TW201244931A - A heat-sealing film and a cover tape for packaging electronic components - Google Patents

A heat-sealing film and a cover tape for packaging electronic components Download PDF

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Publication number
TW201244931A
TW201244931A TW100146984A TW100146984A TW201244931A TW 201244931 A TW201244931 A TW 201244931A TW 100146984 A TW100146984 A TW 100146984A TW 100146984 A TW100146984 A TW 100146984A TW 201244931 A TW201244931 A TW 201244931A
Authority
TW
Taiwan
Prior art keywords
layer
heat seal
heat
weight
film
Prior art date
Application number
TW100146984A
Other languages
Chinese (zh)
Other versions
TWI584951B (en
Inventor
Wei-Xiang Zhang
Zhou Jin
shi-jun Shen
lin-lin Zhang
jia-jun Li
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201244931A publication Critical patent/TW201244931A/en
Application granted granted Critical
Publication of TWI584951B publication Critical patent/TWI584951B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/24All layers being polymeric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00Resin or rubber layer containing a blend of at least two different polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21Anti-static
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/31Heat sealable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00Adhesive articles, e.g. adhesive tapes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00Packaging equipment or accessories not otherwise provided for

Landscapes

  • Laminated Bodies (AREA)
  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)

Abstract

The invention provides a heat-sealing film for packaging an electronic element, comprising: a base layer; at least one intermediate layer which is provided on the base layer and comprises a mixture comprising, in terms of 100% by weight of the total weight of the intermediate layer, 5-70 % by weight of a vinyl acetate copolymer, wherein the units derived from vinyl acetate comprise more than 10% by mole of the copolymer, 20-90 % by weight of a styrene-butadiene copolymer, and 0-40 % by weight of a conductive polymer; and at least a heat-sealing layer which is provided on the surface of the intermediate layer opposite to the base layer. The invention further provides a cover tape made of the heat-sealing film as described above.

