CN110203513B

CN110203513B - A store and transport bracket for SMD

Info

Publication number: CN110203513B
Application number: CN201910356755.8A
Authority: CN
Inventors: 王克飞
Original assignee: Puhui Zhizao Technology Co Ltd
Current assignee: Puhuizhizao Technology Co.,Ltd.
Priority date: 2019-04-29
Filing date: 2019-04-29
Publication date: 2021-02-19
Anticipated expiration: 2039-04-29
Also published as: CN110203513A

Abstract

The invention discloses a storage and transportation bracket for SMD. The SMD material tray comprises a mounting table and an SMD material tray, wherein a damping frame is movably matched on one surface of the mounting table, a limiting column and a guide rod are fixed at the bottom of the inner wall of the damping frame, damping springs are arranged on the peripheral sides of the limiting column and the guide rod in a surrounding mode, a supporting plate is fixed at one end of each damping spring, a buffering frame is fixed on one surface of the supporting plate, a buffering mechanism is fixed at the bottom of the inner wall of the buffering frame, and a partition plate is fixed at one end, away from the bottom of the inner wall of the buffering frame, of each. The invention improves the stability of the bracket in the process of moving and transporting SMD materials by using the mounting table, the SMD material tray, the damping frame, the limiting column, the damping spring, the supporting plate, the buffering frame, the adsorption iron plate and the electromagnet, and the bracket can adjust the size of the material containing level space corresponding to each class according to the class and the quantity of the SMD materials, thereby improving the flexibility of the classified storage of the SMD materials.

Description

A store and transport bracket for SMD

Technical Field

The invention belongs to the technical field of SMD production equipment, and particularly relates to a storage and transportation bracket for an SMD.

Background

SMDs are short for Surface Mounted Devices (Surface Mounted Devices). In the production process of various circuit boards installed on electronic products, SMD is an indispensable production material. In addition, the SMD which needs to be used in the production of electronic products is large in quantity and various in types, the sizes of most SMD components are small, the difficulty of sorting and material finding operation is large, the consumed time is long, and errors are easy to occur. Therefore, in order to ensure the production efficiency and continuously meet the feeding requirement of an electronic product production line, proper tools are needed to classify, store and transport the SMD.

In order to meet the above requirements, various special brackets have been developed in the prior art, so as to implement the classified storage and storage of SMDs and the transportation and feeding of SMDs to a production line. For example, CN106272306A discloses an intelligent moving line side storehouse suitable for SMT (SMT is the surface mounting technology implemented by using SMD promptly), including peripheral support, be provided with the material frame in the peripheral support, it has a plurality of plywoods to distribute on the material frame, it has a plurality of material levels to distribute on the plywoods, be used for categorised SMD material of putting, be provided with a plurality of supports that bear on the material level, the plywood front end is provided with identification means, be provided with material induction system on material level or the support that bears, be provided with energy supply device on the material frame, energy supply device and identification means, material induction system links to each other, peripheral support and material frame below are provided with the universal wheel and do the.

Above prior art has realized putting and visual identification to SMD's classification, and can remove along the production line through the universal wheel, realizes the reciprocal feed of touring. However, the above prior art has disadvantages in that: the bin level is fixedly installed on the laminate, so the bin level space is also fixed, SMD types and quantity required by an electronic product production line change frequently, and the situation that the quantity and the space size of the bin level do not adapt to the requirements of storing and transporting SMD is inevitable. Moreover, the material level adopts open opening, and SMD volume and weight are all very little, so move the condition such as defeated material in-process because of tremble, shake, accident and collide with and all take place very easily that the shedding of SMD material is lost, in case take place to pick up rapidly and classify, seriously influence the work efficiency of production line.

Disclosure of Invention

The invention aims to provide a storage and transportation bracket for SMD, which can adjust the size of a material accommodating position space corresponding to each class according to the class and the quantity of SMD materials, so that the flexibility of SMD material classification storage is improved; the improvement of the invention is the stability of the bracket in the process of moving and transporting the SMD materials; adopt the material level structure that holds that can seal, meet great vibrations and collide with and also can not cause SMD material to drop from the bracket and scatter.

