JPH09109313A - Lid material for carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lid material which has stable peel strength and is free from differential between minimum-maximum peel-strengths. SOLUTION: In a lid material 1 which can be heat-sealed to a carrier tape, a composite backing sheet 2 in which oriented films 21, 22 of the multilayer lid material 1 are laminated through an adhesive layer 7, an intermediate layer 5, and a heat-sealant layer 6 which is made from a resin containing conductive fine powder of tin oxide, indium oxide, or an antistatic organic silicon compound are formed in sequence.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a synthetic resin container for accommodating various industrial parts, for example, a carrier tape for accommodating a semiconductor element in a pocket portion of a recess formed in the carrier tape, covering the accommodating portion and heat sealing. The lid member belongs to a lid member that is easy to open and peel when mounted on an electronic component and has stable peel strength.

[0002]

The material of a synthetic resin container for accommodating various industrial parts, such as a carrier tape, is usually one in which sheets of polyvinyl chloride, polystyrene, polyester, polycarbonate, etc. can be easily formed. Further, the lid member is composed of a laminated body in which a heat sealant layer is provided on one surface of the film. The carrier tape or lid does not cause deterioration or destruction of the semiconductor element due to contact with the stored semiconductor element or static electricity generated when the lid material is peeled off. It is required to have transparency. And
In the mounting process of electronic components, it is required that the lid material can be easily and stably peeled off. That is, if the difference between the maximum value and the minimum value of the peel strength (hereinafter referred to as zip-up in the present specification) with the progress of peeling is large, there is a problem that the electronic component pops out or cannot be loaded at a predetermined position. . In particular, the peeling strength is affected by the peeling angle, and there is a problem that the peeling angle also changes due to a change in the take-up tension of the lid material when loading, and the zip-up becomes large.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a lid material having excellent antistatic properties, high heat sealability to carrier tapes, and stable zip-up properties. It is what

[0004]

In order to solve the above problems, the lid material of the present invention is a lid material which can be heat-sealed to a carrier tape, wherein the lid material comprises a stretched film consisting of two layers and an adhesive layer. A laminate of a composite base material sheet bonded via the intermediate layer, an intermediate layer, and a heat silane layer made of a resin containing a tin oxide-based, zinc oxide-based, conductive fine powder of indium oxide or an antistatic organosilicon compound in order. Is.
The adhesive layer to which the stretched film is attached is polyester, polyether, urethane resin, acrylic resin, epoxy resin, or a modified product thereof. Also,
The intermediate layer has a density of 0.915 to 0.940 g / cm ^3.
Ethylene of (density unit g / cm ³ is omitted below)
α-olefin copolymer (hereinafter referred to as EO copolymer), styrene 50 to 90% by weight and butadiene 50 to 1
Styrene / butadiene block copolymer with 0% by weight (hereinafter referred to as S / B copolymer regardless of ratio), styrene 10 to 50% by weight and butadiene 90 to 50% by weight
And a hydrogenated product of a styrene / butadiene block copolymer (hereinafter referred to as an S / B copolymer hydrogenated product) and a high-impact polystyrene (hereinafter referred to as HIPS) at least an E / O copolymer and It is a lid member formed of three or more kinds of resins including an S / B copolymer. The intermediate layer has a single layer structure and a density of 0.915 to 0.940.
30% to 70% by weight of EO copolymer and 50% to styrene
10 to 50% by weight of styrene and 90 to 50% by weight of butadiene, relative to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of an S / B copolymer of 90% by weight and 50 to 10% by weight of butadiene. 5 to 30 parts by weight of the S / B copolymer hydrogenated product and 5 to 50 parts by weight of HIPS are used as the lid material. In addition, the intermediate layer has a single layer structure, 30 to 70% by weight of an EO copolymer having a density of 0.915 to 0.940, and styrene of 50 to 9%.
From 0 to 30% by weight of S / B copolymer of 50 to 10% by weight of butadiene, 10 to 50% by weight of styrene and 90 to 90% of butadiene per 100 parts by weight of the resin composition.
A lid member formed of a resin composition to which 5 to 30 parts by weight of a hydrogenated S.B copolymer with 50% by weight is added. The intermediate layer has a single layer structure and a density of 0.
915 to 0.940 EO copolymer 30 to 70% by weight
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
A lid member formed of a resin composition in which 5 to 50 parts by weight of HIPS is added to 100 parts by weight of a resin composition composed of 70 to 30% by weight of S / B copolymer with 70% by weight of S / B copolymer. Further, the intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer is made of EO having a density of 0.915 to 0.940.
The second resin layer is formed of a copolymer and has a density of 0.9.
15 to 0.940 EO copolymer 30 to 70% by weight
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
10 to 50 parts by weight of styrene with respect to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of S / B copolymer and 70% by weight of S / B copolymer.
A lid material formed of a resin composition to which 5 to 30 parts by weight of an S / B copolymer hydrogenated product of 90% to 50% by weight of butadiene is added. Further, the intermediate layer,
It has a two-layer structure of a first resin layer and a second resin layer in contact with the heat-silane layer, and the first resin layer has a density of 0.91.
5 to 0.940 EO copolymer, and the second resin layer has a density of 0.915 to 0.940 EO copolymer 30 to 70% by weight and styrene 50 to 90% by weight. S / B copolymer 70 of 50 to 10% by weight of butadiene
10 to 50% by weight of styrene and 90 to 50% of butadiene based on 100 parts by weight of a resin composition composed of 30% by weight.
A lid member formed of a resin composition in which 5 to 50 parts by weight of HIPS is added to 100 parts by weight of a resin composition composed of 70 to 30% by weight of S / B copolymer with 70% by weight of S / B copolymer. Further, the intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer is made of EO having a density of 0.915 to 0.940.
The second resin layer is formed of a copolymer and has a density of 0.9.
15 to 0.940 EO copolymer 30 to 70% by weight
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
Hydrogenation of S / B copolymer of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene with respect to 100 parts by weight of a resin composition consisting of 70% to 30% by weight of S and B copolymer. 5 to 30 parts by weight of HIPS and 5 to 50 parts by weight of HIPS are added to form a lid material. Also, the intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.940.
Of the E / O copolymer, and the second resin layer has a density of 0.915 to 0.940.
Wt%, styrene 50-90 wt% and butadiene 50
10 to 10% by weight of the S / B copolymer and 70 to 30% by weight of the resin composition, and the third resin layer has a density of 0.9.
15 to 0.940 EO copolymer 30 to 70% by weight
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
10 to 50 parts by weight of styrene with respect to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of S / B copolymer and 70% by weight of S / B copolymer.
A lid material formed of a resin composition to which 5 to 30 parts by weight of an S / B copolymer hydrogenated product of 90% to 50% by weight of butadiene is added. Further, the intermediate layer,
It has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer is an EO copolymer having a density of 0.915 to 0.940. The second resin layer is formed of 30% to 70% by weight of an EO copolymer having a density of 0.915 to 0.940 and 50% to 9% of styrene.
0% by weight and 50 to 10% by weight of butadiene, 70 to 30% by weight of an S / B copolymer resin composition, and the third resin layer has an E / O density of 0.915 to 0.940. Copolymer 30-70 wt% and styrene 50-90 wt%
S / B copolymer 70 of 50 to 10% by weight of butadiene
It is a lid material formed of a resin composition in which 5 to 50 parts by weight of HIPS is added to 100 parts by weight of a resin composition of 30 to 30% by weight. Also, the intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.940. Of the E.O copolymer, and the second resin layer has a density of 0.915 to 0.94.
30% to 70% by weight of EO copolymer of 0 and styrene 50
S-B of ~ 90 wt% and butadiene 50-10 wt%
The third resin layer is formed of a resin composition containing 70 to 30% by weight of a copolymer, and the third resin layer contains 30 to 70% by weight of an EO copolymer having a density of 0.915 to 0.940 and 50 to 9% of styrene.
10 to 50% by weight of styrene and 9 to butadiene to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of an S / B copolymer of 0% by weight and 50 to 10% by weight of butadiene.
A lid member formed of a resin composition to which 5 to 30 parts by weight of an S.B copolymer hydrogenated product of 0 to 50% by weight and 5 to 50 parts by weight of HIPS are added. In addition, the intermediate layer is an EO copolymer 30 to 7 having a density of 0.915 to 0.940.
0 wt%, styrene 50-90 wt% and butadiene 5
A lid member formed of a resin composition composed of 0 to 10% by weight and an S / B copolymer of 70 to 30% by weight.
The intermediate layer has an E · E density of 0.915 to 0.940.
A lid material formed of a resin composition comprising an O copolymer 30 to 70% by weight, styrene 10 to 50% by weight, and butadiene 90 to 50% by weight, an S / B copolymer hydrogenated product. The intermediate layer is a lid material formed of linear saturated polyester having a glass transition temperature of higher than 40 ° C. Further, the heat sealant layer is a polyester,
A cover material containing at least one of polyurethane, vinyl chloride / vinyl acetate copolymer, and acrylic resin. Also,
The heat sealant layer has a resistivity of 10 ⁵ to 10 ¹² Ω.
And the charge decay time is 2 seconds or less. The cover material of the present invention has a total light transmittance of 75% or more and a haze value of 50% or less.

