CN103260873B - For packing heat-sealing film and the clad strip of electronic unit - Google Patents

For packing heat-sealing film and the clad strip of electronic unit Download PDF

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Publication number
CN103260873B
CN103260873B CN201080070735.1A CN201080070735A CN103260873B CN 103260873 B CN103260873 B CN 103260873B CN 201080070735 A CN201080070735 A CN 201080070735A CN 103260873 B CN103260873 B CN 103260873B
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China
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layer
heat
sealing film
sealing
intermediate layer
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CN103260873A (en
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张伟祥
金舟
沈时骏
张琳琳
李佳军
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3M China Ltd
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3M Innovative Properties Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for

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  • Laminated Bodies (AREA)
  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)

Abstract

The invention provides a kind of heat-sealing film for packaging electronic components, described heat-sealing film comprises: basal layer; At least one intermediate layer, at least one intermediate layer described to be arranged on described basal layer and to comprise a kind of mixture, with described intermediate layer gross weight be 100 % by weight calculate, described mixture comprises: the vinyl acetate copolymer of 5-70 % by weight, wherein derived from the unit of vinyl acetate in described copolymer more than 10 % by mole; The SB of 20-90 % by weight; And the conducting polymer of 0-40 % by weight; And at least one hot sealing layer, at least one hot sealing layer described is arranged on surface relative with described basal layer in described intermediate layer.Invention further provides a kind of clad strip be made up of heat-sealing film as above.

Description

For packing heat-sealing film and the clad strip of electronic unit
Technical field
The present invention relates to a kind of heat-sealing film and a kind of clad strip, described clad strip is made up of described heat-sealing film and can be sealed plastic carrier, storage pit is formed in described plastic carrier, described carrier band is the one had in the packaging of following functions: when electronic unit is stored, transports or installs, described electronic unit is prevented from contaminated, and they are arranged and are removed to be assembled in electronic circuit substrate.
Background technology
Recently, surface installing type (surface mount) electronic unit such as IC, transistor, diode, condenser, piezoelectric element resistor etc. are wrapped into by the packaging that plastic carrier is formed, the pit of embossment molded (emboss-molded) is formed continuously in described plastic carrier, described electronic unit just can be accommodated in the pit conformed to its shape, and clad strip is heat sealed to described carrier band, is supplied subsequently.After peeling off clad strip from carrier band, packaging electronic unit is removed automatically, is arranged in electronic circuit substrate by these electronic component surface subsequently.
The intensity peeling off clad strip from carrier band is called " peel strength (peel-off strength) ", and when this intensity is too low, Problems existing is: when transportation and packing, clad strip comes off and packaging electronic unit falls down.
On the other hand, when this intensity is too high, such phenomenon can be caused: carrier band vibrates when clad strip is stripped, and just they are jumped out from storage pit before electronic unit is mounted, that is, cause trouble of beating.In addition, need the peel strength of a certain clad strip is remained within the scope of one.If the change of peel strength is too large, be so difficult to by using install machinery stably to peel off clad strip.
Antistatic characteristic is another key characteristic, because electrostatic may destroy electronic unit, and may cause difficulty in the process.The transparency of clad strip is also very important, because people need to bring through coated the state checking electronic unit.In addition, clad strip should not pollute electronic unit.
The mechanism that existing clad strip is commercially peeled off from carrier band is classified as three types: interface peel type (interfacial peeling type), transfer peel-away type (transfer-peeling type) and cohesional failure type (cohesive failure type).Interface peel type refers to such type: clad strip and carrier band are peeled off each other at sealing surface place; Transfer peel-away type refers to such type: in stripping process, adhesive layer itself is transferred to carrier band, and cohesional failure type refers to such type: the one deck or the adhesive layer itself (both is called as cohesional failure layer hereinafter) that are different from adhesive layer break to cause stripping.
Each in these types all has merits and demerits; But, when the state aspect be stripped from the clad strip being sealed to carrier band compares them, interface peel type trends towards the impact by the shape of carrier band, material and characteristic, because sealing surface and release surface are identical, therefore peel strength trends towards becoming unstable.
With regard to transfer peel-away type, adhesive layer is required to be film according to this mechanism, and so-called heat-sealing need be used to paint.Therefore, peel strength trends towards becoming comparatively responsive to seal temperature, and the air-proof condition therefore for suitable peel strength almost can not obtain.
With regard to cohesional failure type, sealing surface and peel ply are different, and therefore the dependence of peel strength to air-proof condition is lower.In addition, cohesional failure type has so huge advantage to make peel strength by the impact of the shape of carrier band, material and characteristic.But in some cases, in stripping process, by the impact of the layer beyond the cohesional failure layer comprising adhesive layer, and can there is interface peel when not causing cohesional failure in cohesional failure layer.
In addition, be difficult to determine that cohesional failure layer breaks wherein, therefore, in stripping process, cohesional failure layer is retained in carrier band on the surface, and so a kind of state occurs: content cannot be removed.
Cohesional failure layer itself makes it be easy to break through design, therefore in many cases, it by each other almost the mixture of immiscible various kinds of resin form, and these resins are not mixed uniformly.This results in the deterioration of the clad strip transparency and result in some cases by condensing the shortcoming caused.In addition, in such purposes, the resin that heat resistance is poor is in some cases in the resin mixture involved.For those reasons, condensation product or catabolite occur and reduce productivity ratio in many cases in the forming process of cohesional failure layer.
Therefore, be necessary to develop and a kind of there is stable peel strength, splendid antistatic characteristic and can not pollute the transparent clad strip of electronic unit.
Summary of the invention
A target of the present invention is a kind of heat-sealing film of exploitation, and described heat-sealing film can be cut into clad strip, has stable peel strength, good antistatic performance, can not pollute electronic unit and have transparent outward appearance.
Another target of the present invention be to provide a kind of cohesional failure type or transfer peel-away type, the clad strip be made up of heat-sealing film.
