CN106604878B

CN106604878B - Electronic parts cover strip, electronic parts packaging material and electronic component packing body

Info

Publication number: CN106604878B
Application number: CN201580045612.5A
Authority: CN
Inventors: 山口亮
Original assignee: Sumitomo Bakelite Co Ltd
Current assignee: Sumitomo Bakelite Co Ltd
Priority date: 2014-11-12
Filing date: 2015-11-10
Publication date: 2018-03-20
Anticipated expiration: 2035-11-10
Also published as: CN106604878A; TWI647297B; KR20170024126A; JPWO2016076331A1; TW201629172A; JP5983902B1; KR101756623B1; WO2016076331A1

Abstract

An object of the present invention is to provide a kind of cover strip, the cover strip can form the electronic parts packaging material that can take out electronic unit out of carrier band possessed recess with excellent precision, the present invention provides a kind of electronic parts cover strip, it is characterised in that has：Substrate layer；And heat sealing layer, the heat sealing layer is stacked in a face of the substrate layer, and it is sealed in above-mentioned carrier band, above-mentioned heat sealing layer is more than 1.0 μm according to surface roughness Rz as defined in JIS B 0601, and above-mentioned heat sealing layer and the adhesive strength using polysiloxane as the resin bed of principal component are 0.3g/mm²Below.

Description

Electronic parts cover strip, electronic parts packaging material and electronic unit bag Fill body

Technical field

The present invention relates to electronic parts cover strip, electronic parts packaging material and electronic component packing body.

Background technology

Typically, as housing electronic part (the especially very small chip such as chip-resistance, chip LED, chip capacitor Part) etc. electronic component packing body, using will be provided with can housing electronic part recess electronic unit storage carry Cover strip (following, also referred to as " cover strip ") electronic component packing obtained from sealing in (following, also referred to as " to carry ") utilization With in packaging material, the electronic component packing body obtained from above-mentioned recess housing electronic part.

As carrier band, glued using a part for the sheet material for making banding by punching processing after in the lower surface of sheet material Punching carrier band (for example, referenced patent document 1) obtained from pasting the dished member storage portion of tail band shape (pocket), by banding A part for sheet material as obtained from compression process forms pocket compacting carrier band (for example, referenced patent document 2), by banding A part for sheet material pressure as obtained from processing and forming (pressure empty shaping, vacuum drum shaping, compressing etc.) forms pocket Line carrier band (for example, referenced patent document 3) etc..

As shown in figure 5, in such conventional electronic parts packaging material 1000, the recessed of electronic unit 40 is accommodated with Portion 512 is sealed by cover strip 200, generally, takes out electronic unit 40 from electronic parts packaging material 1000 in the following manner：It is logical Crossing makes cover strip (seal) 200 be peeled off from carrier band (base material) 500, exposes recess 512, thus, is adsorbed and sprayed using electronic unit The pickups such as mouth are accommodated in the electronic unit 40 in recess 512.

In addition, except it is above-mentioned on the technology of electronic parts packaging material in addition to, can also enumerate in such as patent document 4 The content of record.

Patent document 4 records a kind of cover strip, its comprise at least substrate layer (A), intermediate layer (B), using thermoplastic resin as The peel ply (C) of principal component and the hot sealing layer (D) using thermoplastic resin as principal component on carrier band can be sealed, be formed and peeled off Stretching storage modulus of elasticity (c) of the thermoplastic resin of layer (C) at 23 DEG C is 1 × 10⁶More than Pa 1 × 10⁸Below Pa, formed Stretching storage modulus of elasticity (d) of the thermoplastic resin of hot sealing layer (D) at 23 DEG C is 1 × 10⁸The above 1 × 10¹⁰Below Pa, (c) it is 1 × 10 with the ratio of (d)⁴≥(d)/(c)≥1×10。

In order to which the recess 512 for being accommodated with electronic unit 40 is sealed, the face of the side of carrier band 500 of such cover strip 200 needs With the cementability to carrier band 500.

Therefore, the lid with cementability can be attached to according to carrying method of electronic component packing body etc., electronic unit 40 Face with 200 side of carrier band 500, when making cover strip 200 be peeled off from carrier band 500, electronic unit 40 be not attached in recess 512 and Be attached to cover strip 200, as a result, in the presence of can not exactly using electronic unit adsorption nozzle out of recess 512 the pickup ministry of electronics industry The problem of part 40.

Especially, used in electronic unit 40 as light emitting diode by the resin structure using polysiloxane as principal component Into seal in the case of, seal possesses high viscosity, as a result, can significantly see above-described problem.

Prior art literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 10-218281 publications

Patent document 2：No. 3751414 publications of Japanese Patent Publication No.

Patent document 3：Japanese Unexamined Patent Publication 2011-225257 publications

Patent document 4：International Publication No. 2011/158550

The content of the invention

Invention technical problems to be solved

It is an object of the invention to：A kind of cover strip is provided, the cover strip can be formed can with excellent precision from carrier band institute The electronic parts packaging material of electronic unit is taken out in the recess possessed, there is provided possess the electronic parts bag of the cover strip Material, and the electronic component packing body obtained from housing electronic part in the electronic parts packaging material is provided.

In addition, the present invention also aims to provide while meet the heat sealability to carrier band and the low attachment to electronic unit The electronic parts cover strip of property.

In order to solve the above-mentioned technical problem the present inventor has made intensive studies.As a result, find by improving cover strip The softening point of resin of binding property in heat sealing layer, effectively it can prevent electronic unit from adhering to.Although however, can be effectively Prevent electronic unit from adhering to, but on the other hand the heat sealability of carrier band is deteriorated.

That is, the present inventor specify that：To the heat sealability of carrier band and to disappearing between the low tack of electronic unit in the presence of this The relation of that length (trade-off), the softening of the shifting relation only by adjusting the resin of binding property in heat sealing layer Point can not be improved.

Therefore, the present inventor further has made intensive studies.As a result, find by the way that the heat sealing layer of cover strip will be formed The Vicat softening point of resin of binding property in the variable quantity and heat sealing layer of the confficient of static friction on surface is adjusted to specific scope, Above-mentioned shifting relation can be improved, can obtain while meet the heat sealability to carrier band and the low attachment to electronic unit The cover strip of property, so as to complete the present invention.

For solving the means of technical problem

Above-mentioned purpose is realized by the present invention described in following (1)~(20).

(1) a kind of electronic parts cover strip, it is used for electronic component packing body, above-mentioned electronic component packing body tool It is standby：Carrier band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in above-mentioned recess； And cover strip, the cover strip are covered the above-mentioned recess for being accommodated with above-mentioned electronic unit by the way that above-mentioned carrier band is sealed, above-mentioned electronics Part taping packaging cover is characterised by：

Have：Substrate layer；And heat sealing layer, the heat sealing layer is stacked on a face of the substrate layer, and is sealed in Above-mentioned carrier band,

The surface roughness Rz (according to JIS B 0601 regulation) of above-mentioned heat sealing layer is more than 1.0 μm, and above-mentioned heat Sealant is 0.3g/mm with the adhesive strength using polysiloxane as the resin bed of principal component²Below.

(2) the electronic parts cover strip according to (1), wherein, full light transmittance is (according to JIS K 7361-1 Regulation) be more than 80%.

(3) the electronic parts cover strip according to (1) or (2), wherein, above-mentioned heat sealing layer contains vinyl and is total to Polymers is as main material.

(4) the electronic parts cover strip according to any one of (1) to (3), wherein, the thickness of above-mentioned heat sealing layer Spend for more than 1 μm and less than 15 μm.

(5) the electronic parts cover strip according to any one of (1) to (4), wherein, the thickness of above-mentioned substrate layer For more than 7 μm and less than 30 μm.

(6) according to the electronic parts cover strip any one of (1) to (5), wherein, above-mentioned heat sealing layer to containing There is makrolon to possess sealing as the carrier band of main material.

(7) a kind of electronic parts cover strip, it is used for electronic component packing body, above-mentioned electronic component packing body tool It is standby：Carrier band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in above-mentioned recess； And cover strip, the cover strip are covered the above-mentioned recess for being accommodated with above-mentioned electronic unit by the way that above-mentioned carrier band is sealed, above-mentioned electronics Part taping packaging cover is characterised by：

Possess：Substrate layer；And heat sealing layer, the heat sealing layer is stacked on a face of the substrate layer, and includes bonding Property resin,

In the load N that will be determined according to JIS K7125₁The confficient of static friction on above-mentioned heat sealing layer surface when (50g) is set For μ₅₀, by the load N according to JIS K7125 measure₂The confficient of static friction on above-mentioned heat sealing layer surface when (200g) is set to μ₂₀₀ When,

By (μ₅₀-μ₂₀₀)/(N₂-N₁The variable quantity for the confficient of static friction that) × 1000 represent is less than 3.0,

Above-mentioned resin of binding property in above-mentioned heat sealing layer foundation JIS K7206 measure Vicat softening point for 30 DEG C with Above and less than 70 DEG C.

(8) the electronic parts cover strip according to (7), wherein, the above-mentioned heat seal according to ISO-25178 measure The arithmetic average height (Sa) of layer surface is less than more than 0.4 μm 0.7 μm.