In order to solve the technical problems, the invention is realized by the following technical scheme:

the invention relates to a storage and transportation bracket for SMD, which comprises a mounting table and an SMD material tray, wherein the upper surface of the mounting table is movably matched with a damping frame, a limiting column and a guide rod are fixed at the bottom of the inner wall of the damping frame, damping springs are arranged on the peripheral sides of the limiting column and the guide rod in a surrounding manner, a supporting plate is fixed at one end of each damping spring, and a buffering frame is fixed on one surface of the supporting plate;

a buffer mechanism is fixed at the bottom of the inner wall of the buffer frame, a partition plate is fixed at one end of the buffer mechanism, which is far away from the bottom of the inner wall of the buffer frame, an adsorption iron plate is fixed on one surface of the partition plate, and the inner wall of the buffer frame is rotatably connected with a first guide roller;

an electromagnet is fixed on one surface of the SMD material tray, and a cover body pivot is rotatably connected to the side surface of the SMD material tray; the SMD material tray comprises a material level cavity and a cover body covering an opening of the material level cavity; the cover can be opened or closed around the cover pivot; the material level cavity is internally provided with a plurality of material level clapboards which divide the material level cavity into a plurality of material level spaces.

Furthermore, guide grooves are formed in the tops of at least two parallel side cavity walls of the material level cavity; the two end parts of the material level clapboard are provided with tenons which can be inserted into the guide grooves.

Furthermore, a dovetail groove and a sliding groove are formed in one surface of the mounting table, a dovetail sliding block and a sliding block which are matched with the dovetail groove and the sliding groove respectively are fixed on the surface of the damping frame, a screw rod penetrates through the sliding block and is in threaded connection with the sliding block, and a driving mechanism is connected to one end of the screw rod in a transmission mode.

Furthermore, a clamping groove is formed in the inner wall of the damping frame, clamping blocks matched with the clamping groove are fixed on the peripheral side face of the supporting plate, one end, far away from the bottom of the damping frame, of the guide rod penetrates through the supporting plate and is fixed with a limiting block, and a limiting column matched with the damping spring is fixed on one surface of the supporting plate.

Further, buffer gear includes the sleeve, the bottom of sleeve inner wall is fixed with buffer spring, buffer spring's top is fixed with the spring housing, spring housing surface and telescopic inner wall sliding fit, the bottom of sleeve inner wall and the bottom of spring housing inner wall all are fixed with the spacing ring.

Furthermore, a fixing hole is formed in one surface of the adsorption iron plate, the fixing hole is a countersunk hole, a through hole matched with the fixing hole is formed in the surface of the partition plate, the adsorption iron plate is fixedly connected with the partition plate through a bolt, and a buffer ring is arranged between the adsorption iron plate and the partition plate.

Furthermore, the driving mechanism comprises a motor, a first chain wheel, a chain and a second chain wheel, one side of the motor is fixedly connected with the mounting table, the motor is in transmission connection with the second chain wheel through the first chain wheel and the chain, and one surface of the second chain wheel is fixedly connected with the screw rod.

Furthermore, a ball is arranged on one surface of the dovetail slide block, and a groove matched with the ball is formed in the dovetail groove.

Furthermore, a clamping plate is fixed at the bottom of the inner wall of the buffer frame, a positioning groove is formed in one surface of the clamping plate, and positioning blocks matched with the positioning grooves are fixed on two side faces of the partition plate.

Further, arc-shaped concave parts are formed in the two surfaces of the buffering frame.

The invention has the following beneficial effects:

1. according to the storage and transportation bracket for the SMD, the mounting table, the SMD material tray, the damping frame, the limiting column, the damping spring, the supporting plate, the buffering frame, the adsorption iron plate and the electromagnet are matched for use, so that impact generated when the bracket is collided by vibration and collision can be absorbed, the generated vibration is reduced, the material tray is more firmly fixed through adsorption of the electromagnet, the SMD material cannot fall from the tray, and the reliability of material transportation is improved.

2. According to the SMD storage and transportation bracket, the mounting table, the screw rod and the driving mechanism are matched for use, so that the device can horizontally translate within a certain range, the feeding can be moved within a certain range even if the device is fixedly mounted, and the mounting position and the using mode of the device on a production line are more flexible and convenient.

3. According to the invention, through the matched use of the SMD material tray, the first guide roller and the cover body pivot, the electromagnet can be opposite to the adsorption iron plate, so that the stability of the tray is improved, the butt joint difficulty of accurate placement of the tray is reduced, the positioning butt joint time is reduced, and the tray is convenient to take out, so that when the mechanical arm is used for grabbing the tray for feeding, the efficiency and the accuracy are improved.

