CN113646242A - Cover tape for packaging electronic component and package - Google Patents
Cover tape for packaging electronic component and package Download PDFInfo
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- CN113646242A CN113646242A CN202080026131.0A CN202080026131A CN113646242A CN 113646242 A CN113646242 A CN 113646242A CN 202080026131 A CN202080026131 A CN 202080026131A CN 113646242 A CN113646242 A CN 113646242A
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- Prior art keywords
- layer
- heat
- cover tape
- tape
- electronic component
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
Abstract
The present invention provides a cover tape for packaging electronic components, comprising: a substrate layer; a heat-seal layer disposed on one side of the base layer, the heat-seal layer including an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer disposed on a surface of the base material layer opposite to the heat-seal layer.
Description
Technical Field
The present invention relates to a cover tape for packaging electronic components and a package using the same.
Background
In recent years, electronic parts such as ICs, resistors, transistors, diodes, capacitors, piezoelectric component buffers, and the like are packaged in braids for surface mounting. In the braid package, electronic components are accommodated in a carrier tape having a plurality of accommodation portions for accommodating the electronic components, and the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic components. When mounting the electronic component, the cover tape is peeled from the carrier tape, and the electronic component is automatically taken out and surface-mounted on the substrate. The cover tape is also referred to as an upper tape.
In addition, in the braid package, static electricity may be generated due to friction or contact between the electronic component and the carrier tape or the cover tape, and static electricity may be generated due to peeling of the cover tape from the carrier tape at the time of mounting.
In order to suppress the generation of static electricity, various cover tapes having antistatic properties have been proposed (for example, see patent documents 1 to 3).
Prior art documents
Patent document
Patent document 1: japanese patent No. 4162961
Patent document 2: japanese laid-open patent publication No. 10-95448
Patent document 3: japanese patent No. 4061136
Disclosure of Invention
Problems to be solved by the invention
However, the inventors of the present invention found that: even in the case of using a cover tape having antistatic properties, there are cases where electronic components are attached to the cover tape.
The present invention has been made in view of the above problems, and an object thereof is to provide a cover tape for electronic component packaging that can suppress abnormal behavior of an electronic component when peeled from a carrier tape.
Means for solving the problems
One embodiment of the present invention provides a cover tape for packaging an electronic component, including: a substrate layer; a heat-seal layer disposed on one side of the base layer, the heat-seal layer including an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer disposed on a surface of the base material layer opposite to the heat-seal layer.
One embodiment of the present invention provides a package including: a carrier tape having a plurality of receiving portions for receiving electronic components; an electronic component housed in the housing section; and a cover tape for packaging the electronic component, which is disposed so as to cover the housing.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the cover tape for packaging electronic components of the present invention, a package body can be obtained which can suppress abnormal behavior of electronic components when the cover tape is peeled from a carrier tape even when the package body is placed in a hot and humid environment. Therefore, by using the cover tape for electronic component packaging and the package of the present invention, the mounting of the electronic component can be improved.
Drawings
Fig. 1 is a schematic cross-sectional view illustrating a cover tape for electronic component packaging according to the present invention.
Fig. 2(a) and 2(b) are a schematic plan view and a cross-sectional view illustrating a package of the present invention.
Fig. 3 is a schematic cross-sectional view illustrating the cover tape for electronic component packaging according to the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like. However, the present invention may be embodied in many different forms and should not be construed as being limited to the contents of the embodiments illustrated below. In order to make the description more clear, there are: the width, thickness, shape, and the like of each part are schematically shown as compared with the actual form, but this is merely an example and does not limit the explanation of the present invention. In the present specification and the drawings, the same reference numerals are given to the same components as those described in the already-presented drawings, and detailed description thereof may be omitted as appropriate.
In the present specification, when a mode of disposing another component on a certain component is expressed, in a case of merely being referred to as "upper" or "lower", the following two cases are included unless otherwise specified: a case where another member is disposed directly above or below a certain member so as to be in contact with the certain member; and the case where another member is disposed above or below a certain member and further via another member. In the present specification, when a mode of disposing another member on a surface of a certain member is expressed, the case of merely being referred to as "surface side" or "surface" includes the following two cases unless otherwise specified: a case where another member is disposed directly above or below a certain member so as to be in contact with the certain member; and the case where another member is disposed above or below a certain member and further via another member.
The cover tape for electronic component packaging and the package of the present invention will be described in detail below.
A. Cover tape for packaging electronic component
The cover tape for packaging electronic components of the present invention is a cover tape for packaging electronic components, comprising a base material layer, a heat-seal layer disposed on one surface side of the base material layer and comprising an ethylene-vinyl acetate copolymer and a polyethylene resin, and an antistatic layer disposed on the surface side of the base material layer opposite to the surface side on the heat-seal layer side. In the present specification, the "cover tape for electronic component packaging" may be simply referred to as "cover tape".
