JP2006219137A - Cover tape for packaging electronic component - Google Patents
Cover tape for packaging electronic component Download PDFInfo
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- JP2006219137A JP2006219137A JP2005031485A JP2005031485A JP2006219137A JP 2006219137 A JP2006219137 A JP 2006219137A JP 2005031485 A JP2005031485 A JP 2005031485A JP 2005031485 A JP2005031485 A JP 2005031485A JP 2006219137 A JP2006219137 A JP 2006219137A
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- cover tape
- intermediate layer
- sealant
- packaging
- parts
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 239000000565 sealant Substances 0.000 claims abstract description 34
- 239000000155 melt Substances 0.000 claims abstract description 22
- 239000002245 particle Substances 0.000 claims abstract description 22
- -1 polyethylene Polymers 0.000 claims abstract description 22
- 239000004698 Polyethylene Substances 0.000 claims abstract description 15
- 229920000573 polyethylene Polymers 0.000 claims abstract description 14
- 229920001577 copolymer Polymers 0.000 claims abstract description 12
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 10
- 239000002216 antistatic agent Substances 0.000 claims abstract description 10
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical class C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims abstract description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 16
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 239000011787 zinc oxide Substances 0.000 claims description 5
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000003973 alkyl amines Chemical class 0.000 claims description 3
- 150000008052 alkyl sulfonates Chemical class 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 239000011575 calcium Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 238000009751 slip forming Methods 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 51
- 239000010408 film Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 230000009191 jumping Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 2
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- FIPWRIJSWJWJAI-UHFFFAOYSA-N Butyl carbitol 6-propylpiperonyl ether Chemical compound C1=C(CCC)C(COCCOCCOCCCC)=CC2=C1OCO2 FIPWRIJSWJWJAI-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 239000004920 heat-sealing lacquer Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
Description
本発明は電子部品の保管、輸送、装着に際し、電子部品を汚染から保護し、電子回路基板に実装するために整列させ、取り出せる機能を有する包装体のうち、ヒートシールされ得るカバーテープに関するものである。 The present invention relates to a cover tape that can be heat-sealed out of a package that has the functions of protecting electronic components from contamination, arranging them for mounting on an electronic circuit board, and taking them out when storing, transporting, and mounting the electronic components. is there.
近年、ＩＣを始めとして、トランジスター、ダイオード、コンデンサー、圧電素子レジスター、などの表面実装用電子部品は、電子部品の形状に合わせて、収納しうるエンボス成形されたポケットを有するトレーやポケットを連続的に形成したキャリアテープとキャリアテープにヒートシールしうるカバーテープとからなる包装体に包装されて供給されている。内容物の電子部品はトレーやカバーテープを剥離した後のキャリアテープより、自動的に取り出され電子回路基板に表面実装されている。 In recent years, electronic components for surface mounting such as ICs, transistors, diodes, capacitors, piezoelectric element resistors, etc., are continuously equipped with trays and pockets that have embossed pockets that can be accommodated according to the shape of the electronic components. The carrier tape is supplied in the form of a package comprising a carrier tape formed in the above and a cover tape that can be heat sealed to the carrier tape. The electronic components of the contents are automatically taken out from the carrier tape after the tray and cover tape are peeled off and are surface-mounted on the electronic circuit board.
カバーテープがキャリアテープから剥離される際の強度を剥離強度と呼ぶが、この強度が低すぎると包装体移送時に、カバーテープが外れ、内容物である電子部品が脱落するという問題があった。逆に、強すぎると、カバーテープを剥離する際キャリアテープが振動し、電子部品が装着される直前に収納ポケットから飛び出す現象、即ちジャンピングトラブルを起していた。 The strength at which the cover tape is peeled off from the carrier tape is referred to as peel strength. However, if the strength is too low, there is a problem that the cover tape is detached and the electronic components as contents are dropped when the package is transferred. Conversely, if it is too strong, the carrier tape vibrates when the cover tape is peeled off, causing a phenomenon of jumping out of the storage pocket immediately before the electronic component is mounted, that is, a jumping trouble.
