CN113646242B - Cover tape for packaging electronic components and package - Google Patents
Cover tape for packaging electronic components and package Download PDFInfo
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- CN113646242B CN113646242B CN202080026131.0A CN202080026131A CN113646242B CN 113646242 B CN113646242 B CN 113646242B CN 202080026131 A CN202080026131 A CN 202080026131A CN 113646242 B CN113646242 B CN 113646242B
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- layer
- cover tape
- electronic components
- heat
- tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
Abstract
The present invention provides a cover tape for packaging electronic components, comprising: a substrate layer; a heat sealing layer which is disposed on one surface side of the base material layer and which comprises an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer disposed on a surface of the base material layer opposite to the surface of the heat sealing layer.
Description
Technical Field
The present invention relates to a cover tape for packaging electronic components and a package using the cover tape.
Background
In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric element buffers have been packaged with braids for surface mounting. In the braid package, the electronic component is accommodated in a carrier tape having a plurality of accommodating portions for accommodating the electronic component, and then the carrier tape is heat-sealed with a cover tape to obtain a package for storing and carrying the electronic component. In addition, when mounting the electronic component, the cover tape is peeled off from the carrier tape, and the electronic component is automatically taken out and surface-mounted on the substrate. The cover tape is also referred to as an upper tape.
In addition, in the braid package, in addition to the case where static electricity is generated due to friction or contact between the electronic component and the carrier tape or the cover tape, static electricity is generated due to peeling of the cover tape from the carrier tape at the time of mounting.
Accordingly, various cover tapes having antistatic properties have been proposed to suppress the generation of static electricity (for example, refer to patent documents 1 to 3).
Prior art literature
Patent literature
Patent document 1: japanese patent No. 4162961
Patent document 2: japanese patent laid-open No. 10-95448
Patent document 3: japanese patent No. 4061136
Disclosure of Invention
Problems to be solved by the invention
However, the inventors of the present invention, et al found that: even in the case of using a cover tape having antistatic properties, there are cases where electronic components adhere to the cover tape.
The present invention has been made in view of the above-described problems, and an object thereof is to provide a cover tape for packaging electronic components, which can suppress abnormal behavior of electronic components when peeled from a carrier tape.
Technical means for solving the problems
One embodiment of the present invention provides a cover tape for packaging electronic components, comprising: a substrate layer; a heat sealing layer which is disposed on one surface side of the base material layer and which comprises an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer disposed on a surface of the base material layer opposite to the surface of the heat sealing layer.
One embodiment of the present invention provides a package comprising: a carrier tape having a plurality of storage sections for storing electronic components; an electronic component accommodated in the accommodation portion; and the cover tape for packaging electronic components, which is disposed so as to cover the storage portion.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the cover tape for packaging electronic components of the present invention, it is possible to obtain a package body that can suppress abnormal behavior of electronic components when the cover tape is peeled off from the carrier tape even when the package body is placed in a hot and humid environment. Therefore, by using the cover tape for packaging electronic components and the package of the present invention, the mounting of electronic components can be improved.
Drawings
Fig. 1 is a schematic cross-sectional view illustrating a cover tape for packaging electronic components of the present invention.
Fig. 2 (a) and 2 (b) are schematic plan and cross-sectional views illustrating the package of the present invention.
Fig. 3 is a schematic cross-sectional view illustrating a cover tape for packaging electronic components of the present invention.
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings. However, the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth below. In addition, in order to make the description more clear, there are: the width, thickness, shape, etc. of each portion are schematically shown as compared with the actual embodiment, but this is merely an example and does not limit the explanation of the present invention. In the present specification and the drawings, the same components as those described in the drawings already presented are denoted by the same reference numerals, and detailed description thereof may be omitted appropriately.
In this specification, when a mode of disposing other components on a certain component is expressed, when it is merely a case of "up" or "down", the following two cases are included unless otherwise specified: a case where another component is disposed directly above or directly below the component so as to be connected to the component; and a case where another component is disposed above or below the certain component and further via another component. In addition, in this specification, when a mode in which other members are arranged on a surface of a certain member is expressed, in a case of being merely referred to as "surface side" or "surface", the following two cases are included unless otherwise specified: a case where another component is disposed directly above or directly below the component so as to be connected to the component; and a case where another component is disposed above or below the certain component and further via another component.
The cover tape and the package for packaging electronic components according to the present invention will be described in detail below.
A. Cover tape for packaging electronic parts
The cover tape for packaging electronic components of the present invention is a cover tape for packaging electronic components, which has a base material layer, a heat sealing layer that is disposed on one surface side of the base material layer and that contains an ethylene-vinyl acetate copolymer and a polyethylene resin, and an antistatic layer that is disposed on the surface side of the base material layer opposite to the surface on the heat sealing layer side. In the present specification, the "cover tape for packaging electronic components" may be simply referred to as "cover tape".
