JP2008273602A - Cover film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cover film allowing a wide temperature range of a sealing iron to be employed for obtaining a peeling strength, having a small dispersion in the peeling strength when peeled, and having an excellent heat-sealing performance to a carrier tape. <P>SOLUTION: This cover film including a base material layer, an intermediate layer, and a sealant layer. The base material layer is a biaxially drawn polyester film or a biaxially drawn polypropylene film. The intermediate layer and the sealant layer are a hydrogen added resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene based hydrocarbon compound. The resin (a) contains aromatic vinyl compound of 20 mass% to 45 mass%, and the cover film contains 10 to 30 pts.mass of an organic particle or an inorganic particle to 100 pts.mass of the resin of the sealant layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cover film used for a package of electronic parts.

Along with the downsizing of electronic devices, the electronic components used are also becoming smaller and higher performance, and in the assembly process of electronic devices, the components are automatically mounted on a printed board. The surface-mounting electronic component is stored in a carrier tape in which embossed pockets that can be stored in accordance with the shape of the electronic component are continuously formed. After storing the electronic parts, a cover film is stacked as a lid on the upper surface of the carrier tape, and both ends of the cover film are continuously heat-sealed in the length direction with a heated seal bar to form a package. As the cover film material, a biaxially stretched polyester film is used as a base material, and a sealant layer is laminated with a hot melt layer.

The strength when the cover film is peeled off from the carrier tape is called peel strength, but the parts stored in the carrier tape are peeled off from the carrier tape by an automatic peeling device when mounting the parts in the manufacturing process of electronic devices. Therefore, the peel strength from the carrier tape is particularly important as a function of the cover film. If the peel strength is too strong, the cover film may be cut. Conversely, if the peel strength is too weak, the cover film may be peeled off from the carrier tape when the transport body is transferred, and the electronic components as the contents may fall off. . In addition, high transparency is also an important characteristic of the cover film so that the electronic parts that are stored items can be easily identified. That is, in the inspection of electronic parts such as ICs, a method of discriminating defects such as deformation of IC pins is performed by taking an image with a CCD camera from the cover tape and analyzing the image. There is a need for a cover tape that has properties. In such a method of use, 50% is required as haze (cloudiness value), more preferably 30% or less.

As the mounting speed of electronic components is increased, a strong tensile stress is also applied to the carrier tape. A carrier tape made of polycarbonate has been used as the carrier tape, which is excellent in tensile strength and hardly cuts the carrier tape even when pulled at high speed and high strength. The carrier tape made of polycarbonate has a property that it is difficult to adhere the cover film by heat sealing compared to polystyrene, etc., but the time when the seal bar contacts the cover film is shortened due to the high speed when storing parts. Therefore, there may be a problem that the cover film cannot be sufficiently heat-sealed with respect to the polycarbonate carrier tape. Also, if the peel temperature depends greatly on the seal temperature, not only is it difficult to set the heat seal conditions to obtain an appropriate peel strength, but the adhesive state with the carrier tape is unstable when the cover film is heat sealed. It may become. Therefore, when the cover film is peeled off, the carrier tape may not be peeled off smoothly, and a phenomenon that the electronic component of the contents jumps out of the storage pocket, that is, a jumping trouble may occur.

As prior arts related to the present invention, there are Patent Documents 1 to 9 and the like. Patent Documents 1 to 5 are patents relating to a cover film in which a hydrogenated resin of a block copolymer of an aromatic vinyl compound and a conjugated diene hydrocarbon compound is used as a sealant layer. However, in these patents, heat sealability with respect to a polycarbonate carrier tape has not been studied. In addition, regarding the optimum layer structure relating to the cover film, there has been no mention of a resin structure suitable as the intermediate layer resin. Also, in the case of a cover film using a thermoplastic resin for the sealant layer, it is required to use a resin having a relatively low softening point so that it can be heat-sealed without poor adhesion even at a high taping speed. When such a low softening point resin is used for the sealant layer, blocking between cover films tends to occur. In addition, when heat sealing is performed with a heated seal bar, portions other than the portion pressed with the seal bar are also in close contact with the carrier tape, and the peel strength tends to vary. Patent Documents 6 to 9 are patents relating to a cover film in which spherical fine particles are dispersed in a sealant layer to prevent blocking. However, in these patents, the heat sealability with respect to the polycarbonate carrier tape and the dependency of the peel strength on the seal temperature have not been studied. Moreover, in order to make it easy to obtain sufficient peel strength with respect to the polycarbonate carrier tape, it is effective to increase the thickness of the sealant layer. However, when spherical fine particles are added to the sealant layer to prevent blocking, the thickness is increased. The problem is that not only the transparency is likely to decrease due to the increase in the number of particles, but also the cost is likely to increase.
JP-A-4-139287 Japanese Patent Laid-Open No. 7-118613 JP-A-8-192886 JP-A-8-324676 JP-T-2001-519728 Japanese Patent No. 3503754 JP 9-2079888 A Japanese Patent No. 3228895 JP 2006-168188 A