Description

201244931 六、發明說明: 【發明所屬之技術領域】 本發明係關於熱封膜及覆蓋帶,該覆蓋帶係自該熱封膜 製得且可熱封至其中呈扇形分佈之儲存凹坑之塑膠載帶 上,該載帶係具有以下功能之封裝中之一者:當儲存、輪 送或安裝電子組件時,保護電子組件免受污染,且對該等 電子組件進行配置並取出以在電子電路基板上進行组裝。 【先前技術】 最近’將表面安裝電子組件(例如IC、電晶體、二極 體、電容器、壓電元件電阻器及諸如此類)封裝至由塑膠 載帶(其中依次形成有壓印模製凹坑,電子組件可接收於 該等壓印模製凹坑中且與其形狀相吻合)及熱封至該載帶 之覆蓋帶構成之封裝中,且然後予以供應。在將覆蓋帶自 載帶剝離後,自封裝自動取出所封裝之電子組件,且然後 表面安裝於電子電路基板上。 自載帶剝離覆蓋帶之強度稱為「剝離強度」,且在此強 度過低冑,存在關&在輸送封裝期間覆蓋帶脫離且電子組 件封裝脫落之問題。 另-方面,在強度過高時’將引起以下現象:在剝離覆 蓋帶時載帶發生振動且電子組件在其即將安裝前跳出儲存 凹坑,亦即引起跳動故障。另外,需要將某一覆蓋帶之剝 離強度維持於-定範圍内。若剝離強度之變化過大,則難 以藉由使用安裝機器來穩定地剝離覆蓋帶。 抗靜電性係另一關鍵性質’此乃因靜電可損壞電子單 160811.doc 201244931 2且可在製程中引起一定的困難。覆蓋帶之透明度亦較 ‘”、要,此乃因需要透過覆蓋帶檢查電子組件之狀態。另 外’覆蓋帶不應污染電子組件。 备刖市場上覆蓋帶自載帶剥離之機制分為以下三類:介 面剝離類型、轉移剝離類型及内聚破壞類型。介面剝離類 里係私覆蓋帶及載帶在密封面彼此剝離之類型,轉移剝離 類型係指結合層本身在剝離期間轉移至載帶之類型,且内 聚破壞類型係指與結合層不同之層或結合層本身(此二者 在下文中皆稱為内聚破壞層)發生破裂而引起剝離之類 型。 該等類型中之每一者皆具有優點及缺點;然而,在僅針 對剝離密封至載帶之覆蓋帶時之狀態進行比較時,介面剝 離類型往往受載帶之形狀、材料及性質影響,此乃因密封 面及剝離面相同,且由此剝離強度往往會變得不穩定。 在轉移剝離類型之情形下,結合層就機制而言必須係薄 膜且必須使用所謂的熱封喷漆。因此,剝離強度往往會變 付易受祖封溫度影響,且由此很難獲得用於適宜剝離強度 之密封條件。 在内聚破壞類型之情形下,密封面及剝離層不同,且由 此剝離強度對於密封條件之依賴性較低《同樣,内聚破壞 類型具有剝離強度不受載帶之形狀、材料及性質影響的顯 著優點。然而,在一些情形下,在剝離期間,内聚破壞層 受除内聚破壞層外之層(包含結合層)影響且介面在並不引 起内聚破壞之情形下發生剝離。 160811.doc 201244931 同樣’難以確定内聚破壞層破裂之位置,且由此内聚破 壞層在剝離期間保持於載帶表面上且產生内容物不能取出 之狀態。 内聚破壞層本身經設計而易於破裂,且由此在許多情形 下,其係由複數種樹脂(其很難彼此混溶且該等樹脂並不 均勻混合)之混合物。此使得覆蓋帶之透明度有所降低且 在一些情形下因黏聚物而產生一定缺點。同樣,在該等應 用中,在一些情形下,樹脂混合物中含有具有較差耐熱性 之樹脂》出於該等原因,在許多情形下,在形成内聚破壞 層期間產生黏聚物或降解產物並降低生產力。 因此,需要研發具有穩定剝離強度、極佳抗靜電性質且 不會污染電子組件之透明覆蓋帶。 【發明内容】 本發明目標係研發熱封膜,該熱封膜可切成覆蓋帶,具 有穩定剝離強度、良好抗靜電性能,不污染電子組件且具 有透明外觀。 本發明之另一目標係提供由熱封臈製得之内聚破壞型或 轉移剝離型覆蓋帶。 根據本發明,提供封裝電子元件之熱封膜,其包括·· 基底層; 至少一個中間層,其提供於基底層上且包括混合物,該 混合物就1 00重量。/〇之該中間層之總重量而言包括: 5-70重量%之乙酸乙烯酯共聚物,其中衍生自乙酸乙烯 醋之單元佔該共聚物之1 〇莫耳。/。以上; 160811.doc 201244931 20-90重量%之苯乙烯-丁二烯共聚物;及 〇_4〇重量。/。之導電聚合物;及 至少一個熱封層’其提供於中間層中與基底層相對之表 面上。 • 本發明進一步提供熱封至包括電子元件之載帶之覆蓋 • 帶,該覆蓋帶包括: 基底層; 中間層’其佈置於基底層上;及 熱封層,其佈置於中間層上’該覆蓋帶具有至少75%之 平均光學透射率、不超過約50%之光學霧度及不超過約 之表面電阻率;以便當將覆蓋帶熱封至載帶以形成 物件時,覆蓋帶與載帶之平均剝離強度為至少2〇 , 當物件經歷不小於約5(rc之溫度及不小於約9〇%之相對濕 度達至少5天時剝離強度降低不超過約丨〇0/〇。 本發明之抗靜電熱封膜具有極佳靜電耗散性能、良好光 學性能、良好機械性能、以及對聚碳酸酯、聚苯乙烯、聚 丙烯或諸如此類之基板表面之極佳熱封性能。自本發明之 熱封膜製得之熱敏性覆蓋帶具有許多優點,例如,兩側之 . 纟久性抗靜電性能、高透光率、低霧度、與載帶之穩定剝 離力及極佳密封老化性能。在利用熱敏性覆蓋帶之情形 下’在高溫及高濕度下老化後之黏著面不易於黏著至載帶 之表面,且在使用载帶密封熱敏性覆蓋帶後不可能產生膠 帶開口之問題。在使用t帶密封自#封膜製得之覆蓋帶 後,黏著劑層在剝離後保留於支樓帶上,且黏著劑層可與 160811.doc 201244931 力月t*層刀離與市場上之覆蓋帶情形(其中黏著劑層與載 帶層刀離’此乃因產生程序極佳地控制了功能層及黏著劑 層之表面)相&,可確保藉由該方法製得之覆蓋帶產品的 極佳可控剝離效應《另外,載帶之表面粗糙度相對較高, 若黏著劑層在剝離後與載帶層分離,則剝離力之穩定性較 差。 【實施方式】 在本發明中,除非另外指定,否則術語「熱敏性黏著 劑」意指可熱封聚合樹脂。術語「添加型陽離子型抗靜電 塗層」意指藉由向塗層中添加陽離子型抗靜電劑獲得之具 有抗靜電性能之塗層。 本發明提供封裝電子元件之熱封膜,其包括: 基底層; 至少一個中間層’其提供於基底層上且包括混合物,該 混合物就100重量%之該中間層之總重量而言包括: 5-70重量%之乙酸乙烯酯共聚物,其中衍生自乙酸乙烯 酯之單元佔該共聚物之1 〇莫耳%以上; 20-90重量%之苯乙烯-丁二烯共聚物;及 0-40重量%之導電聚合物;及 至少一個熱封層,其提供於中間層中與基底層相對之表 面上。 基底層主要用於提供膜之機械強度。在本發明中,對於 基底層並不特定限制且通常用於產生熱封膜之基底層可用 於本發明中。較佳地’基底層選自雙轴拉伸之聚酯、聚烯 160811 .doc 201244931 煙或耐論(nylon)。較佳地,基底層具有約l〇至30 μπι之厚 度°膜較佳地具有不小於85%之光學透射率及不小於50 Mpa之抗拉強度。 用於本發明之熱封膜中之中間層相對較軟且可導電,其 可由一個層或複數個層中之材料構成。適用於中間層之聚 乙稀較佳係直鏈低密度聚乙烯(LLDPE),更佳地係重量平 均分子量高於1〇〇,〇〇〇且熔融指數(測試條件為19〇。(:、2.16 公斤’ ASTM D1238)為1-100 g/10分鐘之直鍵低密度聚乙 烯。適用之聚乙烯係(例如)購自Exxon Mobil之LLDPE (1002-YB)。聚乙烯在中間層中之含量為〇_6〇 wt%、較佳 地10-60%、更佳地20-60%及最佳地50-60%。 在中間層中,適宜乙酸乙烯酯共聚物係乙酸乙烯酯衍生 之單元之莫耳百分比為至少丨〇%、較佳地高於丨5%、最佳 地尚於20%之乙酸乙烯酯共聚物。適宜共單體較佳選自烯 烴,更佳地選自乙烯。適宜乙酸乙烯酯共聚物之熔融指數 (測試條件為190。(:、2.16公斤,八8丁]^〇1238)4交佳為1-250 g/l〇分鐘、更佳地1-100 g/Η)分鐘、及最佳地2_5〇 §/1〇分 釦。乙酸乙烯酯共聚物在中間層中之含量為5_7〇 wt%、較 佳地5-50%、更佳地10-60%、更佳地10·4〇%、進一步較佳 地20-40%及最佳地20-30%。 適用於中間層之苯乙烯-丁二烯共聚物較佳係苯乙烯衍 生之單元佔共聚物總單元之50莫耳%以上、更佳地6〇莫耳 %以上及最佳地70莫耳。/。以上的嵌段共聚物。較佳地,'適 宜苯乙烯·丁二烯共聚物之重量平均分子量較佳為2〇〇〇〇至 160811.doc 201244931 、及最佳地50000至 苯乙烯·丁二烯共聚物 500000 、更佳地 40000 至 300000 150000,且分子量分佈較佳為ι_2。 佔中間層之總重量之20-90%、較佳地3〇_7〇% 中間層較佳具有㈣微米之厚度且其表面可根據需要 藉由添加導電聚合物而導電。舉例而t ’其表面電阻率可 小於IxH)11歐姆/□、更佳地小於lxl〇1〇歐姆/口、及最佳地 小於lxlO9歐姆/□。適宜導電聚合物包含但不限於聚乙 炔、聚吡咯、聚噻吩、聚苯胺、基於聚醚醯胺或基於聚酯 醖胺之本質抗靜電聚合物或諸如此類,或其組合。 在並未提供單獨聚乙烯層之情形下,視需要,可在中間 層與基底層之間提供黏著層。在提供單獨聚乙烯層之情形 下’視需要’在聚乙烯層與基底層之間提供黏著層。黏著 層可為常見之可固化聚胺基曱酸酯型黏著劑。201244931 VI. Description of the Invention: [Technical Field] The present invention relates to a heat seal film and a cover tape which is obtained from the heat seal film and which can be heat sealed to a storage pit in which a fan shape is distributed. On the carrier tape, the carrier tape has one of the following functions: protecting the electronic components from contamination when storing, transferring or mounting electronic components, and configuring and taking out the electronic components to be in the electronic circuit Assembly is performed on the substrate. [Prior Art] Recently, surface mount electronic components (such as ICs, transistors, diodes, capacitors, piezoelectric element resistors, and the like) are packaged into a plastic carrier tape in which embossed molding pits are sequentially formed, The electronic component can be received in the embossed dimples and conform to its shape and heat sealed to the package of the carrier tape and then supplied. After the cover tape is peeled off, the packaged electronic components are automatically taken out from the package and then surface mounted on the electronic circuit substrate. The strength of the self-loading tape peeling cover tape is referred to as "peel strength", and when the strength is too low, there is a problem that the cover tape is detached and the electronic component package is detached during conveyance packaging. On the other hand, when the strength is too high, the following phenomenon will occur: the carrier tape vibrates when the cover tape is peeled off and the electronic component jumps out of the storage pit before it is about to be installed, that is, causes a jitter failure. In addition, it is necessary to maintain the peel strength of a certain cover tape within a predetermined range. If the change in peel strength is too large, it is difficult to stably peel the cover tape by using a mounting machine. Antistatic properties are another key property. This is due to the fact that static electricity can damage electronic sheets 160811.doc 201244931 2 and can cause certain difficulties in the process. The transparency of the cover tape is also better than that, because the condition of the electronic components needs to be checked through the cover tape. In addition, the 'covering tape should not contaminate the electronic components. The mechanism for covering the self-supporting tape stripping on the market is divided into the following three. Class: interface peeling type, transfer peeling type and cohesive failure type. The type of private covering tape and the carrier tape are peeled off from each other on the sealing surface, and the transfer peeling type means that the bonding layer itself is transferred to the carrier tape during peeling. Type, and cohesive failure type refers to a type in which a layer different from the bonding layer or the bonding layer itself (both of which are hereinafter referred to as cohesive failure layers) is broken to cause peeling. Each of the types is There are advantages and disadvantages; however, when comparing only the state when peeling the seal to the cover tape of the carrier tape, the type of interface peeling is often affected by the shape, material and properties of the carrier tape, because the sealing surface and the peeling surface are the same. And thus the peel strength tends to become unstable. In the case of transfer peeling type, the bonding layer must be a film in terms of mechanism and must be used The heat-sealing paint is sprayed. Therefore, the peel strength tends to be affected by the enamel sealing temperature, and thus it is difficult to obtain a sealing condition for a suitable peel strength. In the case of a cohesive failure type, the sealing surface and the peeling layer are different. And thus the peel strength is less dependent on the sealing conditions. Similarly, the cohesive failure type has the significant advantage that the peel strength is not affected by the shape, material and properties of the carrier tape. However, in some cases, during peeling, The cohesive failure layer is affected by the layer other than the cohesive failure layer (including the bonding layer) and the interface is peeled off without causing cohesive failure. 160811.doc 201244931 Similarly, it is difficult to determine the location of the collapse of the cohesive failure layer. And thus the cohesive failure layer remains on the surface of the carrier tape during peeling and produces a state in which the contents cannot be taken out. The cohesive failure layer itself is designed to be easily broken, and thus in many cases, it is composed of a plurality of resins. a mixture of which is difficult to be miscible with each other and the resins are not uniformly mixed. This reduces the transparency of the cover tape and in some cases The binder has certain disadvantages. Also, in such applications, in some cases, the resin mixture contains a resin having poor heat resistance. For these reasons, in many cases, during the formation of the cohesive failure layer Producing a binder or degradation product and reducing productivity. Therefore, it is required to develop a transparent cover tape having stable peel strength, excellent antistatic properties, and no contamination of electronic components. SUMMARY OF THE INVENTION The object of the present invention is to develop a heat seal film, which The heat seal film can be cut into a cover tape, has stable peel strength, good antistatic property, does not pollute electronic components and has a transparent appearance. Another object of the present invention is to provide cohesive failure or transfer peeling by heat sealing. A cover tape is provided. According to the present invention, there is provided a heat seal film for encapsulating electronic components, comprising: a base layer; at least one intermediate layer provided on the base layer and comprising a mixture, the mixture having a weight of 100 Å. The total weight of the intermediate layer comprises: 5-70% by weight of a vinyl acetate copolymer, wherein the unit derived from vinyl acetate comprises 1 mole of the copolymer. /. Above; 160811.doc 201244931 20-90% by weight of styrene-butadiene copolymer; and 〇_4〇 by weight. /. The conductive polymer; and at least one heat seal layer ' is provided on the surface of the intermediate layer opposite to the base layer. The present invention further provides a cover tape for heat sealing to a carrier tape comprising electronic components, the cover tape comprising: a base layer; an intermediate layer 'which is disposed on the base layer; and a heat seal layer disposed on the intermediate layer' The cover tape has an average optical transmittance of at least 75%, an optical haze of no more than about 50%, and a surface resistivity of no more than about; such that when the cover tape is heat sealed to the carrier tape to form an article, the cover tape and the carrier tape The average peel strength is at least 2 〇, and the peel strength decreases by no more than about 丨〇0/〇 when the article experiences a temperature of not less than about 5 (the temperature of rc and a relative humidity of not less than about 9%) for at least 5 days. The antistatic heat seal film has excellent static dissipative properties, good optical properties, good mechanical properties, and excellent heat sealing properties to the surface of polycarbonate, polystyrene, polypropylene or the like. The heat-sensitive cover tape made by the sealing film has many advantages, for example, both sides. Long-lasting antistatic property, high light transmittance, low haze, stable peeling force with carrier tape, and excellent sealing aging performance. heat In the case of a sensitive cover tape, the adhesive surface after aging at high temperature and high humidity does not easily adhere to the surface of the carrier tape, and it is impossible to produce a tape opening after using the tape-sealing heat-sensitive cover tape. After sealing the cover tape made from #封膜, the adhesive layer remains on the support belt after peeling off, and the adhesive layer can be separated from the cover tape on the market with 160811.doc 201244931 Wherein the adhesive layer and the carrier layer knife are separated from each other by the production process, which greatly controls the surface of the functional layer and the adhesive layer, thereby ensuring excellent coverage of the cover tape product produced by the method. Controlling the peeling effect "In addition, the surface roughness of the carrier tape is relatively high, and if the adhesive layer is separated from the carrier layer after peeling, the stability of the peeling force is poor. [Embodiment] In the present invention, unless otherwise specified, Otherwise, the term "heat-sensitive adhesive" means a heat-sealable polymer resin. The term "addition-type cationic antistatic coating" means a coating having antistatic properties obtained by adding a cationic antistatic agent to a coating. The present invention provides a heat seal film for packaging electronic components, comprising: a base layer; at least one intermediate layer 'provided on the base layer and comprising a mixture comprising, in terms of 100% by weight of the total weight of the intermediate layer: 5 - 70% by weight of a vinyl acetate copolymer, wherein units derived from vinyl acetate account for more than 1% by mole of the copolymer; 20 to 90% by weight of styrene-butadiene copolymer; and 0-40 a % by weight of a conductive polymer; and at least one heat seal layer provided on a surface of the intermediate layer opposite to the base layer. The base layer is mainly used to provide mechanical strength of the film. In the present invention, it is not specific to the base layer. A substrate layer that is limited and commonly used to create a heat seal film can be used in the present invention. Preferably, the base layer is selected from the group consisting of biaxially stretched polyester, polyolefin 160811.doc 201244931 smoke or nylon. Preferably, the base layer has a thickness of about 10 Torr to 30 μm. The film preferably has an optical transmittance of not less than 85% and a tensile strength of not less than 50 MPa. The intermediate layer used in the heat seal film of the present invention is relatively soft and electrically conductive, and may be composed of one layer or a plurality of layers. Polyethylene which is suitable for the intermediate layer is preferably a linear low-density polyethylene (LLDPE), more preferably having a weight average molecular weight of more than 1 〇〇, and a melt index (test condition is 19 〇. (:, 2.16 kg 'ASTM D1238) is a 1-100 g/10 minute direct bond low density polyethylene. Suitable for polyethylene (for example) LLDPE (1002-YB) from Exxon Mobil. Polyethylene content in the middle layer It is 〇6〇wt%, preferably 10-60%, more preferably 20-60% and most preferably 50-60%. In the intermediate layer, a suitable vinyl acetate copolymer is a unit derived from vinyl acetate. The percentage of moles is at least 丨〇%, preferably higher than 丨5%, and most preferably still 20%. The suitable comonomer is preferably selected from the group consisting of olefins, more preferably from ethylene. Suitable for the melt index of vinyl acetate copolymer (test conditions are 190. (:, 2.16 kg, eight 8 butyl) ^ 〇 1238) 4 cross is preferably 1-250 g / l 〇 minutes, more preferably 1-100 g / Η) minutes, and optimally 2_5〇§/1〇. The content of the vinyl acetate copolymer in the intermediate layer is 5-7 wt%, preferably 5-50%, more preferably 10-60%, Better 10 4〇%, further preferably 20-40% and most preferably 20-30%. The styrene-butadiene copolymer suitable for the intermediate layer is preferably a styrene-derived unit which accounts for 50% of the total copolymer unit. More than or equal to the ear, more preferably more than 6% by mole and most preferably 70 moles of the above block copolymer. Preferably, the weight average molecular weight of the suitable styrene-butadiene copolymer is preferred. It is 2〇〇〇〇 to 160811.doc 201244931, and optimally 50,000 to styrene·butadiene copolymer 500000, more preferably 40,000 to 300,000 150,000, and the molecular weight distribution is preferably ι_2. 20-90%, preferably 3〇_7〇%, the intermediate layer preferably has a thickness of (four) micrometers and its surface can be electrically conductive by adding a conductive polymer as needed. For example, t' surface resistivity can be less than IxH 11 ohms / □, more preferably less than lxl 〇 1 〇 ohms / port, and optimally less than lxlO9 ohm / □. Suitable electrically conductive polymers include, but are not limited to, polyacetylene, polypyrrole, polythiophene, polyaniline, polyether decylamine or polyester guanamine based intrinsic antistatic polymer or the like, or combinations thereof. In the case where a separate polyethylene layer is not provided, an adhesive layer may be provided between the intermediate layer and the base layer as needed. In the case where a separate polyethylene layer is provided, an adhesive layer is provided between the polyethylene layer and the substrate layer as needed. The adhesive layer can be a conventional curable polyamine phthalate type adhesive.