The cover tape of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a schematic cross-sectional view showing an example of a cover tape of the present invention. As shown in fig. 1, the cover tape 1 of the present invention includes: a base material layer 2; a heat sealing layer 3 which is disposed on one surface side of the base material layer 2 and which comprises an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer 4 disposed on the opposite side of the substrate layer 2 from the heat sealing layer 3 side.
Fig. 2 (base:Sub>A) and 2 (b) are schematic plan and cross-sectional views showing an example ofbase:Sub>A package body using the cover tape for packaging electronic components of the present invention, and fig. 2 (b) isbase:Sub>A cross-sectional view taken along linebase:Sub>A-base:Sub>A in fig. 2 (base:Sub>A). As shown in fig. 2 (a) and (b), the package 10 includes: a carrier tape 11 having a plurality of storage sections 12 for storing electronic components 13; an electronic component 13 accommodated in the accommodating section 12; and a cover tape 1 disposed so as to cover the storage section 12. The cover tape 1 is heat-sealed to the carrier tape 11, and heat-sealed portions 3h are provided at both ends of the heat-sealed layer 3 of the cover tape 1 in a line shape with a specific width. In addition, in the package 10, the carrier tape 11 may have a feed hole 14.
The inventors of the present invention have found that: when a cover tape having a heat sealing layer containing an ethylene-vinyl acetate copolymer is used, the heat sealing layer is likely to deteriorate when a plurality of electronic components are bonded to the cover tape because of high initial surface tackiness, and when the electronic components are placed in a high humidity and heat environment during storage or transportation of a package, the electronic components bonded to the cover tape are more likely to fall off.
The reason for this can be presumed to be: the cover tape having a heat-sealing layer containing an ethylene-vinyl acetate copolymer has a high MFR (melt flow rate) and a low viscosity due to the characteristics of the ethylene-vinyl acetate copolymer, and thus has good heat sealability, but on the other hand, has a high surface tackiness and is susceptible to deterioration in a high-humidity and hot environment. In particular, since the package is normally in a wound state during storage or transportation, such electronic components are found to be difficult to fall.
Accordingly, the inventors of the present invention have conducted intensive studies and as a result found that: in order to suppress adhesion of electronic components to the cover tape, it is necessary to reduce the initial surface tackiness of the heat sealing layer of the cover tape and suppress deterioration after the cover tape is placed in a high-humidity and hot environment, in addition to static electricity. Further, the present inventors have further studied and found that: by including the polyethylene resin in addition to the ethylene-vinyl acetate copolymer in the heat sealing layer of the cover tape, the surface tackiness can be reduced, and deterioration after the cover tape is placed in a high-humidity and hot environment can be suppressed.
In this way, in the present invention, by using the cover tape having the heat sealing layer containing the ethylene-vinyl acetate copolymer and the polyethylene resin, in the package using the cover tape of the present invention, it is possible to obtain a package in which abnormal behavior of the electronic component such as the electronic component jumping out of the housing portion of the carrier tape, the bulge, and the rise due to the attachment of the electronic component to the cover tape can be suppressed when the cover tape is peeled off from the carrier tape.
As described above, according to the cover tape for packaging electronic components of the present invention, electronic components can be normally taken out, and the mounting efficiency can be improved.
The following describes the respective configurations of the cover tape of the present invention.
1. Heat sealing layer
The heat sealing layer of the present invention is a layer which is disposed on one surface side of the base material layer and comprises an ethylene-vinyl acetate copolymer and a polyethylene resin. In the case of producing a package using the cover tape of the present invention, the cover tape is bonded to the carrier tape by heat sealing the carrier tape.
(a) Ethylene-vinyl acetate copolymer
The heat-seal layer comprises an ethylene-vinyl acetate copolymer. By including the ethylene-vinyl acetate copolymer in the heat seal layer, heat sealing properties with respect to the carrier tape are improved. In general, it is difficult to heat-seal the cover tape to the paper carrier tape, but a cover tape having a heat-seal layer containing an ethylene-vinyl acetate copolymer can also obtain good heat sealability to the paper carrier tape. Therefore, the cover tape of the present invention can prevent unexpected peeling during transportation and storage.
The ethylene-vinyl acetate copolymer of the present invention is a copolymer comprising at least an ethylene monomer unit and a vinyl acetate monomer unit. The vinyl monomer unit means a structural unit derived from a vinyl monomer, and the vinyl acetate monomer unit means a structural unit derived from a vinyl acetate monomer.
