JPH09111207A - Cover tape for carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a cover tape stable in release strength, slight in zipping up and excellent in antistatic properties. SOLUTION: In this cover tape 1 heat-sealable to a carrier tape, a cover material is obtained by successively laminating a complex substrate sheet 2 obtained by bonding biaxially orientated films 21 and 22 through an adhesive layer 7 to an intermediate layer 5, a heat sealant layer 6 and a static electricity diffusing layer 8 consisting essentially of a bisammonium-based sulfur semiconductor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a synthetic resin container for accommodating various industrial parts, for example, a carrier tape for accommodating a semiconductor element in a pocket portion of a recess formed in the carrier tape, covering the accommodating portion and heat sealing. The cover tape is easy to open and peel when mounted on electronic parts,
Moreover, it belongs to a cover tape with stable peel strength.

[0002]

The material of a synthetic resin container for accommodating various industrial parts, such as a carrier tape, is usually one in which sheets of polyvinyl chloride, polystyrene, polyester, polycarbonate, etc. can be easily formed. Further, the cover tape is composed of a laminated body in which a heat sealant layer is provided on one surface of the film. The carrier tape or cover tape is designed to prevent the electronic components from being deteriorated or destroyed due to static electricity generated when the stored electronic components come into contact with the carrier tape pocket or the cover tape, or when the cover tape is peeled off. It is required to have not only static electricity generation prevention means but also transparency that allows the contents to be visually observed. Also, the lid material can be easily peeled off to take out the stored electronic components,
Further, during peeling operation, it is required to prevent electronic components from vibrating due to variations in peeling strength and from jumping out of the carrier tape. An object of the present invention is to provide a cover tape having stable peelability and an excellent antistatic effect.

[0003]

In order to solve the above problems, the cover tape of the present invention is a cover tape which can be heat-sealed to a carrier tape, wherein the cover tape comprises a stretched film having two or more layers and an adhesive layer. The composite base material sheet, the intermediate layer, the heat silane layer, and the static electricity diffusion layer containing a bisammonium-based sulfur semiconductor as a main component are laminated in this order. The adhesive layer to which the stretched film is attached is polyester, polyether, urethane resin, ethylene / vinyl acetate copolymer, acrylic resin, epoxy resin, or a modified product thereof. In addition, the intermediate layer has a density of 0.915 to
0.940 g / cm ³ (hereinafter density unit g / cm ³ is omitted) of ethylene / α-olefin copolymer (hereinafter E ・
O copolymer), styrene 50-90 wt% and butadiene 50-10 wt% styrene / butadiene block copolymer (hereinafter referred to as S / B copolymer regardless of ratio), styrene 10 To 50% by weight and butadiene 90 to 50% by weight, a hydrogenated product of a styrene / butadiene block copolymer (hereinafter referred to as an S / B copolymer hydrogenated product) and a high-impact polystyrene (hereinafter referred to as HIP).
S)) and at least EO copolymer and S
-A cover tape formed of three or more kinds of resins including a B copolymer. The intermediate layer has a single-layer structure and has a density of 0.915 to 0.940 and an EO copolymer 30 to 70.
Wt%, styrene 50-90 wt% and butadiene 50
10 parts by weight of styrene and 10 parts by weight of styrene are added to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of S / B copolymer.
~ 50 wt% and butadiene 90 to 50 wt% S ・ B
A cover tape formed of a resin composition containing 5 to 30 parts by weight of a hydrogenated copolymer and 5 to 50 parts by weight of HIPS. Further, the intermediate layer has a single layer structure, and the EO copolymer 30 having a density of 0.915 to 0.940.
10 to 50 parts by weight of styrene to 50 parts by weight of styrene, 50 to 90% by weight of styrene, and 70 to 30% by weight of S / B copolymer of 50 to 10% by weight of butadiene. % And butadiene 90 to 50% by weight, a cover tape formed of a resin composition containing 5 to 30 parts by weight of an S.B copolymer hydrogenated product. The intermediate layer has a single layer structure and has a density of 0.915 to
Resin composition 100 consisting of 0.9-40 E / O copolymer 30-70 wt% and S-B copolymer 70-30 wt% of styrene 50-90 wt% and butadiene 50-10 wt%. It is a cover tape formed of a resin composition in which 5 to 50% by weight of HIPS is added to parts by weight. Further, the intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer is made of EO having a density of 0.915 to 0.940.
The second resin layer is formed of a copolymer and has a density of 0.9.
15 to 0.940 EO copolymer 30 to 70% by weight
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
10 to 50 parts by weight of styrene with respect to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of S / B copolymer and 70% by weight of S / B copolymer.
It is a cover tape formed of a resin composition to which 5 to 30 parts by weight of an S / B copolymer hydrogenated product of 90% to 50% by weight of butadiene is added. In addition, the intermediate layer has a two-layer structure of a first resin layer and a second resin layer that is in contact with the heat silane layer, and the first resin layer has an EO co-weight of 0.915 to 0.940. The second resin layer is formed of a united body and has a density of 0.915 to 0.940.
-O copolymer 30 to 70% by weight and styrene 50 to 90
10 to 50% by weight of styrene and 90% of butadiene to 100 parts by weight of a resin composition comprising 70 to 30% by weight of an S / B copolymer of 50% by weight and 50 to 10% by weight of butadiene.
HIPS5 to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of S / B copolymer and 50 to 50% by weight.
It is a cover tape formed of a resin composition to which 50 parts by weight is added. Further, the intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.
940 E / O copolymer, and the second resin layer has an E / O copolymer density of 0.915 to 0.940.
10 to 50 parts by weight of styrene with respect to 100 parts by weight of a resin composition consisting of 0 to 70% by weight, 50 to 90% by weight of styrene, 50 to 10% by weight of butadiene and 70 to 30% by weight of an S / B copolymer. % And butadiene 90 to 50% by weight, S / B copolymer hydrogenated product 5 to 30 parts by weight, and HIPS 5 to
It is a cover tape formed of a resin composition to which 50 parts by weight is added. The intermediate layer has a three-layer structure including a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.
915 to 0.940 EO copolymer,
The second resin layer is made of EO having a density of 0.915 to 0.940.
S / B copolymer 7 of 30-70% by weight of copolymer, 50-90% by weight of styrene and 50-10% by weight of butadiene
The third resin layer comprises 30 to 70% by weight of an EO copolymer having a density of 0.915 to 0.940, 50 to 90% by weight of styrene, and butadiene. S.B copolymer 70 to 30 with 50 to 10% by weight
10 to 50% by weight of styrene and 90 to 50% by weight of butadiene with respect to 100 parts by weight of the resin composition composed of 100% by weight.
Is a cover tape formed of a resin composition to which 5 to 30 parts by weight of an S.B copolymer hydrogenated product is added.
Also, the intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.940. E
The second resin layer is formed of an O copolymer, and the second resin layer has a density of 0.915 to 0.940, an E / O copolymer of 30 to 70% by weight, styrene of 50 to 90% by weight, and butadiene of 50 to 90% by weight.
10% by weight of the S / B copolymer and 70 to 30% by weight of the resin composition, and the third resin layer has a density of 0.91.
5 to 0.940 EO copolymer 30 to 70% by weight,
Resin in which 5 to 50 parts by weight of HIPS is added to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of an S / B copolymer of 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene. It is a cover tape formed of the composition. Also, the intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to
Formed of an E.O copolymer of 0.940,
The resin layer is composed of 30 to 70% by weight of an E / O copolymer having a density of 0.915 to 0.940, and an S / B copolymer of 30 to 70% by weight of styrene of 50 to 90% by weight and butadiene of 50 to 10% by weight.
% Of the resin composition, and the third resin layer has a density of 0.915 to 0.940 and an EO copolymer 30.
10 to 50 parts by weight of styrene to 50 parts by weight of styrene, 50 to 90% by weight of styrene, and 70 to 30% by weight of S / B copolymer of 50 to 10% by weight of butadiene. % And butadiene 90 to 50% by weight, S / B copolymer hydrogenated product 5 to 30 parts by weight, and HIPS 5 to
It is a cover tape formed of a resin composition to which 50 parts by weight is added. The intermediate layer has a density of 0.9.
15 to 0.940 EO copolymer 30 to 70% by weight
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
A cover tape formed of a resin composition composed of 70% by weight of the S / B copolymer and 70% by weight of the S / B copolymer.
The intermediate layer has an E · E density of 0.915 to 0.940.
It is a cover tape formed of a resin composition comprising 30 to 70% by weight of an O copolymer, 10 to 50% by weight of styrene, and 90 to 50% by weight of butadiene, an S.B copolymer hydrogenated product. The intermediate layer has a glass transition temperature of 40.
It is a cover tape formed of a linear saturated polyester having a temperature exceeding ℃. The heat sealant layer is a cover tape containing at least one of polyester, polyurethane, vinyl chloride / vinyl acetate copolymer, and acrylic resin. The electrostatic diffusion layer is a cover tape having a surface resistivity in the range of 10 ⁵ to 10 ¹² Ω / □ and a 99% charge decay time of 2 seconds or less. Further, the cover tape of the present invention has a total light transmittance of 75% or more and a haze value of 50% or less.

