JP2019172281A - Cover tape, electronic component packaging body, and manufacturing method of cover tape - Google Patents

Abstract

To provide a cover tape which achieves both sealability and antistatic properties.SOLUTION: A cover tape 10 includes a sealant layer 2 on one surface, and it is used for sealing a carrier tape 20 having a recess which can store an electronic component, by the sealant layer 2. In the sealant layer 2, (A) in resin, (B) an antistatic agent is dispersed. A component (A) includes styrene-butadiene copolymer, and a component (B) includes at least one kind out of poly-3, 4-ethylenedioxythiophene/polystyrene sulfonate(PEDOT/PSS), polyaniline, polypyrrole, and polythiophene.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cover tape, an electronic component package, and a method for manufacturing the cover tape. More specifically, a cover tape capable of heat-sealing a carrier tape having a storage pocket for transporting an electronic component such as a semiconductor IC chip, a manufacturing method thereof, and a cover tape on the carrier tape storing the electronic component It is related with the electronic component package obtained by heat-sealing.

  Electronic parts such as semiconductor IC chips are stored in a state where they are packed in a packaging material and wound on a paper or plastic reel until they are provided to the mounting process after their manufacture. And transported. For packaging electronic components, a tape-shaped packaging material is used so as to correspond to a mounting process on a substrate by an automatic mounting apparatus, and the packaging material is placed on a long sheet at a predetermined interval. The carrier tape includes a plurality of concave storage pockets and a cover tape heat-sealed to the carrier tape. The electronic component packed with such a packaging material is automatically taken out of the package after the cover tape is peeled off from the carrier tape, and mounted on the electronic circuit board.

  Carrier tape includes static electricity generated by friction between the cover tape and electronic components in the process of transporting the packaged package, static electricity generated when the cover tape is peeled off from the carrier tape, or attached dust and content. It is required to have necessary antistatic properties to such an extent that it is possible to suppress the failure (electrostatic breakdown) of the electronic components housed in the package due to static electricity generated from the object.

  Also, in the process of peeling the cover tape from the carrier tape, if the peel strength that is necessary for peeling the cover tape from the carrier tape is too high, the carrier tape vibrates when the cover tape is peeled off, A phenomenon occurs in which electronic components jump out of the storage pocket. On the other hand, if the adhesive strength between the carrier tape and the cover tape is low, the cover tape may be peeled off during transportation of the package, and the packed electronic component may fall. For this reason, the cover tape is required to have sufficient adhesive strength to the carrier tape, and at the same time, to be peelable from the carrier tape in the mounting process. Furthermore, when the cover tape is peeled from the carrier tape, it is also required that the electronic components adhere to the cover tape and do not jump out.

  Various studies have been made to solve the above-described problems. For example, in Patent Document 1, a cover tape having a multilayer structure including a seal layer using a thermoplastic resin such as a styrene butadiene resin is subjected to friction of the cover tape. And suppressing static electricity generated at the time of peeling. Further, it is disclosed that conductive fine powders of metal oxides such as tin oxide, zinc oxide and indium oxide are used for the seal layer as an antistatic agent.

  Moreover, as an antistatic agent, for example, Patent Document 2 discloses a conductive coating composition containing a conductive polymer such as polythiophene, polyaniline, and polypyrrole.

JP 2013-180792 A JP 2006-176681 A

However, when trying to obtain a higher level of antistatic properties, the conventional sealant layer disclosed in Patent Document 1 uses a metal oxide such as tin oxide as an antistatic agent. When the amount is increased, there is a problem that the sealing performance is lowered. Furthermore, since an increase in tin oxide leads to an increase in antimony, there was a tendency for the environmental load to increase.
Therefore, the inventor pays attention to the antistatic agent as disclosed in Patent Document 2, and disperses it in at least one of the styrene-butadiene copolymer and the acrylic resin in the sealant layer of the cover tape. As a result, it was found that good compatibility was obtained, and as a result, both good sealing properties and antistatic properties were compatible.