根據一些實施例’中間層主要係藉由使用擠出機共混擠 出乙烯-乙酸乙烯酯共聚物、苯乙烯-丁二烯嵌段共聚物及 某一量之本質導電或抗靜電聚合物形成的聚合物合金。層 之表面電阻率較佳為1 X 1 〇6- 1 X 1 〇 14歐姆/口。中間層中所使 用之乙稀型共聚物可為聚(乙酸乙稀酯)。聚(乙酸乙稀酯) 具有高於1 0。/。之VA鍵區段含量且佔整個功能層中之聚合物 合金之10-60 Wt%。擬使用之苯乙烯-丁二烯共聚物具有高 於50%之聚苯乙烯鏈區段含量。嵌段共聚物具有2〇〇〇〇至 500000之重量平均分子量以及1-2之分子量分佈。該共聚 物伯整個功能層中之聚合物合金之30-90 wt% »擬使用之 本質導電或抗靜電聚合物可為ICP(固有導電聚合物)或IDP 160811 ,d〇c •10· 201244931 (固有耗散聚合物)’包含聚乙炔、聚吡咯、聚噻吩、聚苯 胺、基於聚醚醯胺或基於聚酯醯胺之本質抗靜電聚合物或 諸如此類,或其組合,其佔整個功能層中之聚合物合金之 0-40 wt%。 熱封層(在本發明中,其亦稱為「熱敏性黏著劑層」)提 供於中間層十與基底層相對之表面上。此熱封層可由一個 層或複數個層中之材料構成,且根據需要可導電或不導 電。較佳地,熱封層係由選自聚丙烯酸酯或其共聚物之材 料構成且聚合物之玻璃轉變溫度應高於3(rc '更佳地高於 60 C、及最佳地70-90°C。根據需要,若中間層中並未添 加導電或抗靜電聚合物,則可將某一量之導電顆粒添加至 熱封層中,舉例而言,熱封層可為添加有某一量之導電填 充劑之聚丙烯酸酯或其共聚物的塗層。熱封層可具有〇.〇1_ 10微米之厚度及lxl〇7-l><l〇i2歐姆/□、更佳地lxl〇7lx1〇11 歐姆/□之表面電阻率》導電填充劑可為奈米氧化物,例 如,二氧化鈦、二氧化矽、氧化鋁、氧化鋅、氧化錫、氧 化銻、氧化銦錫或諸如此類。導電填充劑亦可為奈米碳 管、碳粉末、金屬粉末或諸如此類。層中所添加之導電填 充劑顆粒較佳佔整個熱敏性黏著劑層之〇_6〇 wt<)/。、更佳地 0-30 wt%。擬用於熱封層中之聚丙烯酸酯或其共聚物具有 30-9(TC之較佳玻璃轉變溫度及9〇°C或更高之較佳熱活化 溫度。 視需要,可將抗靜電塗層塗覆於基底層之表面上。抗靜 電塗層之乾燥膜厚度可為(例如)0.01-2微米、較佳地〇 〇51 160811.doc 201244931 微米及最佳地0.1-0.8微米。抗靜電塗層之表面電阻率可為 lxlO6至lxlO12歐姆/□、更佳地卜丨…至^⑺丨丨歐姆/口。基底 層上之抗靜電塗層可藉由凹版塗覆程序來實現。即使在環 境濕度為50°/◦之情形下,抗靜電塗層之表面電阻率亦不高 於1x1012歐姆/口。此塗層可為添加型陽離子型抗靜電塗層 或聚合物接枝型陽離子型抗靜電劑塗層,且其亦可為添加 有導電填充劑之具有相對良好耐溫性的聚合物塗層。導電 填充劑可選自金属氧化物、奈米破管或其他導電顆粒。 圖1係本發明一實施例之覆蓋帶之剖面圖β 2係厚度為約 10-30微米之基底層且主要用於提供膜之機械強度。基底 層2之表面經乾燥膜厚度為〇〇1_2微米且表面電阻率為 lxlO6至lxlO12歐姆/□之抗靜電塗層丨塗覆。使用具有導電 表面之功能層3(在本發明中,功能層意指中間層)來澆注基 底層2中與抗靜電塗層i相對之表面。功能層3具有1〇_5〇微 米之厚度及ΙχΙΟ5至lxl〇i〇歐姆/□之表面電阻率。功能層3 中與基底層2相對之表面經厚度為〇 〇1_1〇微米且表面電阻 率為1x105至lx 10i2歐姆/口之熱敏性黏著劑層4(在本發明 中,熱敏性黏著劑層等同於熱封層)塗覆。 在圖1之結構中,基底層2可為選自雙轴拉伸聚酯、聚烯 烴或耐綸之具有某一機械強度之塑膠膜。此膜具有不小於 85%之光學透射率及不小於5〇 Mpa之抗拉強度。基底層上 之抗靜電塗層1係藉由凹版塗覆程序來實現。在環境濕度 為5〇%時,表面之表面電阻率不高於lxlO12歐姆/□。此塗 層可為添加型陽離子型抗靜電塗層或聚合物接枝型陽離子 160811.doc •12- 201244931 型抗靜電劑塗層’且其亦可為添加有導電填充劑之具有相 對良好耐溫性的聚合物塗層。導電填充劑可選自金屬氧化 物、奈米碳管或其他導電顆粒。功能層3主要係藉由使用 擠出機共混擠出乙烯共聚物、苯乙烯·丁二烯嵌段共聚物 及某一量之本質導電或抗靜電聚合物形成的聚合物合金。 該層之表面電阻率為lxl〇6_lxl〇l4歐姆/口。熱敏性黏著劑 層4主要係添加有某一量導電顆粒之聚丙烯酸酯或其共聚 物之塗層,其具有0_01_10微米之厚度及1χ1〇6_1χ1〇Ι2歐姆/α 之表面電阻率。 功能層3中所使用之乙烯型共聚物可為聚(乙酸乙烯 酯)。聚(乙酸乙烯酯)具有高於丨〇%之VA鏈段含量且佔整個 功能層3中之聚合物合金之1〇_6〇 wt%。擬使用之苯乙烯_ 丁二烯共聚物具有高於50。/。之聚苯乙烯鏈區段含量。嵌段 共聚物具有20000至500000之重量平均分子量以及12之分 子量分佈《該共聚物佔整個功能層中之聚合物合金之3〇_ 90 wt/〇。擬使用之本質導電或抗靜電聚合物可為或 IDP,包含聚乙炔、聚吡咯、聚噻吩、聚苯胺、基於聚醚 醯胺或基於聚酯醯胺之本質抗靜電聚合物或諸如此類或其 組合,其佔整個功能層中之聚合物合金之〇_4〇 wt%。 擬用於熱敏性黏著劑層4中之聚丙烯酸酯或其共聚物具 有30-90°C之玻璃轉變溫度及90它或更高之熱活化溫度。 層中所添加之導電填充劑顆粒佔整個黏著劑層之〇_6〇 wt%。導電填充劑可為奈米氧化物,例如,二氧化鈦、二 氧化石夕、氧化铭、氧化辞、氧化錫、氧化録、氧化銦錫或 16081I.doc 201244931 諸如此類》導電填充劑亦可為奈米碳管、碳粉末、金屬粉 末或諸如此類。 圖2係本發明另一覆蓋帶之剖面圖。基底層2之表面經抗 靜電塗層1塗覆。基底層2中與抗靜電塗層丨相對之表面經 由黏著層5經功能層3塗覆。功能層3中與黏著層5相對之表 面經熱敏性黏著劑層4塗覆。 圖3係本發明另一覆蓋帶之剖面圖。基底層2之表面經抗 靜電塗層1塗覆。聚乙烯層6及功能層3(聚乙烯層6構成功 能層3之一部分)係藉由共擠出吹塑形成。聚乙烯層6之表 面與基底層2經由黏著層5加以組合。功能層3中與聚乙烯 層6相對之表面經熱敏性黏著劑層4塗覆。 本發明進一步提供熱封至包括電子元件之載帶之覆蓋 帶,該覆蓋帶包括: 基底層; 中間層,其佈置於基底層上;及 熱封層,其佈置於中間層上,該覆蓋帶具有至少75%之 平均^學透射率、不超過約5〇%之光學霧度及不超過約 lxl〇u2表面電阻率;以便當將覆蓋帶熱封至載帶以形成 物件時’覆蓋帶與載帶之平均剝離強度為至少20 gf/mm, g使物件經歷不小於約5〇 C之溫度及不小於約90%之相對 濕度達至少5天時剝離強度降低不超過約1〇%。 本發明之熱敏性覆蓋帶具有許多優點,例如,兩側之永 久性抗靜電性能、高透光率、低霧度、與載帶之穩定剝離 力及極佳密封老化性能。在利用熱敏性覆蓋帶之情形下, I60811.doc 14 201244931 在高溫及高濕度下老化後之黏著面不易於黏著至載帶之表 面,且在使用載帶密封熱敏性覆蓋帶後不可能產生勝帶開 口之問題。在使用載帶密封自熱封膜製得之覆蓋帶後,點 著劑層在剝離後保留於支撐帶上,且黏著劑層可與功能層 分離。與市場上之覆蓋帶情形(其中黏著劑層與載帶層分 離,此乃因經由控制產生程序來良好地控制功能層及黏著 調配物之表面)相比’可確保藉由該方法製得之覆蓋帶產 品的穩定剝離效m卜,載帶之表面粗糙度相對較高且 不同载帶具有不同表面粗链若黏著劑層纟剝離後與載 帶層分離,則剝離力之穩定性較差。 下文藉助實例來更詳細地闡述本發明。應注意,該等實 例決不限制本發明且本發明範圍係由隨附申請專利範圍確 定。在本發明中,除非另外指定,否則所有份數、百分 比、含篁、比例皆係以重量計,所有溫度皆係以攝氏溫標 汁且所有具有未指定單位之數值皆係以技術領域中最常 用之早位計。 實例 測試方法: 表面電阻率:在某一溫度及濕度條件下根據ESD S 11.11 標準測試方法來實施測試: 將電阻率儀置於擬量測之物件之表面上後,將開關調節 至期望電壓位置(1G V或⑽V)且使用約5碌之壓力持續按 式按紐》然後’ LCD營幕將顯示量測之表面電阻率。 表面電阻率之單位為歐姆/口。 160811.doc 201244931 光學透射率及霧度.其係藉由霧度儀HM-15 0來量測β 180°下之剝離力:在16(TC下藉由熱封機器來密封5 4 mm寬覆蓋帶及8 mm寬載帶。然後,藉由剝離力測試儀ρΤ_ 45來量測18〇。下之剝離力。 180°下之剝離力之老化測試:在i 60°c下藉由熱封機器 來密封5 ·4 mm寬覆蓋帶及8 mm寬載帶。然後,藉由剝離 力測試儀PT-45來量測180。下之剝離力;將試樣置於 52 C /95rh°/〇之老化室中,在老化5天後,取出試樣並實施 剝離力測試。 60°C下之抗沾黏性之老化測試:將擬測試之試樣黏著至 聚碳酸酯片之表面上且藉由黏著帶固定其兩側。將所獲得 之試樣置於60°C之老化箱中。在一定時間後,取出試樣並 觀察在熱封膜及聚碳酸S旨片之表面上是否發生黏著現象。 實例1 : 功能層材料之製備: 將67.5 kg苯乙烯-丁二烯嵌段共聚物(CHI MEI, PB_ 5903) ' 3 7.5 kg聚(乙酸乙烯酯)(HyunDai,VA60)、45 kg本 質抗靜電聚合物(IDP:P〇lyNova PNC300R-M)及0.6 kg抗氧 化劑 A5(Jinhai Albemarle,Shanghai Jinhai Albemarle Fine Chemicals有限公司)均勻攪拌,並在180〇c下熔融混合,且 然後進行冷卻及粒化以用於進一步應用。 熱封膜及覆蓋帶之製備: 1.製備16 μηι厚單側電暈放電處理之雙軸拉伸聚酯薄 膜β使用厚度為約0.2 μΐΏ之聚胺基甲酸酯型底塗層塗覆電 160811.doc 201244931 軍放電處理之表面’且然後在供箱中供烤。同時,將所製 得用於功能層之聚合物合金熔融塗覆於經底塗層塗覆之聚 醋薄膜上’且然後使所獲得產物冷卻並將其捲繞。功能層 具有30μιτι之厚度及lxl〇9歐姆/□之表面電阻率。 2_在攪拌下,將2 kg聚丙烯酸酯共聚物(DSM ,玻璃轉 變溫度為42°C )粉末溶於16 kg乙酸乙酯溶劑中,且然後添 加2 kg曱苯,並進一步攪拌5分鐘以用於進一步應用。丙 烯酸樹脂於溶液中之固體含量為1〇%。將溶液塗覆於具有 功能層之表面上且在烘箱中乾燥所獲得產物以去除溶劑並 將其捲繞。丙烯酸樹脂層係熱敏性黏著劑層,其具有約^ μπι之厚度《熱敏性黏著劑層之表面具有1><1〇1()歐姆/ 口之表 面電阻率。 肘因镀兮重為 w * « i \JH Z ,According to some embodiments, the intermediate layer is formed primarily by blending an ethylene-vinyl acetate copolymer, a styrene-butadiene block copolymer, and an amount of an intrinsically conductive or antistatic polymer using an extruder. Polymer alloy. The surface resistivity of the layer is preferably 1 X 1 〇 6 - 1 X 1 〇 14 ohms/□. The ethylene copolymer used in the intermediate layer may be poly(ethyl acetate). Poly(ethylene acetate) has a higher than 10%. /. The VA bond segment content is from 10 to 60 Wt% of the polymer alloy in the entire functional layer. The styrene-butadiene copolymer to be used has a polystyrene chain segment content of more than 50%. The block copolymer has a weight average molecular weight of from 2 5000 to 500,000 and a molecular weight distribution of from 1 to 2. The copolymer is 30-90 wt% of the polymer alloy in the entire functional layer. The intrinsically conductive or antistatic polymer to be used may be ICP (Inner Conductive Polymer) or IDP 160811, d〇c •10· 201244931 ( Intrinsically dissipative polymer) 'comprising polyacetylene, polypyrrole, polythiophene, polyaniline, polyether decylamine or polyester guanamine based intrinsic antistatic polymer or the like, or a combination thereof, which occupies the entire functional layer 0-40 wt% of the polymer alloy. A heat seal layer (also referred to as "thermosensitive adhesive layer" in the present invention) is provided on the surface of the intermediate layer 10 opposite to the base layer. The heat seal layer may be composed of a material in one layer or a plurality of layers and may be electrically or non-conductive as needed. Preferably, the heat seal layer is composed of a material selected from the group consisting of polyacrylates or copolymers thereof and the glass transition temperature of the polymer should be higher than 3 (rc 'more preferably higher than 60 C, and most preferably 70-90 °C. If necessary, if a conductive or antistatic polymer is not added to the intermediate layer, a certain amount of conductive particles may be added to the heat seal layer. For example, the heat seal layer may be added with a certain amount. a coating of a polyacrylate or a copolymer thereof of the conductive filler. The heat seal layer may have a thickness of 〇1_10 μm and lxl〇7-l>l〇i2 ohm/□, more preferably lxl〇 7lx1〇11 ohm/□ surface resistivity>>The conductive filler may be a nano oxide, for example, titanium dioxide, cerium oxide, aluminum oxide, zinc oxide, tin oxide, antimony oxide, indium tin oxide or the like. Conductive filler It may also be a carbon nanotube, a carbon powder, a metal powder or the like. The conductive filler particles added in the layer preferably constitute 〇6〇wt<)/ of the entire heat-sensitive adhesive layer. More preferably 0-30 wt%. The polyacrylate or copolymer thereof to be used in the heat seal layer has a preferred glass transition temperature of TC of 30 and a preferred heat activation temperature of 9 ° C or higher. Antistatic coating can be applied as needed. The layer is applied to the surface of the substrate layer. The dry film thickness of the antistatic coating may be, for example, 0.01-2 microns, preferably 〇〇51 160811.doc 201244931 microns and optimally 0.1-0.8 microns. Antistatic The surface resistivity of the coating may be from lxlO6 to lxlO12 ohms/□, more preferably from 丨... to ^(7) 丨丨 ohms/mouth. The antistatic coating on the substrate layer can be achieved by a gravure coating process. When the ambient humidity is 50 ° / ◦, the surface resistivity of the antistatic coating is not higher than 1 x 1012 ohm / port. This coating may be an additive cationic antistatic coating or a polymer grafted cationic anti-corrosion. An electrostatic coating, and which may also be a polymer coating having a relatively good temperature resistance to which a conductive filler is added. The conductive filler may be selected from metal oxides, nanotubes or other conductive particles. A cross-sectional view of a cover tape according to an embodiment of the present invention has a thickness of about 10-30. The base layer of rice is mainly used to provide mechanical strength of the film. The surface of the base layer 2 is coated with an antistatic coating having a dry film thickness of 〇〇1_2 μm and a surface resistivity of lxlO6 to lxlO12 ohm/□. The functional layer 3 of the conductive surface (in the present invention, the functional layer means the intermediate layer) is used to cast the surface of the base layer 2 opposite to the antistatic coating i. The functional layer 3 has a thickness of 1 〇 5 μm and ΙχΙΟ 5 to The surface resistivity of lxl〇i〇 ohm/□. The surface of the functional layer 3 opposite to the base layer 2 is subjected to a heat-sensitive adhesive layer 4 having a thickness of 〇〇1_1 〇micrometer and a surface resistivity of 1×105 to 1×10i2 ohm/port ( In the present invention, the heat-sensitive adhesive layer is equivalent to the heat seal layer. In the structure of FIG. 1, the base layer 2 may be selected from biaxially stretched polyester, polyolefin or nylon to have a certain mechanical strength. The plastic film has an optical transmittance of not less than 85% and a tensile strength of not less than 5 〇 Mpa. The antistatic coating 1 on the substrate layer is realized by a gravure coating process at an ambient humidity of 5 When 〇%, the surface resistivity of the surface is not higher than lxlO12 /□ The coating may be an additive cationic antistatic coating or a polymer grafted cation 160811.doc • 12-201244931 antistatic coating” and it may also have a relative addition of a conductive filler. A polymer coating with good temperature resistance. The conductive filler may be selected from metal oxides, carbon nanotubes or other conductive particles. The functional layer 3 is mainly obtained by blending an ethylene copolymer, styrene by using an extruder. A polymer alloy of a butadiene block copolymer and a certain amount of an intrinsically conductive or antistatic polymer. The surface resistivity of this layer is lxl 〇 6_lxl 〇 14 ohms/mouth. The heat-sensitive adhesive layer 4 is mainly a coating of a polyacrylate or a copolymer thereof to which a certain amount of conductive particles is added, and has a thickness of 0_01_10 μm and a surface resistivity of 1 χ 1 〇 6 χ 1 〇Ι 2 Ω / α. The ethylene type copolymer used in the functional layer 3 may be poly(vinyl acetate). The poly(vinyl acetate) has a VA segment content higher than 丨〇% and accounts for 1〇_6〇 wt% of the polymer alloy in the entire functional layer 3. The styrene-butadiene copolymer to be used has a higher than 50. /. The content of the polystyrene chain segment. The block copolymer has a weight average molecular weight of 20,000 to 500,000 and a molecular weight distribution of 12 "this copolymer accounts for 3 〇 _ 90 wt / 〇 of the polymer alloy in the entire functional layer. The intrinsically conductive or antistatic polymer to be used may be or IDP, comprising polyacetylene, polypyrrole, polythiophene, polyaniline, polyether decylamine or polyester guanamine based intrinsic antistatic polymer or the like or combinations thereof It accounts for 〇4〇wt% of the polymer alloy in the entire functional layer. The polyacrylate or copolymer thereof to be used in the heat-sensitive adhesive layer 4 has a glass transition temperature of 30 to 90 ° C and a heat activation temperature of 90 or higher. The conductive filler particles added in the layer accounted for 〇6〇 wt% of the entire adhesive layer. The conductive filler may be a nano oxide, for example, titanium dioxide, sulphur dioxide, oxidized, oxidized, tin oxide, oxidized, indium tin oxide or 16081I.doc 201244931, etc. The conductive filler may also be nano carbon. Tube, carbon powder, metal powder or the like. Figure 2 is a cross-sectional view of another cover tape of the present invention. The surface of the base layer 2 is coated with an antistatic coating 1. The surface of the base layer 2 opposite to the antistatic coating is coated with the functional layer 3 via the adhesive layer 5. The surface of the functional layer 3 opposite to the adhesive layer 5 is coated with the heat-sensitive adhesive layer 4. Figure 3 is a cross-sectional view of another cover tape of the present invention. The surface of the base layer 2 is coated with an antistatic coating 1. The polyethylene layer 6 and the functional layer 3 (the polyethylene layer 6 constitutes a part of the functional layer 3) are formed by co-extrusion blow molding. The surface of the polyethylene layer 6 is combined with the base layer 2 via the adhesive layer 5. The surface of the functional layer 3 opposite to the polyethylene layer 6 is coated with the heat-sensitive adhesive layer 4. The present invention further provides a cover tape heat-sealed to a carrier tape comprising an electronic component, the cover tape comprising: a base layer; an intermediate layer disposed on the base layer; and a heat seal layer disposed on the intermediate layer, the cover tape Having an average optical transmittance of at least 75%, an optical haze of no more than about 5%, and a surface resistivity of no more than about 1 x 1 〇 u 2; so that when the cover tape is heat sealed to the carrier tape to form an article, the cover tape is The average peel strength of the carrier tape is at least 20 gf/mm, and the peel strength is reduced by no more than about 1% by weight when the article is subjected to a temperature of not less than about 5 〇C and a relative humidity of not less than about 90% for at least 5 days. The heat-sensitive cover tape of the present invention has many advantages such as permanent antistatic properties on both sides, high light transmittance, low haze, stable peeling force with a carrier tape, and excellent sealing aging properties. In the case of using a heat-sensitive cover tape, I60811.doc 14 201244931 The adhesive surface after aging under high temperature and high humidity does not easily adhere to the surface of the carrier tape, and it is impossible to produce a belt opening after using the tape-sealed heat-sensitive cover tape. The problem. After the cover tape obtained by the carrier tape sealing self-heat sealing film is used, the dot layer remains on the support tape after peeling off, and the adhesive layer can be separated from the functional layer. Compared with the case of the cover tape on the market (where the adhesive layer is separated from the carrier layer, which is controlled by the control generation process to well control the surface of the functional layer and the adhesive formulation), it can be ensured by the method. The stable stripping effect of the cover tape product is relatively high, and the surface roughness of the carrier tape is relatively high and the different carrier tapes have different surface thick chains. If the adhesive layer is peeled off and separated from the carrier layer, the stability of the peeling force is poor. The invention is explained in more detail below by way of examples. It should be noted that the examples are in no way intended to limit the invention and the scope of the invention is defined by the scope of the appended claims. In the present invention, unless otherwise specified, all parts, percentages, enthalpy, ratios are by weight, all temperatures are in Celsius and all values having unspecified units are most commonly used in the technical field. The early position. Example test method: Surface resistivity: Perform test according to ESD S 11.11 standard test method under certain temperature and humidity conditions: After placing the resistivity meter on the surface of the object to be measured, adjust the switch to the desired voltage position. (1G V or (10)V) and use a pressure of about 5 ounces to continue pressing the button and then 'LCD Curtain will display the measured surface resistivity. The unit of surface resistivity is ohm/port. 160811.doc 201244931 Optical transmittance and haze. It is measured by haze meter HM-15 0 to measure the peeling force at β 180°: seal the 5 4 mm wide cover at 16 (TC) by heat sealing machine Belt and 8 mm wide carrier tape. Then, the peeling force tester ρΤ_ 45 is used to measure 18 〇. The peeling force under. The peeling force aging test at 180°: by heat sealing machine at i 60 °c To seal the 5 · 4 mm wide cover tape and the 8 mm wide carrier tape. Then, measure the peel force by 180 by the peel force tester PT-45; place the sample at 52 C / 95rh ° / 〇 In the aging room, after aging for 5 days, the sample was taken out and subjected to the peeling force test. The aging test at 60 ° C for adhesion resistance: the sample to be tested was adhered to the surface of the polycarbonate sheet by Adhesive tape is used to fix both sides. The obtained sample is placed in an aging tank at 60 ° C. After a certain period of time, the sample is taken out and observed whether adhesion occurs on the surface of the heat seal film and the polycarbonate sheet. Example 1: Preparation of functional layer material: 67.5 kg styrene-butadiene block copolymer (CHI MEI, PB_ 5903) ' 3 7.5 kg poly(vinyl acetate) HyunDai, VA60), 45 kg of intrinsic antistatic polymer (IDP: P〇lyNova PNC300R-M) and 0.6 kg of antioxidant A5 (Jinhai Albemarle, Shanghai Jinhai Albemarle Fine Chemicals Co., Ltd.) were uniformly stirred and melted at 180 °c Mixing, and then cooling and granulating for further application. Preparation of heat seal film and cover tape: 1. Preparation of 16 μηι thick single-sided corona discharge treated biaxially stretched polyester film β using a thickness of about 0.2 The polyimide coating of the μΐΏ is coated with electric wave 160811.doc 201244931 The surface of the military discharge treatment is 'and then baked in the box. Meanwhile, the polymer alloy prepared for the functional layer is melt coated Covering the undercoat coated polyester film and then cooling the obtained product and winding it. The functional layer has a thickness of 30 μm τι and a surface resistivity of lxl 〇9 ohm/□. 2_ under stirring 2 kg of polyacrylate copolymer (DSM, glass transition temperature of 42 ° C) powder was dissolved in 16 kg of ethyl acetate solvent, and then 2 kg of toluene was added and further stirred for 5 minutes for further application. Acrylic tree The solid content in the solution is 1% by weight. The solution is applied to the surface of the functional layer and the obtained product is dried in an oven to remove the solvent and wind it. The acrylic resin layer is a heat sensitive adhesive layer having Thickness of about ^ μπι The surface of the heat-sensitive adhesive layer has a surface resistivity of 1 <1〇1() ohm/mouth. The elbow is heavily plated with w * « i \JH Z ,