(9) the electronic parts cover strip according to (7) or (8), wherein, above-mentioned heat sealing layer contains (first Base) acryloyl group resin of binding property.

(10) the electronic parts cover strip according to (9), wherein, the above-mentioned bonding containing (methyl) acryloyl group The containing ratio of (methyl) acryloyl group of property resin is below the mass % of more than 10 mass % 40.

(11) the electronic parts cover strip according to (9) or (10), wherein, it is above-mentioned to contain (methyl) acryloyl group Resin of binding property be ethene copolymer.

(12) the electronic parts cover strip according to any one of (9) to (11), wherein, above-mentioned heat sealing layer is also Resin is adjusted containing cohesiveness.

(13) the electronic parts cover strip according to any one of (7) to (12), wherein, according to JIS K7361- The full light transmittance of 1 measure is more than 80%.

(14) the electronic parts cover strip according to any one of (7) to (13), wherein, above-mentioned heat sealing layer Thickness is less than more than 1 μm 15 μm.

(15) the electronic parts cover strip according to any one of (7) to (14), wherein, the thickness of above-mentioned substrate layer Spend for less than more than 7 μm 50 μm.

(16) according to the electronic parts cover strip any one of (7) to (15), wherein, above-mentioned carrier band by comprising Material more than one or both of makrolon and polystyrene is formed.

(17) the electronic parts cover strip according to any one of (7) to (16), wherein, form the above-mentioned ministry of electronics industry The seal of part is silicone seal.

(18) the electronic parts cover strip according to any one of (1) to (17), wherein, above-mentioned electronic unit is Light emitting diode.

(19) a kind of electronic parts packaging material, it possesses：

(1) to the electronic parts cover strip any one of (18)；With

Carrier band, the carrier band have in a face can housing electronic part recess, and above-mentioned recess is by above-mentioned electronic unit Taping packaging cover covers.

(20) a kind of electronic component packing body, it possesses：

Carrier band, the carrier band a face have can housing electronic part recess；

The electronic unit being incorporated in above-mentioned recess；With

(1) to the electronic parts cover strip any one of (18), the electronic parts cover strip by Above-mentioned carrier band is sealed and covers the above-mentioned recess for being accommodated with above-mentioned electronic unit by said one surface side.

Invention effect

According to electronic parts packaging material (the electronic parts bag of the invention for the cover strip for applying the present invention Material), it can positively suppress or prevent that the electronic unit being accommodated in recess is attached to cover strip when making cover strip be peeled off from carrier band Side, the state being positively accommodated in electronic unit in recess can be formed.Therefore, it is possible to more precisely utilize electronic unit Adsorption nozzle etc. carries out the pickup of electronic unit.

In addition, the electronic parts packaging material (electronic component packing of the invention according to the cover strip for applying the present invention With packaging material), above-mentioned shifting relation can be improved, while meet the heat sealability to carrier band and the low attachment to electronic unit Property.

Brief description of the drawings

Fig. 1 is the partial perspective view for the embodiment for representing the electronic parts packaging material of the present invention.

Fig. 2 is the figure (plan) of the electronic parts packaging material from arrow A directions shown in Fig. 1.

Fig. 3 is the sectional view along line B-B of the electronic parts packaging material shown in Fig. 1.

Fig. 4 is the sectional view along line C-C of the electronic parts packaging material shown in Fig. 1.

Fig. 5 is the partial perspective view for representing conventional electronic parts packaging material.

Embodiment

Hereinafter, cover strip, electronic parts packaging material and electricity of the preferred embodiment shown with reference to the accompanying drawings to the present invention Subassembly package body is described in detail.In addition, in all of the figs, identical symbol is marked for identical constitutive requirements, And description is omitted as appropriate.In addition, "~" between numeral in text, unless otherwise noted, then it represents that with up to following.

First, before the cover strip of the explanation present invention, to possessing the electronic parts packaging material of the cover strip of the present invention (this The electronic parts packaging material of invention) illustrate.

First embodiment

Fig. 1 is the partial perspective view for the embodiment for representing the electronic parts packaging material of the present invention, and Fig. 2 is from arrow A observes in direction the figure of the electronic parts packaging material shown in Fig. 1, and Fig. 3 is the edge of the electronic parts packaging material shown in Fig. 1 Line B-B sectional view, Fig. 4 is the sectional view along line C-C of the electronic parts packaging material shown in Fig. 1.It is in addition, following In explanation, by the upside in Fig. 1, Fig. 3, Fig. 4 be referred to as " on ", by the downside in Fig. 1, Fig. 3, Fig. 4 be referred to as " under ", by Fig. 2 Paper be referred to as with front side " on ", by the paper in Fig. 2 it is inboard be referred to as " under ".

Electronic parts packaging material 10 is used to pack (storage) electronic unit, in banding, has：Electronic unit storage is used Carrier band (following, also referred to as " carry ") 1, the electronic unit storage, which carries 1 and possessed in the 1st face (upper surface) 15, can store electricity Recess (the electronic unit storage recess of subassembly (not shown)；Pocket) 12；With upper cover strip (following, also referred to as " cover strip ") 20, cover strip 20 is engaged in the side of the 1st face 15 with carrier band 1 on this, and the opening for the recess 12 for carrying 1 is sealed into (covering).

That is, electronic parts packaging material 10 for example possesses：Electronic parts cover strip 20；With carrier band 1, the carrier band 1 Have in a face (the 1st face 15) can housing electronic part recess 12, and recess 12 is covered by electronic parts cover strip 20 Lid.

Carrier band (base material) 1 shown in Fig. 1~Fig. 4 is the carrier band for the resin-made being made up of the sheet material of banding, in the carrier band 1 1st face 15 of upside has：Multiple recesses 12 of 1 row are configured to along its long side direction；With with the side parallel with multiple recesses 12 Formula is configured to multiple sprocket holes 11 of 1 row.

In addition, in the present embodiment, carry the general planar of the 2nd face 13 of the opposite side (downside) in 1 the 1st face 15.

In other words, in the present embodiment, carrier band 1 has：In the recess with the end 12 that the 1st face 15 opens；With through the 1st The sprocket hole 11 in the face 13 of face 15 and the 2nd, the 2nd face 13 by near the bottom of recess 12 and its peripheral part essentially without difference of height The face of (step) is formed.

As shown in figure 1, long side direction of multiple recesses 12 along the sheet material of banding, in the 1st face 15 to be arranged in the side of 1 row Formula is equally spaced.Housing electronic part can be distinguished in these recesses 12.

In addition, the global shape of electronic unit is generally in rectangular shape, in the present embodiment, as shown in Figure 1 and Figure 2, The shape of the recess 12 of housing electronic part is also in accordingly rectangular shape with the shape of electronic unit.Therefore, in this implementation In mode, the shape during vertical view of recess 12 is rectangle shape, but can also be corresponding with the shape of the electronic unit to be stored Ground is triangular in shape, polygon-shaped as pentagon, hexagon or toroidal etc..

, can be in the inner peripheral surface of recess 12, along carrier band 1 additionally, it is contemplated that pick of electronic unit adsorption nozzle etc. Thickness direction is formed with raised line or recessed bar.

Furthermore, it is possible to the bottom surface of recess 12 is provided with difference of height.Thus, such as in the bottom surface of electronic unit formed with end In the case of son etc., it can prevent that the terminal and the bottom surface of recess 12 from contacting, therefore, it is possible to positively prevent in the defeated of carrier band 1 When giving etc., the breakage such as terminal.

In addition, as shown in Figure 1 and Figure 2, multiple sprocket holes 11 are arranged in 1 row and waited in a manner of parallel with multiple recesses 12 It is positioned apart from.The electronic unit being accommodated in recess 12 is being sent to electronic component packing body manufacturing machine by these sprocket holes 11 Or used during surface mounting apparatus etc..That is, in the manufacture method and the removing method of electronic unit applied to electronic component packing body When use.

In addition, the size on sprocket hole 11, such as in the case where carrying 1 width of short side direction and being 8mm, it is flat Equal internal diameter Φ is preferably set to 1.5~1.6mm or so, is more preferably set as 1.5~1.55mm or so.In the short side side of carrier band 1 To width be 4mm in the case of, its mean inside diameter Φ is preferably set to 0.76~0.84mm or so, is more preferably set as 0.78 ~0.82mm or so.Thereby, it is possible to be reliably carried out above-mentioned transmission.

In addition, multiple recesses 12 are arranged in 1 row with multiple sprocket holes 11 with the long side direction along the sheet material in banding Mode set.The interval being each configured is not particularly limited, for example, can be in above-mentioned long side direction, in 2 sprocket holes 11 Between be configured with the recess 12 of more than 2,1 recess 12 can also be configured between 2 sprocket holes 11.

In addition, the possessed of electronic parts packaging material 10 carrier band 1 is resin-made.Because being resin-made, Micro mist as will not producing paper powder from carrier band 1 itself in transmission, the failure welding or electricity of electronic unit can be prevented The blocking of subassembly adsorption nozzle.In addition, it can prevent the size of the fluffing in recess 12 or the recess 12 as caused by moisture absorption from becoming Change.Thereby, it is possible to fully tackle to clean, sealing (taping) is realized and the raising of stability that surface is installed, productivity ratio Improve.