[0004]

2. Description of the Related Art Conventionally, as a means for preventing static electricity from occurring in a cover tape of a carrier tape, kneading conductive carbon black fine particles and metal fine particles into the carrier tape or applying a coating liquid containing them has been carried out. ing. In addition, as a means for preventing static electricity generation in the cover tape, an antistatic agent such as a surfactant, conductive carbon black fine particles, and metal fine particles are kneaded into the heat sealant layer that is in direct contact with the electronic component, or a coating containing them is applied. Liquid is applied and the like.

As a means for preventing the carrier tape from generating static electricity, conductive carbon fine particles, conductive fine powders such as metal oxides, and metal fine particles are kneaded and applied to the carrier tape. Further, as means for preventing static electricity generation of the carrier tape, an antistatic agent such as a surfactant, a metal oxide-based conductive fine powder, or a metal fine particle is kneaded or applied to the heat sealant layer that is in direct contact with the electronic component. Is being done. In particular, the heat sealant layer mixed with fine powder of conductive metal oxide (tin oxide, zinc oxide) has been relatively well utilized for transparency.

However, the conductive carbon black fine particles and metal fine particles as the antistatic agent contained in the above-mentioned carrier tape and cover tape reduce the transparency of the sheet, and it is difficult to confirm the stored electronic components from the outside. There was a problem. Further, when a surfactant is applied, the antistatic property of the surfactant has humidity dependency,
In a low-humidity environment, there is a problem that the anti-electrostatic brain is not sufficiently prevented and electronic components are destroyed.

Further, the heat-sealing of the cover tape and the carrier tape is required to have a predetermined strength so that the cover tape does not peel off and the electronic parts fall off during transportation and storage. However, if the heat seal strength is too high,
When peeling the cover tape in the mounting process of electronic parts,
There is a problem that the carrier tape vibrates and an electronic component pops out of the pocket of the carrier tape. Therefore, the cover tape is required to be heat-sealed to the carrier tape with sufficient strength and to have good peelability when mounting an electronic component. There is a problem that it is extremely difficult to adjust the heat sealing strength under the conditions such as heat sealing temperature, time and pressure. Further, even if the peel strength is appropriate, if the difference between the maximum and minimum peel strengths (hereinafter referred to as zip-up) is large, there was a problem that the carrier tape would vibrate or the stored electronic parts would pop out. .

The cover tape of the present invention comprises a heat sealant layer and an electrostatic diffusion layer containing a bisammonium-based sulfur semiconductor as a main component on the heat-sealing surface.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION As shown in FIG. 1, the cover tape of the present invention comprises a cover tape 1 which can be heat-sealed to a carrier tape, and a stretched film composed of two layers of the cover tape with an adhesive layer 3 interposed therebetween. The laminated composite base sheet 2, the intermediate layer 5, the heat sealant layer 6, and the static electricity diffusion layer containing a bisammonium-based sulfur semiconductor as a main component are sequentially laminated.

The stretched film of the present invention is a uniaxially or biaxially stretched film having a thickness of 3 to 25 μm formed from a polyester such as polyethylene terephthalate or polyethylene naphthalate, a polyolefin such as polypropylene, a polyamide such as nylon or a thermoplastic resin such as polycarbonate. It is a film. Then, in order to strengthen and stabilize the adhesive strength with the adhesive layer, the side in contact with the adhesive layer may be subjected in advance to a surface treatment such as corona discharge treatment, plasma treatment, or sandblast treatment, if necessary. Further, a surfactant or the like may be kneaded in and subjected to a charging treatment.

Then, the composite base sheet is formed by compounding the above-mentioned two-layer film of the same kind or different kinds, preferably via the curing reaction type adhesive layer. The thermosetting adhesive layer of the present invention is mainly composed of polyester resin, polyether resin, urethane resin, vinyl copolymer, ethylene / acrylic resin, polythiol, epoxy resin, etc. As tolylene diisocyanate, 4,4 ^, -diphenylmethane diisocyanate,
Hexamethylene diisocyanate, isophorone diisocyanate, xylene diisocyanate, naphthylene-
Examples include 1,5 diisocyanate and polyamine.

As the ionizing radiation curable resin, a composition in which a prepolymer, an oligomer and / or a monomer having a polymerizable unsaturated bond or an epoxy group in the molecule is appropriately mixed is used. Examples include urethane acrylate and polyester acrylate.

