JP2022180578A - Cover tape for packaging electronic component and electronic component packaging body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress breakage of a cover tape when peeling the cover tape from a carrier tape.

SOLUTION: A cover tape 1 for packaging an electronic component comprises a base layer 14 and a sealant layer 11 provided on one side of the base layer. The base layer contains a polyester and has a thickness of 10-30 μm. In addition, when an average value of a peel strength in [Condition 1] is F_Low, and the average value of the peel strength in [Condition 2] is F_High, a value of F_High/F_Low is between 1.0-2.0. [Condition 1] Sealing conditions: A cover tape with a width of 5.3 mm is brought into contact with the surface of "CLEAREN CST2401" manufactured by Denka Co., Ltd. on a sealant layer side surface, and heat-sealed at 160°C, 4 kg/cm², for 0.1 second to obtain a composite. Peeling condition: The composite is peeled at a peel speed of 300 mm/min and a peel angle of 180°, and the peel strength is measured. [Condition 2] The condition is the same as [Condition 1] except a heat sealing temperature of 200°C.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2023,JPO&INPIT

Description

TECHNICAL FIELD The present invention relates to a cover tape for electronic component packaging and an electronic component package. More specifically, the present invention relates to an electronic component packaging cover tape and an electronic component package including the electronic component packaging cover tape and a carrier tape.

Carrier tapes and cover tapes are often used when transporting, storing, etc. electronic components.
Specifically, first, an electronic component (semiconductor chip, etc.) is placed in a recess formed in a carrier tape, and then a cover tape is heat-sealed on the upper surface of the carrier tape to enclose the electronic component. Then, it is reeled up and transported/stored.

Typically, the cover tape comprises two layers, a base layer and a sealant layer (heat seal layer). The sealant layer is a layer for heat sealing with the carrier tape.

As an example, Patent Literature 1 describes that a sealant layer is formed using a coating liquid containing a specific thermoplastic resin, a carbon nanomaterial, and a solvent.
As another example, Patent Document 2 discloses a block copolymer of a styrene hydrocarbon and a conjugated diene hydrocarbon, an ethylene-α-olefin random copolymer, and a block of a styrene hydrocarbon and a conjugated diene hydrocarbon. It describes forming a sealant layer using a resin composition containing a copolymer and impact-resistant polystyrene.

JP-A-2007-45513 Japanese Patent Publication No. 2003-508253

Conventionally, when peeling the cover tape from the carrier tape, the cover tape sometimes breaks.
Therefore, the present inventor proceeded with the study for the purpose of suppressing breakage of the cover tape when peeling the cover tape from the carrier tape.

As a result of studies, the inventor completed the invention provided below and solved the above problems.

According to the present invention, the following cover tape is provided.

A cover tape for packaging electronic components, comprising a base layer and a sealant layer provided on one side of the base layer,
The base layer contains polyester and has a thickness of 10 to 30 μm,
When the average value of the peel strength obtained by [Condition 1] below is F _Low , and the average value of the peel strength obtained by [Condition 2] below is F _High , the value of F _High /F _Low is from 1.0 to 2.0 cover tape.
[Condition 1]
Sealing conditions: The cover tape was slit to a width of 5.3 mm to make a long shape, and the surface on the sealant layer side was brought into contact with the surface of a carrier tape sheet "Clearen CST2401" manufactured by Denka Co., Ltd., and , 160° C., 4 kg/cm ² , and 0.1 second to obtain a composite.
Peeling conditions: The composite is peeled at a peel speed of 300 mm/min and a peel angle of 180°, and the peel strength is measured.
[Condition 2]
Same conditions as [Condition 1] except that the heat seal temperature was 200°C.

Further, according to the present invention, the following electronic component package is provided.

A carrier tape in which an electronic component is housed in a recess, and the above cover tape,
An electronic component package, wherein the sealant layer is adhered to the carrier tape so as to seal the electronic component.

ADVANTAGE OF THE INVENTION According to this invention, when peeling a cover tape from a carrier tape, it becomes difficult to break a cover tape.

