CN105745291B - Bonding sheet for filling organic luminescent device and its manufacturing method - Google Patents
Bonding sheet for filling organic luminescent device and its manufacturing method Download PDFInfo
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- CN105745291B CN105745291B CN201480060493.6A CN201480060493A CN105745291B CN 105745291 B CN105745291 B CN 105745291B CN 201480060493 A CN201480060493 A CN 201480060493A CN 105745291 B CN105745291 B CN 105745291B
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- emitting device
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- 238000000034 method Methods 0.000 claims abstract description 19
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- 239000011521 glass Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
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- 239000005062 Polybutadiene Substances 0.000 description 2
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- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
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- 239000011347 resin Substances 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
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- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- LCJHLOJKAAQLQW-UHFFFAOYSA-N acetic acid;ethane Chemical compound CC.CC(O)=O LCJHLOJKAAQLQW-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to the bonding sheet for filling organic luminescent device and the method for manufacturing it, the bonding sheet includes：Bonding film for filling organic luminescent device；The upper release film being formed on the bonding film for filling organic luminescent device；With the lower release film being formed in below the bonding film for filling organic luminescent device, wherein the bonding film and upper release film for filling organic luminescent device are respectively with the curved surface that is formed at one or more edge.
Description
Technical field
The present invention relates to the bonding sheets (adhesive sheet) and its manufacturing method for encapsulating organic light emitting device.
Background technology
Bonding sheet for encapsulating organic light emitting device includes the bonding film for encapsulating organic light emitting device, is formed in viscous
The upper release film (upper release film) on the upside of film is closed, and the lower release film (lower being formed on the downside of bonding film
Release film) (basilar memebrane).Lower release film has the peeling force and bigger for bonding film compared to upper release film bigger
Thickness, thus as bonding film coating in basilar memebrane.Use is for encapsulating organic hair after so that upper release film is detached from
Bonding film is then attached to packaged glass substrate by the bonding sheet of optical device, and is then detached from lower release film, and will bonding
Film is attached to organic luminescent device, subsequent heat cure.
By using wooden stamping die (punching die) (blanking punch (cutting die)) punching press equipped with blade
(punching) go out the bonding film for encapsulating organic light emitting device, upper release film and lower release film, prepare organic for encapsulating
The bonding sheet of luminescent device.Fig. 7 is the vertical view of typical wooden stamping die.With reference to figure 7, wooden stamping die 50 is by mold
(die) 10 and four blade 20a, 20b, 20c, 20d being formed on mold 10, and limited by two adjacent blades,
It is constituted corresponding to the angle at the joint portion (joint) between blade.In general, pre- by the way that blade of the volume on cylindrical roller to be cut into
Fixed length, is then assembled into the holder (frame) of mold, and blade is provided to wooden stamping die.It is wooden in view of making
The method of stamping die processed, blade cannot be connected to each other completely, thus therebetween spaced (space).This inter-species between blade
Every the corresponding bonding film obtained by punching press and the respective angle of upper release film (corner), thus can on by bonding film disengaging from
When type film, bonding film is caused to be removed together with upper release film, and cause to be detached from and fail, that is, folds or tear off the angle of bonding film
Deng.Accordingly, there exist for can overcome the problems, such as these, bonding sheet and its manufacturing method for encapsulating organic light emitting device
It needs.
Invention content
Technical problem
It is an aspect of the invention to provide the bonding sheet for encapsulating organic light emitting device, can prevent make it is release
Film is failed by the disengaging during being detached from for the bonding film of encapsulating organic light emitting device.
Another aspect of the present invention is to provide the method for making the bonding sheet for being used for encapsulating organic light emitting device, can
To prevent disengaging during making release film by being detached from for the bonding film of encapsulating organic light emitting device from failing.
Technical solution
According to an aspect of the present invention, the bonding sheet for encapsulating organic light emitting device includes：For encapsulating organic hair
The bonding film of optical device；The upper release film being formed on the upside of the bonding film for encapsulating organic light emitting device；And it is formed in use
Lower release film on the downside of the bonding film of encapsulating organic light emitting device, wherein for encapsulating organic light emitting device bonding film and
Release film can respectively have one or more fillets.
