CN106604878A

CN106604878A - Cover tape for electronic part package, packaging material for electronic part package, and electronic part package

Info

Publication number: CN106604878A
Application number: CN201580045612.5A
Authority: CN
Inventors: 山口亮
Original assignee: Sumitomo Bakelite Co Ltd
Current assignee: Sumitomo Bakelite Co Ltd
Priority date: 2014-11-12
Filing date: 2015-11-10
Publication date: 2017-04-26
Anticipated expiration: 2035-11-10
Also published as: WO2016076331A1; TWI647297B; TW201629172A; KR101756623B1; KR20170024126A; JP5983902B1; CN106604878B; JPWO2016076331A1

Abstract

The present invention has as one purpose thereof to provide a cover tape able to serve as a packaging material for an electronic part package from which an electronic part can be removed with exceptional precision from within a recessed portion of a carrier tape, and provides a cover tape for an electronic part package, characterized by having a base material layer, and a heat sealant layer laminated to one surface of the base material layer and sealed to the carrier tape, the heat sealant layer having surface roughness Rz (as stipulated in JIS B0601) of 1.0 muor greater, and adhesive strength of 0.3 g/mm2 or less with respect to a resin layer of which a polyorganosiloxane is the main component.

Description

Electronic parts cover strip, electronic parts packaging material and electronic unit bag Dress body

Technical field

The present invention relates to electronic parts cover strip, electronic parts packaging material and electronic component packing body.

Background technology

Typically, as housing electronic part (the especially very little chip such as chip-resistance, chip LED, chip capacitor Part) etc. electronic component packing body, using will be provided with can housing electronic part recess electronic unit storage carrier band (below, also referred to as " carrying ") is using electronic component packing obtained from upper cover strip (below, also referred to as " cover strip ") sealing With in packaging material, the electronic component packing body obtained from above-mentioned recess housing electronic part.

As carrier band, glued in the lower surface of sheet material after using a part for the sheet material that banding is made by punching processing Punching carrier band (for example, referenced patent document 1) obtained from the patch dished member storage portion (pocket) of tail band shape, by banding A part for sheet material forms compacting carrier band (for example, referenced patent document 2) obtained from pocket by compression process, by banding A part for sheet material formed by processing and forming (pressure empty shaping, vacuum drum molding, compressing etc.) and pressed obtained from pocket Stricture of vagina carrier band (for example, referenced patent document 3) etc..

As shown in figure 5, in such conventional electronic parts packaging material 1000, being accommodated with the recessed of electronic unit 40 Portion 512 is sealed by cover strip 200, generally, takes out electronic unit 40 from electronic parts packaging material 1000 in the following manner：It is logical Crossing makes cover strip (sealing member) 200 peel off from carrier band (base material) 500, exposes recess 512, thus, is sprayed using electronic unit absorption The pickup such as mouth is accommodated in the electronic unit 40 in recess 512.

In addition, in addition to the above-mentioned technology with regard to electronic parts packaging material, in can also enumerating such as patent documentation 4 The content of record.

Patent documentation 4 records a kind of cover strip, its include at least substrate layer (A), intermediate layer (B), with thermoplastic resin be The peel ply (C) of main constituent and the hot sealing layer (D) with thermoplastic resin as main constituent on carrier band can be sealed, be formed and peeled off Stretching storage elastic modelling quantity (c) of the thermoplastic resin of layer (C) at 23 DEG C is 1 × 10⁶More than Pa 1 × 10⁸Below Pa, forms Stretching storage elastic modelling quantity (d) of the thermoplastic resin of hot sealing layer (D) at 23 DEG C is 1 × 10⁸The above 1 × 10¹⁰Below Pa, C () is 1 × 10 with the ratio of (d)⁴≥(d)/(c)≥1×10。

In order to the recess 512 for being accommodated with electronic unit 40 is sealed, the face of the side of carrier band 500 of such cover strip 200 needs With the cementability to carrier band 500.

Therefore, according to carrying method of electronic component packing body etc., electronic unit 40 can be attached to the lid with cementability Face with 200 side of carrier band 500, when making cover strip 200 peel off from carrier band 500, electronic unit 40 be not attached in recess 512 and Cover strip 200 is attached to, as a result, exist exactly the ministry of electronics industry cannot be picked up from recess 512 using electronic unit adsorption nozzle The problem of part 40.

Especially, use by the resin structure with polysiloxane as main constituent as light emitting diode in electronic unit 40 Into sealing member in the case of, sealing member possesses high viscosity, as a result, the problems referred to above point can significantly be seen.

Prior art literature

Patent documentation

Patent documentation 1：Japanese Unexamined Patent Publication 10-218281 publication

Patent documentation 2：No. 3751414 publications of Japanese Patent Publication No.

Patent documentation 3：Japanese Unexamined Patent Publication 2011-225257 publications

Patent documentation 4：International Publication No. 2011/158550

The content of the invention

The invention technical problem to be solved

It is an object of the invention to：A kind of cover strip is provided, the cover strip can be formed can be with excellent precision from carrier band institute The electronic parts packaging material of electronic unit is taken out in the recess for possessing, there is provided possess the electronic parts bag of the cover strip Material, and the electronic component packing body obtained from housing electronic part in the electronic parts packaging material is provided.

In addition, meet the heat sealability to carrying and the low attachment to electronic unit the present invention also aims to provide simultaneously The electronic parts cover strip of property.

The present inventor has made intensive studies to solve above-mentioned technical problem.As a result, finding by improving cover strip The softening point of the resin of binding property in heat sealing layer, can be effectively prevented electronic unit attachment.But, although can be effectively Prevent electronic unit from adhering to, but on the other hand the heat sealability to carrying is deteriorated.

That is, the present inventor specify that：There is this between the low tack to the heat sealability for carrying and to electronic unit to disappear The relation of that length (trade-off), the shifting relation is only by the softening of the resin of binding property in adjustment heat sealing layer Point cannot be improved.

Therefore, the present inventor further has made intensive studies.As a result, finding by the heat sealing layer by cover strip is constituted The Vicat softening point of the resin of binding property in the variable quantity and heat sealing layer of the confficient of static friction on surface is adjusted to specific scope, Above-mentioned shifting relation can be improved, be obtained in that and meet simultaneously the heat sealability to carrying and the low attachment to electronic unit The cover strip of property, so as to complete the present invention.

For solving the means of technical problem

Above-mentioned purpose is by the present invention realization described in following (1)～(20).

(1) a kind of electronic parts cover strip, it is used for electronic component packing body, above-mentioned electronic component packing body tool It is standby：Carrier band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in above-mentioned recess； And cover strip, the cover strip is by the way that the sealing of above-mentioned carrier band is covered the above-mentioned recess for being accommodated with above-mentioned electronic unit, above-mentioned electronics Part taping packaging cover is characterised by：

Have：Substrate layer；And heat sealing layer, the heat sealing layer is stacked on a face of the substrate layer, and is sealed in Above-mentioned carrier band,

Surface roughness Rz (according to regulation of JIS B 0601) of above-mentioned heat sealing layer is 1.0 more than μ, and above-mentioned heat is close The adhesive strength of sealing and the resin bed with polysiloxane as main constituent is as 0.3g/mm²Below.

(2) the electronic parts cover strip according to (1), wherein, full light transmittance is (according to JIS K 7361-1 Regulation) be more than 80%.

(3) the electronic parts cover strip according to (1) or (2), wherein, above-mentioned heat sealing layer contains vinyl and is total to Polymers is used as main material.

(4) the electronic parts cover strip according to any one of (1) to (3), wherein, the thickness of above-mentioned heat sealing layer Spend for more than 1 μm and less than 15 μm.

(5) the electronic parts cover strip according to any one of (1) to (4), wherein, the thickness of above-mentioned substrate layer For more than 7 μm and less than 30 μm.

(6) the electronic parts cover strip according to any one of (1) to (5), wherein, above-mentioned heat sealing layer is to containing There is Merlon to possess sealing as the carrier band of main material.

(7) a kind of electronic parts cover strip, it is used for electronic component packing body, above-mentioned electronic component packing body tool It is standby：Carrier band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in above-mentioned recess； And cover strip, the cover strip is by the way that the sealing of above-mentioned carrier band is covered the above-mentioned recess for being accommodated with above-mentioned electronic unit, above-mentioned electronics Part taping packaging cover is characterised by：

Possess：Substrate layer；And heat sealing layer, the heat sealing layer is stacked on a face of the substrate layer, and comprising bonding Property resin,

In the load N that will be determined according to JIS K7125₁(50g) confficient of static friction on above-mentioned heat sealing layer surface when sets For μ₅₀, the load N that will be determined according to JIS K7125₂(200g) confficient of static friction on above-mentioned heat sealing layer surface when is set to μ₂₀₀ When,

By (μ₅₀-μ₂₀₀)/(N₂-N₁The variable quantity of the confficient of static friction that) × 1000 represent is less than 3.0,

The Vicat softening point that the foundation JIS K7206 of the above-mentioned resin of binding property in above-mentioned heat sealing layer is determined be 30 DEG C with Above and less than 70 DEG C.

(8) the electronic parts cover strip according to (7), wherein, according to the above-mentioned heat seal that ISO-25178 is determined The arithmetic average height (Sa) of layer surface is less than more than 0.4 μm 0.7 μm.

(9) according to the electronic parts cover strip described in (7) or (8), wherein, above-mentioned heat sealing layer is comprising containing (first Base) acryloyl group resin of binding property.

