CN111319869A - Heat seal layer for semiconductor packaging - Google Patents

Heat seal layer for semiconductor packaging Download PDF

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Publication number
CN111319869A
CN111319869A CN201811529164.8A CN201811529164A CN111319869A CN 111319869 A CN111319869 A CN 111319869A CN 201811529164 A CN201811529164 A CN 201811529164A CN 111319869 A CN111319869 A CN 111319869A
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Prior art keywords
heat
block copolymer
tape
seal tape
hydrogenated
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CN201811529164.8A
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Chinese (zh)
Inventor
任忠文
孙永奎
陈其虎
李志莉
谷勤翠
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Kraton Polymers LLC
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Kraton Polymers LLC
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/06—Properties of polyethylene
    • C08L2207/066—LDPE (radical process)

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed is a heat-sealable tape for electronic packaging comprising a base layer, an intermediate layer, an optional release layer, and an adhesive layer, wherein the optional release layer, adhesive layer, or both comprise a hydrogenated styrene block copolymer and optionally a controlled distribution styrene block copolymer. The hydrogenated block copolymer or selectively hydrogenated controlled distribution block copolymer has a melt flow rate of 0.1 to 50g/10min measured at 230 ℃ and 2.16kg mass.

Description

Heat seal layer for semiconductor packaging
Technical Field
The present invention relates to adhesive compositions and heat-sealable lidding tapes or laminates for electronic packaging.
Background
Electronic parts used for electronic devices, such as capacitors, ICs, resistors, LEDs, etc., are generally stored in a carrier tape, and embossed pockets are continuously formed on the carrier tape according to the shape of the stored parts (fig. 2). After storing the electronic components, an upper cover tape is applied as a cover material to the top of the carrier tape, and both ends of the upper cover tape are continuously heat-sealed in the length direction using a heat seal tape to perform packaging. As a material of the upper cover tape, a heat seal layer laminate laminated on the base plate was used. The cover should have adequate peel strength and sufficiently low peel strength variation so as to be less prone to breakage during high speed installation.
There is a need for compositions for heat seal top cover laminates having improved performance and performance characteristics.
Drawings
Fig. 1 is a sectional view of a layered structure of a heat seal tape.
Fig. 2 is a cross-sectional view of a second embodiment of the heat seal tape without a release layer.
Fig. 3 is a cross-sectional view of a storage package for electronic components.
Detailed Description
"molecular weight" or Mw refers to the true molecular weight (g/mol) of the polymer or copolymer block. Mw can be measured using Gel Permeation Chromatography (GPC) according to ASTM 3536 using polystyrene calibration standards.
"diblock copolymer" refers to the portion of the free diblock (e.g., A-B, where A and B are polymer blocks) that is ultimately present in the block copolymer composition.
"coupling efficiency" refers to the number of molecules of coupled polymer divided by the number of molecules of coupled polymer plus the number of molecules of uncoupled polymer. For example, if the coupling efficiency is 80%, the polymer will contain 20% diblock.
"vinyl content" refers to the number of monosubstituted olefin groups present in the styrenic block copolymer. When butadiene is the conjugated diene monomer that participates in the anionic polymerization reaction, the vinyl content is determined by the extent to which butadiene participates in the 1, 2-addition mechanism to form a monosubstituted olefin (e.g., vinyl) pendant from the polymer backbone of the product.
Disclosed are heat-seal tapes comprising a Styrene Block Copolymer (SBC) layer, methods of making heat-seal tapes, and packaging methods including a coverlay tape. The term "heat seal tape" may be used interchangeably with "upper cover tape".
As shown in fig. 1, the heat-seal tape (1) includes a base layer (2), an intermediate layer (3), a release layer (4), and an adhesive layer (5). The release layer (4) is optional and may be omitted from the heat-seal tape (1), as shown in fig. 2. The adhesive layer forms a heat seal with the carrier tape (7) to form the package (6) as shown in fig. 3. In fig. 3, a package (6) is used for storing electronic components, wherein a carrier tape (7) with embossed pockets (8) accommodates individual electronic components (9). After the electronic components (9) are stored in the pockets (8), a heat seal tape (1) is applied as a cover material to the top of the carrier tape (7).