According to an aspect of the present invention, the method for making the bonding sheet for being used for encapsulating organic light emitting device includes：
Using the piece of cutting die stamping layering, the piece of the layering has following structure, wherein sequence stacks lower release film, for being packaged with
The bonding film of machine luminescent device and upper release film, wherein blanking punch can be furnished with and will be used for the viscous of encapsulating organic light emitting device
It closes film and upper release film is cut to the first blade of predetermined size, and the first blade can have one or more fillets.
Advantageous effects
According to the present invention it is possible to provide the bonding sheet for encapsulating organic light emitting device, can reduce makes release film
By the disengaging failure during being detached from for the bonding film of encapsulating organic light emitting device.
According to the present invention it is possible to the method for making the bonding sheet for being used for encapsulating organic light emitting device is provided, it can be with
Disengaging during making release film by being detached from for the bonding film of encapsulating organic light emitting device is reduced to fail.
Description of the drawings
Fig. 1 is the exploded perspective of the bonding sheet for encapsulating organic light emitting device according to embodiment of the present invention
Figure.
Fig. 2 is the sectional view of the bonding sheet for encapsulating organic light emitting device according to the embodiment of the present invention.
Fig. 3 is the enlarged drawing of the fillet of the bonding sheet for encapsulating organic light emitting device according to the embodiment of the present invention,
Radius of curvature R is shown.
Fig. 4 is another embodiment according to the present invention, the exploded perspective of the bonding sheet for encapsulating organic light emitting device
Figure.
Fig. 5 is another embodiment according to the present invention, the sectional view of the bonding sheet for encapsulating organic light emitting device.
Fig. 6 is according to embodiment of the present invention, for making the bonding sheet for being used for encapsulating organic light emitting device
Method in the vertical view of the first blade that uses.
Fig. 7 is the vertical view for the typical wooden stamping die of the bonding sheet of encapsulating organic light emitting device for punching press.
Fig. 8 makes in embodiment, the image at the angle of the bonding sheet for encapsulating organic light emitting device.
Fig. 9 makes in comparing embodiment, the image at the angle of the bonding sheet for encapsulating organic light emitting device.
Figure 10 is the schematic diagram for showing to measure the method for breakaway force (releasing force) in EXPERIMENTAL EXAMPLE.
Specific implementation mode
Embodiments of the present invention will be described in detail with reference to the attached drawings.It should be understood that the present invention can be implemented in different ways
And it is not limited to following embodiments.In the accompanying drawings, the part unrelated with description will be omitted for clarity.In the whole instruction
In, will same component be indicated by same reference label.As it is used in the present context, the term of space correlation such as "upper" and
"lower" is that refer to the attached drawing defines.It is to be understood, therefore, that term " upside " can be interchangeably used with term " downside ".
According to an aspect of the present invention, the bonding sheet for encapsulating organic light emitting device includes, for encapsulating organic hair
The bonding film of optical device and the upper release film for being separately formed at bonding film the upper side and lower side for encapsulating organic light emitting device
With lower release film, wherein respectively there are one or more fillets for the bonding film of encapsulating organic light emitting device and upper release film.
Therefore, it can inhibit to generate gap (void) due to the blade friction in the punching course at fillet, and prevent from being detached from and lose
It loses, such as during so that upper release film is detached from from bonding film at fillet, prevents the bonding for encapsulating organic light emitting device
Film is removed together with upper release film, or prevents the angle of bonding film from folding or tearing off.In general, being used for encapsulating organic light emitting making
In the bonding sheet of device, by bonding film and the punching press simultaneously of upper release film, so as to the fillet to correspond to each other in position.
As it is used in the present context, term " bonding film for being used for encapsulating organic light emitting device " refers to filling organic illuminator
The bonding film at the interval between the packaged glass of part and the cathode of organic luminescent device.