現在、上市されているカバーテープのキャリアテープから剥離される時の機構は界面剥離タイプ、転写剥離タイプ、凝集破壊タイプの３つに分類される。界面剥離タイプとは、カバーテープとキャリアテープのシール面が剥離されるものであり、転写剥離タイプとは剥離時にヒートシーラント層（以下、シーラントと呼ぶ）自身がキャリアテープに転写されるものであり、凝集破壊タイプとはシーラントとは異なる別の層或いはシーラント自身が破れる事により剥離されるタイプのものである。それぞれのタイプで一長一短あるがキャリアテープにヒートシールされたカバーテープを剥離する際の状態だけを比較すると界面剥離タイプはシール面と剥離面が同一の為、キャリアテープの形状、材質、性状の影響を受けやすく、剥離強度が不安定になり安い。転写剥離タイプは機構上、接着層が薄膜である必要があり、いわゆる、ヒートシール用ラッカーを用いなければならず、剥離強度がシール温度に敏感になりがちで適当な剥離強度を得難い。凝集破壊タイプは接着層と剥離層が異なる為、剥離強度のシール条件依存性は少ない。また、キャリアテープの形状、材質、性状の影響を受けないという大きな長所を有する。更には転写剥離機構や界面剥離機構に比べて同種の樹脂間で剥離を生じるために剥離時の帯電を抑えることが出来る。しかし、剥離時、シーラントとは別の層が関与している為、シーラント以外の層が剥離する場合がある。また、シーラントが破壊する位置を設定し難く、剥離時にシーラントがキャリアテープの表面に残り、内容物を取り出す事が出来なくなる状態（以下、デラミと呼ぶ）になる。シーラントが破れやすく設計されている為、混ざり難い複数の樹脂のアロイである場合が多く、それらは均一に混合されていない場合があり、この事がカバーテープの透明性を悪化させたり、凝集物による欠点を作る場合がある。例えば特許文献１に示されている、ポリエチレン、ポリスチレン、エラストマー状スチレン‐ブタジエンースチレンまたはスチレン‐イソプレン‐スチレンのブロックコポリマーの配合を用いてシーラントの形成を試みると透明性が悪い。その為、キャリアテープのポケットに部品を挿入しカバーテープをヒートシールした後の検品工程での視認性が悪くなる。 At present, the mechanism of the commercially available cover tape when it is peeled off from the carrier tape is classified into three types: interface peeling type, transfer peeling type, and cohesive failure type. The interfacial peeling type is one in which the sealing surface of the cover tape and the carrier tape is peeled off, and the transfer peeling type is one in which the heat sealant layer (hereinafter referred to as sealant) is transferred to the carrier tape at the time of peeling. The cohesive failure type is a type that peels when another layer different from the sealant or the sealant itself is broken. Compared only with the state when peeling the cover tape heat-sealed to the carrier tape, each type has advantages and disadvantages, but the interface peeling type has the same sealing surface and peeling surface, so the influence of the shape, material, and properties of the carrier tape Easy to receive, peel strength becomes unstable and cheap. In the transfer peeling type, the adhesive layer needs to be a thin film because of the mechanism, so-called heat sealing lacquer must be used, and the peeling strength tends to be sensitive to the sealing temperature, making it difficult to obtain an appropriate peeling strength. In the cohesive failure type, the adhesive layer and the release layer are different, so the peel strength is less dependent on the sealing conditions. Further, it has a great advantage that it is not affected by the shape, material, and properties of the carrier tape. Furthermore, since peeling occurs between the same types of resins as compared with the transfer peeling mechanism and the interface peeling mechanism, charging at the time of peeling can be suppressed. However, since a layer different from the sealant is involved at the time of peeling, a layer other than the sealant may peel off. Further, it is difficult to set the position at which the sealant breaks, and the sealant remains on the surface of the carrier tape at the time of peeling, and the contents cannot be taken out (hereinafter referred to as delamination). Since the sealant is designed to be easy to tear, it is often an alloy of multiple resins that are difficult to mix, and they may not be evenly mixed, which deteriorates the transparency of the cover tape or aggregates May make a fault. For example, when a sealant is formed using a block copolymer blend of polyethylene, polystyrene, elastomeric styrene-butadiene-styrene or styrene-isoprene-styrene shown in Patent Document 1, the transparency is poor. Therefore, the visibility in the inspection process after inserting a part in the pocket of a carrier tape and heat-sealing a cover tape worsens.
電子部品を包装したキャリアテープは通常、紙製或いはプラスチック製のリールに巻かれ、実装工程迄、その状態が維持される。
実装時は実装機に具備されたフィーダカセットに該リールは収められているがカバーテープがキャリアテープから剥離される前にフィーダカセットが所定の位置に移される。その度重なる移動、即ち、摩擦によって生じた静電気がリール及びカバーテープの表面に蓄積されカバーテープが剥離される時に該静電気が内容物である電子部品に流れ内部回路が破壊されるトラブルが発生する。
At the time of mounting, the reel is housed in a feeder cassette provided in the mounting machine, but the feeder cassette is moved to a predetermined position before the cover tape is peeled off from the carrier tape. Repeated movements, that is, when static electricity generated by friction accumulates on the surface of the reel and the cover tape and the cover tape is peeled off, the static electricity flows into the electronic components that are the contents, causing trouble that destroys the internal circuit. .
本発明は前述の様な問題を解決すべく、剥離強度のシール条件依存性、経時変化が小さく、シール性が安定していて、カバーテープ表面の帯電を抑え、かつ透明性に優れたカバーテープを提供することにある。 In order to solve the above-mentioned problems, the present invention is a cover tape that has a peel strength dependency on seal conditions, a small change with time, a stable seal property, suppresses charging of the surface of the cover tape, and is excellent in transparency. Is to provide.