[0005]

2. Description of the Related Art Conventionally, as a means for preventing static electricity from being generated in a cover material of a carrier tape, kneading conductive carbon black fine particles and metal fine particles into a carrier tape or applying a coating solution containing them has been performed. ing. Further, as a means for preventing static electricity generation in the lid material, an antistatic agent such as a surfactant, conductive carbon black fine particles, and metal fine particles are kneaded into the heat sealant layer that is in direct contact with the electronic component, or a coating containing these is applied. Liquid is applied and the like.

However, the conductive carbon black fine particles and metal fine particles as the antistatic agent contained in the above-mentioned carrier tape and lid material reduce the transparency of the sheet, and it is difficult to confirm the stored electronic components from the outside. There was a problem. When a surfactant is applied,
There is a problem that the heat-sealant layer of the lid material is deposited on the surface of the heat-sealant layer, the heat-sealability becomes unstable, and the heat-seal failure occurs.

Furthermore, the heat sealing of the carrier tape of the lid member is required to have a predetermined strength so that the lid member does not peel off during transport and storage and the electronic parts do not fall off. However, if the heat-sealing strength is too high, there is a problem that when the lid member is peeled off during the mounting process of the electronic component, the carrier tape vibrates and the electronic component pops out of the pocket of the carrier tape. Therefore, the lid material is heat-sealed to the carrier tape with sufficient strength,
In addition, it is required that the peelability of the electronic component is good when it is mounted. There is a problem that it is extremely difficult to adjust the heat sealing strength under the conditions such as heat sealing temperature, time and pressure.

Further, even if an appropriate heat seal strength is obtained, if the zip-up of the peel strength is large, the mounting position of the electronic component will not be stable, and in some cases, it will pop out from the pocket. did.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION As shown in FIG. 1, the lid material of the present invention is a lid material 1 that can be heat-sealed to a carrier tape, and a stretched film composed of two layers is attached via an adhesive layer 3. A composite laminate of a combined base material sheet 2, an intermediate layer 5, and a heat silane layer 6 made of a resin containing a tin oxide-based, zinc oxide-based, conductive fine powder of indium oxide or an antistatic organosilicon compound in this order. Is.

The stretched film of the present invention is formed by uniaxially or biaxially stretching a film from a polyester such as polyethylene terephthalate or polyethylene naphthalate, a polyolefin such as polypropylene, a polyamide such as nylon or a thermoplastic resin such as polycarbonate. 3 to 25 μm. Then, in order to strengthen and stabilize the adhesive strength with the adhesive layer, the side in contact with the adhesive layer may be subjected in advance to a surface treatment such as corona discharge treatment, plasma treatment, or sandblast treatment, if necessary. Furthermore, an antistatic treatment can be performed by kneading a surfactant or the like.

Then, the composite base sheet is formed by compounding the above-mentioned same or different two-layer film, preferably via a curing reaction type adhesive layer. The thermosetting adhesive layer of the present invention is mainly composed of polyester resin, polyether resin, urethane resin, vinyl copolymer, ethylene / acrylic resin, polythiol, epoxy resin, etc. As tolylene diisocyanate, 4,4 ^, -diphenylmethane diisocyanate,
Hexamethylene diisocyanate, isophorone diisocyanate, xylene diisocyanate, naphthylene-
Examples include 1,5 diisocyanate and polyamine.

As the ionizing radiation curable resin, a composition in which a prepolymer, an oligomer and / or a monomer having a polymerizable unsaturated bond or an epoxy group in the molecule is appropriately mixed is used. Examples include urethane acrylate and polyester acrylate.

The application of the adhesive layer and the lamination of the base layer and the intermediate layer can be carried out by ordinary dry lamination. The method of applying the adhesive layer does not matter, such as gravure coating and roll coating. The thickness of the reaction-curable adhesive layer is a factor that gives rigidity to the lid material, and is ^{2 to 20} g / m ² (solid content, the same applies hereinafter).
It is preferably 5 to 10 g / m ² . If it is ² g / m ² or less, the adhesive strength cannot be made uniform, and the rigidity required to stabilize the zip-up of the lid material cannot be provided.
Further, the adhesive layer of 20 g / m ² or more is not only disadvantageous in terms of price, but also has high rigidity and may cause cracks in the lid material.

The composite base material sheet is formed by a heat-resistant stretched film and a reaction-curable adhesive layer, which are combined together to heat-seal the lid material by a heat-sealing bar which comes into contact when the lid material is heat-sealed to the carrier tape. It is possible to impart heat resistance such as heat shrinkage.

A composite base sheet formed by forming a two-layer stretched film with an adhesive layer interposed between them has a higher rigidity as a sheet due to the action of a reactive adhesive layer than a single layer, and has a peeling angle. It can be inferred that the zip-up can be stably reduced.

Further, in the case of a single layer, the rigidity can be increased by increasing the thickness of the stretched film, but the heat amount required by the heat sealant layer cannot be transmitted due to the increase in thickness, and it is necessary to set the temperature of the heat seal bar high. is there. Therefore, the carrier tape having poor heat resistance is deformed or dimensionally changed, which causes a change in position when the electronic component is mounted.

Although not shown, the composite substrate sheet may be composed of five or more layers including an adhesive layer composed of three or more stretched films. The total thickness can be appropriately set depending on the purpose of use, but is 6 to 100 μm, preferably 20 to
45 μm.

On the surface opposite to the heat sealant layer of the composite substrate sheet, that is, on the outermost surface, if necessary, a conductive fine powder such as a surfactant, conductive carbon black, metal vapor deposition, metal oxide, etc. It is possible to prevent the adhesion of dust, dust, etc. on the surface of the base material sheet 2 or to prevent the generation of static electricity due to contact with another surface by applying an antistatic treatment using the above.

By using a thermoplastic resin as an adhesive resin provided between the composite base sheet and the intermediate layer, heat and pressure at the time of heat sealing can be made uniform. As the adhesive resin, either a single substance or a blend of modified products such as polyethylene, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / acrylic acid ester copolymer, ionomer and polypropylene is used. It can be provided by melt extrusion coating or sandwich lamination and has a thickness of 10
〜60 μm.