Be formed in the downside of the bonding film for encapsulating organic light emitting device lower release film can by with upper release film phase
Same material is formed, or can be formed by the material different from upper release film.Lower release film can be referred to as basilar memebrane, and be used for
Bonding film and upper release film of the support for encapsulating organic light emitting device, thus prevent bonding film due to the deformation of external force.Under from
Type film can have with for encapsulating organic light emitting device bonding film or upper release film is identical or the area of bigger.For example,
The area ratio of lower release film and bonding film or upper release film for encapsulating organic light emitting device may be greater than or be equal to about 1.
In another embodiment, which can be in the range of about 1 to about 1.1.Within this range, lower release film can with
Used in the bonding sheet of encapsulating organic light emitting device, and can support for encapsulating organic light emitting device bonding film and
Release film.However, it should be understood that the present invention is not limited to above areas to compare range.
When area ratio is 1, lower release film can have corresponds to the bonding for encapsulating organic light emitting device in position
The fillet of the fillet of film or upper release film.When area ratio is in more than 1 to 1.1 range, lower release film can have fillet or
There can be angled angle (such as 90 °) without any fillet.
Bonding sheet for encapsulating organic light emitting device has the particular area of area and/or shape depending on product
And/or shape.For example, the bonding sheet for encapsulating organic light emitting device can be used for having about 1 inch to about 150 inches, or
The organic light emitting device display of about 50 inches to about 80 inches of size, but not limited to this.
In another embodiment, the bonding sheet according to the present invention for encapsulating organic light emitting device, which has, is connected to circle
First and second sides at angle, wherein fillet are located at by the extend from first side on fillet direction first imaginary extended surface
(first imaginary extension plane) and the second imaginary extended surface extended from second side on fillet direction
The plane " inside " that (second imaginary extension plane) is limited.
Then, by with reference to figure 1 and Fig. 2 description according to embodiment of the present invention be used for encapsulating organic light emitting device
Bonding sheet.Fig. 1 is that the decomposition of the bonding sheet for encapsulating organic light emitting device according to embodiment of the present invention is saturating
View, and Fig. 2 is the sectional view of the bonding sheet for encapsulating organic light emitting device according to embodiment of the present invention.
With reference to figure 1 and Fig. 2, the bonding sheet 100 for encapsulating organic light emitting device according to the embodiment include under from
Type film 110 is formed in 110 upside of lower release film, is used for the bonding film 120 of encapsulating organic light emitting device, and be formed in bonding
The upper release film 130 of the upside of film 120, wherein bonding film 120 and upper release film 130 can be respectively provided with fillet 140b', 140c',
140d' and 140a, 140b, 140c, 140d.Although being not shown in Fig. 1, there is bonding film 120 position to correspond to upper release film
The fillet of 130 fillet 140a.Therefore, can inhibit to generate gap due to the blade friction in the punching course at fillet, and
And prevent from being detached from and fail, such as during so that upper release film is detached from from bonding film at fillet, prevent bonding film together on from
Type film removes or prevents together the angle of bonding film from folding or tearing off.
Fig. 3 is the enlarged drawing of the fillet 140d of bonding sheet according to the embodiment of the present invention.With reference to figure 3, fillet 140d
It is located at, by the first imagination extended surface 150c extended from first side 150a on the direction of fillet 140d and fillet 140d's
The internal plane that the second imaginary extended surface 150d extended from second side 150b on direction is limited, wherein the first and second sides
150a, 150b are connected to fillet 140d and form the profile of the bonding sheet for encapsulating organic light emitting device.Although only retouching above
Stated the fillet 140d of Fig. 1, same description can also be applied to the bonding sheet according to the embodiment other fillets 140a,
140b、140c、140b'、140c'、140d'。
Bonding sheet for encapsulating organic light emitting device can have one or more fillets.Specifically, when for encapsulating
When the bonding film of organic luminescent device and upper release film respectively have the cross section of n angular (wherein n is 3 to 6 integer), bonding
Piece can have 1 to n fillet.Fig. 1 shows that an example, wherein bonding film and upper release film respectively have rectangular shape simultaneously
And there are four fillets for bonding sheet tool.