Qingdao Trade Import and Exp〇rt有限公司)塗覆於熱封膜 之與功能層相對之PET表面上’且在供箱上烘烤以用於固 化。在正常溫度及正常濕度之環境下,抗靜電塗層且有 之乾燥膜厚度及1χ1〇π歐姆/〇之表面電阻率。^ 對於所製得之熱封膜,其光學透射率為㈣,其霧度值 為10% ’熱敏性黏著劑之表面上之表面電阻率為】Μ。】。歐 姆/□,且其他表面上之表面電阻率為…⑼歐姆/ 載帶在1 70 C下密封自此熱封膜製得之覆蓋帶,剝離力之 為5〇 8且剥離力之波動範圍為約2〇 g。在將覆蓋帶 及載帶剝離時’密封位置處之熱封層完全保留於載帶上, 且少量功能層亦駐留於載帶上,因此’剝離因功能層之内 160811.doc -17- 201244931 聚力破壞而係實質性剝離。在52°C /95 rh°/〇之條件下實施 老化1週後,剝離力之平均值及剝離力之波動範圍實質上 無變化。 實例2 : 功能層材料之製備: 將67·5 kg苯乙烯-丁二烯嵌段共聚物MEI,PB-5903)、37.5 kg聚(乙酸乙烯酯)(HyunDai,VA60)、45 kg本 質抗靜電聚合物(IDP:P〇lyNova PNC300R-M)及0.6 kg抗氧 化劑 A5(Jinhai Albemarle,Shanghai Jinhai Albemarle FineQingdao Trade Import and Exp〇rt Co., Ltd.) is applied to the PET surface of the heat seal film opposite to the functional layer and baked on the supply box for curing. Under normal temperature and normal humidity, the antistatic coating has a dry film thickness and a surface resistivity of 1χ1〇π ohm/〇. ^ For the obtained heat-sealing film, the optical transmittance is (4), and the haze value is 10%'. The surface resistivity on the surface of the heat-sensitive adhesive is Μ. 】. Ohmic / □, and the surface resistivity on other surfaces is ... (9) ohm / carrier tape sealed at 1 70 C from the heat-sealing film, the peeling force is 5 〇 8 and the peeling force fluctuation range is About 2〇g. When the cover tape and the carrier tape are peeled off, the heat seal layer at the sealing position is completely retained on the carrier tape, and a small amount of the functional layer also resides on the carrier tape, so the peeling is within the functional layer 160811.doc -17- 201244931 The aggregate is broken and is substantially stripped. After the aging for one week at 52 ° C / 95 rh ° / 〇, the average value of the peeling force and the fluctuation range of the peeling force were substantially unchanged. Example 2: Preparation of functional layer material: 67.5 kg styrene-butadiene block copolymer MEI, PB-5903), 37.5 kg poly(vinyl acetate) (HyunDai, VA60), 45 kg essential antistatic Polymer (IDP: P〇lyNova PNC300R-M) and 0.6 kg of antioxidant A5 (Jinhai Albemarle, Shanghai Jinhai Albemarle Fine