An anchor coat layer (referred to as an AC layer in this specification) used for melt extrusion coating in order to strengthen the adhesion between the composite base sheet and the adhesive resin which is a thermoplastic resin when the adhesive resin is provided. Is preferably provided. For the AC layer, an ordinary one such as an isocyanate type or a polyethyleneimine type can be used, but by using a reaction-curable adhesive as the AC layer, the rigidity of the entire lid material can be increased.

When the thickness of the adhesive resin is 10 μm or less, the cushioning function for uniformizing the pressure during heat sealing is poor, and when it exceeds 60 μm, the heat transfer property as the lid material is lowered and the heat seal bar temperature is increased. This is not preferable because it requires setting.

The intermediate layer of the present invention acts as a cushion that evenly adheres both sheets when the lid material is heat-sealed with the carrier tape. At the same time, when peeling the heat-sealed lid material from the carrier tape,
As shown in FIGS. 4 and 5, the adhesive strength between the intermediate layer 5 and the heat sealant layer 6 is regulated so that the interlayer 5 can be peeled off from the heat sealant layer 4. The intermediate layer 5 may have a single-layer structure or a multi-layer structure, and can be formed by combining two or more kinds of thermoplastic resins.
In addition, a single layer or multiple layers can be formed by a normal film forming method such as an inflation method using a circular die and a casting method using a T die.

As the resin used for the intermediate layer, any of a single polymer, a copolymer and a polymer alloy can be used. The adhesive strength (peel strength) with the heat sealant layer is regulated, and the carrier tape and the lid material are used. It can be selected from those having a cushioning effect when heat-sealing and. For example, polyester, polyethylene, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / acrylic ester copolymer, ionomer, ethylene / propylene rubber, polypropylene, polyethylene, S / B copolymer , S.B copolymer hydrogenated product, and a polymer alloy composed of two or more resins containing at least polyethylene and S.B copolymer among HIPS.

The intermediate layer has a single layer structure and a density of 0.915.
-0.940 EO copolymer S-B copolymer of styrene 50-90% by weight and butadiene 50-10% by weight,
S / B copolymer hydrogenated product of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene, and three or more kinds of resins containing at least E / O copolymer and S / B copolymer among HIPS Can be formed. The EO copolymer used to form the intermediate layer is ethylene and, for example, butene,
It is a copolymer with pentene, hexene, heptene, octene, 4-methylpentene-1 and the like. E like this
O copolymer density is less than 0.915 or 0.915
If it exceeds, the film-forming property of the intermediate layer due to the combination with the S / B copolymer is deteriorated, which is not preferable.

Further, if the amount of styrene constituting the S / B copolymer forming the intermediate layer is less than 50% by weight, the tackiness of the film increases and it becomes difficult to handle. The adhesive strength with the heat sealant layer may decrease.

The mixing ratio of the E / O copolymer and the S / B copolymer in the intermediate layer has a great influence on the peel strength when peeling after heat sealing to the carrier tape and the transparency of the lid material. . In the present invention, the mixing ratio of the E / O copolymer and the S / B copolymer in the intermediate layer is 30 to 7 in the E / O copolymer.
It is preferably 0% by weight and 70 to 30% by weight of the S / B copolymer. When the E / O copolymer is less than 30% by weight and the S / B copolymer is more than 70% by weight, not only the film-forming property of the intermediate layer is deteriorated but also the transparency is deteriorated, and the intermediate layer and the heat sealant are used. The adhesive strength with the layer is increased, and the peel strength of the lid material exceeds the appropriate value, which is not preferable. On the other hand, the E / O copolymer exceeds 70% by weight, and the S / B copolymer is 30% by weight.
If it is less than the above range, the adhesive strength between the intermediate layer and the heat sealant layer is small, and the peel strength suitable as a lid material is less than that, which is not preferable.

S / B copolymer hydrogenated product and HIP are used for the intermediate layer.
When molding with four kinds of resins using S, 100 parts by weight of a resin composition comprising 30 to 70% by weight of the EO copolymer and 70 to 30% by weight of the S / B copolymer as described above. To styrene 10 to 50% by weight and butadiene 90 to
It is preferable to add 5 to 30 parts by weight of the hydrogenated S.B copolymer with 50% by weight and 5 to 50 parts by weight of HIPS.

When the amount of the S.B copolymer hydrogenated product added is less than 5 parts by weight, the effect of adding the S.B copolymer hydrogenated product is not exhibited, and when the amount added exceeds 30 parts by weight. The resulting film is easy to block and is not preferred. When the amount of the hydrogenated S / B copolymer is small, the compatibilizing effect of the hydrogenated S / B copolymer is small and the transparency of the intermediate layer is not improved.

When the amount of HIPS added is less than 5 parts by weight,
The slipperiness of the intermediate layer is poor, the effect of adding HIPS is not exhibited, and when it exceeds 50 parts by weight, the adhesive strength between the intermediate layer and the heat sealant layer becomes strong, and the peel strength of the lid material exceeds the appropriate value. Is not preferable.

The above-mentioned intermediate layer is composed of EO copolymers 30 to 7
5 parts by weight of only the S.B copolymer hydrogenated product was added to 100 parts by weight of the resin composition consisting of 0% by weight and 70.about.30% by weight of the S.B copolymer. You may form with the resin composition containing a kind of resin. In addition, HIP was added to 100 parts by weight of a resin composition composed of 30 to 70% by weight of the E / O copolymer and 70 to 30% by weight of the S / B copolymer.
5 to 50 parts by weight of S alone may be added to form a resin composition containing three kinds of resins.

The intermediate layer of the single layer structure of the present invention has, in addition to the above constitution, 30 to 70% by weight of an EO copolymer having a density of 0.915 to 0.940, 50 to 90% by weight of styrene and butadiene. It can be formed from a resin composition composed of 50 to 10% by weight and 70 to 30% by weight of an S / B copolymer.
In this case, if the amount of styrene constituting the S / B copolymer used is less than 50% by weight, the tackiness of the film increases and it becomes difficult to handle, and if it exceeds 90% by weight, adhesion of the heat sealant layer at low temperature It is not preferable because the strength is lowered. The mixing ratio of the E / O copolymer and the S / B copolymer in the intermediate layer has a great influence on the peel strength and the transparency when peeling after the lid material is heat-sealed on the carrier tape. is there. When the E / O copolymer is less than 30% by weight and the S / B copolymer is more than 70% by weight, the film forming property and transparency of the intermediate layer are deteriorated, and the transparency of the lid material is also impaired. Further, the adhesive strength between the intermediate layer and the heat sealant layer is too large, and the peel strength of the lid material exceeds the appropriate value, which is not preferable. On the other hand, when the E / O copolymer exceeds 70% by weight and the S / B copolymer is less than 30% by weight, the adhesive strength between the intermediate layer and the heat sealant layer is small, and the peel strength of the lid material is appropriate. It is less than the value, which is not preferable.

The single-layered intermediate layer of the present invention has a density of 0.9
30 to 70% by weight of an EO copolymer of 15 to 0.940, 10 to 50% by weight of styrene, and 90 to 50% by weight of an S / B copolymer hydrogenated product of 70 to 30% by weight of an S / B copolymer. It can be composed of a resin composition.