4. According to the SMD material tray, the size of the material level space corresponding to each class is adjusted through the material level partition plate, so that the flexibility of SMD material classified storage is improved.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of a storage and transport tray structure for SMD of the present invention;

FIG. 2 is a schematic view (upside down) of the structure of the SMD material tray and the electromagnet;

FIG. 3 is a side view of FIG. 2;

FIG. 4 is a schematic view of the structure of the mounting table of the present invention;

FIG. 5 is a schematic structural view of the shock-absorbing frame of the present invention;

FIG. 6 is a bottom view of FIG. 5;

FIG. 7 is a schematic view of the structure of the partition board and the iron absorbing plate of the present invention;

FIG. 8 is a side view of FIG. 7;

FIG. 9 is a schematic structural diagram of a buffer frame according to the present invention;

FIG. 10 is a schematic view of the other side of FIG. 1;

FIG. 11 is a cross-sectional view taken along line A-A of FIG. 10;

FIG. 12 is a schematic view of the structure of the cushioning mechanism of the present invention;

FIG. 13 is a schematic view of a bin level cavity structure of the SMD material tray of the present invention;

fig. 14 is an exploded view of fig. 13.

In the drawings, the components represented by the respective reference numerals are listed below:

1-mounting table, 101-dovetail groove, 102-sliding groove, 2-SMD material tray, 201-material level cavity, 202-cover body, 201A-material level clapboard, 201B-guide groove, 201C-tenon, 3-damping frame, 301-dovetail slide block, 302-slide block, 303-clamping groove, 4-limiting column, 5-guide rod, 6-damping spring, 7-support plate, 701-clamping block, 8-damping frame, 9-damping mechanism, 901-sleeve, 902-damping spring, 903-spring sleeve, 10-clapboard, 1001-positioning block, 11-adsorption iron plate, 12-first guide roller, 13-electromagnet, 14-cover body pivot, 15-screw rod, 16-driving mechanism and 17-clamping plate, 1701-positioning groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the present invention is a storage and transportation bracket for SMDs, which includes a mounting table 1 and an SMD material tray 2, wherein the mounting table 1 is fixedly connected to a ground or a base supporting the mounting table or a vehicle body of a mobile cart, and the SMD material tray 2 is detachably disposed on the mounting table.

The upper surface of the mounting table 1 is movably matched with a damping frame 3. Referring to fig. 5, a limiting column 4 and a guide rod 5 are fixed at the bottom of the inner wall of the shock-absorbing frame 3, and a shock-absorbing spring 6 shown in fig. 11 is arranged around the peripheral sides of the limiting column 4 and the guide rod 5. One end of the damper spring 6 is fixed with a support plate 7. As shown in fig. 5, the inner wall of the damping frame 3 is provided with a clamping groove 303, a clamping block 701 matched with the clamping groove 303 is fixed on the circumferential side surface of the supporting plate 7, one end of the guide rod 5 far away from the bottom of the damping frame 3 penetrates through the supporting plate 7 and is fixed with a limiting block, and a limiting column 4 matched with the damping spring 6 is also fixed on one surface of the supporting plate 7.

A buffer frame 8 is fixed on one surface of the support plate 7, and a buffer structure in the buffer frame 8 can absorb energy generated when the bracket is subjected to large vibration or collision; as shown in fig. 11, a buffer mechanism 9 is fixed at the bottom of the inner wall of the buffer frame 8, a partition plate 10 is fixed at one end of the buffer mechanism 9 away from the bottom of the inner wall of the buffer frame 8, an iron adsorption plate 11 is fixed on one surface of the partition plate 10, and a first guide roller 12 is rotatably connected to the inner wall of the buffer frame 8. As shown in fig. 12, the buffer mechanism 9 includes a sleeve 901, a buffer spring 902 is fixed at the bottom of the inner wall of the sleeve 901, a spring sleeve 903 is fixed at the top end of the buffer spring 902, the outer surface of the spring sleeve 903 is in sliding fit with the inner wall of the sleeve 901, and a stop ring is fixed at both the bottom of the inner wall of the sleeve 901 and the bottom of the inner wall of the spring sleeve 903. As shown in fig. 7, a fixing hole is formed in a surface of the iron adsorption plate 11, the fixing hole is a countersunk hole, a through hole matched with the fixing hole is formed in a surface of the partition plate 10, the iron adsorption plate 11 is fixedly connected with the partition plate 10 through a bolt, and a buffer ring is arranged between the iron adsorption plate 11 and the partition plate 10 to further reduce vibration and impact. The bottom of the inner wall of the buffer frame 8 is fixed with a clamping plate 17, a positioning groove 1701 is formed in one surface of the clamping plate 17, and positioning blocks 1001 matched with the positioning groove 1701 are fixed on two side faces of the partition plate 10, so that the partition plate 10 is accurately positioned and matched with the buffer frame 8. Arc-shaped concave parts are formed on the two surfaces of the buffering frame 8.