A base layer: the heat seal tape includes a base layer (top layer 2 in fig. 1 and 2) comprising biaxially stretched polyester or biaxially stretched nylon, such as biaxially stretched polyethylene terephthalate (PET), biaxially stretched polyethylene naphthalate (PEN), biaxially stretched 6, 6-nylon, biaxially stretched polypropylene, or combinations thereof. In one embodiment, the base layer is modified by coating or mixing an antistatic agent, corona treatment, adhesive treatment, or a combination thereof. In another embodiment, the base layer comprises a keycoat. The thickness of the base layer is 8-25 μm.
An intermediate layer: the intermediate layer (3) comprises a linear low density polyethylene resin (e.g. LLDPE resin) and/or a low density polyethylene resin (e.g. LDPE resin). Examples include LLDPE resins prepared with metallocene polymerization catalysts (e.g., "m-LLDPE" resins), LLDPE resins prepared with Ziegler-Natta polymerization catalysts, copolymers comprising ethylene (or substituted ethylene), an olefin comonomer having at least 3 carbon atoms, and mixtures thereof. Examples of olefin comonomers include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 3-methyl-1-butene, 3-methyl-1-pentene, 4-methyl-1-pentene, 2-ethyl-1-hexene, polyenes such as butadiene, isoprene, 1, 3-hexadiene, dicyclopentadiene or 5-ethylidene-2-norbornene, and combinations thereof.
The amount of α -olefin comonomer in the m-LLDPE copolymer is from 1 to 40 mol%, or from 5 to 20 mol% or from 10 to 15 mol%, based on the mol% of the m-LLDPE copolymer.
In one embodiment, the heat seal tape comprises a density of 0.775 × 103-0.975×103kg/m3Or 0.900 × 103-0.925×103kg/m3m-LLDPE of (1). In some embodiments, the m-LLDPE exhibits a tensile modulus of less than 220MPa, or less than 200MPa, or less than 180 MPa.
The thickness of the intermediate layer is 5-50 μm, alternatively 10-40 μm, alternatively 20-35 μm.
Optional release and adhesive layers: an optional release layer is located between the intermediate layer and the adhesive layer, which is in contact with the carrier tape and then heat sealed to the carrier tape. The optional release layer (if present) and adhesive layer each independently comprise a Styrene Block Copolymer (SBC) or mixtures thereof. On the other hand, if a release layer is present, the optional release layer and adhesive layer comprise the same SBC component, or alternatively, the optional release layer and adhesive layer comprise different SBC components.
SBCs suitable for use include, but are not limited to, selectively hydrogenated styrene-butadiene block copolymers, selectively hydrogenated styrene-butadiene-styrene triblock copolymers, selectively hydrogenated styrene-isoprene diblock copolymers, selectively hydrogenated resins of styrene-isoprene-styrene triblock copolymers, selectively hydrogenated styrene-butadiene random copolymers, selectively hydrogenated styrene-isoprene random copolymers, selectively hydrogenated controlled distribution styrene-butadiene/styrene block copolymers, and combinations thereof.
The SBC component may be a styrene diblock copolymer of the formula A-B, a linear triblock copolymer of the formula A-B-A, and/or a triblock copolymer of the formula (A-B)nMulti-arm coupled block copolymers of X. In these aspects, A is a mono alkenyl arene blockSegment, B is a conjugated diene block, n is an integer from 2 to 6, and X is the residue of a coupling agent. When used, the formula (A-B)nIn the case of multi-arm coupled block copolymers of X, n ranges from 2 to 4.
In some embodiments, the SBC component is a linear triblock copolymer of the formula A-B, A-B-A (wherein each A block may have a different or the same peak molecular weight or the same or different monoalkenyl arene content), having A blocks and B blocks, and/or of the formula (A-B)nMulti-arm coupled block copolymers of X.
The monoalkenyl arene block (A block) includes any of styrene, o-methylstyrene, p-tert-butylstyrene, 2, 4-dimethylstyrene, α -methylstyrene, vinylnaphthalene, vinyltoluene, vinylxylene, or mixtures thereof.
In some embodiments, the mono alkenyl arene content in each a block is from 10 to 60 weight percent, or from 15 to 50 weight percent, based on the total weight of the SBC. In aspects where the SBC has the formula A-B-A, the combined monoalkenyl arene content of all A blocks is from 10 to 60 weight percent, or from 15 to 50 weight percent, based on the total weight of the linear block copolymer.