The ethylene content in the ethylene-vinyl acetate copolymer is not particularly limited, but is preferably 60% by mass or more and 97% by mass or less, and particularly preferably 80% by mass or more and 95% by mass or less.
The content of vinyl acetate in the ethylene-vinyl acetate copolymer is not particularly limited, but is preferably 3% by mass or more and 40% by mass or less, and particularly preferably 5% by mass or more and 20% by mass or less.
The ethylene-vinyl acetate copolymer of the present invention may contain a third monomer unit in addition to the ethylene monomer unit and the vinyl acetate monomer unit. Examples of the third monomer unit include conjugated dienes such as styrene, saturated carboxylic acid, unsaturated carboxylic acid ester and the like, (meth) acrylic acid, methyl (meth) acrylate, methyl acrylate, ethyl acrylate, butyl acrylate, propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-decene, 1, 3-butadiene, 2-methyl-1, 3-butadiene and the like, and non-conjugated dienes such as 1, 4-pentadiene and 1, 5-hexadiene.
The content of the ethylene-vinyl acetate copolymer in the heat seal layer is not particularly limited, and may be more than 0% by mass and less than 100% by mass, preferably 50% by mass and 90% by mass or less, and more preferably 60% by mass and 80% by mass or less.
If the value is not less than the above value, preferable sealing strength can be obtained, and thus preferable. If the value is less than the above, the initial tackiness can be reduced, and deterioration of the heat seal layer can be suppressed even after exposure to a high-humidity and hot environment, which is preferable.
(b) Polyethylene resin
The heat-sealing layer of the present invention is characterized by containing a polyethylene resin. The polyethylene resin is formulated in the heat-sealing layer in addition to the ethylene-vinyl acetate copolymer, whereby the surface tackiness can be reduced while maintaining good heat sealability and deterioration after being placed in a high-humidity and hot environment can be suppressed.
The polyethylene resin may be various polyethylenes such as low density polyethylene, linear low density polyethylene, medium density polyethylene, and high density polyethylene, but is advantageous from the viewpoint of dispersibility, and thus low density polyethylene (LDPE, density 0.910 to less than 0.930) and linear low density polyethylene (LLDPE, density 0.910 to 0.925) are preferably used.
In the present invention, the classification of various polyethylenes is referred to in the old JIS K6758: 1995. JIS K6899-1: 2000.
The content of the polyethylene resin in the heat seal layer may be, for example, more than 0% by mass and less than 100% by mass, preferably 10% by mass or more and 50% by mass or less, and more preferably 20% by mass or more and 40% by mass or less.
If the value is less than the above value, the sealing strength after heat sealing is not affected, and therefore, the possibility of abnormality such as peeling occurring when packaging electronic components, and the possibility of unexpected peeling of the cover tape during storage or transportation can be suppressed, which is preferable. If the value is not less than the above value, the initial surface tackiness of the heat-seal layer is suppressed, and deterioration after exposure to a hot and humid environment is suppressed, which is preferable. Further, setting within the above-mentioned range of values is more preferable because the above-mentioned effects are achieved.
In the present invention, as described above, the content of the polyethylene resin in the heat seal layer is preferably 10 mass% or more and 50 mass% or less, and particularly preferably 20 mass% or more and 40 mass% or less, for the reasons described below.
That is, as described above, in order to prevent deterioration after being placed in a hot and humid environment and to suppress abnormal behavior of the electronic component such as the electronic component jumping out of the housing portion of the carrier tape, protruding, standing up, and the like, it is preferable that the content of the polyethylene resin in the heat seal layer is high. On the other hand, when a paper carrier tape is used, it is generally difficult to improve the seal strength after heat sealing, and therefore, it is necessary to increase the content of the ethylene-vinyl acetate copolymer in the heat sealing layer.
In this respect, in order to suppress the occurrence of abnormal peeling and the like during packaging of electronic components and the occurrence of unexpected peeling of the cover tape during storage or transportation, specifically, to impart a seal strength of about 5 to 50gf, preferably about 15 to 40gf, the range of the polyethylene resin content in the heat seal layer is set as described above.
The seal strength is a value measured by a method used in [ heat seal strength evaluation ] in examples described below.
The heat seal layer may contain an ethylene-vinyl acetate copolymer and a polyethylene resin, and may contain other resins. Examples of the other resin include polyolefin such as polypropylene; a polyester; acrylic acid such as polyacrylate and polymethacrylate, and the like. These resins may also be modified.
Additives such as an adhesion imparting agent, an antistatic agent, an antiblocking agent, a dispersing agent, a filler, a plasticizer, a colorant, and the like may be contained in the heat seal layer, if necessary.
