CN207631792U - A kind of novel carrier band - Google Patents
A kind of novel carrier band Download PDFInfo
- Publication number
- CN207631792U CN207631792U CN201721638811.XU CN201721638811U CN207631792U CN 207631792 U CN207631792 U CN 207631792U CN 201721638811 U CN201721638811 U CN 201721638811U CN 207631792 U CN207631792 U CN 207631792U
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- China
- Prior art keywords
- carrier band
- buffer layer
- groove
- body construction
- location hole
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Abstract
The utility model is related to field of electronic devices, more particularly to novel carrier band.The novel carrier band includes at least carrier band body construction, the carrier band body construction is laterally extended, the width of the carrier band body construction is 12mm, the upper end of the carrier band body construction is provided with several location holes, and the location hole is equidistantly arranged in a row along carrier band length direction；Several receiving portions are additionally provided with below the location hole；The receiving portion is equidistantly arranged in a row along carrier band length direction；The receiving portion is the groove for carrying housing electronic component；The groove includes groove side and groove floor；The carrier band body construction is three-decker, and the three-decker includes from top to bottom PS conductive layers, PC hyaline layers and PS conductive layers successively.
Description
Technical field
The utility model is related to field of electronic devices, more particularly to a kind of novel carrier band.
Background technology
Carrier band is the continuous strip belt container that a kind of electronic industry field is used for containing Small electronic component, is utilized mostly
PS, PC or other plastic materials, for being packed to electronic component, such as LED, capacitance, inductance, resistance etc. pass through carrier band
Electrostatic can be prevented by carrying out the packaging of batch, protect electronic component, realize the high speed SMT Surface Mounts welding of patch electronics element.
The bag portion of carrier band is usually designed to the essentially identical shapes and sizes of the electronic device that has with will carry.Work as load
When the electronic device sent is, for example, the electronic component of rectangle, the electronic component will produce during carry vibration etc. or
It is jumped in bag portion due to vibration.Electronic component has weaker intensity because of thinner thickness, therefore vibration etc. very may be used
The electronic component can be damaged, especially four corner parts of the electronic component are damaged.
Therefore, it is highly desirable to design a novel carrier band, the hair of the bounce and damage of electronic component can be prevented
It is raw.
Utility model content
The utility model provides a kind of novel carrier band, and the novel carrier band includes at least carrier band body construction, the load
Band body structure is laterally extended, the width of the carrier band body construction is 12mm, and the upper end of the carrier band body construction is provided with
Several location holes, the location hole are equidistantly arranged in a row along carrier band length direction；If being additionally provided with below the location hole
Dry receiving portion；The receiving portion is equidistantly arranged in a row along carrier band length direction；The receiving portion is for carrying housing electronic
The groove of component；The groove includes groove side and groove floor；The carrier band body construction be three-decker, described three
Layer structure includes from top to bottom PS conductive layers, PC hyaline layers and PS conductive layers successively.
As a kind of perferred technical scheme, the angle between the groove side and groove floor is 90 °~160 °；Institute
It includes bottom surface PC layers, first buffer layer successively to state groove floor from the bottom to top；The groove side includes side successively from outside to inside
Face PC layers, second buffer layer；Several arc-shaped bulge-structures are additionally provided on the outer surface of the second buffer layer；The groove
Venthole is additionally provided on bottom surface, the venthole is located at the center of groove floor.
As a kind of perferred technical scheme, the distance between described location hole is 4mm.
As a kind of perferred technical scheme, the distance between described venthole is 4mm.
As a kind of perferred technical scheme, the fore-and-aft distance between the center of circle of the venthole and the center of circle of location hole is
5.5mm。
As a kind of perferred technical scheme, the lateral distance between the center of circle of the venthole and the center of circle of location hole is
2mm。
As a kind of perferred technical scheme, the angle between the groove side and groove floor is 100 °~150 °.
As a kind of perferred technical scheme, the upper surface of the first buffer layer is additionally provided with fixed bed.
As a kind of perferred technical scheme, the thickness of the first buffer layer is 0.5~2mm；The first buffer layer
Material be TPU elastomers, TPE elastomer, any one in TPV elastomers.
