JP2022081138A - Cover tape for packaging electronic component - Google Patents

Abstract

To provide a cover tape for packaging an electronic component which has an excellent balance of adhesiveness and peelability to a carrier tape when antimony is reduced, and can suppress the generation of static electricity due to peeling.SOLUTION: A cover tape for packaging an electronic component according to the present invention includes a base material layer, an intermediate layer, and a sealant layer in this order, the sealant layer includes an adhesive resin and an antistatic agent, and the antistatic agent includes one or more selected from the group consisting of (A) phosphorus-doped tin, (B) carbon nanotubes, (C) polythiophene or a polythiophene derivative, the 170° peel strength for a polystyrene film having an average surface roughness of 0.25 μm is 0.3 N or more and 0.9 N or less, and the antimony content for the entire cover tape is 0 ppm or more and 150 ppm or less.SELECTED DRAWING: Figure 1

Description

The present invention relates to a cover tape for packaging electronic components.

Conventionally, electronic components such as transistors, diodes, capacitors, and piezoelectric element registers have been used in carrier tapes in which pockets capable of accommodating the electronic components are continuously formed and the carrier tapes at the manufacturing site of electronic devices. After being housed in a package consisting of a cover tape to be sealed and heat-sealed, it is transported to a work area for surface mounting on an electronic circuit board or the like while being wound on a paper or plastic reel. There is. Then, after the cover tape of the package is peeled off in the work area described above, the electronic component is taken out from the pocket formed on the carrier tape and surface-mounted on an electronic circuit board or the like. With the recent miniaturization of electronic devices, the above electronic components are required to be further miniaturized and highly mounted. Therefore, electronic components in recent years tend to be more susceptible to static electricity than ever before.

In view of these circumstances, in recent years, it has been required to improve various characteristics described later in the cover tape used for transporting electronic components.
First, the characteristics required for the cover tape are an excellent balance between sufficient adhesive strength to the carrier tape and peelability that is successfully peeled off from the carrier tape in the mounting process. In the process of peeling the cover tape from the carrier tape, if the peel strength required to peel the cover tape from the carrier tape is too high, the carrier tape vibrates when the cover tape is peeled, and electronic components are used. Occurs the phenomenon of popping out of the storage pocket. On the other hand, if the adhesive strength between the carrier tape and the cover tape is low, the cover tape may be peeled off and the packed electronic components may fall during the transportation of the package.
Secondly, the characteristics required for the cover tape are static electricity generated by friction between the cover tape and electronic components during transportation, static electricity generated when the cover tape is peeled from the carrier tape, and attached dust and contents. The antistatic property is necessary to the extent that it is possible to prevent the electronic components housed in the package from being damaged (electrostatically destroyed) due to static electricity or the like. In particular, with regard to the technology for improving the antistatic property of the cover tape, it is possible to suppress the influence of static electricity generated by friction between the cover tape and electronic components during transportation and static electricity generated when the cover tape is peeled from the carrier tape. From this point of view, various studies have been made so far.

For example, Patent Document 1 describes a cover tape for packaging electronic components in which needle-like particles of tin oxide doped with antimony are used as an antistatic heat seal layer.

Japanese Unexamined Patent Publication No. 2019-06439

As described above in the section of the background technique, various studies have been made on improving the above-mentioned characteristics even in the conventional cover tape. However, antimony, which has been used as a good antistatic agent, has been desired to be reduced in use in recent years from the viewpoint of environmental protection.
In view of the above circumstances, the present inventor has a good balance between adhesiveness and peelability when peeling the carrier tape and the cover tape when antimony is reduced, and suppresses the generation of static electricity at the time of peeling. We have been working on the development of cover tapes for packaging electronic components that can be used.

The present invention provides a cover tape for packaging electronic components, which has an excellent balance of adhesiveness and peelability to a carrier tape and excellent antistatic property due to peeling of the carrier tape when antimony is reduced.

As a further study, the present inventor has found that the antistatic agent contained in the sealant layer of the cover tape for packaging electronic parts consists of (A) phosphorus-doped tin, (B) carbon nanotubes, or (C) polythiophene or a polythiophene derivative. For packaging electronic parts, which has a good balance between adhesiveness to carrier tape and peelability when antimony is reduced by containing one or more selected types, and can suppress the generation of static electricity due to peeling. We have found that a cover tape can be realized, and have completed the present invention.