Chemicals有限公司)均勻攪拌,並在180。〇下熔融混合,且 然後進行冷卻及粒化以用於進一步應用。 熱封膜及覆蓋帶之製備: 1 ·製備1 6 μιη厚單側電暈放電處理之雙軸拉伸聚酯薄 膜。使用厚度為約0.2 μηι之聚胺基曱酸酯型底塗層塗覆電 暈放電處理之表面’且然後在烘箱中烘烤。同時,將功能 層之所製得聚合物合金熔融塗覆於經底塗層塗覆之聚酯薄 膜上’且然後對所獲得產品進行冷卻並捲繞。功能層具有 30μιη之厚度及lxl〇9歐姆/□之表面電阻率。 2.在授拌下’將2 kg聚丙稀酸酯共聚物(3Μ,玻璃轉變 溫度為8 0 °C )粉末溶於16 kg乙酸乙酷溶劑中,且然後添加2 kg甲苯,並進一步攪拌5分鐘以用於進一步應用。溶液中 丙烯酸樹脂之固體含量為10°/。。將溶液塗覆於具有功能層 之表面上且在烘箱中乾燥所獲得產物以去除溶劑並捲繞。 丙烯酸樹脂層係熱敏性黏著劑層,其具有約i μιη之厚度。 160811.doc -18· 201244931 熱敏性黏著劑層之表面具有lxl0,。歐姆/口之表面電阻率。 3.將si體含量為5%之抗靜電塗層溶液Chemicals Co., Ltd.) Stir well and at 180. The underarm is melt mixed and then cooled and granulated for further application. Preparation of heat seal film and cover tape: 1 · Prepare a 6 μ μη thick single-sided corona discharge treated biaxially stretched polyester film. The corona discharge treated surface was coated with a polyamine phthalate type undercoat layer having a thickness of about 0.2 μm and then baked in an oven. At the same time, the polymer alloy obtained by the functional layer is melt-coated on the undercoated polyester film' and then the obtained product is cooled and wound. The functional layer has a thickness of 30 μm and a surface resistivity of lxl 〇 9 ohm/□. 2. Dissolve 2 kg of polyacrylate copolymer (3 Μ, glass transition temperature of 80 ° C) powder in 16 kg of ethyl acetate in a mixture, and then add 2 kg of toluene and further stir 5 Minutes for further application. The solid content of the acrylic resin in the solution was 10 ° /. . The solution was applied to the surface having the functional layer and the obtained product was dried in an oven to remove the solvent and wound up. The acrylic resin layer is a heat-sensitive adhesive layer having a thickness of about i μm. 160811.doc -18· 201244931 The surface of the heat-sensitive adhesive layer has lxl0,. Ohmic / port surface resistivity. 3. Antistatic coating solution with si content of 5%

Qingdao Trade Import and E P〇rt有限公司)塗覆於熱膜 中與功能層相對之PET表面上,H M M u ' 1衣囟上,且在烘箱上烘烤以用於固 化。在正常溫度及正常濕度之環境下,抗靜電塗層且有 0‘2 4〇1之乾燥膜厚度及1><1〇1〗歐姆/口之表面電阻率。 對於所製得之熱封膜,其光學透射率為85%,其霧度值 為·,熱敏性黏著劑之表面上之表面電阻率為ΐχΐ〇ι。歐 姆/口,且其他表面上之表面電阻率為1x10"歐姆/□。使用 載帶在170。。下密封自此熱封臈製得之覆蓋帶,剝離力之 平均值為50 g且剝離力之波動範圍為約2〇 g。在將覆蓋帶 及載帶剝離時,密封位置處之熱封層完全保留於載帶上, 且少量功能層亦駐留於载帶上,因此,義因功能層之内 聚力破壞而係實質性剝離。在饥/95㈣之條件下實施 老化1週後剝離力之平均值及剝離力之波動範圍實質上 不變。 實例3 : 功能層材料之製備·· 將80 kg苯乙烯·丁二烯嵌段共聚物MEI,pB_ 03) 20 kg聚(乙酸乙烯醋)(HyunDai,VA6〇)、及 〇 * ^^>fb#]A5(Jinhai Albemarle > Shanghai Jinhai Albemarle Fine Chemicals有限公司)均勻攪拌,並在18〇。〔下熔融混 合,且然後進行冷卻及粒化以用於進一步應用。 熱封臈及覆蓋帶之製備: i608I1.doc -19- 201244931 1. 藉由吹塑模製將功能層之所製得材料形成膜並捲繞 用於進一步應用。薄膜之厚度&35μηιβQingdao Trade Import and E P〇rt Co., Ltd.) was coated on a PET surface opposite to the functional layer in a hot film, on a H M M u '1 coat, and baked on an oven for curing. Under normal temperature and normal humidity, the antistatic coating has a dry film thickness of 0 '24 〇 1 and a surface resistivity of 1 > 1 〇 1 ohm / mouth. The obtained heat-sealing film had an optical transmittance of 85%, a haze value of ·, and a surface resistivity of 热敏ι on the surface of the heat-sensitive adhesive. Omm/mouth, and the surface resistivity on other surfaces is 1x10" Ohm/□. Use the carrier tape at 170. . The cover tape obtained by the heat sealing of the lower seal was sealed, and the average peeling force was 50 g and the peeling force fluctuated within a range of about 2 〇 g. When the cover tape and the carrier tape are peeled off, the heat seal layer at the sealing position is completely retained on the carrier tape, and a small amount of the functional layer also resides on the carrier tape, so that the cohesive force of the semantic functional layer is broken and substantially peeled off. The average value of the peeling force and the fluctuation range of the peeling force after the aging for one week under the conditions of hunger/95 (4) were substantially unchanged. Example 3: Preparation of functional layer material · 80 kg of styrene-butadiene block copolymer MEI, pB_ 03) 20 kg of poly(vinyl acetate) (HyunDai, VA6〇), and 〇*^^>Fb#]A5 (Jinhai Albemarle > Shanghai Jinhai Albemarle Fine Chemicals Co., Ltd.) was stirred evenly and at 18 〇. [Under melt mixing, and then cooled and granulated for further use. Preparation of heat seal and cover tape: i608I1.doc -19- 201244931 1. The material obtained by the functional layer is formed into a film by blow molding and wound for further application. Film thickness & 35μηιβ