The thickness of the heat seal layer may be set to, for example, 5 μm or more and 60 μm or less. In the case of a paper carrier tape, the thickness of the heat seal layer may be set to, for example, 10 μm or more and 60 μm or less, and may be set to 10 μm or more and 60 μm or less. In the case of a plastic carrier tape, the thickness of the heat seal layer may be set to, for example, 5 μm or more and 60 μm or less. If the thickness of the heat seal layer is too small, a uniform film may not be obtained. If the thickness of the heat seal layer is too large, the transparency of the cover tape may be lowered.
Examples of the method for forming the heat sealing layer include a method in which a composition for heat sealing layer, in which an ethylene-vinyl acetate copolymer, a polyethylene resin, and, if necessary, other resins, additives, and the like are dispersed or dissolved in a solvent, is applied to one surface side of a base layer, and is dried. Examples of the method for applying the composition for a heat-sealing layer include known application methods such as roll coating, reverse coating, gravure reverse coating, comma coating, bar coating, contact coating, blade coating, die nozzle coating, flow coating, dip coating, and spray coating.
In addition, films may be used as heat seal layers. In this case, the lamination method of the base material layer and the heat seal layer is not particularly limited, and a known method can be used. Examples of the method include a method of bonding a prefabricated film to a base material layer with an adhesive, and a method of extruding a material of a film after hot melting to a base material layer with a T die or the like to obtain a laminate. As the adhesive, for example, a polyester adhesive, a polyurethane adhesive, an acrylic adhesive, or the like can be used.
2. Antistatic layer
The antistatic layer of the present invention is a layer for preventing electrification of a cover layer, which is disposed on the side opposite to the side of the heat-seal layer of the base material layer. By having the antistatic layer, adhesion of electronic components to the cover tape due to static electricity, adhesion of dirt, dust, and the like to the surface of the cover tape can be prevented. Further, static electricity generated by contact with other surfaces can be prevented.
The antistatic layer is formed by coating an antistatic agent on the substrate layer. Examples of the antistatic agent include conductive polymers such as polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyacetylene, and polyvinylcarbazole. Among these, the conductive polymer is preferably 1 or more selected from polythiophene, polyaniline and polypyrrole. Since sufficient antistatic property and transparency independent of humidity can be obtained. As polythiophene, for example, PEDOT/PSS (poly (3, 4-ethylenedioxythiophene/polystyrene sulfonic acid)) is preferably used.
In addition, the antistatic layer of the present invention may exhibit antistatic properties by including an antistatic agent other than a conductive polymer. Examples of antistatic agents other than conductive polymers include polymer surfactants and low-molecular surfactants. The surfactant is preferably a cationic polymer surfactant from the viewpoints of antistatic performance and coatability. The counter anion of the quaternary ammonium salt is not particularly limited, and for example, a halide ion, sulfide ion, or the like may be used, and aryl group, alkyl group, or the like may be contained in the 1 st to 3 rd positions of ammonium, but is not particularly limited. From the viewpoint of solubility, the carbon number is preferably 6 or less. The main chain of the polymeric quaternary ammonium salt is preferably an acrylic main chain from the viewpoints of transparency and adhesion to a substrate.
In addition, the antistatic layer may also contain a resin.
Examples of the method for forming the antistatic layer include a method in which a composition for an antistatic layer, in which an antistatic agent or the like is dispersed or dissolved in a solvent, is applied to the other surface side of the base layer, and is dried. Examples of the method for applying the composition for an antistatic layer include known coating methods such as air knife coating, doctor blade coating, bar coating, direct roll coating, reverse coating, gravure coating, and slide coating.
The thickness of the antistatic layer may be set to, for example, 0.02 μm or more and 3 μm or less. By setting the antistatic layer to a thickness of this kind, antistatic properties can be imparted to the cover tape.
3. Substrate layer
The base material layer of the present invention is a layer supporting the heat seal layer and the antistatic layer.
As the base material layer, various materials can be used as long as it has mechanical strength capable of withstanding external forces during storage and transportation, heat resistance capable of withstanding manufacturing and taping packaging, and the like. Polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymers, and terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymers; polyamides such as nylon 6, nylon 66, nylon 610, etc.; polyolefin such as polyethylene, polypropylene and polymethylpentene. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are preferably used because of their excellent cost and mechanical strength.
Additives such as fillers, plasticizers, colorants, antistatic agents, and the like may be optionally contained in the base material layer.
The base material layer may be a single layer or a laminate of multiple layers of the same kind or different kinds. The substrate layer may be a stretched film or an unstretched film. In order to improve the strength, the base material layer may be a film stretched in a uniaxial direction or a biaxial direction.
The thickness of the base material layer may be, for example, 2.5 μm or more and 300 μm or less, or 6 μm or more and 100 μm or less, or 12 μm or more and 50 μm or less. If the thickness of the base material layer is too large, the rigidity becomes high when the braid is packed, which is disadvantageous in terms of handling property and cost. In addition, if the thickness of the base material layer is too small, there is a case where the mechanical strength is insufficient.