Fillet can have about 0mm<R≤1.0mm, the specifically radius of curvature R (unit of about 0.3mm≤R≤0.7mm：
mm).In this range of curvature radius, bonding film can cover organic luminescent device enough, while further decrease release failure
Rate.Radius of curvature according to the present invention will be described with reference to figure 3.With reference to figure 3, radius of curvature R refers to from fillet 140d and the first side
The distance of boundary point 160a to imagination crosspoint 160c between the 150a of face, or between fillet 140d and second side 150b
The distance of boundary point 160b to imagination crosspoint 160c, wherein extend from first side 150a on the direction of fillet 140d the
One imaginary extended surface 150c and the second imaginary extended surface 150d extended from second side 150b on the direction of fillet 140d
It links together in imaginary crosspoint 160c, and first and second sides 150a, 150b are connected to fillet 140d and are formed and are used for
The profile of the bonding sheet of encapsulating organic light emitting device.
Lower release film 110 has compared to upper release film bigger for the peeling force of bonding film and the thickness of bigger, thus
Basilar memebrane in coating as bonding film.Release film moves by under in using the bonding film for encapsulating organic light emitting device
It removes.Lower release film may include any typical optical film, such as by polyester such as polyethylene terephthalate and gather to benzene two
Formic acid fourth diester, polyolefin such as polytetrafluoroethylene (PTFE), polyethylene and polypropylene, polybutadiene, polyurethane, ethane-acetic acid ethyenyl ester
The film that copolymer, ethylene-propylene copolymer, ethylene-ethyl acrylate copolymer or combination thereof are formed, but not limited to this.
Lower release film 110 can have about 25 μm to about 150 μm, specifically about 50 μm to about 125 μm of thickness.In this model
In enclosing, lower release film can use in the bonding sheet for encapsulating organic light emitting device.
Bonding film 120 has specific adhesion strength and can be by including, such as thermosetting resin such as epoxy resin, third
The adhesive film composition of olefin(e) acid resin and polyester resin, curing agent etc. is formed.Bonding film can have about 5 μm to about 100 μm, tool
About 10 μm to about 50 μm of the thickness in body ground.Within this range, bonding film can be in the bonding sheet for encapsulating organic light emitting device
Middle use.Although being not shown in Fig. 1 and Fig. 2, the bonding film for encapsulating organic light emitting device may further include hygroscopic agent,
For preventing moisture penetration from entering in organic luminescent device.
Upper release film 130 is used as protection for the bonding film of encapsulating organic light emitting device not by the cover film of foreign matter etc., and
And it is removed in using the bonding film for encapsulating organic light emitting device.For example, upper release film may include typical optical film,
Such as by polyester such as polyethylene terephthalate and polybutylene terephthalate, polyolefin such as polytetrafluoroethylene (PTFE), polyethylene
And polypropylene, polybutadiene, polyurethane, vinyl-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-acrylic acid second
The film that ester copolymer or combination thereof are formed, but not limited to this.
Upper release film 130 can have about 10 μm to about 100 μm, specifically about 10 μm to about 50 μm of thickness.In this model
In enclosing, upper release film can use in the bonding sheet for encapsulating organic light emitting device.
The bonding sheet for encapsulating organic light emitting device according to the embodiment of the present invention can be made by following：
Use the blanking punch equipped with the first blade and the second blade, the piece for the layering that punching press has following structure, wherein under sequence stacks
Release film, the bonding film for encapsulating organic light emitting device and upper release film, wherein the first blade is cut for being packaged with simultaneously
The bonding film of machine luminescent device and upper release film, and the lower release film of the second blade cutting, will be described in greater detail below.