2. 製備12 μιη厚單側電暈放電處理之雙軸拉伸聚酯薄 膜。使用聚胺基f酸酯膠(35%,購自MITSUI TAKEDA CHEMICAL公司之黏著劑,Α·969ν/Α 5為3/ι)塗覆電暈放 電處理之表面。料後之膠厚度為約2 μπι<>將所製得之功 能層薄膜與經膠塗覆之聚醋薄膜之表面進行組合且然後在 室溫下固化。 3. 在攪拌下,將2 kg聚丙烯酸酯共聚物(DSM)粉末溶於 16 kg乙酸乙醋溶劑中,且然後添加lkgl5%碳黑導電溶液 (PC AUTO碳黑,Nipp〇n Paint有限公司中國)及2 甲 苯,且進一步攪拌5分鐘以用於進一步應用。在溶液中, 丙烯酸樹脂之固體含量為9‘5。/〇且導電碳黑與丙烯酸樹脂之 比率為1Π3.3。將溶液塗覆於與功能層組合之聚酯薄膜之 表面上且在烘箱中乾燥所獲得產品以去除溶劑並捲繞。丙 烯酸樹脂層係熱敏性黏著劑層,其具有約〇 5 之厚度。 熱敏性黏著劑層之表面具有lxl〇9歐姆/口之表面電阻率。 4·將固體含量為5%之抗靜電塗層溶液(Kl〇4A 2, Qingdao Trade Import and Export有限公司)塗覆於熱封膜 中與功能層相對之PET表面上,且在烘箱上烘烤以用於固 化。在正常溫度及正常濕度之環境下,抗靜電塗層具有 0.2»1〇1之乾燥膜厚度及1><1〇11歐姆/口之表面電阻率。 對於所製得之熱封膜,其光學透射率為75%,其霧度值 為10%,熱敏性黏著劑之表面上之表面電阻率為1χ1〇9歐姆/〇, 160811.doc •20· 201244931 且其他表面上之表面電阻率為1M0'·歐姆/口。使用載帶在 C下密封藉由切割自此熱封膜製得之覆蓋帶,剝離力 之平均值為50 g且剝離力之波動範圍為約2〇 g。在將覆蓋 帶及載帶離時,密封位置處之熱封層完全保留於載帶 上’且沒有功能層保留於載帶上,且由此剝離實際上係熱 封層與功能層之間之介面剝離。 實例4 : 功能層材料之製備: 將6〇 kg苯乙烯-丁二烯嵌段共聚物((:出]^1,卩6_ 5903) ' 40 kg聚(乙酸乙烯酯)(HyunDai,VA6〇)、及 〇 4 抗氧化劑 A5(Jinhai Albemarle, Shanghai Jinhai Albemarle2. Prepare a 12 μιη thick single-sided corona discharge treated biaxially stretched polyester film. The surface of the corona discharge treatment was coated with a polyamine-based acid ester gel (35%, an adhesive available from MITSUI TAKEDA CHEMICAL Co., Ltd., 969·969ν/Α 5 was 3/ι). The thickness of the glue after the material was about 2 μm; <> The resulting functional layer film was combined with the surface of the gel-coated polyester film and then cured at room temperature. 3. Dissolve 2 kg of polyacrylate copolymer (DSM) powder in 16 kg of ethyl acetate solvent with stirring, and then add lkgl5% carbon black conductive solution (PC AUTO carbon black, Nipp〇n Paint Co., Ltd. China) And 2 toluene, and further stirred for 5 minutes for further application. In the solution, the acrylic resin has a solid content of 9 '5. /〇 The ratio of conductive carbon black to acrylic resin is 1Π3.3. The solution was applied to the surface of the polyester film combined with the functional layer and the obtained product was dried in an oven to remove the solvent and wound up. The acrylic resin layer is a heat-sensitive adhesive layer having a thickness of about 〇5. The surface of the heat-sensitive adhesive layer has a surface resistivity of lxl 〇 9 ohms/□. 4. Apply an antistatic coating solution (Kl〇4A 2, Qingdao Trade Import and Export Co., Ltd.) with a solid content of 5% on the PET surface of the heat seal film opposite to the functional layer, and bake on the oven. For curing. The antistatic coating has a dry film thickness of 0.2»1〇1 and a surface resistivity of 1<1〇11 ohm/mouth under normal temperature and normal humidity. For the obtained heat seal film, the optical transmittance is 75%, the haze value is 10%, and the surface resistivity on the surface of the heat-sensitive adhesive is 1χ1〇9 ohm/〇, 160811.doc •20· 201244931 And the surface resistivity on other surfaces is 1 M0'·ohm/port. The cover tape obtained by cutting the heat-sealing film was cut using a carrier tape at C, and the average peeling force was 50 g and the peeling force fluctuated within a range of about 2 〇 g. When the cover tape and the carrier tape are separated, the heat seal layer at the sealing position is completely retained on the carrier tape' and no functional layer remains on the carrier tape, and thus the peeling is actually between the heat seal layer and the functional layer. The interface is peeled off. Example 4: Preparation of functional layer material: 6 〇kg styrene-butadiene block copolymer ((:出出^^1, 卩6_ 5903) ' 40 kg poly(vinyl acetate) (HyunDai, VA6〇) And 〇4 antioxidant A5 (Jinhai Albemarle, Shanghai Jinhai Albemarle

Fine Chemicals有限公司)均勻攪拌,並在18〇1>c下熔融混 合’且然後進行冷卻及粒化以用於進一步應用。 熱封臈及覆蓋帶之製備: ^將功能層之所製得材料及直鍵低密度聚乙烯Lldpe (l〇〇2_YB,Exxon Mobil)共擠出並藉由特定方法形成膜且 然後捲繞用於進一步應用。薄膜具有35 μιη之總厚度,其 中功能層之厚度為12 μηι且聚乙烯層之厚度為23 μηι。 2.製備12 μηι厚單側電暈放電處理之雙軸拉伸聚輯薄 膜。使用聚胺基曱酸酿膠(35%,講自MITSUI TAKEDACHEMICAL公司之黏著劑,A-969V/A-5為 3/1)塗 覆電暈放電處理之表面。烘烤後之膠厚度為約2 μηΐβ將上 述雙層薄膜之聚乙烯表面與經膠塗覆之聚酯薄膜之表面進 行組合且然後在室溫下固化。 160811.doc 21 201244931 3.在攪拌下,將2 kg聚丙烯酸酯共聚物(DSM)粉末溶於 16 kg乙酸乙酯溶劑中’且然後添加2 kg 2〇0/〇 AT〇溶液(奈 米氧化錫/氧化銻溶液)及! kg曱苯,並進一步高速攪拌5分 鐘以用於進一步應用。在溶液中,丙烯酸樹脂之固體含量 為9.5%且ΑΤΟ與丙烯酸樹脂之比率為1/5。將溶液塗覆於與 功能層組合之聚酯薄膜之表面上且將所獲得產品在烘箱中 乾燥以去除溶劑並捲繞。丙烯酸樹脂層係熱敏性黏著劑 層,其具有約0.5 μηι之厚度。熱敏性黏著劑層之表面具有 lxio9歐姆/□之表面電阻率。 4.將固體含量為5%之抗靜電塗層溶液(Ki〇4a_2,Fine Chemicals Co., Ltd.) was uniformly stirred and melt-mixed under 18 ° 1 > c and then cooled and granulated for further use. Preparation of heat-sealing tape and cover tape: ^ Co-extruding the material obtained from the functional layer and the direct-bond low-density polyethylene Lldpe (l〇〇2_YB, Exxon Mobil) and forming a film by a specific method and then winding For further application. The film had a total thickness of 35 μηη, wherein the thickness of the functional layer was 12 μηι and the thickness of the polyethylene layer was 23 μηι. 2. Prepare a 12 μηι thick single-sided corona discharge treated biaxially stretched polyfilm. The surface of the corona discharge treatment was coated with a polyamine phthalic acid styrofoam (35%, an adhesive from MITSUI TAKEDACHEMICAL, A-969V/A-5 was 3/1). The thickness of the glue after baking was about 2 μηΐβ. The polyethylene surface of the two-layer film was combined with the surface of the gel-coated polyester film and then cured at room temperature. 160811.doc 21 201244931 3. Dissolve 2 kg of polyacrylate copolymer (DSM) powder in 16 kg of ethyl acetate solvent with stirring> and then add 2 kg of 2〇0/〇AT〇 solution (nano oxidation) Tin/yttrium oxide solution) and! Kg was added to the benzene and further stirred at high speed for 5 minutes for further application. In the solution, the acrylic resin had a solid content of 9.5% and a ratio of cerium to acrylic resin of 1/5. The solution was applied to the surface of the polyester film combined with the functional layer and the obtained product was dried in an oven to remove the solvent and wound. The acrylic resin layer is a heat-sensitive adhesive layer having a thickness of about 0.5 μm. The surface of the heat-sensitive adhesive layer has a surface resistivity of lxio9 ohm/□. 4. Antistatic coating solution (Ki〇4a_2, with a solid content of 5%,

Qingdao Trade Import and Export有限公司)塗覆於熱封膜 中與功能層相對之PET表面上,且在烘箱上烘烤以用於固 化。在正常溫度及正常濕度之環境下,抗靜電塗層具有 〇·2 μιη之乾燥膜厚度及1><1〇"歐姆/〇之表面電阻率。、 對於所製得之熱封膜,其光學透射率為85% ’其霧度值 為15% ’熱敏性黏著劑之表面上之表面電阻率為卜1〇9歐姆 化,且其他表面上之表面電阻率為1χ1〇11歐姆/口。使用載 帶在航下密封藉由切割自此熱封膜製得之覆蓋帶,剝 離力之平均值為40 g且剝離力之波動範圍為約层。在將 覆蓋帶及載帶剝離時,密封位晋虚 ^在钌位置處之熱封層完全保留於載 帶上’且沒有功能層保留於載帶上,且由此剝離實際上係 熱封層與功能層之間之介面剝離。 對比實例1 : 功能層材料之製備: 160811.doc •22· 201244931 將30 kg苯乙烯-丁二烯嵌段共聚物(CHI mEI,PB_ 5903)、75 kg聚(乙酸乙稀酯)(HyunDai,VA60)、45 kg本質 抗靜電聚合物(IDP:P〇lyNova PNC300R-M)及0·6 kg抗氧化 劑 A5(Jinhai Albemarle,Shanghai Jinhai Albemarle FineQingdao Trade Import and Export Co., Ltd.) is applied to the PET surface of the heat seal film opposite to the functional layer and baked on an oven for curing. Under normal temperature and normal humidity, the antistatic coating has a dry film thickness of 〇 2 μm and a surface resistivity of <1 〇 " ohms/〇. For the obtained heat-sealing film, the optical transmittance is 85% 'the haze value is 15%' The surface resistivity on the surface of the heat-sensitive adhesive is 〇1〇9 ohmized, and the surface on other surfaces The resistivity is 1χ1〇11 ohms/port. The carrier tape was sealed under air by cutting the cover tape obtained from the heat-sealing film, and the average peeling force was 40 g and the peeling force fluctuated within about a layer. When the cover tape and the carrier tape are peeled off, the heat seal layer at the position of the seal is completely retained on the carrier tape and no functional layer remains on the carrier tape, and thus the heat seal layer is actually peeled off. The interface between the interface and the functional layer is peeled off. Comparative Example 1: Preparation of functional layer material: 160811.doc •22· 201244931 30 kg of styrene-butadiene block copolymer (CHI mEI, PB_ 5903), 75 kg of poly(ethylene acetate) (HyunDai, VA60), 45 kg of essential antistatic polymer (IDP: P〇lyNova PNC300R-M) and 0.6 kg of antioxidant A5 (Jinhai Albemarle, Shanghai Jinhai Albemarle Fine

Chemicals有限公司)均勻攪拌,並在18〇。〇下熔融混合,且 然後進行冷卻及粒化以用於進一步應用。 熱封膜及覆蓋帶之製備: L製備16 μιη厚單側電暈放電處理之雙軸拉伸聚酯薄 膜。使用厚度為約0.2 μηι之聚胺基甲酸酯型底塗層塗覆電 暈放電處理之表面,且然後在烘箱中烘烤。同時,將功能 層之所製得聚合物合金熔融塗覆於經底塗層塗覆之聚酯薄 膜上’且然後對所獲得產品進行冷卻並捲繞。功能層具有 30 μηι之厚度及ιχ1〇9歐姆/□之表面電阻率。 2. 在攪拌下,將2 kg聚丙烯酸酯共聚物(DSM,玻璃轉 變溫度為42°C )粉末溶於16 kg乙酸乙酯溶劑中,且然後添 加2 kg甲苯’並進一步攪拌5分鐘以用於進一步應用。溶 液中丙烯酸樹脂之固體含量為丨。將溶液塗覆於具有功 能層之表面上且在烘箱中乾燥所獲得產品以去除溶劑並捲 繞。丙稀酸樹脂層係熱敏性黏著劑層,其具有約1 μιη之厚 度。熱敏性黏著劑層之表面具有1χ1〇ι〇歐姆/ 口之表面電阻 率。 3. 將固體含量為5%之抗靜電塗層溶液(κ1〇4Α·2, Qingdao Trade Import and Export有限公司)塗覆於熱封臈 中與功能層相對之PET表面上,且在烘箱上烘烤以用於固 160811.doc •23· 201244931 化。在正常溫度及正常濕度之環境下 抗靜電塗層具有Chemicals Co., Ltd.) Stir well and at 18 〇. The underarm is melt mixed and then cooled and granulated for further application. Preparation of heat seal film and cover tape: L A 16 μιη thick single-sided corona discharge treated biaxially stretched polyester film was prepared. The surface of the corona discharge treatment was coated with a polyurethane-based undercoat layer having a thickness of about 0.2 μm, and then baked in an oven. At the same time, the polymer alloy obtained by the functional layer is melt-coated on the undercoated polyester film' and then the obtained product is cooled and wound. The functional layer has a thickness of 30 μηι and a surface resistivity of ιχ1〇9 ohm/□. 2. 2 kg of polyacrylate copolymer (DSM, glass transition temperature 42 ° C) powder was dissolved in 16 kg of ethyl acetate solvent with stirring, and then 2 kg of toluene was added and further stirred for 5 minutes. For further application. The solid content of the acrylic resin in the solution is 丨. The solution was applied to the surface having the functional layer and the obtained product was dried in an oven to remove the solvent and wrap. The acrylic resin layer is a heat-sensitive adhesive layer having a thickness of about 1 μm. The surface of the heat-sensitive adhesive layer has a surface resistivity of 1 χ 1 〇 〇 ohm / mouth. 3. Apply an antistatic coating solution (κ1〇4Α·2, Qingdao Trade Import and Export Co., Ltd.) with a solid content of 5% to the PET surface of the heat-sealed crucible opposite to the functional layer and bake on the oven. Baked for solidation 160811.doc •23· 201244931. Antistatic coating in normal temperature and normal humidity environment