In this case, the density of the EO copolymer is 0.9.
If it is less than 15 or more than 0.940, the film-forming property of the intermediate layer due to the combination with the hydrogenated S.B copolymer is deteriorated, which is not preferable. Also, S / B to be used
If the amount of styrene constituting the copolymer hydrogenated product is less than 10% by weight, the tackiness of the film is increased and blocking is likely to occur, and if it exceeds 50% by weight, the heat sealability at low temperature is deteriorated, which is not preferable. . Hydrogenated products are EO
It has good compatibility with the copolymer and gives flexibility and transparency to the intermediate layer. The mixing ratio of the E / O copolymer and the hydrogenated S / B copolymer in the intermediate layer depends on the peel strength after heat sealing the carrier tape and the lid material and the transparency of the intermediate layer. It has a great influence. That is, when the E / O copolymer content is less than 30% by weight and the S / B copolymer hydrogenation content exceeds 70% by weight, the film forming property of the intermediate layer is deteriorated and the transparency is also deteriorated.
Further, the adhesive strength between the intermediate layer and the heat sealant layer is too large, and the peel strength of the lid material exceeds the appropriate value, which is not preferable. On the other hand, when the E / O copolymer exceeds 70% by weight and the S / B copolymer hydrogenated content is less than 30% by weight, the adhesive strength between the intermediate layer and the heat sealant layer is weak and the lid material is peeled off. The strength may be below the appropriate value, which is not preferable.

The intermediate layer of the present invention has a glass transition temperature of 40.
It can also be formed from a linear saturated polyester having a temperature of at least ° C. Examples of the linear saturated polyester having a glass transition temperature of 40 ° C. or higher include alcohol components such as ethylene glycol, propylene glycol, 1,4-butanediol, and 1,4-cyclohexanedimethanol, and aliphatic components such as adipic acid and sebacic acid. It is a polyester obtained by dicarboxylic acid or the like with an aromatic dicarboxylic acid such as dicarboxylic acid, terephthalic acid, isophthalic acid, or diphenylcarboxylic acid. Specifically, a co-condensation polymer of ethylene glycol and terephthalic acid, ethylene glycol and isophthalic acid and terephthalic acid, 1,4 cyclohexanedimethanol and ethylene glycol and terephthalic acid, and propylene glycol and terephthalic acid and isophthalic acid are used. To do. In addition, the reason why the glass transition temperature is set to 40 ° C. or higher is that the environmental condition in which the lid material is used does not reach 40 ° C.

The intermediate layer may be composed mainly of the following thermoplastic resin. Polyolefin resins such as ethylene / propylene copolymer, polybutene, ethylene / butene-1 copolymer, ethylene / vinyl acetate copolymer, and ionomer. Polystyrene resins such as styrene / isoprene copolymer. Ethylene / acrylic acid copolymer, methacrylic acid copolymer, ethylene / acrylic acid ethyl ester copolymer,
Ethylene-acrylic acid methyl ester copolymer Ethylene-based copolymers such as ethylene-methacrylic acid methyl ester copolymer. Adhesive resins such as co-condensation polymerized polyester and maleic anhydride-grafted polyethylene. Thermoplastic elastomer.

The intermediate layer of the above single layer structure has a thickness of 10 to 60 μm.
Is preferred. If the thickness is less than 10 μm, the film-forming property is poor, and if it exceeds 60 μm, the heat-sealing property of the lid material is deteriorated.

The intermediate layer 5 of the present invention may have a multi-layer structure, and FIG. 2 is a schematic view showing a cross section of a lid member having a two-layer structure, which comprises a first resin layer 51 and a second resin layer 52. It constitutes the intermediate layer 5.

In this case, the first resin layer is an EO copolymer having a density of 0.915 to 0.940, which facilitates film formation.
The resin layer is an S / B copolymer 70-3 containing 30-70% by weight of an E / O copolymer having a density of 0.915-0.940, 50-90% by weight of styrene, and 50-10% by weight of butadiene.
A resin composition in which 5 to 30 parts by weight of an S / B copolymer hydrogenated product of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene is added to 100 parts by weight of a resin composition consisting of 0%. It can be formed from a thing. Further, the second resin layer is an EO copolymer 30 having a density of 0.915 to 0.940.
To 70% by weight, 70 to 30% by weight of styrene, 50 to 90% by weight of styrene, and 70 to 30% by weight of S / B copolymer of butadiene of 50 to 10% by weight.
It can also be formed from a resin composition to which S5 to 50 parts by weight is added. Also, the density 0.915 to 0.94
30% to 70% by weight of EO copolymer and 50% of styrene
10 to 50% by weight of styrene and 90 to 50% by weight of butadiene, relative to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of an S / B copolymer of 90% by weight and 50 to 10% by weight of butadiene. The S / B copolymer hydrogenated product of 5 to 30 parts by weight and the HIPS of 5 to 50 parts by weight can be added to form the resin composition. The first resin layer and the second resin layer can each be formed to a thickness of 5 to 30 μm.

FIG. 3 is a schematic cross-sectional view showing an example of the lid material of the present invention in which the intermediate layer 5 has a three-layer structure.
The resin layer 51 is composed of the third resin layer 53 which is in contact with the heat sealant layer 6 via the second resin layer 52.

In this case, the first resin layer is made of an E.O copolymer having a density of 0.915 to 0.940 which facilitates film formation, and the second resin layer has a density of 0.915 to 0.940. E
It can be formed by a resin composition of an O copolymer 30 to 70% by weight, a styrene 50 to 90% by weight, and a butadiene 50 to 10% by weight of an S / B copolymer, and the first resin layer and the later-described resin composition. It has the effect of improving the adhesive strength with the third resin layer.

The third resin layer has a density of 0.915 to 0.9.
40 EO copolymer 30-70 wt% and styrene 50
S-B of ~ 90 wt% and butadiene 50-10 wt%
Resin composition 100 comprising 70 to 30% by weight of copolymer
It can be formed from a resin composition to which 5 to 30 parts by weight of an S / B copolymer hydrogenated product of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene is added, based on parts by weight. Further, the third resin layer has a density of 0.915 to 0.940.
30% to 70% by weight of EO copolymer and 50% to styrene
According to a resin composition in which 5 to 50 parts by weight of HIPS is added to 100 parts by weight of a resin composition consisting of 90 to 30% by weight of S and B copolymer of 50 to 10% by weight of butadiene and 70 to 30% by weight. It can also be formed. Further, an EO copolymer having a density of 0.915 to 0.940, 30 to 70% by weight, styrene, 50 to 90% by weight, and butadiene, 50 to 1%.
10 to 5 parts by weight of styrene based on 100 parts by weight of a resin composition consisting of 0 to 30% by weight of an S / B copolymer and 30 to 30% by weight.
It can be formed by a resin composition containing 5 to 30 parts by weight of an S.B copolymer hydrogenated product of 0% by weight and 90 to 50% by weight of butadiene and 5 to 50 parts by weight of HIPS.

Then, the first resin layer, the second resin layer and the third resin layer
The resin layers can each be formed with a thickness in the range of 3 to 20 μm. An adhesive layer may be provided on one surface of the composite base sheet and dry laminated with an intermediate layer prepared in another step, or an adhesive resin may be extrusion-coated through an AC layer to form a sandwich lamination. .