The bonding sheet for encapsulating organic light emitting device according to the embodiment of the present invention can keep upper release film de-
From using later, the bonding film for being subsequently used for encapsulating organic light emitting device is attached to packaged glass substrate, release under then making
Film is detached from, and bonding film is then attached to the cathode surface of organic luminescent device.Can be made by any typical method from
Type film is detached from, such as upper release film can be increased to the automation equipment of fillet by application.Implement at one according to the present invention
In the bonding sheet for encapsulating organic light emitting device of mode, since both bonding film and upper release film have fillet, when will glue
When conjunction film is attached to the packaged glass substrate and cathode surface of organic luminescent device, it can prevent due to being generated in punching course
Gap caused by bad appearance and be detached from fail.
Then, by with reference to figure 4 and Fig. 5 describe another embodiment according to the present invention be used for encapsulating organic light emitting device
Bonding sheet.Fig. 4 is that the decomposition of the bonding sheet for encapsulating organic light emitting device of another embodiment according to the present invention is saturating
View, and Fig. 5 is the sectional view of the bonding sheet for encapsulating organic light emitting device of another embodiment according to the present invention.
With reference to figure 4 and Fig. 5, the bonding sheet 200 for encapsulating organic light emitting device according to the embodiment of the present invention wraps
It includes, lower release film 110, is formed in 110 upside of lower release film, is used for the bonding film 120 of encapsulating organic light emitting device, and formed
Upper release film 130 in 120 upside of bonding film, wherein lower release film 110, bonding film 120 and upper release film 130 can have respectively
There are fillet 140b ", 140c ", 140d "；140b'、140c'、140d'；140a、140b、140c、140d.Although not showing in Fig. 4
Go out, lower release film 110 and bonding film 120 respectively can be with positions corresponding to the fillet of the fillet 140a of upper release film 130.It removes
Lower release film 110 has outside the fillet of the fillet corresponding to bonding film 120 and upper release film 130, according to the use of the embodiment
It is substantially the same with the bonding sheet according to embodiment above in the bonding sheet of encapsulating organic light emitting device.In other words, according to
The lower release film of the bonding sheet of the embodiment can with position correspond to for encapsulating organic light emitting device bonding film and
The fillet of the fillet of upper release film.
Since also there is lower release film fillet, the bonding sheet easily can be used for encapsulating organic light emitting by punching press simultaneously
The bonding film of device, upper release film and lower release film make.
According to the embodiment, the bonding sheet for encapsulating organic light emitting device can pass through following making：Using with
There are the wooden stamping die of the first blade, the piece for the layering that punching press has following structure, wherein sequence stacks lower release film, for sealing
The bonding film of organic luminescent device and upper release film are filled, wherein the first blade is cut simultaneously for the viscous of encapsulating organic light emitting device
Film, upper release film and lower release film are closed, will be described in greater detail below.
Then, the method according to the present invention for making the bonding sheet for encapsulating organic light emitting device will be described.
Method according to the present invention for making the bonding sheet for encapsulating organic light emitting device includes using cutting stamping
Press the piece of layering having following structure, wherein sequence stack lower release film, for encapsulating organic light emitting device bonding film and
Upper release film, wherein blanking punch are furnished with is cut into predetermined size by the bonding film and upper release film that are used for encapsulating organic light emitting device
The first blade, and the first blade can have one or more fillets.Therefore, bonding film and upper release film respectively have one
Thus a or multiple fillets prevent from making release film from the release failure during bonding sheet disengaging.
Fig. 6 is according to embodiment of the present invention, for making the bonding for being used for encapsulating organic light emitting device
The plan view of the first blade used in the method for piece.With reference to figure 6, the first blade 300 is made of blade 310,320, wherein knife
Piece 310,320 is respectively provided with fillet 310a, 310b；310c、310d.Therefore, stamped to be used for encapsulating organic light emitting device
Bonding film and upper release film respectively can have one or more fillets in identical position, thus prevent de- as described above
From failure.