The cover tape of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a schematic cross-sectional view showing an example of the cover tape of the present invention. As shown in fig. 1, the cover tape 1 of the present invention has: a base material layer 2; a heat-seal layer 3 disposed on one side of the base layer 2, and including an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer 4 disposed on the side of the base layer 2 opposite to the side of the heat-seal layer 3.
Fig. 2(a) and 2(b) are a schematic plan view and a cross-sectional view showing an example of a package using the cover tape for electronic component packaging of the present invention, and fig. 2(b) is a cross-sectional view taken along line a-a of fig. 2 (a). As shown in fig. 2(a) and (b), the package 10 includes: a carrier tape 11 having a plurality of receiving portions 12 for receiving electronic components 13; an electronic component 13 housed in the housing portion 12; and a cover tape 1 disposed so as to cover the housing 12. The cover tape 1 is heat-sealed to the carrier tape 11, and heat-sealed portions 3h are provided in a line shape with a predetermined width at both ends of the heat-sealed layer 3 of the cover tape 1. In addition, in the package 10, the carrier tape 11 may have a feeding hole 14.
The inventors of the present invention found that: in the case of using a cover tape having a heat-seal layer containing an ethylene-vinyl acetate copolymer, since the initial surface tackiness is high, when a plurality of electronic components are bonded, and further, when the cover tape is left in a high-humidity environment during storage or transportation of a package, the heat-seal layer is likely to deteriorate, and the electronic components bonded to the cover tape are less likely to fall off.
The reason for this is presumed to be: a cover tape having a heat seal layer comprising an ethylene-vinyl acetate copolymer has good heat sealability because of high MFR (melt flow rate) and low viscosity due to the characteristics of the ethylene-vinyl acetate copolymer, but on the other hand, has high surface tackiness and is susceptible to deterioration in a high-humidity and high-heat environment. In particular, since the package is usually wound up during storage or transportation, such electronic components are found to be less likely to fall off.
Accordingly, the present inventors have conducted intensive studies and found that: in order to suppress adhesion of electronic components to the cover tape, it is necessary to suppress static electricity, to reduce initial surface tackiness of the heat sealing layer of the cover tape, and to suppress deterioration after it is placed in a high-humidity and high-temperature environment. Further, the present inventors have further studied and found that: by including the polyethylene resin in addition to the ethylene-vinyl acetate copolymer in the heat-seal layer of the cover tape, the surface tackiness can be reduced, and deterioration occurring after it is placed in a high-humidity and high-temperature environment can be suppressed.
As described above, in the present invention, by using the cover tape having the heat seal layer containing the ethylene-vinyl acetate copolymer and the polyethylene resin, in the package using the cover tape of the present invention, it is possible to obtain a package capable of suppressing abnormal behaviors of the electronic component such as jumping out of the receiving portion of the carrier tape, protrusion, rising, and the like due to the electronic component being attached to the cover tape when the cover tape is peeled from the carrier tape.
As described above, according to the cover tape for packaging electronic components of the present invention, the electronic components can be taken out normally, and the mounting efficiency can be improved.
Hereinafter, each structure of the cover tape of the present invention will be described.
1. Heat sealing layer
The heat-seal layer of the present invention is a layer which is disposed on one side of a base material layer and comprises an ethylene-vinyl acetate copolymer and a polyethylene resin. The heat seal layer is formed by bonding the cover tape to the carrier tape by heat sealing the carrier tape when the cover tape of the present invention is used to manufacture a package.
(a) Ethylene-vinyl acetate copolymer
The heat seal layer comprises an ethylene-vinyl acetate copolymer. By including the ethylene-vinyl acetate copolymer in the heat seal layer, heat sealability with respect to the carrier tape becomes good. In general, it is difficult to heat-seal a cover tape to a paper carrier tape, but a cover tape having a heat-seal layer containing an ethylene-vinyl acetate copolymer can also obtain good heat-sealability to a paper carrier tape. Therefore, the cover tape of the present invention can prevent the occurrence of unexpected peeling during transportation and storage.
The ethylene-vinyl acetate copolymer of the present invention is a copolymer containing at least an ethylene monomer unit and a vinyl acetate monomer unit. The ethylene monomer unit means a structural unit derived from an ethylene monomer, and the vinyl acetate monomer unit means a structural unit derived from a vinyl acetate monomer.
The ethylene content in the ethylene-vinyl acetate copolymer is not particularly limited, and is preferably 60 mass% or more and 97 mass% or less, and particularly preferably 80 mass% or more and 95 mass% or less.
The content of vinyl acetate in the ethylene-vinyl acetate copolymer is not particularly limited, and is preferably 3% by mass or more and 40% by mass or less, and particularly preferably 5% by mass or more and 20% by mass or less.
The ethylene-vinyl acetate copolymer of the present invention may contain a third monomer unit in addition to the ethylene monomer unit and the vinyl acetate monomer unit. Examples of the third monomer unit include (meth) acrylic acid such as styrene, saturated carboxylic acid, and unsaturated carboxylic acid ester, methyl (meth) acrylate, methyl acrylate, ethyl acrylate, butyl acrylate, propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-decene, 1, 3-butadiene, conjugated dienes such as 1-methyl-1, 3-butadiene, and non-conjugated dienes such as 1, 4-pentadiene and 1, 5-hexadiene.