  ADVANTAGE OF THE INVENTION According to this invention, the cover tape which can make favorable sealing property and antistatic property compatible, and an electronic component packaging body using the said cover tape are provided.

According to the present invention, there is provided a cover tape having a sealant layer on one surface and having a recess capable of accommodating an electronic component and used for sealing with the sealant layer,
The sealant layer has (B) an antistatic agent dispersed in (A) resin,
Component (A) includes a styrene butadiene copolymer,
Component (B) includes at least one of poly-3,4-ethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyaniline, polypyrrole and polythiophene.
A cover tape is provided.

  According to the present invention, there is provided an electronic device having a carrier tape in which an electronic component is accommodated in a recess and the cover tape, wherein the sealant layer is bonded to the carrier tape so as to seal the electronic component. A parts package is provided.

Also according to the invention,
A cover tape comprising a sealant layer on one side and having a recess capable of accommodating an electronic component is used for sealing with the sealant layer.
Mixing an aqueous dispersion of the resin (A) and an aqueous dispersion of the antistatic agent (B) to prepare a sealant layer forming composition;
Using the sealant layer forming composition, forming the sealant layer;
Have
Component (A) includes a styrene butadiene copolymer,
A method for producing a cover tape is provided in which component (B) contains at least one of poly-3,4-ethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyaniline, polypyrrole, and polythiophene.

  ADVANTAGE OF THE INVENTION According to this invention, the cover tape which can make favorable sealing property and antistatic property compatible, and an electronic component packaging body using the said cover tape are provided.

It is sectional drawing which shows the structure of the cover tape which concerns on this embodiment. It is a figure which shows an example of the state which sealed the cover tape for electronic component packaging which concerns on this embodiment to the carrier tape.

<Cover tape>
As shown in FIG. 1, the cover tape 10 for packaging electronic components according to the present embodiment includes a base material layer 3 and a seal layer 2 provided on one surface of the base material layer 3. Here, the cover tape 10 may have a two-layer structure of base material layer 3 / sealing layer 2, for example, an intermediate layer 1 which is another layer between the base material layer 3 and the sealing layer 2. A multilayer structure such as a base material layer 3 / intermediate layer 1 / seal layer 2 interposed may be used. Hereinafter, the case where the cover tape 10 has a multilayer structure of base material layer 3 / intermediate layer 1 / seal layer 2 will be described.

First, the usage method of the cover tape 10 is demonstrated with reference to FIG.
As shown in FIG. 2, the cover tape 10 is used as a cover material for the carrier tape 20 in which concave pockets 21 are continuously provided in accordance with the shape of the electronic component. Specifically, the cover tape 10 is used by adhering (for example, heat sealing) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. In the following description, a structure obtained by bonding the cover tape 10 and the carrier tape 20 is referred to as an electronic component package 100.

  When the cover tape 10 is bonded to the carrier tape 20, the base material layer 3 has a mechanical strength that can withstand the stress applied from the outside when the cover tape 10 is used, etc. What has the heat resistance of the grade which can endure the heat history added when bonding the cover tape 10 is good.

Examples of the material constituting the base material layer 3 include thermoplastic resins. Examples of the thermoplastic resin include thermoplastic resins such as polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, polycarbonate resins, and ABS resins.
The form of the material constituting the base material layer 3 is not particularly limited, but is preferably processed into a film form from the viewpoint of easy processing. A film formed, particularly a biaxially stretched film can be suitably used.
The thickness of the base material layer 3 is generally 5 to 50 μm.

The sealing layer 2 has a heat sealing property, is adhered to the carrier tape 20, and exhibits an easy peeling property that can be easily peeled off during use.
In the sealing layer 2, (A) an antistatic agent is dispersed in (A) resin. That is, good compatibility is obtained between the component (A) and the component (B), and the component (B) is uniformly dispersed throughout the sheet layer 2 using the component (A) as a matrix resin.

  The component (A) contains a styrene butadiene copolymer (SBR). The glass transition temperature (Tg) of the component (A) is preferably 0 ° C. or higher and 60 ° C. or lower. Component (A) may also contain a water-soluble polymer such as a free carboxylic acid oligomer, which is a carboxyl-modified product.