(10) the electronic parts cover strip according to (9), wherein, the above-mentioned bonding containing (methyl) acryloyl group Property resin the containing ratio of (methyl) acryloyl group be more than 10 mass % below 40 mass %.

(11) the electronic parts cover strip according to (9) or (10), wherein, it is above-mentioned containing (methyl) acryloyl group Resin of binding property be ethene copolymer.

(12) the electronic parts cover strip according to any one of (9) to (11), wherein, above-mentioned heat sealing layer is also Resin is adjusted containing cohesiveness.

(13) the electronic parts cover strip according to any one of (7) to (12), wherein, according to JIS K7361- The 1 full light transmittance for determining is more than 80%.

(14) the electronic parts cover strip according to any one of (7) to (13), wherein, above-mentioned heat sealing layer Thickness is less than more than 1 μm 15 μm.

(15) the electronic parts cover strip according to any one of (7) to (14), wherein, the thickness of above-mentioned substrate layer Spend for less than more than 7 μm 50 μm.

(16) according to the electronic parts cover strip any one of (7) to (15), wherein, above-mentioned carrier band is by including One or more material in Merlon and polystyrene is constituted.

(17) the electronic parts cover strip according to any one of (7) to (16), wherein, constitute the above-mentioned ministry of electronics industry The sealing member of part is silicone seal.

(18) the electronic parts cover strip according to any one of (1) to (17), wherein, above-mentioned electronic unit is Light emitting diode.

(19) a kind of electronic parts packaging material, it possesses：

(1) to the electronic parts cover strip any one of (18)；With

Carrier band, the carrier band a face have can housing electronic part recess, and above-mentioned recess is by above-mentioned electronic unit Taping packaging cover is covered.

(20) a kind of electronic component packing body, it possesses：

Carrier band, the carrier band a face have can housing electronic part recess；

The electronic unit being incorporated in above-mentioned recess；With

(1) to the electronic parts cover strip any one of (18), the electronic parts cover strip by Above-mentioned carrier band is sealed and covers the above-mentioned recess for being accommodated with above-mentioned electronic unit by said one surface side.

Invention effect

According to electronic parts packaging material (the electronic parts bag of the present invention of the cover strip for applying the present invention Material), can positively suppress or prevent when making cover strip peel off from carrier band, the electronic unit being accommodated in recess is attached to cover strip Side, can form the state being positively accommodated in electronic unit in recess.Therefore, it is possible to more precisely utilize electronic unit Adsorption nozzle etc. carries out the pickup of electronic unit.

In addition, according to the electronic parts packaging material (electronic component packing of the present invention of the cover strip for applying the present invention With packaging material), above-mentioned shifting relation can be improved, while meeting the heat sealability to carrying and the low attachment to electronic unit Property.

Description of the drawings

Fig. 1 is the partial perspective view of the embodiment of the electronic parts packaging material for representing the present invention.

Fig. 2 is the figure (plane graph) that the electronic parts packaging material shown in Fig. 1 is observed from arrow A directions.

Fig. 3 is the sectional view along line B-B of the electronic parts packaging material shown in Fig. 1.

Fig. 4 is the sectional view along line C-C of the electronic parts packaging material shown in Fig. 1.

Fig. 5 is the partial perspective view of the electronic parts packaging material for representing conventional.

Specific embodiment

Hereinafter, preferred implementation shown with reference to the accompanying drawings is to cover strip of the invention, electronic parts packaging material and electricity Subassembly package body is described in detail.In addition, in all of the figs, for identical constitutive requirements mark identical symbol, And suitably omit the description.In addition, "～" between the numeral in text, unless otherwise noted, then it represents that with up to following.

First, electronic parts packaging material (this before the cover strip of the explanation present invention, to the cover strip for possessing the present invention The electronic parts packaging material of invention) illustrate.

First embodiment

＜ electronic parts packaging material ＞

Fig. 1 is the partial perspective view of the embodiment of the electronic parts packaging material for representing the present invention, and Fig. 2 is from arrow A observes in direction the figure of the electronic parts packaging material shown in Fig. 1, and Fig. 3 is the edge of the electronic parts packaging material shown in Fig. 1 The sectional view of line B-B, Fig. 4 is the sectional view along line C-C of the electronic parts packaging material shown in Fig. 1.In addition, following In explanation, by the upside in Fig. 1, Fig. 3, Fig. 4 be referred to as " on ", the downside in Fig. 1, Fig. 3, Fig. 4 is referred to as into D score, by Fig. 2 Paper be referred to as with front side " on ", be referred to as D score by the paper in Fig. 2 is inboard.

Electronic parts packaging material 10 is used to pack (storage) electronic unit, in banding, has：Electronic unit storage is used Carrier band (below, also referred to as " carrying ") 1, the electronic unit storage carrier band 1 possesses in the 1st face (upper surface) 15 can receive electricity Recess (the electronic unit storage recess of subassembly (not shown)；Pocket) 12；With upper cover strip (below, also referred to as " cover strip ") 20, cover strip 20 is engaged in the side of the 1st face 15 with carrier band 1 on this, by opening sealing (covering) of the recess 12 of carrier band 1.

That is, electronic parts packaging material 10 for example possesses：Electronic parts cover strip 20；With carrier band 1, the carrier band 1 A face (the 1st face 15) with can housing electronic part recess 12, and recess 12 covered by electronic parts cover strip 20 Lid.

Carrier band (base material) 1 shown in Fig. 1～Fig. 4 is the resinous carrier band being made up of the sheet material of banding, in the carrier band 1 1st face 15 of upside has：Multiple recesses 12 of 1 row are configured to along its long side direction；With with the side parallel with multiple recesses 12 Formula is configured to multiple sprocket holes 11 of 1 row.

In addition, in the present embodiment, the general planar of the 2nd face 13 of the opposition side (downside) in 1 the 1st face 15 is carried.

In other words, in the present embodiment, carrier band 1 has：In the recess with the end 12 that the 1st face 15 opens；With through the 1st The sprocket hole 11 in the face 13 of face 15 and the 2nd, the 2nd face 13 by near the bottom of recess 12 and its peripheral part essentially without difference of height The face of (step) is constituted.

As shown in figure 1, long side direction of the multiple recesses 12 along the sheet material of banding, in the 1st face 15 being arranged in the side of 1 row Formula is equally spaced.Can be in these difference housing electronic parts of recess 12.

In addition, the global shape of electronic unit is generally in rectangular shape, in the present embodiment, as shown in Figure 1 and Figure 2, The shape of the recess 12 of housing electronic part is also in accordingly rectangular shape with the shape of electronic unit.Therefore, in this enforcement In mode, the shape during vertical view of recess 12 is rectangle shape, but can also be corresponding with the shape of the electronic unit to be received The triangular in shape, pentagon in ground, polygon-shaped or toroidal etc. as hexagon.

Additionally, it is contemplated that pick of electronic unit adsorption nozzle etc., can be in the inner peripheral surface of recess 12, along carrier band 1 Thickness direction is formed with raised line or recessed bar.

Furthermore, it is possible to be provided with difference of height in the bottom surface of recess 12.Thus, for example it is formed with end in the bottom surface of electronic unit In the case of sons etc., be prevented from the terminal contacts with the bottom surface of recess 12, therefore, it is possible to positively prevent in the defeated of carrier band 1 When giving etc., the breakage such as terminal.

In addition, as shown in Figure 1 and Figure 2, multiple sprocket holes 11 are arranged in 1 and arrange and wait in the mode parallel with multiple recesses 12 It is positioned apart from.The electronic unit being accommodated in recess 12 is being sent to electronic component packing body manufacturing machine by these sprocket holes 11 Or use during surface mounting apparatus etc..That is, in the removing method of the manufacture method and electronic unit for being applied to electronic component packing body When use.

In addition, with regard to the size of sprocket hole 11, such as in the case that the width in the short side direction of carrier band 1 is 8mm, it is put down Internal diameter Φ is preferably set to 1.5～1.6mm or so, is more preferably set as 1.5～1.55mm or so.In the minor face side of carrier band 1 To width be 4mm in the case of, its mean inside diameter Φ is preferably set to 0.76～0.84mm or so, is more preferably set as 0.78 ～0.82mm or so.Thereby, it is possible to be reliably carried out above-mentioned transmission.

In addition, multiple recesses 12 are arranged in 1 row with multiple sprocket holes 11 with the long side direction along the sheet material in banding Mode arrange.The interval being each configured is not particularly limited, for example, can be in above-mentioned long side direction, in 2 sprocket holes 11 Between be configured with the recess 12 of more than 2, it is also possible to 1 recess 12 is configured between 2 sprocket holes 11.

In addition, the carrier band 1 that electronic parts packaging material 10 possesses is resinous.Because be it is resinous, The failure welding or electricity that electronic unit occurs will not be prevented from transmission from micropowder as carrier band 1 generation paper powder itself The blocking of subassembly adsorption nozzle.In addition, the size of the fluffing being prevented from recess 12 or the recess 12 caused by moisture absorption becomes Change.Clean thereby, it is possible to fully reply, realize the raising of the stability of sealing (taping) and surface installation, productivity ratio Improve.

In addition, because being resinous, the intensity for carrying 1 is improved.Thus, even if in order to receive highly little electricity Subassembly and reduce carrier band 1 thickness in the case of, it is also possible to prevent sealing when or install when, conveying carrier band 1 when, carrier band 1 sprocket hole 11 deforms or carries 1 fracture etc..Thereby, it is possible to fully suppress conveying bad, storage stability during sealing is improved Or pick when installing, can realize sealing raising, the raising of productivity ratio of the stability installed with surface.