The content of the ethylene-vinyl acetate copolymer in the heat-seal layer is not particularly limited, and may be more than 0% by mass and less than 100% by mass, preferably 50% by mass or more and 90% by mass or less, and more preferably 60% by mass or more and 80% by mass or less.
The above value or more is preferable because a preferable sealing strength can be obtained. The value of less than the above is preferable because initial tackiness can be reduced and deterioration of the heat sealing layer can be suppressed even after exposure to a high-humidity environment.
(b) Polyethylene resin
The heat-seal layer of the present invention is characterized by containing a polyethylene resin. By blending a polyethylene resin in addition to the ethylene-vinyl acetate copolymer in the heat-seal layer, the surface tackiness can be reduced while maintaining good heat-seal properties, and deterioration after exposure to a high-humidity and high-heat environment can be suppressed.
The polyethylene resin includes various polyethylenes such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene, but low-density polyethylene (LDPE, density 0.910 to less than 0.930) and linear low-density polyethylene (LLDPE, density 0.910 to 0.925) are preferably used because of their superiority in terms of dispersibility.
In the present invention, the classification of each polyethylene is based on the old JIS K6748: 1995. JIS K6899-1: 2000.
The content of the polyethylene resin in the heat-seal layer may be, for example, more than 0% by mass and less than 100%, preferably 10% by mass or more and 50% by mass or less, and more preferably 20% by mass or more and 40% by mass or less.
If the value is less than the above value, the sealing strength after heat sealing is not affected, and therefore, it is possible to suppress the possibility of an abnormality such as peeling occurring when packaging the electronic component, and the possibility of the cover tape accidentally peeling off during storage or transportation, and therefore, it is preferable. When the amount is equal to or more than the above value, the initial surface tackiness of the heat seal layer is suppressed, and the deterioration after the heat seal layer is exposed to a moist heat environment is also suppressed. Further, it is more preferable to set the value within the above range because the above effects are achieved.
In the present invention, as described above, the content of the polyethylene resin in the heat-seal layer is preferably 10% by mass or more and 50% by mass or less, and particularly preferably 20% by mass or more and 40% by mass or less for the following reasons.
That is, as described above, in order to prevent deterioration after exposure to a moist heat environment and suppress abnormal behavior of electronic components such as jumping, protrusion, and rising of the electronic components from the storage portions of the carrier tape, it is preferable that the content of the polyethylene resin in the heat seal layer is high. On the other hand, when a paper carrier tape is used, it is generally difficult to improve the seal strength after heat sealing, and therefore, it is necessary to increase the content of the ethylene-vinyl acetate copolymer in the heat seal layer.
From such a viewpoint, in order to suppress the possibility of occurrence of an abnormality such as peeling at the time of packaging the electronic component or the possibility of accidental peeling of the cover tape during storage or transportation, specifically, a sealing strength of about 5 to 50gf, preferably about 15 to 40gf is provided, and therefore, the range of the content of the polyethylene resin in the heat sealing layer is set as described above.
The seal strength is a value measured by a method used in [ evaluation of heat seal strength ] in examples described later.
The heat-seal layer may contain other resins as long as it contains an ethylene-vinyl acetate copolymer and a polyethylene resin. Examples of the other resin include polyolefins such as polypropylene; a polyester; acrylic acid such as polyacrylate and polymethacrylate. These resins may also be modified.
If necessary, additives such as adhesion imparting agents, antistatic agents, antiblocking agents, dispersants, fillers, plasticizers, colorants, and the like may also be contained in the heat-seal layer.
The thickness of the heat-seal layer can be set to, for example, 5 μm or more and 60 μm or less. In the case of a paper carrier tape, the thickness of the heat-seal layer may be set to, for example, 10 μm or more and 60 μm or less, and may be 10 μm or more and 60 μm or less. In the case of a plastic carrier tape, the thickness of the heat-seal layer can be set to, for example, 5 μm or more and 60 μm or less. If the thickness of the heat seal layer is too thin, a uniform film may not be obtained. Further, if the thickness of the heat seal layer is too large, the transparency of the cover tape may be lowered.
As a method for forming the heat-seal layer, for example, a method can be mentioned in which a composition for heat-seal layer in which an ethylene-vinyl acetate copolymer, a polyethylene resin, and optionally the other resins and additives mentioned above are dispersed or dissolved in a solvent is used, and the composition for heat-seal layer is applied to one surface side of a base layer and dried. Examples of the coating method of the composition for a heat-seal layer include known coating methods such as roll coating, reverse coating, gravure reverse coating, comma coating, bar coating, wire bar coating, rod coating, contact coating, blade coating, die coating, flow coating, dip coating, and spray coating.