In addition, because being resin-made, the intensity of carrier band 1 improves.Thus, even in order to store highly small electricity Subassembly and reduce carrier band 1 thickness in the case of, can also prevent sealing when or installation when, conveying carrier band 1 when, carrier band 1 sprocket hole 11 deforms or carried 1 fracture etc..Thereby, it is possible to fully suppress to convey bad, storage stability when raising seals Or pick during installation, raising, the raising of productivity ratio of the stability of sealing and surface installation can be realized.

In addition, being not particularly limited as the resin for forming carrier band 1, such as it can enumerate such as makrolon, polystyrene, gather Various resins as ethene, polypropylene, polyester (polyethylene terephthalate etc.), polyvinyl chloride, polyamide, polyacetals (various thermoplastic resins), a kind in these can be used or two or more is applied in combination.In these, preferably use and be selected from poly- carbon At least one of acid esters and polystyrene.

Because in recent years, along with the miniaturization of electronic unit, preferably using the width of carrier band 1 for 8mm or so that The narrow carrier band of sample, also, it is preferred that using long carrier band so that electronic unit is being accommodated in recess 12 and is utilizing cover strip 20 It can be transmitted when being sealed in electronic component packing body manufacturing machine etc..That is, as carrier band 1, it is strongly required exploitation width Narrow and long carrier band, as a result, begin to use by using the makrolon as the strong resin of rigidity and/or polystyrene as The carrier band that the resin of main material is formed.Moreover, as the resin for forming carrier band 1, use based on makrolon and/or styrene The resin of material, and then, as described later, even if with the surface roughness Rz of the possessed heat sealing layer 22 of cover strip 20 (according to JIS B 0601 regulation) for the adhesive strength of more than 1.0 μm and heat sealing layer 22 and the resin bed comprising polysiloxane be 0.3g/mm²Following cover strip 20 combines, and can also ensure that the sealing (adaptation) between heat sealing layer 22 and carrier band 1.

In addition, the electroconductive stuffing such as mixed carbon black, graphite, carbon fiber in these resins as needed.Thereby, it is possible to right Carrier band 1 assigns electric conductivity, can effectively suppress the powered of carrier band 1, therefore, it is possible to suppress the electronic unit as caused by electrostatic Damage.Furthermore it is possible to it is added as needed on the various additives such as foaming agent, lubricant.Furthermore, it is possible in the surface shape of carrier band 1 Into the remover comprising silicone resinoid, fluorine-type resin etc. or conductive overlay film etc..In addition, the Rotating fields of carrier band 1 can To be set to the single or multiple lift for meeting these conditions.

In addition, in the present embodiment, recess 12 forms the opposite side in the 1st face 15 of carrier band 1, carrying 1 the 1st face 15 The general planar of the 2nd face 13.That is, the 2nd face 13 by near the bottom of recess 12 and its peripheral part essentially without difference of height Face is formed.Therefore, carrier band 1 can utilize punching to carry or suppress the sealing machine (Taping machin e) of carrier band and install Machine, used in the same manner as punching carrier band or compacting carrier band.In addition, when above-mentioned carrier band 1 is conveyed on spool, due to 2nd face 13 is substantially a flat, therefore can prevent from winding avalanche or winding relaxation.Deformation or lid thus, it is possible to prevent recess 12 With 20 damage.

In addition, the size of recess 12 is determined by the size of packaging electronic unit, but the size of recess 12 is being set to D (mm), E (mm), D≤E, when the size of electronic unit is set into X (mm), Y (mm), X≤Y, 0 ＜ D-X≤0.3,0 are preferably met ＜ E-Y≤0.3, more preferably 0.05≤D-X≤0.15,0.05≤E-Y≤0.15., can by above-mentioned preferable scope Improve sealing when storage stability and installation when pick, can prevent because carrier band 1 keeping when or conveying when impact, dirt The breakage of electronic unit caused by dye etc..

As shown in Figure 1 and Figure 2, cover strip 20 is in banding, and fitting (sealing) is in the 1st face 15 of carrier band 1 so that by the recessed of carrier band 1 The opening sealing (covering) in portion 12.

The cover strip 20 is used for：In the state of electronic unit is accommodated in recess 12, carrier band 1 the side of the 1st face 15 with The engagement of carrier band 1, then, after being taken care of and conveyed in this condition, is peeled off from carrier band 1, is then adsorbed and sprayed using electronic unit Mouth etc., the electronic unit being contained from the interior pickup (taking-up) of recess 12.

Such cover strip (cover strip of the invention) 20, in the present invention, as shown in Figure 3, Figure 4, there is substrate layer 21 and fold Heat sealing layer 22 of the layer on the substrate layer 21, the 1st face 15 of carrier band 1 is sealed in using heat sealing layer 22 as 1 side of carrier band.

(heat sealing layer)

The surface roughness Rz (according to JIS B 0601 regulation) of the possessed heat sealing layer 22 of cover strip 20 is 1.0 μm More than, and heat sealing layer 22 and the adhesive strength using polysiloxane as the resin bed of principal component are 0.3g/mm²Below.

So, the surface roughness of heat sealing layer 22 is set to as the surface roughness determined according to JIS B 0601 10 mean roughness Rz are more than 1.0 μm, and thereby, it is possible to keeping cementability (zygosity) of the heat sealing layer 22 to carrier band 1 While, heat sealing layer 22 and the adhesive strength using polysiloxane as the resin bed of principal component are set as 0.3g/mm²With Under.

Therefore, even if being accommodated in the electronic unit in recess 12, such as light emitting diode, seal with poly- by having Organic siloxane for principal component resin form and the seal possess high viscosity because be set to using polysiloxane as The adhesive strength of the resin bed of principal component is 0.3g/mm²Such low adhesive strength below, thus also can positively suppress or Prevent that electronic unit is attached to the side of cover strip 20 when making cover strip 20 be peeled off from carrier band 1.It is therefore, it is possible to be formed that electronic unit is true The state being accommodated on the spot in recess 12, therefore more precisely can carry out electronic unit using electronic unit adsorption nozzle etc. Pickup.

Here, as long as the surface roughness Rz of heat sealing layer 22 is more than 1.0 μm, but preferably more than 1.0 μm 6.0 Below μm, more preferably less than more than 1.0 μm 3.0 μm.By the way that above-mentioned surface roughness Rz size is set within the range, It can more reliably suppress while sealing (zygosity) to carrier band 1 is reliably kept or prevent electronic unit from adhering to In heat sealing layer 22.That is, can be more reliably close by heat while sealing (zygosity) to carrier band 1 is reliably kept The adhesive strength of sealing 22 and the resin bed comprising polysiloxane is set as 0.3g/mm²Below.

In addition, as long as the adhesive strength of heat sealing layer 22 and the resin bed comprising polysiloxane is 0.3g/mm²Below , but preferably 0.1g/mm²Hereinafter, more preferably 0.05g/mm²Below.Thus, when making cover strip 20 be peeled off from carrier band 1, It can more reliably suppress or prevent electronic unit to be attached to the side of cover strip 20.

In addition, the adhesive strength of heat sealing layer 22 and the resin bed comprising polysiloxane, for example, can as it is following that Sample determines.I.e., first, by the resin bed comprising polysiloxane and heat sealing layer 22, being upside with heat sealing layer 22 In the state of overlapping, 1kg counterweight is loaded in cover strip 20, is thus engaged.Then, by assigning silicone resin layer and heat The power that sealant 22 separates, heat sealing layer 22 (cover strip 20) is peeled off from the resin bed comprising polysiloxane, calculate basis The viscous force that the initial load incrementss (Max values) that now measure and the difference of constant load (counterweight load) afterwards obtain is (viscous Connecing property), as adhesive strength.

In addition, for heat sealing layer (hot sealing layer) 22, to will make electronic unit (50, Sharp Corporation's manufacture, " GM4ZR83232AE ") closely sealed heat sealing layer 22 makes 180 ° of its rotation cause at electronic unit in 65 DEG C of keepings 24 hours When the stickup of electronic unit when lower section is evaluated, preferably electronic unit survival rate is less than 40%, the more preferably ministry of electronics industry Part survival rate is less than 30%.Above-mentioned higher limit is less than by electronic unit survival rate, it may be said that positively inhibit the ministry of electronics industry Part is attached to the side of cover strip 20.

In addition, resin bed is preferably set to count the hardness of measure as more than 20 using JIS Type A type hardness testers, and with Shore D The hardness of type (Shore D types) type hardness tester meter measure is less than 70, is more preferably set in terms of JIS Type A type hardness testers and determines Hardness be more than 35, and using Shore D hardometer measure hardness as less than 55.By heat sealing layer 22 to the scope The adhesive strength of the resin bed of interior hardness is in above range, can more reliably suppress or prevent electronic unit to be attached to lid The side of band 20.