本発明は、
（１） ヒートシーラント層、中間層、基材層の少なくとも３層以上からなるフィルムであり、シーラントと隣り合う中間層の樹脂は、メルトフローレートが１０〜３０ｇ／１０分であるポリエチレン１００重量部に対して、メルトフローレートが１０〜６０ｇ／１０分であるメチルメタクリレートースチレン共重合体が５〜１００重量部添加された樹脂組成物からなり、曇度が４０％以下かつ表裏面の表面抵抗値が１０４〜１０１２Ω／□であることを特徴とする電子部品包装用カバーテープ、
（２） ヒートシーラント層、中間層、基材層の少なくとも３層以上からなるフィルムであり、シーラントと隣り合う中間層の樹脂は、メルトフローレートが１０〜３０ｇ／１０分であるポリエチレン１００重量部に対して、メルトフローレートが１０〜６０ｇ／１０分であるメチルメタクリレート‐スチレン共重合体が５〜１００重量部、及びメルトフローレートが３０〜２５０ｇ／１０分である水素添加スチレン−ブタジエン−スチレンブロック共重合体が１〜５０重量部添加された樹脂組成物からなり、曇度が４０％以下かつ表裏面の表面抵抗値が１０４〜１０１２Ω／□であることを特徴とする電子部品包装用カバーテープ、
（３） 前記基材層がポリエステル、ポリプロピレン、ナイロンの二軸延伸フィルムの内、少なくとも１種以上のフィルムを積層したフィルムであり、外面に帯電防止剤を塗布してなる（１）又は（２）項記載の電子部品包装用カバーテープ、
（４） 前記中間層は１層以上からなり、少なくともヒートシーラント層と隣り合う中間層はシール後に剥離される時に凝集破壊をおこす（１）〜（３）項のいずれかに記載の電子部品包装用カバーテープ、
（５） 前記ヒートシーラント層が軟化温度４０℃〜１３０℃である熱可塑性樹脂に対して帯電防止剤および０．０５〜２０μｍの粒径である帯電防止性を持たないフィラーを含有するアロイである（１）〜（４）項のいずれかに記載の電子部品包装用カバーテープ、
（６） 前記熱可塑性樹脂がポリメチルメタクリレート又は塩化ビニル‐酢酸ビニル共重合体である（５）項記載の電子部品包装用カバーテープ、
（７） 前記帯電防止剤が酸化錫、酸化亜鉛、酸化チタン、カーボン、及びポリオキシエチレンアルキルアミン、第四級アンモニウム、アルキルスルホネート等の界面活性剤、のいずれかまたは、それらの混合物である（３）項記載の電子部品包装用カバーテープ、
（８） 前記帯電防止性を持たないフィラーがケイ素、マグネシウム、カルシウムのいずれか１種を主成分とする酸化物粒子、又はポリオレフィン粒子、ポリアクリレート粒子、ポリスチレン粒子の内いずれか１種もしくは、これらの混合物である（５）項記載の電子部品包装用カバーテープ、
（９） 前記基材層の二軸延伸フィルムの厚みが５〜３０μであり、中間層の厚みが５〜５０μであり、ヒートシーラント層の厚みが０．２〜３μである（１）〜（８）項のいずれかに記載の電子部品包装用カバーテープ、
（１０） 該カバーテープと電子部品を収納するポケットを連続的に形成したキャリアテープとの剥離強度がシール幅１ｍｍ当たり１０〜１２０ｃＮになるよう中間層の樹脂が形成されている（１）〜（９）項のいずれかに記載の電子部品包装用カバーテープ、
である。
The present invention
(1) A film comprising at least three layers of a heat sealant layer, an intermediate layer, and a base material layer, and the resin of the intermediate layer adjacent to the sealant is 100 parts by weight of polyethylene having a melt flow rate of 10 to 30 g / 10 min. In contrast, a resin composition to which 5 to 100 parts by weight of a methyl methacrylate-styrene copolymer having a melt flow rate of 10 to 60 g / 10 min is added, has a haze of 40% or less, and a surface resistance on the front and back surfaces. A cover tape for packaging electronic parts, wherein the value is 10 4 to 10 12 Ω / □,
(2) A film comprising at least three layers of a heat sealant layer, an intermediate layer, and a base material layer, and the resin of the intermediate layer adjacent to the sealant is 100 parts by weight of polyethylene having a melt flow rate of 10 to 30 g / 10 min. 5 to 100 parts by weight of a methyl methacrylate-styrene copolymer having a melt flow rate of 10 to 60 g / 10 min, and hydrogenated styrene-butadiene-styrene having a melt flow rate of 30 to 250 g / 10 min An electronic component comprising a resin composition to which 1 to 50 parts by weight of a block copolymer is added, having a haze of 40% or less and a surface resistance value of 10 4 to 10 12 Ω / □ on the front and back surfaces Cover tape for packaging,
(3) The base material layer is a film obtained by laminating at least one film among biaxially stretched films of polyester, polypropylene, and nylon, and is formed by applying an antistatic agent to the outer surface (1) or (2 ) Cover tape for packaging electronic parts
(4) The electronic component packaging according to any one of (1) to (3), wherein the intermediate layer includes one or more layers, and at least an intermediate layer adjacent to the heat sealant layer causes cohesive failure when being peeled after sealing. Cover tape,
(5) The heat sealant layer is an alloy containing an antistatic agent and a non-antistatic filler having a particle size of 0.05 to 20 μm with respect to a thermoplastic resin having a softening temperature of 40 ° C. to 130 ° C. (1) to the cover tape for packaging electronic parts according to any one of (4),
(6) The cover tape for packaging electronic parts according to (5), wherein the thermoplastic resin is polymethyl methacrylate or vinyl chloride-vinyl acetate copolymer,
(7) The antistatic agent is any one of tin oxide, zinc oxide, titanium oxide, carbon, and a surfactant such as polyoxyethylene alkylamine, quaternary ammonium, and alkyl sulfonate, or a mixture thereof ( Cover tape for packaging electronic parts as described in 3),
(8) The filler having no antistatic property is an oxide particle mainly containing any one of silicon, magnesium and calcium, or any one of polyolefin particles, polyacrylate particles and polystyrene particles, or these A cover tape for packaging electronic parts as set forth in (5), which is a mixture of
(9) The biaxially stretched film of the base material layer has a thickness of 5 to 30 μm, the intermediate layer has a thickness of 5 to 50 μm, and the heat sealant layer has a thickness of 0.2 to 3 μm (1) to ( 8) The electronic component packaging cover tape according to any one of
(10) The intermediate layer resin is formed so that the peel strength between the cover tape and the carrier tape in which the pockets for storing the electronic parts are continuously formed is 10 to 120 cN per 1 mm of the seal width. 9) The electronic component packaging cover tape according to any one of
It is.