In addition, a film may be used as a heat sealing layer. In this case, the method for laminating the base layer and the heat-seal layer is not particularly limited, and a known method can be used. Examples of the method include a method of bonding a film produced in advance to a base material layer with an adhesive, and a method of extruding a raw material of a film after heat fusion to a base material layer with a T-die or the like to obtain a laminate. Examples of the adhesive include a polyester adhesive, a polyurethane adhesive, and an acrylic adhesive.
2. Antistatic layer
The antistatic layer of the present invention is a layer for preventing electrification of the cover tape, which is disposed on the surface of the base material layer opposite to the surface on the heat-seal layer side. By providing the antistatic layer, it is possible to prevent the electronic component from adhering to the cover tape due to static electrification, and prevent dirt, dust, and the like from adhering to the surface of the cover tape. In addition, the generation of static electricity due to contact with other surfaces can be prevented.
The antistatic layer is formed by coating an antistatic agent on the base material layer. Examples of the antistatic agent include conductive polymers, for example, polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylacetylene, and polyvinylcarbazole. Among them, the conductive polymer is preferably selected from polythiophene, polyaniline and polypyrrole in more than 1. Since sufficient antistatic properties and transparency independent of humidity can be obtained. As the polythiophene, PEDOT/PSS (poly (3, 4-ethylenedioxythiophene/polystyrene sulfonic acid) is preferably used, for example, as the polyaniline, sulfonated polyaniline is suitably used.
In addition, the antistatic layer of the present invention can exhibit antistatic properties by including an antistatic agent other than the conductive polymer. Examples of the antistatic agent other than the conductive polymer include a polymer surfactant and a low-molecular surfactant. The surfactant includes nonionic, cationic and anionic surfactants, and the cationic polymer surfactant is preferable from the viewpoint of antistatic performance and coatability. The counter anion of the quaternary ammonium salt is not particularly limited, and examples thereof include a halide ion, a sulfide ion, and the like, and may include an aryl group and an alkyl group at the 1-3 position of ammonium, but is not particularly limited. From the viewpoint of solubility, the number of carbon atoms is preferably 6 or less. The backbone of the polymeric quaternary ammonium salt is preferably an acrylic backbone from the viewpoint of transparency and substrate adhesiveness.
In addition, the antistatic layer may also contain a resin.
As a method for forming the antistatic layer, for example, a method of using a composition for an antistatic layer in which an antistatic agent or the like is dispersed or dissolved in a solvent, applying the composition for an antistatic layer to the other surface side of the base layer, and drying the composition for an antistatic layer is mentioned. Examples of the coating method of the composition for an antistatic layer include known coating methods such as air knife coating, blade coating, bar coating, direct roll coating, reverse coating, gravure coating, and slide coating.
The thickness of the antistatic layer can be set to, for example, 0.02 μm or more and 3 μm or less. By setting the antistatic layer to such a thickness, the cover tape can be given antistatic properties.
3. Substrate layer
The base material layer of the present invention is a layer supporting the heat-seal layer and the antistatic layer.
As the base material layer, various materials can be used as long as they have mechanical strength capable of withstanding external force during storage and transportation, heat resistance capable of withstanding manufacturing and tape packaging, and the like. Polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, and terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer; polyamides such as nylon 6, nylon 66, and nylon 610; polyolefins such as polyethylene, polypropylene, and polymethylpentene. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are preferably used because they are excellent in cost and mechanical strength.
Further, the base material layer may contain additives such as a filler, a plasticizer, a colorant, and an antistatic agent, if necessary.
The substrate layer may be a single layer or a multilayer laminate of the same or different types. The substrate layer may be a stretched film or an unstretched film. The base material layer may be a film stretched in a uniaxial direction or a biaxial direction to improve strength.
The thickness of the base material layer may be set to, for example, 2.5 μm or more and 300 μm or less, may be 6 μm or more and 100 μm or less, and may be 12 μm or more and 50 μm or less. If the thickness of the base material layer is too large, the rigidity becomes high when the tape packaging is performed, which is disadvantageous in terms of handling property and cost. If the thickness of the base material layer is too small, the mechanical strength may be insufficient.
The base material layer may be subjected to an adhesion facilitating treatment such as corona discharge treatment, plasma treatment, ozone treatment, flame treatment (フレーム), preheating treatment, dust removal treatment, vapor deposition treatment, alkali treatment, blast treatment, or the like.
4. Intermediate layer
In the present invention, as shown in fig. 3, for example, an intermediate layer 5 may be disposed between the base layer 2 and the heat-seal layer 3 as needed. The intermediate layer can improve the adhesion between the base layer and the heat-seal layer. In addition, when the cover tape of the present invention is heat-sealed to the carrier tape through the intermediate layer, the cushioning property can be improved, and thus heat can be more uniformly applied to the heat-seal layer.
The material of the intermediate layer is appropriately selected depending on the material of the base layer and the heat-seal layer, and examples thereof include polyolefins such as polyethylene and polypropylene, polyurethanes, and polyesters.
The thickness of the intermediate layer can be set to, for example, 5 μm or more and 50 μm or less.