According to the present invention, it provide a kind of heat-sealing film for packaging electronic components, described heat-sealing film comprises:
Basal layer;
At least one intermediate layer, at least one intermediate layer described to be arranged on basal layer and to comprise a kind of mixture, and be 100 % by weight to calculate with intermediate layer gross weight, described mixture comprises:
The vinyl acetate copolymer of 5-70 % by weight, wherein derived from the unit of vinyl acetate in described copolymer more than 10 % by mole;
The SB of 20-90 % by weight; With
The conducting polymer of 0-40 % by weight; With
At least one hot sealing layer, at least one hot sealing layer described is arranged on the surface relative with described basal layer in described intermediate layer.
The present invention also provides a kind of clad strip, and described clad strip is for sealing the carrier band to comprising electronic component, and described clad strip comprises:
Basal layer;
Be arranged on the intermediate layer on basal layer; With
Hot sealing layer, described hot sealing layer is arranged on the intermediate layer, and described clad strip has the mean transmittance of at least 75%, is no more than the haze of about 50%, and is no more than about 1 × 10 11surface resistivity; Make when the heat-sealing of described clad strip to carrier band to form goods time, described clad strip is at least 20gf/mm for the mean peel strength of described carrier band, when the relative humidity that these goods bear the temperature that is not less than about 50 DEG C and are not less than about 90% reaches at least 5 days, this peel strength reduction is not more than about 10%.
Antistatic heat-sealing film of the present invention, for the surface of the substrate of Merlon, polystyrene, polypropylene etc., has splendid electrostatic dissipative properties, good optical property, good mechanical performance, and splendid heat sealability.The temperature-sensitive clad strip be made up of heat-sealing film of the present invention has many advantages, and such as, all there is lasting antistatic performance on two sides, high-transmittance, low haze, about the stable peeling force of carrier band and splendid seal aging performance.When using this temperature-sensitive clad strip, the adhesive face after aging is under high temperature and humidity not adhered to the surface of carrier band, and after this temperature-sensitive clad strip is with carrier band sealing, band opening problem can not occur.After the clad strip carrier band sealing made from heat-sealing film, adhesive phase will be retained on support belt when peeling off, and this adhesive phase can be separated with functional layer.Compared with the clad strip situation be separated with adhesive phase that on market and carrier band layer, because production process controls the surface of functional layer and adhesive phase capitally, it is hereby ensured that the peeling effect of the clad strip product made by the method is controlled capitally.In addition, the roughness on carrier band surface is relatively large, if adhesive phase is separated from carrier band layer when peeling off, and so less stable of peeling force.
Accompanying drawing explanation
Fig. 1 is the sectional view of antistatic heat-sealing film of the present invention;
Fig. 2 is the sectional view of another antistatic heat-sealing film of the present invention; With
Fig. 3 is the sectional view of another antistatic heat-sealing film again of the present invention.
Detailed description of the invention
In the present invention, unless otherwise defined, term " heat sensitive adhesive " refers to heat sealable fluoropolymer resin.Term " add-on type cation anti-static coating " refers to by cation antistatic agent being added to the coating with antistatic performance obtained in coating.
The invention provides a kind of heat-sealing film for packaging electronic components, described heat-sealing film comprises:
Basal layer;
At least one intermediate layer, at least one intermediate layer described to be arranged on basal layer and to comprise a kind of mixture, and be 100 % by weight to calculate with intermediate layer gross weight, described mixture comprises:
The vinyl acetate copolymer of 5-70 % by weight, wherein derived from the unit of vinyl acetate in described copolymer more than 10 % by mole;
The SB of 20-90 % by weight; With
The conducting polymer of 0-40 % by weight; With
At least one hot sealing layer, at least one hot sealing layer described is arranged on the surface relative with described basal layer in intermediate layer.
Described basal layer is mainly used in the mechanical strength providing film.In the present invention, described basal layer is not limited especially and is generally used for producing the basal layer of heat-sealing film and may be used in the present invention.Preferably, described basal layer is selected from biaxially stretched polyester, polyolefin or nylon.Preferably, described basal layer has the thickness of about 10 μm ~ 30 μm.The light transmittance of described film is preferably not less than 85%, and hot strength is not less than 50MPa.
Relatively soft and can conduct electricity for the intermediate layer in heat-sealing film of the present invention, it can be made up of one or more layers material.The polyethylene being applicable to intermediate layer is preferably LLDPE (LLDPE), more preferably, weight average molecular weight is greater than 100,000 and melt index (MI) (test condition is 190 DEG C, 2.16 kilograms, ASTM D1238) be the LLDPE of 1-100g/10 minute.Such as, the polyethylene be suitable for is for deriving from the LLDPE (1002-YB) of Exxon Mobil (Exxon Mobil).This polyethylene content is in the intermediate layer 0-60 % by weight, preferably, and 10-60%, more preferably, 20-60%, and most preferably 50-60%.
In the intermediate layer, suitable vinyl acetate copolymer is such vinyl acetate copolymer, and wherein the molar percentage of vinyl acetate derived units is at least 10%, is preferably greater than 15%, is most preferably greater than 20%.Suitable comonomer is preferably selected from alkene, is more preferably selected from ethene.The melt index (MI) (test condition is 190 DEG C, 2.16 kilograms, ASTMD1238) of suitable vinyl acetate copolymer is preferably 1-250g/10 minute, is more preferably 1-100g/10 minute, and most preferably is 2-50g/10 minute.Vinyl acetate copolymer content is in the intermediate layer 5-70 % by weight, is preferably 5-50%, is more preferably 10-60%, be more preferably 10-40%, be more preferably 20-40%, and most preferably be 20-30%.
The SB being applicable to intermediate layer is preferably a kind of block copolymer, and wherein styrene derived units comprises and is greater than 50 % by mole, is more preferably and is greater than 60 % by mole, and most preferably is the total unit of the copolymer being greater than 70 % by mole.Preferably, the weight average molecular weight of suitable SB is preferably 20000 ~ 500000, is more preferably 40000 ~ 300000, and most preferably is 50000 ~ 150000, and molecular weight distribution is preferably 1-2.This SB comprises the 20-90% of intermediate layer gross weight, preferred 30-70%.
The thickness in this intermediate layer is preferably 10-50 micron and its surface can add conducting polymer to conduct electricity as required.Such as, its surface resistivity can be less than 1 × 10 11ohm/, is more preferably less than 1 × 10 10ohm/, and be most preferably less than 1 × 10 9ohm/.Suitable conducting polymer includes but not limited to polyacetylene, polypyrrole, polythiophene, polyaniline, based on polyetheramides or the intrinsic antistatic polymer etc. based on polyesteramide, or its combination.