The application of the adhesive layer and the lamination of the base layer and the intermediate layer can be carried out by ordinary dry lamination. The method of applying the adhesive layer does not matter, such as gravure coating and roll coating. The thickness of the reaction-curable adhesive layer is a factor that imparts rigidity to the cover tape, and is 1 to 10 g / m ² (solid content, the same applies hereinafter), preferably ² to 5 g / m ² . 2 g / m
^If it is ² or less, the adhesive strength cannot be made uniform, and 10 g /
The adhesive layer of m ² or more is not only disadvantageous in terms of price, but also has high rigidity and may cause cracks in the cover tape. Further, the thick adhesive layer may impair the heat sealability at low temperature.

In the composite base sheet, the cover tape is heat-melted by a heat-sealing bar which comes into contact when the cover tape is heat-sealed to the carrier tape by the combined action of the heat-resistant stretched film and the reaction-curable adhesive layer. It is possible to impart heat resistance such as heat shrinkage.

The composite substrate sheet formed by two or more layers of stretched film with the adhesive layer interposed between them has a higher rigidity as a sheet due to the action of the reaction type adhesive layer than that of a single layer, and has a peeling angle. It can be presumed that the zip-up, which is the range between the maximum value and the minimum value at the time of peeling, can be made stable and that the zip-up can be reduced.

Further, in the case of a single layer, the rigidity can be increased by increasing the thickness of the stretched film, but the increase in the thickness makes it impossible to transmit the heat quantity required by the heat sealant layer and it is necessary to set the temperature of the heat seal bar high. is there. Therefore, the carrier tape having poor heat resistance is deformed or dimensionally changed, which causes a change in position when the electronic component is mounted.

Although not shown in the drawing, the composite base material sheet may have five or more layers including an adhesive layer composed of three or more stretched films. The total thickness can be appropriately set depending on the purpose of use, but is 6 to 100 μm, preferably 20 to
45 μm.

On the surface opposite to the heat sealant layer of the composite substrate sheet, that is, on the outermost surface, if necessary, a conductive fine powder such as a surfactant, conductive carbon black, metal vapor deposition, metal oxide, etc. It is possible to prevent the adhesion of dust, dust, etc. on the surface of the base material sheet 2 or to prevent the generation of static electricity due to contact with another surface by applying an antistatic treatment using the above.

The composite base material sheet and the intermediate layer are formed by dry lamination through the above-mentioned reactive adhesive layer, or the composite base material sheet provided with the AC layer is melted into a single layer or a multilayer. It can be provided by extrusion coating. Generally, by using a thermoplastic resin as an adhesive resin provided between the composite base sheet and the intermediate layer, heat and pressure during heat sealing can be made uniform. As the adhesive resin, either a single substance or a blend of modified products such as polyethylene, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / acrylic acid ester copolymer, ionomer and polypropylene is used. It can be provided by melt extrusion coating or sandwich lamination, and its thickness is 60 μm or less.

An anchor coat layer (referred to as an AC layer in this specification) used for melt extrusion coating in order to strengthen the adhesion between the composite base sheet and the adhesive resin which is a thermoplastic resin when the adhesive resin is provided. Is preferably provided. As the AC layer, an ordinary one such as an isocyanate type or a polyethyleneimine type can be used, but by using a reaction-curable adhesive as the AC layer, it is possible to obtain the effect of increasing the rigidity of the entire cover tape.

If the thickness of the adhesive resin exceeds 60 μm, the heat conductivity of the cover tape is lowered and it becomes necessary to set the heat seal bar temperature high, which is not preferable.

The intermediate layer of the present invention functions as a cushion for uniformly adhering both sheets when the cover tape is heat-sealed with the carrier tape. At the same time, when peeling the heat-sealed cover tape from the carrier tape, interlayer peeling can be performed between the intermediate layer 5 and the heat sealant layer 4 as shown in FIGS.
The adhesive strength between the intermediate layer 5 and the heat sealant layer 6 is regulated. The intermediate layer 5 may have a single-layer structure or a multi-layer structure, and can be formed by combining two or more kinds of thermoplastic resins. In addition, a single layer or multiple layers can be formed by a normal film forming method such as an inflation method using a circular die and a casting method using a T die.

As the resin used for the intermediate layer, any of a single polymer, a copolymer and a polymer alloy can be used, but the adhesive strength (peel strength) with the heat sealant layer is regulated, and the carrier tape and the cover tape are used. It can be selected from those having a cushioning effect when heat-sealing and. For example, polyester, polyethylene, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / acrylic ester copolymer, ionomer, ethylene / propylene rubber, polypropylene, polyethylene, S / B copolymer , S
It can be formed of a B copolymer hydrogenated product and a polymer alloy made of two or more resins containing at least polyethylene and an S · B copolymer among HIPS.

The intermediate layer having a single layer structure will be described. The intermediate layer is an EO copolymer having a density of 0.915 to 0.940,
Among S / B copolymers of 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene, hydrogenated S / B copolymers of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene, and HIPS At least E / O copolymer and S / B
It can be formed of three or more resins including a copolymer. The EO copolymer used for forming the intermediate layer is a copolymer of ethylene and, for example, butene, pentene, hexene, heptene, octene, 4-methylpentene-1. The density of such an EO copolymer is 0.91.
When it is less than 5 or more than 0.940, the film forming property of the intermediate layer due to the combination with the S / B copolymer is deteriorated, which is not preferable.

If the amount of styrene constituting the S / B copolymer forming the intermediate layer is less than 50% by weight, the tackiness of the film is increased, making it difficult to handle. The adhesive strength with the heat sealant layer may decrease.

The mixing ratio of the E / O copolymer and the S / B copolymer in the intermediate layer has a great influence on the peel strength when peeling after heat-sealing the carrier tape and the transparency of the cover tape. . In the present invention, the mixing ratio of the E / O copolymer and the S / B copolymer in the intermediate layer is 30 to 70% by weight of the E / O copolymer and 70 to 30% by weight of the S / B copolymer.
Is preferred. E / O copolymer is less than 30% by weight, S / B
When the amount of the copolymer exceeds 70% by weight, not only the film-forming property of the intermediate layer is deteriorated but also the transparency is deteriorated, the adhesive strength between the intermediate layer and the heat sealant layer is increased, and the peel strength of the cover tape is increased. This is not preferable because it exceeds the aptitude value. On the other hand, when the E / O copolymer is more than 70% by weight and the S / B copolymer is less than 30% by weight, the adhesive strength between the intermediate layer and the heat sealant layer is small, and the peeling property is suitable as a cover tape. It is less than the strength, which is not preferable.