A membrane may be used as an intermediate layer. In this case, the method for laminating the base layer and the intermediate layer is not particularly limited, and a known method can be used. Examples thereof include a method of bonding a film produced in advance to a base material layer with an adhesive, and a method of extruding a raw material of a film after heat fusion to a base material layer with a T-die or the like to obtain a laminate. The adhesive is the same as the adhesive described in the section of the heat-seal layer.
5. Adhesion promoting layer
Further, an adhesion promoting layer may be provided between the base material layer and the intermediate layer. By forming the adhesion promoting layer on the base material layer, the adhesion between the base material layer and the intermediate layer can be improved even when the base material layer lacks adhesion. The adhesion promoter layer may be appropriately selected depending on the materials used for the base layer and the intermediate layer, and is not particularly limited. The adhesion promoting layer can be formed by a resin having good adhesion such as an acrylic, isocyanate, urethane, or ester adhesive.
B. Packaging body
The package of the present invention comprises: a carrier tape having a plurality of receiving portions for receiving electronic components; an electronic component housed in the housing section; and the cover tape, it disposes in a manner to cover the above-mentioned containing department.
In the present invention, by providing the cover tape having the heat seal layer containing the ethylene-vinyl acetate copolymer and the polyethylene resin, a package using the cover tape of the present invention can be obtained in which abnormal behavior of electronic components such as jumping out of a housing portion of a carrier tape, protrusion, and rising of the electronic components due to the electronic components being attached to the cover tape can be suppressed when the cover tape is peeled from the carrier tape.
Fig. 2(a) and (b) are a schematic plan view and a cross-sectional view showing an example of the package of the present invention. In fig. 2(a) and (b), the above-mentioned "a-type covering tape for packaging electronic components" is described, and therefore, the description thereof is omitted.
Hereinafter, each structure of the package of the present invention will be described.
1. Covering belt
The covering tape of the present invention is described in the above "covering tape for packaging electronic components" and thus will not be described in detail here.
In the package of the present invention, the heat seal layer of the cover tape and the carrier tape are bonded to each other by the heat seal portion. The heat seal portion may be provided, for example, in a part of a portion where the heat seal layer of the cover tape and the carrier tape are joined. That is, the heat seal layer may have a heat seal portion and a non-heat seal portion. This makes it possible to improve the peelability of the cover tape from the carrier tape.
2. Carrier tape
The carrier tape of the present invention is a component having a plurality of receiving portions for receiving electronic components.
The carrier tape may have a plurality of receiving portions, and may be, for example, an embossed carrier tape (also referred to as an embossed tape), a punched carrier tape (also referred to as a punched tape), or a punched carrier tape (also referred to as a punched tape). Among them, embossed carrier tapes are suitably used from the viewpoint of cost, formability, dimensional accuracy, and the like.
Examples of the material of the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and paper. The carrier tape is preferably made of paper. That is, a paper carrier tape made of paper is preferable. The paper of the present invention is mainly composed of cellulose, and may further contain a resin component. The reason is that the paper carrier tape is excellent in terms of cost, environmental load, and the like, and can exhibit appropriate adhesion to the cover tape of the present invention.
The thickness of the carrier tape is appropriately selected according to the material of the carrier tape, the thickness of the electronic component, and the like. For example, the thickness of the carrier tape may be set to 30 μm or more and 1500 μm or less. If the thickness of the carrier tape is too thick, moldability may be deteriorated, and if the thickness of the carrier tape is too thin, strength may be insufficient.
The carrier tape has a plurality of receiving portions. Usually, the receiving portions are arranged at a specific interval in the longitudinal direction of the carrier tape. The size, depth, pitch, and the like of the housing portion are appropriately adjusted according to the size, thickness, and the like of the electronic component.
As a method for forming the carrier tape having the storage section, a commonly used carrier tape forming method can be used, and the method can be appropriately selected according to the kind, material, and the like of the carrier tape. Examples thereof include press forming, vacuum forming, pressure-air forming, press working, and compression working.
3. Electronic component
The electronic component used in the package of the present invention is not particularly limited, and examples thereof include an IC, a resistor, a capacitor, an inductor, a transistor, a diode, an LED (light emitting diode), a liquid crystal, a piezoelectric element buffer, a filter, a crystal oscillator, a crystal resonator, a connector, a switch, a potentiometer, and a relay. The form of IC is also not particularly limited.
4. Packaging body
The package of the present invention is used for storage and transportation of electronic components. The electronic components are stored and transported in a packaged state for mounting. At the time of mounting, the cover tape is peeled off, and the electronic component accommodated in the accommodation portion of the carrier tape is taken out and mounted on a substrate or the like.
The present invention is not limited to the above embodiments. The above-described embodiments are illustrative, and any one having substantially the same configuration and exhibiting the same operational effects as the technical idea described in the claims of the present invention is included in the technical scope of the present invention.
[ examples ]
Hereinafter, examples and comparative examples are shown to explain the present invention in more detail.