Such possessed heat sealing layer 22 of cover strip 20, as long as when it is more than 1.0 μm to make its surface roughness Rz, can The adhesive strength for making itself and the resin bed comprising polysiloxane is 0.3g/mm²Below, it is possible to be made up of any resin. As the resin of composition heat sealing layer 22, such as acrylic resin, polycarbonate resin, (methyl) acrylic compounds tree can be enumerated Fat, polythylene resin, polystyrene resins and polyester resin etc., it can be used 1 in these resins kind or be applied in combination 2 More than kind.In these resins, preferably using polythylene resin as main material.Thus, when carrier band 1 is for example using makrolon as main material When expecting and forming, the sealing (adaptation) between heat sealing layer 22 and carrier band 1 can be reliably ensure that, moreover, making heat close , can be more reliably by heat seal when the surface roughness Rz (according to JIS B 0601 regulation) of sealing 22 is more than 1.0 μm The adhesive strength of layer 22 and the resin bed comprising polysiloxane is set as 0.3g/mm²Below.

In addition, above-mentioned sealing refers to after by heat-sealing of the cover strip 20 relative to the progress 0.015 second at 220 DEG C of carrier band 1, according to According to JIS C-0806-3, the peel strength of the cover strip 20 when being peeled off from carrier band 1 is more than 20gf, as long as being more than 20gf, But preferably more than 30gf below 50gf.Thereby, it is possible to positively prevent from covering in the keeping and conveying of electronic component packing body Band 20 is peeled off from carrier band 1, and in the electronic unit that pickup is contained out of recess 12, can be easily by cover strip 20 from load Band 1 is peeled off.

In addition, above-mentioned peel strength, such as can try to achieve in the following manner：By 8mm wide carrier band 1 and long side direction 500mm, width 5mm cover strip 20, according to JIS C-0806-3, finding speed are set to after the fitting of the face of the side of heat sealing layer 22 300mm/min, calculate mean peel strength when cover strip 20 of sening as an envoy to is peeled off.

In addition, as polythylene resin, such as can enumerate：Such as ethylene-methyl acrylate copolymer (EMA), ethene-the third Olefin(e) acid methacrylate copolymers (EEA), ethylene-butyl acrylate copolymer (EBA), ethylene methyl methacrylate copolymer (EMMA) ethene as-(methyl) acrylate copolymer, vinyl-vinyl acetate copolymer (EVA), styrene-(first Base) acrylate copolymer (MS), polyethylene glycol and polyacrylic graft copolymer, the block copolymerization by styrene and butadiene The ethene copolymer such as polymer (SEBS) obtained from the double bond hydrogenation of thing.By using these ethene copolymers as poly- Vinyl resins, it can significantly more play the effect above.

In addition, the weight average molecular weight for forming the resin of heat sealing layer 22 is not particularly limited, preferably 6,000~700, 000 or so, more preferably 10,000~500,000 or so.When the weight average molecular weight for the resin for forming heat sealing layer 22 is above-mentioned During scope, it is possible to increase the film forming of heat sealing layer 22, and the sealing between heat sealing layer 22 and carrier band 1 can be reliably ensure that Property (adaptation).

In addition, forming the weight average molecular weight of the resin of heat sealing layer 22, such as surveyed using GPC (gel permeation chromatography) It is fixed.

In addition, heat sealing layer 22, can for the adhesive strength with the silicone resin layer comprising polysiloxane and In the range of not had undesirable effect with the resin of binding property of carrier band 1, addition cohesiveness adjustment resin, cohesive adjustment resin Deng.

As long as cohesive adjustment resin is just not particularly limited for that can adjust the resin of cohesive, preferred alkenes class tree Fat, wherein further preferred polyvinyl resin, such as can enumerate low density polyethylene (LDPE), medium density polyethylene, high density polyethylene (HDPE), Straight-chain low density polyethylene (LDPE) etc..Especially for the compatibility improved with resin of binding property, preferred density 900g/m³Above and Less than 920g/m³, to be 100 DEG C less than 120 DEG C, MFR be 1.0g/10min less than 5g/10min to fusing point.

Cohesiveness adjustment resin is used for：When cover strip 20 is peeled off from carrier band 1, by adjusting heat sealing layer (hot sealing layer) 22 Cohesion destroy, carrier band 1 is can be easily separated with cover strip 20.

Resin is adjusted as the cohesiveness, as long as the resin destroyed for that can adjust cohesion is just not particularly limited, preferably Styrene resin, such as polystyrene, SBS (SBS), styrene-second can be enumerated Alkene-butadiene-styrene block copolymer (SEBS), SIS (SIS), benzene second Alkene-ethylene-propylene, Styrene block copolymer (SEPS), styrene-methylacrylate copolymer, styrene-t Methyl terpolymer, hydrogenated styrene block copolymers etc..From the viewpoint of the transparency, particularly preferred styrene-methyl propylene Sour methyl terpolymer, hydrogenated styrene block copolymers.Cohesiveness adjusts resin relative to composition heat sealing layer (hot sealing layer) 22 Resin combination, preferably more than 5 weight % below 60 weight %, more preferably more than 10 weight % below 50 weight %. More than for lower limit, it can obtain and the effect that cohesion destroys easily occurs, below for higher limit, can not be hindered Hinder the effect of cohesive.

Heat sealing layer 22 can also include antistatic resin.Antistatic resin is not particularly limited, such as comprising：Polyethers/poly- Olefin copolymer, polyetheresteramide block's copolymer, the methacrylate copolymer containing quaternary ammonium base, the Malaysia acyl containing quaternary ammonium base Imine copolymer, kayexalate etc..Wherein preferred, polyethers/polyolefin copolymer.Polyethers/polyolefin copolymer it is anti-quiet Electrical property is high, transparent excellent after baking, and the Combination with resin of binding property might as well., can by comprising antistatic resin Assign electric conductivity.By assigning electric conductivity, can prevent due to causing electronic unit in electrostatic caused by peel-off covers band 20 It is attached to the bad situation of powered cover strip 20 and the damage of the electronic unit as caused by static discharge.It is preferred that antistatic resin Resin combination relative to composition heat sealing layer (hot sealing layer) 22 is below the mass % of more than 10 mass % 40.

In addition, the thickness of heat sealing layer 22 is preferably less than more than 1 μm 15 μm, more preferably less than more than 5 μm 13 μm.By This, can be set as more than 1.0 μm by the surface roughness Rz of heat sealing layer 22, can make the heat with surface roughness Rz Sealant 22 has the sealing (adaptation) to carrier band 1, and can be by the heat sealing layer 22 with surface roughness Rz It is set as 0.3g/mm with the adhesive strength of the silicone resin layer comprising polysiloxane²Below.

(substrate layer)

In addition, substrate layer 21 is as long as there is can bear when with processing or the external force of application such as during heat-sealing to carrier band Mechanical strength, heat resistance when can bear heat-sealing, it becomes possible to according to obtained from being suitably used the various materials of processing in purposes Film.

Specifically, the example as base material layer film material, polyethylene terephthalate can be enumerated, be poly- to benzene It is dioctyl phthalate butanediol ester, PEN, nylon 6, nylon66 fiber, polypropylene, polymethylpentene, polyvinyl chloride, poly- Acrylate, polymethacrylates, polyimides, PEI, polyarylate, polysulfones, polyether sulfone, polyphenylene oxide, poly- carbonic acid Ester, ABS resin etc..In order to improve mechanical strength, preferably polyethylene terephthalate, nylon 6, nylon66 fiber etc..In addition, More than 2 layers of the laminated body selected from the resin illustrated can be used as substrate layer 21.

The weight average molecular weight for forming the resin of substrate layer 21 is not particularly limited, and preferably 8,000~1,000,000 is left The right side, more preferably 8,500~950,000 or so.It is above-mentioned by the way that the weight average molecular weight for forming the resin of substrate layer 21 is set in In the range of, substrate layer 21 can be made to possess excellent flexibility.

In addition, forming the weight average molecular weight of the resin of substrate layer 21, such as surveyed using GPC (gel permeation chromatography) It is fixed.

Substrate layer 21 can also use unstretched film, but preferably use edge to improve the overall mechanical strength of cover strip Single shaft direction or the film of biaxially oriented stretching.Especially, more preferably comprising in biaxially stretched polyester and biaxial stretch-formed polypropylene Wantonly more than 1.

In addition, the thickness of substrate layer 21 is preferably less than more than 7 μm 30 μm, more preferably less than more than 10 μm 25 μm.By This, can make substrate layer 21 possess excellent flexibility.When the thickness of substrate layer 21 is below above-mentioned higher limit, the rigidity of cover strip It will not become too high, in the case that the carrier band 1 after to heat-sealing applies distorting stress, cover strip 20 can also follow carrier band 1 Deformation, peeling-off possibility are few.In addition, when the thickness of substrate layer 21 is more than above-mentioned lower limit, the machinery of cover strip 20 Intensity becomes suitable, can suppress cover strip 20 when the high speed when the electronic unit being accommodated in recess 12 is taken out is peeled off and be broken The problem of.

In addition, substrate layer can contain antistatic additive, slip agent and antiblocking agent in the range of its characteristic is not damaged.

In addition, such cover strip 20 preferably has translucency (transparency).Thus, by cover strip 20 from 1 stripping of carrier band Before, the state in the confirmation recess 12 of cover strip 20 can be also passed through, such as whether there is the receiving state of housing electronic part, electronic unit Deng.

In addition, the degree on the translucency, specifically, full light transmittance is preferably as defined in JIS K 7361-1 More than 80%, more preferably more than 85%.

In addition, the mist degree of cover strip 20 is preferably less than 70% (according to JIS K 7136 regulation), more preferably 30% with Under.