SMD material tray 2 is equipped with electro-magnet 13 towards the fixed surface of buffering frame 8 one side, be provided with the buffering ring between SMD material tray 2 and the electro-magnet 13, SMD material tray 2 and electro-magnet 13 are in the same place through bolt fixed connection, SMD material tray 2 side rotates and is connected with lid pivot 14, first deflector roll 12 and lid pivot 14 can level and smooth mutual contact at the in-process of putting into buffering frame 8 with SMD material tray 2, the process that makes SMD material tray 2 put into buffering frame 8 and follow and take out can smoothly be accomplished, and can place multilayer material tray by last under to in the buffering frame 8, so the radian contact surface that first deflector roll 12 formed also is favorable to taking out the material tray that is located the lower floor. Then the electromagnet 13 and the iron plate 11 can generate a certain adsorption force, so that the SMD material tray 2 is stably and detachably placed in the buffer frame 8 at any time. The outer surfaces of the first guide roller 12 and the cover body pivot 14 can be coated with a thin hard plastic layer, so that the collision force is reduced, and meanwhile, the situation that the friction sound is generated by direct contact of metal and is unpleasant is avoided.

The SMD material tray 2 comprises a level chamber 201 and a cover 202 covering an opening of the level chamber, wherein the cover 202 can be opened about a cover pivot 14, and the level chamber 201 under the cover 202 can be exposed after opening the cover 202. As shown in fig. 13, a plurality of level partitions 201A are arranged in the level cavity 201, and guide grooves 201B are formed in the tops of at least two parallel side cavity walls of the level cavity 201; it can be seen from fig. 14 that both end portions of the level divider 201A have tenons 201C insertable into the guide grooves 201B. Therefore, the material level partition board 201A divides the material level cavity 201 into a plurality of material level spaces, and each material level space can be internally provided with an SMD of one type, so that classified storage and material supply are realized; and through sliding each material level baffle 201A along guide slot 201B, carry out size control to the material level space that each grade corresponds, improved the flexibility of SMD material classification storage. Moreover, when the material is not supplied, the cover 202 can be closed, so that the risk of scattering and falling off of the SMD materials is further reduced.

As shown in fig. 4, a dovetail groove 101 and a sliding groove 102 are formed in one surface of the mounting table 1, a dovetail slide block 301 and a sliding block 302 which are respectively matched with the dovetail groove 101 and the sliding groove 102 are fixed on one surface of the shock absorption frame 3, a screw rod 15 penetrates through the sliding block 302, the screw rod 15 is in threaded connection with the sliding block 302, and one end of the screw rod 15 is in transmission connection with a driving mechanism 16. As shown in fig. 6, a surface of the dovetail slider 101 is provided with a ball, and a groove matched with the ball is formed in the dovetail groove 301, so that the frictional resistance between the dovetail groove 101 and the dovetail slider 301 is reduced, and the motion is more flexible and convenient. As shown in fig. 1, the driving mechanism 16 includes a motor, a first chain wheel, a chain, and a second chain wheel, one side of the motor is fixedly connected to the mounting table 1, the motor is connected to the second chain wheel through the first chain wheel and the chain, and one surface of the second chain wheel is fixedly connected to the lead screw 15. Thus, the SMD material tray 2 can be moved by the damper frame 3 being supported by the support plate 7 and the buffer frame 8. In this way, under the condition that the bracket is fixed on the ground or the base, translation of the bracket within a certain space range can be still realized, so that SMD materials can be conveyed for working points in a certain range of an electronic product production line. Of course, if the carriage of the present invention is mounted on a traveling carriage that carries the carriage to be transported along a production line, a separate moving structure between the mounting table and the shock-absorbing frame is not required.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A storage transport carrier for SMD comprising a mounting table (1) and a SMD material tray (2), characterized in that: the damping frame (3) is movably matched with the upper surface of the mounting table (1), a limiting column (4) and a guide rod (5) are fixed at the bottom of the inner wall of the damping frame (3), damping springs (6) are arranged on the circumferential sides of the limiting column (4) and the guide rod (5) in a surrounding mode, a supporting plate (7) is fixed at one end of each damping spring (6), and a buffering frame (8) is fixed on one surface of the supporting plate (7);