In some embodiments, the conjugated diene block (B block) includes any suitable conjugated diene, such as a conjugated diene having from 4 to 10 carbon atoms, a conjugated diene formed from substantially pure monomers or butadiene or isoprene monomers containing a minor amount (up to 10 weight percent) of a structurally related conjugated diene, such as 2, 3-dimethyl-1, 3-butadiene, 1, 3-pentadiene, and 1, 3-hexadiene.
S-B-S or(S-B)2The peak molecular weight of the linear selectively hydrogenated block copolymers of the structure X, wherein B represents a conjugated diene block or a controlled distribution conjugated diene/styrene block, is 70000-120000g/mol, or 80000-110000g/mol, or 90000-100000 g/mol.
The selectively hydrogenated block copolymer or selectively hydrogenated controlled distribution block copolymer has a total polystyrene content (PSC) in the range of from 10 to 60 weight percent, or from 10 to 50 weight percent, or from 12 to 45 weight percent.
In embodiments where butadiene is the conjugated diene monomer, the vinyl content of the conjugated diene block (e.g., B block) is from 10 to 95 mol%, or from 15 to 85 mol%, or from 35 to 80 mol%. In the aspect where isoprene is the conjugated diene monomer, the vinyl content of the B block is from 5 to 95 mol%, or from 5 to 85 mol%, or from 5 to 80 mol%.
In some embodiments, the selectively hydrogenated block copolymer or the selectively hydrogenated controlled distribution block copolymer has a melt flow rate of 0.01 to 50g/10min, or 0.1 to 45g/10min, or 0.5 to 40g/10min, measured at 230 ℃ and 2.16kg mass according to ASTM D1238.
In some embodiments, the SBC component includes a controlled distribution styrene block copolymer. Controlled distribution styrenic block copolymers are characterized by the presence of two distinct types of regions-conjugated diene rich regions at the ends of the block and mono alkenyl arene rich regions in the middle or near the center of the block. In one aspect, a styrenic block copolymer comprising a mono alkenyl arene/conjugated diene controlled distribution copolymer block is characterized by a portion of mono alkenyl arene units gradually increasing to a maximum value at or near the center of the block and then gradually decreasing until the polymer block is fully polymerized.
In some embodiments, the SBC component comprises a hydrogenated styrene block copolymer, which may be a hydrogenated resin of a styrene-isoprene-styrene triblock copolymer, a hydrogenated resin of a styrene-butadiene-styrene triblock copolymer, or a resin in which specific portions of the polymerized conjugated diene (e.g., butadiene) are selectively hydrogenated. The hydrogenated styrene block copolymer is characterized by a conjugated diene block (e.g., B block) in which hydrogen molecule addition has occurred at a portion of the carbon-carbon double bonds within the B block. The degree to which hydrogen molecular addition has occurred can affect the physical properties of the release layer, the adhesive layer, or both, and thus affect the heat seal tape disclosed herein. In one embodiment, the highly saturated hydrogenated styrenic block copolymer comprises a B block in which >92 mol% or >95 mol% or >98 mol% of the carbon-carbon double bonds within the B block have undergone hydrogen molecular addition. In another embodiment, the partially saturated hydrogenated styrenic block copolymer comprises a B block in which 20 to 92 mol% or 25 to 85 mol% or 30 to 80 mol% of the carbon-carbon double bonds in the B block have undergone hydrogen molecular addition.
The thickness of the release layer after drying is 0.05-3 μm, or 0.1-1.5 μm, or 0.2-1 μm.
The thickness of the adhesive layer after drying is 0.1-25 μm, 1-23 μm, 3-20 μm or 5-10 μm.
Any styrene block copolymer (e.g., controlled distribution styrene block copolymer, hydrogenated styrene block copolymer) can be present in the release layer and/or adhesive layer in an amount of 5 to 80 wt%, or 10 to 60 wt%, or 15 to 40 wt%.
In some embodiments, the optional release layer and/or adhesive layer may each independently further comprise 0-65 wt% of an acrylic resin. Examples include methyl acrylate, ethyl acrylate, propyl acrylate and butyl acrylate, and methacrylates such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate and cyclohexyl methacrylate. Alternatively, the acrylic resin may be a copolymerization product of two or more acrylates.