As a kind of perferred technical scheme, the thickness of the second buffer layer is 0.3~1.5mm；Second buffering
The material of layer is any one in TPU elastomers, TPE elastomer, TPV elastomers.
As a kind of perferred technical scheme, the quantity of the arc-shaped bulge-structure is 1~20.
The beneficial effects of the utility model：The novel carrier band of the utility model, the novel carrier band include at least carrier band originally
Body structure, the carrier band body construction are laterally extended, the width of the carrier band body construction is 12mm, certain the utility model
Width is not limited to 12mm, can be formulated to the carrier band product of different in width and different length according to actual needs.This practicality
One of novel design is, the bottom surface and side of groove structure are both provided with buffer layer, and the setting of buffer layer can in the application
With the damage phenomenon of jolting for effectively preventing electronic component from being brought due to the effect of external force, it is effectively protected electronics member device
Part product.The two of the design of the utility model are, several arc-shaped protrusion knots are additionally provided on the outer surface of second buffer layer
Structure, the setting of bulge-structure can prevent the bounce of electronic component, since cover strip is during tearing, due to tear edge
Difference, it is possible that the phenomenon that product is beated, the bulge-structure of the design can effectively prevent the generation of jumping phenomena.This
The three of the design of utility model are that traditional carrier band is one layer of structure, which is three-decker, and first layer PS is conductive
Layer, the second layer is PC hyaline layers, and third layer is PS conductive layers；Simple PC layers are non-conductive；Simple PS layer toughness is bad, stretches
Dynamics is inadequate；In conjunction with back pull raising, cost reduction, toughness improve.Thus, provide the beneficial effects of the utility model.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of novel carrier band；
Fig. 2 is the structural schematic diagram of groove vertical section；
Symbol description：
1- location holes；2- carries body construction；The receiving portions 3-；4- ventholes；5- second buffer layers；PC layers of the sides 6-；7-
Bulge-structure；PC layers of the bottom surfaces 8-；9- first buffer layers；The distance between a- location holes；The distance between b- ventholes；C- outlets
Lateral distance between the center of circle in hole and the center of circle of location hole；Between the center of circle of d- ventholes and the center of circle of location hole it is longitudinal away from
From.
Specific implementation mode
Participate in the election of following the utility model preferred implementation method detailed description and including embodiment can be more easily understood
The content of the utility model.Unless otherwise defined, all technologies used herein and scientific terminology has and the utility model
The normally understood identical meaning of one skilled in the art.When there is a conflict, the definition in this specification shall prevail.
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein (including technology art
Language and scientific terminology) there is meaning identical with the general understanding of the those of ordinary skill in the utility model fields.Also
It should be understood that those terms such as defined in the general dictionary should be understood that with in the context of the prior art
The consistent meaning of meaning, and unless defined as here, will not be explained with the meaning of idealization or too formal.
The meaning of "and/or" described in the utility model refers to the case where respective individualism or both exists simultaneously
In being included in.
The meaning of " inside and outside " described in the utility model is referred to relative to equipment itself, inside sensing equipment
Direction be it is interior, otherwise is outer, rather than the equipment mechanism to the utility model specific restriction.
When the meaning of " left and right " described in the utility model refers to reader's face attached drawing, the left side of reader is
For a left side, the right of reader is the right side, rather than the equipment mechanism to the utility model specific restriction.
The meaning of " connection " described in the utility model can be directly connected to can also be between component between component
Pass through being indirectly connected with for other components.
