monomer other than the acrylic monomer having a carboxyl group include various known (meth) acrylic acid alkyl esters, (meth) acrylamides, (meth) acrylic acid hydroxyalkyls, and other unsaturated monomers. You can use the body. As the other unsaturated monomer, a crosslinkable group capable of forming a crosslinked structure with the following polyfunctional curing agent such as a hydroxyl group may be contained.

Examples of the neutralizing agent include ammonia, primary to tertiary amines, alkali metal compounds and alkaline earth metal compounds, and these can be used alone or in combination of two or more. ..

(D3) Second Polyfunctional Curing Agent The second polyfunctional curing agent is not particularly limited as long as it has two or more functional groups capable of forming a crosslinked structure with the second crosslinkable acrylic polymer. However, it is preferable that the structural portion other than the functional group does not have a cyclic structure such as an aromatic ring, an aliphatic ring, and a heterocycle. That is, a curing agent in which the structural portion other than the functional group is linear or branched is preferable. This is because if the antistatic layer contains an annular structure derived from a curing agent, the antistatic layer becomes hard and brittle, and frictional debris is likely to occur. Specific examples thereof include an aziridine-based curing agent having no cyclic structure and an epoxy-based curing agent having no cyclic structure.

As the aziridine-based curing agent having no cyclic structure other than the functional group, the above-mentioned "I. Antistatic layer 1. First antistatic layer (d) First antistatic layer material (d2) First polyfunctional The same as those described in "System curing agent" can be mentioned.

Examples of the epoxy-based cross-linking agent having no cyclic structure other than the functional group include cross-linking agents having two or more epoxy groups, such as polyglycerol polyglycidyl ether, diglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, and sorbitol poly. Examples include glycidyl ether and the like.

Examples of the curing agent having a cyclic structure such as an aromatic ring, an aliphatic ring, and a heterocycle in the structural portion other than the functional group include an aromatic aziridine-based cross-linking agent and an aromatic-based epoxy-based cross-linking agent.

The blending ratio of the second crosslinkable acrylic polymer and the second polyfunctional curing agent in the second antistatic layer material is not particularly limited, but the mole of the crosslinkable functional group in the crosslinkable acrylic polymer is not particularly limited. When the number (mol) is x and the number of moles (mol) of the functional groups of the polyfunctional curing agent is y, x / y is usually about 0.5 to 2.0, preferably 0.75 to 1. It is a range of about .2.

(E) Forming method As a method for forming the antistatic layer, for example, an antistatic composition obtained by dispersing or dissolving the above-mentioned conductive polymer, second crosslinkable acrylic polymer, second polyfunctional curing agent or the like in a solvent. Examples thereof include a method of applying the antistatic composition to the other surface side of the base material layer and curing the material. Examples of the application method of the antistatic composition include known application methods such as air doctor, blade coat, knife coat, rod coat, bar coat, direct roll coat, reverse roll coat, gravure coat, and slide coat. ..

II. Base material layer The base material layer in the present disclosure is a layer that supports the above-mentioned antistatic layer and heat seal layer.
As the base material layer, various materials can be applied as long as it has mechanical strength to withstand external forces during storage and transportation, heat resistance to withstand manufacturing and taping packaging, and the like. For example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymers, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymers, and polyamides such as nylon 6, nylon 66 and nylon 610. Examples thereof include polyolefins such as polyethylene, polypropylene, and polymethylpentene. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are preferably used because of their good cost and mechanical strength.

Further, the base material layer may contain additives such as a filler, a plasticizer, a colorant, and an antistatic agent, if necessary. The base material layer may be a single layer, or may be a laminate of a plurality of layers of the same type or different types. Further, the base material layer may be a stretched film or an unstretched film. Above all, the base material layer may be a film stretched in the uniaxial direction or the biaxial direction for the purpose of improving the strength.

The thickness of the base material layer can be, for example, 2.5 μm or more and 300 μm or less, 6 μm or more and 100 μm or less, or 12 μm or more and 50 μm or less. If the thickness of the base material layer is too thick, the rigidity at the time of taping packaging becomes strong, which is disadvantageous in terms of handleability and cost. Further, if the thickness of the base material layer is too thin, the mechanical strength may be insufficient.