a buffer mechanism (9) is fixed at the bottom of the inner wall of the buffer frame (8), a partition plate (10) is fixed at one end, far away from the bottom of the inner wall of the buffer frame (8), of the buffer mechanism (9), an adsorption iron plate (11) is fixed on one surface of the partition plate (10), and a first guide roller (12) is rotatably connected to the inner wall of the buffer frame (8);

arc-shaped concave parts are formed in the two surfaces of the buffer frame (8);

a fixing hole is formed in one surface of the adsorption iron plate (11), the fixing hole is a countersunk hole, a through hole matched with the fixing hole is formed in one surface of the partition plate (10), the adsorption iron plate (11) is fixedly connected with the partition plate (10) through a bolt, and a buffer ring is arranged between the adsorption iron plate (11) and the partition plate (10);

an electromagnet (13) is fixed on one surface of the SMD material tray (2), and a cover body pivot (14) is rotatably connected to the side surface of the SMD material tray (2); the SMD material tray (2) comprises a material level cavity (201) and a cover body (202) covering an opening of the material level cavity (201); the cover (202) can be opened or closed about the cover pivot (14); the material level cavity (201) is internally provided with a plurality of material level clapboards (201A) which divide the material level cavity into a plurality of material level spaces;

guide grooves (201B) are formed in the tops of at least two parallel side cavity walls of the material level cavity (201); two end parts of the material level clapboard (201A) are provided with tenons (201C) which can be inserted into the guide grooves;

the SMD material tray (2) is fixed in the buffer frame (8) through the first guide roller (12) and the cover body pivot (14).

2. The storage and transportation bracket for the SMD of claim 1 wherein a dovetail groove (101) and a sliding groove (102) are formed on one surface of the mounting table (1), a dovetail slider (301) and a sliding block (302) which are respectively matched with the dovetail groove (101) and the sliding groove (102) are fixed on one surface of the shock-absorbing frame (3), a lead screw (15) penetrates through the sliding block (302), the lead screw (15) is in threaded connection with the sliding block (302), and a driving mechanism (16) is in transmission connection with one end of the lead screw (15).

3. The storage and transportation bracket for the SMD of claim 1 wherein the inner wall of the shock absorbing frame (3) is formed with a snap groove (303), a clamping block (701) matched with the snap groove (303) is fixed on the peripheral side of the support plate (7), one end of the guide rod (5) far away from the bottom of the shock absorbing frame (3) penetrates through the support plate (7) and is fixed with a limiting block, and a limiting column (4) matched with the shock absorbing spring (6) is also fixed on one surface of the support plate (7).

4. A storage transportation carriage for SMDs according to claim 1 where the buffer mechanism (9) comprises a sleeve (901), a buffer spring (902) is fixed to the bottom of the inner wall of the sleeve (901), a spring housing (903) is fixed to the top of the buffer spring (902), the outer surface of the spring housing (903) is in sliding fit with the inner wall of the sleeve (901), and a stop ring is fixed to both the bottom of the inner wall of the sleeve (901) and the bottom of the inner wall of the spring housing (903).

5. A storage and transport carriage for SMDs according to claim 2, characterised in that said driving mechanism (16) comprises an electric motor, a first sprocket, a chain, a second sprocket, said electric motor being fixedly connected on one side to the mounting station (1), said electric motor being drivingly connected to the second sprocket through the first sprocket and the chain, said second sprocket being fixedly connected on one surface to the screw (15).

6. The storage and transportation carriage for SMDs of claim 2 wherein the dovetail slider (301) has a surface provided with balls and the dovetail slot (101) has grooves formed therein for engagement with the balls.

7. A storage and transport carriage for SMDs as claimed in claim 1, wherein a catch plate (17) is fixed to the bottom of the inner wall of the buffer frame (8), a positioning groove (1701) is formed on one surface of the catch plate (17), and positioning blocks (1001) are fixed to both sides of the partition plate (10) to be fitted into the positioning groove (1701).