By providing an intermediate layer, the lid material of the present invention is peeled between the intermediate layer 5 and the heat sealant layer 6 when the lid material heat-sealed to the carrier tape is peeled off, as shown in FIG. Cause This peel strength is weaker than the heat seal strength between the heat sealant layer and the carrier tape, and is preferably in the range of 100 to 1200 g / 15 mm. Peel strength is 100g / 15
If it is less than mm, there is a risk that the content may fall off due to peeling between the intermediate layer and the heat sealant layer when the content is stored and transferred. Also, the peel strength is 1200 g / 1
If the thickness exceeds 5 mm, the carrier tape may vibrate when the lid material is peeled off and the contents may pop out, which is not preferable. The above peel strength is 23 ° C and relative humidity 40%.
180 degree peeling in atmosphere of (peeling speed 300mm
/ Min) value. Also, the zip up is 30g / 2
mm or less is preferable. If the zip-up exceeds 50 g / 2 mm, the carrier tape may vibrate when the lid material is peeled off and the contents may pop out, which is not preferable. The term "zip-up" as used herein means the difference between the maximum and minimum values of peel strength when a carrier tape sheet and a lid material heat-sealed with a width of 15 mm are slit into a width of 2 mm and peeled. . The measurement conditions for zip-up are 23
Peeling speed 30 in an atmosphere of ℃ and relative humidity 40%
It is a numerical value when a measurement length of 20 mm is peeled by 180 ° under the condition of 0 mm / min.

Since the lid material of the present invention peels between the intermediate layer and the heat sealant layer, it does not change depending on the heat sealing conditions. Therefore, the lid member and the carrier tape can be heat-sealed with sufficient heating, and stable heat-sealing strength and peeling strength can be obtained.

The heat sealant layer of the lid material of the present invention is composed of a thermoplastic resin made of at least one of polyester, polyurethane, vinyl chloride / vinyl acetate copolymer and acrylic resin, and conductive fine particles described later. ing. As a combination of two or more kinds of thermoplastic resins, for example, a mixture of polyurethane and vinyl chloride / vinyl acetate copolymer having a mixing ratio of 9: 1 to 4: 6 and a mixing ratio of 5:
A mixture of a polyester of 5 to 9.5: 0.5 and a vinyl chloride / vinyl acetate copolymer, or a mixture ratio of 5: 5.
Examples include a mixture of an acrylic resin of about 9.5: 0.5 and a vinyl chloride / vinyl acetate copolymer.
When the intermediate layer is made of linear saturated polyester having a glass transition temperature of 40 ° C. or higher, it is preferable to use a mixture of polyurethane and a vinyl chloride / vinyl acetate copolymer.

Further, the heat sealant layer 6 includes metal oxides such as tin oxide, zinc oxide, indium oxide and titanium oxide, sulfides such as zinc sulfide, copper sulfide, cadmium sulfide, nickel sulfide and palladium sulfide, and barium sulfate. ,
The conductive fine particles and the organosilicon compound to which conductivity is imparted are contained in and. It is preferable that the conductive fine particles have a primary average particle diameter of 0.01 to 10 μm.
In this case, the thermoplastic resin 1 in the heat sealant layer
The mixing ratio of the conductive fine particles to 0 is preferably in the range of 1 to 100. If the ratio of the conductive fine particles is less than 1, there is no antistatic effect, and if it exceeds 100, the transparency is impaired, which is not preferable.

The surface resistivity of the heat sealant layer of the present invention is 10 ⁵ to 10 ¹² under the condition of 22 ° C. and 40% relative humidity (hereinafter, the surface resistance is the value measured under this condition unless otherwise specified). Within the range of Ω / □, and 23
5000 measured at ± 5 ° C and 12 ± 3% relative humidity
It has an excellent electrostatic diffusivity, that is, the time required from 99% to V decay, that is, the charge decay time (hereinafter referred to as the charge decay time) is 2 seconds or less. If the surface resistivity is more than 10 ¹² Ω / □, the electrostatic diffusion property deteriorates, and it becomes difficult to protect electronic components from electrostatic breakdown. Further, if it is less than 10 ⁵ Ω / □, there is a risk of electrical destruction by externally energizing the electronic component through the lid member. On the other hand, if the charge decay time, which is an indicator of the rate of diffusion of charges generated by static electricity, exceeds 2 seconds, the effect of dispersing static electricity becomes extremely poor, making it difficult to protect electronic components from electrostatic damage. The surface resistivity and the charge decay time are measured according to MIL-B81705C in the United States.

If desired, the heat sealant layer may contain a dispersion stabilizer and an antiblocking agent.

The heat sealant layer can be formed by a usual coating means such as roll coating or gravure coating. And the coating thickness is 0.1 to 10 μm.
m, preferably 1 to 5 μm.

Since the lid material of the present invention is peeled between the intermediate layer and the heat sealant layer, it can be heat-sealed with the carrier tape without depending on the conditions, and exhibits stable peelability. Such delamination is shown in FIG.
~ It demonstrates in detail with reference to FIG. First, FIG. 4 and FIG.
The lid member 1 shown in FIG. 1 is heat-sealed to the carrier tape 11 having the pockets 12 shown in FIG. This heat seal
The linear heat seal portions 10 having a predetermined width are provided at both ends of the pocket 12. The adhesive strength between the intermediate layer 5 of the lid member 1 and the heat sealant layer 6 is in the range of 100 to 1200 g / 15 mm, and the heat sealant layer 6 and the carrier tape 11 are
It is less than the heat seal strength with. Next, when the cover material 1 is peeled off from the carrier tape 11, the heat sealant layer 6 remains heat-sealed to the carrier tape 11 in the linear heat seal portion 10.
The intermediate layer 5 and the heat sealant layer 6 are separated from each other.
Therefore, the lid member 1 is peeled off with the linear heat seal portion 10 of the heat sealant layer 6 left on the carrier tape. That is, the lid material of the present invention has stable heat-sealing property with respect to the carrier tape 11 and the contradictory property of easy peeling, and at the same time, the composite base material sheet 2 is composed of a multilayer stretched film. There is little zip-up during peeling, and stable peeling is possible.

The material of the carrier tape to which the lid material of the present invention is applied is polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, ABS or the like. Alternatively, as an antistatic measure, conductive carbon black fine particles, fine metal particles, fine conductive powder made of metal oxide having conductivity, an organic silicon compound, or a surfactant is kneaded, or a material containing these is applied. There is something to do. A polystyrene or ABS resin containing carbon black on one or both sides of a polystyrene or ABS resin sheet
Examples include a multilayer sheet in which a BS resin is integrally laminated by co-extrusion, and a sheet in which a conductive polymer is formed on the surface of a plastic sheet.

Next, the lid material of the present invention will be described in more detail with reference to specific examples. (Experimental Example 1) As shown in FIG. 1, a biaxially stretched polyester film 21 having a thickness of 12 μm and a biaxially stretched polyester film 22 having a thickness of 6 μm subjected to surface treatment (both are
Spett 6140 Toyobo Co., Ltd. product name]
Takelac A 515 as a curing agent Takenate A-50
[Takeda Pharmaceutical Co., Ltd. product name] was provided on the adhesive layer 7 and dry laminated to prepare a composite substrate sheet 2. The following were used as the constituent material of the intermediate layer in the composition shown in Table 1 to prepare the intermediate layer 5 having a single layer thickness of 30 μm. EO copolymer: ULTOZEX 3550 [trade name, manufactured by Mitsui Petrochemical Industry Co., Ltd.] Density = 0.925 g / cm
³ . S / B copolymer: Asaflex 810 [trade name of Asahi Kasei Corporation] 70 to 90% by weight of styrene and 30 to 10% by weight of butadiene. S / B copolymer hydrogenated product: Tuftec H1041 [trade name of Asahi Kasei Corporation] Styrene 20 to 50% by weight
And butadiene 80 to 50% by weight. HIPS: Styron 475D [trade name of Asahi Kasei Corporation]. S / B block elastomer: Toughprene A [trade name of Asahi Kasei Corporation] Hydrogen-free additive of 20 to 50% by weight of styrene and 80 to 50% by weight of butadiene. The AC film 3 is provided on the stretched film 22 of the composite substrate sheet 2, and the low-density polyethylene mirason 16 having a thickness of 20 μm is provided.
[Mitsui Petrochemical Industry Co., Ltd. product name] Adhesive resin 4
As a result, the composite substrate sheet 2 and the intermediate layer 5 were laminated by sandwich lamination. Then, the intermediate layer 5
A heat sealant layer 6 having the following composition was applied by gravure reverse to a thickness of 2 μm to prepare Samples 1 to 11 and Comparative Samples 1 to 5 shown in Table 1. (Coating liquid for heat sealant layer) -Polyurethane Nipporan 5120 30 parts by weight [Nippon Polyurethane Industry Co., Ltd. product name] -Vinyl chloride / vinyl acetate copolymer vinylite VAGH 7.5 parts by weight [Union Carbide product name]・ Conductive fine powder Conductive fine particles T-1 62.5 parts by weight [Product name of Mitsubishi Materials Corporation]