It is a figure for demonstrating an example of the layer structure of the cover tape of this embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The drawings are for illustrative purposes only. The shape and dimensional ratio of each member in the drawings do not necessarily correspond to the actual article.

In this specification, the notation "X to Y" in the description of numerical ranges means X or more and Y or less, unless otherwise specified. For example, "1 to 5% by mass" means "1% by mass or more and 5% by mass or less".

In the description of a group (atomic group) in the present specification, a description without indicating whether it is substituted or unsubstituted includes both those having no substituent and those having a substituent. For example, the term “alkyl group” includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups).
The notation "(meth)acryl" used herein represents a concept that includes both acryl and methacryl. The same applies to similar notations such as "(meth)acrylate".
The term "organic group" as used herein means an atomic group obtained by removing one or more hydrogen atoms from an organic compound, unless otherwise specified. For example, a "monovalent organic group" represents an atomic group obtained by removing one hydrogen atom from an arbitrary organic compound.

In this specification, the notation "gf" represents the unit of force "gram force". The notation "kgf" represents the unit of force "kilogram force". By multiplying the numerical values expressed in these units by the gravitational acceleration, it is possible to convert them into other unit systems.

<Cover tape>
FIG. 1 is a diagram schematically showing a layer structure of a cover tape (cover tape 1) for packaging electronic components according to this embodiment.
The cover tape 1 includes at least a base layer 14 and a sealant layer 11 on one side of the base layer 14 .

The cover tape 1 can include an intermediate layer 12, an adhesive layer 13, and the like between the base layer 14 and the sealant layer 11. FIG. These are optional layers.

In the cover tape 1, when the average value of the peel strength obtained by [Condition 1] below is F _Low , and the average value of the peel strength obtained by [Condition 2] below is F _High , the value of F _High /F _Low . is between 1.0 and 2.0.
[Condition 1]
Sealing conditions: The cover tape 1 was slit to a width of 5.3 mm and made into a long shape, and the surface on the sealant layer side was brought into contact with the surface of a carrier tape sheet "Clearen CST2401" manufactured by Denka Co., Ltd., and , 160° C., 4 kg/cm ² , and 0.1 second to obtain a composite.
Peeling conditions: The composite is peeled at a peel speed of 300 mm/min and a peel angle of 180°, and the peel strength is measured.
[Condition 2]
Same conditions as [Condition 1] except that the temperature of heat sealing is 200°C.

In order to make the cover tape less likely to break, the present inventor decided to adopt relatively "hard and strong" polyester for the base material layer. Also, the thickness of the base material layer was set to a relatively large thickness of 10 to 30 μm. These ensure the "basic" strength of the cover tape.

Further, the present inventor thought that the breakage of the conventional cover tape may be related to the fact that the adhesive force between the carrier tape and the cover tape is uneven in places.
Specifically, the seal strength is not necessarily constant over the entire heat-sealed portion due to the presence of small unevenness on the surface of the carrier tape and fluctuations in the heat-sealing conditions (temperature, time, pressing force, etc.). It is considered that the seal strength is uneven (there are portions with high seal strength and portions with low seal strength). It is believed that this non-uniformity in seal strength prevented smooth peeling of the cover tape from the carrier tape and induced breakage.

Therefore, the present inventor thought that breakage could be suppressed by designing a cover tape whose sealing strength does not change so much even if the heat sealing conditions fluctuate, and proceeded with the study. Specifically, a cover tape and a carrier tape sheet "Clearen CST2401" (polystyrene-based, single layer) manufactured by Denka Co., Ltd., which is a sheet material often used for carrier tape, were (i) heated at a temperature of 160 ° C. The seal strength (F _Low above) when sealed and (ii) the seal strength (F _High above) when heat-sealed at a temperature of 200° C. were set as design indices.
Then, the present inventor found that the cover tape with a value of F _High /F _Low of 1.0 to 2.0, that is, heat sealing at 160 ° C. and heat sealing at 200 ° C., heat sealing strength (peel strength ) was newly designed with a cover tape that does not fluctuate so much. As a result, when the cover tape heat-sealed to the carrier tape is peeled off, the cover tape is made difficult to cut.