本発明に従うと、剥離強度を１ｍｍ当り１０〜１２０ｃＮの範囲で任意に設定しうる点、また、従来剥離機構が界面剥離等であるカバーテープは、剥離強度のシール条件依存性が大きいという問題、保管環境により経時的に変化する問題等があったが、本発明では凝集破壊機構による剥離となる為、安定した剥離強度を得ることが出来る。また、凝集破壊層が剥離時にキャリアテープの表面に残るデラミ問題、凝集破壊させる為に相容し難い複数の樹脂をアロイすることによる透明性阻害の問題についても解決することができる。更には帯電防止処理を施すことによって剥離時における内容物の貼り付きを防止することができる。 According to the present invention, the peel strength can be arbitrarily set in the range of 10 to 120 cN per mm, and the cover tape whose conventional peeling mechanism is interface peeling or the like has a problem that the peel strength is largely dependent on the seal condition, Although there was a problem of changing over time depending on the storage environment, in the present invention, since peeling is caused by a cohesive failure mechanism, a stable peeling strength can be obtained. In addition, the delamination problem that the cohesive failure layer remains on the surface of the carrier tape at the time of peeling, and the problem of transparency inhibition caused by alloying a plurality of resins that are difficult to be compatible for cohesive failure can be solved. Furthermore, sticking of the contents during peeling can be prevented by applying an antistatic treatment.
本発明のカバーテープ１の構成要素を図で説明する。図１は本考案のカバーテープの層構成を示す断面図である。図２は本考案のカバーテープをキャリアテープにヒートシールし、その使用状態を示す断面図であり、外層２がポリエステル、ポリプロピレン、ナイロンのいずれかである二軸延伸フィルムであり、静電防止効果を付与する為に外層側つまり二軸延伸フィルムの表面に帯電防止処理を施している。帯電防止処理がカバーテープの片面だけであると未処理面に帯電を生じてしまう。また、厚みは５〜３０μの透明で剛性の高いフィルムである。厚みが５μ以下では剛性がなくなり、カバーテープが切れやすくなる。３０μを越えると硬すぎてシールが不安定となる。 The components of the cover tape 1 of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing the layer structure of the cover tape of the present invention. FIG. 2 is a cross-sectional view of the cover tape of the present invention heat-sealed to a carrier tape and showing its use state. The outer layer 2 is a biaxially stretched film made of polyester, polypropylene or nylon, and has an antistatic effect. In order to impart the antistatic property, an antistatic treatment is applied to the outer layer side, that is, the surface of the biaxially stretched film. If the antistatic treatment is performed only on one side of the cover tape, the untreated side is charged. In addition, the film is a transparent and highly rigid film having a thickness of 5 to 30 μm. If the thickness is 5 μm or less, the rigidity is lost and the cover tape is easily cut. If it exceeds 30μ, it is too hard and the seal becomes unstable.
中間層３は１層以上からなり、少なくともシール後に剥離される時に凝集破壊をおこす層として、シーラントと隣り合う中間層３Ｂを含む。それ以外にクッション的な役割を果たすこともできる層として中間層３Ａを含んでも良い。
中間層３Ｂはメルトフローレートが１０〜３０ｇ／１０分であるポリエチレン１００重量部に対して、メルトフローレートが１０〜６０ｇ／１０分であるメチルメタクリレートースチレン共重合体が５〜１００重量部であるアロイであるか、或いは、メルトフローレートが１０〜３０ｇ／１０分であるポリエチレン１００重量部に対して、メルトフローレートが１０〜６０ｇ／１０分であるメチルメタクリレート‐スチレン共重合体が５〜１００重量部、メルトフローレートが３０〜２５０ｇ／１０分である水素添加スチレン−ブタジエン−スチレンブロック共重合体を１〜５０重量部であるアロイから成り、厚みが５〜５０μｍであるフィルムである。中間層の形成方法については押出ラミネート法が安価で衛生面から見て望ましい。ポリエチレンのメルトフローレートが１０ｇ／１０分未満、又は、メチルメタクリレート‐スチレン共重合体のメルトフローレートが１０ｇ／１０分未満、又は、水素添加スチレン−ブタジエン−スチレンブロック共重合体のメルトフローレートが３０ｇ／１０分未満である場合、加工法として押出ラミネート法を用いるとフィルムの延展性が小さく適当な製膜ができない。また、ポリエチレンのメルトフローレートが３０ｇ／１０分を超える、又は、メチルメタクリレート‐スチレン共重合体のメルトフローレートが６０ｇ／１０分を超える、又は、水素添加スチレン−ブタジエン−スチレンブロック共重合体のメルトフローレートが２５０ｇ／１０分を超える場合、ネッキングが激しくやはり適当な製膜ができない。メチルメタクリレート‐スチレン共重合体の含有量がポリエチレン１００重量部に対して５重量部未満であると中間層の凝集破壊が起きない。１００重量部を超えると混ざりが悪くなり、製膜できなくなる。水素添加スチレン−ブタジエン−スチレンブロック共重合体の含有量がポリエチレン１００重量部に対して、１重量部未満であると凝集破壊が起こりやすく、目的の強度が得られない。５０重量部を超えると押出ラミネートの際にフィルムの厚みバラツキが生じる。中間層の厚みを押出ラミネート法で５μ未満にすると厚みのバラツキが大きくヒートシール時、適当な剥離強度が得られなくなる。２０μ以上では剥離時、デラミが起き易くなる。
The intermediate layer 3 is composed of one or more layers, and includes at least an intermediate layer 3B adjacent to the sealant as a layer that causes cohesive failure when peeled after sealing. In addition, the intermediate layer 3A may be included as a layer that can also serve as a cushion.