In addition, being not particularly limited as the resin for constituting carrier band 1, for example, can enumerate such as Merlon, polystyrene, gather Ethylene, polypropylene, polyester (polyethylene terephthalate etc.), polrvinyl chloride, polyamide, various resins as polyacetals (various thermoplastic resins), it is possible to use a kind in these is applied in combination two or more.In these, preferably use selected from poly- carbon At least one in acid esters and polystyrene.

This is because, in recent years, along with the miniaturization of electronic unit, the width for preferably using carrier band 1 be 8mm or so that The narrow carrier band of sample, also, it is preferred that using long carrier band so that in electronic unit to be accommodated in recess 12 and using cover strip 20 Can be transmitted in electronic component packing body manufacturing machine etc. when being sealed.That is, as carrier band 1, it is strongly required exploitation width Narrow and long carrier band, as a result, begin to use being by using the Merlon and/or polystyrene as the strong resin of rigidity The carrier band that the resin of main material is constituted.And, as the resin for constituting carrier band 1, using based on Merlon and/or styrene The resin of material, and then, as described later, even if surface roughness Rz of the heat sealing layer 22 possessed with cover strip 20 is (according to JIS The regulation of B 0601) it is 1.0 more than μ and heat sealing layer 22 is with the adhesive strength of resin bed comprising polysiloxane 0.3g/mm²Following cover strip 20 is combined, it is also possible to guarantee the sealing (adaptation) between heat sealing layer 22 and carrier band 1.

In addition, the electroconductive stuffing such as mixed carbon black, graphite, carbon fiber in these resins as needed.Thereby, it is possible to right Carrier band 1 gives electric conductivity, can effectively suppress to carry 1 it is powered, therefore, it is possible to the electronic unit that suppresses to be caused by electrostatic Damage.Furthermore it is possible to be added as needed on the various additives such as foaming agent, lubricant.Furthermore, it is possible in the surface shape of carrier band 1 Into the remover comprising silicone resinoid, fluorine-type resin etc. or the overlay film with electric conductivity etc..In addition, the Rotating fields of carrier band 1 can To be set to meet the single or multiple lift of these conditions.

In addition, in the present embodiment, recess 12 is formed in the 1st face 15 of carrier band 1, carries the opposition side in 1 the 1st face 15 The general planar of the 2nd face 13.That is, the 2nd face 13 by near the bottom of recess 12 and its peripheral part essentially without difference of height Face is constituted.Therefore, carrier band 1 can utilize punching to carry or suppress the sealing machine (Taping machin e) of carrier band and install Machine, uses in the same manner as punching is carried or compacting is carried.In addition, when above-mentioned carrier band 1 is conveyed on spool, due to 2nd face 13 is substantially a flat, therefore, it is possible to preventing from winding avalanche or winding lax.Deformation or lid thus, it is possible to prevent recess 12 With 20 damage.

In addition, the size of recess 12 is determined by the size of packaging electronic unit, but the size of recess 12 is being set to into D (mm), E (mm), D≤E, when the size of electronic unit is set to into X (mm), Y (mm), X≤Y, it is preferred meet 0 ＜ D-X≤0.3,0 ＜ E-Y≤0.3, more preferably 0.05≤D-X≤0.15,0.05≤E-Y≤0.15.By being in above-mentioned preferred scope, can Storage stability when raising is sealed and pick when installing, impact, dirt when being prevented from because carrying during 1 keeping or conveying The breakage of electronic unit caused by dye etc..

＜ electronic parts cover strips ＞

As shown in Figure 1 and Figure 2, cover strip 20 is in banding, fits (sealing) in the 1st face 15 of carrier band 1 so that by the recessed of carrier band 1 Opening sealing (covering) in portion 12.

The cover strip 20 is used for：In the state of electronic unit is accommodated in recess 12, carrier band 1 the side of the 1st face 15 with Carrier band 1 is engaged, and then, after being taken care of in this condition and being conveyed, is peeled off from carrier band 1, is then sprayed using electronic unit absorption Mouth etc., the electronic unit that pickup (taking-up) is contained from recess 12.

Such cover strip (cover strip of the present invention) 20, in the present invention, as shown in Figure 3, Figure 4, with substrate layer 21 and folded Heat sealing layer 22 of the layer on the substrate layer 21, using heat sealing layer 22 the 1st face 15 of carrier band 1 is sealed in as 1 side of carrier band.

(heat sealing layer)

Surface roughness Rz (according to regulation of JIS B 0601) of the heat sealing layer 22 that the cover strip 20 possesses is 1.0 μ More than, and the adhesive strength of heat sealing layer 22 and the resin bed with polysiloxane as main constituent is as 0.3g/mm²Below.

So, the surface roughness of heat sealing layer 22 is set to as the surface roughness determined according to JIS B 0601 10 mean roughness Rz are 1.0 more than μ, thereby, it is possible in the cementability (zygosity) for keeping 22 pairs of carrier bands 1 of heat sealing layer Meanwhile, heat sealing layer 22 is set as into 0.3g/mm with the adhesive strength of the resin bed with polysiloxane as main constituent²With Under.

Therefore, even if the electronic unit being accommodated in recess 12, such as light emitting diode, sealing member with poly- by having Organic siloxane is constituted for the resin of main constituent and the sealing member possesses high viscosity, is because being set to with polysiloxane The adhesive strength of the resin bed of main constituent is 0.3g/mm²Such low adhesive strength below, thus also can positively suppress or Prevent when making cover strip 20 peel off from carrier band 1, electronic unit is attached to the side of cover strip 20.It is therefore, it is possible to be formed that electronic unit is true The state being accommodated on the spot in recess 12, therefore, it is possible to more precisely using electronic unit adsorption nozzle etc. carry out electronic unit Pickup.

As long as here, surface roughness Rz of heat sealing layer 22 is 1.0 more than μ, but preferably μ of 1.0 more than μ 6.0 Hereinafter, more preferably below the μ of 1.0 more than μ 3.0.Set within the range by the size by above-mentioned surface roughness Rz, can While sealing (zygosity) to carrier band 1 is reliably kept, more reliably suppress or prevent electronic unit to be attached to heat Sealant 22.That is, can be while sealing (zygosity) to carrier band 1 be reliably kept, more reliably by heat sealing layer 22 are set as 0.3g/mm with the adhesive strength of the resin bed comprising polysiloxane²Below.

As long as in addition, heat sealing layer 22 is 0.3g/mm with the adhesive strength of the resin bed comprising polysiloxane²Below , but preferably 0.1g/mm²Hereinafter, more preferably 0.05g/mm²Below.Thus, when making cover strip 20 peel off from carrier band 1, Can more reliably suppress or prevent electronic unit to be attached to the side of cover strip 20.

In addition, heat sealing layer 22 with comprising polysiloxane resin bed adhesive strength, for example can as it is following that Sample is determined.I.e., first, by the resin bed comprising polysiloxane and heat sealing layer 22, with heat sealing layer 22 as upside In the state of overlap, the counterweight of 1kg is loaded in cover strip 20, thus engaged.Then, by giving silicone resin layer with heat The detached power of sealant 22, makes heat sealing layer 22 (cover strip 20) peel off from the resin bed comprising polysiloxane, calculates basis The viscous force that the difference of the initial load incrementss (Max values) that now measure and constant load (counterweight load) afterwards is obtained is (viscous Connecing property), as adhesive strength.

In addition, for heat sealing layer (hot sealing layer) 22, to will make electronic unit (50, Sharp Corporation's manufacture, " GM4ZR83232AE ") closely sealed heat sealing layer 22 makes 180 ° of its rotation cause at electronic unit in 65 DEG C of keepings 24 hours When the stickup of electronic unit when lower section is evaluated, preferred electronic unit survival rate is less than 40%, the more preferably ministry of electronics industry Part survival rate is less than 30%.Above-mentioned higher limit is less than by electronic unit survival rate, it may be said that positively inhibited the ministry of electronics industry Part is attached to the side of cover strip 20.

In addition, resin bed is preferably set to JIS Type A type hardness testers counts the hardness of measure as more than 20, and with Shore D The hardness that type (Shore D types) type hardness tester meter is determined is less than 70, is more preferably set in terms of JIS Type A type hardness testers and determines Hardness be more than 35, and with Shore D durometer determine hardness as less than 55.By heat sealing layer, 22 pairs have the scope The adhesive strength of the resin bed of interior hardness is in above range, can more reliably to suppress or prevent electronic unit to be attached to lid 20 sides of band.

The heat sealing layer 22 that such cover strip 20 possesses, as long as when it is 1.0 more than μ to make its surface roughness Rz, can It is set to be 0.3g/mm with the adhesive strength of the resin bed comprising polysiloxane²Below, it is possible to be made up of any resin. As the resin for constituting heat sealing layer 22, for example, can enumerate acrylic resin, polycarbonate resin, (methyl) acrylic compounds tree Fat, polythylene resin, polystyrene resins and polyester resin etc., using 1 in these resins kind or can be applied in combination 2 More than kind.In these resins, preferably with polythylene resin as main material.Thus, when carrier band 1 is for example with Merlon as main material When expecting and constituting, the sealing (adaptation) between heat sealing layer 22 and carrier band 1 can be reliably ensure that, and, making, heat is close When surface roughness Rz (according to regulation of JIS B 0601) of sealing 22 is 1.0 more than μ, can more reliably by heat sealing layer 22 are set as 0.3g/mm with the adhesive strength of the resin bed comprising polysiloxane²Below.