  As a commercial item of component (A), for example, SBR resin manufactured by Nippon Zeon: Nipol LX438C (Tg 1 ° C.), SBR resin manufactured by Nippon Zeon: Nipol LX433C (Tg 50 ° C.), SBR resin manufactured by Nippon Zeon: Nipol LX2507H ( Tg 58 ° C.), SBR resin JSR: JSR 0597C (Tg 28 ° C.), Nippon Zeon: Nipol LX430 (Tg 12 ° C.), Nippon Zeon: Nipol LX415M (Tg 27 ° C.), JSR: JSR 0602C (Tg 40 ° C.) ), Manufactured by Nippon A & L Co., Ltd .: Nalstar SR-100 (Tg 27 ° C.), manufactured by Nippon A & L Co., Ltd .: Nalstar SR-102 (Tg 21 ° C.), manufactured by Nippon A & L Co., Ltd .: Nalstar SR-103 (Tg 7 ° C.), manufactured by Nippon A & L Co., Ltd .: Nalstar S R-104 (Tg3 ° C.), and Nippon A & L Co., Ltd .: Nalstar SR-153 (Tg 35 ° C.) and the like can be mentioned.

Component (B) is a poly-3,4-ethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyaniline, from the viewpoint of reducing the surface resistance of the seal layer 2 and suppressing the generation of static electricity associated with peeling. It contains at least one of polypyrrole and polythiophene. Especially, it is preferable that PEDOT / PSS is included from the viewpoint of obtaining good compatibility with the component (A) and maintaining good antistatic properties and sealing properties.
The component (B) is preferably 15 to 2% by weight, and more preferably 10 to 3% by weight in the seal layer 2.

  In addition to the component (A), the sealing layer 2 includes, for example, ethylene polymers such as polyethylene resin, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-butene-1 random copolymer. One or more thermoplastic resins selected from acrylic-polyester-styrene copolymers, acrylic-styrene copolymers, polyester resins, and modified products thereof can be used.

The seal layer 2 may include at least one of a surfactant, a petroleum hydrocarbon resin, a rosin derivative, and an inorganic filler.
Examples of the surfactant include polyoxyethylene alkylamine, quaternary ammonium, alkyl sulfonate, and a surfactant containing a fluorine alkyl structure.
As the inorganic filler, from the viewpoint of preventing blocking that occurs during transportation, oxide particles mainly composed of silicon, magnesium or calcium, inorganic particles such as silica and talc, organic particles such as polyethylene particles, polyacrylate particles and polystyrene particles. One kind selected from the group consisting of particles or an alloy thereof may be mentioned.

  The thickness of the sealing layer 2 is preferably 0.1 μm or more and 5 μm or less, more preferably 0.2 μm or more and 3 μm or less, from the viewpoint of improving the balance between adhesion to the carrier tape and peelability. Most preferably, it is 0.3 μm or more and 2 μm or less.

  The intermediate layer 1 is provided between the base material layer 3 and the seal layer 2. The intermediate layer 1 can adjust the flexibility of the entire cover tape 10 to improve the cushioning property, and can improve the adhesion to the carrier tape 20 to be bonded, and the base material layer 3 and the sealing layer 2. The adhesive strength of can be increased.

The intermediate layer 1 is made of a thermoplastic resin and may be a single layer or multiple layers.
The thermoplastic resin used for the mid layer 1 is not particularly limited, and examples thereof include one or more thermoplastic resins selected from the group consisting of olefin resins, cyclic olefin resins, and styrene resins.

  The thickness of the intermediate layer 1 is preferably 10 μm or more and 35 μm or less, and more preferably 15 μm or more and 30 μm or less, from the viewpoint of improving the adhesion with the carrier tape 20 that is an object to be bonded.

  The cover tape 10 has a sandplast treatment, a corona discharge treatment on the side in contact with the seal layer 2 or the intermediate layer 1 in order to strengthen and stabilize the adhesive strength between the base material layer 3 and the seal layer 2 or the intermediate layer 1. Surface treatment such as plasma treatment can be performed. The base material layer 3 may be an antistatic product in which an antistatic agent is kneaded or surface-coated.