[0053]

[Table 1]

Experimental Example 2 As shown in FIG. 2, Experimental Example 1
The composite substrate sheet 2 prepared in 1 above, the 15 μm thick EO copolymer as the first resin layer 51, and the thickness 1 shown in Table 2
The intermediate layer 5 including the second resin layer 52 having a thickness of 5 μm and the LDP
Sandwich lamination at E. Experimental Example 1
Similarly to the above, a heat sealant layer was provided to prepare cover materials for Samples 12 to 17 and Comparative Samples 6 to 8.

[0055]

[Table 2]

Experimental Example 3 As shown in FIG. 3, the composite base material sheet 2 prepared in Experimental Example 1, the low density polyethylene layer as the first resin layer 51, the second resin layer 52 and the third resin layer are shown. Sandwich lamination was performed with the intermediate layer 5 composed of 3 layers each having a thickness of 10 μm described in 3 using polyethylene as an adhesive resin. Further, as in Experimental Example 1, a heat sealant layer was provided to provide samples 18 to 25 and comparative samples 9 to 1.
The lid material of 2 was created.

[0057]

[Table 3]

With respect to each of the above-mentioned lid materials (Samples 1 to 25 and Comparative Samples 1 to 12), the haze degree, total light transmittance and charge decay time were measured by the following methods and the conductive polyvinyl chloride base material XEG47. Table 4 shows "trade name of Taihei Chemical Co., Ltd." and the peel strength of the heat-sealed product.・ Haze and total light transmittance: Color computer S
Measured with M-44C "Suga Test Instruments Co., Ltd. trade name".・ Surface resistivity: Electro-Tech System
ms, Inc. Made STATIC DECAY METE
Using R-406C, 23 ± 5 ℃, relative humidity 12 ±
The time required for attenuation from 5000 V to 99% is measured according to MIL-B-81705C under the condition of 3%. Peel strength: heat sealed under the conditions of 150 ° C., 3 kgf / cm ² , 0.5 seconds, and Tensilon universal testing machine HTH-
Peeling at 180 degrees using 100 "trade name of Toyo Baldwin Co., Ltd.", and peeling speed was measured at 300 mm / min.

[0059]

[Table 4]

The lid material of the present invention will be described in more detail with reference to other experimental examples and comparative examples. (Experimental Example 4) As shown in FIG. 1, a 6 μm-thick biaxially stretched polyester film 21 and 22 (both manufactured by Spett 6140 Toyobo Co., Ltd.) which had been surface-treated in the same manner as in Experimental Example 1 were used. Then, the adhesive layer 7 was provided and dry lamination was performed to prepare the composite base material sheet 2. Using the following materials as the constituent material of the intermediate layer, the single-layered intermediate layer 5 having a thickness of 30 μm shown in Tables 5 and 6 was prepared. EO copolymer: ULTOZEX 3550 [trade name, manufactured by Mitsui Petrochemical Industry Co., Ltd.] Density = 0.925 g / cm
³ . S / B copolymer: Asaflex 810 [trade name of Asahi Kasei Corporation] styrene 50 to 90% by weight and butadiene 50 to 10% by weight]. The AC film 3 is provided on the stretched film 22 of the composite substrate sheet 2, and the low-density polyethylene mirason 16 having a thickness of 20 μm is provided.
[Mitsui Petrochemical Industry Co., Ltd. product name] Adhesive resin 4
As a result, the composite substrate sheet 2 and the intermediate layer 5 were laminated by sandwich lamination. Then, the intermediate layer 5
Table 5 consisting of the following materials by gravure reverse coating
And the heat sealant layer 6 having the composition shown in Table 6 was applied to a thickness of 2 μm to prepare lid material samples 31 to 56 of Experimental Example 3. [Constituent material of heat sealant layer] -Polyester: Byron "Toyobo Co., Ltd. trade name: Glass transition temperature 50 ° C."-Vinyl chloride / vinyl acetate copolymer: Vinylite VA
GH "Union Carbide product name". -Polyurethane: Nippon Polan 5120 "Product name of Nippon Polyurethane Industry Co., Ltd." -Electrically conductive fine powder: Pastran IV "Mitsui Mining & Smelting Co., Ltd. trade name: average particle size 0.3 µm".

[0061]

[Table 5]

[0062]

[Table 6]

[0063]

[Table 7]

[0064]

[Table 8]

As shown in Tables 7 and 8, samples 31 to 36
In addition, Samples 45 to 50 had good transparency and electrostatic properties, and were peeled between the intermediate layer and the heat sealant layer with an appropriate peel strength. On the other hand, since the samples 37 and 39 contained a large amount of conductive fine powder, the total light transmittance was less than 75% and the transparency was lowered. In addition, samples 38 and 40
Since Nos. 52 and 52 had a small content of the conductive fine powder, the peel strength was below the appropriate value, the surface resistivity was 10 ¹³ Ω or more, the electrification decay time exceeded 2 seconds, and they did not have electrostatic characteristics. Further, Samples 41, 42 and 54 had poor coating suitability because the heat sealant layer contained a large amount of vinyl chloride / vinyl acetate copolymer resin. The sample 53 has a large amount of polyurethane and thus the peel strength is too weak. The samples 43 and 55 have a large amount of the E / O copolymer in the intermediate layer and thus the peel strength is low. On the contrary, the samples 44 and 56 have the E / O copolymer weight. It was said that the peel strength was too strong because there was little coalescence.

(Experimental Example 5) As shown in FIG.
6 μm thick biaxially stretched polyester films 21 and 22 which have been surface-treated in the same manner as in [Spett 6
140 Toyobo Co., Ltd. product name] was provided on the adhesive layer 7 and dry laminated to prepare a composite substrate sheet 2. Using the following materials as the constituent material of the intermediate layer, the single-layered intermediate layer 5 having a thickness of 30 μm shown in Tables 9 and 10 was prepared. EO copolymer: ULTOZEX 3550 [trade name, manufactured by Mitsui Petrochemical Industry Co., Ltd.] Density = 0.925 g / cm
³ . S / B copolymer hydrogenated product: Tuftec H1041 [trade name of Asahi Kasei Corporation] Styrene 10 to 50% by weight
Hydrogenated product of S / B copolymer of butadiene and 80 to 50% by weight of butadiene. The composite base material sheet 2 and the intermediate layer 5 were laminated by sandwich lamination. Then, a heat sealant layer 6 made of the material used in Experimental Example 3 and having a composition shown in Tables 9 and 10 was applied to the intermediate layer 5 by gravure reverse coating to a thickness of 2 μm, and the lid material of Experimental Example 5 was applied. Samples 61 to 86 were prepared.