In order to manufacture a cover tape having a value of F _High /F _Low of 1.0 to 2.0, it is important to appropriately select the material constituting the cover tape 1 and the manufacturing method. These selections will be specifically described below. Briefly, (1) adopting an appropriate polyester resin as a material constituting the base material layer 14, and designing the base material layer 14 to be appropriately thick, (2) providing the sealant layer 11 It is important to use a coating liquid containing an appropriate amount of (meth)acrylic resin and suitable inorganic particles. By providing such a base layer 14, pressure unevenness and heat unevenness during heat sealing can be reduced, and the value of F _High /F _Low can be easily adjusted to 1.0 to 2.0.

Hereinafter, the description of the specific configuration and manufacturing method of the cover tape 1 will be continued.

(Sealant layer 11)
The sealant layer 11 can contain any resin as long as it softens/melts moderately under normal heat-sealing conditions and can be heat-sealed with the carrier tape. Also, by appropriately selecting the material, thickness, etc. of the sealant layer 11, the values of F _High and F _Low can be adjusted, making it easier to suppress breakage of the cover tape.

The sealant layer 11 usually contains a thermoplastic resin. Examples of thermoplastic resins include ionomer resins, polyester resins, vinyl chloride-vinyl acetate copolymers, (meth)acrylic resins, polyurethane resins, ethylene-vinyl acetate copolymers, ethylene-(meth)acrylic acid. Copolymers, ethylene-(meth)acrylic acid ester copolymers, maleic acid resins and the like can be mentioned.
In particular, (meth)acrylic resins are preferably used because they can be heat-sealed to a wide variety of carrier tapes. When the sealant layer 11 contains a (meth)acrylic resin, the F _High /F _Low value tends to be easily adjusted, and breakage of the cover tape tends to be more easily suppressed. Although the details are unknown, the melting behavior of (meth)acrylic resins does not _change much between 160°C and ₂₀₀ °C. It is also inferred that it is easy to set it to 2.0.

Moreover, the sealant layer 11 preferably contains inorganic particles together with a suitable resin. This makes it even easier to set the value of F _High /F _Low to 1.0 to 2.0.
Examples of inorganic particles include sulfide particles such as zinc sulfide, copper sulfide, cadmium sulfide, nickel sulfide, and palladium sulfide; metal oxides such as aluminum oxide, tin oxide, zinc oxide, indium oxide, and titanium oxide; and carbon fine particles. be able to. Metal oxides are preferable as the inorganic particles because of their availability and ease of adjustment of the peel strength.
The average particle size of the inorganic particles is preferably 10-1000 nm, preferably 50-500 nm. By selecting inorganic particles with an appropriate average particle size, it is easy to set the value of F _High /F _Low to 1.0 to 2.0 while maintaining various performances.
When the sealant layer 11 contains inorganic particles, the amount thereof is, for example, 1 to 20 parts by weight, preferably 1 to 10 parts by weight, with respect to 100 parts by weight of the resin (thermoplastic resin).

In order to impart an antistatic effect to the sealant layer 11, the sealant layer 11 may contain a conductive filler such as a metal oxide, a polymer type copolymer type antistatic agent, etc. (the above-mentioned inorganic particles are , may also serve as a conductive filler). The sealant layer 11 may further contain additives such as dispersants, fillers and plasticizers, if necessary.

The thickness of the sealant layer 11 is preferably 0.1 to 5 μm, more preferably 0.5 to 3 μm, from the viewpoint of obtaining sufficient heat sealability without excessively impairing other performances.