及載帶剝離時,密 剝離力之波動範圍為約20 g。在將覆蓋帶 密封位置處之熱封層完全保留於載帶上, 且少量功此層亦駐留於載帶上,因此,剝離因功能層之内 聚力破壞而係實質性剝離。在52t /95 rh%之條件下實施 老化1週後,剝離力之平均值及剝離力之波動範圍實質上 不變。 對比實例2 : 功能層材料之製備: 將30 kg苯乙烯·丁二烯嵌段共聚物(CHI mei,PB- 5903)、70 kg聚(乙酸乙稀 g旨)(HyunDai,VA60)、及 0.4 kg 抗氧化劑 A5(Jinhai Albemarle,Shanghai Jinhai AlbemarleWhen the carrier tape is peeled off, the density of the peeling force ranges from about 20 g. The heat seal layer at the position where the cover tape is sealed is completely retained on the carrier tape, and a small amount of the work layer also resides on the carrier tape, so that the peeling is substantially peeled off due to the cohesive force of the functional layer. After the aging for 1 week at 52 t / 95 rh%, the average value of the peeling force and the fluctuation range of the peeling force were substantially unchanged. Comparative Example 2: Preparation of functional layer material: 30 kg of styrene-butadiene block copolymer (CHI mei, PB-5903), 70 kg of poly(ethylene acetate) (HyunDai, VA60), and 0.4 Kg Antioxidant A5 (Jinhai Albemarle, Shanghai Jinhai Albemarle

Fine Chemicals有限公司)均勻攪拌,.並在180°c下熔融混 合’且然後進行冷卻及粒化以用於進一步應用。 熱封膜及覆蓋帶之製備: 1.將功能層之所製得材料及直鏈低密度聚乙烯LLDPE (I002-YB,Exxon Mobil)共擠出並藉由特定方法形成膜且然 後捲繞用於進一步應用。薄膜具有35 μηι之總厚度,其中 功能層之厚度為12 μηι且聚乙烯層之厚度為23 μιη。 1608ll.doc -24- 201244931 2.製備12 μπι厚單側電暈放電處理之雙軸拉伸聚酯薄 膜。使用聚胺基曱酸酯膠(35%,購自MITSUI TAKEDA CHEMICAL公司之黏著劑,A-969V/A-5為3/1)塗覆電暈放 電處理之表面。烘烤後之膠厚度為約2 μπι。將上述雙層薄 膜之聚乙烯表面與經膠塗覆之聚酯薄膜之表面進行組合且 然後在室溫下固化》 3.在攪拌下,將2 kg聚丙烯酸酯共聚物(DSM)粉末溶於 16 kg乙酸乙酯溶劑中,且然後添加2 kg 20% ΑΤΟ溶液(奈 米氧化錫/氧化銻溶液)及1 kg甲苯,並進一步高速攪拌5分 鐘以用於進一步應用。在溶液中,丙烯酸樹脂之固體含量 為9.5%且ΑΤΟ與丙烯酸樹脂之比率為1/5。將溶液塗覆於與 功能層組合之聚酯薄膜之表面上且將所獲得產品在烘箱中 乾燥以去除溶劑並捲繞。丙烯酸樹脂層係熱敏性黏著劑 層,其具有約0·5㈣之厚度。熱敏性黏著劑層之表面具有 lxio9歐姆/□之表面電阻率。 今.肝因瓶兮置為5%之抗靜電塗層溶液(ΚΚ)4Α·2, Qingdao Trade Import and Exp〇rt有限公司)塗覆於熱封膜 中與功能層相對之PET表面±,且在烘箱上烘烤以用於固 化。在正常溫度及正常濕度之環境下,抗靜電塗 0.2叫之乾燥膜厚度及lxlQu歐姆/q之表面電阻率。、 對於所製得之熱_,其光學透㈣為⑽ 為,熱敏性黏著劑之表面上之表面電阻率為心: ’二I:表面上之表面電阻率為1X1011歐姆/D。在使用 載帶在,下密封藉由切割自此熱封膜製得之覆^ 1608 ] 1 .doc •25· 201244931 後,剝離力之平均值小於30 g。過小之剝離力將弱化覆蓋 帶與載帶之間之密封,此易於引起膠帶開口。 實例之結果匯總於下表中。 160811.doc -26- 201244931 對比實例2 〇 〇 CN 0.4(ATO 粉末) νη 00 ΙχΙΟ11 7 對比實例1 〇 V-H 〇 in 00 lxio11 (N tn (N X 實例4 〇 〇 <N 0.4(ATO 粉末) 00 lxio11 〇 實例3 〇 CN § 〇 CN 0.15(導電 碳黑) in lxio10 實例2 37.5 67.5 〇 »—η 〇 1/1 oo lxio10 in 實例1 37.5 67.5 Ο 〇 00 lxio10 jr> X 聚(乙酸乙烯 一·^ 酉辦 a 1 0 ^ op 奪 〇 G 2 聚丙烯酸酯共 熱封層 聚物/kg 調配物 ΑΤΟ/導電 碳黑/kg 光學透射率/% 霧度值/% 熱封層之表面電阻率/歐姆/口 180°下之剝離力/g/mm 在52°C-95 rh%下老化5天後 之180°下之剝離力 /g/mm 60°C下之抗沾黏性測試 160811.doc -27- 201244931 數據表明功能層之調配物對於剝離力大小具有重要影 響。由於當剝離覆蓋帶時本發明中之剝離係熱封層與功能 層間之介面剝離’或係由功能層之内聚力破壞弓丨起之剝 離’故在用於熱封層之基本樹脂之調配物保持恆定之情形 下’可藉由改變用於功能層之調配物中苯乙烯·丁二稀故 段共聚物之含量來調節自功能層剝離熱封層時功能層之剝 離力或内聚力。自數據分析可看出,可藉由增加苯乙烯_ 丁二烯嵌段共聚物之含量來增加180。下之剝離力,而剝離 力之波動範圍實質上保持恆定。若向功能層中添加導電聚 合物’則因熱封層極薄,表面之表面電阻率略有改變且仍 保持於ΙχΙΟ12歐姆/□。若適當增加熱封層之玻璃轉變溫 度,則可改良覆蓋帶之抗沾黏效應。若向熱封層中添加無 機填充劑,則覆蓋帶可提供有抗靜電性及增加之抗沾黏效 應,但其霧度值同時有所增加。 【圖式簡單說明】 圖1係本發明之坑靜電熱封膜之剖面圖; 圖2係本發明之另一抗靜電熱封膜之剖面圖;且 圖3係本發明之另一抗靜電熱封膜之剖面圖。 【主要元件符號說明】 1 抗靜電塗層 2 基底層 3 功能層 4 熱敏性黏著劑層 5 黏著層 6 聚乙烯層 I60811.doc ·28·Fine Chemicals Co., Ltd.) was uniformly stirred, and melt-mixed at 180 ° C and then cooled and granulated for further use. Preparation of heat seal film and cover tape: 1. Coextruding the material obtained from the functional layer and linear low density polyethylene LLDPE (I002-YB, Exxon Mobil) and forming a film by a specific method and then winding For further application. The film has a total thickness of 35 μηι, wherein the functional layer has a thickness of 12 μm and the polyethylene layer has a thickness of 23 μm. 1608ll.doc -24- 201244931 2. Preparation of a 12 μπι thick single-sided corona discharge treated biaxially stretched polyester film. The surface of the corona discharge treatment was coated with a polyamino phthalate gel (35%, an adhesive available from MITSUI TAKEDA CHEMICAL, A-969V/A-5 of 3/1). The thickness of the glue after baking is about 2 μm. Combining the polyethylene surface of the above two-layer film with the surface of the gel-coated polyester film and then curing at room temperature. 3. Dissolving 2 kg of polyacrylate copolymer (DSM) powder under stirring 16 kg of ethyl acetate solvent, and then 2 kg of 20% hydrazine solution (nano tin oxide / cerium oxide solution) and 1 kg of toluene were added and further stirred at high speed for 5 minutes for further application. In the solution, the acrylic resin had a solid content of 9.5% and a ratio of cerium to acrylic resin of 1/5. The solution was applied to the surface of the polyester film combined with the functional layer and the obtained product was dried in an oven to remove the solvent and wound. The acrylic resin layer is a heat-sensitive adhesive layer having a thickness of about 0.55 (d). The surface of the heat-sensitive adhesive layer has a surface resistivity of lxio9 ohm/□. Today, the liver is coated with a 5% antistatic coating solution (ΚΚ) 4Α·2, Qingdao Trade Import and Exp〇rt Co., Ltd.) coated on the PET surface of the heat seal film opposite to the functional layer ±, and Bake in an oven for curing. Under normal temperature and normal humidity, antistatic coating 0.2 is called dry film thickness and surface resistivity of lxlQu ohm/q. For the heat _ produced, the optical transmittance (4) is (10), and the surface resistivity on the surface of the heat-sensitive adhesive is: 'III: the surface resistivity on the surface is 1×10 11 ohm/D. After the carrier tape was used, the lower seal was obtained by cutting the heat seal film from 1608] 1 .doc • 25· 201244931, and the average peel force was less than 30 g. A too small peel force will weaken the seal between the cover tape and the carrier tape, which tends to cause the tape opening. The results of the examples are summarized in the table below. 160811.doc -26- 201244931 Comparative Example 2 〇〇CN 0.4 (ATO powder) νη 00 ΙχΙΟ11 7 Comparative example 1 〇VH 〇in 00 lxio11 (N tn (NX example 4 〇〇<N 0.4 (ATO powder) 00 lxio11 〇Example 3 〇CN § 〇CN 0.15 (conductive carbon black) in lxio10 Example 2 37.5 67.5 〇»—η 〇1/1 oo lxio10 in Example 1 37.5 67.5 Ο 〇00 lxio10 jr> X Poly(vinyl acetate··^ 酉a 1 0 ^ op 〇 G 2 polyacrylate co-heat seal polymer / kg formulation ΑΤΟ / conductive carbon black / kg optical transmittance /% haze value /% heat seal layer surface resistivity / ohm / Peel force at 180°/g/mm Peel force at 180° after aging for 5 days at 52°C-95 rh%/g/mm Anti-sticking test at 60°C 160811.doc -27 - 201244931 The data indicates that the formulation of the functional layer has a significant influence on the size of the peeling force. Since the interface between the peeling heat seal layer and the functional layer in the present invention is peeled off when the cover tape is peeled off, or the cohesive force of the functional layer breaks the bow Stripping', so the formulation of the base resin used for the heat seal layer remains In the case of constant, the peeling force or cohesion of the functional layer when the heat-sealing layer is peeled off from the functional layer can be adjusted by changing the content of the styrene-butadiene-containing copolymer in the formulation for the functional layer. It can be seen that by increasing the content of the styrene-butadiene block copolymer, the peeling force is increased by 180. The fluctuation range of the peeling force is substantially constant. If a conductive polymer is added to the functional layer' Therefore, since the heat seal layer is extremely thin, the surface resistivity of the surface slightly changes and remains at ΙχΙΟ12 ohm/□. If the glass transition temperature of the heat seal layer is appropriately increased, the anti-sticking effect of the cover tape can be improved. When an inorganic filler is added to the sealing layer, the covering tape can provide antistatic property and an increased anti-sticking effect, but the haze value thereof is also increased at the same time. [Simplified Schematic] FIG. 1 is the electrostatic heat of the pit of the present invention. Figure 2 is a cross-sectional view of another antistatic heat sealing film of the present invention; and Figure 3 is a cross-sectional view of another antistatic heat sealing film of the present invention. [Main component symbol description] 1 Antistatic Coating 2 base layer 3 Functional layer 4 Thermal adhesive layer 5 Adhesive layer 6 Polyethylene layer I60811.doc ·28·