The base material layer may be subjected to easy-adhesion treatment such as corona discharge treatment, plasma treatment, ozone treatment, frame treatment, preheat treatment, dust removal treatment, thin film deposition treatment, alkali treatment, and sandblast treatment.

III. Heat-seal layer The heat-seal layer in the present disclosure is a layer arranged on one surface side of the base material layer. When the package is manufactured using the cover tape of the present disclosure, the heat seal layer is heat-sealed against the carrier tape, so that the cover tape and the carrier tape are adhered to each other.

The heat seal layer has a thermoplastic resin, and the thermoplastic resin is any one of an ethylene-vinyl acetate-based copolymer, an acrylic resin, a polyester-based resin, a polyurethane resin, and a vinyl chloride-vinyl acetate copolymer. Alternatively, a resin containing these as a main component is preferable. Above all, it is preferable to contain an ethylene-vinyl acetate copolymer. When the heat seal layer contains an ethylene-vinyl acetate copolymer, the heat seal property for the carrier tape is improved. Therefore, it is possible to suppress the occurrence of unintended peeling during transportation, storage, and the like.

In the present disclosure, the ethylene-vinyl acetate-based copolymer is a copolymer containing at least an ethylene monomer unit and a vinyl acetate monomer unit. The ethylene monomer unit means a structural unit derived from an ethylene monomer, and the vinyl acetate monomer unit means a structural unit derived from a vinyl acetate monomer.

The content of ethylene in the ethylene-vinyl acetate copolymer is not particularly limited, but is preferably 60% by mass or more and 97% by mass or less, and particularly preferably 80% by mass or more and 95% by mass or less. The content of vinyl acetate in the ethylene-vinyl acetate-based copolymer is not particularly limited, but is preferably 3% by mass or more and 40% by mass or less, and particularly preferably 5% by mass or more and 20% by mass or less.

In the present disclosure, the ethylene-vinyl acetate-based copolymer may contain a third monomer unit in addition to the ethylene monomer unit and the vinyl acetate monomer unit. The third monomer unit includes styrene, (meth) acrylic acid such as saturated carboxylic acid and unsaturated carboxylic acid ester, methyl (meth) acrylate, methyl acrylate, ethyl acrylate, butyl acrylate, propylene, 1-. Butene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-decene, 1,3-butadiene, 2-methyl-1,3-butadiene for conjugated diene, 1,4- for non-conjugated diene Examples thereof include pentadiene and 1,5-hexadiene.

The content of the ethylene-vinyl acetate copolymer in the heat seal layer is not particularly limited, and is preferably 50% by mass or more and 90% by mass or less, and more preferably 60% by mass or more and 80% by mass or less.

If it is at least the above value, it is preferable because a preferable seal strength can be obtained. When it is equal to or less than the above value, the initial tackiness can be lowered, and deterioration of the heat seal layer can be suppressed even after exposure to a high humidity and heat environment, which is preferable.

When the heat seal layer in the present disclosure contains an ethylene-vinyl acetate copolymer, it is preferable that it further contains a polyethylene resin. By blending the polyethylene resin, it is possible to reduce the surface tackiness while maintaining good heat sealability and suppress deterioration after being placed in a high humidity and heat environment.

Examples of the polyethylene resin include various types of polyethylene such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. Since they are superior in terms of dispersibility, low-density polyethylene (LDPE, (Density 0.910 to less than 0.930) and linear low density polyethylene (LLDPE, density 0.910 to 0.925) are preferably used.

Further, in the present disclosure, the classification of various polyethylenes refers to those defined in the former JIS K6748: 1995 and JIS K6899-1: 2000. The content of the polyethylene resin in the heat seal layer is preferably 10% by mass or more and 50% by mass or less, and more preferably 20% by mass or more and 40% by mass or less.
If it is less than the above value, it does not affect the sealing strength after heat sealing, so there is a risk that problems such as peeling may occur when packaging electronic components, and that the cover tape may unintentionally peel off during storage or transportation. It is preferable because it is suppressed. When it is at least the above value, the initial surface tack of the heat seal layer can be suppressed, and deterioration after being placed in a moist heat environment can also be suppressed, which is preferable. Further, it is more preferable to keep the value within the range of the above values because the above effects can be compatible with each other.