Embodiment 1：
As shown in Figure 1 and Figure 2, the embodiments of the present invention 1 provide a kind of novel carrier band, and the novel carrier band is at least
It is laterally extended including carrier band body construction 1, the carrier band body construction 1, the width of the carrier band body construction 1 is 12mm, institute
The upper end for stating carrier band body construction 1 is provided with location hole 1, and the carrier band body construction 1 is three-decker, the three-decker by
Include PS conductive layers, PC hyaline layers and PS conductive layers successively under；The location hole 1 is equidistantly arranged along carrier band length direction
It is in a row；The distance between location hole a is 4mm；Receiving portion 3 is additionally provided with below the location hole；The receiving portion 3
It is equidistantly arranged in a row along carrier band length direction；The receiving portion 3 is the groove for carrying housing electronic component；It is described recessed
Slot includes groove side and groove floor；Angle between the groove side and groove floor is 90 °；The groove floor by
Under it is supreme successively include bottom surface PC layers 8, first buffer layer 9；The thickness of the first buffer layer 9 is 0.5mm；First buffering
The material of layer is TPU elastomers；The groove side includes side PC layers 6, second buffer layer 5 successively from outside to inside；Described
The thickness of two buffer layers 5 is 0.3mm；The material of the second buffer layer is TPU elastomers；The appearance of the second buffer layer 5
1 arc-shaped bulge-structure is additionally provided on face；The material of the arc-shaped bulge-structure is TPU elastomers；The groove-bottom
Venthole 4 is additionally provided on face, the venthole 4 is located at the center of groove floor；The distance between the venthole 4 b is
4mm；Fore-and-aft distance d between the center of circle of the venthole and the center of circle of location hole is 5.5mm；The center of circle of the venthole with it is fixed
Lateral distance c between the center of circle in position hole is 2mm.
Embodiment 2：
As shown in Figure 1 and Figure 2, the embodiments of the present invention 2 provide a kind of novel carrier band, and the novel carrier band is at least
It is laterally extended including carrier band body construction 1, the carrier band body construction 1, the width of the carrier band body construction 1 is 12mm, institute
The upper end for stating carrier band body construction 1 is provided with location hole 1, and the carrier band body construction 1 is three-decker, the three-decker by
Include PS conductive layers, PC hyaline layers and PS conductive layers successively under；The location hole 1 is equidistantly arranged along carrier band length direction
It is in a row；The distance between location hole a is 4mm；Receiving portion 3 is additionally provided with below the location hole；The receiving portion 3
It is equidistantly arranged in a row along carrier band length direction；The receiving portion 3 is the groove for carrying housing electronic component；It is described recessed
Slot includes groove side and groove floor；Angle between the groove side and groove floor is 150 °；The groove floor
Include bottom surface PC layers 8, first buffer layer 9 successively from the bottom to top；The thickness of the first buffer layer 9 is 2mm；First buffering
The material of layer is TPU elastomers；The groove side includes side PC layers 6, second buffer layer 5 successively from outside to inside；Described
The thickness of two buffer layers 5 is 1.5mm；The material of the second buffer layer is TPU elastomers；The appearance of the second buffer layer 5
20 arc-shaped bulge-structures are additionally provided on face；The material of the arc-shaped bulge-structure is TPU elastomers；The groove-bottom
Venthole 4 is additionally provided on face, the venthole 4 is located at the center of groove floor；The distance between the venthole 4 b is
4mm；Fore-and-aft distance d between the center of circle of the venthole and the center of circle of location hole is 5.5mm；The center of circle of the venthole with it is fixed
Lateral distance c between the center of circle in position hole is 2mm.
Embodiment 3：
As shown in Figure 1 and Figure 2, the embodiments of the present invention 3 provide a kind of novel carrier band, and the novel carrier band is at least
It is laterally extended including carrier band body construction 1, the carrier band body construction 1, the width of the carrier band body construction 1 is 12mm, institute
The upper end for stating carrier band body construction 1 is provided with location hole 1, and the carrier band body construction 1 is three-decker, the three-decker by
Include PS conductive layers, PC hyaline layers and PS conductive layers successively under；The location hole 1 is equidistantly arranged along carrier band length direction
It is in a row；The distance between location hole a is 4mm；Receiving portion 3 is additionally provided with below the location hole；The receiving portion 3
It is equidistantly arranged in a row along carrier band length direction；The receiving portion 3 is the groove for carrying housing electronic component；It is described recessed
Slot includes groove side and groove floor；Angle between the groove side and groove floor is 135 °；The groove floor
Include bottom surface PC layers 8, first buffer layer 9 successively from the bottom to top；The thickness of the first buffer layer 9 is 1mm；First buffering
The material of layer is TPE elastomer；The groove side includes side PC layers 6, second buffer layer 5 successively from outside to inside；Described
The thickness of two buffer layers 5 is 1mm；The material of the second buffer layer is TPE elastomer；The outer surface of the second buffer layer 5
On be additionally provided with 8 arc-shaped bulge-structures；The material of the arc-shaped bulge-structure is TPE elastomer；The groove floor
On be additionally provided with venthole 4, the venthole 4 is located at the center of groove floor；The distance between the venthole 4 b is 4mm；
Fore-and-aft distance d between the center of circle of the venthole and the center of circle of location hole is 5.5mm；The center of circle of the venthole and location hole
The center of circle between lateral distance c be 2mm.