When not providing independent polyethylene layer, optionally, adhesion layer can be arranged between intermediate layer and basal layer.When providing independent polyethylene layer, optionally, adhesion layer is arranged between polyethylene layer and basal layer.Adhesion layer can be common curable polyurethane type adhesive.
According to some embodiments, intermediate layer is mainly polymer alloy, and the formation method of this polymer alloy is with extruder blending extrusion vinyl-vinyl acetate copolymer, styrene-butadiene block copolymer and a certain amount of intrinsic conduction or antistatic polymer.The surface resistivity of this layer is preferably 1 × 10 6-1 × 10 14ohm/.Can for gathering (vinyl acetate) for the ethylene copolymer in intermediate layer.Poly-(vinyl acetate) has the VA segment content and the polymer alloy comprising 10-60 % by weight in whole functional layer that are greater than 10%.The SB of use had the polystyrene segment content being greater than 50%.Block copolymer has the weight average molecular weight of 20000 ~ 500000, and the molecular weight distribution of 1-2.This copolymer comprises the polymer alloy of 30-90 % by weight in whole functional layer.By use intrinsic conduction or antistatic polymer can be ICP (inherent conducting polymer) or IDP (inherent dissipative polymer), comprise polyacetylene, polypyrrole, polythiophene, polyaniline, based on polyetheramides or the intrinsic antistatic polymer etc. based on polyesteramide, or its combination, it comprises the polymer alloy of 0-40 % by weight in whole functional layer.
Hot sealing layer (in the present invention, also referred to as " heat sensitive adhesive layer ") is arranged on the surface relative with basal layer in intermediate layer.This hot sealing layer can be made up of one or more layers material, and can conduct electricity as required or non-conductive.Preferably, hot sealing layer is made up of the material being selected from polyacrylate or its copolymer, and the glass transition temperature of this polymer should be greater than 30 DEG C, more preferably greater than 60 DEG C, and most preferably is 70-90 DEG C.As required, if do not add conduction or antistatic polymer in intermediate layer, the conducting particles of so a certain amount can be added in hot sealing layer, and such as, hot sealing layer can be the coating of the polyacrylate or its copolymer that are added with the conductive filler of a certain amount.Hot sealing layer can have the thickness and 1 × 10 of 0.01-10 micron 7-1 × 10 12the surface resistivity of ohm/, is more preferably 1 × 10 7-1 × 10 11ohm/.Conductive filler can be nano-oxide, such as, and titanium dioxide, silica, aluminium oxide, zinc oxide, tin oxide, antimony oxide, indium tin oxide etc.Conductive filler also can be CNT, carbon dust, metal dust etc.The conductive filler particle added in this layer preferably includes the 0-60 % by weight of whole heat sensitive adhesive layer, is more preferably 0-30 % by weight.The polyacrylate used in hot sealing layer or its copolymer had the preferred glass state transition temperature of 30-90 DEG C and the preferred heat activation temperature of 90 DEG C or larger.
Optionally, anti-static coating can be coated on the surface of basal layer.The build of anti-static coating can be, such as 0.01-2 micron, is preferably 0.05-1 micron, and most preferably is 0.1-0.8 micron.The surface resistivity of anti-static coating can be 1 × 10 6~ 1 × 10 12ohm/, is more preferably 1 × 10 9~ 1 × 10 11ohm/.Anti-static coating on basal layer can be obtained by intaglio printing painting method.Even if when ambient humidity is 50%, the surface resistivity of anti-static coating is not also higher than 1 × 10 12ohm/.This coating can be add-on type cation anti-static coating or polymer graft type cation antistatic agent coating, and it also can for be added with conductive filler, there is relatively better durothermic polymer coating.Conductive filler can be selected from metal oxide, CNT or other conducting particles.
Fig. 1 is the sectional view of clad strip according to an embodiment of the invention.2 for having the basal layer of about 10-30 micron thickness and being mainly used in providing the mechanical strength of film.The surface of basal layer 2 scribbles anti-static coating 1, and described anti-static coating has the build and 1 × 10 of 0.01-2 micron 6~ 1 × 10 12the surface resistivity of ohm/.The surface relative with anti-static coating 1 of basal layer 2 is equipped with the functional layer 3 (in the present invention, functional layer refers to intermediate layer) with conductive surface.Functional layer 3 has the thickness and 1 × 10 of 10-50 micron 3~ 1 × 10 10the surface resistivity of ohm/.The surface relative with basal layer 2 of functional layer 3 scribbles heat sensitive adhesive layer 4 (in the present invention, heat sensitive adhesive layer is equal to hot sealing layer), and described heat sensitive adhesive layer has the thickness and 1 × 10 of 0.01-10 micron 5~ 1 × 10 12the surface resistivity of ohm/.
In structure in FIG, basal layer 2 can for having the plastic foil of certain mechanical strength, and this plastic foil is selected from biaxially stretched polyester, polyolefin or nylon.The light transmittance of this film is preferably not less than 85%, and hot strength is not less than 50MPa.Anti-static coating 1 on basal layer is obtained by intaglio printing painting method.When ambient humidity is 50%, the surface resistivity on this surface is not higher than 1 × 10 12ohm/.This coating can be add-on type cation anti-static coating or polymer graft type cation antistatic agent coating, and it also can for be added with conductive filler, there is relatively better durothermic polymer coating.Conductive filler can be selected from metal oxide, CNT or other conducting particles.Functional layer 3 is mainly polymer alloy, and the formation method of this polymer alloy is with extruder blending extrusion ethylene copolymer, styrene-butadiene block copolymer and a certain amount of intrinsic conduction or antistatic polymer.The surface resistivity of this layer is 1 × 10 6-1 × 10 14ohm/.Heat sensitive adhesive layer 4 is mainly and is added with the polyacrylate of a certain amount of conducting particles or the coating of its copolymer, and this heat sensitive adhesive layer has the thickness and 1 × 10 of 0.01-10 micron 6-1 × 10 12the surface resistivity of ohm/.