The present invention provides a cover film that has a wide temperature range of a sealing iron for obtaining a predetermined peel strength at the time of heat sealing between a cover film and a carrier tape, has a small variation in peel strength when peeled, and is excellent in transparency. It is. In particular, it has excellent heat sealability with respect to a polycarbonate carrier tape.

The present invention employs the following means in order to solve the above problems.
(1) A cover film comprising a base material layer, an intermediate layer, and a sealant layer, the base material layer is a biaxially stretched polyester film or a biaxially stretched polypropylene film, and the intermediate layer and sealant layer are an aromatic vinyl compound and a conjugated diene A hydrogenated resin (a) of a block copolymer of a hydrocarbon-based hydrocarbon compound, wherein the aromatic vinyl compound in the resin (a) is 20% by mass or more and 45% by mass or less, and organic particles or inorganic particles are sealed The cover film formed by containing 10 to 30 parts by mass with respect to 100 parts by mass of the resin of the layer.
(2) A cover film comprising a base material layer, an intermediate layer, and a sealant layer, the base material layer is a biaxially stretched polyester film or a biaxially stretched polypropylene film, and the intermediate layer and the sealant layer are an aromatic vinyl compound and a conjugated diene Hydrogenated resin (a) 50 to 90% by mass of ethylene-based hydrocarbon compound block copolymer and 10 to 50% by mass of ethylene-based resin (b), and 20% by mass of aromatic vinyl compound in resin (a) % To 45% by mass and comprising 10 to 30 parts by mass of organic particles or inorganic particles with respect to 100 parts by mass of the resin of the sealant layer.
(3) One or two ethylene resins (b) selected from the group consisting of a copolymer resin of ethylene and α-olefin, a copolymer resin of ethylene and vinyl acetate, and a copolymer resin of ethylene and acrylate ester The cover film as described in (2) above.
(4) The cover film according to any one of (1) to (3), wherein an antistatic treatment is performed on one side or both sides.
(5) An electronic component packaging container using the cover film according to any one of (1) to (4).
(6) An electronic component packaging container using the cover film according to any one of (1) to (4) and a polycarbonate carrier tape.
(7) A carrier tape cover film using the cover film according to any one of (1) to (4).

The cover film of the present invention has a wide temperature range of a seal iron for obtaining a predetermined peel strength at the time of heat sealing between the cover film and the carrier tape, has small variations in peel strength when peeled, and is excellent in transparency. In particular, it has excellent heat sealability with respect to a polycarbonate carrier tape.

The biaxially stretched polyester layer used for the base material layer is a layer using biaxially stretched polyester. Examples of the biaxially stretched polyester include those commonly used such as biaxially stretched polyethylene terephthalate and biaxially stretched polyethylene naphthalate, and those coated with or kneaded with an antistatic agent for antistatic treatment, or corona. Those subjected to treatment or easy adhesion treatment can be used. If the biaxially stretched polyester film is too thin, it tends to cause “film breakage” when the cover film is peeled off, and it is difficult to handle because the film is weak. On the other hand, if it is too thick, the adhesiveness of the cover film is liable to be lowered, so that a thickness of usually 12 to 50 μm can be suitably used.

The biaxially stretched polypropylene layer used for the base material layer is a layer using biaxially stretched polypropylene. As the biaxially stretched polypropylene, in addition to the commonly used one, an antistatic agent for antistatic treatment applied or kneaded, or one subjected to corona treatment or easy adhesion treatment may be used. I can do it. If the biaxially stretched polypropylene film is too thin, it tends to cause “film breakage” when the cover film is peeled off. On the other hand, if it is too thick, the adhesiveness of the cover film tends to be lowered. It can be suitably used.

The hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene hydrocarbon compound used for the sealant layer and the intermediate layer has an aromatic vinyl compound content of 20% by mass or more in the resin (a). It is 20 mass% or less, Preferably it is 20 mass% or more and 35 mass% or less. When the ratio of the aromatic vinyl compound is less than 20% by mass, when the cover tape is heat-sealed to the carrier tape, the portion where the heat-sealing iron does not hit is also adhered, and this easily causes the strength of the peel strength or is stored. Electronic components adhere to the cover tape, which tends to cause mounting defects. On the other hand, if the ratio of the aromatic vinyl compound exceeds 45% by mass, the dependency of the peel strength on the seal temperature tends to increase, and it becomes difficult to obtain an appropriate peel strength. Also, when the cover film is heat-sealed, the adhesive state with the carrier tape tends to become unstable, so when peeling the cover film, the carrier tape vibrates and the contents of the electronic component vibrate. Jumps out of the storage pocket, that is, jumping trouble is likely to occur.

When a hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene hydrocarbon compound and an ethylene resin (b) are used as a sealant layer or an intermediate layer, the resin (a) is 50 to 90% by mass. The resin (b) is 10 to 50% by mass, preferably 10 to 30% by mass of the resin (b) to 70 to 90% by mass. When the amount of the ethylene-based resin (b) used exceeds 50% by mass, it becomes easy to generate a high part and a low part in the peeling strength when peeling the cover tape from the carrier tape. It is easy for the electronic components to jump out of the carrier tape. Furthermore, when the cover tape is heat-sealed to the carrier tape, the peel strength is likely to change depending on the temperature of the heat seal iron, so that it is difficult to obtain the desired peel strength.

Examples of the aromatic vinyl compound of the hydrogenated resin (a) of the block copolymer of the aromatic vinyl compound and the conjugated diene hydrocarbon compound in the sealant layer include styrene, α-methylstyrene, and various alkyl-substituted styrenes. However, among them, styrene can be preferably used. Examples of the conjugated diene hydrocarbon compound of the resin (a) include butadiene, isoprene, 1,3-pentadiene, 1,3-hexadiene, 2,3-dimethyl-1,3-butadiene, and the like. Of these, butadiene and isoprene can be preferably used. The hydrogenation rate of (a) is usually 90 to 100%, preferably 95 to 100%.

Examples of the ethylene resin (b) for the sealant layer and the intermediate layer include polypropylene, poly-1-butene, ethylene containing 50% by mass or more, and ethylene copolymer resin. Chain low density polyethylene, low density polyethylene, ethylene-propylene random copolymer resin, ethylene-1-butene random copolymer resin, ethylene-vinyl acetate copolymer resin, ethylene-acrylic acid random copolymer, ethylene-acrylic acid ester random Examples thereof include copolymers and ethylene-styrene random copolymers. Among them, random copolymer resin of ethylene and 1-butene, random copolymer resin of ethylene-vinyl acetate, and random copolymer resin of ethylene-acrylic acid ester have good resin extrudability and heat the cover tape to the carrier tape. Since the change in peel strength due to the temperature of the heat seal iron is small when sealing, it can be used more suitably.

In order to prevent blocking when a cover film is wound on the sealant layer, spherical or crushed acrylic particles, styrene particles, organic particles such as silicone particles, talc particles, silica particles, mica particles, etc. Inorganic particles can be added. In particular, there is little decrease in transparency when acrylic particles or silica particles are added, and it can be suitably used. The maximum frequency diameter obtained from the weight distribution curve of the particles is preferably 1 to 20 μm, more preferably 2 to 12 μm. If the maximum frequency diameter is less than 1 μm, the antiblocking effect due to the addition of particles may not be sufficiently exhibited. On the other hand, when it exceeds 20 μm, the effect of blocking prevention is improved, but a large amount is required to prevent blocking, resulting in an increase in cost, or a visible unevenness on the surface of the sealant layer of the cover film. As a result, the appearance of the cover film tends to deteriorate. The addition amount of the particles is preferably 10 to 30 parts by mass, more preferably 10 to 20 parts by mass with respect to 100 parts by mass of the sealant resin. When the amount of added particles is less than the above amount, the effect of blocking prevention due to the addition of particles may not sufficiently appear. When the added amount of particles is more than the above amount, the transparency of the cover film Decrease or heat sealability may be reduced.

The thickness of the intermediate layer is preferably 10 μm to 30 μm, more preferably 15 μm to 25 μm. When the thickness of the intermediate layer is 10 μm or less, it becomes difficult to obtain sufficient peel strength when the polycarbonate carrier tape is sealed at a high speed, and when it is 30 μm or more, the temperature of the heat seal iron depends on the temperature of the cover tape when heat-sealing the carrier tape. Since the peel strength is likely to change, it is difficult to obtain the desired peel strength.

