CN102325428A - Surface mounted technology (SMT) feeder, element feed stabilization device for SMT feeder, and chip mounter - Google Patents
Surface mounted technology (SMT) feeder, element feed stabilization device for SMT feeder, and chip mounter Download PDFInfo
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- CN102325428A CN102325428A CN201110205962A CN201110205962A CN102325428A CN 102325428 A CN102325428 A CN 102325428A CN 201110205962 A CN201110205962 A CN 201110205962A CN 201110205962 A CN201110205962 A CN 201110205962A CN 102325428 A CN102325428 A CN 102325428A
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- smt
- feeder
- chip mounter
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- stabilization device
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Abstract
The invention discloses a surface mounted technology (SMT) feeder, an element feed stabilization device for the SMT feeder, and a chip mounter. The element feed stabilization device for the SMT feeder comprises a feed chute for conveying an encapsulation element and at least one magnetic element, wherein the encapsulation element is fed along the extending direction of the feed chute; the magnetic element is fixed below the feed chute; the chip mounter comprises a check block, a suction nozzle and the SMT feeder; and the magnetic element is positioned below the check block. The element feed stabilization device for the SMT feeder makes full use of the Lenz law; and due to the magnetic element, an encapsulation element to be mounted is absorbed by a magnetic field at the moment that a carrying band and a covering band are separated from each other and before the encapsulation element to be mounted is sucked by the suction nozzle, so the problems of low material throwing property and low absorption caused by static electricity and vibration of the element to be mounted and irregular material bands can be solved. The chip mounter can be used for mounting a chip stably and has the advantage of higher chip mounting efficiency.
Description
Technical field
The present invention relates to the SMT mounting device, particularly relate to a kind of SMT feeder element feeding stabilizing arrangement, SMT loader and chip mounter.
Background technology
(Surface Mounted Technology: surface mounting technology) in the large-scale production, the encapsulation of components and parts is more and more littler, and quality is more and more lighter, and paster speed is more and more faster, the high speed placement system extensive use at the SMT of reality.
As shown in Figure 1, potted element has comprised the carrier band 11 that has location notch 111, and this location notch 111 is used for placing treats mount components 2.Above carrier band 11, be coated with the lid that one deck is used to seal location notch 111 and be with 12.When treating mount components 2, absorption need the tear initiation lid to be with 12.
With reference to figure 1, the placement equipment of prior art has comprised a suction nozzle 5 again; One is used for the lid band tearing mechanism 6 of tear-off cap band 12 and is used to locate carrier band 11 and the block 7 of lid with 12 separation point positions.Carrier band 11 and lid are with 12 between moving to below the suction nozzle 5, to be torn, and expose and treat mount components 2 and continue motion, and after treating that mount components 2 moves to suction nozzle 5 belows, suction nozzle 5 will treat that mount components 2 picks up and mount operation.That is to say; Treat before mount components no show suction nozzle 5 belows; The carrier band that encapsulates it is torn off with the lid band; Because the carrier band of existing potted element can produce static and vibration with the material that the lid band adopts in the moment that tearing separates, can cause the upset of treating mount components unavoidably or fly out this moment.When this treats that mount components further moves to the suction nozzle below, can't be picked up exactly, cause the follow-up mistake that mounts.
And in the high speed feed; The consistency of potted element exists inconsistent; Loader produces very big vibration and cause also treating that mount components flies out and overturns from the location notch of carrier band; Cause very high material casting rate, drawing is not in good state then can cause the problem that bad generation and maintenance are done over again and the production quality descends.
Summary of the invention
The technical problem that the present invention will solve is to treat that mount components sealing off, being subject to electrostatic influence in the suction process and the defective of material casting and upset takes place, provides a kind of SMT feeder element feeding stabilizing arrangement, SMT loader and chip mounter in order to overcome in the prior art in the potted element.
