CN111757663B - Vibration-damping bulk material mounting tool of chip mounter and application thereof - Google Patents
Vibration-damping bulk material mounting tool of chip mounter and application thereof Download PDFInfo
- Publication number
- CN111757663B CN111757663B CN202010604860.1A CN202010604860A CN111757663B CN 111757663 B CN111757663 B CN 111757663B CN 202010604860 A CN202010604860 A CN 202010604860A CN 111757663 B CN111757663 B CN 111757663B
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- Prior art keywords
- chip mounter
- die
- vibration
- bulk
- damping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Abstract
A chip mounter damping bulk material mounting tool and application thereof are provided, wherein the mounting tool comprises a bulk material die arranged on a damping die, and the damping die is directly contacted with a chip mounter platform bin and can buffer the pressure of a chip mounter suction nozzle when the chip mounter suction nozzle picks up materials; the vibration reduction mould is provided with a plurality of material positions for placing the surface mounting components in bulk, the length, the width and the height of the material positions are determined according to the packaging size of the surface mounting components, and the material positions limit the surface mounting components placed in the vibration reduction mould; and the surface of the bulk material die is also provided with a positioning datum point for realizing the quick positioning of the chip mounter. The mounting tool can be applied to the automatic picking and mounting process of surface mounting components of different packaging types such as resistance-capacitance components, SOPs, QFPs, QFNs and the like. The invention can realize vibration prevention and automatic mounting of bulk components and avoids that the pressure does not meet the process requirements when neglected loading, wrong loading and materials are picked up.
Description
Technical Field
The invention belongs to the field of surface mounting, and particularly relates to a vibration-damping bulk material mounting tool of a chip mounter and application thereof.
Background
With the development of electronic products toward miniaturization, densification, high automation, and high precision, surface mount devices having the characteristics of lightness, thinness, smallness, high reliability, ease of mass production, and the like are used in large quantities. The production mode of electronic products has the characteristics of multiple varieties and small batch, and materials related to the production mode are various in types and commonly exist in bulk materials.
At present, the common treatment method for bulk materials is as follows:
the method comprises the following steps: the existing bulk material elements such as surface-mounted resistors, capacitors and the like cannot be directly mounted by a chip mounter and are manually mounted and checked one by one. The method has low production efficiency and is easy to have quality problems of wrong assembly, neglected assembly and the like.
The second method comprises the following steps: and (5) mounting by using a chip mounter through a special bulk material tray of the chip mounter. The material tray used in the method is specially matched with each brand of chip mounter and is not compatible with each brand of chip mounter in series. In addition, the charging tray can shift because of equipment working vibration in the use process, so that the problems of error in the accuracy of the paster and the like exist.
Therefore, in order to improve the production efficiency and solve the problems of vibration offset, a new process is required to be provided to realize vibration prevention and automatic mounting of the bulk components.
Disclosure of Invention
The invention aims to solve the problems that the surface mounting component bulk material mounting efficiency is low and the precision cannot be ensured in the prior art, and provides a vibration-proof and automatic mounting tool for a chip mounter and application thereof.
In order to achieve the purpose, the invention has the following technical scheme:
a vibration-damping bulk material mounting tool for a chip mounter comprises a bulk material die arranged on a vibration-damping die, wherein the vibration-damping die is directly contacted with a storage bin of a chip mounter platform and can buffer the pressure of a suction nozzle of the chip mounter when the suction nozzle picks up materials; the vibration reduction mould is provided with a plurality of material positions for placing the surface mounting components in bulk, the length, the width and the height of the material positions are determined according to the packaging size of the surface mounting components, and the material positions limit the surface mounting components placed in the vibration reduction mould; and the surface of the bulk material die is also provided with a positioning datum point for realizing the quick positioning of the chip mounter.
As a preferred scheme of the invention, the vibration reduction die is made of a vibration reduction damping film, and the bulk material die is tightly combined on the vibration reduction damping film.
As a preferred scheme of the invention, the bulk material die is made of an antistatic material, and the antistatic material comprises an epoxy glass cloth plate, an artificial stone and graphite.
As a preferable scheme of the invention, the material positions are arranged in an array shape, and the types of elements with different specifications are distinguished in the same material tray.
In a preferred embodiment of the present invention, the positioning reference point is provided at the vertex of the arrangement region composed of all the stock levels.
As a preferable aspect of the present invention, the positioning reference point is a metal point that can be recognized by a camera provided on the chip mounter, and the metal point has a shape.
The vibration-damping bulk material mounting tool for the chip mounter can be applied to the automatic picking and mounting process of surface-mounted components of different packaging types such as resistance-capacitance elements, SOPs, QFPs and QFNs.
Compared with the prior art, the invention has the following beneficial effects: aiming at the surface mounting of components in bulk, the invention changes the mounting mode from the traditional manual mode to the automatic machine mode, thereby improving the equipment utilization rate and the production efficiency and reducing the labor cost. The vibration-damping bulk material mounting tool solves the problem that the mounting precision has errors due to the deviation of the material tray caused by the working vibration of equipment in the mounting process, and improves the product quality. Meanwhile, the invention is suitable for automatic picking and mounting of surface mounting components of different packaging types, can be used for chip mounters of different brands and has stronger universality.
Furthermore, the array arrangement of the material levels can more conveniently and quickly position and confirm the number of elements when the chip mounter loads materials, one material level and one element are convenient for counting the number of rows and the number of columns, so that the convenience and quickness are realized, and the types and the number of the elements are more visually distinguished when the chip mounter inputs the information of the elements in the material scattering disc.
Furthermore, the positioning reference points are arranged at the top points of the arrangement area formed by all material levels, the positions are confirmed through the camera of the chip mounter, and the camera of the chip mounter is positioned according to the positions to obtain the specific positions of the bulk material dies on the storage bin of the chip mounter platform.