Embodiment 4：
As shown in Figure 1 and Figure 2, the embodiments of the present invention 4 provide a kind of novel carrier band, and the novel carrier band is at least
It is laterally extended including carrier band body construction 1, the carrier band body construction 1, the width of the carrier band body construction 1 is 12mm, institute
The upper end for stating carrier band body construction 1 is provided with location hole 1, and the carrier band body construction 1 is three-decker, the three-decker by
Include PS conductive layers, PC hyaline layers and PS conductive layers successively under；The location hole 1 is equidistantly arranged along carrier band length direction
It is in a row；The distance between location hole a is 4mm；Receiving portion 3 is additionally provided with below the location hole；The receiving portion 3
It is equidistantly arranged in a row along carrier band length direction；The receiving portion 3 is the groove for carrying housing electronic component；It is described recessed
Slot includes groove side and groove floor；Angle between the groove side and groove floor is 135 °；The groove floor
Include bottom surface PC layers 8, first buffer layer 9 successively from the bottom to top；The thickness of the first buffer layer 9 is 1mm；First buffering
The material of layer is TPE elastomer；The groove side includes side PC layers 6, second buffer layer 5 successively from outside to inside；Described
The thickness of two buffer layers 5 is 1mm；The material of the second buffer layer is TPE elastomer；The outer surface of the second buffer layer 5
On be additionally provided with 4 arc-shaped bulge-structures；The material of the arc-shaped bulge-structure is TPE elastomer；The groove floor
On be additionally provided with venthole 4, the venthole 4 is located at the center of groove floor；The distance between the venthole 4 b is 4mm；
Fore-and-aft distance d between the center of circle of the venthole and the center of circle of location hole is 5.5mm；The center of circle of the venthole and location hole
The center of circle between lateral distance c be 2mm.
Embodiment 5：
As shown in Figure 1 and Figure 2, the embodiments of the present invention 5 provide a kind of novel carrier band, and the novel carrier band is at least
It is laterally extended including carrier band body construction 1, the carrier band body construction 1, the width of the carrier band body construction 1 is 12mm, institute
The upper end for stating carrier band body construction 1 is provided with location hole 1, and the carrier band body construction 1 is three-decker, the three-decker by
Include PS conductive layers, PC hyaline layers and PS conductive layers successively under；The location hole 1 is equidistantly arranged along carrier band length direction
It is in a row；The distance between location hole a is 4mm；Receiving portion 3 is additionally provided with below the location hole；The receiving portion 3
It is equidistantly arranged in a row along carrier band length direction；The receiving portion 3 is the groove for carrying housing electronic component；It is described recessed
Slot includes groove side and groove floor；Angle between the groove side and groove floor is 135 °；The groove floor
Include bottom surface PC layers 8, first buffer layer 9 successively from the bottom to top；The thickness of the first buffer layer 9 is 0.8mm；Described first is slow
The material for rushing layer is TPE elastomer；The groove side includes side PC layers 6, second buffer layer 5 successively from outside to inside；It is described
The thickness of second buffer layer 5 is 0.8mm；The material of the second buffer layer is TPE elastomer；Outside the second buffer layer 5
4 arc-shaped bulge-structures are additionally provided on surface；The material of the arc-shaped bulge-structure is TPE elastomer；The groove
Venthole 4 is additionally provided on bottom surface, the venthole 4 is located at the center of groove floor；The distance between the venthole 4 b is
4mm；Fore-and-aft distance d between the center of circle of the venthole and the center of circle of location hole is 5.5mm；The center of circle of the venthole with it is fixed
Lateral distance c between the center of circle in position hole is 2mm.