The substrate layer may be subjected to an easy-to-adhere treatment such as corona discharge treatment, plasma treatment, ozone treatment, flame treatment, preheating treatment, dust removal treatment, vapor deposition treatment, alkali treatment, and sandblasting treatment.
4. Intermediate layer
In the present invention, for example, as shown in fig. 3, an intermediate layer 5 may be disposed between the base material layer 2 and the heat seal layer 3, if necessary. The intermediate layer can improve the adhesion between the base material layer and the heat seal layer. In addition, when the cover tape of the present invention is heat-sealed to the carrier tape through the intermediate layer, cushioning properties can be improved, whereby heat can be more uniformly applied to the heat-sealing layer.
The material of the intermediate layer is appropriately selected depending on the materials of the base material layer and the heat seal layer, and examples thereof include polyolefin such as polyethylene and polypropylene, polyurethane, and polyester.
The thickness of the intermediate layer may be set to, for example, 5 μm or more and 50 μm or less.
A film may be used as the intermediate layer. In this case, the method of laminating the base material layer and the intermediate layer is not particularly limited, and a known method can be used. Examples of the method include a method of bonding a prefabricated film to a base layer with an adhesive, and a method of extruding a material of a film after hot melting to a base layer with a T die or the like to obtain a laminate. The adhesive is the same as the adhesive described in the heat seal layer.
5. Adhesion promoting layer
Further, an adhesion promoting layer may be provided between the base material layer and the intermediate layer. By forming the adhesion promoting layer on the base material layer, even when the base material layer lacks adhesion, the adhesion between the base material layer and the intermediate layer can be improved. The adhesion promoting layer is not particularly limited, as long as it is appropriately selected according to the materials used for the base material layer and the intermediate layer. The adhesion-promoting layer may be formed of, for example, a resin having good adhesion such as an acrylic, isocyanate, urethane or ester adhesive.
B. Packaging body
The package of the present invention comprises: a carrier tape having a plurality of storage sections for storing electronic components; an electronic component accommodated in the accommodation portion; and the cover tape is disposed so as to cover the storage section.
In the present invention, by providing the cover tape having the heat sealing layer containing the ethylene-vinyl acetate copolymer and the polyethylene resin, in the package using the cover tape of the present invention, it is possible to obtain a package in which abnormal behavior of the electronic component such as the electronic component jumping out of the housing portion of the carrier tape, protruding, standing up, and the like due to the electronic component being attached to the cover tape can be suppressed when the cover tape is peeled off from the carrier tape.
Fig. 2 (a) and (b) are schematic plan views and cross-sectional views showing an example of the package of the present invention. In fig. 2 (a) and (b), the item "a. Cover tape for packaging electronic components" is described, and therefore, a description thereof is omitted here.
Hereinafter, each structure of the package of the present invention will be described.
1. Cover tape
The cover tape of the present invention is described in the item "a. Cover tape for electronic component packaging", and therefore, will not be described in detail here.
In the package of the present invention, the heat seal layer of the cover tape is bonded to the carrier tape through the seal portion. The heat seal portion may be disposed, for example, at a part of a portion of the cover tape where the heat seal layer and the carrier tape meet. That is, the heat sealing layer may have a heat sealing portion and a non-heat sealing portion. This can improve the peelability of the cover tape from the carrier tape.
2. Carrier tape
The carrier tape of the present invention is a component having a plurality of housing portions for housing electronic components.
As the carrier tape, any of an embossed carrier tape (also referred to as an embossed tape), a punched carrier tape (also referred to as a punched tape), and a punched carrier tape (also referred to as a punched tape) may be used, for example, as long as the carrier tape has a plurality of storage portions. Among them, the embossed carrier tape is suitably used in terms of cost, formability, dimensional accuracy, and the like.
Examples of the material of the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and papers. The material of the carrier tape is preferably paper. That is, a paper carrier tape is preferable. The paper of the present invention is a paper containing cellulose as a main component, and may further contain a resin component. The reason is that the paper carrier tape is excellent in terms of cost, environmental load, and the like, and can exhibit appropriate adhesion to the cover tape of the present invention.
The thickness of the carrier tape is appropriately selected according to the material of the carrier tape, the thickness of the electronic component, and the like. For example, the thickness of the carrier tape may be set to 30 μm or more and 1500 μm or less. If the thickness of the carrier tape is too large, the formability is deteriorated, and if the thickness of the carrier tape is too small, the strength may be insufficient.