S / B copolymer hydrogenated product and HIP are used for the intermediate layer.
When molding with four kinds of resins using S, 100 parts by weight of a resin composition comprising 30 to 70% by weight of the EO copolymer and 70 to 30% by weight of the S / B copolymer as described above. To styrene 10 to 50% by weight and butadiene 90 to
It is preferable to add 5 to 30 parts by weight of the hydrogenated S.B copolymer with 50% by weight and 5 to 50 parts by weight of HIPS.

If the amount of hydrogenated S / B copolymer added exceeds 30 parts by weight, the resulting intermediate layer is apt to cause blocking, which is not preferable. When the S / B copolymer hydrogenated product is not actually a hydrogenated product, this copolymer has a high butadiene content and is easily oxidized, resulting in a gelled polymer that was polymerized during the formation of the intermediate layer. It is easy to generate things. Further, when a non-aqueous additive is used instead of the hydrogenated S / B copolymer, the film forming accuracy may be poor and the film may not be formed.

If the amount of HIPS added exceeds 5 parts by weight,
The transparency of the intermediate layer deteriorates, which is not preferable.

The above-mentioned intermediate layer is composed of EO copolymers 30 to 7
3 kinds of the S / B copolymer hydrogenated product of less than 30 parts by weight were added to 100 parts by weight of the resin composition consisting of 0% by weight and 70 to 30% by weight of the S / B copolymer. You may form by the resin composition containing resin. Further, with respect to 100 parts by weight of a resin composition composed of 30 to 70% by weight of an E / O copolymer and 70 to 30% by weight of an S / B copolymer, only 5 to 50 parts by weight of HIPS is used. Add 3 parts by weight
It may be formed from a resin composition containing a seed resin.

The intermediate layer of the single layer structure of the present invention has, in addition to the above constitution, 30 to 70% by weight of an EO copolymer having a density of 0.915 to 0.940, 50 to 90% by weight of styrene and butadiene. It can be formed from a resin composition composed of 50 to 10% by weight and 70 to 30% by weight of an S / B copolymer.
In this case, if the amount of styrene constituting the S / B copolymer used is less than 50% by weight, the film becomes more tacky and difficult to handle, and if it exceeds 90% by weight, the adhesion of the heat sealant layer at low temperatures is increased. It is not preferable because the strength is lowered. The mixing ratio of the E / O copolymer and the S / B copolymer in the intermediate layer has a great influence on the peel strength and the transparency when peeling after the cover tape is heat-sealed on the carrier tape. is there. Less than 30% by weight of EO copolymer and 70% by weight of S / B copolymer
When it exceeds, the film-forming property and transparency of the intermediate layer are deteriorated, and the transparency of the cover tape is also impaired. Further, the adhesive strength between the intermediate layer and the heat sealant layer is too large, and the peel strength of the cover tape exceeds the appropriate value, which is not preferable. On the other hand, EO copolymer exceeds 70% by weight, and S ・ B
When the content of the copolymer is less than 30% by weight, the adhesive strength between the intermediate layer and the heat sealant layer is small, and the peel strength of the cover tape becomes less than the appropriate value, which is not preferable.

The single-layered intermediate layer of the present invention has a density of 0.9
15 to 0.940 E / O copolymer 30 to 70% by weight, styrene 70 to 30% by weight, and butadiene 90 to 50% by weight S / B copolymer hydrogenated product 90 to 10% by weight It can be composed of a resin composition.

In this case, the density of the EO copolymer is 0.9.
If it is less than 15 or more than 0.940, the film-forming property of the intermediate layer due to the combination with the hydrogenated S.B copolymer is deteriorated, which is not preferable. Also, S / B to be used
When the amount of styrene constituting the copolymer hydrogenated product is less than 10% by weight, tackiness of the film is increased and blocking is likely to occur, and when it exceeds 50% by weight, adhesion to the electrostatic diffusion layer at low temperature is poor. It is not preferable. The hydrogenated product has good compatibility with the EO copolymer and gives the intermediate layer flexibility and transparency. The mixing ratio of the E / O copolymer and the hydrogenated S / B copolymer in the intermediate layer depends on the peel strength after heat-sealing the carrier tape and the cover tape and the transparency of the intermediate layer. It has a great influence. That is, E
When the O copolymer content is less than 30% by weight and the S / B copolymer hydrogenation content exceeds 70% by weight, the film forming property of the intermediate layer becomes poor and the transparency also deteriorates. On the other hand, when the E / O copolymer is more than 70% by weight and the S / B copolymer hydrogenated product is less than 30% by weight, the adhesive strength between the intermediate layer and the heat sealant layer is weak, and the cover tape is peeled off. The strength may be below the appropriate value, which is not preferable.

The intermediate layer of the present invention has a glass transition temperature of 40.
It can also be formed from a linear saturated polyester having a temperature of at least ° C. Examples of the linear saturated polyester having a glass transition temperature of 40 ° C. or higher include alcohol components such as ethylene glycol, propylene glycol, 1,4-butanediol, and 1,4-cyclohexanedimethanol, and aliphatic components such as adipic acid and sebacic acid. It is a polyester obtained by dicarboxylic acid or the like with an aromatic dicarboxylic acid such as dicarboxylic acid, terephthalic acid, isophthalic acid, or diphenylcarboxylic acid. Specifically, a co-condensation polymer of ethylene glycol and terephthalic acid, ethylene glycol and isophthalic acid and terephthalic acid, 1,4 cyclohexanedimethanol and ethylene glycol and terephthalic acid, and propylene glycol and terephthalic acid and isophthalic acid are used. To do. Further, the glass transition temperature is set to 40 ° C. or higher because the environmental condition for using the cover tape does not reach 40 ° C.

The intermediate layer of the above single layer structure has a thickness of 10 to 100 μm.
A thickness of m is preferred. If the thickness is less than 10 μm, the film-forming property is poor, and if it exceeds 100 μm, the heat-sealing property of the cover tape deteriorates.

The intermediate layer 5 of the present invention may have a multi-layered structure, and FIG. 2 is a schematic view showing a cross section of a cover tape having a two-layered structure, which comprises a first resin layer 51 and a second resin layer 52. It constitutes the intermediate layer 5.

