MY190586A - Heat-sealing film and cover tape for packaging electronic components - Google Patents

Heat-sealing film and cover tape for packaging electronic components

Info

Publication number
MY190586A
MY190586A MYPI2013002143A MYPI2013002143A MY190586A MY 190586 A MY190586 A MY 190586A MY PI2013002143 A MYPI2013002143 A MY PI2013002143A MY PI2013002143 A MYPI2013002143 A MY PI2013002143A MY 190586 A MY190586 A MY 190586A
Authority
MY
Malaysia
Prior art keywords
heat
sealing film
weight
cover tape
electronic components
Prior art date
Application number
MYPI2013002143A
Inventor
Weixiang Zhang
Zhou Jin
Shijun Shen
Linlin Zhang
Jiajun Li
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MY190586A publication Critical patent/MY190586A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00—Packaging equipment or accessories not otherwise provided for

Landscapes

  • Laminated Bodies (AREA)
  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)

Abstract

The invention provides a heat-sealing film for packaging an electronic element, comprising: a base layer; at least one intermediate layer which is provided on the base layer and comprises a mixture comprising, in terms of 100% by weight of the total weight of the intermediate layer, 5-70 % by weight of a vinyl acetate copolymer, wherein the units derived from vinyl acetate comprise more than 10% by mole of the copolymer, 20-90 % by weight of a styrene-butadiene copolymer, and 0-40 % by weight of a conductive polymer; and at least a heat-sealing layer which is provided on the surface of the intermediate layer opposite to the base layer. The invention further provides a cover tape made of the heat-sealing film as described above.
MYPI2013002143A 2010-12-17 2010-12-17 Heat-sealing film and cover tape for packaging electronic components MY190586A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2010/079964 WO2012079258A1 (en) 2010-12-17 2010-12-17 Heat-sealing film and cover tape for packaging electronic components

Publications (1)

Publication Number Publication Date
MY190586A true MY190586A (en) 2022-04-27

Family

ID=46244000

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002143A MY190586A (en) 2010-12-17 2010-12-17 Heat-sealing film and cover tape for packaging electronic components

Country Status (5)

Country Link
JP (1) JP5762556B2 (en)
CN (1) CN103260873B (en)
MY (1) MY190586A (en)
TW (1) TWI584951B (en)
WO (1) WO2012079258A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5762884B2 (en) * 2011-08-26 2015-08-12 昭和電工パッケージング株式会社 Dust-free packaging bag with excellent automatic packaging
CN103466195A (en) * 2013-03-19 2013-12-25 上海吉景包装制品有限公司 Anti-static upper cover tape
JP6325859B2 (en) * 2014-03-20 2018-05-16 リンテック株式会社 Conductive resin sheet
JP6429824B2 (en) * 2016-03-31 2018-11-28 古河電気工業株式会社 Electronic device packaging tape
CN110683208A (en) * 2018-07-06 2020-01-14 3M创新有限公司 Multi-layer cover tape construction
US20200017266A1 (en) * 2018-07-12 2020-01-16 Advantek, Inc. Carbon nanotubes in carrier tape, cover tape and static shielding bags
WO2020204138A1 (en) * 2019-04-03 2020-10-08 大日本印刷株式会社 Electronic component packaging cover tape and package
JP7164485B2 (en) * 2019-04-26 2022-11-01 デンカ株式会社 Cover film and electronic component package using the same
JP2022158849A (en) * 2021-03-31 2022-10-17 住友ベークライト株式会社 Cover tape for electronic component packaging, and electronic component package
WO2022210158A1 (en) * 2021-03-31 2022-10-06 住友ベークライト株式会社 Cover tape for packaging electronic component and electronic component package
CN114801401A (en) * 2022-03-23 2022-07-29 毕玛时软包装（苏州）有限公司 Clean easy-to-open cover film for liquid packaging
WO2024185677A1 (en) * 2023-03-08 2024-09-12 住友ベークライト株式会社 Cover tape, electronic component packaging body, and method for producing cover tape