In some embodiments, the optional release layer and/or adhesive layer may each independently further comprise 0 to 20 wt% of a polyester resin. Examples include resins in which a dicarboxylic acid (such as terephthalic acid, isophthalic acid, succinic acid, glutaric acid, or adipic acid) is polycondensed with a diol (such as ethylene glycol, propylene glycol, butanediol, cyclohexanedimethanol), or resins in which two or more of the foregoing are copolymerized.
In some embodiments, the optional release layer and/or adhesive layer may each independently further comprise 0 to 60 wt% of a polyethylene elastomer.
In some embodiments, the optional release layer and/or adhesive layer each independently further comprises a resin having at least 50 mass% of at least one acrylic residue, such as the acrylates and methacrylates described above. Alternatively, the optional release layer and/or adhesive layer each independently further comprises a resin in which an acrylate is copolymerized with a monomer, for example, a resin such as an acrylic-styrene copolymer. In these aspects, the resin is present in the release and/or adhesive layer in an amount of 0 to 50%.
In some embodiments, the optional release layer and/or adhesive layer each independently further comprises 0-60 wt% of an ethylene vinyl acetate copolymer resin (e.g., EVA) and/or an ethylene methyl acrylate copolymer resin (e.g., EMA). EVA and/or EMA improve the adhesive strength between the SBC component and the base layer or between the SBC component and the intermediate layer.
In one embodiment, the optional release layer and/or adhesive layer may each independently further comprise from 0 to 50 weight percent of a Low Density Polyethylene (LDPE). examples include LDPE homopolymer optionally containing up to 5 percent of another α -olefin having a density of from 0.915 to 0.924g/cc, a melting point of 102-110 ℃ and a melt temperature index of 4.0 to 17.0g/10 min.
In some embodiments, the optional release layer and/or adhesive layer in the heat-sealable tapes of the present disclosure each independently further comprises an optional component, such as a conductive material, such as tin oxide particles, zinc oxide particles, titanium oxide particles, or a combination thereof. The conductive particles enhance the conductivity of the heat seal tape while minimizing the reduction in transparency and maintaining the surface resistivity and electrostatic properties of the heat seal tape. The content of the conductive particles may be 100-.
The conductive material can include one or more carbon nanomaterials (e.g., carbon nanotubes, carbon nanofibers) having an aspect ratio of 10 to 10000, which can aid in the conductivity of the heat seal tape while maintaining its transparency. In one aspect, the conductive material comprises 0.5 to 15 parts by mass, or 2 to 15 parts by mass, or 3 to 10 parts by mass of carbon nanofibers per 100 parts by mass of the SBC component present in the release layer and/or the adhesive layer.
The adhesive layer may further comprise a filler, such as talc particles, silica particles, organosiloxane-treated silica particles, alumina particles, mica particles, calcium carbonate, magnesium carbonate, or a combination thereof. In one embodiment, the filler has a median particle diameter (D50) between 10 and 15000 nm. In another aspect, the filler is present in an amount of 0 to 50 parts by mass, or 20 to 60 parts by mass, based on the total mass of the adhesive layer. The addition of the inorganic filler can suppress the rolling of the heat-seal tape and the blocking during the adhesion of the electronic parts to the heat-seal tape even when the package storing the electronic parts is kept in a high-temperature environment. Further, by adding fillers having different particle diameters, the decrease in transparency of the heat seal tape can be suppressed.
The forming method comprises the following steps: the heat-seal strip may be prepared by assembling the multilayer material as described herein under suitable conditions. For example, a tie coating agent such as polyurethane, polyester, polyolefin or polyethyleneimine may be applied to the surface of a biaxially stretched polyester film such as a base layer, and a resin composition for forming an intermediate layer comprising m-LLDPE as a main component may be T-die extruded to coat the tie coating agent-coated surface to form a two-layer film comprising the base layer and the intermediate layer.
In one embodiment, the intermediate layer is disposed on one surface of the base layer. In another embodiment, the keycoat is positioned between the base layer and the intermediate layer. Furthermore, on the surface of the intermediate layer, an optional release layer of the type described in the present invention may be applied by, for example, a gravure coater, reverse coater, kiss coater, air knife coater, Meyer bar coater, or dip coater. The surface of the intermediate layer may be subjected to corona treatment or ozone treatment before the release layer is applied. Further, the SBC component including the adhesive layer may be coated onto the release layer (if present) or applied directly onto the intermediate layer by, for example, a gravure coater, reverse coater, kiss coater, air knife coater, Meyer rod coater, or dip coater to obtain the desired heat seal tape.