Can for gathering (vinyl acetate) for the ethylene copolymer in functional layer 3.Poly-(vinyl acetate) has the VA segment content and the polymer alloy comprising 10-60 % by weight in whole functional layer 3 that are greater than 10%.The SB of use had the polystyrene segment content being greater than 50%.Block copolymer has the weight average molecular weight of 20000 ~ 500000, and the molecular weight distribution of 1-2.This copolymer comprises the polymer alloy of 30-90 % by weight in whole functional layer.By use intrinsic conduction or antistatic polymer can be ICP or IDP, comprise polyacetylene, polypyrrole, polythiophene, polyaniline, based on polyetheramides or the intrinsic antistatic polymer etc. based on polyesteramide, or its combination, it comprises the polymer alloy of 0-40 % by weight in whole functional layer.
The polyacrylate used in heat sensitive adhesive layer 4 or its copolymer had glass transition temperature and 90 DEG C or the larger heat activation temperature of 30-90 DEG C.The conductive filler particle added in this layer comprises the 0-60 % by weight of whole heat sensitive adhesive layer.Conductive filler can be nano-oxide, such as titanium dioxide, silica, aluminium oxide, zinc oxide, tin oxide, antimony oxide, indium tin oxide etc.Conductive filler also can be CNT, carbon dust, metal dust etc.
Fig. 2 is the sectional view of another clad strip of the present invention.The surface of basal layer 2 scribbles anti-static coating 1.The surface relative with antistatic backing 1 of basal layer 2 scribbles functional layer 3 via adhesion layer 5.The surface relative with adhesion layer 5 of functional layer 3 scribbles heat sensitive adhesive layer 4.
Fig. 3 is the sectional view of another clad strip again of the present invention.The surface of basal layer 2 scribbles anti-static coating 1.Blowing is formed by coextrusion for polyethylene layer 6 and functional layer 3 (polyethylene layer 6 forms a part for functional layer 3).The surface of polyethylene layer 6 is combined with basal layer 2 via adhesion layer 5.The surface relative with polyethylene layer 6 of functional layer 3 scribbles heat sensitive adhesive layer 4.
The present invention also provides a kind of clad strip, and described clad strip is for sealing the carrier band to comprising electronic component, and described clad strip comprises:
Basal layer;
Be arranged on the intermediate layer on basal layer; With
Hot sealing layer, described hot sealing layer is arranged on the intermediate layer, and described clad strip has the mean transmittance of at least 75%, is no more than the haze of about 50%, and is no more than about 1 × 10 11surface resistivity; Make when the heat-sealing of described clad strip to carrier band to form goods time, described clad strip is at least 20gf/mm for the mean peel strength of described carrier band, when the relative humidity that these goods bear the temperature that is not less than about 50 DEG C and are not less than about 90% reaches at least 5 days, this peel strength reduction is not more than about 10%.
Temperature-sensitive clad strip of the present invention has many advantages, and such as, all there is lasting antistatic performance on two sides, high-transmittance, low haze, about the stable peeling force of carrier band and splendid seal aging performance.When using this temperature-sensitive clad strip, the adhesive face after aging under high temperature and humidity can not be attached to the surface of carrier band, and after this temperature-sensitive clad strip is with carrier band sealing, band opening problem can not occur.After the clad strip carrier band sealing made from heat-sealing film, adhesive phase will be retained on support belt when peeling off, and this adhesive phase can be separated with functional layer.Compared with the clad strip situation be separated with adhesive phase that on market and carrier band layer, owing to being controlled the surface of functional layer and adhesive formulation well by production control process, it is hereby ensured that the peeling effect of the clad strip product made by the method is comparatively stable.In addition, the carrier band that the surface roughness of carrier band is relatively large and different has different surface roughnesses, if adhesive phase is separated from carrier band layer when peeling off, and so less stable of peeling force.
Hereafter in more detail the present invention will be described by example.It should be noted that these examples never limit the present invention, and scope of the present invention is decided by appended claims.In the present invention, unless otherwise defined, all numbers, percentage, content, ratio are all based on weight, all temperature are all based on Celsius' thermometric scale, and all quantity with non-regulation unit are all based on unit the most frequently used in this area.
example
method of testing:
Surface resistivity: according to ESD S I1.11 standard method of test, perform test at specific temperature and humidity conditions:
After resistrivity meter is placed on product surface to be measured, by-pass cock presses testing button to required voltage position (10V or 100V) and with the pressure durations of about 5 pounds.Subsequently, lcd screen will illustrate the surface resistivity recorded.The unit of this surface resistivity is ohm/.
Light transmittance and haze: they are measured by haze meter HM-150.
The clad strip that peeling force under 180 °: 5.4mm is wide and the wide carrier band of 8mm are sealed by heat sealing machine at 160 DEG C.Subsequently, the peeling force peel test force meter PT-45 under 180 ° measures.
Peeling force burn-in test under 180 °: the clad strip that 5.4mm is wide and the wide carrier band of 8mm are sealed by heat sealing machine at 160 DEG C.Subsequently, the peeling force peel test force meter PT-45 under 180 ° measures; Sample is placed in aging chamber under 52 DEG C/95rh%, after 5 days aging, take out sample and carry out peel test force.
The burn-in test of anti-adhesive properties at 60 DEG C: sample to be tested is attached to the surface of POLYCARBONATE SHEET and its both sides all fix with adhesive tape.At 60 DEG C, the sample of acquisition is placed in aging box.After a period of time, take out sample and observe attachment phenomenon and whether occur on heat-sealing film and on the surface of POLYCARBONATE SHEET.
example 1:
for the preparation of the material of functional layer:
By styrene-butadiene block copolymer (the CHI MEI of 67.5kg, PB-5903), poly-(vinyl acetate) (Hyundai (HyunDai) of 37.5kg, VA60), the intrinsic antistatic polymer (IDP:PolyNova PNC300R-M) of 45kg and the antioxidant A5 (Jin Haiyabao (Jinhai Albemarle) of 0.6kg, Shanghai Jinhaiyabao Precision Chemical Co., Ltd. (Shanghai JinhaiAlbemarle Fine Chemicals Co, Ltd.)) evenly stir, and melting mixing at 180 DEG C, carry out subsequently cooling and granulating in further application.
the preparation of heat-sealing film and clad strip:
1. the Biaxially oriented polyester film that the one-sided Corona discharge Treatment that preparation 16 μm is thick is crossed.The coated about 0.2 μm of thick polyurethane-type primer coating in the surface crossed of Corona discharge Treatment, cures subsequently in an oven.Meanwhile, by the polymer alloy fusion coating prepared for functional layer on the polyester film scribbling primer coating, subsequently the product obtained is cooled and reeled.This functional layer has the thickness and 1 × 10 of 30 μm 9the surface resistivity of ohm/.