(Intermediate layer 12)
If the cover tape 1 comprises an intermediate layer 12 , the intermediate layer 12 is typically present between the sealant layer 11 and the base layer 14 .
The intermediate layer 12 does not necessarily have to be in direct contact with the sealant layer 11 or the base layer 14 . That is, there may be additional layers between the base layer 14 and the intermediate layer 12 and there may be additional layers between the sealant layer 11 and the intermediate layer 12 . Of course, the intermediate layer 12 may be in contact with the base layer 14 and the sealant layer 11 .
By providing the cover tape 1 with the intermediate layer 12, the cushioning properties, impact resistance, etc. of the cover tape 1 can be enhanced. In addition, when the cover tape 1 is provided with the intermediate layer 12, the pressing force at the time of heat sealing is moderately leveled, and the value of F _High /F _Low is easily designed to be 1.0 to 2.0. There is

Materials for the intermediate layer 12 include olefin-based resins, styrene-based resins, cyclic olefin-based resins, and the like. Among these, olefin resins are preferable from the viewpoint of improving the cushioning properties of the entire cover tape 1 .
Examples of olefinic resins include polyethylene and polypropylene. Among them, polyethylene is preferred. Low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is particularly preferred from the standpoint of cushioning properties. High-density polyethylene (HDPE) is also preferable from the viewpoint of achieving both cushioning properties and strength.
The intermediate layer 12 may contain various additives. Examples of additives include those mentioned for the sealant layer and base layer.

When an intermediate layer is provided, its thickness is preferably 10 to 50 μm, more preferably 15 to 45 μm, from the viewpoint of improving the cushioning properties of the entire cover tape without excessively impairing other performances.

(Adhesion layer 13)
Adhesive layer 13 may be provided for bonding intermediate layer 12 and substrate layer 14 together, for example, when cover tape 1 includes intermediate layer 12 .
As a material for forming the adhesive layer 13, generally, a combination of a polyol such as polyester polyol or polyether polyol and an isocyanate compound can be used.
As a material for forming the adhesive layer 13, a known solvent-based or water-based anchor coating agent can be used. More specifically, isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based anchor coating agents can be used.
Further, as a material for forming the adhesive layer 13, a urethane-based adhesive resin for dry lamination may be used.

Incidentally, the adhesiveness can be further improved by subjecting the bonding surfaces of the intermediate layer 12 and/or the base layer 14 to corona treatment. The conditions for this corona treatment may be appropriately adjusted.

The thickness of the adhesive layer 13 is preferably 0.001-10 μm, more preferably 0.01-5 μm. By setting the thickness to an appropriate level, deterioration of visibility can be suppressed while sufficient adhesiveness is obtained.

(Base material layer 14)
As described above, the base material layer 14 contains a polyester-based resin. Polyester-based resins are preferable from the viewpoint of mechanical strength. That is, by configuring the base material layer 14 with a material containing a polyester resin, it is easy to obtain sufficient mechanical strength to withstand peeling of the cover tape from the carrier tape. Polyester resin also has the advantage of being resistant to heat when the cover tape 1 is heat-sealed to the carrier tape.

Specific examples of polyester resins include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate and derivatives thereof. From the balance of mechanical strength, heat resistance, cost, etc., the base material layer 14 preferably contains polyethylene terephthalate (PET).

The base layer 14 may be stretched or unstretched.
When forming the base layer 14, a commercially available polyester-based resin film may be used. Among commercially available polyester-based resin films, for example, Espet (registered trademark) film T7410 manufactured by Toyobo Co., Ltd. can be preferably used. Although the details are unknown, the use of this film facilitates designing the value of F _High /F _Low to 1.0 to 2.0. Incidentally, this film is a biaxially stretched film.

The substrate layer 14 preferably contains an antistatic agent. As a result, it is possible to suppress static electricity charging when storing and transporting the electronic parts or when peeling the cover tape 1 from the carrier tape, and damage to the electronic parts can be suppressed.

Examples of the antistatic agent include conductive fillers such as metal oxides, polymer type copolymer type antistatic agents, surfactant type antistatic agents, and the like.
When the base material layer 14 contains an antistatic agent, it may be contained in the base material layer 14 or may be laminated on the base material layer 14 by coating.