Example above-mentioned is merely illustrative, some features of the feature for explaining the disclosure.The attached claims
It is intended to the range as wide as possible for requiring to be contemplated that, and embodiments as presented herein is only according to all possible embodiment
Combination selection embodiment explanation.Therefore, the purpose of applicant is that the attached claims are not illustrated this practicality
The exemplary selectional restriction of novel feature.And the progress in science and technology will be formed due to the inaccuracy that language is expressed
And the possible equivalent or son not being presently considered are replaced, and these variations should also be interpreted by institute in the conceived case
Attached claim covering.
Claims (4)
1. a kind of novel carrier band, which is characterized in that the novel carrier band includes at least carrier band body construction, the carrier band bulk junction
Structure is laterally extended, the width of the carrier band body construction is 12mm, and the upper end of the carrier band body construction is provided with several positioning
Hole, the location hole are equidistantly arranged in a row along carrier band length direction；Several receiving portions are additionally provided with below the location hole；
The receiving portion is equidistantly arranged in a row along carrier band length direction；The receiving portion is for carrying the recessed of housing electronic component
Slot；The groove includes groove side and groove floor；The carrier band body construction is three-decker, and the three-decker is by upper
Include PS conductive layers, PC hyaline layers and PS conductive layers successively under；
Angle between the groove side and groove floor is 100 °~150 °；The groove floor includes successively from the bottom to top
Bottom surface PC layers, first buffer layer；The groove side includes side PC layers, second buffer layer successively from outside to inside；Described second
Several arc-shaped bulge-structures are additionally provided on the outer surface of buffer layer；Venthole is additionally provided in the groove floor, it is described
Venthole is located at the center of groove floor；
The distance between described venthole is 4mm；
Lateral distance between the center of circle of the venthole and the center of circle of location hole is 2mm；
The upper surface of the first buffer layer is additionally provided with fixed bed.
2. novel carrier band as described in claim 1, which is characterized in that the thickness of the first buffer layer is 0.5~2mm；Institute
The material for stating first buffer layer is any one in TPU elastomers, TPE elastomer, TPV elastomers.
3. novel carrier band as described in claim 1, which is characterized in that the thickness of the second buffer layer is 0.3~1.5mm；
The material of the second buffer layer is any one in TPU elastomers, TPE elastomer, TPV elastomers.
4. novel carrier band as described in claim 1, which is characterized in that the quantity of the arc-shaped bulge-structure is 1~20.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721638811.XU CN207631792U (en) | 2017-11-30 | 2017-11-30 | A kind of novel carrier band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721638811.XU CN207631792U (en) | 2017-11-30 | 2017-11-30 | A kind of novel carrier band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207631792U true CN207631792U (en) | 2018-07-20 |
Family
ID=62854741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721638811.XU Active CN207631792U (en) | 2017-11-30 | 2017-11-30 | A kind of novel carrier band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207631792U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757663A (en) * | 2020-06-29 | 2020-10-09 | 西安微电子技术研究所 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
-
2017
- 2017-11-30 CN CN201721638811.XU patent/CN207631792U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757663A (en) * | 2020-06-29 | 2020-10-09 | 西安微电子技术研究所 | Vibration-damping bulk material mounting tool of chip mounter and application thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: East, 4th and 5th Floor, Building 16, Changxing Science and Technology Park, Wan'an Road, Shayi Community, Shajing Street, Baoan District, Shenzhen, Guangdong, 518000 Patentee after: Shenzhen xinchuangyuan Precision Intelligent Manufacturing Co.,Ltd. Address before: 518101 4th floor, building 16, Changxing Science Park, Shayi community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XCY ELECTRICAL PARTS CO.,LTD. |