In one method, the film for the intermediate layer is first formed by a T-die casting method or an inflation method. The intermediate film layer may then be adhered to the film of the base layer by a bond coat agent (e.g., polyurethane, polyester, or polyolefin) using a dry lamination process to obtain a film comprising the base layer and the intermediate layer. The intended heat seal tape can be obtained by coating a release layer and an adhesive layer on the surface of the film including the base layer and the intermediate layer.
In another method, the heat seal tape may be obtained by a sand lamination method. That is, first, the film constituting the first intermediate layer is formed by the T-die casting method or the inflation method according to the present invention. Then, a resin composition containing the molten m-LLDPE as a main component is provided between the first intermediate layer film and the base layer film to form and laminate a second intermediate layer. After obtaining a laminated film including a base layer and an intermediate layer including a first intermediate layer and a second intermediate layer, a release layer and an adhesive layer are further applied to the intermediate layer side surface as described in the present invention. Similarly to the above-described method, in the case of using the method, the surface on the base layer film side to be laminated is also usually coated with a cement coating agent.
In one embodiment, the method utilizes a coextrusion process to allow for the simultaneous application of the release layer and adhesive layer. For example, a molten release layer and a molten adhesive layer (along with any additives) are combined to form a composite extrudate that is applied in a continuous manner to a base sheet comprising a base layer and an intermediate layer.
In another embodiment, a method of making a heat-seal tape includes antistatic treating one or more sides of the heat-seal tape, wherein the surface in contact with the carrier tape is antistatic treated. Examples of the antistatic agent include surfactant-type antistatic agents such as anionic, cationic, nonionic and betaine antistatic agents, polymeric antistatic agents and conductive materials. In some aspects, the surface of the heat-seal tape is corona discharge treated or ozone treated prior to the antistatic treatment to provide uniform application of the antistatic agent.
Performance: the heat seal tape when applied and heat sealed to a base sheet such as a carrier tape is characterized by: the peel strength, measured according to ANSI/EIA-481-E-2015, is 0.1-1.0N, or 0.2-0.8N when the heat seal tape is heat sealed at an operating temperature of 130-220 ℃ or 140-190 ℃ and the tape calibration width is 0.8 mm. In another aspect, the disclosed heat seal tapes exhibit a change in peel strength value of less than 0.15N, or less than 0.1N, where the change is in the range of 0.2-0.8N. Peel strength values for the heat-seal tapes disclosed herein were observed with various carrier tapes including methacrylate butadiene styrene carrier tapes, general purpose polystyrene carrier tapes modified with styrene block copolymers (e.g., K-resin), and black high impact polystyrene carrier tapes.
The heat seal tape is characterized by a haze value of less than 30%, or less than 25%, or less than 15%, measured according to ASTM D1003. The heat seal tape includes a haze value that enables the components stored within the package to be visually inspected through the heat seal tape. In another embodiment, the heat seal tape is a colorless transparent appearance or a milky white transparent appearance, or a non-yellowing appearance.
The heat-seal tape is further characterized by measuring the change in properties as a function of aging based on any suitable observable properties including peel strength, haze value, and appearance. The change in properties as a function of aging was measured after exposing the heat-seal tape to an atmosphere of 60 ℃ and 95% relative humidity for 72 hours. When the observed property variation is less than 20% or less than 10%, an acceptable rating for ageing properties is reached.
The heat seal tape is also characterized by low surface contamination. Surface contamination can occur when chemical components (e.g., adhesives) migrate to the outer surface of the heat seal tape over time. Once exposed to the outer surface, the migrating adhesive can accumulate contaminants and form a residue on the outer surface of the heat seal tape and thus the package. SBC components contain negligible levels of migratory species that cause surface contamination or form surface residues. The heat seal tape is also characterized by the absence of whitening contamination. Whitening occurs when the monomer of the offset portion on the surface of the heat seal tape evaporates and reacts with moisture in the air to form a polymer (white powder).
The heat seal tape may also be characterized by a non-adhesive inner or outer surface (e.g., a non-adhesive surface). In one aspect, a non-tacky inner or outer surface is obtained when i) the heat seal tape is heat sealed to the carrier tape, ii) the package storing the electronic components is being shipped and/or stored, or iii) the package storing the electronic components is being used in an assembly line, if the electronic components are not picked up within the cavities of the carrier tape.