Substrate layer and
With the middle class,
With the sealant layer,
A cover tape for packaging electronic components that has
The sealant layer contains an adhesive resin and an antistatic agent, and contains
The above antistatic agent
(A) Contains one or more selected from the group consisting of phosphorus-doped tin (B) carbon nanotubes (C) polythiophene or polythiophene derivatives.
The peel strength with respect to the polystyrene film measured by <Measurement of Peel Strength> is 0.3N or more and 0.9N or less.
A cover tape for electronic component packaging, wherein the antimony content measured for the entire cover tape for electronic component packaging is 0 ppm or more and 150 ppm or less with respect to the entire cover tape for electronic component packaging.
<Measurement of peel strength>
The cover tape for packaging electronic parts is made of polystyrene having a width of 5.5 mm and an average surface roughness (Ra) of 0.25 μm on the sealant layer side of the cover tape and a width of 8 mm. Using a double-edged iron with a single-edged blade of 0.5 mm in width and 28 mm in length, including the uneven surface side of the film, the sealing temperature is 160 ° C, the load is 5 kgf, the sealing time is 60 ms, and the carrier tape feed pitch is 4 mm. The peel strength of the cover tape for packaging electronic parts with respect to the polystyrene film when heat-sealed under the above conditions is measured under the conditions of a peeling speed of 300 mm / min, a measurement temperature of 25 ° C., and a peeling angle of 170 °.

According to the present invention, it is possible to provide a cover tape for packaging electronic components, which has an excellent balance between adhesiveness to a carrier tape and peelability when antimony is reduced, and can suppress the generation of static electricity due to peeling.

It is a figure which represented typically the example of the cover tape for electronic component packaging of this embodiment. It is a figure which shows an example of the state in which the cover tape for electronic component packaging is adhered (heat-sealed) to the carrier tape.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are designated by the same reference numerals, and the description thereof will be omitted as appropriate. Further, the figure is a schematic view and does not match the actual dimensional ratio.

<Cover tape for packaging electronic components>
FIG. 1 schematically shows an example of a cover tape for packaging electronic components according to the present embodiment.
The cover tape for packaging electronic components of the present embodiment is a cover tape for packaging electronic components including a base material layer 1, an intermediate layer 2, and a sealant layer 3 in this order.
In the cover tape 10 for packaging electronic components, the sealant layer 3 is usually adhered to the carrier tape. In other words, the upper surface side in FIG. 1 is usually adhered to the carrier tape.
Further, each layer may be composed of a plurality of layers.

<Other layers>
The cover tape 10 for packaging electronic components may be provided with an adhesive layer (not shown) between the layers. According to this adhesive layer, the adhesiveness between the layers can be improved.
Examples of the material for forming the adhesive layer include urethane-based adhesive resins for dry laminating and adhesive resins for anchor coating, and generally, examples thereof include a combination of a polyester composition such as a polyester polyol or a polyether polyol and an isocyanate compound. Be done.
Further, a layer other than the adhesive layer may be provided, and for example, a layer for improving the strength of the entire film, a water vapor barrier layer, or the like may be provided.

<Base layer>
The base material layer 1 has mechanical strength that can withstand external forces applied during processing, heat sealing to carrier tape, use, etc. of the cover tape 10 for packaging electronic components, and heat resistance that can withstand heat during heat sealing. For example, films processed from various materials can be used.

Specific examples of the material constituting the base material layer 1 include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, ABS resin and the like. Be done. Among these, as the material constituting the base material layer 1, polyester-based resin and polyolefin-based resin are preferable, and polyethylene terephthalate and polyethylene, which can improve mechanical strength, are particularly preferable. When a polyamide resin is selected as the material constituting the base material layer 1, it is preferable to use nylon which can improve mechanical strength and flexibility.

The form of the film used for forming the base material layer 1 may be a stretched film or a film stretched in a uniaxial direction or a biaxial direction, and may be a cover tape for packaging electronic components. From the viewpoint of improving the mechanical strength, a film stretched in the uniaxial direction or the biaxial direction is preferable.

The base material layer 1 may be formed by a single-layer film containing the above-mentioned material, or may be formed by using a multilayer film containing the above-mentioned material in each layer.
The base material layer 1 may contain an antistatic agent from the viewpoint of reducing the amount of charge generated when the carrier tape is peeled off, or the surface of the base material layer 1 opposite to the surface on which the intermediate layer 2 is provided. An antistatic layer may be provided as one of the base material layers. The surface of the base material layer 1 or the antistatic layer containing the antistatic agent is used to form a plurality of packages when the electronic components are accommodated and transported in the package composed of the carrier tape and the cover tape 10 for packaging the electronic components. In the case of stacking and transporting, there is a possibility of contact with the bottom surface of the carrier tape of the package stacked on top.

The thickness of the base material layer 1 is preferably, for example, 6 μm or more, preferably 7 μm or more, and more preferably 8 μm or more. The thickness of the base material layer 1 is preferably, for example, 35 μm or less, preferably 33 μm or less, and more preferably 30 μm or less. If the thickness of the base material layer 1 is not more than the above upper limit, the rigidity of the cover tape for packaging electronic components does not become too high, and even if a torsional stress is applied to the carrier tape after sealing, it is used for packaging electronic components. It is possible to reduce the possibility that the cover tape 10 follows the deformation of the carrier tape and peels off. Further, when the thickness of the base material layer 1 is at least the above lower limit value, the mechanical strength of the cover tape 10 for packaging electronic components becomes suitable, and the cover tape 10 for packaging electronic components is peeled off from the carrier tape at high speed. Even in this case, it is possible to reduce the possibility that the cover tape 10 for packaging electronic components will break.
The base material layer 1 may have a two-layer structure of a first base material layer and a second base material layer, or a structure of three or more layers having a further layer. In this case, for example, the material used in the base material layer 1 can be used. Further, it is preferable that the total thickness of the first base material layer, the second base material layer and the like is the "thickness of the base material layer 1".