The heat seal layer may contain a resin other than the ethylene-vinyl acetate copolymer and the polyethylene resin. Examples of other resins include homopolymers of olefin-based, (meth) acrylic acid ester-based, and styrene-based monomers, copolymers containing one or more of these monomers, polyester, and the like. Examples thereof include polyolefins such as polypropylene, polyesters, acrylics such as polyacrylic acid esters and polymethacrylic acid esters, and the like. These resins may be modified.

If necessary, the heat seal layer may contain additives such as a tackifier, an antistatic agent, an antiblocking agent, a dispersant, a filler, a plasticizer, and a colorant.

Further, when an ethylene-vinyl acetate copolymer is used for the heat-sealing layer, a nonionic surfactant or a relatively large amount is used in order to suppress the influence on the heat-sealing performance and the bleed-out phenomenon. Ionic activators with low polarity can be used. However, a nonionic surfactant or an ionic surfactant having a relatively low polarity tends to stay inside the layer and the bleed-out phenomenon is unlikely to occur, but the antistatic performance may be difficult to be exhibited. Therefore, by having the antistatic layer on the surface side of the base material layer opposite to the heat seal layer, the antistatic property of the cover tape can be improved. In addition to arranging the antistatic layer on the surface side of the base material layer opposite to the heat seal layer, the antistatic property of the cover tape is further improved by adding an antistatic agent to the heat seal layer. be able to.
In the present disclosure, the surface resistance of the surface of the cover tape on the side where the heat seal layer is arranged can be, for example, 1 × 10 ⁷ Ω / □ or more and 1 × 10 ¹³ Ω / □ or less.

When conductive fine particles such as needle-like particles of antimony-doped tin oxide are used as the antistatic agent, high antistatic properties can be imparted by adding a small amount. Further, the thickness of the heat seal layer can be reduced, and high transparency can be ensured.

The thickness of the heat seal layer can be, for example, 0.5 μm or more and 60 μm or less.
In the case of paper carrier tape, the thickness of the heat seal layer can be, for example, 0.5 μm or more and 60 μm or less, and may be 1 μm or more and 30 μm or less. In the case of the plastic carrier tape, the thickness of the heat seal layer can be, for example, 0.5 μm or more and 30 μm or less. If the heat seal layer is too thin, a uniform film may not be obtained. Further, if the heat seal layer is too thick, the transparency of the cover tape may decrease.

As a method for forming the heat-seal layer, for example, a composition for a heat-seal layer in which an ethylene-vinyl acetate copolymer, a polyethylene resin, and if necessary, other resins and additives described above are dispersed or dissolved in a solvent is used. Examples thereof include a method in which the composition for a heat seal layer is applied to one surface side of the base material layer and dried. Examples of the method for applying the heat seal layer composition include roll coat, reverse roll coat, gravure coat, gravure reverse coat, comma coat, bar coat, wire bar coat, rod coat, kiss coat, knife coat, and die coat. Known coating methods such as flow coat, dip coat, and spray coat can be mentioned.

Also, a film can be used as the heat seal layer. In this case, the method of laminating the base material layer and the heat seal layer is not particularly limited, and a known method can be used. For example, a method of laminating a pre-made film to a base material layer with an adhesive, a method of extruding a raw material of a heat-melted film onto a base material layer with a T-die or the like, and the like to obtain a laminate. As the adhesive, for example, a polyester-based adhesive, a polyurethane-based adhesive, an acrylic-based adhesive, or the like can be used.

IV. Intermediate layer In the present disclosure, for example, as shown in FIG. 3, an intermediate layer 5 may be arranged between the base material layer 2 and the heat seal layer 3, if necessary. The intermediate layer can improve the adhesion between the base material layer and the heat seal layer. Further, the intermediate layer can improve the cushioning property when the cover tape of the present disclosure is heat-sealed to the carrier tape, so that heat can be applied to the heat-sealing layer more uniformly.