2. under agitation, acrylate copolymer (DSM has the glass transition temperature of the 42 DEG C) powder dissolution of 2kg, in the ethyl acetate solvent of 16kg, is added the toluene of 2kg subsequently, and stir 5 minutes again in further application.In solution, the solids content of acrylic resin is 10%.This solution is coated to and is placed on baking oven on the surface with functional layer and by the product of acquisition and carries out drying process to remove solvent and to reel.Acrylic resin is heat sensitive adhesive layer, and its thickness is about 1 μm.The surface of this heat sensitive adhesive layer has 1 × 10 10the surface resistivity of ohm/.
3. the anti-static coating solution (K104A-2 of 5% solids content will be had, Qingdao trade Import and Export Co., Ltd. (Qingdao Trade Import and Export Co., Ltd.)) be coated on the pet sheet face relative with functional layer of heat-sealing film, and cure to solidify on baking oven.In the environment of normal temperature and normal humidity, this anti-static coating has the build and 1 × 10 of 0.2 μm 11the surface resistivity of ohm/.
As for the heat-sealing film of preparation, its light transmittance is 85%, and its haze value is 10%, and the surface resistivity on the surface of heat sensitive adhesive is 1 × 10 10ohm/, and the surface resistivity on another surface is 1 × 10 11ohm/.After the clad strip made with this heat-sealing film seals with carrier band at 170 DEG C, the mean value of peeling force is 50g and the fluctuation range of peeling force is about 20g.When clad strip and carrier band are stripped, the hot sealing layer at sealing station place is retained on carrier band completely, and a small amount of functional layer is also positioned on carrier band, and therefore, this stripping is actually the stripping caused due to the cohesional failure of functional layer.After performing aging reaching 1 week under the condition at 52 DEG C/95rh%, the mean value of peeling force and the fluctuation range of peeling force do not change substantially.
example 2:
for the preparation of the material of functional layer:
By the styrene-butadiene block copolymer (strange beautiful (CHI MEI) of 67.5kg, PB-5903), the polyvinyl acetate (Hyundai of 37.5kg, VA60), the intrinsic antistatic polymer (IDP:PolyNova PNC300R-M) of 45kg and the antioxidant A5 (Jin Haiyabao of 0.6kg, Shanghai Jinhaiyabao Precision Chemical Co., Ltd.) evenly stir, and melting mixing at 180 DEG C, carries out cooling and granulating in further application subsequently.
the preparation of heat-sealing film and clad strip:
1. the Biaxially oriented polyester film that the one-sided Corona discharge Treatment that preparation 16 μm is thick is crossed.The coated about 0.2 μm of thick polyurethane-type primer coating in the surface crossed of Corona discharge Treatment, cures subsequently in an oven.Meanwhile, by the polymer alloy fusion coating prepared for functional layer on the polyester film scribbling primer coating, subsequently the product obtained is cooled and reeled.This functional layer has the thickness and 1 × 10 of 30 μm 9the surface resistivity of ohm/.
2. under agitation, acrylate copolymer (3M has the glass transition temperature of the 80 DEG C) powder dissolution of 2kg, in the ethyl acetate solvent of 16kg, is added the toluene of 2kg subsequently, and stir 5 minutes again in further application.In solution, the solids content of acrylic resin is 10%.This solution is coated to and is placed on baking oven on the surface with functional layer and by the product of acquisition and carries out drying process to remove solvent and to reel.Acrylic resin is heat sensitive adhesive layer, and its thickness is about 1 μm.The surface of this heat sensitive adhesive layer has 1 × 10 10the surface resistivity of ohm/.
3. the anti-static coating solution (K104A-2 of 5% solids content will be had, Qingdao trade Import and Export Co., Ltd. (Qingdao Trade Import and Export Co., Ltd.)) be coated on the pet sheet face relative with functional layer of heat-sealing film, and cure in an oven to solidify.In the environment of normal temperature and normal humidity, this anti-static coating has the build and 1 × 10 of 0.2 μm 11the surface resistivity of ohm/.
As for the heat-sealing film of preparation, its light transmittance is 85%, and its haze value is 10%, and the surface resistivity on the surface of heat sensitive adhesive is 1 × 10 10ohm/, and the surface resistivity on another surface is 1 × 10 11ohm/.After the clad strip made with this heat-sealing film seals with carrier band at 170 DEG C, the mean value of peeling force is 50g and the fluctuation range of peeling force is about 20g.When clad strip and carrier band are stripped, the hot sealing layer at sealing station place is retained on carrier band completely, and a small amount of functional layer is also positioned on carrier band, and therefore, this stripping is actually the stripping caused due to the cohesional failure of functional layer.After performing aging reaching 1 week under the condition at 52 DEG C/95rh%, the mean value of peeling force and the fluctuation range of peeling force do not change substantially.
example 3:
for the preparation of the material of functional layer:
By the styrene-butadiene block copolymer (strange beautiful (CHI MEI) of 80kg, PB-5903), poly-(vinyl acetate) (Hyundai of 20kg, and the antioxidant A5 (Jin Haiyabao of 0.4kg VA60), Shanghai Jinhaiyabao Precision Chemical Co., Ltd.) evenly stir, and melting mixing at 180 DEG C, carries out cooling and granulating in further application subsequently.
the preparation of heat-sealing film and clad strip:
1. made the material prepared for functional layer be formed as film by blow molding, and winding is in further application.The thickness of film is 35 μm.
2. the Biaxially oriented polyester film that the one-sided Corona discharge Treatment that preparation 12 μm is thick is crossed.The coated polyurethane adhesive in surface (35%, derive from the adhesive of Mitsui Takeda Chemical Co., Ltd (MITSUI TAKEDA CHEMICALJNC), A-969V/A-5 is 3/1) that Corona discharge Treatment is crossed.After baking, the thickness of this glue is about 2 μm.The functional layer film of preparation is combined with the surface of the polyester film scribbling this glue, at room temperature solidifies subsequently.