<Middle layer>
The intermediate layer 2 is a layer provided for the purpose of imparting cushioning property to the cover tape 10 for packaging electronic components according to the present embodiment. This makes it possible to improve the adhesion between the cover tape 10 for packaging electronic components and the carrier tape at the time of sealing.

The material of the intermediate layer 2 is not particularly limited as long as it can impart cushioning properties to the cover tape 10 for packaging electronic parts. For example, a polyacrylic acid derivative, a polyacrylic acid ester derivative, a polyvinyl acetate derivative, a styrene resin, or an olefin type Examples thereof include one or more selected from resins and cyclic olefin resins, and copolymers thereof. Among these, olefin-based resins are preferable, and ethylene-based resins can be more preferably used.

The thickness of the intermediate layer 2 is typically 10 μm or more and 50 μm or less, preferably 15 μm or more and 45 μm or less, from the viewpoint of improving the adhesion between the cover tape 10 for packaging electronic components and the carrier tape at the time of sealing.

<Sealant layer>
The sealant layer 3 is a layer containing an adhesive resin and an antistatic agent and is provided on the surface side of the intermediate layer 2 opposite to the surface in contact with the base material layer 1, and the cover tape 10 for packaging electronic components is used as a carrier tape. A layer that comes into contact with the carrier tape when sealed (for example, heat-sealed).
The sealant layer 3 has a heat-sealing property and is adhered to the carrier tape, and exhibits an easy peeling property that can be easily peeled off at the time of use.
In the sealant layer 3, the antistatic agent is dissolved or dispersed in the resin. That is, good compatibility is obtained between the adhesive resin and the antistatic agent, and the antistatic agent is uniformly dispersed throughout the sealant layer 3 in the adhesive resin as the matrix resin.
The sealant layer 3 may be laminated in the order of the adhesive resin layer and the antistatic layer on the side opposite to the surface in contact with the intermediate layer 2.

As a specific example of the material of the adhesive resin of the sealant layer 3, one or 2 selected from a polyacrylic acid derivative, a polyacrylic acid ester derivative, a styrene-based polymer, an olefin-based resin, a urethane-based resin, and an ester-based resin. Species and above and copolymers thereof and the like can be mentioned. Among these, polyacrylic acid derivatives and styrene-based polymers are preferable from the viewpoint of satisfactorily dissolving or dispersing the antistatic agent.

The sealant layer 3 preferably contains, as the antistatic agent, one or more selected from the group consisting of (A) phosphorus-doped tin, (B) carbon nanotubes, and (C) polythiophene or polythiophene derivative. As a result, the surface resistance value of the sealant layer 3 can be lowered to suppress the generation of static electricity due to peeling, the adhesiveness can be maintained, and good compatibility with the adhesive resin used for the sealant layer 3 can be obtained. be able to.
Further, by using (A) phosphorus-doped tin or (C) polythiophene or a polythiophene derivative as the antistatic agent, the effect of suppressing static electricity at the time of peeling can be obtained more reliably.

Examples of the (C) polythiophene or a derivative of polythiophene include polythiophene, poly (3,4) -ethylenedioxythiophene, and poly (3-thiophene-β-ethanesulfonic acid). Among these, poly3,4-ethylenedioxythiophene or a derivative thereof is preferable from the viewpoint of maintaining better antistatic property and sealing property.

As other additives, the sealant layer 3 may contain a dispersant, a silica sol, a leveling agent, a conductive auxiliary agent, and the like for improving the dispersibility of the antistatic agent.

The thickness of the sealant layer 3 is typically 0.02 μm or more and 20 μm or less, and more preferably 0.03 μm or more and 15 μm or less, from the viewpoint of preferably performing the sealing work and the peeling work.

The thickness of the cover tape for packaging electronic components according to the present embodiment is preferably 40 μm or more and 65 μm or less, and more preferably 45 μm or more and 60 μm or less, from the viewpoint of ensuring the film strength.

Hereinafter, the characteristics of the cover tape for packaging electronic components according to this embodiment will be described.

In the cover tape for electronic component packaging according to the present embodiment, the upper limit of the antimony content measured for the entire cover tape for electronic component packaging is 150 ppm or less, preferably 140 ppm with respect to the entire cover tape for electronic component packaging. Below, it is more preferably 130 ppm or less. The lower limit of the antimony content measured for the entire cover tape for packaging electronic components according to the present embodiment is not particularly limited, but is 0 ppm or more. By setting the antimony content measured for the entire cover tape for packaging electronic components within the above range, it is possible to meet the demand for antimony reduction.