The angle of the first blade can be made to be rounded, to by that there can be curvature with the angle of the first blade punching press, bonding sheet
Radius, as shown in Figure 3.Therefore, the fillet of the first blade can have about 0mm<R≤1.0mm, specifically about 0.3mm≤R≤
The radius of curvature R of 0.7mm.In the range of this radius of curvature, the bonding sheet for encapsulating organic light emitting device can be made,
So that organic luminescent device is fully covered by the bonding film for encapsulation, while further decreasing disengaging mortality.It can pass through
Method identical with the bonding sheet for encapsulating organic light emitting device measures the radius of curvature of the fillet of the first blade.
Two blades 310,320 for forming the first blade are connected each other by blade joint portion (blade joint) 330,340
It connects, wherein blade joint portion 330,340 is formed in the first blade side.Thus, since blade joint portion is formed in the first blade
Side rather than its angle, for encapsulating organic light emitting device bonding film and upper release film respectively also can its side have pair
It should thus prevent from being detached from failure caused by concentrating due to the peeling force at angle in the part at blade joint portion.It should be understood, however, that
, the first blade can have and single fillet or can be integrally formed without any blade joint portion.
Lower release film can by the first blade punching press, and can with for encapsulating organic light emitting device bonding film and
Release film punching press simultaneously.
Alternatively, blanking punch can be additionally equipped with the second blade that lower release film is cut to predetermined size, wherein the
Two blades can form ladder (stepped from) with the first blade.For example, can be by being provided to wooden stamping die and having
Release film under the second blade punching press more larger sized than the first blade.Second blade can have one or more fillets or can be with
With angled angle (such as 90 °) without any fillet.When the second blade has fillet, which can have about
0mm<R≤1.0mm, the specifically radius of curvature R of about 0.3mm≤R≤0.7mm, but not limited to this.Can also by with for sealing
Fill the radius of curvature of the fillet of bonding sheet the second blade of identical method measurement of organic luminescent device or the first blade.
Second blade can form ladder with the first blade, and (the second blade is being rushed in the-the first blade of length of pressing direction
Press the length in direction).Specifically, the second blade can form the thickness or bigger that ladder is lower release film with the first blade.
The piece of layering can be made by any typical method.For example, can be by the way that encapsulating organic light emitting device will be used for
The composition of the bonding film of part is applied to lower release film to form coating and stack upper release film on the coating layer, subsequent thermosetting
Change or UV cures, to make the piece of layering.
Invention pattern
Then, the present invention will be more fully described with reference to embodiment.It is noted, however, that these embodiments are only
In order to illustrate and provide and should not be construed as in any way limiting the present invention.
Embodiment
By including epoxy resin and imidazole curing agent, the composition coating of the bonding film for encapsulating organic light emitting device
(polyethylene terephthalate (PET) release film, thickness on the basilar memebrane as lower release film：100 μm) to 20 μm of thickness
It spends to form coating, and then by upper release film (PET release films, thickness：25 μm) it stacks on the coating layer, then at 80 DEG C
Lower heat cure 10 minutes, thus makes the piece of layering.The wooden punching for being furnished with blade as shown in Figure 6 is made using two blades
Pressing mold.Herein, the fillet of blade has the radius of curvature R of 0.7mm.Using wooden stamping die by the piece punching press of layering, thus make
Make to be used for encapsulating organic light emitting device with rectangular cross section and with 4 fillets (the respective radius of curvature R with 0.7mm)
The bonding sheet of part.Fig. 8 is the enlarged drawing of the fillet of the bonding sheet for encapsulating organic light emitting device made.As shown in Figure 8,
It can be seen that bonding sheet has smooth fillet and is not subjected to the hangover (tailing) of bonding film.
Comparing embodiment
By with it is identical in embodiment in a manner of make the piece of layering, and made using four blades as shown in Figure 7
Wooden stamping die with blade.Then, the piece being layered using the wooden punching press die stamping, is thus made for encapsulating organic hair
The bonding sheet of optical device.Fig. 9 is the enlarged drawing of the fillet of the bonding sheet for encapsulating organic light emitting device made.In Fig. 9
It is shown, it can be seen that hangover (tailing) of the bonding sheet with corner and with bonding film.