By the way that within the above range, it is more reliable full light transmittance and the mist degree setting of cover strip 20 can be passed through into cover strip 20 Ground confirms and (visually confirmed) state in recess 12.

In the recess 12 for the electronic parts packaging material 10 electronic unit being accommodated in involved by present embodiment, then Cover strip 20 is engaged with carrier band 1 in a manner of recess 12 is capped, is derived from storing in electronic parts packaging material 10 There is the electronic component packing body (electronic component packing body of present embodiment) of electronic unit.

That is, the electronic component packing body of present embodiment, such as possess：Carrier band 1, the carrier band 1 is in a face (the 1st face 15) With can housing electronic part recess 12；The electronic unit being incorporated in recess 12；With electronic parts cover strip 20, The electronic parts cover strip 20 will be accommodated with electronic unit by will carry 1 sealing in a face (the 1st face 15) side Recess 12 covers.

In addition, carrier band 1 and the engagement of cover strip 20 are generally carried out by sealing.Heat-sealing uses length of the sealer along cover strip 20 Each edge in side is carried out.

In addition, electronic unit is the size for the degree that can be accommodated in the recess 12 of carrier band 1, such as resistance, electricity can be enumerated Container, light emitting diode, semiconductor element (semiconductor chip), the semiconductor package body etc. for possessing the semiconductor element, but electricity Subassembly is packed for packaging material 10 and is especially preferred for use in light emitting diode of the storage as electronic unit.

Generally, the seal of light emitting diode is by the resin (silicone seal comprising polysiloxane with high viscosity Part) form.

The cover strip 20 of present embodiment is low relative to the adhesive strength of silicone seal.Therefore, even if by light emitting diode It is accommodated in recess 12, when making cover strip 20 be peeled off from carrier band 1, also can positively suppresses or prevent electronic unit to be attached to lid The side of band 20.

In addition, the electronic parts packaging material 10 and electronic component packing body, spool (core) side is used as using the 2nd face 13 It is wound, and is taken care of and conveyed.Thereby, it is possible to realize that electronic parts packaging material 10 and electronic component packing body exist Space saving during keeping and when conveying.

Second embodiment

Hereinafter, to the electronic parts cover strip of second embodiment, electronic parts packaging material and electronic unit Package body illustrates.

The electronic parts cover strip, electronic parts packaging material and electronic component packing of this second embodiment Body, electronic parts cover strip, electronic parts packaging material and electronic component packing body with above-mentioned first embodiment, Electronic parts cover strip is different.

Electronic parts cover strip 20 involved by present embodiment possesses：Substrate layer 21；With heat sealing layer 22, the heat Sealant 22 is arranged on a face of substrate layer 21, and includes resin of binding property.

Moreover, cover strip 20 by (μ₅₀-μ₂₀₀)/(N₂-N₁) × 1000 represent confficient of static friction variable quantity for 3.0 with Under.

Here, μ₅₀For load N₁The confficient of static friction on the surface of heat sealing layer 22 when (50g), μ₂₀₀For load N₂(200g) When the surface of heat sealing layer 22 confficient of static friction.

In addition, in cover strip 20, the Vicat softening point of the resin of binding property in heat sealing layer 22 is for 30 DEG C less than 70 ℃。

By make heat sealing layer 22 above-mentioned confficient of static friction variable quantity for below above-mentioned higher limit, and make heat seal The Vicat softening point of resin of binding property in layer 22 is realized for the heat sealability to carrier band 1 in above range, can be made good Prevent the cover strip 20 that electronic unit tack is excellent.

In addition, in cover strip 20 involved by present embodiment, heat sealing layer 22 is provided in a face of substrate layer 21 Layer.The surface of the heat sealing layer 22 is located at the side contacted with carrier band 1.

In addition, as shown in Figure 1 and Figure 2, cover strip 20 is, for example, banding, the opening for the recess 12 for carrying 1 is sealed into (covering) Mode, be bonded (sealing) and used in the 1st face 15 of carrier band 1.

Cover strip 20 is used for：In the state of electronic unit is accommodated in recess 12, in the side of the 1st face 15 of carrier band 1 with carrying Band 1 engages, and then, after being taken care of and conveyed in this condition, is peeled off from carrier band 1, then utilizes electronic unit adsorption nozzle Deng the electronic unit being contained from the interior pickup (taking-up) of recess 12.

Such cover strip 20, in the present embodiment, as shown in Figure 3, Figure 4, there is substrate layer 21 and be stacked in the base material Heat sealing layer 22 on layer 21, sealed using heat sealing layer 22 as 1 side of carrier band in the 1st face 15 of carrier band 1.

According to the research of the present inventor, specify that：Carrying method according to electronic component packing body etc., electronic unit can be attached In the face of the carrier band side of the cover strip with cementability, when making cover strip be peeled off from carrier band, electronic unit is not attached in recess And cover strip is attached to, as a result, electronic unit adsorption nozzle pickup electronic components out of recess can not be utilized exactly.

Especially it specify that：When the situation using the electronic unit that the seal as light emitting diode etc. is silicone seal Under, seal possesses high viscosity, as a result, can significantly see above-described problem.

In order to solve the above-mentioned technical problem the present inventor has made intensive studies.As a result, it is found that by improving cover strip Heat sealing layer in resin of binding property softening point, effectively can prevent electronic unit from adhering to.Although however, can be effective Ground prevents electronic unit from adhering to, but on the other hand the heat sealability of carrier band is deteriorated.

That is, the present inventor specify that：To the heat sealability of carrier band and to disappearing between the low tack of electronic unit in the presence of this The relation of that length, the shifting relation can not only be changed by adjusting the softening point of the resin of binding property in heat sealing layer It is kind.

According to the confirmation of the present inventor, in conventional cover strip, the variable quantity of the confficient of static friction on heat sealing layer surface surpasses Cross above-mentioned higher limit.That is, the state on heat sealing layer surface changes easily by the contact with electronic unit.Therefore, it is of the invention People thinks the attachment of electronic unit easily occurs.

That is, the cover strip 20 involved by present embodiment, the change of the confficient of static friction on the surface of heat sealing layer 22 as described above The Vicat softening point of resin of binding property in amount and heat sealing layer 22 meets specific condition.By making the surface of heat sealing layer 22 The variable quantity of confficient of static friction is below above-mentioned higher limit, can make to prevent that electronic unit tack is good.In addition, by making heat The Vicat softening point of resin of binding property in sealant 22 is in above range, and the heat sealability to carrier band can be made good.

In the cover strip 20 involved by present embodiment, the variable quantity of the confficient of static friction on the above-mentioned surface of heat sealing layer 22 For less than 3.0, but it is preferably more than -2.0 less than 2.5, more preferably more than -1.5 less than 2.0.By making heat sealing layer The variable quantity of the confficient of static friction on 22 surfaces is below above-mentioned higher limit, can make to prevent that electronic unit tack is better. In addition, the variable quantity of the confficient of static friction by making the surface of heat sealing layer 22 is more than above-mentioned lower limit, can further press down Winding skew under reeling condition processed etc..

In addition, confficient of static friction, such as the TENSILON universal materials examination of A＆D Company, Limited manufactures can be used Test machine (ProductName：RTF-1250), it is measured according to JIS K7125.

In addition, in the cover strip 20 involved by present embodiment, the dimension card softening of the resin of binding property in heat sealing layer 22 Put as 30 DEG C less than 70 DEG C, but preferably less than more than 35 DEG C 65 DEG C, more preferably less than more than 40 DEG C 60 DEG C.Pass through The Vicat softening point for making the resin of binding property in heat sealing layer 22 is more than above-mentioned lower limit, can make to prevent electronic unit from adhering to Property is better.In addition, by making the Vicat softening point of the resin of binding property in heat sealing layer 22 less than above-mentioned higher limit or being Below above-mentioned higher limit, the heat sealability to carrier band can be made better.

In addition, the Vicat softening point of the resin of binding property in heat sealing layer 22 can determine according to JIS K7206.

Cover strip 20 involved by present embodiment, even for makrolon or polyphenyl containing the resin strong as rigidity The carrier band 1 of ethene, can also be sealed at low temperature.Implement baking in the state of cover strip 20 to be heat-sealed in carrier band 1 Processing, electronic unit will not also be attached to cover strip 20, and even if carrying out baking processing, also maintain sensor etc. can be utilized to fill Ground is divided to carry out the transparency of the degree of identification or the inspection of electronic unit.

The variable quantity of the confficient of static friction of the heat sealing layer 22 of cover strip 20 involved by present embodiment, can be by appropriate Regulation forms the species of each composition of heat sealing layer 22 or the preparation method of mixing ratio and cover strip 20 is controlled.

In the present embodiment, as the factor for being controlled to the variable quantity of above-mentioned confficient of static friction, especially may be used Enumerate the resin of binding property for properly selecting composition heat sealing layer 22 or cohesiveness adjusts resin, cohesive adjusts resin, anti-quiet The species of electric resin, or surface roughness of adjustment heat sealing layer 22 etc..The surface roughness of heat sealing layer 22, such as can pass through Make the rough surface face of heat sealing layer 22 using the roller for possessing projection to be adjusted when heat sealing layer 22 is film-made.