In the cover tape for electronic parts packaging according to the present embodiment, the electronic parts packaging cover tape has a width of 5.5 mm, and is uneven with the sealant layer side of the electronic parts packaging cover tape and a width of 8 mm. Combined with the uneven surface side of a polystyrene film having an average surface roughness (Ra) of 0.25 μm, the sealing temperature is set using a double-edged iron with a single-edged blade measuring 0.5 mm in width and 28 mm in length. When heat-sealed under the conditions of 160 ° C, load 5 kgf, sealing time 60 ms, carrier tape feed pitch 4 mm, the peeling speed of the cover tape for packaging electronic parts with respect to the polystyrene film is 300 mm / min, and the measurement temperature is 25 ° C. The lower limit of the peel strength under the condition of a peeling angle of 170 ° is 0.3 N or more, preferably 0.35 N or more, and more preferably 0.4 N or more. The upper limit of the 170 ° peel strength of the cover tape for packaging electronic components with respect to the polystyrene film is 0.9 N or less, preferably 0.8 N or less, and more preferably 0.7 N or less. By setting the 170 ° peel strength of the cover tape for packaging electronic components with respect to the polystyrene film within the above range, the balance between the adhesiveness and the peelability with respect to the carrier tape can be improved.

Further, in the cover tape for packaging electronic parts according to the present embodiment, the 170 ° peel strength of the cover tape for packaging electronic parts with respect to the polystyrene film is P1, and the cover tape for packaging electronic parts is set to 40 ° C. and 90% RH. The value of (P2 / P1) × 100 is preferably 50 when the 170 ° peel strength of the cover tape for packaging electronic parts with respect to the polystyrene film measured by the same method as P1 after being left for a day is P2. % Or more, more preferably 60% or more, still more preferably 70% or more, preferably 150% or less, more preferably 140% or less, still more preferably 130% or less. By setting the value of (P2 / P1) × 100 within the above range, stable peel strength can be maintained even after undergoing environmental changes during transportation and storage.

The surface resistance value of the cover tape for packaging electronic components according to the present embodiment on the surface of the base material layer measured at 25 ° C. and 50% RH is preferably 1.0 × 10 ³ Ω or more, more preferably 1. It is 0.0 × 10 ⁴ Ω or more, more preferably 1.0 × 10 ⁵ Ω or more, preferably 1.0 × 10 ¹³ Ω or less, and more preferably 1.0 × 10 ¹² Ω or less. More preferably, it is 1.0 × 10 ¹¹ Ω or less. By setting the surface resistance value of the base material layer of the cover tape for packaging electronic components within the above range, static electricity generated by various factors can be efficiently released to the outside.
The surface of the base material layer refers to the exposed surface side of the base material layer in the cover tape for packaging electronic components (that is, the surface of the base material layer that is not in contact with the intermediate layer).

The surface resistance value of the cover tape for packaging electronic components according to the present embodiment on the surface of the sealant layer measured at 25 ° C. and 50% RH is preferably 1.0 × 10 ³ Ω or more, more preferably 1. It is 0.0 × 10 ⁴ Ω or more, more preferably 1.0 × 10 ⁵ Ω or more, preferably 1.0 × 10 ¹² Ω or less, and more preferably 1.0 × 10 ¹¹ Ω or less. More preferably, it is 1.0 × 10 ¹⁰ Ω or less. By setting the surface resistance value on the surface of the sealant layer measured at 25 ° C. and 50% RH of the cover tape for electronic component packaging within the above range, the electronic component packaging is more excellent in antistatic property due to the peeling of the carrier tape. Can be used as a cover tape.
The surface of the sealant layer refers to the exposed surface side of the sealant layer in the cover tape for packaging electronic components (that is, the surface of the sealant layer that is not in contact with the intermediate layer).

In the cover tape for packaging electronic components according to the present embodiment, the resin pellets are placed in a bag prepared by using the cover tape under the conditions of 25 ° C. and 50% RH, vibrated, and then rubbed on the surface of the resin pellets. The amount of charge was measured by a predetermined method. The lower limit of the absolute value of the triboelectric charge on the surface of the resin pellet is preferably 0.0 nC or more. Further, the upper limit of the absolute value of the triboelectric charge amount on the surface of the resin pellet is preferably 1.0 nC or less, more preferably 0.8 nC or less, and further preferably 0.6 nC or less. By doing so, it is possible to further improve the antistatic property associated with the peeling of the carrier tape. Specifically, when the value of the triboelectric charge amount satisfies the above numerical range, even when the working environment at the manufacturing site of the electronic device is in a dry state with a humidity of about 30% RH, the cover tape is used during transportation. It is possible to realize a cover tape with excellent charging characteristics against static electricity generated by friction with electronic parts, static electricity generated when the cover tape is peeled off from the carrier tape, static electricity generated from attached dust and contents, etc. can.
The resin pellet used for measuring the triboelectric charge amount is composed of 85% by mass of silica and 15% by mass of epoxy resin, and has dimensions of 3 mm × 1.5 mm × 1 mm. As the silica, one having an average particle size of 1 to 10 μm and one having an average particle size of 0.5 to 1 μm can be mixed and used. Further, as the epoxy resin, a phenol novolac-based resin can be used. If the compounding of silica and the epoxy resin is the above-mentioned compounding, even if the type of the epoxy resin and the average particle size of the silica are slightly different, the result of the triboelectric charge amount is not significantly affected.