In addition, above-mentioned sealing refer to by cover strip 20 relative to carrier band 1 after 220 DEG C of heat-sealings for carrying out 0.015 second, according to According to JIS C-0806-3, the peel strength of the cover strip 20 when peeling off from carrier band 1 is more than 20gf, as long as being more than 20gf, But preferably more than 30gf below 50gf.Thereby, it is possible to positively prevent from being covered in the keeping and conveying of electronic component packing body Band 20 is peeled off from carrier band 1, and in the electronic unit that the pickup from recess 12 is contained, can be easily by cover strip 20 from load Band 1 is peeled off.

In addition, above-mentioned peel strength, such as can try to achieve in the following manner：By 8mm wide carrier band 1 and long side direction 500mm, width 5mm cover strip 20 after the face laminating of the side of heat sealing layer 22, according to JIS C-0806-3, finding speed is set to 300mm/min, calculates mean peel strength when cover strip 20 of sening as an envoy to is peeled off.

In addition, as polythylene resin, such as can enumerate：Such as ethylene-methyl acrylate copolymer (EMA), ethylene-the third Olefin(e) acid methacrylate copolymers (EEA), ethylene-butyl acrylate copolymer (EBA), ethylene methyl methacrylate copolymer (EMMA) ethylene as-(methyl) acrylate copolymer, vinyl-vinyl acetate copolymer (EVA), styrene-(first Base) acrylate copolymer (MS), Polyethylene Glycol and polyacrylic graft copolymer, by the block copolymerization of styrene and butadiene The ethene copolymer such as polymer (SEBS) obtained from the double bond hydrogenation of thing.By using these ethene copolymers as poly- Vinyl resins, can significantly more play the effect above.

In addition, the weight average molecular weight for constituting the resin of heat sealing layer 22 is not particularly limited, preferably 6,000～700, 000 or so, more preferably 10,000～500,000 or so.When the weight average molecular weight of the resin for constituting heat sealing layer 22 is above-mentioned During scope, it is possible to increase the film property of heat sealing layer 22, and the sealing between heat sealing layer 22 and carrier band 1 can be reliably ensure that Property (adaptation).

In addition, constituting the weight average molecular weight of the resin of heat sealing layer 22, for example, survey using GPC (gel permeation chromatography) It is fixed.

In addition, heat sealing layer 22, can for the adhesive strength of the silicone resin layer comprising polysiloxane and With carrier band 1 resin of binding property do not have undesirable effect in the range of, addition cohesiveness adjustment resin, cohesive adjustment resin Deng.

As long as cohesive adjusts resin, the resin to adjust cohesive is just not particularly limited, preferred alkenes class tree Fat, wherein further preferred polyvinyl resin, for example can enumerate Low Density Polyethylene, medium density polyethylene, high density polyethylene (HDPE), Straight-chain Low Density Polyethylene etc..Especially for the compatibility improved with resin of binding property, preferred density is 900g/m³Above and Less than 920g/m³, fusing point be 100 DEG C less than 120 DEG C, MFR be 1.0g/10min less than 5g/10min.

Cohesiveness adjustment resin is used for：When cover strip 20 is peeled off from carrier band 1, by adjusting heat sealing layer (hot sealing layer) 22 Cohesion destruction, carrier band 1 is can be easily separated with cover strip 20.

Resin is adjusted as the cohesiveness, as long as the resin to adjust cohesion destruction is just not particularly limited, preferably Styrene resin, for example, can enumerate polystyrene, styrene butadiene styrene block copolymer (SBS) (SBS), styrene-second Alkene-butadiene-styrene block copolymer (SEBS), styrene isoprene styrene block copolymer (SIS) (SIS), benzene second Alkene-ethylene-propylene, Styrene block copolymer (SEPS), styrene-methylacrylate copolymer, styrene-t Methyl terpolymer, hydrogenated styrene block copolymers etc..From from the viewpoint of the transparency, particularly preferred styrene-methyl propylene Sour methyl terpolymer, hydrogenated styrene block copolymers.Cohesiveness adjusts resin relative to composition heat sealing layer (hot sealing layer) 22 Resin combination, more than preferably 5 weight % below 60 weight %, more than more preferably 10 weight % below 50 weight %. More than for lower limit, the effect for being susceptible to condense destruction is obtained in that, below for higher limit, is obtained in that and do not hinder Hinder the effect of cohesive.

Heat sealing layer 22 can also include antistatic resin.Antistatic resin is not particularly limited, for example, include：Polyethers/poly- Olefin copolymer, polyetheresteramide block's copolymer, the methacrylate copolymer containing quaternary ammonium base, the maleoyl containing quaternary ammonium base Imine copolymer, Sodium Polystyrene Sulfonate etc..Wherein preferred, polyethers/polyolefin copolymer.Polyethers/polyolefin copolymer it is anti-quiet Electrical property is high, transparent excellent after baking, might as well with the Combination of resin of binding property.By including antistatic resin, can Give electric conductivity.By giving electric conductivity, it is prevented from the electrostatic due to producing when peel-off covers are with 20 and causes electronic unit It is attached to the bad situation of powered cover strip 20 and the damage of the electronic unit caused by static discharge.It is preferred that antistatic resin It is more than 10 mass % below 40 mass % relative to the resin combination for constituting heat sealing layer (hot sealing layer) 22.

In addition, the thickness of heat sealing layer 22 is preferably less than more than 1 μm 15 μm, more preferably less than more than 5 μm 13 μm.By This, can be set as 1.0 more than μ by surface roughness Rz of heat sealing layer 22, can make the heat with surface roughness Rz Sealant 22 has the sealing (adaptation) to carrier band 1, and can be by the heat sealing layer 22 with surface roughness Rz It is set as 0.3g/mm with the adhesive strength of the silicone resin layer comprising polysiloxane²Below.

(substrate layer)

As long as in addition, substrate layer 21 with can bear band plus man-hour or to carry heat-sealing when etc. applying external force Mechanical strength, thermostability when can bear heat-sealing, it becomes possible to according to obtained from purposes is suitably used the various materials of processing Thin film.

Specifically, as the example of base material layer film material, polyethylene terephthalate can be enumerated, is gathered to benzene It is dioctyl phthalate butanediol ester, PEN, nylon 6, nylon66 fiber, polypropylene, polymethylpentene, polrvinyl chloride, poly- Acrylate, polymethacrylates, polyimides, Polyetherimide, polyarylate, polysulfones, polyether sulfone, polyphenylene oxide, poly- carbonic acid Ester, ABS resin etc..For improve mechanical strength, preferred polyethylene terephthalate, nylon 6, nylon66 fiber etc..In addition, More than 2 layers that are selected from the resin for illustrating of laminated body can be used as substrate layer 21.

The weight average molecular weight for constituting the resin of substrate layer 21 is not particularly limited, and preferably 8,000～1,000,000 is left The right side, more preferably 8,500～950,000 or so.It is set in by the weight average molecular weight of the resin by substrate layer 21 is constituted above-mentioned In the range of, substrate layer 21 can be made to possess excellent flexibility.

In addition, constituting the weight average molecular weight of the resin of substrate layer 21, for example, survey using GPC (gel permeation chromatography) It is fixed.

Substrate layer 21 can also use unstretched film, but preferably use edge to improve the overall mechanical strength of cover strip Single shaft direction or the thin film of biaxially oriented stretching.Especially, more preferably comprising in biaxially stretched polyester and biaxial stretch-formed polypropylene Wantonly more than 1.

In addition, the thickness of substrate layer 21 is preferably less than more than 7 μm 30 μm, more preferably less than more than 10 μm 25 μm.By This, can make substrate layer 21 possess excellent flexibility.When the thickness of substrate layer 21 is below above-mentioned higher limit, the rigidity of cover strip Will not become too high, even if in the case that the carrier band 1 after to heat-sealing applies distorting stress, cover strip 20 can also follow carrier band 1 Deformation, peeling-off probability is few.In addition, when the thickness of substrate layer 21 is more than above-mentioned lower limit, the machinery of cover strip 20 Intensity becomes suitable, and cover strip 20 ruptures when the high speed when the electronic unit being accommodated in recess 12 is taken out can be suppressed to peel off Problem.

In addition, substrate layer can contain antistatic additive, slip agent and antiblocking agent not damaging in the range of its characteristic.

In addition, such cover strip 20 preferably has light transmission (transparency).Thus, by cover strip 20 from 1 stripping of carrier band Before, it is also possible to confirm the state in recess 12 through cover strip 20, for example, whether there is the receiving state of housing electronic part, electronic unit Deng.

In addition, with regard to the degree of the light transmission, specifically, the full light transmittance of JIS K 7361-1 regulations is preferably More than 80%, more preferably more than 85%.

In addition, the mist degree (according to the regulation of JIS K 7136) of cover strip 20 is preferably less than 70%, more preferably 30% with Under.

By the way that the full light transmittance of cover strip 20 and mist degree are set within the above range, can be more reliable through cover strip 20 Ground confirms (visually confirm) state in recess 12.

＜ electronic component packing body ＞

In the recess 12 of the electronic parts packaging material 10 that electronic unit is accommodated in involved by present embodiment, then Cover strip 20 is engaged with carrier band 1 in the way of recess 12 is capped, is derived from being received in electronic parts packaging material 10 There is the electronic component packing body (electronic component packing body of present embodiment) of electronic unit.