Cover strip 20 involved by present embodiment, in load N₁The confficient of static friction on the surface of heat sealing layer 22 when (50g) μ₅₀Preferably less than more than 0.5 3.0, more preferably less than more than 1.0 2.5.

By the confficient of static friction μ for making the surface of heat sealing layer 22₅₀For that in above range, can make to prevent electronic unit from adhering to Property is better.

Even if being accommodated in the electronic unit in recess 12, such as the sealing of electronic unit is formed as light emitting diode etc. Part is made up of silicone seal and the seal possesses high viscosity, and the cover strip 20 of present embodiment is because to silicone seal Adhesive strength is low, so also can positively suppress or prevent that electronic unit is attached to lid when making cover strip 20 be peeled off from carrier band 1 The side of band 20.Therefore, it is possible to form the state being positively accommodated in electronic unit in recess 12, therefore being capable of higher precision land productivity The pickup of electronic unit is carried out with electronic unit adsorption nozzle etc..

In addition, in the cover strip 20 involved by present embodiment, the arithmetic average height (Sa) on the surface of heat sealing layer 22 is excellent Elect less than more than 0.4 μm 0.7 μm as.Thereby, it is possible to more reliably suppress or prevent when making cover strip 20 be peeled off from carrier band 1, electricity Subassembly is attached to the side of cover strip 20.

In addition, the arithmetic average height (Sa) on the surface of heat sealing layer 22, such as Ryoka Systems Inc. systems can be used White interferometer (the ProductName made：VertScan (registration mark)), it is measured according to ISO-25178.

The width of cover strip 20 involved by present embodiment is preferably more than 1mm below 100mm, more preferably 2mm Below above 80mm, most preferably more than 2mm below 50mm.

Cover strip 20 involved by present embodiment preferably has translucency (transparency).Thus, by cover strip 20 from carrier band 1 Before stripping, the state in the confirmation recess 12 of cover strip 20 can be also passed through, such as whether there is the receipts of housing electronic part, electronic unit Receive state etc..

In addition, the degree on the translucency, specifically, the full light transmittance according to JIS K 7361-1 measure are excellent Elect more than 80%, more preferably more than 85% as.

In addition, the mist degree of cover strip 20 is preferably less than 70% (according to JIS K 7136 regulation).

The thickness of cover strip 20 is not particularly limited, but preferably less than more than 20 μm 100 μm, more preferably more than 36 μm 60 Below μm.By in preferable scope, it is possible to increase operability.

Hereinafter, each layer for forming the cover strip involved by present embodiment is illustrated.

(heat sealing layer)

Heat sealing layer 22 is preferably made up of the resin combination containing resin of binding property.

Resin of binding property is used for by the way that carrier band 1 is sealed to make carrier band 1 be bonded with cover strip 20 with cover strip 20.As viscous Conjunction property resin, as long as the resin to the display cohesive of carrier band 1, just it is not particularly limited, but from making the better sight of adaptation Point considers, preferably comprises the resin of binding property containing (methyl) acryloyl group.

It is not particularly limited as the resin of binding property containing (methyl) acryloyl group, but preferably to contain (methyl) propylene The thermoplastic elastomer (TPE) of acyl group is the resin of principal component, and the further preferably thermoplastic elastomer (TPE) of (methyl) acryloyl group is ethene Analog copolymer.Thus, the flexibility of cover strip 20 becomes better.As above-mentioned ethene copolymer, ethylene-acrylic acid can be enumerated Copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl acrylate copolymer, ethylene methyl methacrylate copolymer, Ethylene-ethyl acrylate copolymer, ethylene-ethyl methacrylate copolymer, ethylene-butyl acrylate copolymer, ethene-first Base butyl acrylate copolymer etc..Wherein, particularly preferred ethylene-methyl acrylate copolymer.

The containing ratio of (methyl) acryloyl group of the resin of binding property containing (methyl) acryloyl group is preferably 10 mass % Below the mass % of the above 40, more preferably more than 12 mass % below 30 mass %.It is in the containing ratio of (methyl) acryloyl group In the case of more than above-mentioned lower limit, the softening temperature step-down of heat sealing layer 22, carrier band 1 and the cohesive of cover strip 20 become better It is good.On the other hand, (methyl) acryloyl group containing ratio for below above-mentioned higher limit in the case of, heat sealing layer 22 on the contrary Softening temperature uprise, can more effectively suppress to be accommodated in the attachment of the electronic unit and cover strip 20 in carrier band.

Here, the containing ratio of (methyl) acryloyl group, such as can be measured according to Du Pont process or Japanese polyethylene process.

The ratio of resin of binding property relative to form heat sealing layer 22 resin combination integrally be preferably 30 mass % with Upper below 80 mass %, more preferably more than 40 mass % below 70 mass %.More than for above-mentioned lower limit, can more have Effect ground obtains the effect improved to the cohesive of carrier band 1.On the other hand, can be more effectively by below for above-mentioned higher limit Obtaining prevents the cut-off effect of cover strip 20 when cover strip 20 is peeled off at a high speed from carrier band 1.

In addition, form heat sealing layer 22 resin weight average molecular weight, preferably with the weight in above-mentioned first embodiment Average molecular weight identical scope.

In addition, the resin combination of heat sealing layer 22 is formed, can be for the tack to electronic unit and to carrier band 1 Heat sealability do not have undesirable effect in the range of, also containing cohesiveness adjustment resin, cohesive adjustment resin etc..

Cohesive adjusts resin and cohesiveness adjustment resin can be used and the resin used in above-mentioned first embodiment Identical resin.

The ratio of cohesiveness adjustment resin is overall relative to the resin combination for forming heat sealing layer 22, preferably 5 matter Below the mass % of more than % 50 are measured, more preferably more than 10 mass % below 40 mass %.More than for above-mentioned lower limit, energy The effect that cohesion destroys easily occurs for enough obtain, and below for above-mentioned higher limit, can obtain the effect for not hindering cohesive.

Heat sealing layer 22 can also include antistatic resin.Antistatic resin can be used with being made in above-mentioned first embodiment Resin identical resin.

The ratio of antistatic resin is overall relative to the resin combination for forming heat sealing layer 22, preferably 5 mass % with Upper below 40 mass %.More preferably more than 10 mass % below 30 mass %.

The thickness of heat sealing layer 22 is preferably less than more than 1 μm 15 μm, more preferably less than more than 5 μm 13 μm.

In addition, as it was previously stated, the variable quantity of the confficient of static friction of heat sealing layer 22 is in specific scope.In order to meet this Point, it can be set by properly selecting the resin of binding property, cohesiveness adjustment resin, cohesive adjustment of above-mentioned heat sealing layer 22 Fat, the species of antistatic resin and suitably set the surface roughness of heat sealing layer 22 and realize.

(substrate layer)

Substrate layer 21 can be used and the substrate layer identical substrate layer in above-mentioned first embodiment.

The thickness of substrate layer 21 in present embodiment is preferably less than more than 7 μm 50 μm, more preferably more than 10 μm 30 μ Below m.Thereby, it is possible to make the flexibility of substrate layer 21 better.When the thickness of substrate layer 21 is below above-mentioned higher limit, cover strip 20 rigidity will not become too high, and in the case that the carrier band 1 after to heat-sealing applies distorting stress, cover strip 20 can also follow The deformation of carrier band 1, peeling-off possibility are few.In addition, when the thickness of substrate layer 21 is more than above-mentioned lower limit, cover strip 20 Mechanical strength become better, can suppress to cover during the stripping of the high speed when the electronic unit being accommodated in recess 12 is taken out Band 20 is broken.

(intermediate layer)

Cover strip 20 involved by present embodiment, intermediate layer can be provided between substrate layer 21 and heat sealing layer 22 (not shown).The intermediate layer can improve the overall resiliency of cover strip 20, and the cover strip 20 when improving sealing with carry 1 it is closely sealed Property.

As the resin in composition intermediate layer, such as olefine kind resin, styrene resin, cyclic olefin tree can be enumerated Fat.Preferred alkenes resinoid among these.By using olefine kind resin, the effect for improving adaptation can be reliably obtained.

In order to reliably obtain the effect for improving adaptation, the thickness in intermediate layer is preferably 10~50 μm, more preferably 15 ~30 μm.

(adhesive layer)

Cover strip 20 can be provided with adhesive layer (not shown) between the layers.By setting the adhesive layer, it is possible to increase each Cohesive between layer.

As the resin of composition adhesive layer, such as the dry lamination layer binder resin or knot of carbamates can be enumerated Layer binder resin is closed, can typically be enumerated the polymer blends such as PEPA, PPG and isocyanate compound Resin obtained from combination.

More than, embodiments of the present invention are described, but these are the illustration of the present invention, can also be used above-mentioned Various compositions in addition.

For example, in the cover strip 20 of present embodiment, electronic parts packaging material 10, electronic component packing body, can incite somebody to action Each structure is substituted for the arbitrary structures that can play identical function, or can add arbitrary structures.

In addition, in the above-described embodiment, to electronic parts packaging material possessed carrier band with multiple recesses Situation is illustrated, but is not limited to the situation, and the recess that carrying has can also be 1.

Embodiment

Hereinafter, according to embodiment, more specifically the present invention will be described.