The total light transmittance of the cover tape for packaging electronic components according to the present embodiment when measured with the light source D65 according to JIS K7361-1 (1997) is preferably 70% or more, more preferably 75% or more. It is more preferably 80% or more, preferably 95% or less, more preferably 94% or less, still more preferably 93% or less. By doing so, in the package 100 composed of the cover tape 10 for packaging electronic components and the carrier tape, the transparency is such that it can be inspected whether or not the electronic components are correctly housed in the pockets of the carrier tape. Can be given. That is, by setting the total light transmittance of the cover tape for electronic component packaging to the above lower limit value or more, the electronic component housed inside the package 100 composed of the cover tape 10 for electronic component packaging and the carrier tape is packaged. It is possible to visually check from the outside of the body 100.

The external haze measured by the light source D65 according to JIS K7136 (2000) of the cover tape for packaging electronic components according to the present embodiment is preferably 5% or more, more preferably 6% or more, and most preferably 7%. The above is preferably 50% or less, more preferably 45% or less, and most preferably 40% or less. By setting the external haze of the cover tape for packaging electronic components to the above upper limit or less, the electronic components are correctly housed in the pockets of the carrier tape in the package composed of the cover tape 10 for packaging electronic components and the carrier tape. It is possible to impart a degree of transparency that can be inspected for the presence or absence.

In the present embodiment, for example, the type and amount of each component contained in the base material layer 1, the intermediate layer 2, and the sealant layer 3 constituting the cover tape for packaging electronic parts, the method for preparing the coating liquid for forming the sealant layer, and the electronic parts. By appropriately selecting conditions such as a method for producing the covering tape for packaging, it is possible to control the 170 ° peel strength for the polystyrene film and the antimony content for the entire covering tape for electronic parts packaging. As a result, even in the cover tape for packaging electronic components with reduced antimony, the balance between the adhesiveness to the carrier tape and the peelability is excellent, and the generation of static electricity due to the peeling can be suppressed.
Further, in the present embodiment, by appropriately selecting the above conditions, the 170 ° peel strength with respect to the polystyrene film is set to P1, and the cover tape for packaging electronic components is placed at 40 ° C. and 90% RH for 14 days before measurement. The value of (P2 / P1) × 100 when the peel strength P2 is 170 ° with respect to the above polystyrene film, the surface resistance value of the base material layer 1, the surface resistance value of the sealant layer 3, the frictional charge amount, and the total light transmission rate. In addition, it is possible to control external haze, and in the cover tape for packaging electronic components with reduced antimony, the peeling strength can be stabilized even after environmental changes, and the effect of suppressing static electricity at the time of peeling can be achieved. It can be made more reliable and can be provided with transparency to the extent that the electronic component can be visually recognized from the outside.

<Manufacturing method of cover tape for packaging electronic components>
An example of a method for manufacturing a cover tape for packaging electronic components according to the present embodiment will be described.
First, the intermediate layer 2 is formed on the surface of the base material layer 1. The intermediate layer 2 can be formed by, for example, an extrusion laminating method or a dry laminating method. Next, the sealant layer 3 is formed by applying a predetermined material on the intermediate layer 2 by a coating method and drying it, or by laminating it by an extrusion laminating method.

Further, when forming the above-mentioned adhesive layer, the material of the adhesive layer may be applied to the surface of the target layer by a conventionally known coating method.

The cover tape for packaging electronic components according to this embodiment can be attached to a carrier tape and used as a packaging body. That is, it includes a carrier tape having a plurality of storage parts for storing electronic parts, electronic parts stored in the storage parts, and a cover tape for packaging electronic parts arranged so as to cover the storage parts. It is preferable to use a package.
With such a package, it is possible to suppress the generation of static electricity, and it is possible to more reliably protect the electronic components stored in the storage unit from static electricity.

<Electronic component packaging>
An electronic component package can be obtained from the cover tape for packaging electronic components of the present embodiment described above and the carrier tape in which electronic components are housed in recesses. This will be described with reference to FIG.

In FIG. 2, the cover tape 10 for packaging electronic components is used as a lid material for a band-shaped carrier tape 20 in which concave pockets 21 are continuously provided according to the shape of electronic components.
Specifically, the cover tape 10 for packaging electronic components is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. Hereinafter, the structure obtained by adhering the cover tape 10 for packaging electronic components and the carrier tape 20 will be referred to as an electronic component packaging body 100.