The material of the intermediate layer is appropriately selected depending on the material of the base material layer and the heat seal layer, and examples thereof include polyolefins such as polyethylene and polypropylene, polyurethane, and polyester.
The thickness of the intermediate layer can be, for example, 5 μm or more and 50 μm or less.

A film can be used as the intermediate layer. In this case, the method for laminating the base material layer and the intermediate layer is not particularly limited, and a known method can be used. For example, a method of laminating a pre-made film to a base material layer with an adhesive, a method of extruding a raw material of a heat-melted film onto a base material layer with a T-die or the like, and the like to obtain a laminate. The adhesive is the same as that described in the section of the heat seal layer.

V. Anchor layer Further, an anchor layer may be provided between the base material layer and the intermediate layer, or between the intermediate layer and the heat seal layer. By forming the anchor layer, even when the base material layer, the intermediate layer or the heat seal layer has poor adhesive strength, between the base material layer and the intermediate layer, or between the intermediate layer and the heat seal layer. Adhesion can be improved. The anchor layer may be appropriately selected depending on the material used for the base material layer, the intermediate layer, and the heat seal layer, and is not particularly limited. The anchor layer can be formed of, for example, a resin having good adhesiveness such as an olefin-based, acrylic-based, isocyanate-based, urethane-based, or ester-based adhesive.

B. Packaging Body The packaging body of the present disclosure includes a carrier tape having a plurality of storage portions for storing electronic parts, electronic parts stored in the storage parts, and the above-mentioned cover tape arranged so as to cover the storage parts. And.

In the present disclosure, by providing a cover tape in which the change ratio R1 of the surface intrinsic resistance of the antistatic layer before and after the test when the antistatic layer is subjected to the rubbing resistance test with steel wool satisfies 10 ≦ R1 ≦ 100. , In the package using the cover tape of the present disclosure, when the cover tape is peeled off from the carrier tape, the electronic parts may pop out, float, or stand from the carrier tape storage portion due to the attachment of the electronic parts to the cover tape. It is possible to obtain a package that suppresses abnormal behavior of electronic components such as.

2 (a) and 2 (b) are schematic plan views and cross-sectional views showing an example of the package of the present disclosure. Note that FIGS. 2 (a) and 2 (b) have been described in the above section "A. Cover tape for packaging electronic components", and thus the description thereof will be omitted here.
Hereinafter, each configuration of the package of the present disclosure will be described.

1. 1. Cover Tape The cover tape in the present disclosure has been described in the above section "A. Cover tape for packaging electronic components", and thus the description thereof will be omitted here.

In the package of the present disclosure, the heat seal layer of the cover tape and the carrier tape are adhered at the heat seal portion. The heat-sealing portion can be arranged, for example, in a part of the portion where the heat-sealing layer of the cover tape comes into contact with the carrier tape. That is, the heat-sealing layer may have a heat-sealing portion and a non-heat-sealing portion. Thereby, the peelability of the cover tape with respect to the carrier tape can be improved.

2. Carrier Tape The carrier tape in the present disclosure is a member having a plurality of storage portions for storing electronic components.
The carrier tape may have a plurality of storage portions, and may be, for example, an embossed carrier tape (also referred to as embossed tape), a punch carrier tape (also referred to as punch tape), or a press carrier tape (press). Any of the tapes) can be used. Above all, the embossed carrier tape is preferably used from the viewpoint of cost, moldability, dimensional accuracy and the like.

Examples of the material of the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and paper. In the present disclosure, the paper refers to a paper containing cellulose as a main component, and may further contain a resin component.

The thickness of the carrier tape is appropriately selected according to the material of the carrier tape, the thickness of the electronic component, and the like. For example, the thickness of the carrier tape can be 30 μm or more and 1500 μm or less. If the thickness of the carrier tape is too thick, the moldability is deteriorated, and if the thickness of the carrier tape is too thin, the strength may be insufficient.

The carrier tape has a plurality of storage parts. The storage portions are usually arranged at predetermined intervals in the longitudinal direction of the carrier tape. The size, depth, pitch, etc. of the storage portion are appropriately adjusted according to the size, thickness, etc. of the electronic component.