The heat seal tape of the present invention is resistant to the accumulation of static electricity. In one aspect, the heat seal tape can be referred to as an antistatic heat seal tape. The antistatic properties of the heat seal tape may result from the addition of an antistatic agent as previously described.
Electronic packaging applications: the heat seal tape is used as a cover material for a carrier tape to form a package (e.g., fig. 3). The carrier tape serves as a packaging container for storing electronic parts. An exemplary carrier tape is an 8-100mm wide strip product having recesses for storing electronic components. When the heat seal tape as the cover material is heat-sealed, the material constituting the carrier tape is not particularly limited, and commercially available materials can be used. For example, polystyrene, polyester, polycarbonate, and polyvinyl chloride may be used for the carrier tape with optional materials such as carbon black or carbon nanotubes (to impart conductivity) or antistatic agents.
The package storing the electronic parts can be obtained by, for example, placing the electronic parts or the like in an electronic parts storage portion (embossed bag of fig. 3) of a carrier tape, then applying the heat-seal tape as a cover material, continuously heat-sealing both outer edges of the heat-seal tape in a longitudinal direction to form a package, and then winding it on a reel. The electronic components packaged in this form are stored and transported. The package can be used to store and transport various electronic components, such as connectors, ICs, diodes, transistors, capacitors, resistors, and LEDs. In particular, for components having a thickness of 1mm or less, such as LEDs, transistors, and diodes, the heat sealing tape can greatly suppress problems in mounting electronic components. When the packages storing the electronic parts are transported using the holes for feeding at the edges in the longitudinal direction of the carrier tape, the heat-seal tape is peeled off a little at a time, and when the presence, direction and position of the electronic parts are verified, the electronic parts can be taken out with a pickup device.
Detailed description of the preferred embodiments
Example (b): a series of heat seal tapes were prepared. The following test methods were used:
EIA-481-E-2015 8-200mm embossed and 8mm and 12mm perforated carrier tapes for surface mount components for automated processing
ASTM D100313 Standard test method for haze and light transmittance of transparent plastics
JIS-K-6251 measurement of vulcanized or thermoplastic rubber-tensile stress-strain characteristics
Peel strength was measured with a series of carrier tapes. The results are shown in Table 1.
The following resin compositions were used for the intermediate layer, the release layer and the adhesive layer:
SBC-1 is structure (S-EB/S)nX, the melt flow rate of which is measured at 230 ℃ and 2.16kg mass<2g/10min。
SBC-2 is structure (S-EB/S)nX has a melt flow rate of 48g/10min when measured at 230 ℃ and 2.16kg mass.
SBC-3 is structure (S-EB)nThe selectively hydrogenated styrenic block copolymer of X has a melt flow rate of 12g/10min when measured at 230 ℃ and 2.16kg mass.
SBC-4 is styrene-ethylene/butylene-styrene (SEBS) having a melt flow rate of 20-28g/10min when measured at 230 ℃ and 2.16kg mass.
LDPE 2420K is a low density polyethylene;
kristellex 5140 is a hydrocarbon resin produced by copolymerization of pure aromatic monomers.
The 10% EBS PPMB (polypropylene masterbatch) is 10% ethylene bis stearamide resin in polypropylene.
The heat seal tape was formulated with layers containing the components and amounts shown in the table. The heat-seal tape is heat-sealed at 140 ℃, 160 ℃ or 180 ℃ to a carrier tape comprising MBS (methyl methacrylate-butadiene-styrene copolymer), general purpose polystyrene, K resin blend (styrene-butadiene polymer, very high styrene content of at least 65%) or black HIPS (high impact polystyrene). The peel strength of these constructions using 0.8mm wide carrier tapes is shown in table 1, where the italic values in the lower right corner of each unit provide the standard deviation of the reported mean. Reference 1 and reference 2 are commercially available heat seal tapes for comparison. NM means no measurement because the film broke when the film was peeled from the carrier tape during sample preparation.