  The thickness of the cover tape 10 is preferably 25 μm or more and 200 μm or less, and more preferably 30 μm or more and 150 μm or less. The width of the cover tape 10 is preferably 1 mm or more and 100 mm or less, more preferably 2 mm or more and 80 mm or less, and further preferably 2 mm or more and 50 mm or less.

  The haze (%) of the cover tape 10 is preferably 65% or less, more preferably 60% or less, from the viewpoint of obtaining transparency. On the other hand, the haze (%) of the cover tape 10 is not particularly limited from the viewpoint of obtaining transparency, but the compatibility of the components (A) and (B) is improved, and the balance between antistatic properties and sealing properties is improved. From a viewpoint of making it favorable, 0.001% or more is preferable.

Further, the resistance value of the surface on the seal layer side of the cover tape 10 is 10 ⁴ Ω or more and 10 ¹¹ Ω or less at 23 ° C. and 12 RH% from the viewpoint of efficiently discharging the static electricity generated by various factors to the outside. It is preferable to do.

Next, a material for forming an object that comes into contact with the surface of the seal layer 2 when the electronic component is accommodated and transported will be described.
As described above, examples of the object include the bottom surface of the carrier tape 20 and the like, but there is a possibility that the object may come into contact with the surface of the seal layer 2 when the electronic component is accommodated and transported or when the electronic component is mounted. It will not be limited if it is. Specific examples of the material forming the object include materials for forming carrier tapes such as polystyrene, polyethylene terephthalate, and polycarbonate, polyethylene, rubber (material processed from natural rubber, synthetic rubber, etc.), and the like. .

<Method for manufacturing cover tape>
Next, the method for manufacturing the cover tape 10 includes the following steps.
Step 1: A step of mixing the aqueous dispersion of the resin (A) and the aqueous dispersion of the antistatic agent (B) to prepare a sealant layer forming composition.
Step 2: A step of forming the sealant layer using the sealant layer forming composition.
As the component (A) and the component (B), the same ones as described above can be used.
A known method can be used for mixing.
The average particle diameter D50 of the aqueous dispersion of component (A) is preferably from 50 μm to 250 μm, and more preferably from 75 μm to 250 μm.
As a result, the cover tape 10 having both sealing properties and antistatic properties can be obtained.
In the present specification, the average particle diameter D50 of the aqueous dispersion means a median diameter (50%), and can be obtained, for example, as a median diameter in a theoretical volume distribution obtained by a laser diffraction / scattering method. it can.

<Electronic parts packaging>
As shown in FIG. 2, the electronic component package 100 includes a carrier tape 20 in which the electronic component is accommodated in the recess 21 and the cover tape 10, and a sealing layer that seals the electronic component. 2 is bonded to the carrier tape 20.

  At an electronic device manufacturing site, electronic components are accommodated in the pocket 21 of the carrier tape 20, and then the cover tape 10 is bonded to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. By doing so, the package 100 in which the electronic component is accommodated is produced. As described above, the package 100 is conveyed to a work area where surface packaging is performed on an electronic circuit board or the like in a state where the package 100 is wound around a paper or plastic reel. In the surface mounting process of the electronic component, the cover tape 10 is peeled off from the carrier tape 20, and the electronic component is automatically taken out from the package and mounted on the electronic circuit board.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and can employ | adopt various structures other than the above.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these.