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54129075A (en) * 1978-03-30 1979-10-06 Denki Kagaku Kogyo Kk Film for heat-seal package
JPS5920557B2 (en) * 1978-06-29 1984-05-14 電気化学工業株式会社 packaging
JP2609779B2 (en) * 1991-02-28 1997-05-14 住友ベークライト株式会社 Cover tape for packaging chip-type electronic components
JPH0796585A (en) * 1993-08-04 1995-04-11 Dainippon Printing Co Ltd Cover material
JPH08295001A (en) * 1995-04-27 1996-11-12 Dainippon Printing Co Ltd Lid material, carrier tape and taping using these materials
JPH09111207A (en) * 1995-10-19 1997-04-28 Dainippon Printing Co Ltd Cover tape for carrier tape
JPH1095448A (en) * 1996-09-18 1998-04-14 Dainippon Printing Co Ltd Lid material for carrier tape
CN1313266C (en) * 1999-08-31 2007-05-02 电气化学工业株式会社 Transparent heat-sealing film
JP4544563B2 (en) * 2001-03-23 2010-09-15 大日本印刷株式会社 Heat seal laminate and carrier tape package
WO2001075905A1 (en) * 2000-04-03 2001-10-11 Dai Nippon Printing Co., Ltd. Transparent, electrically conductive and heat-sealable material and lidded container for carrier tape using the same
ATE336371T1 (en) * 2001-06-26 2006-09-15 Sumitomo Bakelite Co COVER STRIPS FOR PACKAGING ELECTRONIC COMPONENTS
JP2003200990A (en) * 2002-01-09 2003-07-15 Sumitomo Bakelite Co Ltd Cover tape for packaging electronic component
JP2008273602A (en) * 2007-05-02 2008-11-13 Denki Kagaku Kogyo Kk Cover film

Also Published As

Publication number Publication date
TWI584951B (en) 2017-06-01
CN103260873A (en) 2013-08-21
WO2012079258A1 (en) 2012-06-21
JP5762556B2 (en) 2015-08-12
CN103260873B (en) 2015-09-23
JP2014501185A (en) 2014-01-20
TW201244931A (en) 2012-11-16

Similar Documents

Publication Publication Date Title
MY190586A (en) Heat-sealing film and cover tape for packaging electronic components
MY170273A (en) Cover tape for electronic component packaging
MX2016001306A (en) Multilayer composition for packaging.
JP2014141504A5 (en)
WO2011126262A3 (en) Adhesive composition for a touch panel, adhesive film, and touch panel
WO2010144444A3 (en) Articles containing silicone compositions and methods of making such articles
WO2013015600A3 (en) Anti-fingerprint coating composition and film using the same
MX368295B (en) Films containing functional ethylene-based polymer compositions.
GB2467279A (en) Tapes comprising barrier coating compositions and components comprising the same
JP2014040593A5 (en)
JP2014501185A5 (en)
WO2014049570A3 (en) Improved release polycarbonate compositions
MY154605A (en) Laminated metal sheet and can container for food
TW201129473A (en) Laminated film
MY163745A (en) Methods of sputtering cadmium sulfide layers for use in cadmium telluride based thin film photovoltaic devices
EP2599500A4 (en) Adhesive patch for medical use
WO2012042264A3 (en) Printable composition, method and uses thereof
TW200740607A (en) Multi-layer release films
MY184617A (en) A heat-sealing cover film for packaging electronic components
MX2015008456A (en) Multilayer films containing functional ethylene-based polymer compositions.
TR201911252T4 (en) Oxygen absorbing packaging material and oxygen absorbing resin composition, including oxygen absorbing film, oxygen absorbing laminate, oxygen absorbing laminate.
WO2012128526A3 (en) Noble polyamic acid, photosensitive resin composition, dry film, and circuit board
TW200942629A (en) Sprayed Si-or Si:A1-target with low iron content
PH12014502842A1 (en) Base sheet for electronic component packaging, multilayer sheet for electronic component packaging, carrier tape for electronic component packaging, and electronic component carrier
WO2012084477A3 (en) Use (and production) of a creped polylactic acid film