The carrier tape has a plurality of storage portions. In general, the storage sections are arranged at specific intervals in the longitudinal direction of the carrier tape. The size, depth, pitch, etc. of the housing portion are appropriately adjusted according to the size, thickness, etc. of the electronic component.
As a method for forming the carrier tape having the storage portion, a carrier tape forming method that is generally used may be used, and may be appropriately selected according to the type, material, and the like of the carrier tape. Examples thereof include press molding, vacuum molding, pressure molding, press working, compression working, and the like.
3. Electronic component
The electronic component used in the package of the present invention is not particularly limited, and examples thereof include an IC, a resistor, a capacitor, an inductor, a transistor, a diode, an LED (light emitting diode), a liquid crystal, a piezoelectric element buffer, a filter, a crystal oscillator, a crystal vibrator, a connector, a switch, a potentiometer, a relay, and the like. The form of the IC is also not particularly limited.
4. Packaging body
The package of the present invention is used for storing and transporting electronic components. The electronic components are stored and transported in a packaged state for mounting. In mounting, the cover tape is peeled off, and the electronic component accommodated in the accommodating portion of the carrier tape is taken out and mounted on a substrate or the like.
The present invention is not limited to the above embodiment. The above-described embodiments are examples, and the present invention is intended to be included in the technical scope of the present invention, in which the technical idea described in the claims is substantially the same and the same effects are exhibited.
Examples (example)
Hereinafter, examples and comparative examples are shown, and the present invention will be described in more detail.
Example 1
As the base material layer, a 2-axis stretched polyethylene terephthalate film (FE 2002 manufactured by FUTAMURA CHEMICAL company, hereinafter referred to as PET film) having a thickness of 25 μm and both sides subjected to corona treatment was prepared. An antistatic layer was formed by applying an antistatic coating (aracast AS601D/CL910 (mass ratio) =10/1 manufactured by kawa chemical company) containing PEDOT AS a conductive polymer and aziridine AS a curing agent) to one side of a PET film. A urethane-based tackifying coating (Takenate a-3075/Takelac a-3210 (mass ratio) =3/1 diluted with 5% ethyl acetate) was applied to the surface of the PET film opposite to the surface on which the antistatic layer was formed, to form a tackifying layer. Then, a polyethylene resin (CE 4009 manufactured by Sumikathene chemical company), and a polyethylene resin (Sumikathene L705 manufactured by sumikou chemical company) were mixed with an ethylene-vinyl acetate copolymer (melchene (registered trademark) M (MX 53C manufactured by eastern co.) at a mass ratio of 40/60 were laminated by melt extrusion processing to form an intermediate layer and a heat seal layer, respectively, at a thickness of 20 μm. Thus, a cover tape 1 having a structure including an antistatic layer (1 μm or less)/a base layer (25 μm)/an adhesion promoting layer/an intermediate layer (20 μm)/a heat sealing layer (20 μm) was produced.
Example 2
A cover tape 2 having a structure including an antistatic layer (1 μm or less)/a base layer (25 μm)/an adhesion promoting layer/an intermediate layer (20 μm)/a heat sealing layer (20 μm) was produced in the same manner as in example 1 except that the heat sealing layer material (a mixed material of an ethylene-vinyl acetate copolymer and a polyethylene resin) in example 1 was changed to a mixed material of a polyethylene resin (sumikasel 705 manufactured by sumikon chemical company) and an ethylene-vinyl acetate copolymer (Merusen (registered trademark) M (MX 53C) manufactured by eastern co.) to 20/80 (mass ratio).
Example 3
A cover tape 3 having a structure including an antistatic layer (1 μm or less)/a base layer (25 μm)/an adhesion promoting layer/an intermediate layer (20 μm)/a heat sealing layer (20 μm) was produced in the same manner as in example 1 except that the heat sealing layer material (a mixed material of ethylene-vinyl acetate copolymer and polyethylene resin) of example 1 was changed to a mixed material of polyethylene resin (sumikasel 705 sumitomo chemical company) and ethylene-vinyl acetate copolymer (Merusen (registered trademark) M (MX 53C) manufactured by eastern co.) to 60/40.
Comparative example 1
A cover tape 4 having a structure including an antistatic layer (1 μm or less)/a base layer (25 μm)/an adhesion promoting layer/an intermediate layer (20 μm)/a heat sealing layer (20 μm) was produced in the same manner as in example 1 except that the heat sealing layer material (a mixture of an ethylene-vinyl acetate copolymer and a polyethylene resin) in example 1 was changed to an ethylene-vinyl acetate copolymer (Merusen (registered trademark) M (MX 53C) manufactured by eastern co., ltd.).