3. under agitation, by acrylate copolymer (DSM) powder dissolution of 2kg in the ethyl acetate solvent of 16kg, add 15% conductive black solution (the PCAUTO carbon black of 1kg subsequently, China ippon coating Co., Ltd (Nippon Paint Co., Ltd) and the toluene of 2kg, 5 minutes are stirred subsequently again in further application.In this solution, the solids content of acrylic resin is 9.5% and the ratio of conductive black and acrylic resin is 1/13.3.This solution is applied on the surface of the polyester film combined with functional layer, and the product of acquisition is put carry out in an oven drying process to remove solvent and to reel.Acrylic resin is heat sensitive adhesive layer, and its thickness is about 0.5 μm.The surface of this heat sensitive adhesive layer has 1 × 10 9the surface resistivity of ohm/.
4. the anti-static coating solution (K104A-2, Qingdao trade Import and Export Co., Ltd.) with 5% solids content is coated on the pet sheet face relative with functional layer of heat-sealing film, and cures to solidify on baking oven.In the environment of normal temperature and normal humidity, this anti-static coating has the build and 1 × 10 of 0.2 μm 11the surface resistivity of ohm/.
As for the heat-sealing film of preparation, its light transmittance is 75%, and its haze value is 10%, and the surface resistivity on the surface of heat sensitive adhesive is 1 × 10 9ohm/, and the surface resistivity on another surface is 1 × 10 11ohm/.With this heat-sealing film by the clad strip that is cut at 160 DEG C with carrier band sealing after, the mean value of peeling force is 50g and the fluctuation range of peeling force is about 20g.When clad strip and carrier band are stripped, the hot sealing layer at sealing station place is retained on carrier band completely, and does not have functional layer to be retained on carrier band, and therefore, this stripping is actually the interface peel between hot sealing layer and functional layer.
example 4:
for the preparation of the material of functional layer:
By (very beautiful for the styrene-butadiene block copolymer of 60kg, PB-5903), poly-(vinyl acetate) (Hyundai of 40kg, and the antioxidant A5 (Jin Haiyabao of 0.4kg VA60), Shanghai Jinhaiyabao Precision Chemical Co., Ltd.) evenly stir, and melting mixing at 180 DEG C, carries out cooling and granulating in further application subsequently.
the preparation of heat-sealing film and clad strip:
1. the material prepared for functional layer and LLDPE LLDPE (1002-YB derives from Exxon Mobil) coextrusion are formed as film by ad hoc approach, reel subsequently in further application.The gross thickness of this film is 35 μm, and wherein the thickness of functional layer is 12 μm and the thickness of polyethylene layer is 23 μm.
2. the Biaxially oriented polyester film that the one-sided Corona discharge Treatment that preparation 12 μm is thick is crossed.The coated polyurethane adhesive in surface (35%, derive from the adhesive of Mitsui Takeda Chemical Co., Ltd, A-969V/A-5 is 3/1) that Corona discharge Treatment is crossed.After baking, the thickness of this glue is about 2 μm.The polyethylene surface of double-layer films as above is combined with the surface of the polyester film scribbling this glue, at room temperature solidifies subsequently.
3. under agitation, by acrylate copolymer (DSM) powder dissolution of 2kg in the ethyl acetate solvent of 16kg, add the 20%ATO solution (nano tin dioxide/antimony oxide solution) of 2kg and the toluene of 1kg subsequently, subsequently again to stir at a high speed 5 minutes in further application.In this solution, the solids content of acrylic resin is 9.5% and the ratio of ATO and acrylic resin is 1/5.This solution is applied on the surface of the polyester film combined with functional layer, and the product of acquisition is put carry out in an oven drying process to remove solvent and to reel.Acrylic resin is heat sensitive adhesive layer, and its thickness is about 0.5 μm.The surface of this heat sensitive adhesive layer has 1 × 10 9the surface resistivity of ohm/.
4. the anti-static coating solution (K104A-2, Qingdao trade Import and Export Co., Ltd.) with 5% solids content is coated on the pet sheet face relative with functional layer of heat-sealing film, and cures to solidify on baking oven.In the environment of normal temperature and normal humidity, this anti-static coating has the build and 1 × 10 of 0.2 μm 11the surface resistivity of ohm/.
As for the heat-sealing film of preparation, its light transmittance is 85%, and its haze value is 15%, and the surface resistivity on the surface of heat sensitive adhesive is 1 × 10 9ohm/, and the surface resistivity on another surface is 1 × 10 11ohm/.With this heat-sealing film by the clad strip that is cut at 160 DEG C with carrier band sealing after, the mean value of peeling force is 40g and the fluctuation range of peeling force is about 20g.When clad strip and carrier band are stripped, the hot sealing layer at sealing station place is retained on carrier band completely, and does not have functional layer to be retained on carrier band, and therefore, this stripping is actually the interface peel between hot sealing layer and functional layer.
comparative example 1:
for the preparation of the material of functional layer:
By (very beautiful for the styrene-butadiene block copolymer of 30kg, PB-5903), poly-(vinyl acetate) (Hyundai of 75kg, VA60), the intrinsic antistatic polymer (IDP:PolyNova PNC300R-M) of 45kg and the antioxidant A5 (Jin Haiyabao of 0.6kg, Shanghai Jinhaiyabao Precision Chemical Co., Ltd.) evenly stir, and melting mixing at 180 DEG C, carries out cooling and granulating in further application subsequently.
the preparation of heat-sealing film and clad strip:
1. the Biaxially oriented polyester film that the one-sided Corona discharge Treatment that preparation 16 μm is thick is crossed.The coated about 0.2 μm of thick polyurethane-type primer coating in the surface crossed of Corona discharge Treatment, cures subsequently in an oven.Meanwhile, by the polymer alloy fusion coating prepared for functional layer on the polyester film scribbling primer coating, subsequently the product obtained is cooled and reeled.This functional layer has the thickness and 1 × 10 of 30 μm 9the surface resistivity of ohm/.