[embodiment 1]

Using as the Elvaloy AC1820 of resin of binding property (ethylene-methyl acrylate copolymer, (methyl) acrylate Base 20%, the manufacture of Du Pont-Mitsui Polychemicals Co., Ltd.s) 60 parts, as cohesiveness adjustment resin Estyrene MS-600 (styrene-(methyl) methyl acrylate copolymer, Nippon Steel Chemical Co., Ltd (Nippon Steel Chemical Co., Ltd.s) manufacture) 20 parts and as antistatic resin Pelestat 212 (PP-PEG block copolymers, three Foreignize into Industrial Co., Ltd (Sanyo Chemical Industries, Ltd.) manufacture) 20 parts entered using double screw extruder Row is kneaded, and obtains the resin combination for forming heat sealing layer.

In PET film (Fang Ji Co., Ltd. of Japan (Toyobo Co., Ltd.s) system of 16 μm of the thickness as substrate layer Make, E5102) on, using as the low density polyethylene (LDPE) in intermediate layer (Sumitomo Chemical Co (Sumitomo Chemical Co, Ltd.) manufacture, Sumikathene L705) utilize the film for extruding laminating at 300 DEG C of extrusion temperature and being fabricated to 20 μm of thickness.

Then, on the intermediate layer of film has been made, further the resin combination of above-mentioned composition heat sealing layer is utilized Extrusion laminating is fabricated to the film of 5 μm of thickness as heat sealing layer at 300 DEG C of extrusion temperature, obtains the cover strip of embodiment 1.

In addition, when by heat sealing layer film forming, using the chill roll for possessing projection of 3.5 μm of surface roughness to flatness layer Surface implement mat surface.

[embodiment 2]

When by heat sealing layer film forming, using the chill roll for possessing projection of 4.5 μm of surface roughness to the table of flatness layer Face implements mat surface, in addition, operates similarly to Example 1, obtains the cover strip of embodiment 2.

[embodiment 3]

When by heat sealing layer film forming, using the chill roll for possessing projection of 5.5 μm of surface roughness to the table of flatness layer Face implements mat surface, in addition, operates similarly to Example 1, obtains the cover strip of embodiment 3.

[comparative example 1]

When by heat sealing layer film forming, using the chill roll for possessing projection of 2.4 μm of surface roughness to the table of flatness layer Face implements mat surface, in addition, operates similarly to Example 1, obtains the cover strip of comparative example 1.

[comparative example 2]

To the cover strip made in comparative example 1, by the acrylic compounds of the silica of 2 μm of the average grain diameter comprising 15wt% Adhesive is coated in the surface of heat sealing layer in a manner of as 1 μm of thickness, in addition, is operated in the same manner as comparative example 1, Obtain the cover strip of comparative example 2.

[comparative example 3]

When by heat sealing layer film forming, using the chill roll for possessing projection of 8.0 μm of surface roughness to the table of flatness layer Face implements mat surface, in addition, operates similarly to Example 1, obtains the cover strip of comparative example 3.

The cover strip of each embodiment and each comparative example is evaluated using following methods.

Using ultra-deep measuring shape microscope (KEYENCE CORPORATION are manufactured, " VK9700 "), according to JIS B 0601, determine the surface roughness Rz and Sm of the cover strip possessed heat sealing layer of each embodiment and each comparative example.

Using spectrophotometer (JASCO Corporation are manufactured, " N-670 "), according to JIS K 7361-1, determine The full light transmittance of each embodiment and the cover strip of each comparative example.

Using spectrophotometer (JASCO Corporation are manufactured, " N-670 "), according to JIS K 7136, determine each The mist degree of embodiment and the cover strip of each comparative example.

First, silicone resin layer is formed on the pedestal of 60mm × 60mm sizes, then, with the silicone resin layer and each reality The overlapping mode of cover strip (26mm × 76mm) possessed heat sealing layer for applying example and each comparative example configures cover strip on pedestal Afterwards, 1kg counterweight is loaded in cover strip, thus engages silicone resin layer with heat sealing layer.

Then, the power separated by assigning silicone resin layer with heat sealing layer, heat sealing layer (cover strip) is made from silicone resin Layer is peeled off, and determines the initial load incrementss (Max values) that now obtain and constant load (counterweight load) afterwards.

Then, viscous force is calculated as bonding strength (adhesive strength), and above-mentioned viscous force is the load incrementss that are obtained The difference of (Max values) and constant load (counterweight load).

In addition, the silicone resin layer formed on pedestal contains polysiloxane, Shore D hardometer measure is utilized Hardness is 60.

The carrier band of polycarbonate resin after being sealed according to JIS C0806-3 measure at 220 DEG C and each embodiment With the peel strength of the cover strip of each comparative example, the low temperature seal to PC (makrolon) have rated according to the peel strength.

That is, in the case where peel strength is more than 20g, qualified (zero) will be evaluated as to PC heat sealability, it is strong peeling off In the case that degree is less than 20g, PC heat sealability will be evaluated as unqualified (×).

Here, peel strength is determined using following methods.

It is 500mm cover strip in heat sealing layer by width 8mm conductive PC (makrolon) and width 5mm and long side direction Face fitting, using 2 row 0.5mm are wide, the sealing flatiron of 54mm length, sealed according to following heat seal conditions.

Heat-sealing temperature：Each heat-sealing temperature

Seal flatiron compressing time：0.020 second/1 time

Seal flatiron compression number：13 times

Seal flatiron pressing load：4.0kgf

Heat seal width：0.5mm × 2 arrange

Utilize the method according to JIS C-0806-3, the peel strength of measure sample as obtained from above-mentioned heat-sealing.Separately Outside, finding speed is set to 300mm/min, calculates mean intensity.

To will be closely sealed with heat sealing layer (hot sealing layer) electronic unit (50) in 65 DEG C of keepings 24 hours and make its rotation 180 ° make it that the stickup of electronic unit when electronic unit is below is evaluated.Here, use Sharp Corporation The GM4ZR83232AE of manufacture is as electronic unit.

In the case where electronic unit survival rate is less than 40%, the stickup of electronic unit is evaluated as qualified (zero), In the case that electronic unit survival rate is more than 40%, the stickup of electronic unit is evaluated as unqualified (×).

The evaluation result for the cover strip for utilizing each embodiment obtained with upper type and each comparative example is shown in following tables 1.

[table 1]

As shown in table 1, the cover strip of each embodiment, the surface roughness Rz of heat sealing layer is more than 1.0 μm, and heat sealing layer Adhesive strength with silicone resin layer is 0.3g/mm²Hereinafter, thereby is achieved at the same meet high-speed sealing and part paste property Result.

And the cover strip of comparative example, the surface roughness Rz and heat sealing layer of heat sealing layer and the adhesive strength of silicone resin layer In either one be unsatisfactory for above-mentioned relation, therefore become and be unsatisfactory for high-speed sealing and part and paste the knot of either one in property Fruit.

[embodiment 4]

First, 25 μm of the thickness as substrate layer Biaxially oriented polyester film (Fang Ji Co., Ltd. of Japan manufacture E5102, hereinafter also referred to " PET film ") face coating conducting polymer (Arakawa Chemical Industries, Ltd. (Arakawa Chemical Industries, Ltd.) manufacture, Aracoat AS-625) and be dried.

Then, on another face of PET film, using laminating is extruded, using as the low density polyethylene (LDPE) in intermediate layer (Sumitomo Chemical Co manufacture, Sumikathene L705) is fabricated to the film of 25 μm of thickness at 300 DEG C of extrusion temperature.

Then, on the intermediate layer of film has been made, using as the styrene-methylmethacrylate copolymer of heat sealing layer (the Estyrene MS-600 of Nippon Steel Chemical Co., Ltd's manufacture) 15 mass %, ethylene-methyl acrylate copolymer (Du The Elvaloy AC 1820 of Pont-Mitsui Polychemicals Co., Ltd.s manufacture, the containing ratio of acryloyl group：20 matter Measure %) 65 mass %, polyethers/polyolefin copolymer (Sanyo Chemical Industries, Ltd. manufacture, Pelestat212, be also referred to as below For " PEG-PO ") 20 mass % mixture is fabricated to the film of 10 μm of thickness at 280 DEG C of extrusion temperature, obtain embodiment 4 Cover strip.

In addition, silicon rubber system is padded into roller (matroll) with pressure 0.2MPa when by heat sealing layer film forming is pressed against surface On the chill roll for possessing projection that 5.5 μm of roughness, the mat surface of heat sealing layer is thus implemented.

[embodiment 5]

When by heat sealing layer film forming, using 6.5 μm of the chill roll for possessing projection of surface roughness, by silicon rubber pad The pressure of roller is set to 0.2MPa and implements mat surface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 5.

[embodiment 6]

When by heat sealing layer film forming, using 4.5 μm of the chill roll for possessing projection of surface roughness, by silicon rubber pad The pressure of roller is set to 0.2MPa and implements mat surface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 6.

[embodiment 7]

When by heat sealing layer film forming, using 5.5 μm of the chill roll for possessing projection of surface roughness, by silicon rubber pad The pressure of roller is set to 0.15MPa and implements mat surface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 7.

[embodiment 8]

When by heat sealing layer film forming, using 4.5 μm of the chill roll for possessing projection of surface roughness, by silicon rubber pad The pressure of roller is set to 0.15MPa and implements mat surface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 8.