The present invention solves above-mentioned technical problem through following technical proposals:
A kind of SMT feeder element feeding stabilizing arrangement, its characteristics are that it comprises: one is used to transmit the feed well of potted element, and said potted element is along the bearing of trend charging of said feed well; Said potted element feeding stabilizing arrangement also comprises at least one magnetic element, and said magnetic element is fixed in the below of said feed well.
Wherein, the magnetic induction line of said magnetic element generation is vertical with the bearing of trend of said feed well.
Wherein, said magnetic element is permanent magnet or electromagnet.
The present invention also provides a kind of SMT loader, and its characteristics are that it comprises described SMT feeder element feeding stabilizing arrangement, and said SMT feeder element feeding stabilizing arrangement is fixed on the said SMT loader.
The present invention also provides a kind of chip mounter, and it comprises a block, and a suction nozzle, and its characteristics are that this chip mounter also comprises described SMT loader, and said magnetic element is positioned at the below of said block.
Among the present invention, but above-mentioned optimum condition combination in any on the basis that meets this area general knowledge promptly gets each preferred embodiments of the present invention.
Positive progressive effect of the present invention is: SMT feeder element feeding stabilizing arrangement of the present invention has made full use of Lenz's law; Make the interior mount components of treating of encapsulation be with the moment of separating before being drawn, all to receive magnetic field absorption through magnetic element, thereby avoided treating mount components generation static, vibration, strip material casting, the bad problem of absorption of causing lack of standardization by said suction nozzle at carrier band and lid.And, along with potted element gradually away from magnetic element, its suction that receives magnetic element diminishes gradually, from and be convenient to suction nozzle the mount components of treating wherein drawn.It is more stable smooth that paster of the present invention transmits and draw the process of treating mount components, and paster efficient is better.
Description of drawings
Fig. 1 is the structural representation of the chip mounter in the preferred embodiment of the present invention.
Fig. 2 is the vertical view of feeder channel among Fig. 1.
Fig. 3 is the fundamental diagram of SMT feeder element feeding stabilizing arrangement of the present invention.
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to specify technical scheme of the present invention.
Shown in Fig. 1~3; What placement equipment of the present invention was identical with prior art is; All comprise one and be used to draw the suction nozzle 5 of treating mount components; One is used for the lid band tearing mechanism 6 of tear-off cap band 12, and one be used to locate carrier band 11 and the block 7 of lid with 12 separation point positions, repeats no more for the remainder of placement equipment.
Different with prior art is, below the suction nozzle 5 of chip mounter, has fixed SMT feeder element feeding stabilizing arrangement.The top of SMT feeder element feeding stabilizing arrangement 3 is provided with a feed well 31, and potted element carries out charging along the bearing of trend of feed well 31.This potted element feeding stabilizing arrangement 3 is fixed in the below of suction nozzle 5.Block 7 is pressed in lid and is with on 12.Block 7 is carrier band 11 and covers the position of separating with 12 towards the position at the place, edge of suction nozzle 5 one sides.Among Fig. 1 and 2, the potted element along continuous straight runs carries out charging.Potted element is along vertical paper direction feeding among Fig. 3.
Below feed well 31, be fixed with a permanent magnet 4.Because the moment electrostatic force in that place, said separation point position produces is maximum, so permanent magnet 4 is positioned at the below of above-mentioned separation point position.The magnetic induction line that permanent magnet 4 is produced and the feedstock direction of potted element are perpendicular.That is, the magnetic field line that produced of permanent magnet 4 is perpendicular to paper., just magnetic induction line is cut potted element when moving in magnetic field.According to Lenz's law, the magnetic field that magnet produces can hinder the change in location of conductor.Thereby, reach and overcome the irregular and material casting that causes of static, vibration, strip that the SMT loader exists and draw bad problem.
Except the described permanent magnet of present embodiment, those skilled in the art also can adopt electromagnet to substitute.Can repeat no more at this with reference to the foregoing description in its installation site.In addition, electromagnet is a prior art also, also repeats no more at this.