That is, the electronic component packing body of present embodiment, for example, possess：Carrier band 1, the carrier band 1 is in a face (the 1st face 15) With can housing electronic part recess 12；The electronic unit being incorporated in recess 12；With electronic parts cover strip 20, The electronic parts cover strip 20 will be accommodated with electronic unit by will carry 1 sealing in a face (the 1st face 15) side Recess 12 is covered.

In addition, carrier band 1 is generally carried out with the engagement of cover strip 20 by heat-sealing.Heat-sealing uses sealer along the length of cover strip 20 The each edge in side is carried out.

In addition, electronic unit is the size of the degree that can be accommodated in the recess 12 of carrier band 1, for example, can enumerate resistance, electricity Container, light emitting diode, semiconductor element (semiconductor chip), possess semiconductor package body of the semiconductor element etc., but electricity Subassembly packaging packaging material 10 is especially preferred for use in the light emitting diode received as electronic unit.

Generally, the sealing member of light emitting diode is by the resin (silicone seal comprising polysiloxane with high viscosity Part) constitute.

The cover strip 20 of present embodiment is low relative to the adhesive strength of silicone seal.Therefore, even if by light emitting diode In being accommodated in recess 12, when making cover strip 20 peel off from carrier band 1, it is also possible to positively suppress or prevent electronic unit to be attached to lid 20 sides of band.

In addition, the electronic parts packaging material 10 and electronic component packing body, using the 2nd face 13 as spool (core) side It is wound, and is taken care of and conveyed.Thereby, it is possible to realize that electronic parts packaging material 10 and electronic component packing body exist Space saving during keeping and when conveying.

Second embodiment

Hereinafter, to second embodiment electronic parts cover strip, electronic parts packaging material and electronic unit Package body is illustrated.

The electronic parts cover strip of this second embodiment, electronic parts packaging material and electronic component packing Body, the electronic parts cover strip, electronic parts packaging material and electronic component packing body with above-mentioned first embodiment, Electronic parts cover strip is different.

＜ electronic parts cover strips ＞

Electronic parts cover strip 20 involved by present embodiment possesses：Substrate layer 21；With heat sealing layer 22, the heat Sealant 22 is arranged on a face of substrate layer 21, and comprising resin of binding property.

And, cover strip 20 by (μ₅₀-μ₂₀₀)/(N₂-N₁) × 1000 represent confficient of static friction variable quantity be 3.0 with Under.

Here, μ₅₀For load N₁(50g) confficient of static friction on the surface of heat sealing layer 22 when, μ₂₀₀For load N₂(200g) When the surface of heat sealing layer 22 confficient of static friction.

In addition, in cover strip 20, the Vicat softening point of the resin of binding property in heat sealing layer 22 is 30 DEG C less than 70 ℃。

It is below above-mentioned higher limit, and to make heat seal by the variable quantity for making the above-mentioned confficient of static friction of heat sealing layer 22 The Vicat softening point of the resin of binding property in layer 22 is in above range, the heat sealability to carrier band 1 can be made good, and is realized Prevent the cover strip 20 that electronic unit tack is excellent.

In addition, in the cover strip 20 involved by present embodiment, heat sealing layer 22 is provided in a face of substrate layer 21 Layer.The surface of the heat sealing layer 22 is located at the side contacted with carrier band 1.

In addition, as shown in Figure 1 and Figure 2, cover strip 20 is, for example, banding, by opening sealing (covering) of the recess 12 of carrier band 1 Mode, fitted (sealing) in the 1st face 15 of carrier band 1 using.

Cover strip 20 is used for：In the state of electronic unit is accommodated in recess 12, in the side of the 1st face 15 of carrier band 1 and load Band 1 is engaged, and then, after being taken care of in this condition and being conveyed, is peeled off from carrier band 1, then using electronic unit adsorption nozzle Deng the electronic unit that pickup (taking-up) is contained from recess 12.

Such cover strip 20, in the present embodiment, as shown in Figure 3, Figure 4, with substrate layer 21 and being stacked in the base material Heat sealing layer 22 on layer 21, heat sealing layer 22 is sealed as 1 side of carrier band in the 1st face 15 of carrier band 1.

According to the research of the present inventor, specify that：Carrying method according to electronic component packing body etc., electronic unit can be attached In the face of the carrier band side of the cover strip with cementability, when making cover strip peel off from carrier band, electronic unit is not attached in recess And cover strip is attached to, as a result, electronic unit adsorption nozzle pickup electronic components from recess cannot be utilized exactly.

Especially specify that：When the situation using the electronic unit that the sealing member as light emitting diode etc. is silicone seal Under, sealing member possesses high viscosity, as a result, the problems referred to above point can significantly be seen.

The present inventor has made intensive studies to solve above-mentioned technical problem.As a result, being found that by improving cover strip Heat sealing layer in resin of binding property softening point, can be effectively prevented electronic unit attachment.But, although can be effective Prevent electronic unit from adhering to, but on the other hand the heat sealability to carrying is deteriorated.

That is, the present inventor specify that：There is this between the low tack to the heat sealability for carrying and to electronic unit to disappear The relation of that length, the shifting relation only cannot be changed by the softening point of the resin of binding property in adjustment heat sealing layer It is kind.

According to the confirmation of the present inventor, in conventional cover strip, the variable quantity of the confficient of static friction on heat sealing layer surface surpasses Cross above-mentioned higher limit.That is, the state on heat sealing layer surface changes easily by the contact with electronic unit.Therefore, the present invention People thinks the attachment for being susceptible to electronic unit.

That is, the cover strip 20 involved by present embodiment, the change of the confficient of static friction on the surface of heat sealing layer as described above 22 The Vicat softening point of the resin of binding property in amount and heat sealing layer 22 meets specific condition.By making the surface of heat sealing layer 22 The variable quantity of confficient of static friction is below above-mentioned higher limit, can to make to prevent electronic unit tack good.In addition, by making heat The Vicat softening point of the resin of binding property in sealant 22 is in above range, the heat sealability to carrying can be made good.

In the cover strip 20 involved by present embodiment, the variable quantity of the confficient of static friction on the above-mentioned surface of heat sealing layer 22 For less than 3.0, but it is preferably more than -2.0 less than 2.5, less than 2.0 more preferably more than -1.5.By making heat sealing layer The variable quantity of the confficient of static friction on 22 surfaces is below above-mentioned higher limit, can to make to prevent electronic unit tack better. In addition, the variable quantity of the confficient of static friction by making the surface of heat sealing layer 22 is more than above-mentioned lower limit, can further press down Winding skew under reeling condition processed etc..

In addition, confficient of static friction, such as can use A＆D Company, the TENSILON universal materials examination of Limited manufactures Test machine (ProductName：RTF-1250), it is measured according to JIS K7125.

In addition, in the cover strip 20 involved by present embodiment, the dimension card of the resin of binding property in heat sealing layer 22 softens Put as 30 DEG C less than 70 DEG C, but preferably less than more than 35 DEG C 65 DEG C, more preferably less than more than 40 DEG C 60 DEG C.Pass through The Vicat softening point for making the resin of binding property in heat sealing layer 22 is more than above-mentioned lower limit, can to make to prevent electronic unit from adhering to Property is better.In addition, the Vicat softening point of the resin of binding property in by making heat sealing layer 22 is less than above-mentioned higher limit or is Below above-mentioned higher limit, the heat sealability to carrying can be made better.

In addition, the Vicat softening point of the resin of binding property in heat sealing layer 22 can be determined according to JIS K7206.

Cover strip 20 involved by present embodiment, even for containing the Merlon or polyphenyl as the strong resin of rigidity The carrier band 1 of ethylene, it is also possible to sealed at low temperature.Even if implementing baking in the state of cover strip 20 to be heat-sealed in carrier band 1 Process, electronic unit will not also be attached to cover strip 20, even and if carry out baking process, also maintain to fill using sensor etc. Carry out the transparency of the identification of electronic unit or the degree of inspection Check with dividing.

The variable quantity of the confficient of static friction of the heat sealing layer 22 of the cover strip 20 involved by present embodiment, can be by appropriate The species of each composition or the manufacture method of mixing ratio and cover strip 20 that constitute heat sealing layer 22 are adjusted being controlled.

In the present embodiment, as the factor for being controlled to the variable quantity of above-mentioned confficient of static friction, especially may be used Enumerate and properly select the resin of binding property or cohesiveness adjustment resin for constituting heat sealing layer 22, cohesive adjustment resin, anti-quiet The species of electric resin, or the surface roughness of adjustment heat sealing layer 22 etc..The surface roughness of heat sealing layer 22, for example, can pass through The rough surface face of heat sealing layer 22 is made using the roller for possessing projection when by 22 masking of heat sealing layer to be adjusted.

Cover strip 20 involved by present embodiment, in load N₁(50g) confficient of static friction on the surface of heat sealing layer 22 when μ₅₀Preferably less than more than 0.5 3.0, more preferably less than more than 1.0 2.5.

By the confficient of static friction μ for making the surface of heat sealing layer 22₅₀In above range, to make to prevent electronic unit from adhering to Property is better.