In this case, the first resin layer is an EO copolymer having a density of 0.915 to 0.940 which facilitates film formation, and the second resin layer
The resin layer is an S / B copolymer 70-3 containing 30-70% by weight of an E / O copolymer having a density of 0.915-0.940, 50-90% by weight of styrene, and 50-10% by weight of butadiene.
A resin composition in which 5 to 30 parts by weight of an S / B copolymer hydrogenated product of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene is added to 100 parts by weight of a resin composition consisting of 0%. It can be formed from a thing. Further, the second resin layer is an EO copolymer 30 having a density of 0.915 to 0.940.
5 to 5 parts by weight with respect to 100 parts by weight of a resin composition consisting of 70 to 70% by weight, 70 to 30% by weight of an S / B copolymer of 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene.
It can also be formed from a resin composition containing 0 parts by weight of HIPS. The second resin layer has a density of 0.9.
Resin composition comprising 30 to 70% by weight of an E / O copolymer of 15 to 0.940, 50 to 90% by weight of styrene, and 50 to 30% by weight of an S / B copolymer of 50 to 10% by weight of butadiene. Resin composition obtained by adding 3 to 30 parts by weight of an S / B copolymer hydrogenated product of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene and 5 to 50 parts by weight of HIPS to 100 parts by weight. Can be formed by.

The first resin layer and the second resin layer can each be formed to a thickness of 5 to 60 μm.

FIG. 3 is a schematic cross-sectional view showing an example of the cover tape of the present invention in which the intermediate layer 5 has a three-layer structure. The intermediate layer 5 has the first resin layer 51 and the second resin layer 52 interposed therebetween. And a third resin layer 53 that is in contact with the heat sealant layer 6.

In this case, the first resin layer is made of an E.O copolymer having a density of 0.915 to 0.940 which facilitates film formation, and the second resin layer has a density of 0.915 to 0.940. E
O-copolymer 30-70% by weight, styrene 50-90% by weight, butadiene 50-10% by weight S-B copolymer 70-30% by weight composition and different from the third resin layer E having a composition and a density of 0.915 to 0.940
-O copolymer 30 to 70% by weight and styrene 50 to 90
10 to 50% by weight of styrene and 90% of butadiene to 100 parts by weight of a resin composition comprising 70 to 30% by weight of an S / B copolymer of 50% by weight and 50 to 10% by weight of butadiene.
˜50 wt%, 5 to 30 parts by weight of the S / B copolymer hydrogenated product, and 5 to 50 parts by weight of HIPS.

The third resin layer has a density of 0.915 to 0.9.
40 EO copolymer 30-70 wt% and styrene 50
S-B of ~ 90 wt% and butadiene 50-10 wt%
Resin composition 100 comprising 70 to 30% by weight of copolymer
It can be formed from a resin composition to which 5 to 30 parts by weight of an S / B copolymer hydrogenated product of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene is added, based on parts by weight. In addition, the third resin layer has a density of 0.915 to 0.94.
30% to 70% by weight of EO copolymer of 0 and styrene 50
S-B of ~ 90 wt% and butadiene 50-10 wt%
Resin composition 100 comprising 70 to 30% by weight of copolymer
It can also be formed from a resin composition in which 5 to 50 parts by weight of HIPS is added to parts by weight. Furthermore, an EO copolymer having a density of 0.915 to 0.940, 30 to 70
% By weight, 50 to 90% by weight of styrene and 50 to 50% by weight of butadiene
Styrene 10 to 10 parts by weight with respect to 100 parts by weight of the resin composition consisting of 70 to 30% by weight of the S / B copolymer.
It can be formed by a resin composition in which 5 to 30 parts by weight of an S.B copolymer hydrogenated product of 50% by weight and 90 to 50% by weight of butadiene and 5 to 50 parts by weight of HIPS are added.

Then, the first resin layer, the second resin layer and the third resin layer
Each of the resin layers can be formed with a thickness in the range of 3 to 30 μm. An adhesive layer may be provided on one surface of the composite base sheet and dry laminated with an intermediate layer prepared in another step, or an adhesive resin may be extrusion-coated through an AC layer to form a sandwich lamination. .

In the cover tape of the present invention, by providing a heat sealant layer on the intermediate layer, when the cover tape heat-sealed on the carrier tape is peeled off, as shown in FIG. 6, the intermediate layer 5 and the heat sealant layer 6 are formed. Is a preferred form of peeling that occurs between the layers. That is, FIG.
The heat seal portion 10 is attached to the carrier tape 11 shown in FIG.
When the cover tape 1 provided with is peeled off, it is peeled off between the intermediate layer 5 and the heat sealant layer 6 as shown in FIG. The peel strength in this case is weaker than the adhesive strength between the heat sealant layer 6 and the electrostatic diffusion layer 8, the adhesive strength between the electrostatic diffusion layer and the electrostatic diffusion layer and the carrier tape, and is 100 to 1200 g / 15 m.
It is preferably in the range of m. Peel strength is 100g /
If it is less than 15 mm, there is a risk that the interlayer may be peeled off between the intermediate layer and the heat sealant layer when the container in which the cover tape is heat-sealed is transferred, and the contents may fall off.
If the peel strength exceeds 1200 g / 15 mm, the pocket of the carrier tape may vibrate when the cover tape is peeled off, and the contents may pop out, which is not preferable.
The above peel strength is a peel angle of 180 ° and a peel speed of 300 mm / min at 23 ° C. and 40% relative humidity.
It is the value measured in. (Hereinafter, unless otherwise specified, the values measured under the above conditions are described in this specification). The zip-up is preferably 30 g or less when measured with a width of 2 mm. When the weight is 30 g or more, when the cover tape is peeled from the carrier tape, the carrier tape may vibrate and the contents may pop out.

As described above, delamination between the intermediate layer and the heat sealant layer can be achieved by sufficiently heating and pressing. For example, the heating temperature is 130 to 200 ° C., the heating time is 0.3 to 2.0 seconds, and the pressurization is 0.73 to 3.0 k.
It is about gf / cm ² . This peel strength after peeling 180 degrees is weaker than the heat seal strength between the heat sealant layer and the carrier tape, and is 100 to 1200 g /
It is preferably in the range of 15 mm. Peel strength is 1
If it is less than 00 g / 15 mm, there is a risk that the content may fall off due to separation between the intermediate layer and the heat sealant layer during storage and transfer of the content. The peel strength is 1
If it exceeds 200 g / 15 mm, the carrier tape may vibrate when the cover tape is peeled off and the contents may pop out, which is not preferable.

Since the cover tape of the present invention peels between the intermediate layer and the heat sealant layer, it does not change depending on the heat sealing conditions. Therefore,
Heat sealing between the cover tape and the carrier tape can be performed by sufficiently heating, and stable heat sealing strength and peel strength can be obtained.

The heat sealant layer of the cover tape of the present invention is composed of a thermoplastic resin made of at least one of polyester, polyurethane, vinyl chloride / vinyl acetate copolymer and acrylic resin, and conductive fine particles described later. ing. As a combination of two or more thermoplastic resins, for example, a mixture of polyurethane and vinyl chloride / vinyl acetate copolymer having a mixing ratio of 9: 1 to 4: 6, and a mixing ratio of 5: 5 to 9.5. : A mixture of a polyester and a vinyl chloride / vinyl acetate copolymer of 0.5, or an acrylic resin and a vinyl chloride / vinyl acetate copolymer of a mixing ratio of 5: 5 to 9.5: 0.5 A mixture etc. can be mentioned. When the intermediate layer is made of linear saturated polyester having a glass transition temperature of 40 ° C. or higher, it is preferable to use a mixture of polyurethane and a vinyl chloride / vinyl acetate copolymer.