The sealant resin, additive and antistatic agent shown in Table 1 are as follows.
Sealant resin acrylic Mitsubishi Chemical Co., Ltd .: Dianal BR116 (Tg 48 ° C)
Ethylene-vinyl acetate copolymer resin (EVA) manufactured by Mitsui DuPont Polychemical Co., Ltd .: EVAFLEX EV210
SBR resin Nippon Zeon Co., Ltd .: Nipol LX438C (Tg1 ° C)
SBR resin Nippon Zeon Co., Ltd .: Nipol LX433C (Tg 50 ° C.)
SBR resin Nippon Zeon: Nipol LX2507H (Tg 58 ° C)
SBR resin, manufactured by JSR: JSR 0597C (Tg 28 ° C)
Additive acrylic-polyester Toagosei Co., Ltd .: Aron NS1200 (1)
Acrylic Toagosei Co., Ltd .: Jurimar AT613
Polyester Unitika: Elitel KA5034
Rosin ester Arakawa Chemical Industries, Ltd .: Tamanol E-100
-Antistatic agent tin oxide (antimony dope) manufactured by Advanced Nano Products: SR40MK solid content 28%
PEDOT / PSS Heraeus: Clevios P 1% solids
PEDOT / PSS manufactured by Agfa: Orgacon ICP 1010 1% solids
PEDOT / PSS Soken Chemical Co., Ltd .: Verazol WED-SM solid content 1.5%

<Examples 1-8>
(Preparation of base material layer)
Biaxially stretched polyester film (Toyobo "E5101" 19μ thickness) anchor coat agent (Mitsui Chemicals "Takelac A-3210" 9 parts by weight, Mitsui Chemicals "Takenate A3070" 3 parts by weight, ethyl acetate 88 weights Part) was applied by gravure coating with a wet thickness of 4 μm, dried at 100 ° C., low-density polyethylene (“Petrocene 203” manufactured by Tosoh Corporation, 25 μ thickness) was laminated, and a cooling roll with a surface roughness Rz 2.5 (surface temperature 20 ° C.) Was cooled to prepare a base film.
Furthermore, the low density polyethylene surface of the base film was subjected to corona treatment at an output of 42 V × 6.4 A using a corona treatment machine (manufactured by Kasuga Denki Co., Ltd .: Corona Generator).

[Preparation of coating solution (sealant layer forming composition)]
First, a surfactant adjusted to a solid content of 2 wt% with water (“DISPANOL WI-115” manufactured by NOF Corporation), 1 part by weight of a conductive additive (manufactured by Wako Pure Chemical Industries, Ltd .: ethylene glycol), pH adjuster In addition to 0.09 parts by weight (manufactured by Wako Pure Chemical Industries, Ltd.), in addition to 0.09 parts by weight, distilled water, a sealant resin, and an aqueous dispersion of an antistatic agent were mixed to form an aqueous dispersion and coated. A liquid was prepared.
Note that the sealant resin and the additive were prepared in advance to a solid content of 25 wt% to obtain an aqueous dispersion. Table 1 shows the average particle diameter D50 of the aqueous dispersion (water dispersion of component (A)).

[Production of cover tape]
Next, the coating liquid is applied to the polyethylene surface subjected to the corona treatment of the base material layer obtained above using a bar coat (manufactured by Mitsuwa Rikagaku Co., Ltd .: K Control Coater Bar # 3 • wet6 g / m ² ) at 100 ° C. And dried for 1 minute to obtain a cover tape with a sealant layer.

<Comparative Examples 1-2>
A cover tape was prepared in the same manner as in Example except that 33.3 parts by weight of the sealant resin adjusted to 15 wt% with toluene and 66.6 parts by weight of the metal antistatic agent adjusted to 28 wt% solid were mixed. Produced.

  The following evaluation and measurement were performed using the obtained cover tape. The results are shown in Table 1.

・ Peel strength-1: Peel strength (PC) against polycarbonate carrier tape
The obtained cover tape was made into the dimension of 5.5 mm in width | variety, and it heat-sealed on the following conditions with respect to the carrier tape of a width | variety of 8 mm in dimension using the heat sealing machine, and it was set as the test piece.
Using the obtained test piece, the peel strength between the cover tape and the carrier tape was measured according to the following conditions.
(Heat seal-1)
Equipment: ISMECA MBM4000
Iron size: 0.4mm x 8mm (double blade)
Temperature: 180 ° C
Load: 1kg
Sealing time: 100ms
Carrier tape feed pitch: 4mm
Carrier tape: conductive polycarbonate (# 3000 made by 3M)
(Peel strength)
Peeling machine: GPD856VS
Peeling speed: 300mm / min
Peel angle: 175-180 °
Standard: JIS K 806-3