Even if the electronic unit being accommodated in recess 12, for example, the sealing of electronic unit is constituted as light emitting diode etc. Part is made up of silicone seal and the sealing member possesses high viscosity, and the cover strip 20 of present embodiment is because to silicone seal Adhesive strength is low, so also can positively suppress or prevent when making cover strip 20 peel off from carrier band 1, electronic unit is attached to lid 20 sides of band.Therefore, it is possible to form the state being positively accommodated in electronic unit in recess 12, therefore, it is possible to higher precision land productivity The pickup of electronic unit is carried out with electronic unit adsorption nozzle etc..

In addition, in the cover strip 20 involved by present embodiment, the arithmetic average height (Sa) on the surface of heat sealing layer 22 is excellent Elect less than more than 0.4 μm 0.7 μm as.Thereby, it is possible to more reliably suppressing or preventing when making cover strip 20 peel off from carrier band 1, electricity Subassembly is attached to the side of cover strip 20.

In addition, the arithmetic average height (Sa) on the surface of heat sealing layer 22, such as can use Ry oka Systems Inc. systems White interferometer (the ProductName made：VertScan (registered trade mark)), it is measured according to ISO-25178.

The width of the cover strip 20 involved by present embodiment is preferably more than 1mm below 100mm, more preferably 2mm Below above 80mm, most preferably more than 2mm below 50mm.

Cover strip 20 involved by present embodiment preferably has light transmission (transparency).Thus, by cover strip 20 from carrier band 1 Before stripping, it is also possible to confirm the state in recess 12 through cover strip 20, such as whether there is the receipts of housing electronic part, electronic unit Receive state etc..

In addition, with regard to the degree of the light transmission, specifically, the full light transmittance determined according to JIS K 7361-1 is excellent Elect more than 80%, more preferably more than 85% as.

In addition, the mist degree (according to the regulation of JIS K 7136) of cover strip 20 is preferably less than 70%.

The thickness of cover strip 20 is not particularly limited, but preferably less than more than 20 μm 100 μm, more preferably more than 36 μm 60 Below μm.By in preferred scope, it is possible to increase operability.

Hereinafter, each layer to constituting the cover strip involved by present embodiment is illustrated.

(heat sealing layer)

Heat sealing layer 22 is preferably made up of the resin combination containing resin of binding property.

Resin of binding property is used to be made carrier band 1 bond with cover strip 20 by the way that carrier band 1 is sealed with cover strip 20.As viscous Conjunction property resin, as long as being the resin that cohesive is shown to carrier band 1, is just not particularly limited, but from the sight for making adaptation better Point consideration, preferably comprises the resin of binding property containing (methyl) acryloyl group.

It is not particularly limited as the resin of binding property containing (methyl) acryloyl group, but preferably with containing (methyl) propylene The thermoplastic elastomer (TPE) of acyl group is the resin of main constituent, and further preferably the thermoplastic elastomer (TPE) of (methyl) acryloyl group is ethylene Analog copolymer.Thus, the flexibility of cover strip 20 becomes better.As above-mentioned ethene copolymer, ethylene-acrylic acid can be enumerated Copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl acrylate copolymer, ethylene methyl methacrylate copolymer, Ethylene-ethyl acrylate copolymer, ethylene-ethyl methacrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-first Base butyl acrylate copolymer etc..Wherein, particularly preferred ethylene-methyl acrylate copolymer.

The containing ratio of (methyl) acryloyl group of the resin of binding property containing (methyl) acryloyl group is preferably 10 mass % Below mass % of the above 40, more than more preferably 12 mass % below 30 mass %.It is in the containing ratio of (methyl) acryloyl group In the case of more than above-mentioned lower limit, the softening temperature step-down of heat sealing layer 22, carrier band 1 becomes better with the cohesive of cover strip 20 It is good.On the other hand, in the case that the containing ratio in (methyl) acryloyl group is below above-mentioned higher limit, heat sealing layer 22 on the contrary Softening temperature uprise, can more effectively suppress to be accommodated in the attachment of the electronic unit in carrier band and cover strip 20.

Here, the containing ratio of (methyl) acryloyl group, such as can be measured according to Du Pont process or Japanese polyethylene process.

The ratio of resin of binding property relative to constitute heat sealing layer 22 resin combination integrally be preferably 30 mass % with Below upper 80 mass %, more than more preferably 40 mass % below 70 mass %.More than for above-mentioned lower limit, can more have Effect ground obtains the effect that the cohesive to carrier band 1 is improved.On the other hand, by below for above-mentioned higher limit, can be more effectively Acquisition prevents the cut-off effect of cover strip 20 when cover strip 20 is peeled off at a high speed from carrier band 1.

In addition, constitute heat sealing layer 22 resin weight average molecular weight, preferably with above-mentioned first embodiment in weight Average molecular weight identical scope.

In addition, the resin combination of heat sealing layer 22 is constituted, can be for the tack to electronic unit and to carrier band 1 Heat sealability do not have undesirable effect in the range of, also containing cohesiveness adjustment resin, cohesive adjustment resin etc..

Cohesive adjusts resin and cohesiveness adjustment resin and can use and the resin used in above-mentioned first embodiment Identical resin.

The ratio of cohesiveness adjustment resin is relative to the resin combination entirety for constituting heat sealing layer 22, preferably 5 matter Below amount mass % of more than % 50, more than more preferably 10 mass % below 40 mass %.More than for above-mentioned lower limit, energy It is enough to obtain the effect for being susceptible to condense destruction, below for above-mentioned higher limit, it is obtained in that the effect for not hindering cohesive.

Heat sealing layer 22 can also include antistatic resin.Antistatic resin can be used and made in above-mentioned first embodiment Resin identical resin.

The ratio of antistatic resin relative to constitute heat sealing layer 22 resin combination entirety, preferably 5 mass % with Below upper 40 mass %.More than more preferably 10 mass % below 30 mass %.

The thickness of heat sealing layer 22 is preferably less than more than 1 μm 15 μm, more preferably less than more than 5 μm 13 μm.

In addition, as it was previously stated, the variable quantity of the confficient of static friction of heat sealing layer 22 is in specific scope.In order to meet this Point, can adjust resin, cohesive adjustment tree by properly selecting the resin of binding property of above-mentioned heat sealing layer 22, cohesiveness Fat, the species of antistatic resin and the surface roughness of heat sealing layer 22 is suitably set realizing.

(substrate layer)

Substrate layer 21 can be used and the substrate layer identical substrate layer in above-mentioned first embodiment.

The thickness of the substrate layer 21 in present embodiment is preferably less than more than 7 μm 50 μm, more preferably more than 10 μm 30 μ Below m.Thereby, it is possible to make the flexibility of substrate layer 21 better.When the thickness of substrate layer 21 is below above-mentioned higher limit, cover strip 20 rigidity will not become too high, even if in the case that the carrier band 1 after to heat-sealing applies distorting stress, cover strip 20 also can be followed The deformation of carrier band 1, peeling-off probability is few.In addition, when the thickness of substrate layer 21 is more than above-mentioned lower limit, cover strip 20 Mechanical strength become better, the high speed when the electronic unit that will be accommodated in recess 12 takes out can be suppressed to cover when peeling off Band 20 ruptures.

(intermediate layer)

Cover strip 20 involved by present embodiment, can be provided with intermediate layer between substrate layer 21 and heat sealing layer 22 (not shown).The intermediate layer can improve the resiliency of the entirety of cover strip 20, and the cover strip 20 when improving sealing is closely sealed with carrier band 1 Property.

As the resin for constituting intermediate layer, for example, can enumerate olefine kind resin, styrene resin, cyclic olefin tree Fat.Preferred alkenes resinoid among these.By using olefine kind resin, the effect for improving adaptation can be reliably obtained.

In order to reliably obtain the effect for improving adaptation, the thickness in intermediate layer is preferably 10～50 μm, and more preferably 15 ～30 μm.

(adhesive layer)

Cover strip 20 can between the layers be provided with adhesive layer (not shown).By arranging the adhesive layer, it is possible to increase each Cohesive between layer.

As the resin for constituting adhesive layer, for example, can enumerate the dry lamination layer binder resin or knot of carbamatess Layer binder resin is closed, typically can be enumerated the polymer blends such as PEPA, polyether polyol and isocyanate compound Resin obtained from combination.

More than, embodiments of the present invention are described, but these are the illustration of the present invention, may also be employed above-mentioned Various compositions in addition.

For example, in present embodiment in cover strip 20, electronic parts packaging material 10, electronic component packing body, can be by Each structure is substituted for the arbitrary structures that can play identical function, or can additional arbitrary structures.

In addition, in the above-described embodiment, the carrier band possessed to electronic parts packaging material has multiple recesses Situation is illustrated, but is not limited to the situation, and it can also be 1 to carry the recess having.

Embodiment

Hereinafter, according to embodiment, more specifically the present invention will be described.

[embodiment 1]

Using as the Elvaloy AC1820 of resin of binding property (ethylene-methyl acrylate copolymer, (methyl) acrylate Base 20%, Du Pont-Mitsui Polychemicals Co., L td. manufacture) 60 parts, adjust resin as cohesiveness Estyrene MS-600 (styrene-(methyl) methyl acrylate copolymer, Nippon Steel Chemical Co., Ltd (Nippon Steel Che mical Co., Ltd.s) manufacture) 20 parts and as antistatic resin Pelestat 212 (PP-P EG block copolymers, Sanyo Chemical Industries, Ltd. (Sanyo Chemical Industries, Ltd.) manufactures) 20 parts utilize double screw extruder Kneaded, obtained the resin combination for constituting heat sealing layer.