As a method for forming a carrier tape having a storage portion, a general method for forming a carrier tape can be applied, and it is appropriately selected according to the type and material of the carrier tape. For example, press molding, vacuum forming, pressure forming, punching, compression and the like can be mentioned.

3. 3. Electronic components The electronic components used in the packaging of the present disclosure are not particularly limited, and include, for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element registers, filters, and crystal oscillators. Examples include children, crystal oscillators, connectors, switches, volumes, relays, and the like. The format of the IC is also not particularly limited.

4. Packaging The packaging of this disclosure is used for the storage and transportation of electronic components. Electronic components are stored and transported in their packaging for mounting. At the time of mounting, the cover tape is peeled off, the electronic components stored in the carrier tape storage portion are taken out, and the electronic components are mounted on a substrate or the like.

Note that the present disclosure is not limited to the above embodiment. The above embodiment is an example, and any object having substantially the same structure as the technical idea described in the claims of the present disclosure and exhibiting the same effect and effect is the present invention. Included in the technical scope of the disclosure.

Examples and comparative examples are shown below, and the present disclosure will be described in more detail.
(Adjustment of antistatic composition composition)
[Adjustment example 1]
The following main agent and curing agent were mixed at a dry solid content ratio of 10: 1 to prepare an antistatic composition 1 having a total solid content concentration of 1.5% by mass with a diluting solvent (methanol / ethyl acetate = 1/1). ..
-Main agent: Acrylic polymer compound having a quaternary ammonium base, a carboxyl group, and a (meth) acrylic acid ester group in the side chain (Acryt 1SX-1123 (manufactured by Taisei Fine Chemicals Co., Ltd.))
-Curing agent: Polyfunctional curing agent HDI-based polyisocyanate (Duranate 24A-100 (manufactured by Asahi Kasei Corporation))

[Adjustment example 2]
The following main agent and curing agent were mixed at a dry solid content ratio of 10: 1, and an antistatic composition 2 having a total solid content concentration of 1.5% by mass was prepared with a diluting solvent of methanol.
-Main agent: Acrylic polymer compound having a quaternary ammonium base, a carboxyl group, and a (meth) acrylic acid ester group in the side chain (Acryt 1SX-1123 (manufactured by Taisei Fine Chemicals Co., Ltd.))
-Curing agent: Polyfunctional aziridine-based curing agent Tris (1-aziridine propionic acid) 1,1,1-propanetriyltrismethylene (Product name: Chemitite PZ-33 (manufactured by Nippon Shokubai Co., Ltd.))

[Adjustment example 3]
The following main agent and curing agent were mixed at a dry solid content ratio of 10: 1 to prepare an antistatic composition 3 having a total solid content concentration of 1.5% by mass with a diluting solvent (methanol / ethyl acetate = 1/1). ..
-Main agent: Acrylic polymer compound having a quaternary ammonium base, a hydroxyl group, and a (meth) acrylic acid ester group in the side chain (Acryt 1SX-1124 (manufactured by Taisei Fine Chemicals Co., Ltd.))
-Curing agent: Polyfunctional curing agent HDI-based polyisocyanate Duranate 24A-100 (manufactured by Asahi Kasei Corporation)

[Adjustment example 4]
The following main agent and curing agent are mixed at a dry solid content ratio of 10: 1, and an antistatic composition 4 having a total solid content concentration of 1.2% by mass is prepared with a diluting solvent (2-propanol / water = 7/3). did.
-Main agent: Acrylic polymer compound having carboxylate anion in the side chain, and polythiophene conductive polymer compound PEDOT / PSS (Product name Aracoat AS-601D (manufactured by Arakawa Chemical Co., Ltd.))
-Curing agent: Polyfunctional epoxy curing agent Polyglycerol polyglycidyl ether (Product name Denacol EX-512 (manufactured by Nagase ChemteX Corporation))

[Adjustment example 5]
The following main agent and curing agent are mixed at a dry solid content ratio of 10: 1, and an antistatic composition 5 having a total solid content concentration of 1.2% by mass is prepared with a diluting solvent (2-propanol / water = 7/3). did.
-Main agent: Acrylic polymer compound having carboxylate anion in the side chain, and polythiophene conductive polymer compound PEDOT / PSS (Product name Aracoat AS-601D (manufactured by Arakawa Chemical Co., Ltd.))
-Curing agent: Polyfunctional aziridine-based curing agent Tris (1-aziridine propionic acid) 1,1,1-propanetriyltrismethylene (product name: Chemitite PZ-33 (manufactured by Nippon Shokubai))