Peel strength-2: Peel strength (PS) against polystyrene carrier tape
The obtained cover tape was made into the dimension of 5.5 mm in width | variety, and it heat-sealed on the following conditions with respect to the carrier tape of a width | variety of 8 mm in dimension using the heat sealing machine, and it was set as the test piece.
Using the obtained test piece, the peel strength between the cover tape and the carrier tape was measured according to the following conditions.
(Heat seal-2)
Equipment: NET-3200SB
Iron size: 0.5mm x 16mm (double blade)
Temperature: 180 ° C
Load: 1kg
Sealing time: 100ms
Carrier tape feed pitch: 4mm
Carrier tape: conductive polystyrene (E980E manufactured by Sumitomo Bakelite)
(Peel strength)
Peeling machine: GPD856VS
Peeling speed: 300mm / min
Peel angle: 175-180 °
Standard: JIS K 806-3

・ Surface resistance (Ω)
The surface resistance value (Ω) of the surface of the obtained cover tape on the sealant layer side was measured under the following conditions.
Equipment: TREK MODEL 152
Voltage: 100V
Standard: IEC61340-2-3
(Humidity is 12% RH)

・ Haze (%)
The haze (%) of the surface of the obtained cover tape on the sealant layer side was measured under the following conditions.
Equipment: Nippon Denka Kogyo Co., Ltd .: NDH 4000
Standard: JIS K7136-1 (1999)

DESCRIPTION OF SYMBOLS 1 Intermediate | middle layer 2 Seal layer 3 Base material layer 10 Cover tape 20 Carrier tape 21 Pocket 100 Electronic component package

Claims (11)

A cover tape having a sealant layer on one side and having a recess capable of accommodating an electronic component is used for sealing with the sealant layer,
The sealant layer has (B) an antistatic agent dispersed in (A) resin,
Component (A) includes a styrene butadiene copolymer,
Component (B) includes at least one of poly-3,4-ethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyaniline, polypyrrole and polythiophene.
Cover tape.   The cover tape of Claim 1 whose glass transition temperature (Tg) of a component (A) is 0 degreeC or more and 60 degrees C or less.   The cover tape according to claim 1 or 2, wherein the component (A) is a carboxyl-modified product.   The cover tape according to any one of claims 1 to 3, wherein the sealant layer includes a water-soluble polymer.   5. The cover tape according to claim 1, wherein the sealant layer includes at least one of a surfactant, a petroleum-based hydrocarbon resin, a rosin derivative, and an inorganic filler.   The cover tape according to any one of claims 1 to 5, wherein the cover tape further includes a base material layer and an intermediate layer between the base material layer and the sealant layer.   The said intermediate | middle layer is a cover tape of Claim 6 containing 1 or more types of thermoplastic resins selected from the group which consists of an olefin resin, a cyclic olefin resin, and a styrene resin.   The cover tape according to any one of claims 1 to 7, which has a width of 1 mm or more and 100 mm or less. A carrier tape in which an electronic component is housed in a recess;
A cover tape according to any one of claims 1 to 8,
An electronic component package in which the sealant layer is bonded to the carrier tape so as to seal the electronic component. A cover tape comprising a sealant layer on one side and having a recess capable of accommodating an electronic component is used for sealing with the sealant layer.
Mixing an aqueous dispersion of the resin (A) and an aqueous dispersion of the antistatic agent (B) to prepare a sealant layer forming composition;
Using the sealant layer forming composition, forming the sealant layer;
Have
Component (A) includes a styrene butadiene copolymer,
Component (B) includes at least one of poly-3,4-ethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyaniline, polypyrrole and polythiophene.
A method for manufacturing a cover tape.   The manufacturing method of the cover tape of Claim 10 whose average particle diameter D50 of the said water dispersion of a component (A) is 50 micrometers or more and 250 micrometers or less.

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