In PET film (Fang Ji Co., Ltd. of Japan (To yobo Co., Ltd.) system of 16 μm of the thickness as substrate layer Make, E5102) on, using as the Low Density Polyethylene in intermediate layer (Sumitomo Chemical Co (Sumitomo Chemical Co, Ltd.) manufacture, Sumikathe ne L705) it is fabricated to 20 μm of thickness at 300 DEG C of extrusion temperature using extrusion laminating Film.

Then, making on the intermediate layer of film, further utilizing the resin combination of above-mentioned composition heat sealing layer Extrusion laminating is fabricated to the film of 5 μm of thickness as heat sealing layer at 300 DEG C of extrusion temperature, obtains the cover strip of embodiment 1.

In addition, when by heat sealing layer film forming, using the chill roll for possessing projection of 3.5 μm of surface roughness to flatness layer Surface implement matsurface.

[embodiment 2]

When by heat sealing layer film forming, using table of the chill roll for possessing projection of 4.5 μm of surface roughness to flatness layer Face implements matsurface, in addition, operates similarly to Example 1, obtains the cover strip of embodiment 2.

[embodiment 3]

When by heat sealing layer film forming, using table of the chill roll for possessing projection of 5.5 μm of surface roughness to flatness layer Face implements matsurface, in addition, operates similarly to Example 1, obtains the cover strip of embodiment 3.

[comparative example 1]

When by heat sealing layer film forming, using table of the chill roll for possessing projection of 2.4 μm of surface roughness to flatness layer Face implements matsurface, in addition, operates similarly to Example 1, obtains the cover strip of comparative example 1.

[comparative example 2]

To the cover strip made in comparative example 1, by the acrylic compounds of the silicon dioxide of 2 μm of the mean diameter comprising 15wt% Binding agent to become 1 μm of thickness in the way of be coated in the surface of heat sealing layer, in addition, operate in the same manner as comparative example 1, Obtain the cover strip of comparative example 2.

[comparative example 3]

When by heat sealing layer film forming, using table of the chill roll for possessing projection of 8.0 μm of surface roughness to flatness layer Face implements matsurface, in addition, operates similarly to Example 1, obtains the cover strip of comparative example 3.

The cover strip of each embodiment and each comparative example is evaluated using following methods.

Measure ＞ of the surface roughness of ＜ heat sealing layers

Using ultra-deep measuring shape microscope (KEYENCE CORPORATION are manufactured, " VK9700 "), according to JIS B 0601, determine surface roughness Rz and Sm of the heat sealing layer that the cover strip of each embodiment and each comparative example possesses.

The full light transmittance ＞ of ＜ cover strips

Using spectrophotometer (JASCO Corporation are manufactured, " N-670 "), according to JIS K 7361-1, determine The full light transmittance of the cover strip of each embodiment and each comparative example.

The mist degree ＞ of ＜ cover strips

Using spectrophotometer (JASCO Corporation are manufactured, " N-670 "), according to JIS K 7136, determine each The mist degree of the cover strip of embodiment and each comparative example.

Measure ＞ of the bonding strength of ＜ heat sealing layers

First, silicone resin layer is formed on the pedestal of 60mm × 60mm sizes, then, with the silicone resin layer and each reality Apply the mode that the heat sealing layer that the cover strip (26mm × 76mm) of example and each comparative example possesses overlaps cover strip to be configured on pedestal Afterwards, the counterweight of 1k g is loaded in cover strip, thus silicone resin layer is engaged with heat sealing layer.

Then, by giving silicone resin layer power detached with heat sealing layer, heat sealing layer (cover strip) is made from silicone resin Layer is peeled off, and determines the initial load incrementss (Max values) and constant load (counterweight load) afterwards for now obtaining.

Then, viscous force is calculated as bonding strength (adhesive strength), above-mentioned viscous force is obtained load incrementss The difference of (Max values) and constant load (counterweight load).

In addition, the silicone resin layer formed on pedestal contains polysiloxane, determined using Shore D durometer Hardness is 60.

High-speed sealing ＞s of the ＜ to carrier band

The carrier band and each embodiment of the polycarbonate resin after being sealed at 220 DEG C are determined according to JIS C0806-3 With the peel strength of the cover strip of each comparative example, the low temperature seal to PC (Merlon) have rated according to the peel strength.

That is, in the case where peel strength is more than 20g, qualified (zero) will be evaluated as to the heat sealability of PC, it is strong peeling off Degree will be evaluated as unqualified (×) less than in the case of 20g to the heat sealability of PC.

Here, peel strength is determined using following methods.

By the conductive PC (Merlon) of width 8mm and width 5mm and long side direction for 500mm cover strip in heat sealing layer Face laminating, using 2 row 0.5mm width, 54mm length sealing flatiron, sealed according to following heat seal conditions.

＜ heat seal conditions ＞

Heat-sealing temperature：Each heat-sealing temperature

Heat-sealing flatiron compressing time：0.020 second/1 time

Heat-sealing flatiron compression number：13 times

Heat-sealing flatiron pressing load：4.0kgf

Heat seal width：0.5mm × 2 arrange

Using the method according to JIS C-0806-3, the peel strength by sample obtained from above-mentioned heat-sealing is determined.Separately Outward, finding speed is set to 300mm/min, calculates mean intensity.

＜ electronic units stickup property ＞

To by the electronic unit (50) closely sealed with heat sealing layer (hot sealing layer) was in 65 DEG C of keepings 24 hours and rotated it 180 ° so that the stickup of electronic unit when electronic unit is below is evaluated.Here, using Sharp Corporation The GM4ZR83232A E of manufacture are used as electronic unit.

In the case where electronic unit survival rate is less than 40%, the stickup of electronic unit is evaluated as into qualified (zero), In the case that electronic unit survival rate is more than 40%, the stickup of electronic unit is evaluated as unqualified (×).

Following tables 1 will be shown in using the evaluation result of the cover strip of each embodiment and each comparative example that obtain with upper type.

[table 1]

As shown in table 1, the cover strip of each embodiment, surface roughness Rz of heat sealing layer is 1.0 more than μ, and heat sealing layer It is 0.3g/mm with the adhesive strength of silicone resin layer²Hereinafter, thereby is achieved while meeting high-speed sealing and part stickup property Result.

And the cover strip of comparative example, surface roughness Rz and heat sealing layer of heat sealing layer and the adhesive strength of silicone resin layer In either one be unsatisfactory for above-mentioned relation, therefore become and be unsatisfactory for the knot of either one that high-speed sealing and part are pasted in property Really.

[embodiment 4]

First, 25 μm of the thickness as substrate layer Biaxially oriented polyester film (Fang Ji Co., Ltd. of Japan manufacture E5102, hereinafter also referred to " PET film ") a face apply conducting polymer (Arakawa Chemical Industries, Ltd. (Arakawa Chemical Industries, Ltd.) manufacture, Aracoat AS-625) and be dried.

Then, on another face of PET film, using extrusion laminating, using as the Low Density Polyethylene in intermediate layer (Sumitomo Chemical Co manufacture, Sumikathene L705) is fabricated to the film of 25 μm of thickness at 300 DEG C of extrusion temperature.

Then, making on the intermediate layer of film, using as the styrene-methylmethacrylate copolymer of heat sealing layer (the Estyrene MS-600 of Nippon Steel Chemical Co., Ltd's manufacture) 15 mass %, ethylene-methyl acrylate copolymer (Du The Elvaloy AC 1820 of Pont-Mitsui Polychemicals C o., Ltd. manufacture, the containing ratio of acryloyl group：20 Quality %) 65 mass %, polyethers/polyolefin copolymer (Sanyo Chemical Industries, Ltd. manufacture, Pelestat212, below Referred to as " PEG-PO ") mixture of 20 mass % is fabricated to the film of 10 μm of thickness at 280 DEG C of extrusion temperature, obtains embodiment 4 cover strip.

In addition, silicone rubber pad roller (mat roll) is pressed against into surface with pressure 0.2MPa when by heat sealing layer film forming On the chill roll for possessing projection that 5.5 μm of roughness, the matsurface of heat sealing layer is thus implemented.

[embodiment 5]

When by heat sealing layer film forming, using 6.5 μm of the chill roll for possessing projection of surface roughness, by silicone rubber pad The pressure of roller is set to 0.2MPa and implements matsurface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 5.

[embodiment 6]

When by heat sealing layer film forming, using 4.5 μm of the chill roll for possessing projection of surface roughness, by silicone rubber pad The pressure of roller is set to 0.2MPa and implements matsurface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 6.

[embodiment 7]

When by heat sealing layer film forming, using 5.5 μm of the chill roll for possessing projection of surface roughness, by silicone rubber pad The pressure of roller is set to 0.15MPa and implements matsurface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 7.

[embodiment 8]

When by heat sealing layer film forming, using 4.5 μm of the chill roll for possessing projection of surface roughness, by silicone rubber pad The pressure of roller is set to 0.15MPa and implements matsurface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of embodiment 8.

[comparative example 4]

When by heat sealing layer film forming, using 2.5 μm of the chill roll for possessing projection of surface roughness, by silicone rubber pad The pressure of roller is set to 0.2MPa and implements matsurface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of comparative example 4.

[comparative example 5]

When by heat sealing layer film forming, using 3.5 μm of the chill roll for possessing projection of surface roughness, by silicone rubber pad The pressure of roller is set to 0.2MPa and implements matsurface to the surface of heat sealing layer, in addition, grasps similarly to Example 4 Make, obtain the cover strip of comparative example 5.