The static electricity diffusion layer provided in the heat sealant layer of the present invention contains a bisammonium-based sulfur semiconductor as a main component. Then, a solution obtained by kneading with a thermoplastic resin or a thermoplastic elastomer, dispersing with a resin varnish, or dispersing as a simple substance in (water / isopropyl alcohol) is provided by melt extrusion coating, roll coating, spraying, or the like. be able to. The thickness of the electrostatic diffusion layer in the present invention is 0.01 to 30 μm, preferably 0.05 to 2 μm.

The bisammonium-based sulfur semiconductor used in the present invention is a bond represented by the following general formula 1.

[0049]

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[0050]

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[0051]

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[0052]

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[0053]

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[0054]

[Chemical 6]

The surface resistivity of the static electricity diffusion layer shown in (Chemical formula 1) to (Chemical formula 6) is in the range of 10 ⁵ to 10 ¹² Ω at 22 ° C. and 60% relative humidity, and 23 ± 5.
5000V to 99 at ℃ and relative humidity of 12 ± 3%
It has excellent electrostatic characteristics with a charge decay time of 2 seconds or less required to decay. When the surface resistivity exceeds 10 ¹² Ω, the static electricity diffusion effect is extremely reduced, making it difficult to protect electronic components from electrostatic breakdown. Also, 10 ⁵
If it is less than Ω, there is a risk of electrical damage by externally energizing the electronic component through the cover tape. For the surface resistivity and the charge decay time, the numerical values measured under the above conditions are described below. Further, the above numerical values are measured according to MIL-B91705C in the United States.

Since the cover tape of the present invention is peeled between the intermediate layer and the heat sealant layer, it can be heat-sealed with the carrier tape without depending on the conditions, and exhibits stable peelability. Such delamination will be described in detail with reference to FIGS. First, the carrier tape 1 having the pockets 12 shown in FIGS.
1, the cover tape 1 shown in FIG. 1 is heat-sealed. In this heat seal, linear heat seal portions 10 having a predetermined width are provided at both ends of the pocket 12. Cover material 1 in this state
The adhesive strength between the intermediate layer 5 and the electrostatic diffusion layer 8 is 100 to 1
The range is 200 g / 15 mm, which is smaller than the adhesive strength between the heat sealant layer 6 and the electrostatic diffusion layer 8 or the adhesive strength between the electrostatic diffusion layer 8 and the carrier tape 11. Next, when the cover tape 1 is peeled from the carrier tape 11, the heat sealant layer 6 and the electrostatic diffusion layer 8 remain heat-sealed to the carrier tape 11 in the linear heat seal portion 10, and the intermediate layer 5 and the heat sealant layer 6 and 6 are peeled off. Therefore, the cover tape 1 is peeled off with the linear heat seal portion 10 of the heat sealant layer 6 and the static electricity diffusion layer 8 left on the carrier tape. That is, the cover tape 1 of the present invention has both the stable heat-sealing property with respect to the carrier tape 11 and the contradictory characteristics of easy peeling. Further, since the composite base material sheet 2 is composed of a multilayer stretched film, zip-up at the time of peeling is small and stable peeling is possible.

The material of the carrier tape to which the cover tape of the present invention is applied is polyvinyl chloride, polystyrene, polyester (A-PET, PEN, PET-G,
PCTA), polypropylene, polycarbonate, polyacrylonitrile, ABS and the like. Then, as an antistatic measure, conductive carbon black fine particles, metal fine particles, conductive fine powder made of metal oxide having conductivity, an organic silicon compound, or a surfactant is kneaded or a coating containing these is applied. There is something to do. In addition, a polystyrene-based or ABS-based resin sheet may be a multilayer sheet in which carbon black-containing polystyrene-based or ABS-based resin is integrally laminated by coextrusion on one or both sides, or a plastic sheet on which a conductive polymer is formed. To be Alternatively, as the conductive treatment, a plastic sheet having a conductive polymer formed on its surface can be used.

Next, the cover tape of the present invention will be described in more detail with reference to specific examples. (Experimental Example 1) As shown in FIG. 1, a biaxially stretched polyester film 21 having a thickness of 12 μm and a biaxially stretched polyester film 22 having a thickness of 6 μm (both are
Spett 6140 Toyobo Co., Ltd. product name]
Takelac A 515 as a curing agent Takenate A-50
[Takeda Pharmaceutical Co., Ltd. product name] was provided on the adhesive layer 7 and dry laminated to prepare a composite substrate sheet 2. The following were used as the constituent material of the intermediate layer in the composition shown in Table 1 to prepare the intermediate layer 5 having a single layer thickness of 30 μm. EO copolymer: ULTOZEX 3550 [trade name, manufactured by Mitsui Petrochemical Industry Co., Ltd.] Density = 0.925 g / cm
³ . S / B copolymer: Asaflex 810 [trade name of Asahi Kasei Corporation] 70 to 90% by weight of styrene and 30 to 10% by weight of butadiene. S / B copolymer hydrogenated product: Tuftec H1041 [trade name of Asahi Kasei Corporation] Styrene 20 to 50% by weight
And butadiene 80 to 50% by weight. HIPS: Styron 475D [trade name of Asahi Kasei Corporation]. S / B block elastomer: Toughprene A [trade name of Asahi Kasei Corporation] Hydrogen-free additive of 20 to 50% by weight of styrene and 80 to 50% by weight of butadiene. The AC film 3 is provided on the stretched film 22 of the composite base sheet 2, and the low density polyethylene mirason 16 having a thickness of 20 μm is provided.
[Mitsui Petrochemical Industry Co., Ltd. product name] Adhesive resin 4
As a result, the composite substrate sheet 2 and the intermediate layer 5 having the composition shown in Table 1 were laminated by sandwich lamination.
Then, a heat sealant layer 6 obtained by dissolving the following composition in a solvent by gravure reverse is applied to the intermediate layer 5 by 2 μm.
The thickness was (solid content). Further, a solution of a bisammonium-based sulfur semiconductor as a static electricity diffusion layer was applied to the heat sealant layer 6 by gravure coating at 0.1 g / m ² to obtain cover tape samples 1 to 16 and comparative samples 1 to 6 shown in Table 1. Created. (Coating liquid for heat sealant layer) -Polyurethane Nipporan 5120 25 parts by weight [Nippon Polyurethane Industry Co., Ltd. product name] -Vinyl chloride / vinyl acetate copolymer vinylite VAGH 75 parts by weight [Union Carbide product name]