Drawings
FIG. 1 is a side view of the vibration reducing bulk placement tool of the present invention;
FIG. 2 is a front view of the vibration reducing bulk placement tool of the present invention;
FIG. 3 is a top view of the vibration reducing bulk placement tool of the present invention;
in the drawings: 1-damping mould; 2-bulk material mould; 3-locating a reference point; 4-material level.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The invention provides a vibration-damping bulk material mounting tool for a chip mounter, and aims to realize vibration-damping and automatic mounting of bulk components on the basis of being compatible with a platform bin of the chip mounter aiming at surface mounting components of different packaging types.
Referring to fig. 1-3, the vibration-damping bulk material mounting tool for the chip mounter comprises a bulk material die 2 arranged on a vibration-damping die 1, wherein the vibration-damping die 1 is directly contacted with a storage bin of a chip mounter platform and can buffer the pressure of a suction nozzle of the chip mounter when the suction nozzle picks up materials. The vibration damping die 1 is made of a vibration damping film, and the bulk material die 2 is tightly combined on the vibration damping film. The bulk material die 2 is made of antistatic materials, and the antistatic materials can be epoxy glass cloth plates, artificial stones, graphite and the like. Through damping mould 1 and bulk cargo mould 2 combined action, can prevent to shake out the material level with the material when chip mounter suction nozzle picks up the material.
The vibration reduction die 1 is provided with a plurality of material levels 4 for placing surface mounting components in bulk, the material levels 4 are arranged in an array mode, the length and the width of the material levels 4 are determined according to the packaging size of the surface mounting components, the material levels 4 are of groove structures, the surface mounting components placed in the material levels are limited, the mounting deviation caused by component displacement in the moving mounting process of a platform of a chip mounter is prevented, and the types of components with different specifications in the same material tray can be distinguished through the material levels 4.
The surface of the bulk material die 2 is also provided with a positioning reference point 3 for realizing the quick positioning of the chip mounter. The three positioning reference points 3 are arranged at the top points of the arrangement area formed by all the material positions, the three positioning reference points 3 are arranged at the lower left corner, the lower right corner and the upper left corner of the material tray respectively, and the size of the bulk material die 2 is confirmed through three-point positioning. The positioning reference points 3 are metal points which can be identified by a camera arranged on the chip mounter, and the metal points have shapes such as circles, diamonds, squares and the like.
The vibration-damping bulk material mounting tool for the chip mounter can be applied to the automatic picking and mounting process of surface mounting components of different packaging types such as resistance-capacitance elements, SOPs, QFPs and QFNs, and can be used for chip mounters of different brands.
In the traditional mounting process, a chip mounter cannot realize automatic mounting, and when the chip mounter mounts, a mounting head has a downward pressure on a suction element, so that a bulk device for placing the element is stressed, the element is easy to vibrate out of the bulk device or overturn, and automatic mounting cannot be carried out. The vibration reduction die can absorb the pressure of the component to decompose the force by the chip mounter, cannot cause vibration, accurately positions the surface mounting components in bulk, and can realize automatic surface mounting. In addition, the mounting tool has good compatibility, can meet platform bins of various types of chip mounters, enables bulk elements to be mounted by the chip mounters, prevents the problems of missing mounting, wrong mounting, lower pressure not meeting the process requirements and the like of the bulk during manual mounting, ensures the correctness of mounted products, improves the mounting efficiency and meets the process requirements, thereby realizing high-quality automatic mounting and having good application prospect.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical solution of the present invention, and it should be understood by those skilled in the art that the technical solution can be modified and replaced by a plurality of simple modifications and replacements without departing from the spirit and principle of the present invention, and the modifications and replacements also belong to the protection scope covered by the claims.
Claims (2)
1. A vibration-damping bulk material mounting tool for a chip mounter is characterized by comprising a bulk material die (2) arranged on a vibration-damping die (1), wherein the vibration-damping die (1) is directly contacted with a storage bin of a chip mounter platform and can buffer the pressure of a suction nozzle of the chip mounter when materials are picked up; the vibration reduction die (1) is provided with a plurality of material positions (4) for placing surface mounting components in bulk, the length, the width and the height of the material positions (4) are determined according to the packaging size of the surface mounting components, and the material positions (4) limit the surface mounting components placed in the vibration reduction die; the surface of the bulk material die (2) is also provided with a positioning reference point (3) for realizing the rapid positioning of the chip mounter; the vibration reduction die (1) is made of a vibration reduction damping film, and the bulk material die (2) is tightly combined on the vibration reduction damping film; the material positions (4) are arranged in an array shape, and the types of elements with different specifications are distinguished in the same material tray; the positioning reference point (3) is a metal point which can be identified by a camera arranged on the chip mounter, and the metal point has a shape; the bulk material die (2) is made of an antistatic material, and the antistatic material comprises an epoxy glass cloth plate, an artificial stone and graphite; the positioning datum mark (3) is arranged at the vertex of an arrangement area formed by all material positions.
2. The vibration-damping bulk mounting tool for a chip mounter according to claim 1, wherein the vibration-damping bulk mounting tool is applied to an automatic pick-up and mounting process of surface mount components of different packaging types of resistive-capacitive elements, SOP, QFP and QFN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604860.1A CN111757663B (en) | 2020-06-29 | 2020-06-29 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604860.1A CN111757663B (en) | 2020-06-29 | 2020-06-29 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111757663A CN111757663A (en) | 2020-10-09 |
| CN111757663B true CN111757663B (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010604860.1A Active CN111757663B (en) | 2020-06-29 | 2020-06-29 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
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| CN111757663A (en) | 2020-10-09 |
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