The thickness of the base layer 14 is 10-30 μm, preferably 10-27.5 μm, more preferably 10-25 μm. When the thickness of the base material layer 14 is 10 to 30 μm, pressure unevenness and heat unevenness during heat sealing are reduced, and the value of F _High /F _Low is easily adjusted to 1.0 to 2.0. .
Moreover, since the thickness of the base material layer 14 is 30 μm or less, the rigidity of the cover tape 1 is not excessively increased. As a result, even when torsional stress is applied to the carrier tape after sealing, the cover tape 1 easily follows the deformation of the carrier tape. Therefore, it is possible to prevent the cover tape from unintentionally peeling off from the carrier tape.
Further, by setting the thickness of the base material layer 14 to 10 μm or more, the mechanical strength of the cover tape 1 can be sufficiently improved. Therefore, even when peeling the cover tape 1 from the carrier tape at high speed, for example, breakage of the cover tape can be suppressed.

(Other layers)
The cover tape 1 may or may not have layers other than those described above.
As one aspect, from the viewpoint of setting the value of F _High /F _Low to 1.0 to 2.0 due to the characteristics of the base layer 14 that it is "relatively hard and thick", the cover tape 1 is composed of the above layers ( It is preferred that no extra layers other than the sealant layer 11, the intermediate layer 12, the adhesive layer 13 and the base layer 14) are provided. For example, some conventional cover tapes include a nylon (polyamide) containing layer, but the cover tape 1 need not include such a layer.

(Additional explanation regarding F _High , F _Low , etc.)
In the cover tape 1, the value of F _High /F _Low should be 1.0 to 2.0. The value of F _High /F _Low is preferably between 1.05 and 1.60.
The value of F _Low itself is preferably 5 to 80 gf, more preferably 10 to 70 gf, still more preferably 20 to 60 gf. The value of F _High itself is 1.0 to 2.0 times these numerical values. When the values of F _Low and F _High themselves are within an appropriate range, the housed electronic components can be appropriately protected and easily peeled off under normal cover tape peeling conditions.

Just to make sure, it is explained that F _Low and F _High are "average values".
F _Low is the “average value” of the peel strength obtained according to [Condition 1], in the test of [Condition 1], the horizontal axis is the measurement time t, and the magnitude of the force measured during peeling This means that the average of the graph plotted on the vertical axis of F (the value obtained by dividing the total peel strength measured at regular time intervals by the number of measurement points) is adopted as F _Low . However, when calculating this average, the "rising part" near t=0 and the "falling part" near t=the end of the measurement time in the graph are excluded.
Similarly, F _High is the “average value” of the peel strength obtained by [Condition 2] means that in the test of [Condition 2], the horizontal axis is the measurement time t, and the force measured during peeling This means that the average of a graph in which the magnitude F is plotted on the vertical axis (a value obtained by dividing the total peel strength measured at regular intervals by the number of measurement points) is adopted as F _High . When calculating this average, the “rising portion” near t=0 and the “falling portion” near t=the end of the measurement time in the graph are excluded.

As a point of view different from F _Low and F _High , in a graph plotting the measurement time on the horizontal axis and the magnitude of the force measured during peeling off on the vertical axis during the test of [Condition 1], the force The value of f _max /f _min is preferably 1 to 1.6, more preferably 1 to 1.4, where f _max is the maximum magnitude and f _min is the minimum magnitude of the force.
In addition to small fluctuations in peel strength when the temperature changes (the value of F _High /F _Low is 1.0 to 2.0), fluctuations in peel strength in one peel at a constant temperature is small, it is possible to further suppress breakage of the cover tape.

Incidentally, the value of f _min itself is preferably 20 to 50 gf. And the value of f _max itself is preferably 1.0 to 1.4 times these values. By appropriately designing the value of f _min itself and the value of f _max itself, it is possible to provide a cover tape that can adequately protect the housed electronic components and that can be easily peeled off under normal peeling conditions.

(Width and length of cover tape)
The width and length of the cover tape 1 can be appropriately set mainly according to the width and length of the carrier tape to be heat-sealed.
Typically, the width of the cover tape 1 is, for example, about 1 to 100 mm, preferably about 2 to 100 mm. Also, the length is about 100 to 10,000 m.