[0067]

[Table 9]

[0068]

[Table 10]

With respect to each lid material (Samples 61 to 86) of Experimental Example 5, the haze degree, total light transmittance, surface resistivity, charge decay time, peel strength and blocking resistance were evaluated in the same manner as in Experimental Example 3. Are shown in Tables 11 and 12.

[0070]

[Table 11]

[0071]

[Table 12]

As shown in Table 11 and Table 12, Experimental Example 5
The lid materials (Samples 61 to 86) of Example 1 are the lid materials of Experimental Example 4 (Sample 3).
1 to 56), the same tendency as that observed in Sample 6
1-66 and Samples 75-80 had good transparency and electrostatic properties and peeled between the intermediate layer and the heat sealant layer with moderate peel strength. On the other hand, sample 6
Since Nos. 7, 69 and 72 contained a large amount of conductive fine powder, the total light transmittance was less than 75% and the transparency was poor. Further, since the samples 68, 70, and 82 have a small content of the conductive fine powder, the peel strength is too weak, the surface resistivity is 10 ¹³ Ω or more, and the charge decay time exceeds 2 seconds and does not have electrostatic characteristics. It was Furthermore, Samples 71, 72, and 84 were poor in coating suitability because the heat sealant layer contained a large proportion of vinyl chloride / vinyl acetate copolymer. In addition, sample 83
Indicates that the peel strength is too weak due to the large amount of polyurethane, and the peel strength is low for Samples 73 and 85 due to the large amount of E / O copolymer in the intermediate layer, and conversely the samples 73 and 85 have low E / O copolymer. Therefore, the peel strength was too strong.

Experimental Example 6 As shown in FIG. 1, Experimental Example 1
A biaxially stretched polyester film 21 having a thickness of 12 μm and a biaxially stretched polyester film 22 having a thickness of 6 μm (both are Spett 6140 Toyobo Co., Ltd. product name) which are surface-treated in the same manner as the adhesive layer 7. The composite base material sheet 2 was prepared by providing and dry laminating.
The saturated polyester film "KS-011C manufactured by Tohcello Chemical Co., Ltd." was used to form the intermediate layer 5 using a thickness of 30 μm and a glass transition temperature of 50 ° C. The composite substrate sheet 2 was sandwiched in the same manner as in Experimental Example 1 by sandwich lamination. Then, the heat sealant layer 6 made of the material used in Experimental Example 3 and having the composition shown in Table 13 was applied to the intermediate layer 5 by gravure reverse coating so as to have a thickness of 2 μm. Samples 91 to 99 of the lid material of No. 6 were prepared.

[0074]

[Table 13]

With respect to each lid material (Samples 91 to 99) of Experimental Example 5, the haze degree, total light transmittance, surface resistivity, charge decay time, peel strength and blocking resistance were evaluated in the same manner as in Experimental Example 3. Is shown in Table 14.

[0076]

[Table 14]

(Experimental Example 7) A composite substrate sheet 2 having the constitution shown in Table 15 was prepared by dry lamination using the following biaxially stretched polyethylene terephthalate film and adhesive.・ Biaxially stretched polyethylene terephthalate film Tetoron film F type [Product name of Teijin Ltd.]
Thickness 3, 6 and 12 μm. Tetoron film V type [Product name of Teijin Limited]
Thickness 25 μm. -Adhesives Ester-based, ether-based, acrylic-based, epoxy-based, urethane-based, polyimide-based. The base material sheet shown in Table 15 and (E / O copolymer 40% by weight)
And an intermediate layer 5 having a thickness of 30 μm and made of a blended product of 60% by weight of S / B copolymer were laminated by sandwich lamination via an adhesive. Then, the intermediate layer 5 is gravure-reversed to obtain the vinylite VA.
The heat sealant layer 6 composed of 35 parts by weight of GH and 65 parts by weight of conductive fine powder is 2 μm by the gravure reverse method.
Samples 101 to 11 of the lid material of Experimental Example 7
2 was created.

Each lid material of Experimental Example 7 (Samples 101 to 111)
About the conductive polyvinyl chloride base material XEG47 "trade name of Taihei Chemical Co., Ltd." which is a sheet of carrier tape, the temperature is 130 ° C and 150 ° C, and the pressure is 2 kgf / c.
Heat sealing was performed under the heat sealing conditions of m ² and time of 0.5 seconds. Further, the peel strength was measured under the conditions of a peel width of 15 mm, a peel angle of 180 degrees, and a peel speed of 300 mm / min. The peel strength was averaged and heat-sealed under the same conditions.
The peel strength was measured under conditions of mm width and peel angle of 300 mm / min, and the zip-up, which is the difference between the maximum peel strength and the minimum peel strength, was evaluated. Table 15 shows the results. Sample 10
Nos. 1 to 109 showed an appropriate peel strength and a zip-up of 30 g / 2 mm or less, but the sample 110 showed an appropriate peel strength, but the zip-up was large, and the sample 111 had a polyester of 25 μm. Since the film was used, heat sealing was not stable in the low temperature range, and the peeled state showed cohesive peeling.

[0079]

[Table 15]

[0080]

EFFECT OF THE INVENTION E / O copolymer, S / B copolymer and S.
At least EO of the hydrogenated B copolymer and HIPS
The heat sealant layer provided on the intermediate layer formed of three or more kinds of resins including the copolymer and the S / B copolymer is stable between the intermediate layer and the heat sealant layer when peeled from the carrier tape. To peel off. The lid material formed on the composite base material sheet in which two or more layers of the stretched film are adhered with the curable adhesive has an effect of reducing zip-up when peeled.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing a cross section of a lid material of the present invention.

FIG. 2 is a conceptual diagram showing a cross section of a lid member provided with a two-layered intermediate layer.

FIG. 3 is a conceptual diagram showing a cross section of a lid member provided with a three-layered intermediate layer.

FIG. 4 is a perspective view showing a sealed state of a carrier tape and a lid member.

FIG. 5 is a conceptual diagram showing a cross section of a lid material and a carrier tape of the present invention in a heat-sealed state.

FIG. 6 is a conceptual diagram showing a cross section of a state in which a lid member is peeled off from a carrier tape.

[Explanation of symbols]

 1 Carrier Tape 2 Composite Base Sheets 21, 22 Stretched Film 3 AC Layer 4 Adhesive Resin 5 Intermediate Layer 51 First Resin Layer 52 Second Resin Layer 53 Third Resin Layer 6 Heat Sealant Layer 7 Adhesive Layer 10 Heat Seal Section 11 carrier tape 12 pockets

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location B32B 27/32 103 B32B 27/32 103

Claims (18)