[Adjustment example 6]
The following main agent / curing agent / fine particles are mixed at a dry solid content ratio of 10/1 / 0.3, and the total solid content concentration is 2 in a diluting solvent (water / methanol / ethyl acetate = 0.2 / 1/1). A 5.5 mass% antistatic composition 6 was prepared.
-Main agent: Acrylic polymer compound having a quaternary ammonium base, a carboxyl group, and a (meth) acrylic acid ester group in the side chain (Acryt 1SX-1123 (manufactured by Taisei Fine Chemicals Co., Ltd.))
-Curing agent: Polyfunctional curing agent HDI-based polyisocyanate (product name: Duranate 24A-100 (manufactured by Asahi Kasei Corporation))
・ Moisture absorbing and releasing fine particles (Product name: Tuftic HU-707E (manufactured by Japan Exlan Co., Ltd.))

[Adjustment example 7]
The following main agent was used as a diluting solvent in methanol to prepare an antistatic composition 7 having a total solid content concentration of 2.5% by mass.
-Main agent: Acrylic polymer compound having a quaternary ammonium base and a (meth) acrylic acid ester group in the side chain (Product name: Acryt 1SX-1090 (manufactured by Taisei Fine Chemicals Co., Ltd.))

[Adjustment example 8]
The following main agent and curing agent were mixed at a dry solid content ratio of 10: 1 to prepare an antistatic composition 8 having a total solid content concentration of 0.5% by mass with a diluting solvent (methanol / ethyl acetate = 1/1). ..
-Main agent: Acrylic polymer compound having a quaternary ammonium base, a carboxyl group, and a (meth) acrylic acid ester group in the side chain (Product name: Acryt 1SX-1123 (manufactured by Taisei Fine Chemicals Co., Ltd.))
-Curing agent: Polyfunctional curing agent HDI-based polyisocyanate (product name: Duranate 24A-100 (manufactured by Asahi Kasei Corporation))

[Adjustment example 9]
The following main agent and curing agent were mixed at a dry solid content ratio of 10: 1 to prepare an antistatic composition 9 having a total solid content concentration of 5% by mass with a diluting solvent (methanol / ethyl acetate = 1/1).
-Main agent: Acrylic polymer compound having a quaternary ammonium base, a carboxyl group, and a (meth) acrylic acid ester group in the side chain (Product name: Acryt 1SX-1123 (manufactured by Taisei Fine Chemicals Co., Ltd.))
-Curing agent: Polyfunctional curing agent HDI-based polyisocyanate (Product name: Duranate 24A-100 (manufactured by Asahi Kasei Corporation))

[Adjustment example 10]
The following main agent and curing agent were mixed at a dry solid content ratio of 10: 1 to prepare an antistatic composition 10 having a total solid content concentration of 1.5% by mass with a diluting solvent (methanol / ethyl acetate = 1/1). ..
-Main agent: Acrylic polymer compound having a quaternary ammonium base, a carboxyl group, and a (meth) acrylic acid ester group in the side chain (Product name: Acryt 1SX-1123 (manufactured by Taisei Fine Chemicals Co., Ltd.))
-Curing agent: Polyfunctional curing agent with cyclic structure IPDI-based polyisocyanate (Product name: Takenate D-140 (manufactured by Mitsui Chemicals, Inc.))

[Adjustment example 11]
The following main agent and curing agent are mixed at a dry solid content ratio of 10: 1 to prepare an antistatic composition 11 having a total solid content concentration of 1.2% by mass with a diluting solvent (2-propanol / water = 7/3). did.
-Main agent: Acrylic polymer compound having carboxylate anion in the side chain, and polythiophene conductive polymer compound PEDOT / PSS (Product name Aracoat AS-601D (manufactured by Arakawa Chemical Co., Ltd.))
-Curing agent: Aziridine-based curing agent having a cyclic structure (Chemitite DZ-22E (manufactured by Nippon Shokubai Co., Ltd.))