TABLE 1
Figure BDA0001905217480000121
TABLE 2
Figure BDA0001905217480000131

Claims (10)

1. A heat-sealable tape comprising a base layer, an intermediate layer and an adhesive layer, wherein:
the base layer comprises a biaxially stretched polyester or a biaxially stretched nylon;
the intermediate layer comprises linear low density polyethylene, or a mixture thereof;
the adhesive layer comprises a hydrogenated styrenic block copolymer or a selectively hydrogenated controlled distribution styrenic block copolymer;
wherein the hydrogenated block copolymer or selectively hydrogenated controlled distribution block copolymer has any of the following configurations:
i) a styrene diblock copolymer of the formula A-B comprising an A block and a B block,
i i) a linear triblock copolymer of the formula A-B-A, or
ii i) formula (A-B)nA multi-arm coupled block copolymer of X,
a is a monoalkenyl arene block, B is a conjugated diene block, n is an integer from 2 to 6, and X is the residue of a coupling agent; and
wherein the hydrogenated block copolymer or selectively hydrogenated controlled distribution block copolymer has a melt flow rate of 0.01 to 50g/10min, measured at 230 ℃ and 2.16kg mass according to ASTM D1238.
2. The heat seal tape according to claim 1, further comprising a release layer,
wherein the release layer comprises a hydrogenated styrenic block copolymer or a selectively hydrogenated controlled distribution styrenic block copolymer, and
wherein the hydrogenated styrenic block copolymer or selectively hydrogenated controlled distribution styrenic block copolymer in the release layer is the same or different than the hydrogenated styrenic block copolymer or selectively hydrogenated controlled distribution styrenic block copolymer in the adhesive layer.
3. The heat-seal tape according to any one of claims 1-2, wherein the peel strength of the heat-seal tape, when heat-sealed and applied to a carrier tape at an operating temperature of 130-220 ℃, is 0.1-1.0N, measured according to ANSI/EIA-481-E-2015.
4. The heat-seal tape according to claim 3, which has a peel strength of 0.2 to 0.8N.
5. The heat-seal tape of claim 3, wherein the peel strength of the heat-seal tape changes by less than 20% after being exposed to an atmosphere of 60 ℃ at 95% relative humidity for 72 hours.
6. The heat-sealable tape of any of claims 1-2 having a haze value of less than 30% as measured according to ASTM D1003.
7. The heat-sealable tape of any one of claims 1-2 having a haze value of less than 25% as measured according to ASTM D1003.
8. The heat-seal land of any one of claims 1-2, having a non-adhesive surface.
9. The heat-seal tape according to any one of claims 1 to 2, wherein the adhesive layer has a thickness of 0.1 to 25 μm after drying.
10. The heat-seal tape of any one of claims 1-2, wherein the adhesive layer has a thickness of 3-20 μ ι η after drying.
CN201811529164.8A 2018-12-14 2018-12-14 Heat seal layer for semiconductor packaging Pending CN111319869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811529164.8A CN111319869A (en) 2018-12-14 2018-12-14 Heat seal layer for semiconductor packaging

Publications (1)

Publication Number Publication Date
CN111319869A true CN111319869A (en) 2020-06-23

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08324676A (en) * 1995-05-30 1996-12-10 Sumitomo Bakelite Co Ltd Cover tape for packaging electronic parts
JPH09201922A (en) * 1995-11-22 1997-08-05 Sumitomo Bakelite Co Ltd Cover tape for packaging electronic part
US20120003429A1 (en) * 2009-03-13 2012-01-05 Denki Kagaku Kogyo Kabushiki Kaisha Cover film
CN103492289A (en) * 2011-04-18 2014-01-01 电气化学工业株式会社 Cover film
US20140037940A1 (en) * 2011-04-01 2014-02-06 Denki Kagaku Kogyo Kabushiki Kaisha Cover film

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08324676A (en) * 1995-05-30 1996-12-10 Sumitomo Bakelite Co Ltd Cover tape for packaging electronic parts
JPH09201922A (en) * 1995-11-22 1997-08-05 Sumitomo Bakelite Co Ltd Cover tape for packaging electronic part
US20120003429A1 (en) * 2009-03-13 2012-01-05 Denki Kagaku Kogyo Kabushiki Kaisha Cover film
US20140037940A1 (en) * 2011-04-01 2014-02-06 Denki Kagaku Kogyo Kabushiki Kaisha Cover film
CN103492289A (en) * 2011-04-18 2014-01-01 电气化学工业株式会社 Cover film

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Application publication date: 20200623