[Claims] 1. A lid material which can be heat-sealed to a carrier tape, wherein the lid material is a composite substrate sheet obtained by laminating a stretched film consisting of two layers via an adhesive layer, an intermediate layer, and a tin oxide-based, zinc oxide. A cover material for a carrier tape, which is obtained by sequentially laminating a system, a conductive fine powder of indium oxide, or a heat silane layer made of a resin containing an antistatic organosilicon compound. 2. The carrier tape lid according to claim 1, wherein the adhesive layer to which the stretched film is attached is polyester, polyether, urethane resin, acrylic resin, epoxy resin, or a modified product thereof. Material. 3. The intermediate layer has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer, 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene
And a styrene / butadiene block copolymer with styrene, a hydrogenated product of a styrene / butadiene block copolymer with 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene, and at least an ethylene / α-olefin copolymer of high-impact polystyrene. A cover material for a carrier tape, which is formed from three or more kinds of resins including a polymer and a styrene / butadiene block copolymer. 4. The intermediate layer has a single layer structure, 30 to 70% by weight of an ethylene / α-olefin copolymer having a density of 0.915 to 0.940 g / cm ³ and 50 to 9 of styrene.
0% by weight of styrene and 50 to 10% by weight of styrene
To 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a butadiene block copolymer, 10 to 5 of styrene is added.
0% by weight of styrene and 90 to 50% by weight of styrene
4. The resin composition according to claim 3, wherein the resin composition contains 5 to 30 parts by weight of a hydrogenated butadiene block copolymer and 5 to 50 parts by weight of a high impact polystyrene. Cover material for carrier tape. 5. The intermediate layer has a single-layer structure, 30 to 70% by weight of an ethylene / α-olefin copolymer having a density of 0.915 to 0.940 g / cm ³ , and 50 to 9 of styrene.
0% by weight of styrene and 50 to 10% by weight of styrene
To 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a butadiene block copolymer, 10 to 5 of styrene is added.
0% by weight of styrene and 90 to 50% by weight of styrene
The lid material for a carrier tape according to claim 3, which is formed of a resin composition to which 5 to 30 parts by weight of a hydrogenated product of a butadiene block copolymer is added. 6. The intermediate layer has a single layer structure, 30 to 70% by weight of an ethylene / α-olefin copolymer having a density of 0.915 to 0.940 g / cm ³ , and 50 to 9 of styrene.
0% by weight of styrene and 50 to 10% by weight of styrene
It is formed by a resin composition in which 5 to 50 parts by weight of high-impact polystyrene is added to 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a butadiene block copolymer. The lid material for a carrier tape according to claim 3. 7. The intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer has a density of 0.915 to 0.940 g / cm.
Formed by ethylene / α-olefin copolymer of ³ ,
The second resin layer has a density of 0.915 to 0.940 g / cm.
30 to 70% by weight of ethylene / α-olefin copolymer of ³
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
Styrene-butadiene block copolymer with 70% by weight
10 to 50% by weight of styrene and 90 to 50% of butadiene based on 100 parts by weight of a resin composition composed of 30 to 30% by weight.
The carrier tape according to claim 3, wherein the carrier tape is formed of a resin composition containing 5 to 30 parts by weight of a hydrogenated styrene-butadiene block copolymer with 5% by weight. Lid material. 8. The intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer has a density of 0.915 to 0.940 g / cm.
Formed by ethylene / α-olefin copolymer of ³ ,
The second resin layer has a density of 0.915 to 0.940 g / cm.
30 to 70% by weight of ethylene / α-olefin copolymer of ³
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
Styrene-butadiene block copolymer with 70% by weight
The resin composition is formed by adding 5 to 50 parts by weight of high-impact polystyrene to 100 parts by weight of the resin composition of 30 to 30% by weight. The lid material for the carrier tape described. 9. The intermediate layer has a two-layer structure of a first resin layer and a second resin layer in contact with the heat silane layer,
The first resin layer has a density of 0.915 to 0.940 g / cm.
Formed by ethylene / α-olefin copolymer of ³ ,
The second resin layer has a density of 0.915 to 0.940 g / cm.
30 to 70% by weight of ethylene / α-olefin copolymer of ³
And 50 to 90% by weight of styrene and 50 to 10 of butadiene
Styrene-butadiene block copolymer with 70% by weight
10 to 50% by weight of styrene and 90 to 50% of butadiene based on 100 parts by weight of a resin composition composed of 30 to 30% by weight.
Characterized in that it is formed of a resin composition to which 5 to 30 parts by weight of a hydrogenated styrene-butadiene block copolymer with 5% by weight and 5 to 50 parts by weight of high-impact polystyrene are added. The lid material for a carrier tape according to claim 3. 10. The intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.9
The second resin layer is formed of a 40 g / cm ³ ethylene / α-olefin copolymer, and has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
˜70 wt%, styrene / butadiene block copolymer 70˜30 wt% of styrene 50˜90 wt% and butadiene 50˜10 wt%, and the third resin layer has a density 0.915-0.940g
/ Cm ³ ethylene / α-olefin copolymer 30 to 70
Wt%, styrene 50-90 wt% and butadiene 50
10 to 50% by weight of styrene and 90 to butadiene based on 100 parts by weight of a resin composition consisting of 70 to 30% by weight of a styrene / butadiene block copolymer with 10 to 10% by weight.
4. The carrier according to claim 3, wherein the carrier is formed of a resin composition to which 5 to 30 parts by weight of a hydrogenated product of a styrene-butadiene block copolymer with about 50 to 50% by weight is added. Cover material for tape. 11. The intermediate layer has a three-layer structure including a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0. ．
The second resin layer is formed of an ethylene / α-olefin copolymer of 940 g / cm ³ , and has a density of 0.915 to 0.
940 g / cm ³ ethylene / α-olefin copolymer 3
The third resin layer is formed by a resin composition of 0 to 70% by weight, 70 to 30% by weight of styrene / butadiene block copolymer of 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene. Density 0.915 to 0.940
g / cm ³ ethylene / α-olefin copolymer 30 to 7
0 wt%, styrene 50-90 wt% and butadiene 5
Formed from a resin composition in which 5 to 50 parts by weight of high-impact polystyrene is added to 100 parts by weight of a resin composition consisting of 0 to 10% by weight and 70 to 30% by weight of a styrene / butadiene block copolymer. The carrier tape cover material according to claim 3, wherein the cover material is a carrier tape cover material. 12. The intermediate layer has a three-layer structure of a first resin layer, a second resin layer, and a third resin layer in contact with the heat silane layer, and the first resin layer has a density of 0.915 to 0.9
The second resin layer is formed of a 40 g / cm ³ ethylene / α-olefin copolymer, and has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
˜70 wt%, styrene / butadiene block copolymer 70˜30 wt% of styrene 50˜90 wt% and butadiene 50˜10 wt%, and the third resin layer has a density 0.915-0.940g
/ Cm ³ ethylene / α-olefin copolymer 30 to 70
Wt%, styrene 50-90 wt% and butadiene 50
10 to 50% by weight of styrene-butadiene block copolymer and 30 to 30% by weight, based on 100 parts by weight of the resin composition, 10 to 50% by weight of styrene and 90 to 5% of butadiene
5 to 30 parts by weight of hydrogenated styrene-butadiene block copolymer with 0 and high impact polystyrene 5
The lid material for a carrier tape according to claim 3, which is formed of a resin composition to which 50 parts by weight is added. 13. The intermediate layer has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
It is formed of a resin composition composed of 70 to 30% by weight, 70 to 30% by weight of styrene, and 50 to 90% by weight of styrene and 50 to 10% by weight of butadiene. Item 2. A cover material for a carrier tape according to Item 1. 14. The intermediate layer has a density of 0.915 to 0.9.
40 g / cm ³ ethylene / α-olefin copolymer 30
To 70% by weight, 70 to 30% by weight of hydrogenated styrene-butadiene block copolymer of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene. Claim 1
The lid material for a carrier tape as described in. 15. The glass transition temperature of the intermediate layer is 40 ° C.
The carrier tape lid material according to claim 1, wherein the lid material is formed of a linear saturated polyester exceeding the above range. 16. The heat sealant layer according to claim 1, wherein the heat sealant layer contains at least one of polyester, polyurethane, vinyl chloride / vinyl acetate copolymer and acrylic resin. Cover material for carrier tape. 17. The heat sealant layer has a surface resistivity in the range of 10 ⁵ to 10 ¹² Ω / □ and a charge decay time of 2 seconds or less. The cover material for a carrier tape according to any one of the above. 18. The carrier tape lid material according to claim 1, which has a total light transmittance of 75% or more and a haze value of 50% or less.