Comparative example 2
A cover tape 5 having a structure including an antistatic layer (1 μm or less)/a base layer (25 μm)/an adhesion promoting layer/an intermediate layer (20 μm)/a heat sealing layer (20 μm) was produced in the same manner as in example 1, except that the heat sealing layer material (a mixed material of an ethylene-vinyl acetate copolymer and a polyethylene resin) in example 1 was changed to a polyethylene resin (SumikasenL 705 manufactured by sumitomo chemical company).
[ evaluation of initial tackiness ]
The tackiness of the heat-seal layers of the cover tapes 1 to 4 obtained above was measured in the following manner.
(measurement method)
The heat-seal layer of the sample was faced up and the 4 corners of the sample were attached to a slide glass (76X 26mm, 0.8-1.0 mmt) in a flat manner. The sample is placed on a stage of a measuring apparatus described below, and a probe is brought into contact with the sample from above under the following conditions, and the probe is separated from the sample under the following conditions, and the load value received by the probe at this time is obtained. The results are shown in Table 1.
(measurement device)
Tack tester TAC-2 (manufactured by RHESA Co., ltd.)
(measurement conditions)
Pressurization (compression) speed: 30mm/min
Pressurization load: 200gf
Pressurizing time: 10s
Measurement (release) speed: 30mm/min
Measurement of contact (probe): cylinder diameter 5mm, SUS304
Temperature conditions: probe temperature 60 ℃, sample stage temperature 60 ℃ (sample temperature 60 ℃)
[ evaluation of abnormal behavior quantity ]
Using the cover tapes 1 to 4, test samples of the package were prepared as follows, and the number of abnormal behaviors of the electronic component when the cover tapes were peeled from the package was measured.
(sample preparation)
Samples of the packages were prepared under the following conditions. While the 500 electronic components described below were continuously disposed in the cavity of the paper carrier tape described below, the paper carrier tape and the cover tape were heat-sealed and wound up using the following braiding machine under the following conditions, whereby a sample of the roll-shaped package was obtained.
(sample preparation conditions)
Braiding machine NST-35 (manufactured by Nitto Industrial Co., ltd.)
Paper carrier: north Yuejizhou paper HOCTO 0.31mmt (virgin paper)
Braiding temperature: 180 DEG C
Braiding speed: 3500 distance (takt)
Sealing width: 0.6mm 2
Electronic component: 0402 size capacitor
(determination of abnormal behavior quantity)
The rolls of the package were stored in a constant temperature and humidity laboratory at 60℃and 95% RH for 24 hours. The cover tape was peeled from the roll-shaped package after storage at a speed of 100 mm/sec using a cover tape peeling device (W08 f intelligent dispenser, manufactured by FUJI Co.). The stripping was performed in an environment of 25.+ -. 3 ℃ and 30.+ -. 5% RH and completed within 10 seconds. The behavior of the electronic component at the time of peeling was observed by a high-speed camera. When peeling, the situation that more than half of the chips are jumped out of the paper carrier cavity (including the situation that the electronic component is stuck to the cover tape, the situation that the electronic component is rotated by 90 degrees to stand up, and the situation that the electronic component is jumped out of the cavity of the paper carrier tape) is regarded as abnormal behavior, and the number of abnormal behaviors is counted visually while the images shot by the high-speed camera are played at a slow speed (slow motion).
Similarly, after storage at room temperature (24 hours), the behavior of the electronic component at the time of peeling was observed by the high-speed camera, and the number of abnormal behaviors was counted by visual observation while the image captured by the high-speed camera was slowly played. The results are shown in Table 1.
TABLE 1
[ evaluation of Heat seal Strength ]
The peel strength of the samples obtained by sealing the paper carrier tape and the cover tapes 1 to 5 under the following braiding conditions was measured by a seal strength measuring machine under the following conditions. The average value of the measurement length of 15cm was taken as a measurement value. The results are shown in Table 2.
(Heat sealing device and heat sealing conditions)
Braiding machine NST-35 (manufactured by Nitto Industrial Co., ltd.)
Paper carrier: north Yuejizhou paper HOCTO 0.31mmt (virgin paper)
Braiding temperature: 180 DEG C
Braiding speed: 3500 distance between products
Sealing width: 0.6mm 2
(seal Strength measurement conditions)
The device comprises: vanguard Systems peel back tester VG-20
Peeling speed: 300mm/min
Stripping temperature: 25+ -3 DEG C
Peel angle: 165-175 DEG
TABLE 2
According to tables 1 and 2, the heat-sealing layer of the present invention contained the cover tapes of ethylene-vinyl acetate copolymer and polyethylene resin (examples 1 to 3) was suppressed in surface tackiness, the number of abnormal behaviors when the cover tapes were peeled from the package after being placed in a high-humidity and hot environment was suppressed, and the seal strength was also sufficient. On the other hand, in comparative example 1 in which the heat seal layer does not contain a polyethylene resin, the surface tackiness is strong, and the number of abnormal behaviors when the cover tape is peeled from the package after being placed in a high humidity and heat environment is large. In addition, in comparative example 2 in which the heat seal layer does not contain an ethylene-vinyl acetate copolymer, the heat seal strength is weak.