The electronic component package 100 can be manufactured, for example, by the following procedure.
First, the electronic components are housed in the pocket 21 of the carrier tape 20.
Next, the cover tape 10 for packaging electronic components is adhered to the surface of the carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, heat is made so that the sealant layer 3 of the cover tape 10 for electronic component packaging is in contact with the carrier tape 20 (that is, the "back surface" of the cover tape 10 for electronic component packaging in FIG. 2 is the sealant layer 3). Seal).
The specific method and conditions of the heat seal are not particularly limited as long as the cover tape 10 for packaging electronic components adheres sufficiently strongly to the carrier tape 20. Typically, a known heat sealing machine can be used, and the temperature can be set within the range of 100 to 240 ° C., a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

As a result, a structure (electronic component package 100) in which electronic components are hermetically sealed can be obtained.
This structure (electronic component package 100) is wound on a reel, for example, and then transported to a work area where electronic components are mounted on an electronic circuit board or the like. The material of the reel can be metal, paper, plastic, or the like.

After the electronic component packaging body 100 is transported to the work area, the electronic component packaging cover tape 10 is peeled off from the carrier tape 20 and the housed electronic component is taken out.

The electronic components housed in the electronic component package 100 are not particularly limited. Examples thereof include semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, electrodes, and all other parts used in the manufacture of electrical and electronic equipment.

The embodiments of the present invention have been described in detail above, but these are examples of the present invention. Further, various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiment.

The embodiments of the present invention will be described in detail based on Examples and Comparative Examples, but the present invention is not limited thereto.

Each constituent material of the sealant layer shown in Table 1 is as follows.
(Adhesive resin)
-Resin 1: Poly (meth) acrylic acid derivative ("A450A" manufactured by Dainippon Ink Co., Ltd.)
-Resin 2: Styrene-based polymer ("Nipol 2507H" manufactured by Zeon Corporation)
-Resin 3: Polyacrylic acid derivative ("Elvalois AC1820" manufactured by Mitsui Dow Polychemical Co., Ltd.)
-Resin 4: Styrene polymer ("Estyrene MS-600" manufactured by Nippon Steel Chemical Co., Ltd.)
(Antistatic agent)
-Antistatic agent 1: Lin-doped tin oxide (Mitsubishi Materials "SP-2")
-Antistatic agent 2: Carbon nanotube ("isoNanotubes-M (registered trademark) 750530" manufactured by Sigma-Aldrich)
-Antistatic agent 3: Polythiophene derivative ("Aedron (registered trademark) C3-NM" manufactured by Sigma-Aldrich)
-Antistatic agent 4: Polythiophene derivative (PEDOT: PSS) ("Clevios P1000" manufactured by Heraeus)
-Antistatic agent 5: Antimony-doped tin oxide ("T-1" manufactured by Mitsubishi Materials Corporation)
-Antistatic agent 6: Polypropylene / polyethylene glycol ("Perestat 212" manufactured by Sanyo Chemical Industries, Ltd.)

<Example 1>
[Preparation of base material layer and intermediate layer]
A 12 μm thick antistatic polyethylene terephthalate (PET) film (“E7455” manufactured by Toyobo Co., Ltd.) is coated with an anchor coating agent wet by 4 μm with a gravure coating, dried at 100 ° C, and then low-density polyethylene (“Sumikasen” manufactured by Sumitomo Chemical Co., Ltd.). L705 "37 μ thickness) was extruded and laminated, and cooled with a cooling roll (surface temperature 20 ° C.) to prepare a laminated film composed of a base material layer and an intermediate layer.

A sealant layer composed of the components shown in Table 1 was formed on the surface of the obtained laminated film on the intermediate layer side with a film thickness of 0.5 μm by a gravure coating method.
The thickness of the entire cover tape is shown in Table 1.

<Examples 2 to 4, Comparative Examples 1 to 4>
A cover tape for packaging electronic components was prepared in the same manner as in Example 1 according to the formulation shown in Table 1.

<170 ° peel strength for polystyrene film>
Each electronic component packaging cover tape obtained above has a width of 5.5 mm, and the average surface roughness (Ra) of the uneven surface of the electronic component packaging cover tape on the sealant layer side and the width of 8 mm. ) Is 0.25 μm with the above-mentioned uneven surface side of a polystyrene film (“CEL-E980A” manufactured by Sumitomo Bakelite Co., Ltd.), and a single-edged blade with a width of 0.5 mm and a length of 28 mm is used with a double-edged iron. Heat-sealed using a heat-sealing machine ("TWA-6621" manufactured by Tokyo Wells Co., Ltd.) under the conditions of a sealing temperature of 160 ° C, a load of 5 kgf, a sealing time of 60 ms, a carrier tape feed pitch of 4 mm, and two rows of 7-degree striking. And adjusted the sample. The peel strength (N) immediately after the heat seal was measured. The peel strength immediately after heat sealing is P1 (N). The peel strength was measured using a peeling tester (“PTS-5000” manufactured by EPI) under the conditions of a peeling speed of 300 mm / min, a peeling angle of 170 °, and a measurement temperature of 25 ° C.
The surface roughness (Ra) of the polystyrene film is determined by JIS B for the portion of the polystyrene film used above to be bonded to the cover tape for packaging electronic parts before being bonded to the cover tape for packaging electronic parts. Measurement was performed using a surface roughness measuring instrument (“SJ-210” manufactured by Mitutoyo Co., Ltd.) in accordance with 0601 (2001). The unit is μm.
Further, after the cover tape for electronic component packaging obtained above is placed in a 40 ° C. 90% RH environment for 14 days, the 170 ° peel strength (N) of the cover tape for electronic component packaging with respect to the polystyrene film is the same as above. It was measured by the method of. The peel strength immediately after heat sealing of the cover tape for packaging electronic components after being left in a 40 ° C. 90% RH environment for 14 days was defined as P2 (N).
From the obtained values of P1 and P2, the value of (P2 / P1) × 100 was calculated.
The values of P1, P2 and (P2 / P1) × 100 are shown in Table 1.