[ example 1]
As the base material layer, a 2-axis stretched polyethylene terephthalate film (FE 2002 manufactured by FUTAMURA CHEMICAL corporation, hereinafter referred to as PET film) having a thickness of 25 μm and both surfaces corona-treated was prepared. An antistatic coating agent (araacoat AS601D/CL910 (mass ratio) 10/1, manufactured by seikagawa chemical company, containing PEDOT AS a conductive polymer and aziridine AS a curing agent) was applied to one surface side of the PET film to form an antistatic layer. A urethane tackifier (Takenate a-3075/Takelac a-3210 (mass ratio) 3/1 was diluted with 5% ethyl acetate) was applied to the side of the PET film opposite to the side on which the antistatic layer was formed, to form an adhesion-promoting layer. Then, a polyethylene resin (manufactured by CE4009 Sumikathene L705 sumikatent chemical) and an ethylene-vinyl acetate copolymer (Melthene (registered trademark) M (MX53C) manufactured by eastern cao) were mixed by melt extrusion processing to obtain materials, which were laminated in a thickness of 40/60 (mass ratio) to form an intermediate layer and a heat-seal layer, respectively. Thus, a cover tape 1 having a structure including an antistatic layer (1 μm or less)/a base material layer (25 μm)/an adhesion-promoting layer/an intermediate layer (20 μm)/a heat-seal layer (20 μm) was produced.
[ example 2]
A cover tape 2 having a structure including an antistatic layer (1 μ M or less)/base material layer (25 μ M)/adhesion-promoting layer/intermediate layer (20 μ M)/heat seal layer (20 μ M) was produced in the same manner as in example 1, except that the heat seal layer material (the mixed material of the ethylene-vinyl acetate copolymer and the polyethylene resin) in example 1 was changed to a mixed material of a polyethylene resin (manufactured by sumikasel 705 sumisen chemical corporation) and an ethylene-vinyl acetate copolymer (merrsen (registered trademark) M (MX53C), manufactured by tokyo corporation) in a mass ratio of 20/80.
[ example 3]
A cover tape 3 having a structure including an antistatic layer (1 μ M or less)/base material layer (25 μ M)/adhesion-promoting layer/intermediate layer (20 μ M)/heat-seal layer (20 μ M) was produced in the same manner as in example 1, except that the material for the heat-seal layer (the material mixture of an ethylene-vinyl acetate copolymer and a polyethylene resin) in example 1 was changed to a material mixture of a polyethylene resin (manufactured by sumikasel 705 sumiscom chemical corporation) and an ethylene-vinyl acetate copolymer (merrsen (registered trademark) M (MX53C), manufactured by tokyo corporation) of 60/40.
Comparative example 1
A cover tape 4 having a structure including an antistatic layer (1 μ M or less)/a base material layer (25 μ M)/an adhesion promoting layer/an intermediate layer (20 μ M)/a heat seal layer (20 μ M) was produced in the same manner as in example 1, except that the material of the heat seal layer (the mixed material of the ethylene-vinyl acetate copolymer and the polyethylene resin) in example 1 was changed to an ethylene-vinyl acetate copolymer (merusn (registered trademark) M (MX53C, manufactured by tokyo corporation).
Comparative example 2
A cover tape 5 having a structure including an antistatic layer (1 μm or less)/a base material layer (25 μm)/an adhesion-promoting layer/an intermediate layer (20 μm)/a heat-seal layer (20 μm) was produced in the same manner as in example 1, except that the material of the heat-seal layer (the mixed material of the ethylene-vinyl acetate copolymer and the polyethylene resin) in example 1 was changed to a polyethylene resin (manufactured by sumikasel 705 sumitomo chemical corporation).
[ evaluation of initial tackiness ]
The adhesiveness of the heat-seal layers of the obtained cover tapes 1 to 4 was measured in the following manner.
(measurement method)
The heat-sealed layer of the sample was faced up and 4 corners of the sample were attached to a glass slide (76X 26mm, 0.8-1.0 mmt) in a flat manner. The sample was placed on a stage of a measuring apparatus described below, the probe was brought into contact with the sample from above under the following conditions, the probe was separated from the sample under the following conditions, and a load value applied to the probe at this time was obtained. The results are shown in Table 1.
(measurement device)
Viscosity tester TAC-2 (manufactured by RHESCA)
(measurement conditions)
Pressing (compression) speed: 30mm/min
Pressurizing load: 200gf
Pressurizing time: 10s
Measurement (detachment) speed: 30mm/min
Measurement contact part (probe): SUS304 cylinder diameter 5mm
Temperature conditions: probe temperature 60 ℃ and sample stage temperature 60 ℃ (sample temperature 60 ℃)
[ evaluation of the number of abnormal behaviors ]
Using the cover tapes 1 to 4, a sample of a package was prepared as follows, and the number of abnormal behaviors of the electronic component when the cover tape was peeled off from the package was measured.
(sample preparation)
The samples of the packages were prepared under the following conditions. While 500 electronic components described below were continuously arranged in a cavity of a paper carrier tape described below, the paper carrier tape and a cover tape were heat-sealed and wound up using a taping machine described below under the following conditions, and thus a sample of a roll-shaped package was obtained.