(Manufacturing of cover tape)
[Example 1]
As a base material layer, a 25 μm-thick biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having corona treatment on both sides was prepared. The antistatic composition 1 was applied to one surface side of the PET film and cured to form an antistatic layer. Urethane-based anchor coating agent (Takenate A-3075 / Takelac A-3210 (mass ratio) = 3/1 diluted with 5% ethyl acetate) is applied to the surface of the PET film opposite to the surface on which the antistatic layer is formed. It was applied to form an anchor layer. Next, polyethylene resin (CE4009 manufactured by Sumitomo Chemical Co., Ltd.) and polyethylene resin (Sumikasen L705 manufactured by Sumitomo Chemical Co., Ltd.) and ethylene-vinyl acetate copolymer (Melsen (registered trademark) M (MX53C) manufactured by Tosoh Co., Ltd.) were melt-extruded. And 40/60 (mass ratio) were mixed and laminated to a thickness of 20 μm each to form an intermediate layer and a heat seal layer, respectively.
As a result, the cover tape 1 having an antistatic layer / base material layer / anchor layer / intermediate layer / heat seal layer was produced.

[Examples 2 to 6]
Cover tapes 2 to 6 were produced in the same manner as in Example 1 except that an antistatic layer was formed by applying the antistatic compositions 2 to 6.

[Comparative Examples 1 to 5]
Cover tapes 7 to 11 were produced in the same manner as in Example 1 except that an antistatic layer was formed by applying the antistatic compositions 7 to 11.

(Measurement of surface resistivity before steel wool test)
The surface resistivity (R11) of the antistatic layers of the cover tapes 1 to 11 manufactured above was measured at an applied voltage of 1000 V in a 25 ° C. and 50% RH environment. As the resistivity meter, a high resistance / resistivity meter manufactured by Mitsubishi Chemical Analytech Co., Ltd. was used.

(Steel wool test)
The cover tape was fixed to the table of the reciprocating wear tester so that the antistatic layer side was on the surface, and the reciprocating wear test was carried out in accordance with the following test conditions.

(Test condition)
Equipment: Reciprocating wear tester TYPE30S (Shinto Kagaku Co., Ltd.)
Steel wool count: # 0000 (made by Bonster)
Load: 80g
Number of reciprocating wear: 5 times Movement speed: 600 to 650 mm / min
Travel distance: 50mm
Test environment: 25 ° C, 50% RH environment

(Measurement of surface resistivity after steel wool test)
The surface resistivity (R21) of the antistatic layers of the cover tapes 1 to 11 after the steel wool test was measured at an applied voltage of 1000 V in a 25 ° C. and 50% RH environment.
Then, as the surface resistance change rate, the value R1 (R21 / R11) obtained by dividing R21 by R11 was obtained.

(Measurement of change rate of surface intrinsic resistance after storage in moist heat environment)
The cover tapes 1 to 11 produced above were stored in a constant temperature and humidity test room at 60 ° C. and 95% RH for 24 hours. The surface resistivity (R12) of each cover tape after storage was measured in the same manner as described above (measurement of surface resistivity before the steel wool test). Next, the steel wool test was performed, and the surface resistivity (R22) was measured in the same manner as above (measurement of the surface resistivity after the steel wool test). Then, the value R2 (R22 / R12) obtained by dividing R22 by R12 was obtained as the rate of change in surface resistance.

[Evaluation of abnormal behavior number]
Using the cover tapes 1 to 11, a sample of the package was prepared as follows, and the number of abnormal behaviors of the electronic components when the cover tape was peeled off from the package was measured.

(Sample preparation)
A sample of the package was prepared under the following conditions. Roll-shaped packaging by winding the paper carrier tape and cover tape while heat-sealing them under the following conditions using the following taping machine while continuously arranging the following 500 electronic components in the following paper carrier tape cavities. Body samples were obtained.