2. under agitation, acrylate copolymer (DSM has the glass transition temperature of the 42 DEG C) powder dissolution of 2kg, in the ethyl acetate solvent of 16kg, is added the toluene of 2kg subsequently, and stir 5 minutes again in further application.In solution, the solids content of acrylic resin is 10%.This solution is coated to and is placed on baking oven on the surface with functional layer and by the product of acquisition and carries out drying process to remove solvent and to reel.Acrylic resin is heat sensitive adhesive layer, and its thickness is about 1 μm.The surface of this heat sensitive adhesive layer has 1 × 10 10the surface resistivity of ohm/.
3. the anti-static coating solution (K104A-2 of 5% solids content will be had, Qingdao trade Import and Export Co., Ltd. (Qingdao Trade Import and Export Co., Ltd.)) be coated on the pet sheet face relative with functional layer of heat-sealing film, and cure to solidify on baking oven.In the environment of normal temperature and normal humidity, this anti-static coating has the build and 1 × 10 of 0.2 μm 11the surface resistivity of ohm/.
As for the heat-sealing film of preparation, its light transmittance is 85%, and its haze value is 10%, and the surface resistivity on the surface of heat sensitive adhesive is 1 × 10 10ohm/, and the surface resistivity on another surface is 1 × 10 11ohm/.After the clad strip made with this heat-sealing film seals with carrier band at 170 DEG C, the mean value of peeling force is 50g and the fluctuation range of peeling force is about 20g.When clad strip and carrier band are stripped, the hot sealing layer at sealing station place is retained on carrier band completely, and a small amount of functional layer is also positioned on carrier band, and therefore, this stripping is actually the stripping caused due to the cohesional failure of functional layer.After performing aging reaching 1 week under the condition at 52 DEG C/95rh%, the mean value of peeling force and the fluctuation range of peeling force do not change substantially.
comparative example 2:
for the preparation of the material of functional layer:
By poly-(vinyl acetate) (Hyundai of the styrene-butadiene block copolymer (CHI MET PB-5903) of 30kg, 70kg, and the antioxidant A5 (Jin Haiyabao of 0.4kg VA60), Shanghai Jinhaiyabao Precision Chemical Co., Ltd.) evenly stir, and melting mixing at 180 DEG C, carries out cooling and granulating in further application subsequently.
the preparation of heat-sealing film and clad strip:
1. the material prepared for functional layer and LLDPE LLDPE (1002-YB derives from Exxon Mobil) coextrusion are formed as film by ad hoc approach, reel subsequently in further application.The gross thickness of this film is 35 μm, and wherein the thickness of functional layer is 12 μm and the thickness of polyethylene layer is 23 μm.
2. the Biaxially oriented polyester film that the one-sided Corona discharge Treatment that preparation 12 μm is thick is crossed.The coated polyurethane adhesive in surface (35%, derive from the adhesive of Mitsui Takeda Chemical Co., Ltd, A-969V/A-5 is 3/1) that Corona discharge Treatment is crossed.After baking, the thickness of this glue is about 2 μm.The polyethylene surface of double-layer films as above is combined with the surface of the polyester film scribbling this glue, at room temperature solidifies subsequently.
3. under agitation, by acrylate copolymer (DSM) powder dissolution of 2kg in the ethyl acetate solvent of 16kg, add the 20%ATO solution (nano tin dioxide/antimony oxide solution) of 2kg and the toluene of 1kg subsequently, subsequently again to stir at a high speed 5 minutes in further application.In this solution, the solids content of acrylic resin is 9.5% and the ratio of ATO and acrylic resin is 1/5.This solution is applied on the surface of the polyester film combined with functional layer, and the product of acquisition is put carry out in an oven drying process to remove solvent and to reel.Acrylic resin is heat sensitive adhesive layer, and its thickness is about 0.5 μm.The surface of heat sensitive adhesive layer has 1 × 10 9the surface resistivity of ohm/.
4. the anti-static coating solution (K104A-2 of 5% solids content will be had, Qingdao trade Import and Export Co., Ltd. (Qingdao Trade Import and Export Co., Ltd.)) be coated on the pet sheet face relative with functional layer of heat-sealing film, and cure to solidify on baking oven.In the environment of normal temperature and normal humidity, this anti-static coating has the build and 1 × 10 of 0.2 μm 11the surface resistivity of ohm/.
As for the heat-sealing film of preparation, its light transmittance is 85%, and its haze value is 15%, and the surface resistivity on the surface of heat sensitive adhesive is 1 × 10 9ohm/, and the surface resistivity on another surface is 1 × 10 11ohm/.With this heat-sealing film by the clad strip that is cut at 160 DEG C with carrier band sealing after, the mean value of peeling force is less than 30g.Too little peeling force can weaken the sealing between clad strip and carrier band, and this may cause band opening.
The results are summarized in following table of each example.
The preparation that these data indicate functional layer has vital impact for the value of peeling force.Due to the interface peel that the stripping in the present invention when clad strip is stripped is between hot sealing layer and functional layer, or the stripping to be caused by the cohesional failure of functional layer, therefore, when the preparation of the basic resin for hot sealing layer is constant, gathers when hot sealing layer is peeled off from functional layer and can be regulated by the content changed the preparation of styrene-butadiene block copolymer in functional layer in peeling force or functional layer.Can see from data analysis: the peeling force of 180 ° can be increased by the content increasing styrene-butadiene block copolymer, and the fluctuation range of peeling force remains unchanged substantially.If added to by conducting polymer in functional layer, so because hot sealing layer is very thin, therefore generation minor variations still will be remained 1 × 10 by the surface resistivity on this surface 12ohm/.If the glass transition temperature of hot sealing layer increases fully, so the anti-adhesion effectiveness of clad strip can strengthen.If added to by inorganic filler in hot sealing layer, so clad strip can possess the anti-adhesion effectiveness of antistatic characteristic and enhancing, but its haze value increases simultaneously.

Claims (10)

1., for a heat-sealing film for packaging electronic components, described heat-sealing film comprises:
Basal layer;
At least one intermediate layer, at least one intermediate layer described to be arranged on described basal layer and to it is characterized in that comprising a kind of mixture, and be 100 % by weight to calculate with described intermediate layer gross weight, described mixture comprises:
The vinyl acetate copolymer of 5-70 % by weight, wherein derived from the unit of vinyl acetate in described copolymer more than 10 % by mole;
The SB of 20-90 % by weight; And
The conducting polymer of 0-40 % by weight; With
At least one hot sealing layer, at least one hot sealing layer described is arranged on the surface relative with described basal layer in described intermediate layer.