[comparative example 4]

When by heat sealing layer film forming, using 2.5 μm of the chill roll for possessing projection of surface roughness, by silicon rubber pad The pressure of roller is set to 0.2MPa and implements mat surface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of comparative example 4.

[comparative example 5]

When by heat sealing layer film forming, using 3.5 μm of the chill roll for possessing projection of surface roughness, by silicon rubber pad The pressure of roller is set to 0.2MPa and implements mat surface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of comparative example 5.

[comparative example 6]

Using ethylene-methyl acrylate copolymer, (Du Pont-Mitsui Polychemicals Co., Ltd.s manufacture Elvaloy AC 1609, the containing ratio of acryloyl group：9 mass %) replace ethylene-methyl acrylate copolymer (Du Pont- The Elvaloy AC 1820 of Mitsui Polychemicals Co., Ltd.s manufacture, the containing ratio of acryloyl group：20 matter Measure %), when by heat sealing layer film forming, using 2.5 μm of the chill roll for possessing projection of surface roughness, silicon rubber system is padded into roller Pressure be set to 0.2MPa mat surface implemented to the surface of heat sealing layer, in addition, operate similarly to Example 4, Obtain the cover strip of comparative example 6.

The cover strip of each embodiment and each comparative example is evaluated using following methods.By each embodiment and each comparative example The evaluation result of cover strip be shown in table 2.

According to JIS K7206, it is determined using following conditions.

White interferometer (the ProductName manufactured using Ryoka Systems Inc.：VertScan (registration mark)), according to According to ISO-25178, it is determined using following conditions.

(condition determination)

Measure is implemented 5 times, using its average value.Measure is implemented in the environment of 23 ± 2 DEG C, 50 ± 6%RH of humidity.

Use A＆D Company, the TENSILON universal testing machine (ProductNames of Limited manufactures：RTF-1250), According to JIS K7125, it is determined using following conditions.Each Specimen Determination 5 times, static friction is used as using its average value Coefficient.

(condition determination)

23 ± 2 DEG C of environment temperature, 50 ± 6%RH of ambient humidity, peeling rate 100mm/min

Here, by load N₁The confficient of static friction on heat sealing layer surface when (50g) is set to μ₅₀, by load N₂When (200g) The confficient of static friction on heat sealing layer surface be set to μ₂₀₀, calculate by (μ₅₀-μ₂₀₀)/(N₂-N₁The static friction that) × 1000 represent The variable quantity of coefficient.

Employ and the assay method identical assay method in above-described embodiment 1~3 and comparative example 1~3.

By the cover strip obtained be cut into 5.5mm it is wide after, by electronic unit (Sharp Corporation manufacture GM4ZR83232AE the carrier band (NIPPOCORPORATION manufactures) of the wide makrolon of 8mm) is inserted, in heat-sealing temperature 180 Cover strip is subjected to heat-sealing at DEG C and is prepared for sample.

Obtained sample is stood in a manner of part contacts with cover strip face, applies the heat treatment of 24 hours at 70 DEG C Afterwards, cover strip is peeled off with 300mm/min speed, to the number for the electronic unit being pasted onto in electronic unit 100 in cover strip Counted.

In the case where the chip being pasted onto in cover strip is less than 2, the stickup of the electronic unit after baking is evaluated as Zero, in the case where the chip being pasted onto in cover strip is more than 2, the stickup of the electronic unit after baking is evaluated as ×.

By the cover strip obtained be cut into 5.5mm it is wide after, electronic unit (QFP64T40-3.9) is inserted into the wide poly- carbon of 8mm The carrier band (NIPPO CORPORATION manufactures) of acid esters, cover strip is subjected to heat-sealing in 180 DEG C of heat-sealing temperature and is prepared for sample. 1cm is vertically above carried from electronic component surface, the word of printing on electronic components is confirmed by visual observation, by the wheel of word It is wide not fuzzy and what can be read is evaluated as ◎, although by literary glyph it is fuzzy can read be evaluated as zero, by word Profile can not read be evaluated as ×.

As shown in table 2, the cover strip of each embodiment, heat sealability and the performance of the low tack to electronic unit to carrier band are put down Weigh excellent.And the cover strip of each comparative example, the heat sealability and the performance balance of the low tack to electronic unit to carrier band are poor.

Symbol description

1 carrier band

10 electronic parts packaging materials

11 sprocket holes

12 recesses

13 the 2nd faces

15 the 1st faces

20 cover strips

21 substrate layers

22 heat sealing layers

40 electronic units

200 cover strips

500 carrier bands

512 recesses

1000 electronic parts packaging materials

Claims

1. a kind of electronic parts cover strip, it is used for electronic component packing body, and the electronic component packing body possesses：Carry Band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in the recess；And lid Band, the cover strip is by the way that the carrier band sealing is covered the recess for being accommodated with the electronic unit, the electronic unit Taping packaging cover is characterised by：

Have：Substrate layer；And heat sealing layer, the heat sealing layer are stacked on a face of the substrate layer, and it is sealed in described Carrier band,

The heat sealing layer is more than 1.0 μm according to surface roughness Rz as defined in JIS B 0601, and the heat sealing layer It is 0.3g/mm with the adhesive strength using polysiloxane as the resin bed of principal component²Below.

2. electronic parts cover strip according to claim 1, it is characterised in that：

It is more than 80% according to full light transmittance as defined in JIS K 7361-1.

3. electronic parts cover strip according to claim 1 or 2, it is characterised in that：

The heat sealing layer contains ethene copolymer as main material.

4. electronic parts cover strip according to claim 1 or 2, it is characterised in that：

The thickness of the heat sealing layer is more than 1 μm and less than 15 μm.

5. electronic parts cover strip according to claim 1 or 2, it is characterised in that：

The thickness of the substrate layer is more than 7 μm and less than 30 μm.

6. electronic parts cover strip according to claim 1 or 2, it is characterised in that：

The heat sealing layer possesses sealing to containing makrolon as the carrier band of main material.

7. a kind of electronic parts cover strip, it is used for electronic component packing body, and the electronic component packing body possesses：Carry Band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in the recess；And lid Band, the cover strip is by the way that the carrier band sealing is covered the recess for being accommodated with the electronic unit, the electronic unit Taping packaging cover is characterised by：

Possess：Substrate layer；And heat sealing layer, the heat sealing layer is stacked on a face of the substrate layer, and includes cohesive tree Fat,

In the load N that will be determined according to JIS K7125₁When the confficient of static friction on the heat sealing layer surface be set to μ₅₀, will be according to The load N determined according to JIS K7125₂When the confficient of static friction on the heat sealing layer surface be set to μ₂₀₀When,

By (μ₅₀-μ₂₀₀)/(N₂-N₁The variable quantity for the confficient of static friction that) × 1000 represent is less than 3.0, wherein, N₁For 50g, N₂ For 200g,

The Vicat softening point of the foundation JIS K7206 measure of the resin of binding property in the heat sealing layer for more than 30 DEG C and Less than 70 DEG C.

8. electronic parts cover strip according to claim 7, it is characterised in that：

Arithmetic average height Sa according to the heat sealing layer surface of ISO-25178 measure is less than more than 0.4 μm 0.7 μm.

9. the electronic parts cover strip according to claim 7 or 8, it is characterised in that：

The heat sealing layer includes the resin of binding property containing (methyl) acryloyl group.

10. electronic parts cover strip according to claim 9, it is characterised in that：

The containing ratio of (methyl) acryloyl group of the resin of binding property containing (methyl) acryloyl group is more than 10 mass % Below 40 mass %.

11. electronic parts cover strip according to claim 9, it is characterised in that：

The resin of binding property containing (methyl) acryloyl group is ethene copolymer.

12. electronic parts cover strip according to claim 9, it is characterised in that：

The heat sealing layer is also containing cohesiveness adjustment resin.

13. the electronic parts cover strip according to claim 7 or 8, it is characterised in that：

Full light transmittance according to JIS K7361-1 measure is more than 80%.

14. the electronic parts cover strip according to claim 7 or 8, it is characterised in that：

The thickness of the heat sealing layer is less than more than 1 μm 15 μm.

15. the electronic parts cover strip according to claim 7 or 8, it is characterised in that：

The thickness of the substrate layer is less than more than 7 μm 50 μm.

16. the electronic parts cover strip according to claim 7 or 8, it is characterised in that：

The carrier band comprising the material more than one or both of makrolon and polystyrene by forming.

17. the electronic parts cover strip according to claim 7 or 8, it is characterised in that：

Seal used in the electronic unit is silicone seal.

18. according to the electronic parts cover strip any one of claim 1,2,7 and 8, it is characterised in that：

The electronic unit is light emitting diode.

19. a kind of electronic parts packaging material, it is characterised in that possess：

Electronic parts cover strip any one of claim 1 to 18；With

Carrier band, the carrier band have in a face can housing electronic part recess, and the recess is by the electronic component packing Covered with cover strip.

20. a kind of electronic component packing body, it is characterised in that possess：

The electronic unit being incorporated in the recess；With

Electronic parts cover strip any one of claim 1 to 18, the electronic parts cover strip by One surface side covers the recess for being accommodated with the electronic unit carrier band sealing.