(Production method)
A manufacturing method of the cover tape 1 is not particularly limited. For example, it can be manufactured by applying a known extrusion method, lamination method, coating method, or the like.

More specifically, the cover tape 1 can be manufactured by the following procedures.
(1) A film corresponding to the substrate layer 14 is prepared. The film may be subjected to surface treatment such as corona treatment.
(2) The film prepared in (1) and the film corresponding to the intermediate layer 12 are laminated. For lamination, for example, a dry lamination method can be applied. When laminating by dry lamination, the adhesive layer 13 is formed between the base layer 14 and the intermediate layer 12 .
(3) A sealant layer 11 is formed by a coating method on the surface of the laminate film obtained in (2) where the intermediate layer 12 is exposed. For example, a coating liquid obtained by dissolving or dispersing a (meth)acrylic resin or inorganic particles in an organic solvent such as toluene is applied to the exposed surface of the intermediate layer 12 using a bar coater, roll coater, gravure coater, or the like. Depending on the coating method and the desired film thickness, the non-volatile content concentration of the coating liquid may be adjusted, for example, between 10 and 50% by mass.
After coating, the sealant layer 11 can be formed by performing a drying treatment at about 65 to 75°C. By using an appropriate coating liquid and drying at an appropriate temperature, the surface condition after drying becomes appropriate, and a cover tape having an F _High /F _Low value of 1.0 to 2.0 can be easily produced. A commercially available product may be used as the coating liquid. Commercially available coating liquids are available from, for example, DIC Corporation.
(4) If necessary, the obtained film is cut into suitable lengths and widths.

<Electronic component package>
An electronic component package can be manufactured by heat-sealing the carrier tape in which the electronic components are accommodated in the recesses and the cover tape 1 described above.
More specifically, an electronic component package in which the sealant layer 11 of the cover tape 1 is adhered to the carrier tape so as to seal the electronic components can be obtained by the following procedure.
(1) Prepare a carrier tape in which electronic components are housed in recesses.
(2) Using the cover tape 1, the entire surface of the opening of the carrier tape is covered (at this time, the sealant layer 11 is brought into contact with the carrier tape).
(3) Apply heat sealing treatment.

Specific methods and conditions for heat sealing are not particularly limited as long as the cover tape 1 adheres to the carrier tape sufficiently strongly. Typically, a known taping machine can be used at a temperature of 100 to 240° C., a load of 0.1 to 10 kgf (0.98 to 98 N), and a time of 0.0001 to 1 second.

The obtained electronic component package is wound on a reel, for example, and then transported to a work area for mounting the electronic component on an electronic circuit board or the like. The reel material can be metal, paper, plastic, or the like.
After the electronic component package is transported to the work area, the cover tape 1 is peeled off from the carrier tape, and the contained electronic components are taken out.

Electronic components to be accommodated are not particularly limited. Examples include semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, electrodes, and other general parts used in the manufacture of electrical and electronic equipment.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than those described above can be adopted. Moreover, the present invention is not limited to the above-described embodiments, and includes modifications, improvements, etc. within the scope of achieving the object of the present invention.

Embodiments of the present invention will be described in detail based on examples and comparative examples. It should be noted that the invention is not limited to the examples only.