[comparative example 6]

Using ethylene-methyl acrylate copolymer, (Du Pont-Mitsui Polychemicals C o., Ltd. are manufactured Elvaloy AC 1609, the containing ratio of acryloyl group：9 mass %) replace ethylene-methyl acrylate copolymer (Du Pont- The Elvaloy AC 1820 of Mitsui Polychemicals Co., Ltd.s manufacture, the containing ratio of acryloyl group：20 matter Amount %), when by heat sealing layer film forming, using 2.5 μm of the chill roll for possessing projection of surface roughness, by silicone rubber pad roller Pressure be set to 0.2MPa matsurface implemented to the surface of heat sealing layer, in addition, operate similarly to Example 4, Obtain the cover strip of comparative example 6.

The cover strip of each embodiment and each comparative example is evaluated using following methods.By each embodiment and each comparative example The evaluation result of cover strip be shown in table 2.

The Vicat softening point ＞ of the resin of binding property in ＜ heat sealing layers

According to JIS K7206, it is determined using following conditions.

Arithmetic average height (Sa) ＞ on ＜ heat sealing layers surface

White interferometer (the ProductName manufactured using Ryoka Systems Inc.：VertScan (registered trade mark)), according to According to ISO-25178, it is determined using following conditions.

(condition determination)

Determine and implement 5 times, using its meansigma methods.Determine and implement in the environment of 23 ± 2 DEG C, humidity 50 ± 6%R H.

The confficient of static friction ＞ on ＜ heat sealing layers surface

Using A＆D Company, the TENSILON universal testing machine (ProductNames of Limited manufactures：RTF-1250), According to JIS K7125, it is determined using following conditions.Each Specimen Determination 5 times, using its meansigma methods as static friction Coefficient.

(condition determination)

23 ± 2 DEG C of ambient temperature, 50 ± 6%RH of ambient humidity, peeling rate 100mm/min

Here, by load N₁(50g) confficient of static friction on heat sealing layer surface when is set to μ₅₀, by load N₂(200g) when The confficient of static friction on heat sealing layer surface be set to μ₂₀₀, calculate by (μ₅₀-μ₂₀₀)/(N₂-N₁The static friction that) × 1000 represent The variable quantity of coefficient.

The full light transmittance ＞ of ＜ cover strips

The mist degree ＞ of ＜ cover strips

Heat sealability ＞s of the ＜ to carrier band

＜ electronic units (light emitting diode) stickup property ＞

Employ and the assay method identical assay method in above-described embodiment 1～3 and comparative example 1～3.

The stickup ＞ of the electronic unit after ＜ bakings

The cover strip for being obtained is cut into after 5.5mm width, by electronic unit, (Sharp Corporation manufactures GM4ZR83232AE the carrier band (NIPPO CORPORATION manufactures) of the wide Merlon of 8mm) is inserted, in heat-sealing temperature 180 Cover strip is carried out into heat-sealing at DEG C and is prepared for sample.

Obtained sample is stood in the way of part is contacted with cover strip face, the heat treatment of 24 hours is applied at 70 DEG C Afterwards, cover strip is peeled off with the speed of 300mm/min, the number of the electronic unit to being pasted onto in electronic unit 100 in cover strip Counted.

In the case where the chip being pasted onto in cover strip is less than 2, the stickup of the electronic unit after baking is evaluated as Zero, in the case where the chip being pasted onto in cover strip is more than 2, the stickup of the electronic unit after baking is evaluated as ×.

The visibility ＞ of ＜ electronic units

The cover strip for being obtained is cut into after 5.5mm width, electronic unit (QFP64T40-3.9) is inserted into the wide poly- carbon of 8mm The carrier band (NIPPO CORPORATION manufactures) of acid esters, carries out heat-sealing and is prepared for sample in 180 DEG C of heat-sealing temperature by cover strip. 1cm is vertically above carried from electronic component surface, printing word on electronic components is confirmed by visual observation, by the wheel of word It is wide do not obscure and can read be evaluated as ◎, although by literary glyph it is fuzzy can read be evaluated as zero, by word Profile cannot read be evaluated as ×.

As shown in table 2, the cover strip of each embodiment, the heat sealability and the performance of the low tack to electronic unit to carrying is put down Weighing apparatus is excellent.And the cover strip of each comparative example, it is poor with the performance balance of the low tack to electronic unit to the heat sealability of carrier band.

Symbol description

1 carrier band

10 electronic parts packaging materials

11 sprocket holes

12 recesses

13 the 2nd faces

15 the 1st faces

20 cover strips

21 substrate layers

22 heat sealing layers

40 electronic units

200 cover strips

500 carrier bands

512 recesses

1000 electronic parts packaging materials

Claims

1. a kind of electronic parts cover strip, it is used for electronic component packing body, and the electronic component packing body possesses：Carry Band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in the recess；And lid Band, the cover strip is by the way that the carrier band sealing is covered the recess for being accommodated with the electronic unit, the electronic unit Taping packaging cover is characterised by：

Have：Substrate layer；And heat sealing layer, the heat sealing layer is stacked on a face of the substrate layer, and is sealed in described Carrier band,

The heat sealing layer according to JIS B 0601 specify surface roughness Rz be 1.0 more than μ, and the heat sealing layer with The adhesive strength of the resin bed with polysiloxane as main constituent is as 0.3g/mm²Below.

2. electronic parts cover strip according to claim 1, it is characterised in that：

The full light transmittance specified according to JIS K 7361-1 is more than 80%.

3. electronic parts cover strip according to claim 1 and 2, it is characterised in that：

The heat sealing layer contains ethene copolymer as main material.

4. electronic parts cover strip according to any one of claim 1 to 3, it is characterised in that：

The thickness of the heat sealing layer is more than 1 μm and less than 15 μm.

5. electronic parts cover strip according to any one of claim 1 to 4, it is characterised in that：

The thickness of the substrate layer is more than 7 μm and less than 30 μm.

6. electronic parts cover strip according to any one of claim 1 to 5, it is characterised in that：

The heat sealing layer possesses sealing to the carrier band containing Merlon as main material.

7. a kind of electronic parts cover strip, it is used for electronic component packing body, and the electronic component packing body possesses：Carry Band, the carrier band a face have can housing electronic part recess；The electronic unit being incorporated in the recess；And lid Band, the cover strip is by the way that the carrier band sealing is covered the recess for being accommodated with the electronic unit, the electronic unit Taping packaging cover is characterised by：

Possess：Substrate layer；And heat sealing layer, the heat sealing layer is stacked on a face of the substrate layer, and comprising cohesive tree Fat,

In the load N that will be determined according to JIS K7125₁When the confficient of static friction on the heat sealing layer surface be set to μ₅₀, will be according to According to the load N that JIS K7125 are determined₂When the confficient of static friction on the heat sealing layer surface be set to μ₂₀₀When,

By (μ₅₀-μ₂₀₀)/(N₂-N₁The variable quantity of the confficient of static friction that) × 1000 represent is less than 3.0, wherein, N₁For 50g, N₂ For 200g,

The Vicat softening point that the foundation JIS K7206 of the resin of binding property in the heat sealing layer is determined be more than 30 DEG C and Less than 70 DEG C.

8. electronic parts cover strip according to claim 7, it is characterised in that：

The arithmetic average height Sa on the heat sealing layer surface determined according to ISO-25178 is less than more than 0.4 μm 0.7 μm.

9. the electronic parts cover strip according to claim 7 or 8, it is characterised in that：

The heat sealing layer includes the resin of binding property containing (methyl) acryloyl group.

10. electronic parts cover strip according to claim 9, it is characterised in that：

The containing ratio of (methyl) acryloyl group of the resin of binding property containing (methyl) acryloyl group is more than 10 mass % Below 40 mass %.

The 11. electronic parts cover strips according to claim 9 or 10, it is characterised in that：

The resin of binding property containing (methyl) acryloyl group is ethene copolymer.

The 12. electronic parts cover strips according to any one of claim 9 to 11, it is characterised in that：

The heat sealing layer also adjusts resin containing cohesiveness.

The 13. electronic parts cover strips according to any one of claim 7 to 12, it is characterised in that：

The full light transmittance determined according to JIS K7361-1 is more than 80%.

The 14. electronic parts cover strips according to any one of claim 7 to 13, it is characterised in that：

The thickness of the heat sealing layer is less than more than 1 μm 15 μm.

The 15. electronic parts cover strips according to any one of claim 7 to 14, it is characterised in that：

The thickness of the substrate layer is less than more than 7 μm 50 μm.

The 16. electronic parts cover strips according to any one of claim 7 to 15, it is characterised in that：

The carrier band is constituted by one or more the material in Merlon and polystyrene is included.

The 17. electronic parts cover strips according to any one of claim 7 to 16, it is characterised in that：

The sealing member for constituting the electronic unit is silicone seal.

The 18. electronic parts cover strips according to any one of claim 1 to 17, it is characterised in that：

The electronic unit is light emitting diode.

19. a kind of electronic parts packaging materials, it is characterised in that possess：

Electronic parts cover strip any one of claim 1 to 18；With

Carrier band, the carrier band a face have can housing electronic part recess, and the recess is by the electronic component packing Covered with cover strip.

20. a kind of electronic component packing bodies, it is characterised in that possess：

The electronic unit being incorporated in the recess；With

Electronic parts cover strip any one of claim 1 to 18, the electronic parts cover strip by One surface side the recess for being accommodated with the electronic unit is covered the carrier band sealing.