The intermediate layer 3B has 5 to 100 parts by weight of a methyl methacrylate-styrene copolymer having a melt flow rate of 10 to 60 g / 10 min and 100 parts by weight of polyethylene having a melt flow rate of 10 to 30 g / 10 min. A methyl methacrylate-styrene copolymer having a melt flow rate of 10 to 60 g / 10 min is 5 to 100 parts by weight of polyethylene having a certain alloy or a melt flow rate of 10 to 30 g / 10 min. It is a film having a thickness of 5 to 50 μm, comprising 100 parts by weight of an alloy of 1 to 50 parts by weight of a hydrogenated styrene-butadiene-styrene block copolymer having a melt flow rate of 30 to 250 g / 10 min. As the method for forming the intermediate layer, the extrusion laminating method is inexpensive and desirable from the viewpoint of hygiene. The melt flow rate of polyethylene is less than 10 g / 10 min, the melt flow rate of methyl methacrylate-styrene copolymer is less than 10 g / 10 min, or the melt flow rate of hydrogenated styrene-butadiene-styrene block copolymer is In the case of less than 30 g / 10 minutes, if an extrusion laminating method is used as a processing method, the film has low spreadability and an appropriate film cannot be formed. In addition, the melt flow rate of polyethylene exceeds 30 g / 10 min, the melt flow rate of methyl methacrylate-styrene copolymer exceeds 60 g / 10 min, or the hydrogenated styrene-butadiene-styrene block copolymer When the melt flow rate exceeds 250 g / 10 min, the necking is severe and an appropriate film cannot be formed. When the content of the methyl methacrylate-styrene copolymer is less than 5 parts by weight with respect to 100 parts by weight of polyethylene, cohesive failure of the intermediate layer does not occur. When the amount exceeds 100 parts by weight, mixing is worsened and film formation becomes impossible. If the content of the hydrogenated styrene-butadiene-styrene block copolymer is less than 1 part by weight with respect to 100 parts by weight of polyethylene, cohesive failure tends to occur, and the desired strength cannot be obtained. If it exceeds 50 parts by weight, the thickness of the film varies during extrusion lamination. If the thickness of the intermediate layer is less than 5 μm by the extrusion laminating method, the thickness variation is large, and an appropriate peel strength cannot be obtained during heat sealing. If it is 20 μm or more, delamination is likely to occur during peeling.
シーラント５はブロッキング現象防止のためにポリメチルメタクリレート又は塩化ビニル‐酢酸ビニル共重合体に対して０．２〜２０μｍの粒径である帯電防止剤および帯電防止性を持たないフィラーを含んだ混合物から成り、厚みが０．２〜３μｍである。帯電防止剤としては、酸化錫、酸化亜鉛、酸化チタン、カーボン、及びポリオキシエチレンアルキルアミン、第四級アンモニウム、アルキルスルホネート等の界面活性剤、のいずれかまたは、混合物があげられる。ただし、上記粒径の範囲は粒径を持たない界面活性剤型の帯電防止剤は除く。上記の内カーボンにはカーボンブラック・ホワイトカーボン・カーボン繊維・カーボンチューブ等の炭素からなる種々形状フィラーを含む。帯電防止性を持たないフィラーとしては特に限定されないが、ケイ素、マグネシウム、カルシウムのいずれかを主成分とする酸化物粒子、例えば、シリカ、タルク等、又はポリエチレン粒子、ポリアクリレート粒子、ポリスチレン粒子の内、いずれか１種もしくはこれらのアロイをポリメチルメタクリレート又は塩化ビニル‐酢酸ビニル共重合体１００重量部に対してフィラーを１〜６０重量部含むことが好ましい。該層の形成方法としてはグラビュアコーティング法が最も望ましい。ポリメタクリレートとしては例えばメチルメタクリレート‐ブチルメタクリレート共重合体が挙げられる。これは共重合比率を変えることにより軟化温度を４０〜１３０℃の範囲で変えることができる。塩化ビニル‐酢酸ビニル共重合体としては、例えばディックシールＡ-１００Ｚシリーズ（大日本インキ化学工業（株）製）のようなものがある。これも品番により軟化温度を調節できる。軟化温度が４０℃未満の場合、カバーテープの保管時にブロッキングする可能性があり、１３０℃を超えるとヒートシール時の温度条件を高くする必要があり、その場合キャリアテープ自体が破損する恐れがある。 Sealant 5 is made of a mixture containing an antistatic agent having a particle size of 0.2 to 20 μm and a non-antistatic filler for polymethyl methacrylate or vinyl chloride-vinyl acetate copolymer to prevent blocking phenomenon. And the thickness is 0.2 to 3 μm. Examples of the antistatic agent include tin oxide, zinc oxide, titanium oxide, carbon, and surfactants such as polyoxyethylene alkylamine, quaternary ammonium, and alkyl sulfonate, or a mixture thereof. However, the above range of particle size excludes surfactant type antistatic agents having no particle size. The above carbon includes fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube. The filler having no antistatic property is not particularly limited, but oxide particles mainly containing any one of silicon, magnesium and calcium, such as silica, talc, etc., or polyethylene particles, polyacrylate particles and polystyrene particles. The filler is preferably contained in an amount of 1 to 60 parts by weight of any one kind or alloy thereof based on 100 parts by weight of polymethyl methacrylate or vinyl chloride-vinyl acetate copolymer. As a method for forming the layer, a gravure coating method is most desirable. Examples of polymethacrylate include methyl methacrylate-butyl methacrylate copolymer. This can change the softening temperature in the range of 40 to 130 ° C. by changing the copolymerization ratio. As a vinyl chloride-vinyl acetate copolymer, for example, there is one such as Dick Seal A-100Z series (manufactured by Dainippon Ink & Chemicals, Inc.). The softening temperature can be adjusted by the product number. If the softening temperature is less than 40 ° C, there is a possibility of blocking during storage of the cover tape, and if it exceeds 130 ° C, it is necessary to increase the temperature condition during heat sealing, in which case the carrier tape itself may be damaged. .