Claims (1)

201244931 七、申請專利範圍: ^ —種用於封裝電子元件之熱封膜,其包括: 基底層; i —個中間層,其係提供於該基底層上且包括混合 • 物’遠混合物就100重量%之該中間層之總重量而言包 括: 5重量%至7〇重量%之乙酸乙烯酯共聚物,其中衍生 自乙酸乙烯酯之單元佔該共聚物之10莫耳%以上; 20重量❶/。至90重量%之苯乙烯-丁二烯共聚物;及 〇至40重量%之導電聚合物;及 至少一個熱封層’其係提供於該中間層之與該基底層 相對之表面上。 2.如凊求項1之熱封膜,其中該基底層係由選自由雙軸拉 伸聚8日、聚烯烴或耐綸(ny丨〇n)組成之群之材料構成。 如吻求項1之熱封膜,其中該基底層具有1〇 pm至3〇卩m 之厚度。 士叫求項1之熱封膜,其中該基底層具有不小於85〇/〇之光 學透射率及不小於50 MPa之抗拉強度。 。月求項1之熱封膜,其中在該乙酸乙烯酯共聚物中, * '•亥等何生自乙酸乙烯酯之單元至少佔該共聚物之2〇莫耳 %。 明求項1之熱封膜’其中該苯乙稀-丁二烯共聚物係嵌 段共聚物。 7.如請求項16中任一項之熱封膜,其中在該苯乙烤·丁二 160811.doc 201244931 彿共聚物中’該等衍生自笨乙烯之單元佔該共聚物之總 單元數的60莫耳。/〇以上。 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 如請求項1至6中任-項之熱封膜,其中該苯乙烯·丁二烯 共聚物具有4〇,〇〇〇至3〇〇〇〇〇之重量平均分子量。 如請求们之熱封膜,其中該乙酸乙烯醋共聚物佔該中 間層之總重量之1 〇重量°/〇至60重量〇/〇。 如請求項1之熱封膜,纟中該苯乙烯-丁二烯共聚物佔該 中間層之總重量之3〇重量%至70重量 士-月求項!之熱封膜,其中該導電聚合物佔該中間層之 總重量之0至30重量%。 如請求項1之熱封膜,其中該乙酸乙稀醋共聚物係乙酸 乙稀酯與乙烯之共聚物β 如請求項1之熱封膜,其中該導電聚合物係選自由以下 組成之群:聚乙炔、聚吡咯、聚噻吩、聚苯胺、基於聚 賴胺或基於聚㈣胺之本質抗靜電聚合物’或其組 合。 如請求項1之熱封膜’其中該中間層具有 至 之厚度。 月丨東項1之熱封膜’其中該中間層具有卜⑺6歐姆/□至 1x10 4歐姆/ 口之表面電阻率。 二:求項1之熱封膜,其中該中間層進一步含有佔該中 主之總重量之10重量%至60重量%的聚乙烯。 如《月求項16之熱封膜’其中所有該聚乙稀皆存在於該中 間層中作為聚乙烯亞層。 160811.doc 201244931 18. 如請求項16之熱封膜,其中該聚乙烯具有100,000至 1,000,〇〇〇之重量平均分子量。 19. 如請求項16之熱封膜,其中該聚乙烯具有i g/i〇分鐘至 1〇〇 g/ιο分鐘之熔融指數。 . 20.如請求項16之熱封膜,其中該聚乙烯亞層具有10 μm至 , 30 μηι之厚度。 21·如請求項1或16之熱封膜,其中該熱封層係由選自由聚 (甲基)丙烯酸酯或其共聚物組成之群之材料構成。 22. 如請求項1或16之熱封膜,其中該熱封層進一步含有導 電填充劑,其中該導電填充劑之含量就該整個熱封層之 總重量而言不超過6〇%。 23. 如請求項22之熱封膜,其中該熱封層具有〇 〇1 ^爪至⑺ μηι之厚度。 24_如請求項22之熱封膜,其中該熱封層具有1χ1〇7歐姆/口至 ΙχΙΟ12歐姆/□之表面電阻率。 25. 如請求項22之熱封膜,其中該導電填充劑係選自由以下 組成之群:奈米氧化物、奈米碳管、碳粉末、金屬粉 末,或其混合物。 26. 如請求項21之熱封膜,其中該聚(甲基)丙烯酸酯或聚(甲 ' 基)丙烯酸酯共聚物具有3〇t至90°C之玻璃轉變溫度。 27. 如請求項21之熱封膜,其中該聚(曱基)丙烯酸酿或聚(甲 基)丙烯酸醋共聚物具有至少9〇t之熱活化溫度。 28. 如請求項1之熱封膜,其進一步包括位於該中間層與該 基底層之間之黏著層。 160811 .doc 201244931 29. 如請求们之熱封膜,其進—步包括位於該基底層之與 該中間層相對之表面上之抗靜電塗層。 30. 如明求項29之熱封膜’其中該抗靜電塗層之乾燥膜具有 0.01 μηι至2 μιη之厚度。 31. 如請求項29之熱封膜,其中該抗靜電塗層具有1χΐ〇6歐姆/口 至1χ1012歐姆/□之表面電阻率。 32. -種用於熱封i包括電子元件之載帶之覆蓋_,該覆蓋 帶包括: 如請求項1至31中任一項所定義之基底層; 如請求項1至3 1中任一項所定義之中間層,其係佈置 於該基底層上以用於耗散電荷; 如請求項1至3 1中任一項所定義之熱封層,其係佈置 於該中間層上;及 如請求項29至31中任一項所定義之可選抗靜電塗層, 其係位於該基底層之與該中間層相對之表面上, 該覆蓋帶具有至少75%之平均光學透射率、不超過約 5〇%之光學霧度及不超過約1><10»1之表面電阻率;以便 當將該覆蓋帶熱封至載帶以形成物件時,該覆蓋帶與該 載帶之平均剝離強度為至少20 gf/mm,當該物件經歷不 小於約50 C之溫度及不小於約90%之相對濕度達至少5天 時該剝離強度降低不超過約1 〇〇/〇。 160811.doc201244931 VII. Patent application scope: ^ - A heat sealing film for encapsulating electronic components, comprising: a base layer; i - an intermediate layer provided on the base layer and comprising a mixture of materials The weight percent of the total weight of the intermediate layer comprises: 5% by weight to 7% by weight of the vinyl acetate copolymer, wherein the unit derived from vinyl acetate accounts for more than 10 mol% of the copolymer; 20 weight ❶ /. Up to 90% by weight of the styrene-butadiene copolymer; and up to 40% by weight of the conductive polymer; and at least one heat seal layer' is provided on the surface of the intermediate layer opposite to the base layer. 2. The heat seal film of claim 1, wherein the base layer is composed of a material selected from the group consisting of biaxially stretched 8 days, polyolefin or nylon (ny丨〇n). A heat seal film as claimed in claim 1, wherein the base layer has a thickness of from 1 pm to 3 〇卩m. The heat seal film of claim 1, wherein the base layer has an optical transmittance of not less than 85 Å/〇 and a tensile strength of not less than 50 MPa. . The heat-sealing film of claim 1, wherein in the vinyl acetate copolymer, the unit of the 'vinyl acetate is at least 2% by mole of the copolymer. The heat seal film of the item 1 wherein the styrene-butadiene copolymer is a block copolymer. 7. The heat-sealing film according to any one of claim 16, wherein in the styrene-butadiene 160811.doc 201244931 佛 copolymer, the units derived from the stupid ethylene account for the total number of units of the copolymer. 60 moles. /〇 above. 8. 9. 10. 16. 12. 13. 14. 15. 16. 17. The heat-sealing film of any one of clauses 1 to 6, wherein the styrene-butadiene copolymer has 4 〇, 〇 The weight average molecular weight of 〇〇 to 3〇〇〇〇〇. For example, the heat seal film of the applicant, wherein the vinyl acetate vinegar copolymer accounts for 1 〇 weight / 〇 to 60 weight 〇 / 〇 of the total weight of the intermediate layer. The heat-sealable film of claim 1, wherein the styrene-butadiene copolymer comprises from 3% by weight to 70% by weight of the total weight of the intermediate layer, wherein the conductive polymerization is performed. The matter accounts for 0 to 30% by weight of the total weight of the intermediate layer. The heat seal film of claim 1, wherein the ethyl acetate copolymer is a copolymer of ethylene carbonate and ethylene, such as the heat seal film of claim 1, wherein the conductive polymer is selected from the group consisting of: Polyacetylene, polypyrrole, polythiophene, polyaniline, polylysine based or poly(tetra)amine based intrinsic antistatic polymer' or combinations thereof. The heat seal film of claim 1 wherein the intermediate layer has a thickness of up to . The heat seal film of Yueshangdong 1 wherein the intermediate layer has a surface resistivity of from (7) 6 ohms / □ to 1 x 10 4 ohms / mouth. A heat sealable film according to claim 1, wherein the intermediate layer further contains 10% by weight to 60% by weight of the polyethylene based on the total weight of the main body. For example, "Heat Sealing Film of Monthly Item 16" in which all of the polyethylene is present in the intermediate layer as a polyethylene sublayer. The heat seal film of claim 16, wherein the polyethylene has a weight average molecular weight of from 100,000 to 1,000. 19. The heat seal film of claim 16, wherein the polyethylene has a melt index of from 1 g/i Torr to 1 〇〇 g/ιο minutes. 20. The heat seal film of claim 16, wherein the polyethylene sublayer has a thickness of from 10 μm to 30 μm. The heat seal film of claim 1 or 16, wherein the heat seal layer is composed of a material selected from the group consisting of poly(meth)acrylates or copolymers thereof. 22. The heat seal film of claim 1 or 16, wherein the heat seal layer further comprises a conductive filler, wherein the conductive filler is present in an amount of no more than 6% by weight based on the total weight of the entire heat seal layer. 23. The heat seal film of claim 22, wherein the heat seal layer has a thickness of from ^1^claw to (7)μηι. 24_ The heat seal film of claim 22, wherein the heat seal layer has a surface resistivity of from 1χ1〇7 ohm/port to ΙχΙΟ12 ohm/□. 25. The heat seal film of claim 22, wherein the conductive filler is selected from the group consisting of nano oxides, carbon nanotubes, carbon powder, metal powder, or mixtures thereof. 26. The heat seal film of claim 21, wherein the poly(meth)acrylate or poly(methyl') acrylate copolymer has a glass transition temperature of from 3 Torr to 90 °C. 27. The heat seal film of claim 21, wherein the poly(mercapto)acrylic or poly(meth)acrylic acid vinegar copolymer has a heat activation temperature of at least 9 Torr. 28. The heat seal film of claim 1, further comprising an adhesive layer between the intermediate layer and the base layer. 160811 .doc 201244931 29. The heat seal film of the applicant, further comprising an antistatic coating on a surface of the base layer opposite the intermediate layer. 30. The heat seal film of claim 29, wherein the dry film of the antistatic coating has a thickness of from 0.01 μm to 2 μm. 31. The heat seal film of claim 29, wherein the antistatic coating has a surface resistivity of from 1 χΐ〇 6 ohms/port to 1 χ 1012 ohms/square. 32. A cover for heat sealing i comprising a carrier tape of an electronic component, the cover tape comprising: a base layer as defined in any one of claims 1 to 31; as claimed in any one of claims 1 to 31 The intermediate layer defined by the item, wherein the intermediate layer is disposed on the base layer for dissipating the charge; the heat seal layer as defined in any one of claims 1 to 31, which is disposed on the intermediate layer; An optional antistatic coating as defined in any one of claims 29 to 31, which is located on a surface of the substrate layer opposite the intermediate layer, the cover tape having an average optical transmittance of at least 75%, An optical haze of more than about 5% and a surface resistivity of no more than about 1 <10»1; such that when the cover tape is heat sealed to the carrier tape to form an article, the coverage tape and the average of the carrier tape The peel strength is at least 20 gf/mm, and the peel strength is reduced by no more than about 1 〇〇/〇 when the article experiences a temperature of not less than about 50 C and a relative humidity of not less than about 90% for at least 5 days. 160811.doc
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