According to Lenz's law: faradic direction always makes the magnetic field that it excited hinder the variation that causes faradic magnetic flux in the closed-loop path.Therefore; Moment static absorption affinity and vibration to treat the influence of mount components 2 big more; Then to treat the absorption affinity of mount components 2 big more for permanent magnet; Overcome static, vibration, strip material casting, the bad problem of absorption of causing lack of standardization that the SMT loader exists effectively, guarantee that the follow-up of potted element is stablized smooth and easy.
Though more than described embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is limited appended claims.Those skilled in the art can make numerous variations or modification to these execution modes under the prerequisite that does not deviate from principle of the present invention and essence, but these changes and modification all fall into protection scope of the present invention.
Claims (5)
1. SMT feeder element feeding stabilizing arrangement, it is characterized in that it comprises: one is used to transmit the feed well of potted element, and said potted element is along the bearing of trend charging of said feed well; Said potted element feeding stabilizing arrangement also comprises at least one magnetic element, and said magnetic element is fixed in the below of said feed well.
2. SMT feeder element feeding stabilizing arrangement as claimed in claim 1 is characterized in that, the magnetic induction line that said magnetic element produces is vertical with the bearing of trend of said feed well.
3. SMT feeder element feeding stabilizing arrangement as claimed in claim 2 is characterized in that said magnetic element is permanent magnet or electromagnet.
4. a SMT loader is characterized in that, it comprises each described SMT feeder element feeding stabilizing arrangement among the claim 1-3, and said SMT feeder element feeding stabilizing arrangement is fixed on the said SMT loader.
5. chip mounter, it comprises a block and a suction nozzle, it is characterized in that, and this chip mounter also comprises the described SMT loader of claim 4, and said magnetic element is positioned at the below of said block.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110205962A CN102325428A (en) | 2011-07-21 | 2011-07-21 | Surface mounted technology (SMT) feeder, element feed stabilization device for SMT feeder, and chip mounter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110205962A CN102325428A (en) | 2011-07-21 | 2011-07-21 | Surface mounted technology (SMT) feeder, element feed stabilization device for SMT feeder, and chip mounter |
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CN102325428A true CN102325428A (en) | 2012-01-18 |
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CN201110205962A Pending CN102325428A (en) | 2011-07-21 | 2011-07-21 | Surface mounted technology (SMT) feeder, element feed stabilization device for SMT feeder, and chip mounter |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104192497A (en) * | 2014-08-27 | 2014-12-10 | 昆山元崧电子科技有限公司 | Feeder capable of stably feeding materials |
CN104925505A (en) * | 2015-06-10 | 2015-09-23 | 苏州米达思精密电子有限公司 | Reinforcing panel automatically feeding and positioning method |
CN111386756A (en) * | 2017-12-26 | 2020-07-07 | 株式会社富士 | Belt feeder |
CN111757663A (en) * | 2020-06-29 | 2020-10-09 | 西安微电子技术研究所 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090071996A1 (en) * | 2005-07-13 | 2009-03-19 | Atsuyuki Horie | Tape feeder |
-
2011
- 2011-07-21 CN CN201110205962A patent/CN102325428A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090071996A1 (en) * | 2005-07-13 | 2009-03-19 | Atsuyuki Horie | Tape feeder |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104192497A (en) * | 2014-08-27 | 2014-12-10 | 昆山元崧电子科技有限公司 | Feeder capable of stably feeding materials |
CN104925505A (en) * | 2015-06-10 | 2015-09-23 | 苏州米达思精密电子有限公司 | Reinforcing panel automatically feeding and positioning method |
CN111386756A (en) * | 2017-12-26 | 2020-07-07 | 株式会社富士 | Belt feeder |
CN111386756B (en) * | 2017-12-26 | 2021-09-03 | 株式会社富士 | Belt feeder |
CN111757663A (en) * | 2020-06-29 | 2020-10-09 | 西安微电子技术研究所 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
CN111757663B (en) * | 2020-06-29 | 2022-03-08 | 西安微电子技术研究所 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
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Application publication date: 20120118 |