To each assessment in the bonding sheet for encapsulating organic light emitting device that is made in embodiment and comparing embodiment
Release film is set to be detached from required power (edge breakaway force) from bonding sheet and be detached from mortality.As a result it is shown in table 1.
Table 1
| Edge breakaway force (kgf) | It is detached from mortality (%) | |
| Embodiment | 101.4 | 1.3 |
| Comparing embodiment | 145.9 | 18.1 |
As shown in table 1, it can be seen that the bonding sheet for encapsulating organic light emitting device of embodiment show compared to
The significantly lower edge breakaway force of comparing embodiment, thus expected its inhibits the bonding film for encapsulating organic light emitting device to make
Upper release film is detached from during being detached from from bonding sheet, and shows the disengaging failure significantly lower compared to comparing embodiment
Rate.
(1) edge breakaway force：Edge breakaway force is to use TXATMWhat Texture instrument (texture analyzer) measured.It is first
First, the size of 4cm × 4cm (long × wide) will be cut into for the bonding sheet of encapsulating organic light emitting device, and it is diagonal not any
It destroys.
Figure 10 is the schematic diagram for showing the method for measuring edge breakaway force.With reference to figure 10, double faced adhesive tape is attached to survey
The whole surface of the testboard of device is tried, and point that the test probe 65 for making tester is contacted with testboard is marked with * on platform.
The upper release film 72 of bonding sheet 70 is set to face upward, wherein bonding sheet has following structure, wherein sequence stacks lower release film 71, uses
In the bonding film and upper release film 72 of encapsulating organic light emitting device, bonding sheet is placed on platform so that the angle of bonding sheet, which is left, uses *
The distance of the point 3mm of label.It is right while so that test probe of the packet in double faced adhesive tape is contacted with upper release film and then moving up
Each angle under the following conditions measures 20 times upper release film detaching required power (separating force) from bonding film, then flat
The measured value.
* test height：5mm
* test speed (test probe is displaced downwardly to the speed * points marked or moved up by the point)：1mm/ seconds
* pressure (test probe presses the pressure of the point)：600gf
* time (test probe presses the period of the point)：15 seconds
(2) it is detached from mortality：Detect by an unaided eye during so that upper release film is detached from from bonding sheet, if bonding film together with
Upper release film is detached from or is folded at angle together.It is detached from mortality and is calculated as the number of samples for being subjected to being detached from failure and test sample
Sum ratio.
It should be understood that without departing from the spirit and scope of the present invention, those skilled in the art can do
Go out various modifications, change, change and equivalent embodiment.
Claims (8)
1. a kind of bonding sheet for encapsulating organic light emitting device, including：
Bonding film for encapsulating organic light emitting device；
The upper release film formed on the upside for the bonding film of encapsulating organic light emitting device；And
The lower release film formed on the downside for the bonding film of encapsulating organic light emitting device,
Wherein, respectively there is rectangular shape for the bonding film of encapsulating organic light emitting device and the upper release film and have
There are one or multiple fillets,
Wherein, the fillet has the radius of curvature R of 0.3mm≤R≤0.7mm.
2. the bonding sheet according to claim 1 for encapsulating organic light emitting device, wherein be used for encapsulating organic light emitting device
The bonding film of part and the upper release film respectively have the first side and second side for being connected to the fillet, and
The fillet is located at by the extend from the first side on the direction of the fillet first imaginary extended surface and in institute
It states in the plane limited by the second imaginary extended surface that the second side extends on the direction of fillet.
3. the bonding sheet according to claim 1 for encapsulating organic light emitting device, wherein the lower release film be used for
The area ratio of the bonding film of encapsulating organic light emitting device or the upper release film is in 1 to 1.1 range.
4. the bonding sheet according to claim 1 for encapsulating organic light emitting device, wherein the lower release film has position
Set the fillet corresponded to for the bonding film of encapsulating organic light emitting device and the fillet of the upper release film.