<Antimony content>
The cover tape for packaging electronic parts obtained above is completely dissolved in a nitric acid / hydrochloric acid / hydrofluoric acid solution using spectroscopy, and the antimony content (ppm) with respect to the entire cover tape for electronic parts packaging is inductively coupled high frequency. It was measured by an inductively coupled plasma-atomic electronics spectroscopy (IPC) method. The results are shown in Table 1.

<Surface resistance value of base material layer>
The surface resistance value (Ω) on the surface of the base material layer of the cover tape for packaging electronic components obtained above was measured at 25 ° C. 50 using a surface resistance measuring instrument manufactured by SIMCO (“ST-3” manufactured by SIMCO). Measured under% RH environment. The results are shown in Table 1.
In addition, in Table 1, for example, "5.E + 10" of Example 1 represents "5 × 10 ¹⁰ ".

<Surface resistance value of sealant layer>
The surface resistance value (Ω) on the surface of the sealant layer of the cover tape for packaging electronic components obtained above was measured at 25 ° C. and 50% using a surface resistance measuring instrument manufactured by SIMCO (“ST-3” manufactured by SIMCO). Measured in RH environment. The results are shown in Table 1.
In addition, for example, "2.E + 09" of Example 1 described in Table 1 represents "2 × 10 ⁹ ".

<Triboelectric charge>
In the cover tape for packaging electronic parts obtained above, the triboelectric amount on the surface of the resin pellets under the conditions of 25 ° C. and 50% RH was measured by the following procedures (a) to (e).
(A) Cut the cover tape for packaging electronic components to a width of 25 mm and a length of 200 mm, fold it in half in the length direction so that the surface of the sealant layer is on the inside, and tape both sides. By fastening with, a bag having a width of 25 mm and a length of 100 mm was created.
(B) A resin pellet composed of 85% by mass of silica and 15% by mass of epoxy resin and having dimensions of 3 mm × 1.5 mm × 1 mm was prepared.
(C) After static elimination of the bag and the resin pellets, five of the resin pellets were placed in the bag, and the openings were taped and sealed.
(D) The bag containing the resin pellets sealed by the above (c) was fixed to a vortex mixer (“G-560E” manufactured by SCIENTIFIC INDUSTRIES) and vibrated at 600 rpm for 5 minutes.
(E) Five of the resin pellets are taken out from the inside of the bag, all of them are transferred to a Faraday cup (Electro-Tech Systems, Model 231), and a nanocoulomb meter (Electro-Tech Systems, Model 230) is used. , 25 ° C., 50% RH, and the charge amount for 5 of the above resin pellets was measured. The absolute value of the measured value was taken as the triboelectric charge amount. The results are shown in Table 1.

Next, the measured triboelectric charge was evaluated against the following evaluation criteria. The results are shown in Table 1.
Antistatic evaluation criteria:
⊚: Triboelectric charge is 0.0 nC or more and 0.2 nC or less 〇: Triboelectric charge is greater than 0.2 nC and 1.0 nC or less ×: Triboelectric charge is greater than 1.0 nC

<Total light transmittance>
The total light transmittance (%) of the cover tape for packaging electronic components obtained above is based on JIS K7361-1 (1997), and the Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd. is used as the light source D65. Was measured. The results are shown in Table 1.

<External haze>
The external haze (%) of the cover tape for packaging electronic components obtained above was measured with a light source D65 using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd. in accordance with JIS K7136 (2000). The results are shown in Table 1.

In Examples 1 to 4, the 170 ° peel strength with respect to the polystyrene film, the surface resistance value on the surface of the sealant layer, the surface resistance value on the surface of the base material layer, the triboelectric charge amount, and the packaging for electronic components while reducing the antimony content. A cover tape for packaging electronic components was obtained in which the total light transmittance and haze of the entire cover tape were within an appropriate range. Examples 1 to 4 showed peel strength and the like comparable to those of Comparative Example 1 in which the antimony content was not reduced. Further, in Comparative Example 2, although the antimony content was reduced, the 170 ° peel strength with respect to the polystyrene film was not within an appropriate range.
Further, in Comparative Example 4, since the sealant layer did not contain an antistatic agent, a sufficient resistance value on the sealant surface could not be obtained.
Since Comparative Example 3 did not satisfy the composition of the base material layer, the intermediate layer, and the sealant layer, the 170 ° peel strength with respect to the polystyrene film was not within an appropriate range.