(Example 1: Production of cover tape)
It was manufactured according to the following procedure.
(1) As a substrate layer, a biaxially oriented polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., Espet (registered trademark) E5100) having a thickness of 12 μm was prepared.
(2) Polyethylene was laminated by dry lamination (using a urethane-based adhesive) to a film thickness of 25 μm on the corona-treated surface side of the base material layer. This provided an intermediate layer.
(3) After the exposed surface of the intermediate layer was subjected to corona treatment, a coating solution was prepared by mixing 30% by mass of an acrylic sealant resin (A450A, manufactured by DIC), 2% by mass of aluminum oxide having an average particle size of 100 nm, and 68% by mass of toluene. It was applied and dried at 70° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Example 2: Production of cover tape)
It was manufactured according to the following procedure.
(1) As a substrate layer, a biaxially oriented polyethylene terephthalate film (Espet (registered trademark) E5100, manufactured by Toyobo Co., Ltd.) having a thickness of 25 μm was prepared.
(2) Polyethylene was laminated by dry lamination (using a urethane-based adhesive) to a film thickness of 25 μm on the corona-treated surface side of the base material layer. This provided an intermediate layer. (3) After the exposed surface of the intermediate layer was subjected to corona treatment, a coating solution was prepared by mixing 30% by mass of an acrylic sealant resin (A450A, manufactured by DIC), 2% by mass of aluminum oxide having an average particle size of 100 nm, and 68% by mass of toluene. It was applied and dried at 70° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Example 3: Production of cover tape)
It was manufactured according to the following procedure.
(1) As a substrate layer, a biaxially oriented polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., Espet (registered trademark) E5100) having a thickness of 12 μm was prepared.
(2) Polyethylene was laminated on the corona-treated surface of the base material layer by dry lamination (using a urethane-based adhesive) so as to have a film thickness of 45 μm. This provided an intermediate layer.
(3) After the exposed surface of the intermediate layer was subjected to corona treatment, a coating solution was prepared by mixing 30% by mass of an acrylic sealant resin (A450A, manufactured by DIC), 2% by mass of aluminum oxide having an average particle size of 100 nm, and 68% by mass of toluene. It was applied and dried at 70° C. to provide a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Example 4: Production of cover tape)
It was manufactured according to the following procedure.
(1) As a substrate layer, a biaxially oriented polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., Espet (registered trademark) E5100) having a thickness of 45 μm was prepared.
(2) Polyethylene was laminated on the corona-treated surface of the base material layer by dry lamination (using a urethane-based adhesive) so as to have a film thickness of 45 μm. This provided an intermediate layer.
(3) After corona-treating the exposed surface of the intermediate layer, 30% by mass of an acrylic sealant resin (Mitsubishi Chemical Co., Dianal BR-116), 2% by mass of aluminum oxide having an average particle size of 100 nm, and 68% by mass of toluene. The mixed coating solution was applied and dried at 70° C. to form a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Comparative Example 1: Production of cover tape)
It was manufactured according to the following procedure.
(1) As a substrate layer, a biaxially oriented polyethylene terephthalate film (Espet (registered trademark) E5100, manufactured by Toyobo Co., Ltd.) having a thickness of 25 μm was prepared.
(2) An intermediate layer of polyethylene was laminated to a thickness of 25 μm on the corona-treated surface of the substrate layer.
(3) After the exposed surface of the intermediate layer was subjected to corona treatment, a styrene-based sealant resin (LX2507H manufactured by Nippon Zeon Co., Ltd.) was applied and dried to form a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Comparative Example 2: Production of cover tape)
It was manufactured according to the following procedure.
(1) As a substrate layer, a biaxially oriented polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., Espet (registered trademark) E5100) having a thickness of 12 μm was prepared.
(2) Polyethylene was laminated on the corona-treated surface of the base material layer by dry lamination (using a urethane-based adhesive) so as to have a film thickness of 45 μm. This provided an intermediate layer.
(3) After the exposed surface of the intermediate layer was subjected to corona treatment, a styrene-based sealant resin (LX2507H manufactured by Nippon Zeon Co., Ltd.) was applied and dried to form a sealant layer. The coating amount was adjusted so that the film thickness after drying was 2 μm.

(Measurement under [Condition 1])
Each of the cover tapes obtained in Examples 1 and 2 and Comparative Example 1 was cut to a width of 5.5 mm.
The cut cover tape was heat-sealed to an 8-mm-wide sheet of carrier tape sheet "Clearen CST2401" manufactured by Denka Co., Ltd. (flat sheet used as a material for the carrier tape) under the following conditions. This gave a composite for testing.
・Equipment: ISMECA MBM4000 (taping machine)
・ Iron shape at the time of sealing: blade width 0.3 mm / blade length 54 mm / blade interval 1.95 mm (two 0.3 mm × 54 mm trowels are lined up at 1.95 mm intervals)
・Seal temperature: 160°C
・Sealing time: 0.1s
・Seal pressure: 4 kgf/cm ²