[0059]

[Table 1]

With respect to each of the above cover tapes (Samples 1 to 16 and Comparative Samples 1 to 6), the haze degree, total light transmittance, surface resistivity and charge decay time were measured by the following methods and conductive polychlorination. Table 2 shows the peel strength and peeling form of the heat-sealed vinyl base material "XEG47 Taihei Chemical Co., Ltd. trade name".・ Haze and total light transmittance: Color computer S
Measured with M-44C "Suga Test Instruments Co., Ltd. trade name".・ Surface resistivity: Electro-Tech System
ms, Inc. Made STATIC DECAY METE
Using R-406C, 23 ± 5 ℃, relative humidity 12 ±
The time required for attenuation from 5000 V to 99% is measured according to MIL-B-81705C under the condition of 3%. Peel strength: heat sealed under the conditions of 150 ° C., 3 kgf / cm ² , 0.5 seconds, and Tensilon universal testing machine HTH-
Peeling at 180 degrees using 100 "trade name of Toyo Baldwin Co., Ltd.", and peeling speed was measured at 300 mm / min.

[0061]

[Table 2]

(Experimental Example 2) A composite substrate sheet 2 having the constitution shown in Table 3 was prepared by dry lamination using the following biaxially stretched polyethylene terephthalate film and an adhesive.・ Biaxially oriented polyethylene terephthalate film Tetron film F type [Teijin Co., Ltd. product name]
Thickness 3, 6 and 12 μm. Tetoron film V type [Product name of Teijin Limited]
Thickness, 20 and 25 μm. -Adhesives Ester-based, ether-based, acrylic-based, epoxy-based, urethane-based, polyimide-based. The composite substrate sheet shown in Table 3 or a single-layer substrate sheet (E
By dry lamination through the adhesive layer 7 used in Experimental Example 1 with the intermediate layer 5 having a thickness of 30 μm and comprising a blend of 40% by weight of O copolymer and 60% by weight of S / B copolymer Laminated. Then, a heat sealant layer of the following composition 2 μm is formed on the intermediate layer 5 by gravure reverse.
Is provided by gravure reverse coating, and further, Experimental example 1
Apply 0.1g / m ² static electricity diffusion layer in the same manner as in
17 to 25 of the cover tape shown in FIG.
~ 9 was created. (Coating liquid for heat sealant layer) -Polyurethane Nipporan 5120 70 parts by weight [Product name of Nippon Polyurethane Industry Co., Ltd.]-Vinyl chloride / vinyl acetate copolymer VINYLITE VAGH 18 parts by weight [Product name of Union Carbide Co., Ltd.]-Silica Particle size 0.02 μm 12 parts by weight

Each cover tape of Experimental Example 7 (Samples 17 to 2)
5 and comparative samples 7 to 9), carrier tape sheet XEG47 “Taihei Chemical Co., Ltd. trade name”,
The peel strength is measured by heat-sealing under the heat-sealing conditions of a temperature of 130 ° C. and 150 ° C., a pressure of 2 kgf / cm ² , and a time of 0.5 seconds, and the average peel strength and the difference between the maximum peel strength and the minimum peel strength. Was evaluated. Table 15 shows the results.

[0064]

[Table 3]

[0065]

EFFECT OF THE INVENTION The cover tape formed on the composite substrate sheet in which the stretched film is laminated with two or more layers of the curable adhesive reduces zip-up when peeling, and both the EO copolymer and the S / B copolymer can be removed. The heat sealant layer provided on the intermediate layer formed of three or more kinds of resins containing at least the E / O copolymer and the S / B copolymer among the polymer and the S / B copolymer hydrogenated product and HIPS is When it is peeled off from the carrier tape, it has the effect of stably peeling between the intermediate layer and the heat sealant layer. Then, the electrostatic diffusion layer having a bisammonium-based sulfur semiconductor as a main component provided in the heat sealant layer has a surface resistivity on the cover tape,
It is effective to provide a cover tape having excellent antistatic properties such as charge decay time.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing a cross section of a cover tape of the present invention.

FIG. 2 is a conceptual diagram showing a cross section of a cover tape provided with an intermediate layer composed of two layers.

FIG. 3 is a conceptual diagram showing a cross section of a cover tape provided with an intermediate layer composed of three layers.

FIG. 4 is a perspective view showing a sealed state of a carrier tape and a cover tape.

FIG. 5 is a conceptual diagram showing a cross section of a cover tape and a carrier tape of the present invention in a heat-sealed state.

FIG. 6 is a conceptual diagram showing a cross section of the cover tape of FIG. 5 peeled from the carrier tape.

[Explanation of symbols]

 1 Carrier Tape 2 Composite Base Sheet 21, 22 Stretched Film 3 AC Layer 4 Adhesive Resin 5 Intermediate Layer 51 First Resin Layer 52 Second Resin Layer 53 Third Resin Layer 6 Heat Sealant Layer 7 Adhesive Layer 8 Electrostatic Diffusion Layer Layer 10 Heat seal area 11 Carrier tape 12 Pocket

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location B32B 7/12 B32B 7/12 27/00 27/00 B H01L 21/60 311 H01L 21/60 311W

Claims (18)