フィラーの粒径が０．２μｍ未満又は添加部数が１重量部未満であればカバーテープを６０℃以上の高温環境下で保管した場合、巻きだしが出来なくなるいわゆるブロッキング現象が起こる。また、フィラーの粒径が２０μｍを超える又は添加部数が６０重量部を超えれば透明性が悪化し、曇度が４０％を超えてしまう。ヒートシーラント層の厚みが０．２μｍ未満であれば厚みを一定にするのが極めて困難であり安定した剥離強度を得る事が出来なくなり、３μを超えればシーラントで凝集破壊が生じ、やはり剥離強度が不安定になる。 If the particle size of the filler is less than 0.2 μm or the number of added parts is less than 1 part by weight, when the cover tape is stored in a high temperature environment of 60 ° C. or higher, a so-called blocking phenomenon that prevents unwinding occurs. On the other hand, if the particle size of the filler exceeds 20 μm or the added part exceeds 60 parts by weight, the transparency deteriorates and the haze exceeds 40%. If the thickness of the heat sealant layer is less than 0.2 μm, it is extremely difficult to make the thickness constant, and it becomes impossible to obtain a stable peel strength. If the thickness exceeds 3 μm, cohesive failure occurs in the sealant, and the peel strength is also high. It becomes unstable.
この場合、該カバーテープ１と該キャリアテープ６との剥離強度はシール幅1mm当り１０〜１２０ｃＮ、更に好ましくは１０〜７０ｃＮなるようシーラントの樹脂が形成される。剥離強度が１０ｃＮより低いと包装体移送時に、カバーテープが外れ、内容物である電子部品が脱落するという問題がある。逆に、１２０ｃＮよりも高いと、カバーテープを剥離する際キャリアテープが振動し、電子部品装着される直前に収納ポケットから飛び出す現象、即ちジャンピングトラブルを起こす。本発明によるとシール条件依存性が低く、且つ、保管環境による剥離強度の経時変化が少ない目的とする性能を得ることが出来る。 In this case, the sealant resin is formed so that the peel strength between the cover tape 1 and the carrier tape 6 is 10 to 120 cN, more preferably 10 to 70 cN per 1 mm of the seal width. When the peel strength is lower than 10 cN, there is a problem in that the cover tape is removed during transportation of the package, and the electronic component as the contents falls off. On the other hand, if it is higher than 120 cN, the carrier tape vibrates when the cover tape is peeled off, causing a phenomenon of jumping out of the storage pocket immediately before mounting the electronic component, that is, a jumping trouble. According to the present invention, it is possible to obtain the desired performance with low dependency on the sealing conditions and with little change in peel strength with time due to the storage environment.
又、カバーテープの曇度が４０％以下、好ましくは３５％以下になる様に構成されているために、キャリアテープに封入された内部の電子部品が目視あるいは機械によって確認できる。４０％より高いと、包装された電子部品の確認が難しい。 Further, since the cover tape is configured to have a haze of 40% or less, preferably 35% or less, the internal electronic components enclosed in the carrier tape can be confirmed visually or by a machine. If it is higher than 40%, it is difficult to confirm the packaged electronic parts.
本発明の実施例を以下に示すがこれらの実施例によって本発明は何ら限定されるものではない。
外層として膜厚２５μｍの二軸延伸ポリエステルフィルムを使用し、表１及び表２に示す配合処方により、中間層を押出しラミネート法（押出し温度：２８０℃）により膜厚３０μｍに製膜し、シーラントをグラビュアコーティング法により膜厚１μｍに製膜し、図１に示した層構成のカバーテープを得た。
得られたカバーテープを５．５ｍｍ幅にスリット後、８ｍｍ幅のＰＳ製キャリアテープとの剥離強度が４０ｃNとなるようにヒートシール温度を調整したヒートシールを行い、３００ｍｍ／ｍｉｎで剥離した際の剥離機構、剥離時に発生する剥離帯電圧を測定した。また、スリットする前に表裏面の表面抵抗値、曇度及び６０℃の環境でカバーテープを保管した場合のブロッキングの状態を測定した。その特性評価結果を実施例については表１に、比較例については表２に示した。なお、表１、２中の剥離強度については一般に多く使われる温度である１６０℃でヒートシールし、剥離強度の評価を実施した。
Examples of the present invention are shown below, but the present invention is not limited to these examples.