(conditions for sample preparation)
Braider NST-35 (manufactured by Ridong Industrial Co., Ltd.)
A paper carrier: HOCTO 0.31mmt made by Beiyue State paper making (virgin paper)
Temperature of the braid: 180 deg.C
Braiding speed: 3500 productivity (takt)
Sealing width: 0.6mm 2
Electronic component: 0402 size capacitor
(determination of the number of abnormal behaviors)
The rolls of the package were stored in a constant temperature and humidity laboratory at 60 ℃ and 95% RH for 24 hours. The cover tape was peeled from the stored roll-shaped package at a speed of 100 mm/sec using a cover tape peeling device (W08f smart dispenser, manufactured by FUJI Co., Ltd.). The stripping was performed at 25. + -. 3 ℃ and 30. + -. 5% RH and completed within 10 seconds. The behavior of the electronic component at the time of peeling was observed by a high-speed camera. At the time of peeling, the number of abnormal behaviors was counted by visual observation while playing an image taken by a high-speed camera at a slow speed (slow motion) with the case where more than half of the chips were ejected from the cavity of the paper carrier (including the case where the electronic component was stuck to the cover tape, the case where the electronic component was rotated by 90 degrees and the case where the electronic component was ejected from the cavity of the paper carrier tape) as abnormal behaviors.
Similarly, after storage at room temperature (24 hours), the behavior of the electronic component at the time of peeling was observed by the high-speed camera, and the number of abnormal behaviors was counted by visual observation while the image captured by the high-speed camera was played back at a slow speed. The results are shown in Table 1.
[ Table 1]
[ evaluation of Heat seal Strength ]
The peel strength of a sample obtained by sealing the paper carrier tape and the cover tapes 1 to 5 under the following taping conditions was measured by a seal strength measuring machine under the following conditions. The measurement value was defined as an average value of a measurement length of 15 cm. The results are shown in Table 2.
(Heat-sealing device and Heat-sealing Condition)
Braider NST-35 (manufactured by Ridong Industrial Co., Ltd.)
A paper carrier: HOCTO 0.31mmt made by Beiyue State paper making (virgin paper)
Temperature of the braid: 180 deg.C
Braiding speed: 3500 productive distance
Sealing width: 0.6mm 2
(seal Strength measurement conditions)
The device comprises the following steps: vanguard Systems peel back tester VG-20
Stripping speed: 300mm/min
Stripping temperature: 25 +/-3 DEG C
Peeling angle: 165-175 DEG
[ Table 2]
According to tables 1 and 2, the surface tackiness of the cover tape (examples 1 to 3) including the ethylene-vinyl acetate copolymer and the polyethylene resin in the heat-seal layer of the present invention was suppressed, the number of abnormal behaviors when the cover tape was peeled from the package after being placed in a high-humidity and high-heat environment was suppressed, and the seal strength was also sufficient. On the other hand, in comparative example 1 in which the heat seal layer does not contain a polyethylene resin, the surface tackiness was strong, and the number of abnormal behaviors when the cover tape was peeled off from the package after being placed in a high-humidity and high-heat environment was large. In addition, in comparative example 2 in which the heat-seal layer did not contain the ethylene-vinyl acetate copolymer, the heat-seal strength was weak.
Description of the reference numerals
1 cover belt
2 base material layer
3 Heat sealing layer
4 antistatic layer
5 intermediate layer
10 packaging body
11 Carrier tape
12 receiving part
13 electronic component
Claims (5)
1. A cover tape for packaging an electronic component, comprising:
a substrate layer;
a heat-seal layer disposed on one side of the base layer, the heat-seal layer comprising an ethylene-vinyl acetate copolymer and a polyethylene resin; and
and an antistatic layer disposed on a surface of the base material layer opposite to the heat-seal layer.
2. The covering tape for electronic component packaging according to claim 1, wherein the heat-seal layer contains 10% by mass or more and 50% by mass or less of the polyethylene resin.
3. The covering tape for electronic component packaging according to claim 1 or 2, wherein the heat seal layer contains 20% by mass or more and 40% by mass or less of the polyethylene resin.
4. A package is provided with:
a carrier tape having a plurality of receiving portions for receiving electronic components;
an electronic component housed in the housing section; and
a cover tape for electronic component packaging according to any one of claims 1 to 3, which is disposed so as to cover the housing.