[Claims] 1. A cover tape which can be heat-sealed to a carrier tape, wherein a composite base material sheet comprising a stretched film comprising two or more layers of the cover tape bonded via an adhesive layer, an intermediate layer, a heat silant layer and a screw. A cover tape for a carrier tape, characterized in that an electrostatic diffusion layer containing an ammonium-based sulfur semiconductor as a main component is sequentially laminated. 2. The adhesive layer for laminating the stretched film is polyester, polyether, urethane resin, ethylene / vinyl acetate resin, acrylic resin, epoxy resin, or a modified product thereof. Cover tape for carrier tape according to 1. 3. The intermediate layer has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer, 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene
And a styrene / butadiene block copolymer with styrene, a hydrogenated product of a styrene / butadiene block copolymer with 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene, and at least an ethylene / α-olefin copolymer of high-impact polystyrene. A cover tape for a carrier tape, which is formed of three or more kinds of resins including a polymer and a styrene / butadiene block copolymer. 4. The intermediate layer has a single layer structure, 30 to 70% by weight of an ethylene / α-olefin copolymer having a density of 0.915 to 0.940 g / cm ³ and 50 to 9 of styrene.
0% by weight of styrene and 50 to 10% by weight of styrene
To 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a butadiene block copolymer, 10 to 5 of styrene is added.
0% by weight of styrene and 90 to 50% by weight of styrene
4. The resin composition according to claim 3, wherein the resin composition contains 5 to 30 parts by weight of a hydrogenated butadiene block copolymer and 5 to 50 parts by weight of a high impact polystyrene. Cover tape for carrier tape. 5. The intermediate layer has a single-layer structure, 30 to 70% by weight of an ethylene / α-olefin copolymer having a density of 0.915 to 0.940 g / cm ³ , and 50 to 9 of styrene.
0% by weight of styrene and 50 to 10% by weight of styrene
To 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a butadiene block copolymer, 10 to 5 of styrene is added.
0% by weight of styrene and 90 to 50% by weight of styrene
The carrier tape cover tape according to claim 3, wherein the cover tape is formed of a resin composition to which 5 to 30 parts by weight of a hydrogenated butadiene block copolymer is added. 6. The intermediate layer has a single layer structure, 30 to 70% by weight of an ethylene / α-olefin copolymer having a density of 0.915 to 0.940 g / cm ³ , and 50 to 9 of styrene.
0% by weight of styrene and 50 to 10% by weight of styrene
It is formed by a resin composition in which 5 to 50% by weight of high-impact polystyrene is added to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a butadiene block copolymer. Claim 3
Cover tape for carrier tape according to. 7. The intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer has a density of 0.915 to 0.940 g / cm.
Formed by ethylene / α-olefin copolymer of ³ ,
The second resin layer has a density of 0.915 to 0.940 g / cm.
30 to 70% by weight of ethylene / α-olefin copolymer of ³
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
Styrene-butadiene block copolymer with 70% by weight
10 to 50% by weight of styrene and 90 to 50% of butadiene based on 100 parts by weight of a resin composition composed of 30 to 30% by weight.
The carrier tape according to claim 3, wherein the carrier tape is formed of a resin composition containing 5 to 30 parts by weight of a hydrogenated styrene-butadiene block copolymer with 5% by weight. Cover tape. 8. The intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer has a density of 0.915 to 0.940 g / cm.
Formed by ethylene / α-olefin copolymer of ³ ,
The second resin layer has a density of 0.915 to 0.940 g / cm.
30 to 70% by weight of ethylene / α-olefin copolymer of ³
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
Styrene-butadiene block copolymer with 70% by weight
The resin composition is formed by adding 5 to 50 parts by weight of high-impact polystyrene to 100 parts by weight of the resin composition of 30 to 30% by weight. Cover tape for the carrier tape described. 9. The intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer has a density of 0.915 to 0.940 g / cm.
Formed by ethylene / α-olefin copolymer of ³ ,
The second resin layer has a density of 0.915 to 0.940 g / cm.
30 to 70% by weight of ethylene / α-olefin copolymer of ³
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
Styrene-butadiene block copolymer with 70% by weight
10 to 50% by weight of styrene and 90 to 50% of butadiene based on 100 parts by weight of a resin composition composed of 30 to 30% by weight.
Characterized in that it is formed of a resin composition to which 5 to 30 parts by weight of a hydrogenated styrene-butadiene block copolymer with 5% by weight and 5 to 50 parts by weight of high-impact polystyrene are added. The cover tape for carrier tapes according to claim 3. 10. The intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.9
The second resin layer is formed of a 40 g / cm ³ ethylene / α-olefin copolymer, and has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
˜70 wt%, styrene / butadiene block copolymer 70˜30 wt% of styrene 50˜90 wt% and butadiene 50˜10 wt%, and the third resin layer has a density 0.915-0.940g
/ Cm ³ ethylene / α-olefin copolymer 30 to 70
Wt%, styrene 50-90 wt% and butadiene 50
10 to 50% by weight of styrene and 90 to butadiene based on 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a styrene / butadiene block copolymer with 10 to 10% by weight.
A styrene-butadiene block copolymer of 70 to 30% by weight and a hydrogenated product of 5 to 30 parts by weight are added to the resin composition. The cover tape for carrier tape according to item 3. 11. The intermediate layer has a three-layer structure including a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0. ．
The second resin layer is formed of an ethylene / α-olefin copolymer of 940 g / cm ³ , and has a density of 0.915 to 0.
940 g / cm ³ ethylene / α-olefin copolymer 3
The third resin layer is formed by a resin composition of 0 to 70% by weight, 70 to 30% by weight of styrene / butadiene block copolymer of 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene. Density 0.915 to 0.940
g / cm ³ ethylene / α-olefin copolymer 30 to 7
0 wt%, styrene 50-90 wt% and butadiene 5
Formed from a resin composition in which 5 to 50 parts by weight of high-impact polystyrene is added to 100 parts by weight of a resin composition consisting of 0 to 10% by weight and 70 to 30% by weight of a styrene / butadiene block copolymer. The cover tape for carrier tape according to claim 3, wherein the cover tape is a carrier tape. 12. The intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.9
The second resin layer is formed of a 40 g / cm ³ ethylene / α-olefin copolymer, and has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
˜70 wt%, styrene / butadiene block copolymer 70˜30 wt% of styrene 50˜90 wt% and butadiene 50˜10 wt%, and the third resin layer has a density 0.915-0.940g
/ Cm ³ ethylene / α-olefin copolymer 30 to 70
Wt%, styrene 50-90 wt% and butadiene 50
10 to 50% by weight of styrene-butadiene block copolymer and 30 to 30% by weight, based on 100 parts by weight of the resin composition, 10 to 50% by weight of styrene and 90 to 5% of butadiene
5 to 30 parts by weight of hydrogenated styrene-butadiene block copolymer with 0 and high impact polystyrene 5
The cover tape for a carrier tape according to claim 3, which is formed of a resin composition to which 50 parts by weight is added. 13. The intermediate layer has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
It is formed of a resin composition composed of 70 to 30% by weight, 70 to 30% by weight of styrene, and 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene. The cover tape for carrier tapes according to Item 1. 14. The intermediate layer has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
To 70% by weight, and 70 to 30% by weight of hydrogenated styrene-butadiene block copolymer of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene. Claim 1 characterized by
Cover tape for carrier tape according to. 15. The glass transition temperature of the intermediate layer is 40 ° C.
The carrier tape cover tape according to claim 1, wherein the cover tape is formed of a linear saturated polyester exceeding the above range. 16. The heat sealant layer according to claim 1, wherein the heat sealant layer contains at least one of polyester, polyurethane, vinyl chloride / vinyl acetate copolymer and acrylic resin. Cover tape for carrier tape. 17. The electrostatic diffusion layer has a surface resistivity of 1
The carrier tape cover tape according to any one of claims 1 to 16, wherein the charge tape has a 99% charge decay time of 2 seconds or less in the range of 0 ⁵ to 10 ¹² Ω / □. 18. The carrier tape cover tape according to claim 1, which has a total light transmittance of 75% or more and a haze value of 50% or less.