A biaxially stretched polyester film with a film thickness of 25 μm is used as the outer layer, and the intermediate layer is formed into a film thickness of 30 μm by an extrusion laminating method (extrusion temperature: 280 ° C.) according to the formulation shown in Tables 1 and 2, and a sealant is formed. A film having a thickness of 1 μm was formed by a grabure coating method to obtain a cover tape having a layer structure shown in FIG.
After slitting the obtained cover tape to a width of 5.5 mm, heat sealing was performed by adjusting the heat sealing temperature so that the peel strength with the carrier tape made of 8 mm width was 40 cN, and peeling was performed at 300 mm / min. The peeling mechanism and the peeling voltage generated during peeling were measured. Moreover, the surface resistance value of front and back, haze, and the blocking state when the cover tape was stored in an environment of 60 ° C. were measured before slitting. The characteristic evaluation results are shown in Table 1 for the examples and Table 2 for the comparative examples. The peel strengths in Tables 1 and 2 were heat-sealed at 160 ° C., which is a commonly used temperature, and the peel strength was evaluated.
前記剥離時の帯電圧の測定はＳＩＭＣＯ株式会社製の表面電位計を用いて、サンプル-プローブ間距離を１０ｍｍに設定して実施した。測定対象サンプルは接地した金属板上に載せてプローブ-サンプルの周囲にはプローブを中心に３５ｍｍΦになるように金属製の板で囲み、外部からの影響を遮断した。 The measurement of the charged voltage at the time of peeling was carried out using a surface potential meter manufactured by SIMCO Corporation and setting the sample-probe distance to 10 mm. The sample to be measured was placed on a grounded metal plate, and the probe-sample was surrounded by a metal plate so as to have a diameter of 35 mm with the probe as the center, thereby blocking external influences.
表面抵抗値の測定は、ＳＩＭＣＯ株式会社製の表面抵抗器を用いて、測定を実施した。 The surface resistance value was measured using a surface resistor manufactured by SIMCO Corporation.
表１、２中の記号及び表示物名は以下のものを使用した。
ＰＥ ：ポリエチレン（ＭＦＲ：１５ｇ／１０分）
ＭＳ ：メチルメタクリレート−スチレン共重合体（ＭＦＲ：４７ｇ／１０分）
ＳＥＢＳ ：スチレン−エチレン−ブタジエン−スチレン共重合体（ＭＦＲ：５０ｇ／１０分）
塩酢ビ ：塩化ビニル−酢酸ビニル共重合体（軟化温度：６０℃）
アクリル ：ポリメチルメタクリレート（軟化温度：５０℃）
ＡＴＯ ：酸化錫
ＺｎＯ ：酸化亜鉛
ＡＳ ：第４級アンモニウム
タルク ：滑石
シリカ ：二酸化ケイ素
ワックス ：低分子量四フッ化エチレン樹脂
架橋アクリル ：ポリメチルメタクリレート架橋粒子
架橋スチレン ：ポリスチレン架橋粒子
The following symbols and display names in Tables 1 and 2 were used.
PE: Polyethylene (MFR: 15 g / 10 min)
MS: Methyl methacrylate-styrene copolymer (MFR: 47 g / 10 min)
SEBS: Styrene-ethylene-butadiene-styrene copolymer (MFR: 50 g / 10 min)
Salt vinyl acetate: Vinyl chloride-vinyl acetate copolymer (softening temperature: 60 ° C.)
Acrylic: Polymethylmethacrylate (softening temperature: 50 ° C)
ATO: tin oxide ZnO: zinc oxide AS: quaternary ammonium talc: talc silica: silicon dioxide wax: low molecular weight tetrafluoroethylene resin crosslinked acrylic: polymethyl methacrylate crosslinked particles crosslinked styrene: polystyrene crosslinked particles
本発明は、剥離強度のシール条件依存性、経時変化が小さく、シール性が安定していて、カバーテープ表面の帯電を抑え、かつ透明性に優れたカバーテープを提供することができ、電子部品の保管、輸送、装着に際し、電子部品を汚染から保護し、電子回路基板に実装するために有用なカバーテープである。 The present invention is capable of providing a cover tape that is less dependent on the sealing conditions of peel strength, changes with time, has a stable sealing property, suppresses charging of the surface of the cover tape, and is excellent in transparency. This cover tape is useful for protecting electronic components from contamination and mounting them on electronic circuit boards when storing, transporting, and mounting them.