5. The package of claim 4, wherein the carrier tape is a paper carrier tape made of paper.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019071334 | 2019-04-03 | ||
| JP2019-071334 | 2019-04-03 | ||
| PCT/JP2020/015204 WO2020204138A1 (en) | 2019-04-03 | 2020-04-02 | Electronic component packaging cover tape and package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113646242A true CN113646242A (en) | 2021-11-12 |
| CN113646242B CN113646242B (en) | 2023-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080026131.0A Active CN113646242B (en) | 2019-04-03 | 2020-04-02 | Cover tape for packaging electronic components and package |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6822626B1 (en) |
| KR (1) | KR102646543B1 (en) |
| CN (1) | CN113646242B (en) |
| TW (1) | TW202043111A (en) |
| WO (1) | WO2020204138A1 (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000280411A (en) * | 1999-03-31 | 2000-10-10 | Dainippon Printing Co Ltd | Laminated plastic film, transparent conductive cover tape and package |
| JP2001315847A (en) * | 2000-05-01 | 2001-11-13 | Denki Kagaku Kogyo Kk | Cover tape |
| JP2005112424A (en) * | 2003-10-09 | 2005-04-28 | Hokuetsu Paper Mills Ltd | Chiplike electronic device carrier tape paper |
| JP2005178073A (en) * | 2003-12-17 | 2005-07-07 | Shin Etsu Polymer Co Ltd | Cover tape and package |
| WO2013042727A1 (en) * | 2011-09-22 | 2013-03-28 | 東ソー株式会社 | Adhesive resin composition and easy-peeling film |
| JP2014501185A (en) * | 2010-12-17 | 2014-01-20 | スリーエム イノベイティブ プロパティズ カンパニー | Cover tape for packaging heat seals and electronic components |
| CN105377713A (en) * | 2013-07-09 | 2016-03-02 | 住友电木株式会社 | Cover tape for packaging electronic components |
| CN106604878A (en) * | 2014-11-12 | 2017-04-26 | 住友电木株式会社 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
| WO2018061442A1 (en) * | 2016-09-28 | 2018-04-05 | 住友ベークライト株式会社 | Resin composition, cover tape, and electronic component package |
| WO2018235606A1 (en) * | 2017-06-22 | 2018-12-27 | 住友ベークライト株式会社 | Cover tape and electronic component package |
| CN112703157A (en) * | 2018-09-18 | 2021-04-23 | 大日本印刷株式会社 | Cover tape for packaging electronic component and package |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57131106A (en) * | 1981-02-05 | 1982-08-13 | Matsushita Electric Ind Co Ltd | Synchronizing detecting device |
| JPH1095448A (en) | 1996-09-18 | 1998-04-14 | Dainippon Printing Co Ltd | Lid material for carrier tape |
-
2020
- 2020-04-02 CN CN202080026131.0A patent/CN113646242B/en active Active
- 2020-04-02 JP JP2020559591A patent/JP6822626B1/en active Active
- 2020-04-02 KR KR1020217031546A patent/KR102646543B1/en active IP Right Grant
- 2020-04-02 WO PCT/JP2020/015204 patent/WO2020204138A1/en active Application Filing
- 2020-04-06 TW TW109111479A patent/TW202043111A/en unknown
-
2021
- 2021-01-07 JP JP2021001425A patent/JP2021062923A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000280411A (en) * | 1999-03-31 | 2000-10-10 | Dainippon Printing Co Ltd | Laminated plastic film, transparent conductive cover tape and package |
| JP2001315847A (en) * | 2000-05-01 | 2001-11-13 | Denki Kagaku Kogyo Kk | Cover tape |
| JP2005112424A (en) * | 2003-10-09 | 2005-04-28 | Hokuetsu Paper Mills Ltd | Chiplike electronic device carrier tape paper |
| JP2005178073A (en) * | 2003-12-17 | 2005-07-07 | Shin Etsu Polymer Co Ltd | Cover tape and package |
| JP2014501185A (en) * | 2010-12-17 | 2014-01-20 | スリーエム イノベイティブ プロパティズ カンパニー | Cover tape for packaging heat seals and electronic components |
| WO2013042727A1 (en) * | 2011-09-22 | 2013-03-28 | 東ソー株式会社 | Adhesive resin composition and easy-peeling film |
| CN105377713A (en) * | 2013-07-09 | 2016-03-02 | 住友电木株式会社 | Cover tape for packaging electronic components |
| CN106604878A (en) * | 2014-11-12 | 2017-04-26 | 住友电木株式会社 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
| WO2018061442A1 (en) * | 2016-09-28 | 2018-04-05 | 住友ベークライト株式会社 | Resin composition, cover tape, and electronic component package |
| CN109790345A (en) * | 2016-09-28 | 2019-05-21 | 住友电木株式会社 | Resin combination, covering band and electronic building brick package body |
| WO2018235606A1 (en) * | 2017-06-22 | 2018-12-27 | 住友ベークライト株式会社 | Cover tape and electronic component package |
| CN110770144A (en) * | 2017-06-22 | 2020-02-07 | 住友电木株式会社 | Cover tape and electronic component package |
| CN112703157A (en) * | 2018-09-18 | 2021-04-23 | 大日本印刷株式会社 | Cover tape for packaging electronic component and package |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210144738A (en) | 2021-11-30 |
| JP6822626B1 (en) | 2021-01-27 |
| KR102646543B1 (en) | 2024-03-13 |
| CN113646242B (en) | 2023-04-21 |
| JPWO2020204138A1 (en) | 2021-04-30 |
| TW202043111A (en) | 2020-12-01 |
| JP2021062923A (en) | 2021-04-22 |
| WO2020204138A1 (en) | 2020-10-08 |
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