The thickness of the sealant layer is preferably 5 μm to 25 μm, more preferably 5 μm to 10 μm. When the thickness of the sealant layer is 5 μm or less, it is difficult to obtain a sufficient anti-blocking effect. On the other hand, when the sealant layer is 25 μm or more, the transparency tends to decrease.

The cover film can be subjected to antistatic treatment as necessary. Antistatic agents include, for example, nonionic, cationic, anionic, and amphoteric ionic surfactants, polymeric antistatic agents, and metal oxide fine particles such as antimony oxide and tin oxide. The contained conductive agent or the like can be applied to the surface of the substrate and the surface of the sealant by a roll coater using a gravure roll, spraying, or the like. In addition, a sealant-type antistatic agent, a polymer-type antistatic agent, and a conductive agent containing metal oxide fine particles such as antimony oxide and tin oxide are kneaded into the resin constituting the sealant. It is also possible to impart conductivity to. Among them, the method for imparting the conductive performance to the sealant layer is to apply a surfactant type antistatic agent to the surface of the sealant layer. When heat-sealing the carrier tape, it is easy to obtain a stable peel strength. It is inexpensive and preferable. Before performing the antistatic treatment, it is preferable to subject the front and back surfaces of the film to corona discharge treatment or ozone treatment in order to uniformly apply these antistatic agents. In particular, corona discharge treatment is inexpensive and preferable.

The method for producing the film is not particularly limited. For example, the components constituting the intermediate layer and the sealant layer are blended using a mixer such as a Henschel mixer, a tumbler mixer, or a mazeller, and then uniaxially or biaxially. After kneading and extruding with a shaft extruder, pellets are obtained, and an intermediate layer resin is laminated on the biaxially stretched film of the base material layer by an extrusion coating method. Further, a sealant resin is formed on the intermediate layer resin surface by an extrusion coating method. There is a method of laminating. As another method, the resin that constitutes the sealant layer and the resin that constitutes the intermediate layer are melt-kneaded using separate single-screw or twin-screw extruders, and both are fed via a feed block or a multi-manifold die. After stacking and integrating, a two-layer film consisting of a sealant layer and an intermediate layer is obtained by co-extrusion from a T-die, and then bonded to the biaxially stretched film of the base material layer by dry lamination or extrusion lamination It is also possible.

As a cover film manufacturing machine, a general laminator can be used, and a tandem laminator can also be used. When performing extrusion lamination, dry lamination, and extrusion coating, in order to strengthen the adhesive force between the base film and the intermediate layer, the base layer is made of polyurethane, polyolefin, ethylene-vinyl acetate resin, ethylene-acrylic ester, etc. Surface treatments such as anchor coating agent coating treatment, sand blast treatment, corona discharge treatment, and plasma treatment can be performed. In addition, an antistatic agent may be blended and used in the resin used for the base material layer, or an antistatic product in which the antistatic agent is surface-coated on the base material layer may be used. As a coater for applying the anchor coating agent to the biaxially stretched polyester film, a commonly used one such as a roll coater, a gravure coater, a reverse roll coater, a bar coater, or a die coater can be used.

Other layers may be inserted between the layers of the cover film as long as the object of the present invention is not impaired.

When heat sealing is performed using the cover film as a cover material, a component storage tape having a recess for storing electronic components at regular intervals, such as a carrier tape, can be used as the bottom material. The material of the bottom material is not particularly limited. For example, polystyrene, polyvinyl chloride, polycarbonate, polyester, polypropylene, or the like can be used.

By using the cover film of the electronic component of the present invention, the transparency of the electronic component is prevented and the chip-type electronic component is prevented from being contaminated during storage, transportation and mounting, and has a practical peel strength. Excellent heat-sealability for easy acquisition and easy-openability for easy removal. Furthermore, it is excellent in heat sealability with respect to a carrier tape made of polycarbonate, and it takes less time to press the seal iron at the time of heat sealing, and high-speed sealing is possible.

EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited by these.
Example 1
As the resin (a) constituting the sealant layer, a hydrogenated resin of styrene-butadiene-styrene triblock copolymer (manufactured by Asahi Kasei Chemicals Co., Ltd., “Tuftec H1041”, styrene content 30% by mass) is used to constitute the sealant layer. For 100 parts by mass of resin, crosslinked acrylic particles having a maximum frequency diameter of 5 μm obtained from a weight distribution curve obtained by a measurement method according to JIS-Z8823-1 (2001) (manufactured by Sekisui Plastics Co., Ltd. 10 parts by mass of polymer MBX ") was mixed, and kneaded and extruded with a twin-screw extruder to obtain a compound that became a sealant resin composition. As a resin (a) constituting the intermediate layer, a hydrogenated resin of a styrene-butadiene-styrene triblock copolymer (manufactured by Asahi Kasei Chemicals Co., Ltd., “Tuftec H1041”, styrene content of 30% by mass) was separated into a single unit. A bilayer film that is extruded from a screw extruder and is extrusion coated on the surface of a biaxially stretched polyethylene terephthalate film (thickness: 16 μm) coated with a urethane anchor coating agent to a thickness of 15 μm. After that, a cover film composed of base material layer / intermediate layer / sealant layer was obtained by extrusion coating the surface of the intermediate layer with a sealant layer having a thickness of 10 μm.

(Examples 2 to 25, Comparative Examples 1 to 20)
A carrier tape cover film was produced in the same manner as in Example 1 with the resin composition shown in Tables 1 to 9 using the following resin and particles added to the sealant layer. The thicknesses of the sealant layer and the intermediate layer are as shown in Tables 1 to 9. The results are shown in Tables 1-9.

The resin (a), resin (b), and particles used in each example and each comparative example are as follows.
Resin (a) -1: Hydrogenated resin of styrene-butadiene-styrene triblock copolymer (manufactured by Asahi Kasei Chemicals Corporation, “Tuftec H1041”, styrene content 30% by mass)
Resin (a) -2: Hydrogenated resin of styrene-butadiene-styrene triblock copolymer (manufactured by Asahi Kasei Chemicals Corporation, “Tuftec H1272”, styrene content 35 mass%)
Resin (a) 3: Hydrogenated resin of styrene-butadiene-styrene triblock copolymer (manufactured by Asahi Kasei Chemicals Corporation, “Tuftec H1052”, styrene content 20% by mass)
Resin (a) 4: Hydrogenated resin of styrene-butadiene-styrene triblock copolymer (Asahi Kasei Chemicals, "Tuftec H1051", styrene content 42% by mass)
Resin (a) 5: Hydrogenated resin of styrene-butadiene-styrene triblock copolymer (Asahi Kasei Chemicals, "Tuftec H1062", styrene content 18% by mass)
Resin (a) 6: Hydrogenated resin of styrene-butadiene-styrene triblock copolymer (manufactured by Asahi Kasei Chemicals Corporation, “Tuftec H1043”, styrene content 63 mass%)

Resin (b) -1: Linear low density polyethylene (manufactured by Nippon Polyethylene Co., Ltd., “Harmolex”)
Resin (b) -2: Linear low-density polyethylene (Nippon Polyethylene, “Kernel”)
Resin (b) -3: Ethylene-vinyl acetate copolymer resin (Mitsui DuPont Polychemical Co., Ltd., “Evaflex”, vinyl acetate content 19% by mass)
Resin (b) -4: Ethylene-methyl acrylate copolymer resin (manufactured by Nippon Polyethylene Co., Ltd., “Lex Pearl EMA”, methyl acrylate content 20% by mass)
Resin (b) -5: Ethylene-1-butene random copolymer resin (manufactured by Mitsui Chemicals, “Toughmer”)

Particle (1): Cross-linked acrylic particle (manufactured by Sekisui Plastics Co., Ltd., “Techpolymer MBX-5”, maximum frequency diameter 5 μm)
Particle (2): Silica particle (manufactured by Denki Kagaku Kogyo Co., Ltd., “Denka fused silica FB-5D”, maximum frequency diameter 5 μm)
Particle (3): Cross-linked acrylic particle (manufactured by Sekisui Plastics Co., Ltd., “Techpolymer MBX-12”, maximum frequency diameter 12 μm)
Particle (4): Cross-linked acrylic particle (manufactured by Sekisui Plastics Co., Ltd., “Techpolymer MBX-20”, maximum frequency diameter 20 μm)