１ カバーテープ
２ 外層
３ 中間層
３A クッション的な役割を果たす事も出来る層
３B ヒートシーラント層と隣り合う層
４ ヒートシーラント層
５ シール部
６ キャリアテープ
DESCRIPTION OF SYMBOLS 1 Cover tape 2 Outer layer 3 Middle layer 3A Layer which can also play a cushion-like role 3B Layer adjacent to heat sealant layer 4 Heat sealant layer 5 Sealing part 6 Carrier tape
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010505024A (en) * | 2006-09-28 | 2010-02-18 | ヨウル チョン ケミカル カンパニー， リミテッド | Surface protection film |
| WO2010018791A1 (en) * | 2008-08-12 | 2010-02-18 | 住友ベークライト株式会社 | Cover tape for packaging electronic part and electronic-part package |
| CN101973150A (en) * | 2010-08-25 | 2011-02-16 | 浙江洁美电子科技有限公司 | Gluing belt used for packaging carrier of electronic element and preparation method thereof |
| JP2011225263A (en) * | 2010-04-22 | 2011-11-10 | Denki Kagaku Kogyo Kk | Cover tape |
| DE112011102024T5 (en) | 2010-06-15 | 2013-06-06 | Denki Kagaku Kogyo Kabushiki Kaisha | masking tape |
| JP2013193786A (en) * | 2012-03-22 | 2013-09-30 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component and electronic component package |
| JP2015166253A (en) * | 2014-03-04 | 2015-09-24 | 住友ベークライト株式会社 | Cover tape for packaging electronic component and electronic component packaging body |
| WO2016076331A1 (en) * | 2014-11-12 | 2016-05-19 | 住友ベークライト株式会社 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
| KR20200070251A (en) | 2017-10-31 | 2020-06-17 | 덴카 주식회사 | Cover film |
| JPWO2022255338A1 (en) * | 2021-05-31 | 2022-12-08 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH09124070A (en) * | 1995-11-02 | 1997-05-13 | Daicel Chem Ind Ltd | Easily unsealable film |
| JPH09201922A (en) * | 1995-11-22 | 1997-08-05 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic part |
| JP2003175968A (en) * | 2001-12-12 | 2003-06-24 | Denki Kagaku Kogyo Kk | Cover tape and carrier tape body |
-
2005
- 2005-02-08 JP JP2005031485A patent/JP4706274B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09124070A (en) * | 1995-11-02 | 1997-05-13 | Daicel Chem Ind Ltd | Easily unsealable film |
| JPH09201922A (en) * | 1995-11-22 | 1997-08-05 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic part |
| JP2003175968A (en) * | 2001-12-12 | 2003-06-24 | Denki Kagaku Kogyo Kk | Cover tape and carrier tape body |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010505024A (en) * | 2006-09-28 | 2010-02-18 | ヨウル チョン ケミカル カンパニー， リミテッド | Surface protection film |
| WO2010018791A1 (en) * | 2008-08-12 | 2010-02-18 | 住友ベークライト株式会社 | Cover tape for packaging electronic part and electronic-part package |
| JP4438906B1 (en) * | 2008-08-12 | 2010-03-24 | 住友ベークライト株式会社 | Cover tape for electronic component packaging and electronic component package |
| KR100966985B1 (en) | 2008-08-12 | 2010-06-30 | 스미토모 베이클리트 컴퍼니 리미티드 | Cover tape and packaging for electronic components |
| US7931965B2 (en) | 2008-08-12 | 2011-04-26 | Sumitomo Bakelite Co., Ltd. | Cover tape for electronic component packing body and electronic component packing body |
| JP2011225263A (en) * | 2010-04-22 | 2011-11-10 | Denki Kagaku Kogyo Kk | Cover tape |
| US9662866B2 (en) | 2010-06-15 | 2017-05-30 | Denka Company Limited | Cover tape |
| KR101685749B1 (en) * | 2010-06-15 | 2016-12-12 | 덴카 주식회사 | Cover tape |
| DE112011102024B4 (en) | 2010-06-15 | 2022-02-03 | Denka Company Limited | masking tape |
| KR20130112027A (en) | 2010-06-15 | 2013-10-11 | 덴키 가가쿠 고교 가부시기가이샤 | Cover tape |
| DE112011102024T5 (en) | 2010-06-15 | 2013-06-06 | Denki Kagaku Kogyo Kabushiki Kaisha | masking tape |
| CN101973150A (en) * | 2010-08-25 | 2011-02-16 | 浙江洁美电子科技有限公司 | Gluing belt used for packaging carrier of electronic element and preparation method thereof |
| JP2013193786A (en) * | 2012-03-22 | 2013-09-30 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component and electronic component package |
| JP2015166253A (en) * | 2014-03-04 | 2015-09-24 | 住友ベークライト株式会社 | Cover tape for packaging electronic component and electronic component packaging body |
| JP5983902B1 (en) * | 2014-11-12 | 2016-09-06 | 住友ベークライト株式会社 | Cover tape for electronic component packaging, packaging material for electronic component packaging, and electronic component package |
| WO2016076331A1 (en) * | 2014-11-12 | 2016-05-19 | 住友ベークライト株式会社 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
| CN106604878A (en) * | 2014-11-12 | 2017-04-26 | 住友电木株式会社 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
| KR101756623B1 (en) | 2014-11-12 | 2017-07-10 | 스미또모 베이크라이트 가부시키가이샤 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
| CN106604878B (en) * | 2014-11-12 | 2018-03-20 | 住友电木株式会社 | Electronic parts cover strip, electronic parts packaging material and electronic component packing body |
| KR20200070251A (en) | 2017-10-31 | 2020-06-17 | 덴카 주식회사 | Cover film |
| US11541645B2 (en) | 2017-10-31 | 2023-01-03 | Denka Company Limited | Cover film |
| JPWO2022255338A1 (en) * | 2021-05-31 | 2022-12-08 | ||
| WO2022255338A1 (en) * | 2021-05-31 | 2022-12-08 | 大日本印刷株式会社 | Cover tape for use in packaging electronic component, and package |
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