2. heat-sealing film according to claim 1, the light transmittance of wherein said basal layer is not less than 85%, and hot strength is not less than 50MPa.
3. heat-sealing film according to any one of claim 1 to 2, wherein said SB has 40, the weight average molecular weight of 000 ~ 300,000.
4. heat-sealing film according to claim 1, wherein said vinyl acetate copolymer is the copolymer of vinyl acetate and ethene.
5. heat-sealing film as claimed in claim 1, wherein said intermediate layer is further containing polyethylene, and described polyethylene accounts for the 10-60 % by weight of described intermediate layer gross weight.
6. heat-sealing film according to claim 5, wherein said polyethylene is all arranged in described intermediate layer as polyethylene subgrade.
7., according to claim 1 or heat-sealing film according to claim 5, wherein said hot sealing layer is further containing conductive filler, and with regard to the gross weight of whole hot sealing layer, the content of described conductive filler is no more than 60%.
8. heat-sealing film according to claim 7, wherein said conductive filler is selected from: nano-oxide, CNT, carbon dust, metal dust, or its mixture.
9. heat-sealing film according to claim 1, comprises the adhesion layer between described intermediate layer and described basal layer further.
10. a clad strip, described clad strip is for sealing the carrier band to comprising electronic component, and described clad strip comprises:
The basal layer limited any one of claim 1 to 9;
Limit any one of claim 1 to 9, be arranged on the intermediate layer for Charge dissipation on described basal layer;
Limit any one of claim 1 to 9, the hot sealing layer be arranged on described intermediate layer; With
Optional anti-static coating, described anti-static coating is positioned on the surface relative with described intermediate layer of described basal layer, it is characterized in that:
Described clad strip has the mean transmittance of at least 75%, is no more than the haze of 50%, and is no more than 1 × 10 11surface resistivity; Make when the heat-sealing of described clad strip to carrier band to form goods time, described clad strip is at least 20gf/mm for the mean peel strength of described carrier band, when the relative humidity that described goods bear the temperature that is not less than 50 DEG C and are not less than 90% reaches at least 5 days, described peel strength reduction is not more than 10%.
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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5762884B2 (en) * 2011-08-26 2015-08-12 昭和電工パッケージング株式会社 Dust-free packaging bag with excellent automatic packaging
CN103466195A (en) * 2013-03-19 2013-12-25 上海吉景包装制品有限公司 Anti-static upper cover tape
JP6325859B2 (en) * 2014-03-20 2018-05-16 リンテック株式会社 Conductive resin sheet
JP6429824B2 (en) * 2016-03-31 2018-11-28 古河電気工業株式会社 Electronic device packaging tape
CN110683208A (en) * 2018-07-06 2020-01-14 3M创新有限公司 Multi-layer cover tape construction
US20200017266A1 (en) * 2018-07-12 2020-01-16 Advantek, Inc. Carbon nanotubes in carrier tape, cover tape and static shielding bags
CN113646242B (en) * 2019-04-03 2023-04-21 大日本印刷株式会社 Cover tape for packaging electronic components and package
JP7164485B2 (en) * 2019-04-26 2022-11-01 デンカ株式会社 Cover film and electronic component package using the same
JP2022158849A (en) * 2021-03-31 2022-10-17 住友ベークライト株式会社 Cover tape for electronic component packaging, and electronic component package
WO2022210158A1 (en) * 2021-03-31 2022-10-06 住友ベークライト株式会社 Cover tape for packaging electronic component and electronic component package
CN114801401A (en) * 2022-03-23 2022-07-29 毕玛时软包装（苏州）有限公司 Clean easy-to-open cover film for liquid packaging

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366681A (en) * 2000-04-03 2002-08-28 大日本印刷株式会社 Transparent, electrically conductive and heat-sealable material and ladded container for carrier tape using the same
US20030035946A1 (en) * 2001-06-26 2003-02-20 Hisao Nakanishi Cover tape for packaging electronic components
CN1432514A (en) * 2002-01-09 2003-07-30 住友电木株式会社 Electonic element packing belt

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54129075A (en) * 1978-03-30 1979-10-06 Denki Kagaku Kogyo Kk Film for heat-seal package
JPS5920557B2 (en) * 1978-06-29 1984-05-14 電気化学工業株式会社 packaging
JP2609779B2 (en) * 1991-02-28 1997-05-14 住友ベークライト株式会社 Cover tape for packaging chip-type electronic components
JPH0796585A (en) * 1993-08-04 1995-04-11 Dainippon Printing Co Ltd Cover material
JPH08295001A (en) * 1995-04-27 1996-11-12 Dainippon Printing Co Ltd Lid material, carrier tape and taping using these materials
JPH09111207A (en) * 1995-10-19 1997-04-28 Dainippon Printing Co Ltd Cover tape for carrier tape
JPH1095448A (en) * 1996-09-18 1998-04-14 Dainippon Printing Co Ltd Lid material for carrier tape
AU6734000A (en) * 1999-08-31 2001-03-26 Denki Kagaku Kogyo Kabushiki Kaisha Transparent heat-sealing film
JP4544563B2 (en) * 2001-03-23 2010-09-15 大日本印刷株式会社 Heat seal laminate and carrier tape package
JP2008273602A (en) * 2007-05-02 2008-11-13 Denki Kagaku Kogyo Kk Cover film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1366681A (en) * 2000-04-03 2002-08-28 大日本印刷株式会社 Transparent, electrically conductive and heat-sealable material and ladded container for carrier tape using the same
US20030035946A1 (en) * 2001-06-26 2003-02-20 Hisao Nakanishi Cover tape for packaging electronic components
CN1432514A (en) * 2002-01-09 2003-07-30 住友电木株式会社 Electonic element packing belt

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
罗河胜.苯乙烯-丁二烯-苯乙烯共聚物.《塑料材料手册》.广州:广东科技出版社,2010,第31-33页. *

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