5. a kind of method for making the bonding sheet for encapsulating organic light emitting device, including：
Using the piece of cutting die stamping layering, the structure that the piece of the layering has is：Wherein, sequentially stack lower release film,
Bonding film for encapsulating organic light emitting device and upper release film,
Wherein, the blanking punch is furnished with and is cut to the bonding film and the upper release film that are used for encapsulating organic light emitting device
First blade of predetermined size, and
First blade has one or more fillets,
Wherein, respectively there is rectangular shape for the bonding film of encapsulating organic light emitting device and the upper release film and have
There are one or multiple fillets,
Wherein, the fillet has the radius of curvature R of 0.3mm≤R≤0.7mm.
6. the method according to claim 5 for making the bonding sheet for encapsulating organic light emitting device, wherein use
Lower release film described in the first blade punching press.
7. the method according to claim 5 for making the bonding sheet for encapsulating organic light emitting device, wherein described
Blanking punch is further configured with the second blade that the lower release film is cut to predetermined size, and second blade with it is described
First blade forms ladder.
8. the method according to claim 7 for making the bonding sheet for encapsulating organic light emitting device, wherein described
Second blade has one or more fillets.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0135072 | 2013-11-07 | ||
| KR1020130135072A KR101726910B1 (en) | 2013-11-07 | 2013-11-07 | Adhesive sheet for encapsulating oled device and method for preparing the same |
| PCT/KR2014/005425 WO2015068926A1 (en) | 2013-11-07 | 2014-06-19 | Adhesive sheet for filling organic light emitting device and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105745291A CN105745291A (en) | 2016-07-06 |
| CN105745291B true CN105745291B (en) | 2018-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480060493.6A Active CN105745291B (en) | 2013-11-07 | 2014-06-19 | Bonding sheet for filling organic luminescent device and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101726910B1 (en) |
| CN (1) | CN105745291B (en) |
| WO (1) | WO2015068926A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220022950A (en) * | 2020-08-19 | 2022-03-02 | 삼성디스플레이 주식회사 | Window module and method of manufacturing display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040048279A (en) * | 2002-12-02 | 2004-06-07 | 김보경 | Double Sided Tape Forming Equipment |
| CN1800285A (en) * | 2004-12-30 | 2006-07-12 | 胶点国际有限公司 | Perforated adhesive dispensing sheets |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100634960B1 (en) * | 2004-06-24 | 2006-10-17 | (주)모디스텍 | Encapsulation film for oled, encapsulating method thereof |
| KR200398477Y1 (en) * | 2005-07-21 | 2005-10-13 | (주)데카닉스 | A double-sided adhesive tape |
| KR100810599B1 (en) * | 2006-07-04 | 2008-03-06 | 김영선 | Protective film for the transparent panel of a display panel |
| KR20100097442A (en) * | 2009-02-26 | 2010-09-03 | 제일모직주식회사 | Anisotropic conductive adhesive film and manufacturing method for it |
| WO2012060621A2 (en) * | 2010-11-02 | 2012-05-10 | 주식회사 엘지화학 | Adhesive film and method for encapsulating organic electronic device using the same |
| JP6011067B2 (en) * | 2011-08-12 | 2016-10-19 | 日立化成株式会社 | Adhesive film |
-
2013
- 2013-11-07 KR KR1020130135072A patent/KR101726910B1/en active IP Right Grant
-
2014
- 2014-06-19 CN CN201480060493.6A patent/CN105745291B/en active Active
- 2014-06-19 WO PCT/KR2014/005425 patent/WO2015068926A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040048279A (en) * | 2002-12-02 | 2004-06-07 | 김보경 | Double Sided Tape Forming Equipment |
| CN1800285A (en) * | 2004-12-30 | 2006-07-12 | 胶点国际有限公司 | Perforated adhesive dispensing sheets |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015068926A1 (en) | 2015-05-14 |
| KR20150053198A (en) | 2015-05-15 |
| CN105745291A (en) | 2016-07-06 |
| KR101726910B1 (en) | 2017-04-13 |
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