(Sample preparation conditions)
Taping machine NST-35 (manufactured by Nitto Kogyo Co., Ltd.)
Paper carrier: Hokuetsu Kishu Paper HOCTO 31mmt (virgin paper)
Taping temperature: 180 ° C
Taping speed: 3500 Tact seal width: 0.6 mm x 2
Electronic components: 0402 size capacitors

(Measurement of abnormal behavior number)
The cover tape was peeled off from the roll-shaped package produced above using a cover tape peeling device (W08f Intelligent Feeder, manufactured by FUJI) at a speed of 100 mm / sec. The peeling was performed in an environment of 25 ± 3 ° C. and 30 ± 5% RH, and was completed in 10 seconds. The behavior of electronic components during peeling was observed with a high-speed camera. When the chip protrudes more than half from the paper carrier cavity during peeling (when the electronic component sticks to the cover tape, when the electronic component rotates 90 degrees and stands up, the electronic component pops out from the cavity of the paper carrier tape. The number of abnormal behaviors was calculated by visually observing the number of abnormal behaviors while playing back the images taken by the high-speed camera in slow motion.

Similarly, after storing the roll of the package in a constant temperature and humidity test room at 60 ° C. and 95% RH for 24 hours, the number of abnormal behaviors was measured using the cover tape peeling device. The results are shown in Table 1.

From Table 1, the cover tapes (Examples 1 to 6) in which the change ratio R1 of the surface intrinsic resistance of the antistatic layer before and after the test of the abrasion resistance test with steel wool of the present disclosure is 10 or more and 100 or less are used. In the case of the package used, the abnormal behavior of the chip could be suppressed. Above all, when the cover tapes 4 and 5 using the conductive polymer were used, the number of abnormal chip behaviors could be significantly reduced even when stored in a moist heat environment.

1 ... Cover tape 2 ... Base material layer 3 ... Heat seal layer 4 ... Antistatic layer 5 ... Intermediate layer 10 ... Package 11 ... Carrier tape 12 ... Storage 13 ... Electronic components

Claims (8)

1. Base layer and
   A heat seal layer arranged on one surface side of the base material layer and
   An antistatic layer arranged on the surface side of the base material layer opposite to the surface on the heat seal layer side,
   Have,
   Electronic component packaging in which the change ratio R1 of the surface intrinsic resistance of the antistatic layer before and after the antistatic layer is subjected to the rubbing resistance test with steel wool satisfies 10 ≦ R1 ≦ 100. Cover tape for.
2. The rate of change in the surface intrinsic resistance of the antistatic layer before and after the rubbing resistance test when the antistatic layer is subjected to the rubbing resistance test with steel wool after being stored in an environment of 60 ° C. and 95% RH for 24 hours. The cover tape for packaging electronic components according to claim 1, wherein R2 satisfies 20 ≦ R2 ≦ 35.
3. The antistatic layer has an acrylic main chain, a side chain containing a quaternary ammonium base, and a crosslinked resin containing a crosslinked structure, and the crosslinked structure is -NHC (= O) O-, -NHC (= O). -Or, the cover tape for packaging electronic parts according to claim 1 or 2, which has -C (= O) OC ₂ H _{4 NH-.}
4. The cover tape for packaging electronic components according to claim 3, wherein the antistatic layer does not contain a compound having a cyclic structure.
5. According to claim 3 or 4, the antistatic layer material of the antistatic layer has a first crosslinkable acrylic polymer containing a crosslinkable functional group and a quaternary ammonium base, and a polyfunctional curing agent. Described cover tape for packaging electronic parts.
6. The antistatic layer has a conductive polymer and a crosslinked resin containing an acrylic main chain and a crosslinked structure, and the crosslinked structure is -C (= O) OC ₂ H ₄ NH- or -C (OH) CH. _{2 The} cover tape for packaging electronic parts according to claim 1 or 2, which has OC (= O)-.
7. The electron according to claim 6, wherein the antistatic layer material of the antistatic layer has a conductive polymer, a second crosslinkable acrylic polymer containing a carboxylate anionic group, and a polyfunctional curing agent. Cover tape for parts packaging.
8. A carrier tape with multiple storage units for storing electronic components,
   Electronic components stored in the storage unit and
   The cover tape for packaging electronic components according to any one of claims 1 to 7, which is arranged so as to cover the storage portion.
   A packaging body.

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