Description of the reference numerals
1. Cover tape
2. Substrate layer
3. Heat sealing layer
4. Antistatic layer
5. Intermediate layer
10. Packaging body
11. Carrier tape
12. Storage part
13. Electronic component
Claims (3)
1. A cover tape for packaging electronic components, comprising:
a substrate layer;
a heat sealing layer which is disposed on one surface side of the base material layer and which comprises an ethylene-vinyl acetate copolymer and a polyethylene resin; and
an antistatic layer disposed on a surface of the base material layer opposite to the surface of the heat-seal layer,
the heat seal layer contains more than 20 mass% and 40 mass% or less of the polyethylene resin.
2. A package is provided with:
a carrier tape having a plurality of storage sections for storing electronic components;
an electronic component housed in the housing portion; and
the cover tape for packaging electronic components of claim 1 disposed so as to cover the storage portion.
3. The package of claim 2, wherein the carrier tape is a paper carrier tape made of paper.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-071334 | 2019-04-03 | ||
| JP2019071334 | 2019-04-03 | ||
| PCT/JP2020/015204 WO2020204138A1 (en) | 2019-04-03 | 2020-04-02 | Electronic component packaging cover tape and package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113646242A CN113646242A (en) | 2021-11-12 |
| CN113646242B true CN113646242B (en) | 2023-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202080026131.0A Active CN113646242B (en) | 2019-04-03 | 2020-04-02 | Cover tape for packaging electronic components and package |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6822626B1 (en) |
| KR (1) | KR102646543B1 (en) |
| CN (1) | CN113646242B (en) |
| WO (1) | WO2020204138A1 (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57131106A (en) * | 1981-02-05 | 1982-08-13 | Matsushita Electric Ind Co Ltd | Synchronizing detecting device |
| JPH1095448A (en) | 1996-09-18 | 1998-04-14 | Dainippon Printing Co Ltd | Lid material for carrier tape |
| JP2000280411A (en) * | 1999-03-31 | 2000-10-10 | Dainippon Printing Co Ltd | Laminated plastic film, transparent conductive cover tape and package |
| JP3514699B2 (en) * | 2000-05-01 | 2004-03-31 | 電気化学工業株式会社 | Cover tape |
| JP4460870B2 (en) * | 2003-10-09 | 2010-05-12 | 北越紀州製紙株式会社 | Carrier tape paper for chip electronic devices |
| JP2005178073A (en) * | 2003-12-17 | 2005-07-07 | Shin Etsu Polymer Co Ltd | Cover tape and package |
| CN103260873B (en) * | 2010-12-17 | 2015-09-23 | 3M创新有限公司 | For packing heat-sealing film and the clad strip of electronic unit |
| WO2013042727A1 (en) * | 2011-09-22 | 2013-03-28 | 東ソー株式会社 | Adhesive resin composition and easy-peeling film |
| WO2015005330A1 (en) * | 2013-07-09 | 2015-01-15 | 住友ベークライト株式会社 | Cover tape for packaging electronic components |
| TWI647297B (en) * | 2014-11-12 | 2019-01-11 | Sumitomo Bakelite Co., Ltd. | Cover tape for electronic component packaging, packaging material for electronic component packaging, and electronic component package |
| WO2018061442A1 (en) * | 2016-09-28 | 2018-04-05 | 住友ベークライト株式会社 | Resin composition, cover tape, and electronic component package |
| WO2018235606A1 (en) * | 2017-06-22 | 2018-12-27 | 住友ベークライト株式会社 | Cover tape and electronic component package |
| JP6763421B2 (en) * | 2018-09-18 | 2020-09-30 | 大日本印刷株式会社 | Cover tape and packaging for electronic component packaging |
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2020
- 2020-04-02 CN CN202080026131.0A patent/CN113646242B/en active Active
- 2020-04-02 WO PCT/JP2020/015204 patent/WO2020204138A1/en active Application Filing
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| Publication number | Publication date |
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| KR20210144738A (en) | 2021-11-30 |
| KR102646543B1 (en) | 2024-03-13 |
| WO2020204138A1 (en) | 2020-10-08 |
| TW202043111A (en) | 2020-12-01 |
| CN113646242A (en) | 2021-11-12 |
| JP2021062923A (en) | 2021-04-22 |
| JPWO2020204138A1 (en) | 2021-04-30 |
| JP6822626B1 (en) | 2021-01-27 |
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