Using the obtained composite, the peel strength between the cover tape and the carrier tape was measured under the following conditions.
・ Peeling device: 856VS (manufactured by General Production Devices)
・Peeling speed: 300mm/min
・ Peeling angle: 180°
・Standard: JIS K 0806-3

In the above measurement, F _Low , f _max and f _min were obtained from the measurement time-peeling strength relationship (graph) obtained from the peeling apparatus. For F _Low , the peel strength was measured 100 times every 0.1 seconds (10 seconds in total), excluding the "rising part" near t = 0 and the "falling part" near t = the end of the measurement time in the graph. A value obtained by dividing the total of 100 by 100 was adopted.

(Measurement under [Condition 2])
The same measurement as in [Condition 1] above was performed, except that the heat sealing temperature was changed to 200°C. Then, F _High was obtained.

(Evaluation: tape cutting test)
The test composites obtained under [Condition 1] or [Condition 2] were peeled under the following high-speed peeling conditions. At this time, it was confirmed whether or not the tape was broken.
・ Peeling device: 856VS (manufactured by General Production Devices)
・Peeling speed: 15,000mm/min
・ Peeling angle: 180°
・Standard: JIS K806-3

The evaluation results are summarized in the table below.

As shown in the table above, the evaluation of the cover tapes of Examples 1 to 4 (F _High /F _Low values of 1.0 to 2.0) did not cause tape breakage.
On the other hand, in the evaluation of the cover tapes of Comparative Examples 1 and 2 (F _High /F _Low value exceeding 2.0), tape breakage occurred when the heat sealing conditions were set to 200°C. It is presumed that the heat sealing at a relatively high temperature caused unevenness in the sealing strength in some places, and smooth peeling was not possible.

1 cover tape 11 sealant layer 12 intermediate layer 13 adhesive layer 14 base layer

Claims (7)

A cover tape for packaging electronic components, comprising a base layer and a sealant layer provided on one side of the base layer,
The base layer contains polyester and has a thickness of 10 to 30 μm,
When the average value of the peel strength obtained by [Condition 1] below is F _Low , and the average value of the peel strength obtained by [Condition 2] below is F _High , the value of F _High /F _Low is from 1.0 to 2.0 cover tape.
[Condition 1]
Sealing conditions: The cover tape was slit to a width of 5.3 mm to make a long shape, and the surface on the sealant layer side was brought into contact with the surface of a carrier tape sheet "Clearen CST2401" manufactured by Denka Co., Ltd., and , 160° C., 4 kg/cm ² , and 0.1 second to obtain a composite.
Peeling conditions: The composite is peeled at a peel speed of 300 mm/min and a peel angle of 180°, and the peel strength is measured.
[Condition 2]
Same conditions as [Condition 1] except that the heat seal temperature was 200°C. The electronic component packaging cover tape according to claim 1,
In the graph plotting the measurement time on the horizontal axis and the force magnitude measured for peeling on the vertical axis during the test of [Condition 1], f max is the maximum value of the force magnitude, and f _max is the force magnitude. A cover tape having a value of f _max /f _min of 1 to 1.6, where f _min is the minimum thickness. The electronic component packaging cover tape according to claim 1 or 2,
The cover tape, wherein the polyester contained in the base material layer contains polyethylene terephthalate. The electronic component packaging cover tape according to any one of claims 1 to 3,
A cover tape comprising an intermediate layer between the base layer and the sealant layer. The electronic component packaging cover tape according to claim 4,
The cover tape, wherein the intermediate layer comprises polyethylene. The electronic component packaging cover tape according to any one of claims 1 to 5,
The sealant layer is a cover tape containing a (meth)acrylic resin. A carrier tape in which electronic components are housed in recesses, and the cover tape according to any one of claims 1 to 6,
An electronic component package, wherein the sealant layer is adhered to the carrier tape so as to seal the electronic component.

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