1 Base material layer 2 Intermediate layer 3 Sealant layer 10 Cover tape 20 Carrier tape 21 Pocket 100 Electronic component packaging

Claims (9)

Substrate layer and
With the middle class,
With the sealant layer,
A cover tape for packaging electronic components that has
The sealant layer contains an adhesive resin and an antistatic agent, and contains
The antistatic agent
(A) Contains one or more selected from the group consisting of phosphorus-doped tin (B) carbon nanotubes (C) polythiophene or polythiophene derivatives.
The peel strength with respect to the polystyrene film measured by <Measurement of Peel Strength> is 0.3N or more and 0.9N or less.
A cover tape for electronic component packaging, wherein the antimony content measured for the entire cover tape for electronic component packaging is 0 ppm or more and 150 ppm or less with respect to the entire cover tape for electronic component packaging.
<Measurement of peel strength>
The cover tape for packaging electronic parts is made of polystyrene having a width of 5.5 mm and an average surface roughness (Ra) of 0.25 μm on the sealant layer side of the cover tape and a width of 8 mm. Using a double-edged iron with a single-edged blade of 0.5 mm in width and 28 mm in length, including the uneven surface side of the film, the sealing temperature is 160 ° C, the load is 5 kgf, the sealing time is 60 ms, and the carrier tape feed pitch is 4 mm. The peel strength of the cover tape for packaging electronic parts with respect to the polystyrene film when heat-sealed under the above conditions is measured under the conditions of a peeling speed of 300 mm / min, a measurement temperature of 25 ° C., and a peeling angle of 170 °. The cover tape for packaging electronic components according to claim 1.
A cover tape for packaging electronic components having a surface resistance value of 1.0 × 10 ¹³ Ω or less on the surface of the base material layer measured at 25 ° C. and 50% RH. The cover tape for packaging electronic components according to claim 1 or 2.
A cover tape for packaging electronic components having a surface resistance value of 1.0 × 10 ³ Ω or more and 1.0 × 10 ¹² Ω or less on the surface of the sealant layer measured at 25 ° C. and 50% RH. The cover tape for packaging electronic components according to any one of claims 1 to 3.
The 170 ° peel strength of the electronic component packaging cover tape with respect to the polystyrene film is P1, and the electronic component packaging cover tape is placed at 40 ° C. and 90% RH for 14 days and then measured by the <measurement of peel strength>. A cover tape for packaging electronic parts, wherein the value of (P2 / P1) × 100 is 50% or more and 150% or less when the 170 ° peel strength with respect to the polystyrene film is P2. The cover tape for packaging electronic components according to any one of claims 1 to 4.
A cover tape for packaging electronic components, wherein the triboelectric charge on the surface of the resin pellets measured at 25 ° C. and 50% RH by the following procedures (a) to (e) is 0.0 nC or more and 1.0 nC or less.
(A) Cut the cover tape for packaging electronic components to a width of 25 mm and a length of 200 mm, fold it in half in the length direction so that the surface of the sealant layer is on the inside, and tape both sides. By fastening with, a bag having a width of 25 mm and a length of 100 mm is created.
(B) Prepare a resin pellet consisting of 85% by mass of silica and 15% by mass of epoxy resin and having dimensions of 3 mm × 1.5 mm × 1 mm.
(C) After static elimination of the bag and the resin pellets, five of the resin pellets are placed in the bag, and the openings are taped and sealed.
(D) The bag containing the resin pellets sealed by the above (c) is fixed to a vortex mixer and vibrated at 600 rpm for 5 minutes.
(E) After taking out 5 of the resin pellets from the inside of the bag, all of them are transferred to a Faraday cup, and the charge amount of the resin pellets is measured at 25 ° C. and 50% RH conditions using a nanocoulomb meter. .. The absolute value of the measured value is taken as the triboelectric charge amount. The cover tape for packaging electronic components according to any one of claims 1 to 5.
A cover tape for packaging electronic components, which conforms to JIS K7361-1 (1997) and has a total light transmittance of 70% or more and 95% or less as measured by a light source D65. The cover tape for packaging electronic components according to any one of claims 1 to 6.
A cover tape for packaging electronic components that conforms to JIS K7136 (2000) and has an external haze of 5% or more and 50% or less as measured by the light source D65. The cover tape for packaging electronic components according to any one of claims 1 to 7.
A cover tape for packaging electronic components, wherein the (C) polythiophene or polythiophene derivative is poly3,4-ethylenedioxythiophene or a derivative thereof. The cover tape for packaging electronic components according to any one of claims 1 to 8.
A cover tape for packaging electronic components, wherein the sealant layer contains one or two selected from a polyacrylic acid derivative and a styrene-based polymer.

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