The following evaluations were performed on the cover films for carrier tapes of electronic components produced in each Example and each Comparative Example. These results are summarized in Tables 1 to 9.
(1) Peel strength temperature dependence on polystyrene (PS) carrier tape: using a sealing machine (Systemation, ST-60), sealing head width 0.5 mm × 2, sealing head length 32 mm, sealing pressure Under the conditions of 5 MPa, feed length of 16 mm, and sealing time of 0.5 seconds × 2 (double seal), a hot iron temperature is changed from 130 ° C. to 180 ° C. at intervals of 10 ° C., and a 21.5 mm wide cover film is made of 24 mm wide polystyrene. Heat-sealed on a carrier tape (manufactured by Denki Kagaku Kogyo). After being left for 24 hours, the cover film was peeled off at a speed of 300 mm / min and a peeling angle of 180 °. The average peel strength at 130 ° C to 180 ° C is in the range of 0.3N to 1.3N, and the difference between the average peel strength when sealed at 130 ° C and the average peel strength when sealed at 180 ° C is 0.5N The following were marked as “excellent”, those with 0.8 N or less as “good”, and those with an average peel strength other than the above were marked as “bad”. The results are shown in Tables 1-9.
(2) High-speed sealing characteristics for polycarbonate (PC) carrier tape Using a sealing machine (Systemation Corporation, ST-60), seal head width 0.5 mm x 2, seal head length 32 mm, seal pressure 3.5 MPa, feed Under the conditions of a length of 16 mm and a sealing time of 0.2 seconds × 2 (double seal), the thermal iron temperature was changed from 150 ° C. to 200 ° C. at intervals of 10 ° C., and a 21.5 mm wide cover film was converted to a 24 mm wide polycarbonate. Heat-sealed on a carrier tape (manufactured by Denki Kagaku Kogyo). After being left for 24 hours, the cover film was peeled off at a speed of 300 mm / min and a peeling angle of 180 °. When the average peel strength when heat-sealed at a temperature of 150 ° C. to 200 ° C. is in the range of 0.4N to 0.6N, “excellent”, and in the range of 0.3 to 0.8N “good” ", And those other than the above were described as" bad ".
The results are shown in Tables 1-9.
(3) Adhesion of non-sealed parts When heat sealing is performed under the conditions of (1), the part where the sealing iron does not adhere is not marked as "good", and the one marked as "bad". did. A result is shown in the column of adhesion | attachment of the non-seal part of Table 1-Table 9.
(4) Transparency Haze (cloudiness value) was measured using an integrating sphere type measuring apparatus according to measuring method A according to JIS-K7105 (1998). The unit is%. The results are shown in the column of haze (cloudiness value) in Tables 1 to 9.

The cover film provided by the present invention is excellent in heat sealability for easily obtaining a practical peel strength and transparency for identifying a storage component. In particular, the heat sealability of polycarbonate carrier tape is excellent, and it takes less time to press the seal iron during heat sealing, enabling high-speed sealing.

The cover film of the present invention can be applied to various small electric parts in addition to electronic parts.

Claims (7)

  A cover film comprising a base material layer, an intermediate layer, and a sealant layer, the base material layer is a biaxially stretched polyester film or a biaxially stretched polypropylene film, and the intermediate layer and sealant layer are an aromatic vinyl compound and a conjugated diene hydrocarbon A hydrogenated resin (a) of a block copolymer of the compound, wherein the aromatic vinyl compound in the resin (a) is 20% by mass or more and 45% by mass or less, and the organic particles or the inorganic particles are used as a resin for the sealant layer. A cover film comprising 10 to 30 parts by mass with respect to 100 parts by mass. A cover film comprising a base material layer, an intermediate layer, and a sealant layer, the base material layer is a biaxially stretched polyester film or a biaxially stretched polypropylene film, and the intermediate layer and sealant layer are an aromatic vinyl compound and a conjugated diene hydrocarbon The hydrogenated resin (a) of the block copolymer of the compound is 50 to 90% by mass and the ethylene resin (b) is 10 to 50% by mass, and the aromatic vinyl compound in the resin (a) is 20% by mass or more and 45%. A cover film containing 10 to 30 parts by mass of organic particles or inorganic particles with respect to 100 parts by mass of the resin of the sealant layer. The ethylene resin (b) is one or more selected from the group consisting of a copolymer resin of ethylene and α-olefin, a copolymer resin of ethylene and vinyl acetate, and a copolymer resin of ethylene and acrylate ester. The cover film according to claim 2. The cover film according to any one of claims 1 to 3, wherein an antistatic treatment is performed on one side or both sides. The electronic component packaging container using the cover film as described in any one of Claims 1-4. An electronic component packaging container using the cover film according to any one of claims 1 to 4 and a polycarbonate carrier tape. The cover film for carrier tapes using the cover film as described in any one of Claims 1-4.